CN114678296A - 一种晶圆加热装置 - Google Patents
一种晶圆加热装置 Download PDFInfo
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- CN114678296A CN114678296A CN202210241532.9A CN202210241532A CN114678296A CN 114678296 A CN114678296 A CN 114678296A CN 202210241532 A CN202210241532 A CN 202210241532A CN 114678296 A CN114678296 A CN 114678296A
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 101
- 238000007789 sealing Methods 0.000 claims abstract description 65
- 238000001514 detection method Methods 0.000 claims description 6
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 238000012423 maintenance Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 21
- 230000006872 improvement Effects 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000013021 overheating Methods 0.000 description 4
- 230000001174 ascending effect Effects 0.000 description 2
- UQMRAFJOBWOFNS-UHFFFAOYSA-N butyl 2-(2,4-dichlorophenoxy)acetate Chemical compound CCCCOC(=O)COC1=CC=C(Cl)C=C1Cl UQMRAFJOBWOFNS-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
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Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202210241532.9A CN114678296B (zh) | 2022-03-11 | 2022-03-11 | 一种晶圆加热装置 |
Applications Claiming Priority (1)
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CN202210241532.9A CN114678296B (zh) | 2022-03-11 | 2022-03-11 | 一种晶圆加热装置 |
Publications (2)
Publication Number | Publication Date |
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CN114678296A true CN114678296A (zh) | 2022-06-28 |
CN114678296B CN114678296B (zh) | 2023-03-31 |
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CN202210241532.9A Active CN114678296B (zh) | 2022-03-11 | 2022-03-11 | 一种晶圆加热装置 |
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Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0714998A2 (en) * | 1994-11-30 | 1996-06-05 | Applied Materials, Inc. | CVD processing chamber |
US20050022742A1 (en) * | 2003-07-29 | 2005-02-03 | Hong Hyung-Sik | Chemical vapor deposition processing equipment for use in fabricating a semiconductor device |
US20110073039A1 (en) * | 2009-09-28 | 2011-03-31 | Ron Colvin | Semiconductor deposition system and method |
WO2016095259A1 (zh) * | 2014-12-17 | 2016-06-23 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 加热腔室以及半导体加工设备 |
US20180211893A1 (en) * | 2017-01-23 | 2018-07-26 | Hitachi High-Technologies Corporation | Vacuum processing apparatus |
US20180269084A1 (en) * | 2017-03-16 | 2018-09-20 | SCREEN Holdings Co., Ltd. | Substrate treating apparatus |
CN109003925A (zh) * | 2018-08-13 | 2018-12-14 | 常州瑞择微电子科技有限公司 | 用于半导体掩膜板的高精密平板加热装置 |
CN109509712A (zh) * | 2017-09-14 | 2019-03-22 | 中国电子科技集团公司第四十八研究所 | 一种热处理设备辅助加热炉门系统 |
CN211125619U (zh) * | 2019-11-25 | 2020-07-28 | 徐州同鑫光电科技股份有限公司 | 一种基于静电吸附的托盘固定结构 |
CN112349626A (zh) * | 2020-09-28 | 2021-02-09 | 芯米(厦门)半导体设备有限公司 | 一种晶圆烘烤装置 |
CN212750843U (zh) * | 2020-07-17 | 2021-03-19 | 常州铭赛机器人科技股份有限公司 | 分区吸附的晶圆加热装置及具有其的多工位点胶机 |
CN212848315U (zh) * | 2020-07-04 | 2021-03-30 | 天津方圆系统集成有限公司 | 一种用于智能芯片的封合装置 |
CN212962714U (zh) * | 2020-08-07 | 2021-04-13 | 智程半导体设备科技(昆山)有限公司 | 一种氮气加热晶圆干燥槽 |
CN113571455A (zh) * | 2021-09-27 | 2021-10-29 | 智程半导体设备科技(昆山)有限公司 | 半导体器件收容装置的承托组件 |
CN113600545A (zh) * | 2021-10-08 | 2021-11-05 | 智程半导体设备科技(昆山)有限公司 | 一种晶圆喷雾式清洗洁净装置 |
CN214753669U (zh) * | 2021-04-29 | 2021-11-16 | 北京北方华创微电子装备有限公司 | 承载装置及半导体工艺设备的反应腔室 |
US20220068674A1 (en) * | 2020-08-31 | 2022-03-03 | Applied Materials, Inc. | Heater Assembly with Process Gap Control for Batch Processing Chambers |
WO2022042471A1 (zh) * | 2020-08-25 | 2022-03-03 | 北京北方华创微电子装备有限公司 | 加热器和加热基座 |
-
2022
- 2022-03-11 CN CN202210241532.9A patent/CN114678296B/zh active Active
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0714998A2 (en) * | 1994-11-30 | 1996-06-05 | Applied Materials, Inc. | CVD processing chamber |
US20050022742A1 (en) * | 2003-07-29 | 2005-02-03 | Hong Hyung-Sik | Chemical vapor deposition processing equipment for use in fabricating a semiconductor device |
US20110073039A1 (en) * | 2009-09-28 | 2011-03-31 | Ron Colvin | Semiconductor deposition system and method |
WO2016095259A1 (zh) * | 2014-12-17 | 2016-06-23 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 加热腔室以及半导体加工设备 |
US20180211893A1 (en) * | 2017-01-23 | 2018-07-26 | Hitachi High-Technologies Corporation | Vacuum processing apparatus |
US20180269084A1 (en) * | 2017-03-16 | 2018-09-20 | SCREEN Holdings Co., Ltd. | Substrate treating apparatus |
CN109509712A (zh) * | 2017-09-14 | 2019-03-22 | 中国电子科技集团公司第四十八研究所 | 一种热处理设备辅助加热炉门系统 |
CN109003925A (zh) * | 2018-08-13 | 2018-12-14 | 常州瑞择微电子科技有限公司 | 用于半导体掩膜板的高精密平板加热装置 |
CN211125619U (zh) * | 2019-11-25 | 2020-07-28 | 徐州同鑫光电科技股份有限公司 | 一种基于静电吸附的托盘固定结构 |
CN212848315U (zh) * | 2020-07-04 | 2021-03-30 | 天津方圆系统集成有限公司 | 一种用于智能芯片的封合装置 |
CN212750843U (zh) * | 2020-07-17 | 2021-03-19 | 常州铭赛机器人科技股份有限公司 | 分区吸附的晶圆加热装置及具有其的多工位点胶机 |
CN212962714U (zh) * | 2020-08-07 | 2021-04-13 | 智程半导体设备科技(昆山)有限公司 | 一种氮气加热晶圆干燥槽 |
WO2022042471A1 (zh) * | 2020-08-25 | 2022-03-03 | 北京北方华创微电子装备有限公司 | 加热器和加热基座 |
US20220068674A1 (en) * | 2020-08-31 | 2022-03-03 | Applied Materials, Inc. | Heater Assembly with Process Gap Control for Batch Processing Chambers |
CN112349626A (zh) * | 2020-09-28 | 2021-02-09 | 芯米(厦门)半导体设备有限公司 | 一种晶圆烘烤装置 |
CN214753669U (zh) * | 2021-04-29 | 2021-11-16 | 北京北方华创微电子装备有限公司 | 承载装置及半导体工艺设备的反应腔室 |
CN113571455A (zh) * | 2021-09-27 | 2021-10-29 | 智程半导体设备科技(昆山)有限公司 | 半导体器件收容装置的承托组件 |
CN113600545A (zh) * | 2021-10-08 | 2021-11-05 | 智程半导体设备科技(昆山)有限公司 | 一种晶圆喷雾式清洗洁净装置 |
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CN114678296B (zh) | 2023-03-31 |
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Address after: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Applicant before: Zhicheng semiconductor equipment technology (Kunshan) Co.,Ltd. |
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Address after: 215000, No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |