CN1147312A - Improved disk substrate - Google Patents
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- CN1147312A CN1147312A CN95192629A CN95192629A CN1147312A CN 1147312 A CN1147312 A CN 1147312A CN 95192629 A CN95192629 A CN 95192629A CN 95192629 A CN95192629 A CN 95192629A CN 1147312 A CN1147312 A CN 1147312A
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- 239000000758 substrate Substances 0.000 title claims abstract description 63
- 229910002077 partially stabilized zirconia Inorganic materials 0.000 claims abstract description 25
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 45
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 17
- 238000005245 sintering Methods 0.000 claims description 10
- 229910052580 B4C Inorganic materials 0.000 claims description 9
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 9
- 241000662429 Fenerbahce Species 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 6
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 6
- 229910001404 rare earth metal oxide Inorganic materials 0.000 claims description 6
- 239000006061 abrasive grain Substances 0.000 claims description 5
- 238000001020 plasma etching Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 2
- 229910052727 yttrium Inorganic materials 0.000 claims description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical group [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 2
- 150000002910 rare earth metals Chemical class 0.000 claims 4
- 239000013043 chemical agent Substances 0.000 claims 2
- 230000003628 erosive effect Effects 0.000 claims 2
- 238000005260 corrosion Methods 0.000 claims 1
- 230000007797 corrosion Effects 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 230000003746 surface roughness Effects 0.000 abstract description 5
- 238000005498 polishing Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 13
- 229910003460 diamond Inorganic materials 0.000 description 11
- 239000010432 diamond Substances 0.000 description 11
- 238000000227 grinding Methods 0.000 description 9
- 239000000843 powder Substances 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 239000006071 cream Substances 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 229910000861 Mg alloy Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910003481 amorphous carbon Inorganic materials 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000002241 glass-ceramic Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000000472 traumatic effect Effects 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/64—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
- G11B5/739—Magnetic recording media substrates
- G11B5/73911—Inorganic substrates
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B2220/00—Record carriers by type
- G11B2220/20—Disc-shaped record carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/90—Magnetic feature
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Magnetic Record Carriers (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
This invention relates to a disk substrate for use in a disk drive, the disk substrate consisting essentially of partially stabilized zirconia and having a surface roughness (Ra) of no more than 10 angstroms.
Description
Technical field
The present invention relates to be used for the disk substrate of disc driver.
Background technology
Use in the infosystem at computing machine and word processor, data (being program and file) are by disc driver storage and recovery.Disc driver generally comprises three parts: read/write head (" magnetic head "), transmission arm and hard disc (" disk ").Fig. 1 has disclosed common disc driver 1, transmission arm 2 moving head 3 on disk 4 wherein, thus make the circuit on the magnetic head between lead-in wire (not shown) and disk 4, transmit information bit.Fig. 2 has disclosed a kind of common disk, and substrate 5 (being generally the Al/Mg alloy) is by immersion coating in the deposit successively or anodized coatings (Ni/P) 6, magnetisable coating 7, protection overlayer 8 and fluid lubricant 9.
Because generally canned data density is higher on disk, so transmit accurately in order to guarantee, magnetic head must be very near disk during data transmit.Like this, the distance between magnetic head and disk (being called " flying height " or " air-gap ") usually has only about 4～6 microinchs.Under extremely small like this distance, magnetic head and disk all must be very smooth.Therefore the disk material therefor should be very hard and be suitable for retrofit.
When disk and transmission arm relative motion, will generate air-flow and magnetic head " is floated " on disk.During operation, magnetic head showy avoided causing contacting of wearing and tearing between magnetic head and the disk, and this wearing and tearing will reduce the accuracy that data transmit.But usually the starting or stoping of disk or arm can produce physics and contact between magnetic head and disk.Therefore, the backing material of disk should be wear-resisting.
As mentioned above, most of ordinary magnetic discs are all made by the Mg/Al alloy, are coated with Ni/P and thin magnetic film on it.This alloy is selected owing to have splendid antiwear characteristic, rigidity and polishing performance, and shows better performance at present bigger disc driver.
But the requirement of raising speed and capacity makes the volume of disc driver more and more littler.For example at present the diameter of hard disk in 65～275 millimeter and thickness in 0.64～1.5 millimeter, require the diameter of hard disk to be less than 38 millimeters and thickness is less than 0.4 millimeter in the future.Equally, air-gap can not surpass 2 microinchs.For such size, adopting the Al/Mg alloy to make the disk substrate is that thin like this disk can not provide necessary rigidity (wherein required rigidity needs 200GPa at least) with the problem of bringing.
