CN114725040B - Samming board and mobile terminal - Google Patents
Samming board and mobile terminal Download PDFInfo
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- CN114725040B CN114725040B CN202210324634.7A CN202210324634A CN114725040B CN 114725040 B CN114725040 B CN 114725040B CN 202210324634 A CN202210324634 A CN 202210324634A CN 114725040 B CN114725040 B CN 114725040B
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 37
- 238000004891 communication Methods 0.000 claims abstract description 36
- 230000005855 radiation Effects 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims abstract description 17
- 238000000576 coating method Methods 0.000 claims abstract description 17
- 230000002265 prevention Effects 0.000 claims description 7
- 229910052582 BN Inorganic materials 0.000 claims description 6
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229920000620 organic polymer Polymers 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 16
- 238000012546 transfer Methods 0.000 abstract description 8
- 238000000926 separation method Methods 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 description 39
- 238000000034 method Methods 0.000 description 20
- 230000008569 process Effects 0.000 description 17
- 230000000694 effects Effects 0.000 description 13
- 238000005452 bending Methods 0.000 description 12
- 230000009471 action Effects 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 6
- 229920002943 EPDM rubber Polymers 0.000 description 5
- 230000005484 gravity Effects 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
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- 239000000835 fiber Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the field of mobile terminals, in particular to a temperature equalizing plate and a mobile terminal, comprising: the heat dissipation device comprises a plurality of temperature equalization plate main bodies, wherein each temperature equalization plate main body is internally provided with a vacuum cavity, the interior of each vacuum cavity is provided with a first capillary structure net and a flexible communication structure, each flexible communication structure is used for communicating every two adjacent temperature equalization plate main bodies, each flexible communication structure comprises an outer pipe and an inner pipe, a second capillary structure net communicated with the first capillary structure net is filled between each inner pipe and each outer pipe, a convex hull is arranged on the surface of each temperature equalization plate main body, and a radiation heat dissipation coating is arranged on the surface of each temperature equalization plate main body, so that gas-water separation can be realized in the same pipe, the number of channels is saved on the premise of ensuring the circulation efficiency, more communication pipelines can be arranged between every two adjacent temperature equalization plate main bodies, the circulation efficiency between the adjacent temperature equalization plate main bodies is remarkably improved, and the heat transfer efficiency is further improved.
Description
Technical Field
The invention relates to the field of mobile terminals, in particular to a temperature equalizing plate and a mobile terminal.
Background
With the continuous increase of the integration level and the packaging density of electronic components, the packaging volume is continuously reduced, the higher heat flux density is usually provided at the positions, the service performance of the chip is seriously affected by the working temperature of a commercial-grade chip which is generally 0 to 70 ℃ exceeding the limit, even the chip is burnt, so that the heat management has important significance, the available heat dissipation areas are distributed on planes in different directions in some cases and other devices, the traditional temperature-uniforming plate is difficult to dissipate heat by utilizing different planes in multiple directions at the same time, and moreover, the traditional temperature-uniforming plate and the temperature-uniforming plate capable of being bent in one direction cannot meet the temperature-uniforming requirement on the planes on some irregular surfaces with pits, bulges and the like or the surfaces with the shape which is changed at any time, and the flexible communication structure of the current bendable temperature-uniforming plate is mainly communicated by air and water through pipelines in different positions, but still has the following defects:
1. in the working process of the temperature equalization plate, particularly in the bending process of the bendable temperature equalization plate, the flowing direction of liquid in the capillary tube is easy to change along with the change of the gravity acting direction due to the gravity effect, the liquid circulation effect is affected, even the liquid cannot flow back, and the heat transfer effect is deteriorated;
2. In the practical application process of the bendable temperature equalization plate, the heat dissipation area cannot be fully attached to other heat dissipation surfaces, and at this time, the radiation characteristic of the surface of the temperature equalization plate is a key factor affecting the heat dissipation effect of the temperature equalization plate. The radiation characteristics of the surface of the temperature equalizing plate are not considered in the design process of the traditional temperature equalizing plate and the bendable temperature equalizing plate.
Disclosure of Invention
The invention discloses a temperature equalization plate and a mobile terminal, which are used for bending a temperature equalization plate main body and improving the heat dissipation efficiency of the temperature equalization plate main body.
In order to achieve the above purpose, the present invention provides the following technical solutions:
in a first aspect, the present invention provides a temperature equalization plate comprising:
a plurality of temperature equalization plate main bodies, wherein each temperature equalization plate main body is internally provided with a vacuum cavity, and a first capillary structure net is arranged in each vacuum cavity;
The flexible communication structure is used for communicating every two adjacent temperature equalization plate main bodies and comprises an outer pipe and an inner pipe, and a second capillary structure net communicated with the first capillary structure net is filled between the inner pipe and the outer pipe;
the convex hull is arranged on the surface of the temperature equalization plate main body;
The radiation heat dissipation coating is arranged on the surface of the temperature equalization plate main body.
The component comprises the flexible communication structure for bending the adjacent two temperature equalization plate main bodies, so that the temperature equalization plate main bodies can be bent in multiple dimensions, the heat dissipation requirement in the three-dimensional complex proposed structure is met, a larger heat dissipation area is obtained, heat conduction is carried out, the temperature equalization and heat dissipation can be well carried out on planes in different directions, and the temperature equalization and heat dissipation purposes can still be well realized on some surfaces with pits and protrusions or surfaces with high and low shapes changing at any time.
And secondly, the inner pipe and the outer pipe are arranged in the flexible communication structure, under the action of the second capillary structure net, steam is conducted from the inside of the second capillary structure net, and liquid is conducted from the inside of the inner pipe, so that the invention can realize gas-water separation in the same pipe, the number of channels is saved on the premise of ensuring the circulation efficiency, more communication pipelines can be arranged between two adjacent temperature equalization plate main bodies, the circulation efficiency between the adjacent temperature equalization plate main bodies is obviously improved, the heat transfer efficiency is further improved, meanwhile, the second capillary structure net is provided with a backflow prevention structure, the second capillary structure net has smaller flow resistance and better capillary force connection in the forward flow process of liquid, the second capillary structure net can play a role in guiding and pushing the liquid, but in the reverse flow process of liquid, the backflow prevention structure is not easy to overcome the larger flow resistance, and can guide the liquid to flow back in the correct direction, and the backflow problem of the liquid is avoided especially when the flow direction of the liquid is opposite to the gravity direction in the process of the temperature equalization plate main bodies.
In addition, the radiation heat-dissipation coating and the convex hulls are arranged on the surface of the main body of the temperature-uniforming plate, so that the radiation heat-exchange effect of the heat-dissipation surface can be enhanced through the radiation heat-dissipation coating on the basis of increasing the heat-dissipation surface area, and the heat-dissipation performance of the temperature-uniforming plate is further enhanced.
In some embodiments, the temperature equalization plate body further comprises a bottom plate and a cover plate forming the vacuum chamber, and a plurality of heat conducting support columns are arranged between the bottom plate and the cover plate.
In some embodiments, the inner tube diameter D 1 and the outer tube diameter D 2 satisfy the following range relationship:
1.05D2≤D1≤1.1D2。
in some embodiments, the diameter D 2 of the outer tube and the isopipe body thickness H satisfy the following range relationship:
0.6H≤D2≤0.8H。
In some embodiments, the number of the flexible communication structures connected between every two adjacent temperature equalization plate bodies is 3-5.
In some embodiments, the radiant heat-dissipating coating comprises a mixture of hexagonal boron nitride or aluminum nitride and an organic polymer.
In some embodiments, the inner tube and the outer tube are each made of a flexible insulating material.
In some embodiments, the height h of the convex hull and the diameter d of the convex hull satisfy the following range relationship:
h：d＝1：2。
In some embodiments, the backflow prevention structure comprises a barb flow blocking group, and an included angle θ formed between the barb flow blocking group and the second capillary structure web satisfies the following range:
30°≤θ≤60°。
in a second aspect, the present invention provides a mobile terminal, including a temperature equalizing plate as defined in any one of the above.
Drawings
FIG. 1 is a schematic diagram of a temperature equalization plate structure according to an embodiment of the present invention;
FIG. 2 is a radial cross-sectional view of a single flexible communication structure in accordance with the present invention;
FIG. 3 is a split block diagram of a monolithic isopipe body;
FIG. 4 is a schematic view of an anti-backflow structure and an included angle θ according to the present invention;
FIG. 5 shows an embodiment of a temperature equalization plate according to the present invention;
FIG. 6 shows another embodiment of a temperature uniformity plate according to the present invention;
FIG. 7 is a schematic view of a cover plate of a main body of the temperature equalization plate with a convex hull;
fig. 8 is a schematic diagram of the vapor flow of liquid and vapor within the isopipe body and the convex hull.
In the figure: 1-temperature equalizing plate main body, 2-communication structure, 21-outer tube, 22-inner tube, 23-second capillary structure net, 24-barb choked flow group, 3-cover plate, 4-bottom plate, 5-first capillary structure net, 6-heat conduction support column, 7-convex hull, 8-radiation heat dissipation coating.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1 to 8, the invention discloses a temperature equalizing plate and a mobile terminal, which are used for bending a temperature equalizing plate main body 1 and improving the heat dissipation efficiency of the temperature equalizing plate main body 1.
In order to achieve the above purpose, the present invention provides the following technical solutions:
in a first aspect, the present invention provides a temperature equalization plate comprising:
a plurality of temperature equalizing plate main bodies 1, wherein each temperature equalizing plate main body 1 is internally provided with a vacuum cavity, and the inside of the vacuum cavity is provided with a first capillary structure net 5;
the flexible communication structure 2 is used for communicating every two adjacent temperature equalization plate main bodies 1;
the flexible communication structure 2 comprises an outer tube 21 and an inner tube 22, and a second capillary structure net 23 communicated with the first capillary structure net 5 is filled between the inner tube 22 and the outer tube 21;
The convex hull 7 is arranged on the surface of the temperature equalizing plate main body 1;
the radiation heat dissipation coating 8, the radiation heat dissipation coating 8 is set up on the surface of the samming board main body 1.
The components comprise the flexible communication structure 2 for bending the adjacent two temperature equalization plate main bodies 1, so that the temperature equalization plate main bodies 1 can be bent in multiple dimensions, the heat dissipation requirements in the three-dimensional complex structure are met, a larger heat dissipation area is obtained, heat conduction is conducted, the temperature equalization and heat dissipation can be well realized on planes in different directions, and the temperature equalization and heat dissipation purposes can still be well realized on some surfaces with pits and protrusions or surfaces with height and shape changing at any time.
Secondly, be equipped with inner tube 22 and outer tube 21 in flexible intercommunication structure 2 inside, under the effect of second capillary structure net 23, make steam by the inside conduction of second capillary structure net 23, and liquid by the inside conduction of inner tube 22, make this invention can realize gas-water separation in same intraductal, save channel quantity under the prerequisite of guaranteeing circulation efficiency, make can set up more communication pipeline between two adjacent samming board main parts 1, the circulation efficiency between adjacent samming board main parts 1 is showing and is improving, and then the efficiency of heat transfer has been improved, and simultaneously second capillary structure net 23 is provided with the anti-return structure, in the liquid forward flow in-process, have less flow resistance and better capillary force link up, make liquid in-process that transmits, second capillary structure net 23 can play the effect of direction propelling movement to liquid, but in the liquid reverse flow in-process, the liquid needs to overcome great flow resistance, and be difficult for appearing the phenomenon that flows backward, and then make anti-return structure can guide liquid backward to the exact direction, in the bending of samming board main part 1, especially, the problem that flows backward flow direction when liquid has been avoided when the gravity is opposite to the direction.
In addition, the surface of the temperature equalization plate main body 1 is provided with the radiation heat dissipation coating 8 and the convex hulls 7, so that the radiation heat exchange effect of the heat dissipation surface can be enhanced through the radiation heat dissipation coating 8 on the basis of increasing the heat dissipation surface area, and the heat dissipation performance of the temperature equalization plate is further enhanced.
In a possible implementation manner, as shown in fig. 3, the temperature equalization plate main body 1 further includes a bottom plate 4 and a cover plate 3 that form a vacuum cavity, a plurality of heat conduction support columns 6 are disposed between the bottom plate 4 and the cover plate 3, phase-change heat conduction working liquid is injected into the vacuum cavity, wherein the phase-change heat conduction working liquid is pure water, ethanol, diethyl ether, etc., and the heat conduction support columns 6 are welded on the bottom plate 4 and are connected with the cover plate 3, so as to play a role of mechanical support, and meanwhile, the heat conduction support columns 6 can play a role of heat transfer to a certain extent, and note that the bottom plate 4 and the cover plate 3 in the invention can be both in contact with a heat source, such as a chip, as a part where the liquid evaporates, when the bottom plate 4 contacts with the heat source, the cover plate 3 automatically becomes a part where the vapor condenses; when the cover plate 3 is in contact with a heat source, the bottom plate 4 automatically becomes a site where vapor condenses.
For convenience in explaining the working principle of the present invention, it is assumed that the bottom plate 4 of a certain temperature equalization plate main body 1 is in contact with a heat source, heat is firstly conducted from the lower surface of the bottom plate 4 to the upper surface of the bottom plate 4 through heat conduction, water filled in the capillary structure net absorbs heat to be changed into steam, the steam is rapidly diffused to all parts in the temperature equalization plate main body 1 due to diffusion effect and is diffused to the adjacent temperature equalization plate main body 1 through the communication structure 2, the steam is condensed into water at a lower temperature part, the heat is released, the condensed water flows in the capillary structure net through capillary force effect, and finally flows back to the capillary structure net contacting with the heat source through capillary filling material of the communication structure 2 to form a cycle, and it is noted that the adjacent temperature equalization plate main body 1 does not need to be on the same plane at the moment, but can be conducted along with the actual application situation, and meanwhile, the heat conduction support column 6 also conducts a part of heat from the bottom plate 4 to the cover plate 3, and the heat is evenly opened on planes in different directions through such a process.
In one possible implementation, as shown in fig. 2, the inner tube 22 diameter D 1 and the outer tube 21 diameter D 2 satisfy the following range relationship:
1.05D 2≤D1≤1.1D2, a second capillary structure net 23 is arranged between the outer tube 21 and the inner tube 22, a steam channel is etched on the inner wall of the inner tube 22, when water and steam flow through the tube, the water can flow in the second capillary structure net 23 between the inner tube 22 and the outer tube 21 due to the action of capillary force, and the steam flows in the inner tube 22 due to the action of diffusion, in this way, gas-water separation can be realized, and the problem of reduced heat transfer efficiency caused by gas-water mixing can be effectively prevented.
In a possible implementation, as shown in fig. 1, the diameter D 2 of the outer tube 21 and the thickness H of the temperature-equalizing plate body 1 satisfy the following range relationship:
In the invention, the thickness of the temperature equalizing plate main body 1 is 1-3mm, and a user can properly increase according to practical application conditions and is matched with corresponding numbers of flexible communication pipelines, meanwhile, under the condition that the temperature equalizing plate main body 1 and the flexible communication structures 2 are arranged in a sufficient number, the invention can realize large-amplitude bending of the temperature equalizing plate main body 1 in multiple directions, and for each flexible communication structure 2, only small-amplitude bending is carried out, and the problems of pipeline blockage and the like caused by large-amplitude bending of a certain local flexible communication structure 2 are avoided through the design.
In a possible implementation manner, as shown in fig. 1, the number of flexible communication structures 2 connected between every two adjacent temperature equalizing plate main bodies 1 is 3-5, and the communication structures 2 provided by the invention realize gas-water separation in the volume of one pipe, so that the volume utilization efficiency of the communication pipe is greatly improved, more communication pipelines can be arranged between the same temperature equalizing plate main bodies 1, and the heat exchange efficiency between the adjacent temperature equalizing plate main bodies 1 is improved.
In a possible implementation manner, the radiation heat dissipation coating 8 comprises hexagonal boron nitride or a mixture of aluminum nitride and an organic polymer, for example, hexagonal boron nitride has good thermal conductivity, so that heat passing through the hexagonal boron nitride can be well transferred, and meanwhile, the radiation coating in the invention is particularly arranged as follows: firstly, a layer of heat-conducting glue is coated on the surface of the temperature-equalizing plate main body 1, the thickness is within 0.1mm, a layer of high-emissivity is attached on the heat-conducting glue, a mixture of hexagonal boron nitride or aluminum nitride with high refractive index and an organic polymer is coated on a radiation layer, a transparent insulating layer is covered on the radiation layer, after the arrangement is finished, the radiation heat-dissipating coating 8 can be subjected to surface roughening treatment, the emissivity of the radiation heat-dissipating coating is further increased, in the practical application process, heat in the condensation position is conducted to the surface of the temperature-equalizing plate through heat conduction of the cover plate 3, and due to the high emissivity and the high refractive index of the radiation coating, the heat can be rapidly dissipated to achieve the effect of enhancing heat exchange, so that the surface temperature of the temperature-equalizing plate main body 1 can be kept in an extremely low range after the secondary heat dissipation.
In a possible implementation manner (not shown in the figure), the surface of the temperature-equalizing plate main body 1 is provided with heat-dissipating carbon powder, and by utilizing the good heat-dissipating performance of the heat-dissipating carbon powder, the heat radiation efficiency of the surface of the temperature-equalizing plate main body 1 is increased, so that the heat dissipation rate of the surface of the temperature-equalizing plate main body 1 is improved, and the surface temperature of the temperature-equalizing plate main body can be kept in an extremely low range.
In a possible implementation manner, the inner tube 22 and the outer tube 21 are made of flexible heat-insulating materials, wherein the flexible heat-insulating materials can be ceramic fibers, ethylene propylene diene monomer rubber and the like, and the ethylene propylene diene monomer rubber is taken as an example, and main polymer chains of the ethylene propylene diene monomer rubber are completely saturated, so that the ethylene propylene diene monomer rubber can resist heat, light and oxygen, and meanwhile, the ethylene propylene diene monomer rubber is non-polar in nature, has resistance to polar solutions and chemicals, is low in water absorption rate and has good insulating characteristics, so that the inner tube 22 and the outer tube 21 have heat insulation characteristics and the like, and the problem of low heat transfer efficiency caused by heat exchange between water in the second capillary structure net 23 and steam in the inner tube 22 in advance through heat conduction of the inner tube 22 is also avoided.
In one possible implementation, as shown in fig. 7, the height h of the convex hull 7 and the diameter d of the convex hull 7 satisfy the following range relationship:
h: d=1: 2, the convex hull 7 is arranged to be hemispherical, so that when the heat source is radiated by the temperature equalizing plate main body 1 in the using process, the hemispherical convex hull 7 can be better attached to a chip releasing the heat, meanwhile, the convex hull 7 is provided with a certain radian, the convex hull 7 can be prevented from scratching the chip, the cavity steam capacity of the temperature equalizing plate main body 1 is increased by the convex hull 7, the heat exchanging requirement under high heat flow density is better met, the heat exchanging area of the cover plate 3 is also increased, the heat can be better radiated in a low temperature area, and the temperature equalizing effect is realized.
In one possible implementation, as shown in fig. 4, the backflow preventing structure includes a barb-blocking group 24, and an included angle θ formed between the barb-blocking group 24 and the second capillary structure web 23 satisfies the following range:
30.ltoreq.θ.ltoreq.60°, for example: 30 degrees, 40 degrees, 50 degrees and 60 degrees are taken as examples, the flow direction of the steam in the figure is opposite to the flow direction of the steam, the flow direction of the liquid in the figure is defined as the forward direction, the included angle theta is 40 degrees, in the backflow prevention structure provided by the invention, in the forward flow process of the liquid, the included angle theta formed between the barb choke group 24 and the second capillary structure net 23 is 40 degrees, so that the barb choke group 24 has smaller flow resistance and better capillary force connection, the barb choke group 24 can play a role in guiding and pushing the liquid in the transmission process of the liquid, but the liquid needs to overcome larger flow resistance in the reverse flow process of the liquid, the backflow phenomenon is not easy to occur, the backflow prevention structure can guide the liquid to flow back in the correct direction, and the backflow problem of the liquid is avoided in the bending process of the temperature equalizing plate main body 1, especially when the flow direction of the liquid is opposite to the gravity direction.
In a possible implementation, as shown in fig. 5, fig. 5 is a variant of the present invention in practical use, and is different from fig. 1 in that the initial setting position of the main body 1 of the temperature equalizing plate is not on the same plane. In the figures, the temperature-equalizing plate main body 1A, the temperature-equalizing plate main body 1B and the temperature-equalizing plate main body 1C are only for convenience in description, and practically there is no difference, hereinafter referred to as plate a, plate B and plate C, for convenience in description, the heat source is assumed to be in contact with the plate a, in the practical use process, the heat source can be in contact with any temperature-equalizing plate main body 1, the filling liquid in the plate a is heated and evaporated to become steam, the steam is rapidly diffused to the positions of the plate a under the action of pressure difference, and is diffused to the positions of the plate B and the plate C through the inner tube 22 of the flexible communication structure 2, the diffused steam emits heat at the position with lower temperature to be condensed into liquid, and the liquid flows back to the heat source position through the second capillary structure network 23 of the flexible communication structure 2 under the driving of capillary force, so as to start a new round of heat absorption evaporation. Through such a cycle, heat transfer from plate a to plates B, C located in different planes is achieved. In the structure with a plurality of heat dissipation surfaces, the invention can well conduct heat from the surface of one temperature equalizing plate main body 1 to the surfaces of other temperature equalizing plate main bodies 1, thereby realizing the temperature equalizing of each temperature equalizing plate main body 1.
In a second aspect, the present invention provides a mobile terminal comprising a temperature equalization plate according to any one of the above.
In one possible implementation manner of the present invention, specific embodiments thereof are as follows:
Firstly, a user determines the use environment of the temperature-equalizing plate main body 1, when the use environment is a complex heat dissipation surface, the temperature-equalizing plate is required to be bent in a plurality of directions, namely front, back, left and right, and the temperature-equalizing plate main body 1 can be tightly attached to the heat dissipation surface according to different angles by the user under the effect of the bending property of the flexible communication structure 2 in the use process of the temperature-equalizing plate main body 1, so that the installation process of the temperature-equalizing plate main body 1 is completed.
In the working process of the temperature equalizing plate main body 1, as shown in fig. 6 and 8, heat generated by a heat source is released on the surface of the temperature equalizing plate main body 1, at this time, a certain temperature equalizing plate main body 1 absorbs heat from the heat source, filling liquid in the temperature equalizing plate main body can be evaporated into steam, the steam rapidly diffuses to other temperature equalizing plate main bodies 1 through the communication structure 2, part of the steam can diffuse to the inner surface of the convex hull 7, the steam is transferred in the first capillary structure net 5, the other part of the steam is conducted in the second capillary structure net 23 under the action of the flexible communication structure 2, the liquid is conducted in the inner part of the inner tube 22, and gas-water separation is realized in the same tube, in the process, if the heat source surface is provided with bulges, the steam can still smoothly reach the temperature equalizing plate main body 1 at the bulge position due to the bending property of the flexible communication structure 2, so that the steam releases heat at the position with lower temperature, the heat is condensed into liquid due to the driving action of capillary force, and flows back to the position of the heat source to form a circulation, and the heat source needs to be carefully contacted again, and the heat source is conducted in the main body, and each heat dissipating plate main body is tightly attached to the heat dissipating plate main body 1 through the heat dissipating surface and the heat dissipating plate main body 1.
As shown in fig. 8, the steam entering the body of the temperature equalization plate from one side of the flexible communication structure 2 diffuses to the other side due to pressure difference, when passing through the position of the convex hull 7, the steam enters the convex hull 7 to exchange heat with the outside, part of the steam condenses into liquid, the steam which is not condensed continues to diffuse to the other side until entering the flexible communication structure 2at the other side and further diffuses to the next body 1 of the temperature equalization plate, in the process, the liquid at the position of the bottom plate 4 absorbs heat and evaporates at the same time, heat is taken away, the generated steam is added into the steam flow to diffuse until reaching the position with lower temperature to condense, and the heat is released.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (9)
1. A temperature equalization plate, comprising:
a plurality of temperature equalization plate main bodies, wherein each temperature equalization plate main body is internally provided with a vacuum cavity, and a first capillary structure net is arranged in each vacuum cavity;
The flexible communication structure is used for communicating every two adjacent temperature equalization plate main bodies, and comprises an outer pipe and an inner pipe, a second capillary structure net communicated with the first capillary structure net is filled between the inner pipe and the outer pipe, and the second capillary structure net is provided with a backflow prevention structure;
the convex hull is arranged on the surface of the temperature equalization plate main body;
The radiation heat dissipation coating is arranged on the surface of the temperature equalization plate main body.
2. The isopipe of claim 1 wherein the isopipe body further comprises a bottom plate and a cover plate forming the vacuum cavity, a plurality of thermally conductive support columns being disposed between the bottom plate and the cover plate.
3. The isopipe of claim 1 wherein the inner tube has a diameter D 1, the outer tube has a diameter D 2, and the diameter D 2 of the outer tube and the isopipe body thickness H satisfy the following range relationship:
0.6H≤D2≤0.8H。
4. The temperature equalization plate according to claim 1, wherein the number of the flexible communication structures connected between every two adjacent temperature equalization plate bodies is 3-5.
5. The isopipe of claim 1 wherein the radiant heat release coating comprises a mixture of hexagonal boron nitride or aluminum nitride and an organic polymer.
6. A temperature equalization plate as recited in claim 3, wherein said inner tube and said outer tube are each formed of a flexible insulating material.
7. The isopipe of claim 1 wherein the height h of the convex hull and the diameter d of the convex hull satisfy the following range relationship:
h：d=1：2。
8. The temperature uniformity plate according to claim 1, wherein said backflow prevention structure comprises a barb choke group, and an included angle θ formed between said barb choke group and said second capillary structure web satisfies the following range:
30°≤θ≤60°。
9. a mobile terminal comprising a temperature equalizing plate according to any one of claims 1-8.
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| CN202210324634.7A CN114725040B (en) | 2022-03-29 | 2022-03-29 | Samming board and mobile terminal |
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| CN101957151A (en) * | 2009-07-13 | 2011-01-26 | 富准精密工业(深圳)有限公司 | Flat-plate heat tube and radiator using flat-plate heat tube |
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| CN202160368U (en) * | 2011-05-20 | 2012-03-07 | 奇鋐科技股份有限公司 | Heat dissipating unit and heat dissipating module thereof |
| US9459056B2 (en) * | 2011-09-02 | 2016-10-04 | Gabe Cherian | SPRDR—heat spreader—tailorable, flexible, passive |
| US9341418B2 (en) * | 2013-03-01 | 2016-05-17 | International Business Machines Corporation | Thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s) |
| EP3330654A4 (en) * | 2015-07-27 | 2019-03-06 | Chi-Te Chin | Plate-like temperature uniforming device |
| CN206585883U (en) * | 2017-03-07 | 2017-10-24 | 上海嘉熙科技有限公司 | Bend the hot superconducting radiator of tabular |
| CN208835040U (en) * | 2018-08-17 | 2019-05-07 | 东莞市宏瑞热传科技有限公司 | A kind of compound 3D temperature-uniforming plate |
| TWI701992B (en) * | 2019-10-31 | 2020-08-11 | 建準電機工業股份有限公司 | Temperature-uniformizing board |
| CN112802810B (en) * | 2019-11-13 | 2023-06-20 | 华为技术有限公司 | Uniform temperature plate and manufacturing method thereof |
| CN112146497A (en) * | 2020-10-21 | 2020-12-29 | 常州碳元热导科技有限公司 | Flexible temperature equalizing plate |
| CN215864820U (en) * | 2021-01-25 | 2022-02-18 | 爱美达（上海）热能系统有限公司 | Flexible temperature-equalizing plate |
| CN113473803B (en) * | 2021-06-30 | 2022-11-15 | 青岛海信移动通信技术股份有限公司 | Temperature equalizing plate and terminal equipment |
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| CN101309573A (en) * | 2007-05-18 | 2008-11-19 | 富准精密工业(深圳)有限公司 | Even heating board and heat radiating device |
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