CN114669884B - Device and method for flattening laser processing diamond based on horizontal liquid level regulation and control - Google Patents
Device and method for flattening laser processing diamond based on horizontal liquid level regulation and control Download PDFInfo
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- CN114669884B CN114669884B CN202210528615.6A CN202210528615A CN114669884B CN 114669884 B CN114669884 B CN 114669884B CN 202210528615 A CN202210528615 A CN 202210528615A CN 114669884 B CN114669884 B CN 114669884B
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- 239000007788 liquid Substances 0.000 title claims abstract description 426
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 111
- 239000010432 diamond Substances 0.000 title claims abstract description 111
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000003860 storage Methods 0.000 claims abstract description 75
- 230000001276 controlling effect Effects 0.000 claims abstract description 16
- 230000001105 regulatory effect Effects 0.000 claims abstract description 10
- 230000008859 change Effects 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 6
- 239000007864 aqueous solution Substances 0.000 claims description 5
- 229910017053 inorganic salt Inorganic materials 0.000 claims description 5
- 239000000049 pigment Substances 0.000 claims description 5
- 238000003672 processing method Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 3
- 238000005265 energy consumption Methods 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 239000002893 slag Substances 0.000 abstract description 2
- 238000004134 energy conservation Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
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- 230000003287 optical effect Effects 0.000 description 1
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- 238000002834 transmittance Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention discloses a laser processing diamond flattening device based on horizontal liquid level regulation, which comprises a laser processing assembly, a processing liquid storage tank, light-blocking and heat-absorbing auxiliary processing liquid, a liquid flow circulating device and a liquid level control device, wherein a diamond sheet to be processed is horizontally placed and fixed in the processing liquid storage tank, two ends of the processing liquid storage tank are respectively provided with a liquid inlet and a liquid outlet horizontally, the liquid flow circulating device is arranged between the liquid inlet and the liquid outlet, and the liquid level control device is used for accurately regulating and controlling the real-time height change of the liquid level in the processing liquid storage tank in the laser processing process. The invention uses the liquid level principle to ensure the surface type precision of the diamond processing surface, uses the black liquid absorption and absorption principle to protect the low-point area of the diamond surface, and simultaneously uses the liquid flow to take away the redundant heat and the waste slag generated in the processing process, so that the air is not polluted, and the auxiliary processing liquid can be recycled; the invention does not need high-power energy consumption components, high-precision moving components and complex process steps, realizes the efficient planarization processing of the diamond surface, is beneficial to environmental protection and energy conservation, and reduces the processing cost of the diamond.
Description
Technical Field
The invention relates to the technical field of diamond machining, in particular to a device and a method for flattening laser machining diamond based on horizontal liquid level regulation.
Background
Currently, diamond has the highest hardness, rigidity and strength in nature, and extremely high abrasion resistance and chemical stability, and belongs to typical difficult-to-react-difficult-to-process materials. The diamond synthesized by the artificial synthesis has uneven growth surface and unequal grain size due to the fact that the crystal is preferentially grown along certain crystal faces in the deposition process, and the diamond also often has a warping phenomenon, and the diamond can be put into use only after plane processing is needed to planarize the surface and achieve certain plane type precision. The plane processing method with the most applied mechanical grinding at present has extremely low efficiency, easily generates defects of scratches, breakage, high residual stress and the like, and is extremely challenging for processing large-size diamond chips in the future.
The laser non-contact processing technology is applied to the field of diamond, has the advantages of small deterioration influence area, high processing efficiency, strong precision controllability and the like, and is more applied in the aspects of cutting, punching, surface modification and the like. The planarization processing of diamond by using the laser technology generally needs to be established on the basis of a precise in-place detection technology and an expensive optical lens, has higher requirements on the precision of laser processing equipment, has complex processing technology and depends on the experience of operators. Therefore, the invention is required to be invented for realizing the planarization processing of the diamond by a laser processing method with low requirements on equipment precision and simple processing technology.
Disclosure of Invention
The invention aims to provide a device and a method for flattening a laser processing diamond based on horizontal liquid level regulation, which can realize efficient flattening processing of the diamond surface without high-precision moving parts and complex process steps.
The invention adopts the technical scheme that:
the device comprises a laser processing assembly, a processing liquid storage tank, light-blocking and heat-absorbing auxiliary processing liquid, a liquid flow circulating device and a liquid level control device, wherein a diamond sheet to be processed is horizontally placed and fixed in the processing liquid storage tank, a liquid inlet and a liquid outlet are respectively and horizontally formed in two ends of the processing liquid storage tank, the liquid flow circulating device is arranged between the liquid inlet and the liquid outlet, and the liquid level control device is used for controlling the real-time height of the liquid level in the processing liquid storage tank;
the liquid flow circulating device comprises a liquid flow pipeline, a liquid flow circulating pump, a filter and a cooler, wherein two ends of the liquid flow pipeline are respectively communicated with a liquid inlet and a liquid outlet of the processing liquid storage tank, and the liquid flow circulating pump, the filter and the cooler are sequentially arranged on the liquid flow pipeline.
The liquid level control device comprises a liquid level control pump, a processing liquid temporary storage tank, a central processing unit, a liquid level analog quantity analyzer and a temperature sensor, wherein a liquid outlet of the liquid level control pump is communicated with a liquid inlet of the processing liquid temporary storage tank, a liquid inlet of the liquid level control pump is communicated with a liquid flow circulating pipeline, the temperature sensor is immersed in an auxiliary processing liquid in the processing liquid storage tank and is arranged close to a diamond fixed position, the liquid level analog quantity analyzer is arranged above the liquid level in the processing liquid storage tank, and the central processing unit is used for receiving output data of the liquid level analog quantity analyzer, the temperature sensor, the first flow sensor and the second flow sensor and controlling opening degrees of the liquid level control pump, the liquid flow circulating pump, the filter and the cooler as well as the unidirectional liquid outlet overflow valve and the unidirectional liquid inlet overflow valve.
The liquid flow circulating device also comprises a one-way liquid outlet overflow valve arranged at the liquid outlet of the processing liquid storage tank, a first flow sensor, a one-way liquid inlet overflow valve arranged at the liquid inlet of the processing liquid storage tank and a second flow sensor.
The laser processing assembly comprises a shell, a laser, a beam expander, a reflecting prism, a vibrating mirror and a focusing lens are arranged in the shell, a light outlet of the laser sequentially passes through the beam expander, the reflecting prism, the vibrating mirror and the focusing lens to a light outlet of the shell, and the light outlet of the shell is arranged right above a diamond sheet to be processed.
The light-blocking and heat-absorbing auxiliary processing liquid adopts an aqueous solution in which black pigment and inorganic salt are dissolved.
The processing method of the laser processing diamond flattening device based on horizontal liquid level regulation comprises the following steps:
step S1: the device initialization specifically comprises the following steps:
s1.1: leveling, namely adjusting and leveling the whole processing liquid storage tank to keep the surface of the processing platform for placing the diamond sheet in the processing liquid storage tank horizontal;
s1.2: placing the diamond sheet, adopting epoxy resin glue to bond and fix the diamond sheet to be processed on a processing platform in a processing liquid storage tank, and enabling the glue coating thickness to be uniform so as to keep the bottom surface of the diamond sheet horizontal;
s1.3: the liquid level initialization adjustment is carried out, an operator sends a working signal to a liquid flow circulating pump through a central processing unit to enable liquid to normally start circulating dynamic flow, then the operator sends a working signal to a liquid level control pump through the central processing unit to enable auxiliary processing liquid to drop or rise to the position where the liquid just submerges the highest point of a diamond sheet to be processed against the tension of the liquid when the auxiliary processing liquid flows according to the circulating flow, and after the position is reached, a liquid level height analog quantity analyzer detects the liquid level height value at the moment and sends the liquid level height value to the central processing unit;
s1.4: focusing laser, adjusting the distance between the laser processing component and the surface of the diamond sheet to be processed to be equal to the laser focal length, and setting the range of the processing irradiation area of the laser processing component, wherein the range covers the whole surface of the diamond sheet to be processed;
step S2: the method for starting processing specifically comprises the following steps:
s2.1: the liquid flow circulates, the central processing unit sends working signals to the liquid flow circulating pump and the cooler, and sends working stopping signals to the liquid level control pump, so that residues in the auxiliary processing liquid are filtered after the subsequent auxiliary processing liquid flows through the filter, and the auxiliary processing liquid is cooled by the cooler and then circulated into the processing liquid storage tank;
s2.2: laser processing, wherein a central processing unit sends a working signal to a laser processing assembly, laser starts to irradiate vertically downwards and is focused on the surface of a diamond sheet, and the laser scans and irradiates all the set area range point by point;
step S3: regulating and controlling the liquid level, monitoring the temperature value of the temperature sensor in real time through a central processing unit, and analyzing the change characteristic of the temperature signal by the central processing unit to be used as the basis for controlling the start and stop of a pump and regulating and controlling the liquid level to drop; the method comprises the steps that as the high points on the surface of a diamond sheet are removed, the temperature of auxiliary processing liquid is further increased, after a temperature rise signal is monitored by a temperature sensor, a central processing unit calculates the time for the liquid level control pump to work according to the liquid level descending target height, the capacity of a processing liquid storage tank and the flow difference monitored by a first flow sensor and a second flow sensor in real time, so that the liquid level descending height is accurately regulated and controlled;
step S4: finishing processing;
s4.1: repeating the steps of laser processing and liquid level regulation, namely repeating the step S2 and the step S3 for N times until the N-th processing time and the N-1 th processing time are the same, wherein the whole surface of the diamond sheet is processed by the laser and is completely immersed under the liquid level, and the laser does not remove materials any more, so that the planarization processing of the whole surface of the diamond sheet is realized;
s4.2: calculating the diamond material removal thickness; after the Nth processing is finished, the processor sends a control signal to the laser processing assembly to stop light emission, the central processor controls the liquid level control pump to work so that the liquid level in the processing liquid storage tank is lowered again until the surface of the diamond sheet is just submerged against the tension of the liquid level, and the difference between the liquid level value detected by the liquid level analog quantity analyzer and the liquid level value detected before processing is the removal thickness of the laser processing diamond.
The liquid flow circulating device also comprises a one-way liquid outlet overflow valve arranged at the liquid outlet of the processing liquid storage tank, a first flow sensor, a one-way liquid inlet overflow valve arranged at the liquid inlet of the processing liquid storage tank and a second flow sensor.
The laser processing assembly comprises a shell, wherein a laser, a beam expander, a reflecting prism, a vibrating mirror and a focusing lens are arranged in the shell, and a light outlet of the laser sequentially passes through the beam expander, the reflecting prism, the vibrating mirror and the focusing lens to a light outlet of the shell.
The heat absorption processing liquid storage adopts an aqueous solution with black pigment and inorganic salt.
The invention uses the liquid level principle to ensure the surface type precision of the diamond processing surface, uses the black liquid absorption and absorption principle to protect the low-point area of the diamond surface, and simultaneously uses the liquid flow to take away the redundant heat and the waste slag generated in the processing process, so that the air is not polluted, and the auxiliary processing liquid can be recycled; the invention does not need high-power energy consumption components, is beneficial to environmental protection and energy saving, does not need high-precision moving components in the whole device, does not need complex process steps, realizes high-efficiency planarization processing of the diamond surface, provides a new method and a new device for the field of diamond processing, and is beneficial to reducing the diamond processing cost. The invention is not limited by the shape and size of the diamond, the class of materials and the like, and has stronger universality and wider adaptability.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a block diagram of the present invention;
fig. 2 is a flow chart of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1 and 2, the invention is shown in fig. 1, and comprises a laser processing assembly 1, a processing liquid storage tank 2, a liquid level analog quantity analyzer 3, a temperature sensor 4, a one-way liquid outlet overflow valve 5, a one-way liquid inlet overflow valve 13, a first flow sensor 6, a liquid flow circulating pump 7, a liquid level control pump 8, a processing liquid temporary storage tank 9, a filter 10, a cooler 11, a second flow sensor 12 and a central processing unit. The laser processing assembly 1 comprises a shell, wherein a laser 1A, a beam expander 1B, a reflecting prism 1C, a vibrating mirror 1D and a focusing lens 1E are arranged in the shell, and a light outlet of the laser 1A sequentially passes through the beam expander 1B, the reflecting prism 1C, the vibrating mirror 1D and the focusing lens 1E to a light outlet of the shell. The laser processing assembly 1 is used for non-contact processing of diamond, wherein a laser 1A generates parallel laser beams with fixed wavelength, the beam diameter is enlarged through a beam expander 1B, the beam is adjusted by a reflecting prism 1C to irradiate vertically downwards, and then high-energy density light spots are formed in a set area under the action of a galvanometer 1D and a focusing lens 1E, so that the processing and removal of materials in a set range are realized.