In the face of this problem, consider to be exactly to adopt stupalith to replace technically.For disk substrate of future generation, glass, glass ceramics, amorphous carbon, silicon, tantalum, polymkeric substance and the stainless steel capital are candidate materials.Referring to " magnetic slider/hard disc backing material and the disk constructing technology-present state and perspectives " of B.Bhusan, this article is published in Advances in Information Storage System, Vol5,1993, pp.175-209.And Bhusan asserts that glass, glass ceramics and amorphous carbon are the most promising materials because it has suitable elastic modulus.
Another kind of recommendation is chemical vapour deposition (CVD) silit as the material of following disk substrate.Referring to Am.Cer.Soc.Bull.Vol.72, No.3 (in March, 1 993), p.74.But to be cost high and be directed (post to) grain pattern for the shortcoming of CVD silit.
JP62078716 has disclosed the used zirconia base disk substrate of disc driver.But the surfaceness of this material (Ra) it is reported to have only 0.01 micron (100 dust).JP62078715 has disclosed the used zirconia base disk substrate of disc driver.But the low-density of material may obtain lower surfaceness (Ra).
The zirconia base disk substrate that a kind of disc driver is used has been reported in EPO patented claim 0 131 895.But the best surface roughness (Ra) of the material that discloses it is reported to have only 0.003 micron (30 dust).JP01112518 has disclosed the used zirconia base disk substrate of disc driver.But the surfaceness of this material (Ra) it is reported to have only 5～8 nanometers (50～80 dust).
Therefore need a kind of wearing quality, rigidity and polishing performance excellent material to make disk.
Summary of the invention
According to the present invention, a kind of partially stabilized zirconia substrate (preferably in the disc driver used disk substrate format) is provided, substrate is made up of partially stabilized zirconia basically and surfaceness (Ra) is no more than 10 dusts.
And, providing a kind of disc driver used disk substrate according to the present invention, substrate is formed and is had the surface of structure basically by partially stabilized zirconia.
And, provide a kind of disc driver according to the present invention, and comprise: a) magnetic head and b) as the disk below the top magnetic head that discloses, wherein the air-gap between magnetic head and the disk is no more than 2 microinchs.
And, provide a kind of manufacturing process according to the present invention, comprise following steps: a) adopt adamas or alumina lap cream to the meticulous polishing of partially stabilized zirconia substrate, make its roughness be no more than 10 dusts.
Brief description of drawings
Fig. 1 represents common disc driver.
Fig. 2 represents common disk.
The preferred embodiments of invention
It is believed that most of promising candidate materials, its rigidity be not suitable for or surface roughness too high. Especially, Their toughness is as follows:
Substrate toughness (Mpa m1/2)
1) glass 0.5-0.9
2) glass ceramics 2
3) amorphous carbon 1
4) silicon 2
5) CVD silit 3
On the contrary, the toughness of believing following thin disk is wanted 4Mpa m at least
1/2And surfaceness (Ra) can not surpass 10 dusts.If do not want to be limited by theory, that believes following disk substrate will have high toughness, and good machining property and traumatic resistance energy so just can be provided, and needs retrofit (lower surfaceness) for improving recording density.Because partially stabilized zirconia generally has 7Mpa m at least
1/2And surfaceness can be accomplished below 10 dusts, can satisfy the requirement of following disk so it is believed that these materials.
For the purposes of the present invention, utilize Journal of the American Ceramics Society, 64 (9), 1981, the Chantikul impression intensity method (indentationstrength method) that discloses among the pp.539-44 (CITE) is measured " fracture toughness " (fracture toughness); " surface roughness Ra " is commonly considered as the arithmetic mean that departs from from the profile that average surface is counted; And polishing refers to the mean diameter of abrasive material with abrasive grain.
According to the present invention, can adopt any common PSZ (" PSZ ") pottery, for example the partially stabilized positive tetragonal lattice zirconia polycrystalline pottery of yttria (" YTZP ").Tetragonal zirconia and toughness that commercially available PSZ generally comprises 30% (usually surpassing 70%) at least are at least 4.5Mpam
1/2, reasonable is 6Mpa m
1/2Reasonablely be, zirconia is partially stabilized by rare earth element, and the concentration that is more preferably rare earth oxide is between 2.5～6mol%, and preferably the concentration of rare earth oxide is between 4.5～6mol%.
In some embodiments, zirconia is YZ110, and it is the stable zirconia of yttrium available from U.S. Norton company.
