EP0756743A1 - Improved disk substrate - Google Patents
Improved disk substrateInfo
- Publication number
- EP0756743A1 EP0756743A1 EP95916245A EP95916245A EP0756743A1 EP 0756743 A1 EP0756743 A1 EP 0756743A1 EP 95916245 A EP95916245 A EP 95916245A EP 95916245 A EP95916245 A EP 95916245A EP 0756743 A1 EP0756743 A1 EP 0756743A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- disk
- disk substrate
- substrate
- angstroms
- surface roughness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 67
- 230000003746 surface roughness Effects 0.000 claims abstract description 33
- 229910002077 partially stabilized zirconia Inorganic materials 0.000 claims abstract description 23
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 28
- 229910003460 diamond Inorganic materials 0.000 claims description 19
- 239000010432 diamond Substances 0.000 claims description 19
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 15
- 238000005498 polishing Methods 0.000 claims description 10
- 229910052580 B4C Inorganic materials 0.000 claims description 9
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 9
- 229910001404 rare earth metal oxide Inorganic materials 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 6
- 150000002910 rare earth metals Chemical class 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- 239000012535 impurity Substances 0.000 claims description 5
- 238000003486 chemical etching Methods 0.000 claims description 4
- 238000001020 plasma etching Methods 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims 1
- 229910052727 yttrium Inorganic materials 0.000 claims 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 9
- 239000000843 powder Substances 0.000 description 7
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 229910000861 Mg alloy Inorganic materials 0.000 description 4
- 229910003481 amorphous carbon Inorganic materials 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000002241 glass-ceramic Substances 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910002082 tetragonal zirconia polycrystal Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 238000007723 die pressing method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910002076 stabilized zirconia Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/64—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
- G11B5/739—Magnetic recording media substrates
- G11B5/73911—Inorganic substrates
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B2220/00—Record carriers by type
- G11B2220/20—Disc-shaped record carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/90—Magnetic feature
Definitions
- Figure 1 discloses a conventional disk drive 1 in which the actuator arm 2 moves the head 3 over disk 4 so that the circuitry on the head can magnetically transmit bits of information between leads (not shown) and the disk 4.
- Figure 2 discloses a conventional disk wherein a substrate 5 (typically an Al/Mg alloy) has deposited thereon, consecutively, an electroless or anodized coating (Ni/P) 6, a magnetic coating 7, a protective overcoat 8, and a liquid lubricant 9.
- a substrate 5 typically an Al/Mg alloy
- Ni/P electroless or anodized coating
- the head Due to the high density of information typically stored on a disk, the head must come very close to the disk during data transmission in order to insure accurate transfer. Accordingly, the space between the head and the disk (called a "flying height" or “air gap”) is often between about 4-6 microinches. At such extremely small distances, both the head and the disk must be very flat. Thus, the material used for the disk should be very stiff and amenable to a fine finish.
- the disk and actuator arm move relative to each other, an air flow develops and allows the head to "float" above the disk.
- the head's ability to float prevents wear-inducing contact between the head and disk which degrades the accuracy of data transfer.
- the starting and stopping of the disk or arm often produces physical contact between the head and disk. Therefore, it is also desirable to make the disk substrate from a material which is wear resistant.
- most conventional disks are made from a Mg/Al alloy overcoated with Ni/P and a magnetic film. This alloy has been selected as the material of choice for the disk due to its superior wear resistance, stiffness and polishablity, and performs well in the current relatively large disk drives.
- the current hard disk is about 65-275 mm in diameter and 0.64 mm to 1.5 mm in thickness, and is expected to be less than about 38 mm in diameter and less than about 0.4 mm in thickness in the future.
- the air gap will be reduced to no more than 2 microinches.
- use of Al/Mg alloys as disk substrates will be problematic in that the elastic modulus of Al/Mg alloys (only about 80 GPa) will not provide the stiffness required in the thin disks of the future (wherein the required stiffness will likely be at least about 200 GPa) .
- JP 62078716 discloses a zirconia based magnetic disk substrate for use in disk drives. However, the surface roughness (Ra) of this material is reported to be only 0.01 um. (100 angstroms). JP 62078715 discloses a zirconia based magnetic disk substrate for use in disk drives. However, the low density of this material would likely yield an even lower surface roughness (Ra) .
- EPO Patent Application 0 131 895 reports a zirconia based magnetic disk substrate for use in disk drives. However, the best surface roughness (Ra) of any disclosed material is reported to be only 0.003 um (30 angstroms). JP 01112518 discloses a zirconia based magnetic disk substrate for use in disk drives. However, the surface roughness (Ra) of this material is reported to be only 5- 8 nm (50-80 angstroms) .
- a partially stabilized zirconia substrate (preferably in the form of a disk substrate for use in a disk drive) , the substrate consisting essentially of partially stabilized zirconia and having a surface roughness (Ra) of no more than 10 angstroms.
- a disk substrate for use in a disk drive, the disk substrate consisting essentially of partially stabilized zirconia and having a textured surface.
- a disk drive comprising: a) a head, and b) an underlying disk as disclosed above, wherein the in- use airgap between the head and the disk is no more than 2 microinches.
- a process comprising: a) polishing a partially stabilized zirconia substrate with a diamond or alumina paste to a finish of no more than 10 angstroms.
- Figure 1 presents a conventional disk drive system.
- Figure 2 presents a conventional disk.
- the most of the promising disk substrate candidate materials possess inadequate toughness or a too high surface roughness (Ra) .
- the toughness required for the thin disks of the future will be at least about 4 MPa m 1/2 and the surface roughness (Ra) requirement will be no more than 10 angstroms.
- Ra surface roughness
- high toughness is required in these future disk substrates because it affords superior machinability and damage tolerance, and the fine finish (low surface roughness) is required for increased recording density.
- partially-stabilized zirconia typically has a toughness of at least about 7 MPa m 12 and can now be made to have a surface roughness of no more than 10 angstroms, it is believed that these materials will be required in the disks of the future.
- fracture toughness is measured by the Chantikul indentation strength method as disclosed in the Journal of the American Ceramics Society, 64(9), 1981, pp. 539-44. (CITE) ; surface roughness Ra" is the universally recognized as the arithmetic mean of the departures of the profile from the mean surface; and grit sizes used in finishing refer to the average diameter of the grit. Any conventional partially-stabilized zirconia
- PSZ ceramic such as yttria-partially stabilized tetragonal zirconia polycrystal ceramic (“YTZP”)
- YTZP yttria-partially stabilized tetragonal zirconia polycrystal ceramic
- commercial partially-stabilized zirconias have at least about 30% (and often more than about 70%) tetragonal zirconia and a toughness of at least about 4.5 MPa m 1/2 , preferably at least about 6 MPa m 12 .
- the zirconia is partially stabilized by a rare earth, and more preferably at a concentration of between about 2.5 mol% and about 6 mol%, as rare earth oxide, most preferably at a concentration of between about 2.5 mol% and about 4 mol%, as rare earth oxide.
- the zirconia is YZ110, an yttrium-stabilized zirconia available from the Norton Company of Worcester, MA.
- any conventional method of making the zirconia disk substrate may be used.
- rare earth oxide powder and zirconia powder are mixed, the mixture is cipped (uniaxially or isostatically) at between 50 and 500 MPa to form a green piece; the green piece is sintered at between 1300°C and 1500°C for 0.5-4 hours to achieve a density of at least 95%; and the sintered piece is hipped in inert gas at between 1200°C and 1500°C for between 0.5 and 4 hours to achieve a density of at least 99.9%.
- yttria powder and zirconia powder are mixed, cold-pressed, sintered to at least 96% density and hipped to at least 99.9% density.
- a highly pure disk substrate that is, a substrate having less than 0.3% of impurity or sintering aid, especially if the impurity or sintering aid tends to form a second phase.
- impurity or sintering aids include silica, iron and manganese. It has been found that using YTZP powders, available from Daiichi Kigenso (DKK) of Osaka, Japan, without sintering aid produces a partially stabilized disk substrate having the desired levels of purity which can be finished to the desired levels of surface roughness (Ra) . Accordingly, there is provided a partially stabilized zirconia disk substrate having no more than 0.3% impurity or sintering aid and a surface roughness of no more than 10 angstroms.
- Disk preparation generally involves only two steps: making a thin ceramic body and then finishing the body.
- Any conventional method of making thin ceramic bodies may be used in accordance with the invention, including diamond saw slicing of ceramic rods, tape casting, extrusion, and die pressing.
- the thin disk substrates are made by slicing a ceramic rod with a diamond saw.
- the slicing should produce a disk having an Ra of between about 2-7 um and a thickness of less than about 1 mm, preferably less than about 0.5 mm.
- Any conventional lapping method may be used to help attain the required finish on the disk substrate of the present invention, including lapping with a diamond paste or alumina.
- the lapping should produce a finish of less than about 125 angstroms.
- the polishing entails selecting either a diamond paste or alumina grain having an average size of between about 3 and 15 um, preferably less than 10 um.
- polishing the lapped disk substrate with a fine diamond paste or alumina produces a finish of less than about 10 angstroms.
- the polishing step uses diamond, alumina or a mixture thereof, having an average size of about 0.01 and 0.2 um, preferably less than 0.1 um.
- disks which are too smooth stick to the head. Accordingly, disks often require a surface texture. Any conventional method of texturing may be used, including thermal etching, laser etching, chemical etching and plasma etching, and combinations thereof. If thermal etching is selected to texture zirconia, the temperature of the etch is typically between about 800 and 1400°C, preferably about 1000°C at about 30 minutes.
- zirconia toughened alumina may be used, preferably AZ67, available from the Norton
- boron carbide may be selected. If boron carbide is selected as the disk substrate, any conventional boron carbide ceramic may be used. It is believed that when boron carbide is either hot pressed or sinter-hipped, and then lapped and polished as above yields the desired finish. It typically has a modulus of elasticity of at least about 435 GPa.
- the boron carbide also has a porosity of less than about 0.1% and a surface roughness (Ra) of no more than 10 angstroms.
- the boron carbide is Norbide, a hot-pressed boron carbide available from the Norton Company of Worcester, MA.
- COMPARATIVE EXAMPLE A YZ110-H blank rod having a 1.5" diameter and a 3" length, available from the Norton Company of Worcester, MA, was sliced with a diamond saw. The surface of this slice was subjected to a number of finishing steps including grinding, lapping and polishing steps.
- the slice was first ground with a 320 grit diamond blank to produce a surface roughness (Ra) of about 0.110 um.
- the lapped slice was serially lapped and polished with diamond on a 12 inch lapping machine according to the specifications set out in Table I below:
- This test slice did not achieve the desired 0.001 um (10 angstrom) surface roughness (Ra) .
- EXAMPLE I A YZ110-H blank rod having a 1.5" diameter and a 3" length, available from the Norton Company of Worcester, MA, was sliced with a diamond saw into six slices A to F. Slices E and F were sliced at a higher feed rate. The thickest and thinnest cross sections, as well as the surface roughness Ra of these six slices are presented in Table II. The surface roughness (Ra) was measured by
- EXAMPLE II Two Daiichi powders (3mol%Y-TZP and 4mol%Y-TZP) were cipped at 200 MPa to form green rods, sintered in air at 1350° for 60 minutes to achieve at least 98% density, and hipped in argon at 1350°C and 200 MPa for about 45 minutes to produce rods having a density of at least 99.9%.
- ground disk blanks were lapped using 9 um alumina grit on a cast-iron lapping wheel having slurry continuously dripping from the wheel. Lapping took about 30 minutes and produced a surface roughness of about 125 angstroms.
- the lapped slices were then final-polished with a 0.05 um alumina/diamond paste to a surface roughness (Ra) of 10 angstroms, as measured by TENCOR methodology.
- EXAMPLE III This example proceed substantially similarly to Example II, except that the lapping step used 9 um alumina only and the final-polish step used 50 nm alumina only.
- the resulting disk substrate had a surface roughness of about 10 angstroms, as measured by AFM.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Magnetic Record Carriers (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
This invention relates to a disk substrate for use in a disk drive, the disk substrate consisting essentially of partially stabilized zirconia and having a surface roughness (Ra) of no more than 10 angstroms.
