CN114685775A - 可用作表面流平剂的聚合物、其制造方法及包含其的制品 - Google Patents
可用作表面流平剂的聚合物、其制造方法及包含其的制品 Download PDFInfo
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- CN114685775A CN114685775A CN202111576627.8A CN202111576627A CN114685775A CN 114685775 A CN114685775 A CN 114685775A CN 202111576627 A CN202111576627 A CN 202111576627A CN 114685775 A CN114685775 A CN 114685775A
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- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 10
- 239000011737 fluorine Substances 0.000 claims abstract description 10
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims abstract 2
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- 239000003795 chemical substances by application Substances 0.000 abstract description 44
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- 239000011248 coating agent Substances 0.000 description 14
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- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
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- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
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- 125000003118 aryl group Chemical group 0.000 description 3
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- 125000004122 cyclic group Chemical group 0.000 description 3
- 239000000412 dendrimer Substances 0.000 description 3
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- 229940116333 ethyl lactate Drugs 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
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- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 125000006413 ring segment Chemical group 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 229940035437 1,3-propanediol Drugs 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- KNLXBOKBOCQJTG-UHFFFAOYSA-N 3-methyl-3-(2,2,2-trifluoroethoxymethyl)oxetane Chemical compound FC(F)(F)COCC1(C)COC1 KNLXBOKBOCQJTG-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
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- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
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- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical group C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
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- 150000001408 amides Chemical class 0.000 description 2
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- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 239000006117 anti-reflective coating Substances 0.000 description 2
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- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
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- 229910052943 magnesium sulfate Inorganic materials 0.000 description 2
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- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 2
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- 125000004739 (C1-C6) alkylsulfonyl group Chemical group 0.000 description 1
- 125000006700 (C1-C6) alkylthio group Chemical group 0.000 description 1
- 125000004737 (C1-C6) haloalkoxy group Chemical group 0.000 description 1
- 125000000171 (C1-C6) haloalkyl group Chemical group 0.000 description 1
- 125000006652 (C3-C12) cycloalkyl group Chemical group 0.000 description 1
- 125000006654 (C3-C12) heteroaryl group Chemical group 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
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- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- 229940043375 1,5-pentanediol Drugs 0.000 description 1
- IEZRRCGVGTZADM-UHFFFAOYSA-N 1-(2-butan-2-yloxyethoxy)pentane Chemical compound C(C)(CC)OCCOCCCCC IEZRRCGVGTZADM-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
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- LSHYNAUVTXYALE-UHFFFAOYSA-N 3,3-dimethylbutanoyl 3,3-dimethylbutanoate Chemical compound CC(C)(C)CC(=O)OC(=O)CC(C)(C)C LSHYNAUVTXYALE-UHFFFAOYSA-N 0.000 description 1
- RVGLUKRYMXEQAH-UHFFFAOYSA-N 3,3-dimethyloxetane Chemical compound CC1(C)COC1 RVGLUKRYMXEQAH-UHFFFAOYSA-N 0.000 description 1
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- OEMBIMMYYGYSDU-UHFFFAOYSA-N 3-(2,2-dimethylbutyl)oxetane Chemical compound CCC(C)(C)CC1COC1 OEMBIMMYYGYSDU-UHFFFAOYSA-N 0.000 description 1
- NXUJMAUHSVRTPQ-UHFFFAOYSA-N 3-(2,2-dimethylpropoxymethyl)oxetane Chemical compound CC(C)(C)COCC1COC1 NXUJMAUHSVRTPQ-UHFFFAOYSA-N 0.000 description 1
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- POWZELWCLOBCIB-UHFFFAOYSA-N 3-(butoxymethyl)-3-butyloxetane Chemical compound CCCCC1(COCCCC)COC1 POWZELWCLOBCIB-UHFFFAOYSA-N 0.000 description 1
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- CBUDUABMFSQANL-UHFFFAOYSA-N 3-(butoxymethyl)-3-hexyloxetane Chemical compound CCCCCCC1(COCCCC)COC1 CBUDUABMFSQANL-UHFFFAOYSA-N 0.000 description 1
- BIQBKINMZHTQSA-UHFFFAOYSA-N 3-(butoxymethyl)-3-pentyloxetane Chemical compound CCCCCC1(COCCCC)COC1 BIQBKINMZHTQSA-UHFFFAOYSA-N 0.000 description 1
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- DXTFPEDLCRTLCT-UHFFFAOYSA-N 3-(methoxymethyl)oxetane Chemical compound COCC1COC1 DXTFPEDLCRTLCT-UHFFFAOYSA-N 0.000 description 1
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- CGRJJOYCFCCGPX-UHFFFAOYSA-N 3-ethyloxetane Chemical compound CCC1COC1 CGRJJOYCFCCGPX-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1818—C13or longer chain (meth)acrylate, e.g. stearyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/22—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
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Abstract
Description
背景技术
本文公开了可用作表面流平剂的聚合物、其制造方法及包含其的制品。
在用于制造薄膜和涂料溶液的组合物中使用表面流平剂(SLA)。表面流平剂典型地倾向于迁移到自由表面(接触空气的表面),并促进表面流平或表面平滑。表面流平剂通常包含聚合物或低聚物,在与溶液中的其他分子相比时,这些聚合物或低聚物具有较低表面能并且低表面能导致它们即使在较低固体负载量下也选择性地分离到自由表面。这种迁移到表面的能力(即分子流动性)有助于表面/界面层的流动和流平,以产生平坦光滑的表面/界面。
最常见表面流平剂包括聚硅氧烷、烷基改性的丙烯酸类聚合物、聚酯或碳氟化合物。良好的表面流平剂具有例如像优良的滑移、流平、流动、表面张力降低、抗凹陷能力、抗鱼眼能力、基底润湿、抗伯纳德泡(bernard cell)形成倾向以及良好的泡沫稳定性的特性。
表面流平剂在各种涂料配制品(例如,能够实现微光刻的旋涂(spin-on)薄膜)中起着重要作用。随着图案化特征分辨率、纵横比以及对低缺陷光刻图案的需求不断提高,寻求表面流平剂的新材料策略是所希望的。
存在许多由表面流平剂产生缺陷的原因。以下列出这些原因中的一些。大多数表面流平剂含有硅部分或氟部分并且是高度疏水的。不幸的是,这些表面流平剂的疏水性是先进光致抗蚀剂图案化中缺陷的主要来源。这些缺陷不仅包括表面缺陷,而且还包括其他类型缺陷,如残余物沉淀、桥接缺陷、图案非开口缺陷等。
许多光刻图案化工艺使用水性碱性显影剂。这些碱性显影剂中的不溶性物质产生不溶解的残余物,从而产生缺陷。因此,希望任何曝光的抗蚀剂材料是可完全去除的,且不留下可能潜在地形成缺陷的不溶解残余物。
为了克服此问题,在光致抗蚀剂组合物中以尽可能少的量使用表面流平剂。使用表面流平剂的另一种方式是改性该表面流平剂以含有碱溶性单元或含有碱可转换官能团从而实现溶解性。换言之,希望对包括氟部分和/或硅部分的表面流平剂进行特定改性以便用于光致抗蚀剂组合物中。
含有氟的表面流平剂的另一个问题是监管问题。政府法规要求最小程度地利用含有氟的产品。
因此,希望开发可以在用于光刻或涂覆应用的组合物中使用且不含有碳氟化合物并且提供在所得制品中不产生缺陷的良好表面流平特性的表面流平剂。
发明内容
本文公开了一种共聚物,其包含具有式(1)的第一聚合单元:
其中:R1是H或取代或未取代的C1-C6烷基;并且R2是取代或未取代的C3-C20烷基,其任选包括-O-、-S-、-N-、-C(O)-、或-C(O)O-、-N-C(O)-、-C(O)-NR-中的一个或多个;其中,R是H或取代或未取代的C1-C6烷基;和
具有式(2)的第二聚合单元:
其中:R3是取代或未取代的C1-C6烷基,其任选包括-O-、-N-、-S-、-C(O)-、或-C(O)O-中的一个或多个;其中所述第一聚合单元和所述第二聚合单元在化学上不同,并且所述共聚物不含氟。
具体实施方式
如本文所用,术语“一个/种(a/an)”和“所述”不表示数量的限制,并且除非在本文中以其他方式指出或与上下文明显矛盾,否则被解释为包括单数和复数两者。除非另外明确指出,否则“或”意指“和/或”。
如本文所用,“酸不稳定基团”是指以下基团,其中通过酸的催化作用(任选地并且典型地与热处理一起)使键断裂,导致极性基团(如羧酸或醇基)在聚合物上形成以及任选地并且典型地,与断裂的键连接的部分从聚合物断开。此种酸典型地是在曝光后烘烤期间发生键裂解情况下的光生酸。合适的酸不稳定基团包括,例如:叔烷基酯基团、仲或叔芳基酯基团、具有烷基和芳基的组合的仲或叔酯基团、叔烷氧基、缩醛基团或缩酮基团。酸不稳定基团通常在本领域中也称为“酸可裂解基团”、“酸可裂解保护基团”、“酸不稳定保护基团”、“酸离去基团”、“酸不稳定基团”以及“酸敏感基团”。
“取代的”意指基团上的至少一个氢原子被另一个原子或基团替代,前提是不超过所指定的原子的正常价。当取代基是氧代(即,=O)时,则碳原子上的两个氢被替代。取代基或变量的组合是可允许的。在“取代的”位置上可存在的示例性基团包括但不限于硝基(-NO2)、氰基(-CN)、羟基(-OH)、氧代(=O)、氨基(-NH2)、单-或二-(C1-6)烷基氨基、烷酰基(如C2-6烷酰基如酰基)、甲酰基(-C(=O)H)、羧酸或其碱金属盐或铵盐;酯(包括丙烯酸酯、甲基丙烯酸酯和内酯)如C2-6烷基酯(-C(=O)O-烷基或-OC(=O)-烷基)和C7-13芳基酯(-C(=O)O-芳基或-OC(=O)-芳基);酰胺基(-C(=O)NR2,其中R是氢或C1-6烷基)、甲酰胺基(-CH2C(=O)NR2,其中R是氢或C1-6烷基)、卤素、巯基(-SH)、C1-6烷硫基(-S-烷基)、硫氰基(-SCN)、C1-6烷基、C2-6烯基、C2-6炔基、C1-6卤代烷基、C1-9烷氧基、C1-6卤代烷氧基、C3-12环烷基、C5-18环烯基、具有至少一个芳香族环的C6-12芳基(例如,苯基、联苯基、萘基等,每一个环是取代或未取代的芳香族的)、具有1至3个单独或稠合环以及6至18个环碳原子的C7-19芳基烷基、具有1至3个单独或稠合环以及6至18个环碳原子的芳基烷氧基、C7-12烷基芳基、C4-12杂环烷基、C3-12杂芳基、C1-6烷基磺酰基(-S(=O)2-烷基)、C6-12芳基磺酰基(-S(=O)2-芳基)、或甲苯磺酰基(CH3C6H4SO2-)。当基团是取代的时,指示的碳原子数是基团中的碳原子的总数,不包括任何取代基的那些。例如,基团-CH2CH2CN是被氰基取代的C2烷基。
在本说明书中,“(甲基)丙烯酸酯”表示“丙烯酸酯和甲基丙烯酸酯中的至少一种”。另外,“(甲基)丙烯酸”意指“丙烯酸和甲基丙烯酸中的至少一种”。
如本文所用,术语“烷基”意指具有指定的碳原子数(通常为1至约12个碳原子)的支链或直链饱和脂族烃基。如本文所用,术语C1-C6烷基指示具有1、2、3、4、5或6个碳原子的烷基。其他实施例包括具有1至8个碳原子、1至4个碳原子、或1或2个碳原子的烷基,例如C1-C6烷基、C1-C4烷基、和C1-C2烷基。当本文中将C0-Cn烷基与另一个基团(例如,(环烷基)C0-C4烷基)结合使用时,所示基团(在这种情况下为环烷基)通过单个共价键(C0)直接键合,或通过具有指定的碳原子数的烷基链附接,在这种情况下为1、2、3或4个碳原子。烷基的实例包括但不限于:甲基、乙基、正丙基、异丙基、正丁基、3-甲基丁基、叔丁基、正戊基、和仲戊基。
如本文所用,术语“环烷基”指示具有仅碳环原子且具有指定的碳原子数(通常具有3至约8个环碳原子或3至约7个碳原子)的饱和烃环基。环烷基的实例包括:环丙基、环丁基、环戊基、或环己基以及桥连或笼形的饱和环基团,如降冰片烷或金刚烷。
如本文所用,术语“杂环烷基”指示含有选自N、O和S的1至约3个杂原子、其余的环原子为碳的饱和环状基团。杂环烷基具有3至约8个环原子,并且更典型地具有5至7个环原子。杂环烷基的实例包括吗啉基、哌嗪基、哌啶基、和吡咯烷基。杂环烷基中的氮可任选地被季铵化。
在本说明书中对基团和原子团的引用中,在未明确说明所述基团是取代还是未取代的情况下表示所述基团的情况下,则所述基团包括不具有取代基的基团和原子团、以及具有取代基的基团和原子团。例如,未表示其是取代还是未取代的“烷基”不仅包括不具有取代基的烷基(未取代的烷基),而且还包括具有取代基的烷基(取代的烷基)。
本文公开了一种表面流平剂,其用于表面活性化学应用中、特别用于用来制造旋涂薄膜的光刻组合物中。表面流平剂包括在链骨架中具有醚键的两个或更多个聚合单元的共聚物。所述两个或更多个聚合单元不含氟。在任选的实施例中,所述聚合物不含包含硅的表面能降低部分。虽然上述醚键是聚合物骨架的一部分,但是在侧基(侧链)上可以存在与共聚物骨架共价键合的另外的官能键。在实施例中,这些侧链可以仅包含碳碳键。在另一个实施例中,这些侧链可以包含碳碳键以及其他官能键或官能团,包括但不限于醚、酯、酰胺、磺酸酯、羟基、巯基、氰基、胺、巯基、醛、羧基、卤代烷、酮、烯丙基、丙二烯基、降冰片基、乙炔基、丙烯酸酯、甲基丙烯酸酯、衣康酸酯、马来酰亚胺、马来酸酐等。换言之,侧链可以含有杂原子,如氮、硫、氧等。
表面流平剂不仅可以在用于光刻应用的组合物中使用,而且还可以在希望良好的表面流平和光泽外观的其他应用中使用,例如像涂料、涂漆、油墨、电镀液、医药、防腐蚀、和润滑技术。
在示例性实施例中,共聚物的聚合单元中的至少一个是沿链骨架具有至少一个烷基取代基的聚氧杂环丁烷(下文中,聚烷基氧杂环丁烷)。聚氧杂环丁烷骨架为表面流平剂共聚物提供亲水性,其有助于与碱和与水的混溶,而烷基侧链为表面流平剂迁移到薄膜或涂料中的界面提供疏水性。所述界面可以位于旋涂层与空气之间,或者可替代地,位于多层膜中的两个层之间。在实施例中,聚烷基氧杂环丁烷以大于40摩尔百分比(mol%)的量存在于共聚物中。
在实施例中,聚氧杂环丁烷共聚物可以含有一个或多个末端官能团。末端官能团可以包含羟基、巯基、氰基、胺或磺酸酯。
上述烷基取代基可以是直链、支链,或者可以任选地含有其他原子,如O、S、N、P,或含有包括醚、酯、酰胺、酰亚胺、尿烷或脲的其他官能键。烷基取代基还可以任选地含有末端官能团,例如像羟基、巯基、氰基、胺或磺酸酯。
表面流平剂在某些应用中可以是疏水的,而它在其他应用中可以是足够亲水的,以便与水或水性显影剂可混溶。在表面流平剂中不存在含氟部分或含硅部分将缺陷形成最小化。不存在含氟部分符合环境法规。
表面流平剂优选地是包含两个或更多个不同重复单元的共聚物。在实施例中,表面流平剂可以是包含三个或更多个不同重复单元的共聚物。所述共聚物可以是无规共聚物、交替共聚物、嵌段共聚物、星形嵌段共聚物、超支化聚合物、梳形共聚物、树枝状聚合物(dendrimer)、梯度共聚物等,其中优选无规共聚物或嵌段共聚物。无规共聚物和嵌段共聚物的组合也可以用于表面流平剂。
在实施例中,所述共聚物包含具有式(1)的第一聚合单元:
其中,R1是H或取代或未取代的C1-C6烷基;并且R2是取代或未取代的C3-C20烷基,其任选包括-O-、-S-、-N-、-C(O)-、或-C(O)O-、-N-C(O)-、-C(O)-NR-中的一个或多个;其中,R是H或取代或未取代的C1-C6烷基;和具有式(2)的第二聚合单元:
其中,R3是取代或未取代的C1-C6烷基,其任选包括-O-、-N-、-S-、-C(O)-、或-C(O)O-中的一个或多个;其中所述第一聚合单元和所述第二聚合单元在化学上不同,并且所述共聚物不含氟。在优选实施例中,R3是未取代的C1-C5烷基。
当R3是取代的时,取代基链长具有两个或更少的碳原子。具有式(2)的亲水聚合单元可以提供表面活性剂流平剂与水或水性碱性显影剂混溶的益处。
在实施例中,R2具有支链结构。在实施例中,R2具有两个或更多个支链。
在实施例中,表面流平剂包含具有式(1)的聚合单元、具有式(2)的聚合单元,并且包含具有式(3)的另外的聚合单元
其中,R4是取代或未取代的C2至C4烷基,其任选包括-O-、-S-、-N-、-C(O)-、或-C(O)O-、-N-C(O)-、-C(O)-NR-中的一个或多个;其中,R是H或取代或未取代的C1-C6烷基。
作为上述实施例的具体实例,所述第一聚合单元具有式(1-1),所述第二聚合单元具有式(2-1),并且所述第三聚合单元具有式(4):
其中,R4是取代或未取代的C3-C20烷基,其任选包括-O-、-S-、-N-、-C(O)-、或-C(O)O-中的一个或多个;
具有式(1)的聚合单元的前体的实例包括3-甲基氧杂环丁烷、3-乙基氧杂环丁烷、3-丙基氧杂环丁烷、3-丁基氧杂环丁烷、3-新戊基氧杂环丁烷、3-戊基氧杂环丁烷、3-己基氧杂环丁烷、3-(2,2-二甲基丁基)氧杂环丁烷、3-甲氧基甲基氧杂环丁烷、3-乙氧基甲基氧杂环丁烷、3-丙氧基甲基氧杂环丁烷、3-丁氧基甲基氧杂环丁烷、3-新戊氧基甲基氧杂环丁烷、3-戊氧基甲基氧杂环丁烷、3-己氧基甲基氧杂环丁烷、3-(2,2-二甲基丁氧基)氧杂环丁烷、3-甲氧基乙基氧杂环丁烷、3-乙氧基乙基氧杂环丁烷、3-丙氧基乙基氧杂环丁烷、3-丁氧基乙基氧杂环丁烷、3-新戊氧基乙基氧杂环丁烷、3-戊氧基乙基氧杂环丁烷、3-己氧基乙基氧杂环丁烷、3-丁氧基甲基-3-甲基氧杂环丁烷、3-丁氧基甲基-3-乙基氧杂环丁烷、3-丁氧基甲基-3-丙基氧杂环丁烷、3-丁氧基甲基-3-丁基氧杂环丁烷、3-丁氧基甲基-3-戊基氧杂环丁烷、3-丁氧基甲基-3-新戊基氧杂环丁烷、3-丁氧基甲基-3-己基氧杂环丁烷、3,3-二甲基氧杂环丁烷、3-乙基-3-[(2-乙基己氧基)甲基]氧杂环丁烷、3-乙基-3-羟甲基氧杂环丁烷、3-乙基-3-羟甲基氧杂环丁烷、3-甲基-3-氧杂环丁烷甲醇、3-(1-甲基乙基)-氧杂环丁烷、或其组合。
具有式(2)的聚合单元的前体的实例包括甲醛、环氧乙烷、环氧丙烷、四氢呋喃、1,4-二噁烷、或其组合。
具有式(3)的聚合单元的前体的实例包括1,3-丙二醇、2,2-二甲基-1,3-丙二醇、1,4-丁二醇、1,5-戊二醇、1,6-己二醇、或其组合。
具有式(1)的聚合单元的优选前体是3-丁氧基甲基-3-甲基氧杂环丁烷,而具有式(2)的聚合单元的优选前体是四氢呋喃。具有式(3)的聚合单元的优选前体是2,2-二甲基-1,3-丙二醇。
表面流平剂可以具有500至30,000克/摩尔(g/摩尔)、优选800至12,000g/摩尔、并且更优选1000至10,000g/摩尔的重均分子量。
基于共聚物中的总摩尔数,具有式(1)的聚合单元典型地以大于40mol%、优选大于50mol%并且更优选大于60mol%的量存在于共聚物中。基于共聚物中的总摩尔数,具有式(1)的聚合单元以小于80mol%、优选小于75mol%并且更优选大于70mol%的量存在于共聚物中。
在实施例中,基于共聚物中的总摩尔数,具有式(2)的聚合单元以大于20mol%、优选大于25mol%并且更优选大于70mol%的量存在于共聚物中。在实施例中,基于共聚物中的总摩尔数,具有式(2)的聚合单元以小于60mol%、优选小于50mol%并且更优选小于40mol%的量存在于共聚物中。
在实施例中,基于共聚物中的总摩尔数,具有式(3)的聚合单元以大于或等于0.01mol%、优选大于或等于1mol%并且更优选大于或等于2mol%的量存在于共聚物中。在实施例中,基于共聚物中的总摩尔数,具有式(3)的聚合单元以小于或等于20mol%、优选小于或等于15mol%并且更优选小于或等于10mol%的量存在于共聚物中。
表面流平剂可以用于各种不同的组合物中。在实施例中,表面流平剂可以仅用于溶剂或溶剂混合物中,用作冲洗配制品。在另一个实施例中,表面流平剂可以用于包含基体聚合物、溶剂、和其他任选添加剂的组合物中。
在实施例中,表面流平剂可以用于含有聚合物基体树脂、任选的淬灭剂、一种或多种光酸产生剂、任选的添加剂和溶剂的光致抗蚀剂组合物中。基体聚合物优选是包含含有酸不稳定基团和/或含有可交联官能团的至少一个重复单元的共聚物。如果使用,则表面流平剂以基于组合物的总固体的0.001至100wt%、更优选地0.001至1wt%的量存在。
在另一个实施例中,表面流平剂可以用于光致抗蚀剂组合物中,所述组合物除表面流平剂之外还含有基体聚合物、光酸产生剂、任选的淬灭剂、溶剂、和其他任选的添加剂。
在另一个实施例中,表面流平剂可以用于除表面流平剂之外还含有基体聚合物、至少一种热活化的酸产生剂、和溶剂的组合物中。可以向组合物添加其他任选的添加剂,包括但不限于交联剂。含有热活化的酸产生剂的组合物的实例可以是减反射涂料组合物、面涂层、光致抗蚀剂修整组合物或图案增强组合物、和其他底层组合物。
用于前述组合物中的聚合物基体可以包括热塑性聚合物、热塑性聚合物的共混物、热固性聚合物、或热塑性聚合物与热固性聚合物的共混物。聚合物基体还可以包括聚合物的共混物、共聚物的共混物、三元共聚物的共混物或包含至少一种前述聚合物的组合的共混物。聚合物基体还可以包括低聚物、均聚物、共聚物、嵌段共聚物、交替共聚物、无规聚合物、无规共聚物、无规嵌段共聚物、梯度共聚物、接枝共聚物、星形嵌段共聚物、树枝状聚合物、聚电解质(具有一些含有电解质的重复单元的聚合物)、聚两性电解质(具有阳离子和阴离子重复基团两者的聚电解质)、离聚物等、或其组合。所述共聚物可以是作为溶解分子以微颗粒的形式或者以溶剂或溶剂混合物中的纳米颗粒分散体或悬浮液的形式可获得的。
热塑性聚合物的实例包括聚缩醛、聚二烯、聚丙烯酸类(polyacrylic)、聚碳酸酯、聚醇酸树脂(polyalkyd)、聚苯乙烯、聚烯烃、聚酯、聚酰胺、聚芳酰胺(polyaramide)、聚酰胺酰亚胺、聚芳酯、聚氨酯、环氧树脂、酚类、硅酮、聚芳砜、聚醚砜、聚苯硫醚、聚砜、聚酰亚胺、聚醚酰亚胺、聚四氟乙烯、聚醚酮、聚醚醚酮、聚醚酮酮、聚苯并噁唑、聚噁二唑、聚苯并噻嗪并吩噻嗪、聚苯并噻唑、聚吡嗪并喹喔啉、聚均苯四酰亚胺(polypyromellitimide)、聚喹喔啉、聚苯并咪唑、聚羟吲哚、聚氧代异吲哚啉、聚二氧代异吲哚啉、聚三嗪、聚哒嗪、聚哌嗪、聚吡啶、聚哌啶、聚三唑、聚吡唑、聚碳硼烷、聚氧杂双环壬烷(polyoxabicyclononane)、聚二苯并呋喃、聚苯酞、聚缩醛、聚酸酐、聚乙烯醚、聚乙烯硫醚、聚乙烯醇、聚乙烯酮、聚卤乙烯、聚乙烯腈、聚乙烯酯、聚磺酸酯、多硫化物、聚硫酯、聚砜、聚磺酰胺、聚脲、聚磷腈、聚硅氮烷、聚硅氧烷等、或其组合。
热固性聚合物的实例包括环氧聚合物、不饱和聚酯聚合物、聚酰亚胺聚合物、双马来酰亚胺聚合物、双马来酰亚胺三嗪聚合物、氰酸酯聚合物、乙烯基聚合物、苯并噁嗪聚合物、苯并环丁烯聚合物、丙烯酸类、醇酸树脂、苯酚-甲醛聚合物、酚醛树脂、甲阶酚醛树脂(resole)、三聚氰胺-甲醛聚合物、脲-甲醛聚合物、羟甲基呋喃、异氰酸酯、邻苯二甲酸二烯丙酯、氰尿酸三烯丙酯、异氰尿酸三烯丙酯、不饱和聚酯酰亚胺等、或其组合。组合物可以包含交联剂以促进热固性聚合物形成。交联剂可以是自交联的酸活化或碱活化的交联剂、自由基交联剂、或其组合。
合适的溶剂包括例如:脂族烃,如己烷和庚烷;芳香族烃,如甲苯和二甲苯;卤代烃,如二氯甲烷、1,2-二氯乙烷和1-氯己烷;醇,如甲醇、乙醇、1-丙醇、异丙醇、叔丁醇、2-甲基-2-丁醇和4-甲基-2-戊醇;丙二醇单甲醚(PGME)、醚如二乙醚、四氢呋喃、1,4-二噁烷和苯甲醚;酮,如丙酮、甲基乙基酮、甲基异丁基酮、2-庚酮和环己酮(CHO);酯,如乙酸乙酯、乙酸正丁酯、丙二醇单甲醚乙酸酯(PGMEA)、乳酸乙酯(EL)、羟基异丁酸甲酯(HBM)和乙酰乙酸乙酯;内酯,如γ-丁内酯(GBL)和ε-己内酯;内酰胺,如N-甲基吡咯烷酮;腈,如乙腈和丙腈;环状或非环状碳酸酯,如碳酸亚丙酯、碳酸二甲酯、碳酸亚乙酯、碳酸亚丙酯、碳酸二苯酯和碳酸亚丙酯;极性非质子溶剂,如二甲亚砜和二甲基甲酰胺;水;及其组合。在这些中,优选的溶剂是PGME、PGMEA、EL、GBL、HBM、CHO、及其组合。组合物中的总溶剂含量(即,所有溶剂的累积溶剂含量)是基于光致抗蚀剂组合物的总重量,典型地40至99wt%、例如70至99wt%、或85至99wt%。所希望的溶剂含量将取决于例如所涂覆的光致抗蚀剂层的希望厚度和涂覆条件。
首先通过将基体聚合物、表面流平剂和任何其他固体组分及任选的添加剂与溶剂一起混合来制造组合物。所述组合物在使用前可经受附加过程,如过滤、离子交换等。可以通过旋涂、浸涂、辊涂或其他涂覆方法将组合物施加到基底上。所述基底可以包括电子装置基底、金属、木材、纸张、聚合物基底或底层。可以改变涂料溶液的固体含量以提供具有可变厚度的膜。固体含量还可以基于所用的特定涂覆设备、溶液的粘度、涂覆工具的速度和用于旋转的时间量。在实施例中,可以以单次施加来施加组合物的层。在另一个实施例中,可以以多次施加来施加组合物的层。
取决于特定涂料组合物,将组合物层(布置在基底上)软烘烤以最小化膜中的溶剂含量可能是有益的。软烘烤有助于形成无粘性涂层,并提高组合物层对基底的粘附。软烘烤可以在加热板或烘箱中进行,或者可替代地可以使用紫外线或使用激光进行。
在光致抗蚀剂组合物的情况下,所述层可随后以图案方式曝光以允许通过光掩模、通过直接写入或接触或通过使用光干涉产生的图案进行辐照,以在曝光区域与未曝光区域之间产生溶解度差。这种辐照在所述层中形成潜像。光掩模具有光学透明区域和光学不透明区域,其对应于组合物层中的待通过活化辐射曝光的或未曝光的区域。
组合物层可以任选地经历曝光后烘烤过程,在此之后使其显影以提供抗蚀剂浮雕图像。在实施例中,使用碱性显影液去除组合物层的曝光的部分。碱性显影液的实例包括四甲基氢氧化铵、氢氧化钠和氢氧化钾的水溶液。所述曝光的部分可以形成图案,如孔(例如触点、通孔或凸点图案)或沟槽(例如线间距)图案。
在一个实施例中,因为表面流平剂与水和水性显影剂可混溶,所以所述表面流平剂是有利的。在另一个实施例中,表面流平剂显示出适当水平的疏水性,并且与水和水性显影剂不可混溶,这使其与有机溶剂显影剂可混溶。表面流平剂不含氟,并且因此是环境友好的。
可以使用表面流平剂作为润湿剂用于改进流动控制。这些特性(表面流平和润湿能力)为涂层提供良好的光学特性(例如,高光泽度和良好的图像清晰度)。表面流平剂因此可以与多种多样的溶液、蜡、抛光剂、涂料、共混物等共混。在实施例中,表面流平剂可用于地板抛光配制品、涂漆、粉末涂料组合物等。
本发明现在将通过以下非限制性的实例进行例证。
实例
实例1
进行此预测性实例以证明用于共聚物(表面流平剂)中的单体重复单元的合成。使用3-丁氧基甲基-3-甲基氧杂环丁烷作为单体之一和四氢呋喃及其他单体制造所述共聚物。换言之,3-丁氧基甲基-3-甲基氧杂环丁烷用于制造所述共聚物的第一聚合单元,并且四氢呋喃用于制造所述共聚物的第二聚合单元。如下进行3-丁氧基甲基-3-甲基氧杂环丁烷单体的合成。
将50重量百分比(2.8克,58.3mmol)的氢化钠在矿物油中的分散体用己烷洗涤两次,并悬浮在35毫升的二甲基甲酰胺中。然后将3.9克(52.6mmol)的丁醇添加到分散体中,并且将混合物搅拌45分钟。添加10.0克(39mmol)的3-羟甲基-3-甲基氧杂环丁烷对甲苯磺酸酯在15毫升二甲基甲酰胺中的溶液,并将混合物在80℃下搅拌20小时,此时对等分样品的'H-NMR分析示出起始磺酸酯完全消耗。
然后将混合物倒入100毫升冰水中,并用2体积的二氯甲烷萃取。将合并的有机萃取物用水洗涤两次,用2重量百分比的盐酸水溶液、盐水洗涤两次,经硫酸镁干燥,并蒸发以得到呈油形式的3-(2,2,2-三氟乙氧基甲基)-3-甲基氧杂环丁烷,其含有小于1重量百分比的二甲基甲酰胺。将油在减压下蒸馏,以得到分析纯3-丁氧基甲基-3-甲基氧杂环丁烷单体。
如下进行(3-甲氧基氧杂环丁烷-3-基)甲基3,3-二甲基丁酸酯单体的合成。
在100mL四颈烧瓶中,将10.0g的3,3-二甲基丁酸酐(46.7mmol)、0.6g的二甲基氨基吡啶(4.7mmol)溶解于250ml的二氯甲烷中。在冰水浴下缓慢添加6.0g的3-乙基-3-羟甲基氧杂环丁烷(51.4mmol),并且反应在室温下搅拌24小时。然后,将反应混合物用饱和碳酸氢钠水溶液、水、盐水洗涤,并且然后经硫酸镁干燥过夜。去除溶剂,并且将油在减压下蒸馏以得到分析纯的3,3-二甲基丁酸(3-乙基氧杂环丁烷-3-基)甲酯。
实例2
进行此预测性实例以证明用作表面流平剂的聚合物的合成。以下对使用官能氧杂环丁烷和四氢呋喃制备共聚物的方法进行详述。
400ml烧瓶(配备有冷凝器、热电偶温度探针和机械搅拌器)装有无水二氯甲烷(100ml)和1,4-丁二醇(2.03g,22.6毫摩尔)。然后添加BF3THF(29.6g,211.7摩尔)、2,2-二甲基-l,3-丙二醇(22.1g,211.7mmol),并且将混合物搅拌10分钟。然后,经5小时将3-丁氧基甲基-3-甲基氧杂环丁烷(67g,423.4摩尔)在无水二氯甲烷(30ml)中的溶液泵入容器中。在整个添加期间,反应温度保持在38℃与42℃之间。然后将混合物回流另外2小时(同时进行搅拌),此时1H-NMR指示>98%的转化率。将反应用10%碳酸氢钠水溶液(200ml)淬灭,并且将有机相用3%HCl水溶液(200ml)并且用水(200ml)洗涤。将有机相经硫酸钠干燥、过滤,并在减压下去除溶剂,以得到呈透明油形式的(3-甲基氧杂环丁烷-3-基)甲基3,3-二甲基丁酸酯单体。
实例3
进行此预测性实例以确定抗蚀剂组合物的抗蚀剂涂覆和显影特性。配制品R1-R4(抗蚀剂组合物)和CR1-CR2(对比抗蚀剂组合物)以表1中所示的组分和量制备。在表1中,括号中的数字指示每种组分的重量比。在下表2描述了由C1-2、D1-2和S1-2表示的结构。应注意表1中的所有聚合物均根据此通用合成方案制备。
表1(在此表1中,括号中的全部数字表示共聚物中单体的摩尔百分比)。单体编号(例如,单体1)与以上刚示出的结构有关。
基体树脂聚合物 | 单体1 | 单体2 | 单体3 | 单体4 |
A1 | 1(40%) | 2(30%) | 3(20%) | 4(10%) |
A2 | 5(40%) | 2(40%) | 6(20%) |
表2
添加剂(C1、C2、D1和D2)和溶剂(S1和S2)的结构紧接着在以下示出。
聚合物A1和A2具有8000g/摩尔的重均分子量。E1是如合成实例2中所述的聚-3-(2,2,2-三氟乙氧基甲基)-3-甲基氧杂环丁烷。
E2是PolyFox PF-656,为来自欧诺法溶液公司(Omnova SolutionIncorporation)的商业材料。
每种配制品用表2中示出的组分制备并且一起(通过搅拌)混合过夜,然后通过0.2微米过滤器,在旋涂到晶片上并且然后在焦点增加和剂量增加的情况下,在ASML 1100扫描器下暴露于65nm/130nm间距线/空间的图案,并且然后在100℃下进行曝光后烘烤(PEB)60秒。PEB之后,将晶片在0.26N的TMAH水性显影剂中显影12秒,用蒸馏水冲洗,并且旋转干燥。
对上述组合物的旋涂晶片进行进行涂覆缺陷评价。在将组合物旋涂到六甲基二硅氮烷(HDMS)涂底的硅片上之后,在日立(Hitachi)CG4000CD-SEM上进行计量和SP2工具评价(tool evaluation)。测量缺陷计数和雾度值以进行比较。
为了评价图案化缺陷,用TEL Lithius 300mm晶片轨道和ASML 1900i浸没式扫描仪以1.3NA(数值孔径)、0.86/0.61内/外σ和35Y极化的偶极子照明进行浸没式光刻。使用205℃/60秒固化,用AR40A底部减反射涂层(BARC)涂覆用于光刻测试的晶片。使用175℃/60sec固化,在AR40A层上方涂覆的AR104 BARC。使用90℃/60秒软烘烤,在BARC堆叠体上方涂覆的光致抗蚀剂。在焦点增加和剂量增加的情况下,将晶片暴露于55nm/110nm间距线/空间的图案并且然后在100℃/60秒下进行曝光后烘烤(PEB)。PEB之后,将晶片在0.26N的TMAH水性显影剂中显影12sec,用蒸馏水冲洗,并且旋转干燥。然后在日立CG4000 CD-SEM上进行计量并对缺陷数进行计数以进行比较。
预期本发明中所述的表面流平剂可以有利地用来生产不含有大量涂覆和图案化缺陷的光致抗蚀剂组合物。
Claims (11)
2.如权利要求1所述的共聚物,其中,R2具有支链结构。
5.一种组合物,其包含如权利要求1至4中任一项所述的共聚物和溶剂。
6.一种组合物,其包含如权利要求1至5中任一项所述的共聚物和基体聚合物。
7.如权利要求6所述的组合物,其进一步包含光酸产生剂,并且其中所述基体聚合物包含可酸分解基团。
8.如权利要求6所述的组合物,其进一步包含热酸产生剂。
9.如权利要求6所述的组合物,其进一步包含交联剂。
10.一种涂覆方法,其包括:
将如权利要求5至9中任一项所述的组合物的层施加在基底上。
11.一种图案形成方法,其包括:
将如权利要求5至7中任一项所述的组合物的层布置在基底上;
将所述组合物层暴露于活化辐射;并且
使所述组合物层显影以提供抗蚀剂浮雕图像。
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