Can adopt the conventional method of any manufacturing zirconia disk substrate.For example, in some embodiments, RE oxide powder and Zirconium oxide powder are mixed, raw cook (green piece) is made on potpourri single shaft ground or isobaric ground between 50～500Mpa; Raw cook between 1300 ℃～1500 ℃ sintering 0.5～4 hour to reach at least 95% density; Raw cook through oversintering is put into inert gas, places 0.5～4 hour to reach 99.9% density between 1200 ℃～1500 ℃.
Best is with yttrium oxide powder and Zirconium oxide powder mixes, colds pressing and sinter at least 96% density and be increased to 99.9% density.
In certain embodiments, high-purity disk substrate is favourable, and promptly the impurity or the sintering aid content that have of substrate is no more than 0.3%, if particularly impurity or sintering aid are tending towards forming second phase.These typical sintering aids comprise silicon dioxide, iron and manganese.Have been found that the partially stabilized disk substrate that employing produces available from the YTZP powder that does not have sintering aid of Japanese DKK, its impurity content and the surfaceness (Ra) that reached are all in desired horizontal.Therefore provide partially stabilized zirconia disk substrate, the content of its impurity or sintering aid to be no more than 0.3% and surfaceness is no more than 10 dusts.
In some preferred embodiments, it is favourable being no more than 0.1% porosity.Have been found that the PSZ available from the DKK powder provides the partially stabilized disk substrate that is no more than 0.1% porosity, and can process, make its surfaceness (Ra) reach desired horizontal it.
The preparation of disk generally comprises two steps: make thin ceramic body and processing ceramic body.Can make ceramic body with any usual way according to the present invention, comprise casting, extruding and the mold pressing of cutting ceramic bar, band with diamond saw blade.Reasonable is to utilize diamond saw blade to cut ceramic bar.Cut out be Ra between 2～7 microns and thickness less than 1 millimeter disk, reasonable thickness is less than 0.5 millimeter.
Can adopt any common Ginding process to realize comprising the processing of disk substrate to invention with diamond polishing cream or aluminium oxide.Grinding should obtain out the finishing less than about 125 dusts.In preferred embodiment, it is 3 and 15 microns diamond paste or alumina particle that polishing needs particle mean size, and reasonable is to be no more than 10 microns.
Have been found that the disk substrate that has ground with meticulous diamond polishing cream or aluminium oxide polishing has drawn the finishing less than 10 dusts.In preferred embodiment, polishing step adopts diamond polishing cream, aluminium oxide or their potpourri, and particle mean size is about about 0.01 and 0.2 micron, and reasonable is less than 0.1 micron.
Though in order accurately to need smooth magnetic disk surface, the too smooth magnetic head that may make of disk substrate is difficult to adhere to.Therefore, disk usually needs the surface structure.Any common building method be can adopt, hot etching, laser ablation, chemical etching and plasma etching and their combination comprised.If select hot etching to construct zirconia, generally between 800 and 1400 ℃, reasonable is about 1000 ℃ to etching temperature, and the time is 30 minutes.
In other embodiments, can adopt the aluminium oxide that makes zirconia toughening, reasonable is AZ67 available from U.S. Norton.It is believed that toughness is at least 4.5 MPam
1/2, preferably be at least 5MPam
1/2Commercially available zirconia toughening aluminium oxide grind and polish and will obtain desirable finishing.
In other embodiments, can select boron carbide.If boron carbide is elected to be the disk substrate, then can adopt any common boron carbide.It is believed that boron carbide is not that hot pressing is exactly sintering, grinds subsequently and polishes to obtain producing desirable finishing.Its elastic modulus typically is at least 435GPa.Be more preferably, the porosity of boron carbide less than 0.1% surfaceness (Ra) less than 10 dusts.In preferred embodiment, boron carbide is a kind of hot pressing boron carbide Norbide available from U.S. Norton company.
Comparative example
With the diamond saw blade cutting diameter is the YZ110-H blank bar (available from Norton company) of 1.5 " and length is 3 ".Cut the surface of section through several roads finishing steps, comprise grinding, grinding and polishing.
Especially, the section at first with 320 granularity adamas blank grindings to produce 0.110 micron surfaceness (Ra).Then will cut into slices and on 12 inches lapping machines, grind and polish with adamas one by one according to the specification of Table I.
Table I section sand size rag wheel type speed pressure duration Ra
Micron revolutions per minute pound/time
2Minute micron A40 aluminium oxide 100 20 4 0.130 B30 pressing plates 25 25 3 0.028 C9 pressing plates 125 25 2 0.020 D3 texmet 200 30 1.2 0.012 E1 cloth 300 45 1.2 0.008 F0.25 cloth 400 60＜1 0.005
This test pieces does not reach 0.001 micron surfaceness (Ra).
Example I
Is that the YZ110-H blank bar (available from Nor-ton company) of 1.5 " and length is 3 " is cut into six section A-F with diamond saw blade with diameter.Section E and F cut with fast speeds.Table II has been listed thickness, surfaceness.Adopt TENCOR measure surface roughness (Ra).
Table II
Section the thickest (inch) the thinnest (inch) Ra (micron)
A 0.0406 0.0402 2-7
B 0.0412 0.0405 2-7
C 0.0406 0.0401 2-7
D 0.0201 0.0194 2-6
E 0.0215 0.0195 2-7
F 0.0235 0.0220 2-5
These sections are done last polishing with 0.05 micron diamond paste subsequently through the grinding and the polishing step of standard, and the surfaceness (Ra) that records according to the TENCOR method is 10 dusts.At last, wherein a section is constructed by hot etching down at 1000 ℃.
Example II
Under 200MPa, handle two kinds of DKK powder (3mol%Y-TZP and 4mol%Y-TZP) to form bar, sintering 60 minutes to be reaching at least 98% density in 1350 ℃ air, and handles under 200MPa in 1350 ℃ argon gas and be at least 99.9% bar to make density in 45 minutes.
It is 25.4 millimeters and thickness is 0.8 millimeter disk that these fine and close bars cut into diameter subsequently.Last grinding is carried out on the resin-bonded diamond wheel of #500 granularity.
9 micron the alumina abrasive of employing on the cast iron abrasive wheel grinds the disk blank.Grinding needed 30 minutes and produced the surfaceness on the 125 Izod right sides.
Adopt aluminium oxide/diamond polishing cream of 0.05 micron to do last polishing subsequently through the section of grinding, utilize the TENCOR method to measure, surfaceness (Ra) is 10 dusts.
Example III
Except only adopting 9 micrometer aluminas and only adopt in last polishing step the aluminium oxide of 50nm in grinding steps, this example is similar to example II basically.The surfaceness that records final disk substrate with AFM is the 10 Izod right sides.
Claims (26)
1. a disk substrate that is used for disc driver is characterized in that the disk substrate is made up of PSZ basically and surfaceness (Ra) is no more than 10 dusts.
2. disk substrate as claimed in claim 1 is characterized in that partially stabilized zirconia is included in rare earth between about 2.5mol% and the about 6mol% as rare earth oxide.
3. disk substrate as claimed in claim 2 is characterized in that having structured surface.
4. disk substrate as claimed in claim 3 is characterized in that adopting a kind of method in hot etching, chemical corrosion and the plasma etching to produce structured surface.
5. disk substrate as claimed in claim 1 is characterized in that the amount of impurity and sintering aid is no more than 0.3%.
6. disk substrate as claimed in claim 1 is characterized in that porosity is no more than 0.1%.
7. disk substrate that is used for disc driver is characterized in that the disk substrate is made up of PSZ basically and has a structured surface.
8. disk substrate as claimed in claim 7 is characterized in that partially stabilized zirconia is included in the rare earth of about 2.5mol% and about 4mol% as rare earth oxide.
9. disk substrate as claimed in claim 8 is characterized in that adopting a kind of method in hot etching, chemical agent erosion and the plasma etching to produce structured surface.
10. disk substrate as claimed in claim 7 is characterized in that the amount of impurity and sintering aid is no more than 0.3%.
11. disk substrate as claimed in claim 7 is characterized in that porosity is no more than 0.1%.
12. a disc driver is characterized in that comprising:
A) magnetic head, and
B) comprise as claim 1 or the rebasing disk of 7 described disks, wherein the air-gap of magnetic head and disk is no more than 2 microinchs.
13. a process is characterized in that comprising following steps:
A) substrate of being made up of partially stabilized zirconia basically is polished to surfaceness (Ra) is no more than 10 dusts with the adamas or the aluminium oxide antiscuffing paste of abrasive grain between 0.01～0.02 micron.
14. process as claimed in claim 13 is characterized in that further comprising following steps:
B) structure disk substrate.
15. process as claimed in claim 14 is characterized in that adopting a kind of method in hot etching, chemical agent erosion and the plasma etching to construct.
16. process as claimed in claim 14 is characterized in that further comprising following steps:
C) with blanket deposition on the disk substrate to form disk.
17. process as claimed in claim 15 is characterized in that further comprising following steps:
D) disk is put into the disc driver that comprises magnetic head so that the flying height between magnetic head and the disk less than 2 microinchs.
18. a process is characterized in that comprising following steps:
A) with adamas, aluminium oxide antiscuffing paste or their potpourri of abrasive grain between about 3～15 microns the substrate of being made up of partially stabilized zirconia basically is ground to surfaceness and is no more than 125 dusts, and
B) with adamas or aluminium oxide antiscuffing paste or their potpourri the substrate of being made up of partially stabilized zirconia basically is polished to surfaceness (Ra) and is no more than 10 dusts.
19. a partially stabilized zirconia substrate is characterized in that being made up of partially stabilized zirconia basically and surfaceness (Ra) is no more than 10 dusts.
20. disk substrate as claimed in claim 20 is characterized in that partially stabilized zirconia is included in rare earth between about 2.5mol% and the about 6mol% as rare earth oxide.
21. disk substrate as claimed in claim 20 is characterized in that rare earth element is a yttrium.
22. disk substrate as claimed in claim 21 is characterized in that the concentrations of rare-earth as rare earth oxide is 4mol%.
23. a disk substrate that is used for disc driver is characterized in that the disk substrate is made up of boron carbide basically.
24. disk substrate as claimed in claim 23 is characterized in that the elastic modulus of boron carbide is at least 435GPa, porosity is no more than 0.1% and surfaceness (Ra) is no more than 10 dusts.
25. a disk substrate that is used for disc driver is characterized in that the disk substrate is made up of the zirconia toughening aluminium oxide basically, surfaceness (Ra) is no more than 10 dusts.
26. form by partially stabilized zirconia basically and surfaceness is no more than the PSZ substrate of 10 dusts for one kind, it is characterized in that the process of making substrate may further comprise the steps:
A) with adamas, aluminium oxide antiscuffing paste or their potpourri of abrasive grain between about 3～15 microns the substrate of being made up of partially stabilized zirconia basically is ground to surfaceness (Ra) and is no more than 125 dusts, and
B) with adamas, aluminium oxide antiscuffing paste or their potpourri of abrasive grain between 0.01～0.02 micron the substrate of being made up of partially stabilized zirconia basically is polished to surfaceness (Ra) and is no more than 10 dusts.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23004494A | 1994-04-19 | 1994-04-19 | |
| US08/230,044 | 1994-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1147312A true CN1147312A (en) | 1997-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN95192629A Pending CN1147312A (en) | 1994-04-19 | 1995-04-18 | Improved disk substrate |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0756743A1 (en) |
| JP (1) | JPH09512127A (en) |
| KR (1) | KR970702550A (en) |
| CN (1) | CN1147312A (en) |
| CA (1) | CA2188150A1 (en) |
| WO (1) | WO1995028703A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002080423A1 (en) * | 2000-12-18 | 2002-10-10 | The Research Institute Of Telecommunication Transmission, Mii | Pilot channel tracking method based on multipath barycenter tracking loop |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3311308B2 (en) * | 1998-03-03 | 2002-08-05 | 株式会社オハラ | Glass ceramic substrate for perpendicular magnetic recording media |
| US6383645B1 (en) * | 1998-03-23 | 2002-05-07 | Kabushiki Kaisha Ohara | Glass-ceramic substrate for an information storage medium |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6022733A (en) * | 1983-07-19 | 1985-02-05 | Hitachi Metals Ltd | Substrate for magnetic disc |
| JPH0715753B2 (en) * | 1985-08-22 | 1995-02-22 | 株式会社日立製作所 | Magnetic recording medium |
| JPH0740350B2 (en) * | 1985-09-30 | 1995-05-01 | 京セラ株式会社 | Magnetic disk substrate |
| US4738885A (en) * | 1986-02-24 | 1988-04-19 | Kyocera Corporation | Magnetic disk, substrate therefor and process for preparation thereof |
-
1995
- 1995-04-18 KR KR1019960705898A patent/KR970702550A/en not_active Application Discontinuation
- 1995-04-18 CA CA002188150A patent/CA2188150A1/en not_active Abandoned
- 1995-04-18 EP EP95916245A patent/EP0756743A1/en not_active Withdrawn
- 1995-04-18 WO PCT/US1995/004325 patent/WO1995028703A1/en not_active Application Discontinuation
- 1995-04-18 CN CN95192629A patent/CN1147312A/en active Pending
- 1995-04-18 JP JP7527023A patent/JPH09512127A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002080423A1 (en) * | 2000-12-18 | 2002-10-10 | The Research Institute Of Telecommunication Transmission, Mii | Pilot channel tracking method based on multipath barycenter tracking loop |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2188150A1 (en) | 1995-10-26 |
| EP0756743A1 (en) | 1997-02-05 |
| WO1995028703A1 (en) | 1995-10-26 |
| JPH09512127A (en) | 1997-12-02 |
| KR970702550A (en) | 1997-05-13 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C01 | Deemed withdrawal of patent application (patent law 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |