CN114727484A - Hexagonal semiconductor circuit and manufacturing method thereof - Google Patents
Hexagonal semiconductor circuit and manufacturing method thereof Download PDFInfo
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- CN114727484A CN114727484A CN202210258780.4A CN202210258780A CN114727484A CN 114727484 A CN114727484 A CN 114727484A CN 202210258780 A CN202210258780 A CN 202210258780A CN 114727484 A CN114727484 A CN 114727484A
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/08—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
- H02M1/088—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters for the simultaneous control of series or parallel connected semiconductor devices
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
- Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of electronic circuits, and particularly discloses a hexagonal semiconductor circuit and a manufacturing method thereof. According to the invention, the hexagonal circuit substrate is used as a circuit carrier, and the functional circuits are respectively arranged on the six surfaces of the hexagonal circuit substrate, so that the integrated level is high, the occupied space is small, the heat dissipation effect is good, and the anti-interference capability of the circuit is strong.
Description
Technical Field
The present invention relates to the field of electronic circuit technology, and more particularly, to a hexagonal semiconductor circuit and a method for manufacturing the same.
Background
The semiconductor circuit, namely the modular Intelligent Power system mips (modular Intelligent Power system), not only integrates the Power switch device and the driving circuit, but also embeds fault detection circuits such as overvoltage, overcurrent and overheat, and can send detection signals to a CPU or a DSP for interrupt processing. The high-speed low-power-consumption chip-on-chip protection circuit is composed of a high-speed low-power-consumption chip, an optimized gate-level driving circuit and a quick protection circuit. Even if a load accident occurs or the use is improper, the MIPS can be prevented from being damaged. MIPS generally uses an IGBT as a power switching element, and has an integrated structure in which a current sensor and a driving circuit are incorporated.
An inverter circuit composed of a low-voltage control circuit such as an IC drive control circuit, an MIPS sampling amplification circuit, a PFC current protection circuit and the like of the existing MIPS modular intelligent power system and a high-voltage semiconductor circuit is arranged on the same board, and meanwhile, the existing MIPS modular intelligent power system only integrates a single MIPS module, so that integration of a plurality of MIPS modular intelligent power systems is not realized, and higher requirements on high integration and high heat dissipation technologies of the MIPS modular intelligent power system are provided for market miniaturization and low cost competition; as shown in the first figure, the conventional semiconductor circuit heat dissipation method is to transfer heat through a heat sink and then dissipate the heat through air, so as to realize air cooling heat dissipation, which has poor heat dissipation effect; the existing semiconductor circuit integral structure only has one surface, and the integral structure occupies a large space.
Disclosure of Invention
The invention aims to solve the technical problem that the problem can be conveniently solved and failure analysis can be conveniently carried out when the circuit product has problems.
In order to solve the technical problem, the technical scheme of the invention is as follows:
the utility model provides a hexagonal semiconductor circuit, includes hexagonal circuit substrate, hexagonal circuit substrate comprises metal substrate layer, insulating layer, copper foil layer and green oil reservoir, the side of hexagonal circuit substrate has set gradually PFC function circuit, press contravariant function circuit, rectifier bridge heap function circuit, fan contravariant function circuit, drive control circuit and MCU circuit, be connected with a plurality of pin on the hexagonal circuit substrate, PFC function circuit, press contravariant function circuit, rectifier bridge heap function circuit, fan contravariant function circuit, drive control circuit all through the metal wire with MCU circuit electric connection.
Preferably, an epoxy resin packaging body is packaged outside the hexagonal circuit substrate, a water cooling tank is arranged at the bottom of the hexagonal circuit substrate, a water cooling pipeline is mounted on the water cooling tank, and a screw hole is formed in the center of the hexagonal circuit substrate.
Preferably, the cross section of the hexagonal circuit substrate is a regular hexagon; the side of hexagonal circuit base plate is connected gradually by 6 rectangle faces and is constituteed, PFC functional circuit, press contravariant functional circuit, rectifier bridge heap functional circuit, fan contravariant functional circuit, drive control circuit and MCU circuit distribute in proper order set up in on the rectangle face.
Preferably, the PFC functional circuit, the press inverter functional circuit, the rectifier bridge stack functional circuit, the fan inverter functional circuit, the drive control circuit, and the MCU circuit are each composed of a plurality of semiconductor chips, a chip resistor, and a chip capacitor, and the semiconductor chips, the chip resistors, and the chip capacitors are all welded to the hexagonal circuit substrate.
Preferably, the PFC function circuit is configured to reduce a phase difference between a current and a voltage to improve a power factor; the compressor inverter functional circuit and the fan inverter functional circuit are used for converting direct current into alternating current and can work according to logic signals of an IC (integrated circuit); the rectifier bridge stack functional circuit is used for converting sine wave alternating current into steamed bread wave direct current; the drive control circuit is used for receiving the logic signal of the MCU and outputting the signal to control the drive power device; the MCU circuit is used for receiving the logic signal of the MCU through the drive IC and outputting the logic signal to control the drive control circuit to work.
In order to solve the above technical problem, the present invention further provides a method for manufacturing a hexagonal semiconductor circuit, including the steps of: placing a hexagonal circuit substrate on a carrier, and brushing solder paste or dispensing silver paste on component mounting positions reserved on the surfaces of six surfaces of the hexagonal circuit substrate respectively; mounting a circuit component on a component mounting position through automatic die bonding equipment, and mounting the circuit component on the component mounting position through automatic SMT (surface mount technology) equipment; placing the lead frame to the corresponding welding position of the hexagonal circuit substrate through a manipulator or manually; then, the whole semi-finished product including the carrier passes through a reflow oven together, so that all circuit components are welded on corresponding mounting positions; detecting the welding quality of the circuit component by visual inspection of the AOI equipment; cleaning flux and oxide remained on the hexagonal circuit substrate by cleaning modes such as spraying, ultrasonic and the like, forming electric connection between the circuit element and circuit wiring through a metal wire, packaging the hexagonal circuit substrate in a mold through packaging equipment, and reserving an MCU (microprogrammed control Unit) mounting position; marking the hexagonal semiconductor circuit through laser marking, carrying out postcuring destressing treatment on the hexagonal semiconductor circuit through a high-temperature oven, then pasting the MCU circuit to the corresponding mounting position at the MCU mounting position by using tin paste or silver paste, and finally carrying out electrical parameter testing to manufacture the final hexagonal semiconductor circuit.
Preferably, the manufacturing method further includes sealing at least a connection portion of the lead and the circuit wiring on the hexagonal circuit substrate with an epoxy resin by means of plastic molding, and exposing at least a portion of the lead extending outward without being sealed with the epoxy resin.
Preferably, the manufacturing method further comprises mounting a water cooling pipe on the hexagonal circuit substrate, and drilling a screw hole at the center of the hexagonal circuit substrate.
By adopting the technical scheme, the hexagonal semiconductor circuit and the manufacturing method thereof have the following beneficial effects: the hexagonal circuit substrate in the hexagonal semiconductor circuit consists of a metal substrate layer, an insulating layer, a copper foil layer and a green oil layer, a PFC functional circuit, a press inverter functional circuit, a rectifier bridge stack functional circuit, a fan inverter functional circuit, a drive control circuit and an MCU circuit are sequentially arranged on the side surface of the hexagonal circuit substrate, a plurality of pins are connected on the hexagonal circuit substrate, the PFC functional circuit, the press inverter functional circuit, the rectifier bridge stack functional circuit, the fan inverter functional circuit and the drive control circuit are all electrically connected with the MCU circuit through metal wires, the hexagonal circuit substrate is arranged as a circuit carrier, the functional circuits are respectively arranged on six surfaces of the hexagonal circuit substrate, the heat dissipation problem caused by higher specification current and higher integration level can be well solved, the heat dissipation effect is good, the application is wider, and the requirements of high-integration level circuits can be met simultaneously, the occupied space is small, and the manufacturing cost is reduced; the strong current and the weak current are distinguished, the anti-interference capability of the product can be improved, the problem can be conveniently eliminated when the circuit product has a problem, and failure analysis is convenient to carry out.
Drawings
FIG. 1 is a three-dimensional schematic diagram of a conventional semiconductor circuit substrate;
FIG. 2 is a three-dimensional schematic diagram of the internal structure of a hexagonal semiconductor circuit of the present invention;
FIG. 3 is a front perspective view of the internal structure of the hexagonal semiconductor circuit of the present invention;
FIG. 4 is a cross-sectional view of a hexagonal semiconductor circuit of the present invention;
FIG. 5 is a three-dimensional schematic diagram of the external structure of a hexagonal semiconductor circuit in accordance with the present invention;
fig. 6 is a front projection view of the external structure of the hexagonal semiconductor circuit of the present invention.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
As shown in fig. 2-6, the hexagonal semiconductor circuit includes a hexagonal circuit substrate 2, the hexagonal circuit substrate 2 is composed of a metal substrate layer, an insulating layer 001, a copper foil layer 002 and a green oil layer 003, a PFC functional circuit 1, a press inverter functional circuit 3, a rectifier bridge stack functional circuit 4, a fan inverter functional circuit 5, a drive control circuit 6 and an MCU circuit 7 are sequentially disposed on a side surface of the hexagonal circuit substrate 2, a plurality of pins 8 are connected to the hexagonal circuit substrate 2, the PFC functional circuit 1, the press inverter functional circuit 3, the rectifier bridge stack functional circuit 4, the fan inverter functional circuit 5, and the drive control circuit 6 are electrically connected to the MCU circuit 7 through metal wires 004. It can be understood that the exterior of the hexagonal circuit substrate 2 is packaged with the epoxy resin package 10, the bottom of the hexagonal circuit substrate 2 is provided with a water cooling tank 201, the water cooling tank 201 is provided with a water cooling pipeline 9, and the center of the hexagonal circuit substrate 2 is provided with a screw hole 202. The hexagonal semiconductor circuit is radiated by a water cooling device, the base material structure is designed into a hexagon, each surface of a hexagonal circuit substrate 2 is provided with a functional circuit, a water cooling device is arranged below each functional circuit to achieve the independent radiating purpose, and meanwhile, a screw mounting hole is reserved in the center of the hexagonal circuit substrate 2 and used for mounting the hexagonal semiconductor circuit on an electric control board.
Specifically, the cross section of the hexagonal circuit substrate 2 is a regular hexagon; the side surface of the hexagonal circuit substrate 2 is formed by sequentially connecting 6 rectangular surfaces, and the PFC functional circuit 1, the press inverter functional circuit 3, the rectifier bridge stack functional circuit 4, the fan inverter functional circuit 5, the drive control circuit 6 and the MCU circuit 7 are sequentially distributed on the rectangular surfaces; the PFC functional circuit 1, the press inverter functional circuit 3, the rectifier bridge stack functional circuit 4, the fan inverter functional circuit 5, the drive control circuit 6 and the MCU circuit 7 are respectively composed of a plurality of semiconductor chips, chip resistors and chip capacitors, and the semiconductor chips, the chip resistors and the chip capacitors are all welded on the hexagonal circuit substrate 2. As can be understood, the PFC functional circuit 1 is used to reduce the phase difference between the current and the voltage to improve the power factor; the compressor inverter functional circuit 2 and the fan inverter functional circuit 5 are used for converting direct current into alternating current and can work according to logic signals of an IC (integrated circuit); the rectifier bridge stack functional circuit 4 is used for converting sine wave alternating current into steamed bread wave direct current; the drive control circuit 6 is used for receiving the logic signal of the MCU and outputting the signal to control the drive power device; the MCU circuit 7 is used for receiving the logic signal of the MCU through the driver IC and outputting the logic signal to control the driver control circuit 6 to operate.
As can be understood, the internal structure of the hexagonal semiconductor circuit includes: a PFC function circuit 1 for increasing a power factor by reducing a phase difference between a current and a voltage; the chip 101 forming the PFC circuit realizes the on-off control of the circuit and plays a role of follow current; a driving resistor 102 forming a PFC circuit for limiting the switching speed of the IGBT; a pad (pad)103 forming a PFC circuit, used for being welded with a pin to realize electric connection with an external circuit; a hexagonal circuit board 2 (i.e., a metal base material) serving as a carrier of the entire internal circuit of the semiconductor circuit and having a heat dissipation function for the entire semiconductor circuit; a water cooling tank 201 for installing a water cooling pipe; screw holes 202 for mounting the hexagonal semiconductor circuit to the electronic control board; the insulating layer 001 is used for preventing the risks of short circuit and electric leakage of an internal circuit caused by electrifying the circuit wiring layer and the metal base material; a copper foil layer 002, which is etched to form a desired circuit, to form a circuit wiring layer; the green oil layer 003 is mainly used for protecting the copper foil circuit layer, preventing physical disconnection of a conductor circuit, preventing short circuit caused by bridging in a welding process, reducing copper pollution to a welding trough and preventing insulation deterioration and corrosion caused by external environmental factors such as dust, moisture and the like; a metal wire 004 (the metal wire is generally made of gold, aluminum, copper and the like) for electrically connecting components in the circuit; the chip 005 realizes on-off control of the circuit and plays a role of follow current; the chip resistor 006 is connected to the gate of the IGBT chip in the semiconductor circuit and plays a role in limiting the switching speed of the IGBT by current limiting; the patch capacitor 007 plays roles of filtering, coupling and bootstrapping in the semiconductor circuit; the press inverter functional circuit 3 converts direct current into alternating current and can work according to logic signals of the IC; the chip 301 forming the inverter functional circuit of the press realizes the on-off control of the circuit and plays a role of follow current; a bonding pad (pad)302 of the inverter functional circuit of the press machine, which is used for being welded with a pin to realize the electric connection with an external circuit; the rectifier bridge stack functional circuit 4 converts sine wave alternating current into steamed bread wave direct current; a chip 401 forming a rectifier bridge circuit realizes rectification by using the single-phase conduction characteristic of a diode; a bridge rectifier pad (pad)402 for electrically connecting to an external circuit by soldering with a pin; the fan inverter functional circuit 5 converts direct current into alternating current and can work according to logic signals of the IC; the chip 501 forming the fan inverter functional circuit realizes the on-off control of the circuit and plays a role of follow current; a pad (pad)502 of the fan inverter functional circuit, which is used for being welded with a pin to realize the electric connection with an external circuit; the driving control circuit 6 is composed of a press driving control circuit and a fan driving control circuit, receives a logic signal of the MCU and outputs the signal to control a driving power device; the driving chip 601 controls the driving power device according to the MCU logic signal; a pad (pad)602 of the driving control circuit, which is used for being electrically connected with an external circuit by being welded with a pin; the MCU circuit 7, a signal processing center of the whole system, as a part of the system, receives the logic signal of the MCU through the drive IC and outputs the logic signal to control the drive inverter circuit to work; a (pad)701 of an MCU circuit output bonding pad, which is used for being welded with the pin 8 to realize the electric connection with an external circuit; an MCU mounting position 702 for welding an MCU; the pins 8 are made of C194(-1/2H) (chemical composition: Cu (97.0) ≧ Fe: 2.4P: 0.03 Zn: 0.12) or KFC (-1/2H) (chemical composition: Cu (99.6) ≧ Fe: 0.1 (0.05-0.15) P: 0.03 (0.025-0.04)), the 0.5mm copper plate is punched by machining to form a required shape, the surface is plated with nickel with the thickness of 0.1-0.5um, and then the surface is plated with tin with the thickness of 2-5 um; the water cooling pipeline 9 realizes the heat dissipation effect by realizing water circulation in the pipeline; the packaging body 10 is a powder molding compound formed by mixing epoxy resin as matrix resin, high-performance phenolic resin as curing agent, silicon micropowder and the like as fillers and a plurality of additives, is extruded into a die cavity by a heat transfer molding method and embeds a semiconductor chip therein, and is crosslinked, cured and molded to form a device with a certain shape structure. In summary, the conventional semiconductor circuit is only composed of a single inverter circuit and a drive control circuit, while the hexagonal semiconductor circuit of the invention is composed of a rectifier bridge stack, a PFC, a compressor inverter circuit, a fan inverter circuit, a compressor drive control circuit, a fan drive control circuit and an MCU control circuit, and has the characteristics of high integration level and small size specification.
It can be understood that the hexagonal semiconductor circuit has the following features, which include: the hexagonal metal base material is used as a carrier; an insulating layer disposed intermediate the metal substrate and the copper foil layer; a copper foil layer for forming a circuit wiring layer; pressing the insulating layer and the copper foil layer to form a pressed semi-finished product; laminating the laminated semi-finished product insulation layer surface and the other surface of the metal base material to form a substrate semi-finished product; forming a circuit wiring layer on the surface of the semi-finished copper foil layer of the substrate; forming a green oil layer serving as a protection layer on the circuit wiring layer to form a finished substrate; a metal pin which is connected with the circuit wiring and is used as input and output and extends outwards; a circuit component disposed at a specific portion of the circuit wiring; a metal wire for electrically connecting the circuit wiring and the circuit component; at least the connection portion of the lead and the circuit wiring is sealed by an epoxy resin, and at least a portion of the lead extending outward is exposed without being sealed by the resin.
As can be understood, the external structure of the hexagonal semiconductor circuit includes: the water-cooled LED packaging structure comprises a packaging body 10, a hexagonal circuit substrate 2, pins 8, a water-cooled pipeline 9, a water-cooled groove 201 and a screw hole 202; compared with the external structure of the conventional semiconductor circuit, the overall structure of the hexagonal semiconductor circuit is hexagonal, while the overall structure of the conventional semiconductor circuit is cuboid, so that the overall structures are different; the hexagonal semiconductor circuit pins are distributed from six surfaces to form a hexagonal layout, and the conventional semiconductor circuit pins are distributed from one surface and have different pin layouts; the hexagonal semiconductor circuit only needs one screw hole for installation, and the existing semiconductor circuit needs two screw holes for installation, so that the installation modes are different; the hexagonal semiconductor circuit substrate of the invention is provided with a water cooling tank device, and the conventional semiconductor circuit substrate is not provided with the water cooling tank device, so that the heat dissipation modes are different. When the hexagonal semiconductor circuit is installed, the hexagonal semiconductor circuit is directly installed on the electric control board as a plug-in unit, then the hexagonal semiconductor circuit is fixed in the screw hole position through a screw, and the pin is welded on the electric control board through wave soldering to realize electric connection. The invention can take away heat through water circulation of the water cooling pipeline to realize water cooling heat dissipation.
Specifically, the present invention also provides a method for manufacturing a hexagonal semiconductor circuit, comprising the steps of: placing the hexagonal circuit substrate on a carrier, and brushing solder paste or dispensing silver paste on component mounting positions reserved on the surfaces of six surfaces of the hexagonal circuit substrate; mounting a circuit component on a component mounting position through automatic die bonding equipment, and mounting the circuit component on the component mounting position through automatic SMT (surface mount technology) equipment; placing the lead frame to the corresponding welding position of the hexagonal circuit substrate through a manipulator or manually; then, the whole semi-finished product including the carrier passes through a reflow oven together, so that all circuit components are welded on corresponding mounting positions; detecting the welding quality of the circuit component by visual inspection of the AOI equipment; cleaning flux and oxide remained on the hexagonal circuit substrate by cleaning modes such as spraying, ultrasonic and the like, forming electric connection between the circuit element and circuit wiring by a metal wire, packaging the hexagonal circuit substrate in a die by packaging equipment, and reserving an MCU (microprogrammed control Unit) mounting position; marking the hexagonal semiconductor circuit through laser marking, carrying out postcuring destressing treatment on the hexagonal semiconductor circuit through a high-temperature oven, then pasting the MCU circuit to the corresponding mounting position at the MCU mounting position by using tin paste or silver paste, and finally carrying out electrical parameter testing to manufacture the final hexagonal semiconductor circuit.
It can be understood that the manufacturing method further comprises sealing at least the connection part of the pins and the circuit wiring on the hexagonal circuit substrate by epoxy resin in a plastic packaging manner, and exposing at least a part of the pins extending outwards without being sealed by epoxy resin; the manufacturing method also comprises the step of installing a water cooling pipeline on the hexagonal circuit substrate, and forming a screw hole in the center of the hexagonal circuit substrate. The manufacturing method has the following characteristics that: a hexagonal metal base material is used as a carrier; arranging a copper foil layer on the surface of each side of the metal substrate; forming a circuit wiring on the metal base copper foil by etching; forming a line protection green oil layer on the surface of the circuit wiring; a step of forming a plating layer on the surface of the metal copper material of the specific shape, which is not covered by the green oil layer, to manufacture a metal connector; a step of forming a plating layer on the surface of a metal copper material with a specific shape to prepare a pin; coating an adhesive material having a predetermined fluidity on a predetermined position of the circuit wiring; welding a chip on the surface of the metal radiating fin; placing a circuit element on the adhesive material; curing the adhesive material; cleaning the scaling powder, aluminum scraps and other pollutants remained on the metal aluminum substrate by adopting cleaning modes such as spraying, ultrasonic and the like; forming an electrical connection between the circuit element and the circuit wiring by bonding a metal wire; sealing and fixing the metal substrate and the pins in a plastic package mode, so that the specific position of the circuit wiring with a specific potential is not filled with the resin; testing necessary electrical parameters and appearance parameters by testing equipment; a step of mounting a cooling water pipe to the semiconductor circuit; the semiconductor circuit of the present invention is manufactured after the cold water pipe is installed.
The invention has the advantages of reasonable design, unique structure, realization of water cooling function, better refrigeration effect, better solution of heat dissipation problem caused by higher specification current and higher integration level, and wider application; a structural method of taking a hexagon as a carrier is provided, which can meet the requirement of high integration level electric control miniaturization; each side of the hexagonal semiconductor substrate is provided with a functional circuit, so that strong and weak current distinction is realized, the anti-interference capability of a product can be improved, and when a circuit product has a problem, the problem can be conveniently eliminated, and failure analysis is facilitated; when the electric control board is installed, the electric control board can be fixed by only installing one screw, and the installation efficiency is improved.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, and the scope of protection is still within the scope of the invention.
Claims (8)
1. A hexagonal semiconductor circuit, characterized by: including hexagon circuit substrate, hexagon circuit substrate comprises metal substrate layer, insulating layer, copper foil layer and green oil reservoir, hexagon circuit substrate's side has set gradually PFC functional circuit, press contravariant functional circuit, rectifier bridge heap functional circuit, fan contravariant functional circuit, drive control circuit and MCU circuit, be connected with a plurality of pin on the hexagon circuit substrate, PFC functional circuit, press contravariant functional circuit, rectifier bridge heap functional circuit, fan contravariant functional circuit, drive control circuit all through the metal wire with MCU circuit electric connection.
2. The hexagonal semiconductor circuit of claim 1, wherein: the novel water-cooling type LED lamp is characterized in that an epoxy resin packaging body is packaged outside the hexagonal circuit substrate, a water cooling groove is formed in the bottom of the hexagonal circuit substrate, a water cooling pipeline is mounted on the water cooling groove, and a screw hole is formed in the center of the hexagonal circuit substrate.
3. The hexagonal semiconductor circuit of claim 1, wherein: the cross section of the hexagonal circuit substrate is a regular hexagon; the side face of the hexagonal circuit substrate is formed by sequentially connecting 6 rectangular faces, and the PFC functional circuit, the press inverter functional circuit, the rectifier bridge stack functional circuit, the fan inverter functional circuit, the drive control circuit and the MCU circuit are sequentially distributed on the rectangular faces.
4. The hexagonal semiconductor circuit of claim 1, wherein: the PFC functional circuit, the press inversion functional circuit, the rectifier bridge stack functional circuit, the fan inversion functional circuit, the drive control circuit and the MCU circuit are respectively composed of a plurality of semiconductor chips, chip resistors and chip capacitors, and the semiconductor chips, the chip resistors and the chip capacitors are all welded on the hexagonal circuit substrate.
5. The hexagonal semiconductor circuit of claim 1, wherein: the PFC function circuit is used for reducing the phase difference between the current and the voltage to improve the power factor; the compressor inverter functional circuit and the fan inverter functional circuit are used for converting direct current into alternating current and can work according to logic signals of an IC (integrated circuit); the rectifier bridge stack functional circuit is used for converting sine wave alternating current into steamed bread wave direct current; the drive control circuit is used for receiving the logic signal of the MCU and outputting the signal to control the drive power device; the MCU circuit is used for receiving the logic signal of the MCU through the drive IC and outputting the logic signal to control the drive control circuit to work.
6. A method of manufacturing a hexagonal semiconductor circuit according to any one of claims 1 to 5, characterized in that: the method comprises the following steps: placing a hexagonal circuit substrate on a carrier, and brushing solder paste or dispensing silver paste on component mounting positions reserved on the surfaces of six surfaces of the hexagonal circuit substrate respectively; mounting a circuit component on a component mounting position through automatic die bonding equipment, and mounting the circuit component on the component mounting position through automatic SMT (surface mount technology) equipment; placing the lead frame to the corresponding welding position of the hexagonal circuit substrate through a manipulator or manually; then, the whole semi-finished product including the carrier passes through a reflow oven together, so that all circuit components are welded on corresponding mounting positions; detecting the welding quality of the circuit component by visual inspection of the AOI equipment; cleaning flux and oxide remained on the hexagonal circuit substrate by cleaning modes such as spraying, ultrasonic and the like, forming electric connection between the circuit element and circuit wiring through a metal wire, packaging the hexagonal circuit substrate in a mold through packaging equipment, and reserving an MCU (microprogrammed control Unit) mounting position; marking the hexagonal semiconductor circuit through laser marking, carrying out postcuring destressing treatment on the hexagonal semiconductor circuit through a high-temperature oven, then pasting the MCU circuit to the corresponding mounting position at the MCU mounting position by using tin paste or silver paste, and finally carrying out electrical parameter testing to manufacture the final hexagonal semiconductor circuit.
7. The method of manufacturing a hexagonal semiconductor circuit according to claim 6, wherein: and sealing at least the connection part of the pins and the circuit wiring on the hexagonal circuit substrate by epoxy resin in a plastic package mode, wherein at least one part of the pins extending outwards is exposed without being sealed by the epoxy resin.
8. The method of manufacturing a hexagonal semiconductor circuit according to claim 6, wherein: the water cooling pipeline is arranged on the hexagonal circuit substrate, and a screw hole is formed in the center of the hexagonal circuit substrate.
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| CN115734462A (en) * | 2022-11-21 | 2023-03-03 | 广东汇芯半导体有限公司 | Semiconductor circuit and manufacturing method thereof |
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