Description
Improved Disk Substrate Background of the Invention
In the information systems presently used in computers and word processors, data (i.e., programs and files) are stored and retrieved through the disk drive. The disk drive typically has three components: the read-write head ("head") , the actuator arm, and the hard magnetic disk ("disk") . Figure 1 discloses a conventional disk drive 1 in which the actuator arm 2 moves the head 3 over disk 4 so that the circuitry on the head can magnetically transmit bits of information between leads (not shown) and the disk 4. Figure 2 discloses a conventional disk wherein a substrate 5 (typically an Al/Mg alloy) has deposited thereon, consecutively, an electroless or anodized coating (Ni/P) 6, a magnetic coating 7, a protective overcoat 8, and a liquid lubricant 9.
Due to the high density of information typically stored on a disk, the head must come very close to the disk during data transmission in order to insure accurate transfer. Accordingly, the space between the head and the disk (called a "flying height" or "air gap") is often between about 4-6 microinches. At such extremely small distances, both the head and the disk must be very flat. Thus, the material used for the disk should be very stiff and amenable to a fine finish.
When the disk and actuator arm move relative to each other, an air flow develops and allows the head to "float" above the disk. During operation, the head's ability to float prevents wear-inducing contact between the head and disk which degrades the accuracy of data transfer. However, the starting and stopping of the disk or arm often produces physical contact between the head and disk. Therefore, it is also desirable to make the disk substrate from a material which is wear resistant. As noted above, most conventional disks are made from a Mg/Al alloy overcoated with Ni/P and a magnetic
film. This alloy has been selected as the material of choice for the disk due to its superior wear resistance, stiffness and polishablity, and performs well in the current relatively large disk drives. However, increasing speed and capacity requirements are forcing disk drives to become smaller and smaller. For example, the current hard disk is about 65-275 mm in diameter and 0.64 mm to 1.5 mm in thickness, and is expected to be less than about 38 mm in diameter and less than about 0.4 mm in thickness in the future. Likewise, the air gap will be reduced to no more than 2 microinches. At these dimensions, it is believed that use of Al/Mg alloys as disk substrates will be problematic in that the elastic modulus of Al/Mg alloys (only about 80 GPa) will not provide the stiffness required in the thin disks of the future (wherein the required stiffness will likely be at least about 200 GPa) .
Faced with this problem, the art has considered using alternative ceramics. It has been suggested that glass, glass ceramics, amorphous carbon, silicon, titanium, polymers, and stainless steels are the likely candidates for the next generation of disk substrates. See B.Bhusan, "Magnetic Slider/Rigid Disk Substrate Materials and Disk Texturing Techniques-Status and Future Outlook", Advances in Information Storage Systems, Vol.
5, 1993, pp. 175-209. Moreover, Bhusan concludes that, of this group, the most promising are glasses, glass ceramics and amorphous carbon because they possess adequate elastic modulus. One other material which has been suggested for use as a substrate for future disks is CVD silicon carbide. See Am. Cer. Soc. Bull. Vol. 72, No. 3 (March 1993),p.74. However, CVD silicon carbide suffers from the disadvantages of high cost and directional (columnar) grain structure.
JP 62078716 discloses a zirconia based magnetic disk substrate for use in disk drives. However, the surface
roughness (Ra) of this material is reported to be only 0.01 um. (100 angstroms). JP 62078715 discloses a zirconia based magnetic disk substrate for use in disk drives. However, the low density of this material would likely yield an even lower surface roughness (Ra) .
EPO Patent Application 0 131 895 reports a zirconia based magnetic disk substrate for use in disk drives. However, the best surface roughness (Ra) of any disclosed material is reported to be only 0.003 um (30 angstroms). JP 01112518 discloses a zirconia based magnetic disk substrate for use in disk drives. However, the surface roughness (Ra) of this material is reported to be only 5- 8 nm (50-80 angstroms) .
Accordingly, there is a need for a disk drive material possessing superior wear resistance, stiffness and polishablity.
Summary of the Invention
In accordance with the present invention, there is provided a partially stabilized zirconia substrate (preferably in the form of a disk substrate for use in a disk drive) , the substrate consisting essentially of partially stabilized zirconia and having a surface roughness (Ra) of no more than 10 angstroms.
Also in accordance with the present invention, there is provided a disk substrate for use in a disk drive, the disk substrate consisting essentially of partially stabilized zirconia and having a textured surface.
Also in accordance with the present invention, there is provided a disk drive comprising: a) a head, and b) an underlying disk as disclosed above, wherein the in- use airgap between the head and the disk is no more than 2 microinches.
Also in accordance with the present invention, there is provided a process comprising: a) polishing a partially stabilized zirconia substrate with a diamond or alumina paste to a finish of no more than 10 angstroms. Description of the Figures
Figure 1 presents a conventional disk drive system.
Figure 2 presents a conventional disk. Detailed Description of the Invention It is believed that the most of the promising disk substrate candidate materials possess inadequate toughness or a too high surface roughness (Ra) . In particular, they possess the following toughnesses:
Substrate Toughness (MPa m1/2) 1) glass 0.5 - 0.9
2) glass ceramics 2
3) amorphous carbon 1
4) silicon 2
5) CVD Silicon carbide 3 In contrast, it is believed that the toughness required for the thin disks of the future will be at least about 4 MPa m1/2 and the surface roughness (Ra)
requirement will be no more than 10 angstroms. Without wishing to be tied to a theory, it is believed that high toughness is required in these future disk substrates because it affords superior machinability and damage tolerance, and the fine finish (low surface roughness) is required for increased recording density. Because partially-stabilized zirconia typically has a toughness of at least about 7 MPa m12 and can now be made to have a surface roughness of no more than 10 angstroms, it is believed that these materials will be required in the disks of the future.
For the purposes of this invention, "fracture toughness" is measured by the Chantikul indentation strength method as disclosed in the Journal of the American Ceramics Society, 64(9), 1981, pp. 539-44. (CITE) ; surface roughness Ra" is the universally recognized as the arithmetic mean of the departures of the profile from the mean surface; and grit sizes used in finishing refer to the average diameter of the grit. Any conventional partially-stabilized zirconia
("PSZ") ceramic, such as yttria-partially stabilized tetragonal zirconia polycrystal ceramic ("YTZP") , may be used in accordance with the present invention. Typically, commercial partially-stabilized zirconias have at least about 30% (and often more than about 70%) tetragonal zirconia and a toughness of at least about 4.5 MPa m1/2, preferably at least about 6 MPa m12. Preferably, the zirconia is partially stabilized by a rare earth, and more preferably at a concentration of between about 2.5 mol% and about 6 mol%, as rare earth oxide, most preferably at a concentration of between about 2.5 mol% and about 4 mol%, as rare earth oxide.
In some embodiments, the zirconia is YZ110, an yttrium-stabilized zirconia available from the Norton Company of Worcester, MA.
Any conventional method of making the zirconia disk substrate may be used. For example, in some embodiments,
rare earth oxide powder and zirconia powder are mixed, the mixture is cipped (uniaxially or isostatically) at between 50 and 500 MPa to form a green piece; the green piece is sintered at between 1300°C and 1500°C for 0.5-4 hours to achieve a density of at least 95%; and the sintered piece is hipped in inert gas at between 1200°C and 1500°C for between 0.5 and 4 hours to achieve a density of at least 99.9%.
Most preferably, yttria powder and zirconia powder are mixed, cold-pressed, sintered to at least 96% density and hipped to at least 99.9% density.
In some embodiments, it is believed advantageous to have a highly pure disk substrate, that is, a substrate having less than 0.3% of impurity or sintering aid, especially if the impurity or sintering aid tends to form a second phase. Such typical sintering aids include silica, iron and manganese. It has been found that using YTZP powders, available from Daiichi Kigenso (DKK) of Osaka, Japan, without sintering aid produces a partially stabilized disk substrate having the desired levels of purity which can be finished to the desired levels of surface roughness (Ra) . Accordingly, there is provided a partially stabilized zirconia disk substrate having no more than 0.3% impurity or sintering aid and a surface roughness of no more than 10 angstroms.
In some preferred embodiments, it is believed advantageous to have no more than 0.1% porosity. It has been found that PSZ from commercially available DKK powders provides a partially stabilized disk substrate having no more than 0.1% porosity which can be finished to the desired levels of surface roughness (Ra) .
Disk preparation generally involves only two steps: making a thin ceramic body and then finishing the body. Any conventional method of making thin ceramic bodies may be used in accordance with the invention, including diamond saw slicing of ceramic rods, tape casting, extrusion, and die pressing. Preferably, the thin disk
substrates are made by slicing a ceramic rod with a diamond saw. The slicing should produce a disk having an Ra of between about 2-7 um and a thickness of less than about 1 mm, preferably less than about 0.5 mm. Any conventional lapping method may be used to help attain the required finish on the disk substrate of the present invention, including lapping with a diamond paste or alumina. The lapping should produce a finish of less than about 125 angstroms. In preferred embodiments, the polishing entails selecting either a diamond paste or alumina grain having an average size of between about 3 and 15 um, preferably less than 10 um.
It has been found that polishing the lapped disk substrate with a fine diamond paste or alumina produces a finish of less than about 10 angstroms. In preferred embodiments, the polishing step uses diamond, alumina or a mixture thereof, having an average size of about 0.01 and 0.2 um, preferably less than 0.1 um.
Although a smooth disk surface is desirable for accuracy, it is often the case that disk substrates which are too smooth stick to the head. Accordingly, disks often require a surface texture. Any conventional method of texturing may be used, including thermal etching, laser etching, chemical etching and plasma etching, and combinations thereof. If thermal etching is selected to texture zirconia, the temperature of the etch is typically between about 800 and 1400°C, preferably about 1000°C at about 30 minutes.
In other embodiments, zirconia toughened alumina may be used, preferably AZ67, available from the Norton
Company of Worcester, MA. It is believed that lapping and polishing commercial zirconia toughened alumina having a toughness of at least about 4.5 MPa m1/2, preferably at least about 5 MPa m1/2 as described above yields the desired finish.
In still other embodiments, boron carbide may be selected. If boron carbide is selected as the disk
substrate, any conventional boron carbide ceramic may be used. It is believed that when boron carbide is either hot pressed or sinter-hipped, and then lapped and polished as above yields the desired finish. It typically has a modulus of elasticity of at least about 435 GPa.
More preferably, the boron carbide also has a porosity of less than about 0.1% and a surface roughness (Ra) of no more than 10 angstroms. In preferred embodiments, the boron carbide is Norbide, a hot-pressed boron carbide available from the Norton Company of Worcester, MA.
COMPARATIVE EXAMPLE A YZ110-H blank rod having a 1.5" diameter and a 3" length, available from the Norton Company of Worcester, MA, was sliced with a diamond saw. The surface of this slice was subjected to a number of finishing steps including grinding, lapping and polishing steps.
In particular, the slice was first ground with a 320 grit diamond blank to produce a surface roughness (Ra) of about 0.110 um. Next, the lapped slice was serially lapped and polished with diamond on a 12 inch lapping machine according to the specifications set out in Table I below:
TABLE I
Slice Grit Size Wheel type Speed Pressure Duration Ra um rpm psi min um
A 40 alumina 100 20 4 0.130
B 30 platen 25 25 3 0.028
C 9 platen 125 25 2 0.020
D 3 texmet 200 30 1.2 0.012
E 1 cloth 300 45 1.2 0.008
F 0.25 cloth 400 60 <1 0.005
This test slice did not achieve the desired 0.001 um (10 angstrom) surface roughness (Ra) .
EXAMPLE I A YZ110-H blank rod having a 1.5" diameter and a 3" length, available from the Norton Company of Worcester,
MA, was sliced with a diamond saw into six slices A to F. Slices E and F were sliced at a higher feed rate. The thickest and thinnest cross sections, as well as the surface roughness Ra of these six slices are presented in Table II. The surface roughness (Ra) was measured by
TENCOR.
TABLE II
Slice Thickest fin) Thinnest (in) Ra (um)
A 0.0406 0.0402 2-7
B 0.0412 0.0405 2-7
C 0.0406 0.0401 2-7
D 0.0201 0.0194 2-6
E 0.0215 0.0195 2-7
F 0.0235 0.0220 2-5 These slices were subjected to standard lapping and polishing steps, and then final-polished with a 0.05 um diamond paste to a surface roughness (Ra) of 10 angstroms, as measured by TENCOR methodology. Lastly, one of the slices was textured by thermal etching at 1000°C.
EXAMPLE II Two Daiichi powders (3mol%Y-TZP and 4mol%Y-TZP) were cipped at 200 MPa to form green rods, sintered in air at 1350° for 60 minutes to achieve at least 98% density, and hipped in argon at 1350°C and 200 MPa for about 45 minutes to produce rods having a density of at least 99.9%.
These dense rods were then sliced into disks of 25.4 mm diameter and 0.8 mm thickness. Final finish grinding of these slices was undertaken with #500 grit resin bonded diamond wheels.
The ground disk blanks were lapped using 9 um alumina grit on a cast-iron lapping wheel having slurry continuously dripping from the wheel. Lapping took about 30 minutes and produced a surface roughness of about 125 angstroms.
The lapped slices were then final-polished with a
0.05 um alumina/diamond paste to a surface roughness (Ra) of 10 angstroms, as measured by TENCOR methodology.
EXAMPLE III This example proceed substantially similarly to Example II, except that the lapping step used 9 um alumina only and the final-polish step used 50 nm alumina only. The resulting disk substrate had a surface roughness of about 10 angstroms, as measured by AFM.
Claims
1. A disk substrate for use in a disk drive, the disk substrate consisting essentially of partially stabilized zirconia and having a surface roughness (Ra) of no more than 10 angstroms.
2. The disk substrate of claim 1 wherein the partially stabilized zirconia comprises between about 2.5 mol% and about 6 mol% rare earth, as rare earth oxide.
3. The disk substrate of claim 2 having a textured surface.
4. The disk substrate of claim 3 wherein the textured surface is produced by a method selected from the group consisting of thermal etching, chemical etching and plasma etching.
5. The disk substrate of claim 1 having an impurity and sintered level of no more than 0.3%.
6. The disk substrate of claim 1 having a porosity of no more than 0.1%.
7. A disk substrate for use in a disk drive, the disk substrate consisting essentially of partially stabilized zirconia and having a textured surface.
8. The disk substrate of claim 7 wherein the partially stabilized zirconia comprises between about 2.5 mol% and about 4 mol% rare earth, as rare earth oxide.
9. The disk substrate of claim 8 wherein the textured surface is produced by a method selected from the group consisting of thermal etching, chemical etching and plasma etching.
10. The disk substrate of claim 7 having an impurity and sintering level of no more than 0.3%.
11. The disk substrate of claim 7 having a porosity of no more than 0.1%.
12. A disk drive comprising: a) a head, and b) a disk comprising the disk substrate of claims 1 or 7, wherein the airgap between the head and the disk is no more than 2 microinches.
13. A process comprising: a) polishing a substrate consisting essentially of partially stabilized zirconia with a diamond or alumina paste having a grit size of between 0.01 um and 0.2 um to a surface roughness of no more than 10 angstroms.
14. The process of claim 13 further comprising the step of: b) texturing the disk substrate.
15. The process of claim 14 wherein the texturing is achieved by a method selected from the group consisting of thermal etching, chemical etching and plasma etching.
16. The process of claim 14 further comprising the step of: c) depositing an overcoat on the disk substrate to form a disk.
17. The process of claim 16 further comprising the step of: d) placing the disk in a disk drive having a head to define flying height of no more than 2 microinches between the head and the disk.
18. A process comprising the steps of: a) lapping a disk substrate consisting essentially of partially stabilized zirconia with a diamond or alumina paste, or mixture thereof, having a grit size of between about 3 um and 15 um to a surface roughness (Ra) of about 125 angstroms, and b) polishing the disk substrate with a diamond or alumina paste, or mixture thereof, to a surface roughness (Ra) of no more than 10 angstroms.
19. A partially stabilized zirconia substrate consisting essentially of partially stabilized zirconia and having a surface roughness (Ra) of no more than 10 angstroms.
20. The disk substrate of claim 19 wherein the partially stabilized zirconia comprises between about 2.5 mol% and about 6 mol% rare earth, as rare earth oxide.
21. The disk substrate of claim 20 wherein the rare earth is yttrium.
22. The disk substrate of claim 21 wherein the rare earth concentration is 4 mol%, as rare earth oxide.
23. A disk substrate for use in a disk drive, the disk substrate consisting essentially of boron carbide.
24. The disk substrate of claim 23 wherein the boron carbide has a modulus of elasticity of at least about 435 GPa, a porosity of less than about 0.1% and a surface roughness (Ra) of no more than 10 angstroms.
25. A disk substrate for use in a disk drive, the disk substrate consisting essentially of zirconia toughened alumina having a surface roughness (Ra) of no more than 10 angstroms.
26. A partially stabilized zirconia substrate consisting essentially of partially stabilized zirconia and having a surface roughness (Ra) of no more than 10 angstroms, the substrate produced by a process comprising the steps of: a) lapping a disk substrate consisting essentially of partially stabilized zirconia with a diamond or alumina paste, or mixture thereof, having a grit size of between about 3 um and 15 um to a surface roughness (Ra) of about 125 angstroms, and b) polishing the disk substrate with a diamond or alumina paste, or mixture thereof, having an grit size of between 0.01 and 0.2 um to a surface roughness (Ra) of no more than 10 angstroms.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US23004494A | 1994-04-19 | 1994-04-19 | |
US230044 | 1994-04-19 | ||
PCT/US1995/004325 WO1995028703A1 (en) | 1994-04-19 | 1995-04-18 | Improved disk substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0756743A1 true EP0756743A1 (en) | 1997-02-05 |
Family
ID=22863733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP95916245A Withdrawn EP0756743A1 (en) | 1994-04-19 | 1995-04-18 | Improved disk substrate |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0756743A1 (en) |
JP (1) | JPH09512127A (en) |
KR (1) | KR970702550A (en) |
CN (1) | CN1147312A (en) |
CA (1) | CA2188150A1 (en) |
WO (1) | WO1995028703A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3311308B2 (en) * | 1998-03-03 | 2002-08-05 | 株式会社オハラ | Glass ceramic substrate for perpendicular magnetic recording media |
US6383645B1 (en) * | 1998-03-23 | 2002-05-07 | Kabushiki Kaisha Ohara | Glass-ceramic substrate for an information storage medium |
CN1151622C (en) * | 2000-12-18 | 2004-05-26 | 信息产业部电信传输研究所 | Pilot channel tracking method based on multipath channel energy window gravity center tracking loop |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6022733A (en) * | 1983-07-19 | 1985-02-05 | Hitachi Metals Ltd | Substrate for magnetic disc |
JPH0715753B2 (en) * | 1985-08-22 | 1995-02-22 | 株式会社日立製作所 | Magnetic recording medium |
JPH0740350B2 (en) * | 1985-09-30 | 1995-05-01 | 京セラ株式会社 | Magnetic disk substrate |
US4738885A (en) * | 1986-02-24 | 1988-04-19 | Kyocera Corporation | Magnetic disk, substrate therefor and process for preparation thereof |
-
1995
- 1995-04-18 CA CA002188150A patent/CA2188150A1/en not_active Abandoned
- 1995-04-18 KR KR1019960705898A patent/KR970702550A/en not_active Application Discontinuation
- 1995-04-18 EP EP95916245A patent/EP0756743A1/en not_active Withdrawn
- 1995-04-18 JP JP7527023A patent/JPH09512127A/en active Pending
- 1995-04-18 WO PCT/US1995/004325 patent/WO1995028703A1/en not_active Application Discontinuation
- 1995-04-18 CN CN95192629A patent/CN1147312A/en active Pending
Non-Patent Citations (1)
Title |
---|
See references of WO9528703A1 * |
Also Published As
Publication number | Publication date |
---|---|
KR970702550A (en) | 1997-05-13 |
CN1147312A (en) | 1997-04-09 |
JPH09512127A (en) | 1997-12-02 |
CA2188150A1 (en) | 1995-10-26 |
WO1995028703A1 (en) | 1995-10-26 |
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