The laser processing assembly 1 is used for non-contact processing of diamond, wherein a laser 1A generates parallel laser beams with fixed wavelength, the beam diameter is enlarged through a beam expander 1B, then a reflecting prism 1C adjusts the beam to irradiate vertically downwards, and then a high-energy density light spot is formed in a set area under the action of a galvanometer 1D and a focusing lens 1E, so that the processing and removal of materials in a set range are realized; the method comprises the steps that a diamond sheet 14 to be processed is arranged right below a focusing lens 1E of a laser processing assembly 1, the diamond sheet 14 to be processed is fixedly arranged in a processing liquid storage tank 2, black auxiliary processing liquid is filled in the processing liquid storage tank 2, the liquid level of the auxiliary processing liquid is that the highest point of the diamond sheet 14 to be processed is just submerged by overcoming self tension, a liquid level analog quantity analyzer 3 and a temperature sensor 4 are further arranged in the processing liquid storage tank 2, the temperature sensor 4 is arranged close to the fixed position of the diamond sheet 14, and an auxiliary processing liquid temperature change signal caused by laser processing is timely acquired, the liquid level analog quantity analyzer 3 adopts a microwave sensor, and the application limit is small so as to sense the change of the liquid level and whether the liquid level is stable or not; the side wall outside the processing liquid storage tank 2 is provided with a liquid inlet hole 2B and a liquid outlet hole 2A, and the heights of the liquid inlet hole 2B and the liquid outlet hole 2A are equal to the fixed position of the diamond sheet 14 to be processed; the liquid outlet hole 2A is connected with a one-way liquid outlet overflow valve 5, the one-way liquid outlet overflow valve 5 is connected with a first flow sensor 6, the first flow sensor 6 is connected with a liquid flow circulating pump 7, the liquid flow circulating pump 7 can stop the flow of liquid when not working and can only enable the liquid flow to flow in one direction when working, the liquid flow circulating pump 7 is respectively connected with a liquid level control pump 8 and a filter 10 through a three-way joint, wherein the liquid level control pump 8 has two working modes of enabling the liquid flow to flow in the forward direction and flow in the reverse direction, and also stops the flow of liquid when not working, the liquid level control pump 8 is connected with a working liquid temporary storage box 9, the filter 10 is connected with a cooler 11, the cooler 11 is connected with a second flow sensor 12, the second flow sensor 12 is connected with a one-way liquid inlet overflow valve 13, and the one-way liquid inlet overflow valve 13 is connected with a liquid inlet hole 2B; the liquid level height analog quantity analyzer 3, the temperature sensor 4, the first flow sensor 6 and the second flow sensor 12 are all connected with the signal acquisition end of the central processing unit through cables, and the laser processing assembly 1, the liquid flow circulating pump 7, the liquid level control pump 8 and the cooler 11 are all connected with the signal output end of the central processing unit through cables.
The endothermic auxiliary processing liquid in the processing liquid storage tank 2 is selected from aqueous solution dissolved with black pigment and inorganic salt, and can resist light and absorb heat, has good fluidity and high boiling point, or other black liquid with similar performance. The auxiliary processing liquid has three flow paths: the first path sequentially flows through the liquid outlet hole 2A, the one-way liquid outlet overflow valve 5, the first flow sensor 6, the liquid flow circulating pump 7, the filter 10, the cooler 11, the second flow sensor 12, the one-way liquid inlet overflow valve 13 and the liquid inlet hole 2B from the processing liquid storage tank 2, returns to the processing liquid storage tank 2 again, realizes one-way circulating flow, and takes away laser energy and processing waste residues absorbed by auxiliary processing liquid in time; a second path sequentially flows through the liquid outlet hole 2A, the one-way liquid outlet overflow valve 5, the first flow sensor 6, the liquid flow circulating pump 7 and the liquid level control pump 8 from the processing liquid storage tank 2, and enters the processing liquid temporary storage tank 9 to realize the drop of the liquid level in the processing liquid storage tank 2; and a third path sequentially flows through the liquid level control pump 8, the filter 10, the cooler 11, the second flow sensor 12, the one-way liquid inlet overflow valve 13 and the liquid inlet hole 2B from the processing liquid temporary storage box 9, and returns to the processing liquid storage tank 2, so that the liquid level in the processing liquid storage tank 2 is raised.
The liquid circulation device comprises a liquid flow pipeline, two ends of the liquid flow pipeline are respectively communicated with a liquid inlet and a liquid outlet of the processing liquid storage tank, and the liquid flow circulation pump, the filter and the cooler are sequentially arranged on the liquid flow pipeline. The liquid flow circulating device also comprises a one-way liquid outlet overflow valve arranged at the liquid outlet of the processing liquid storage tank, a first flow sensor, a one-way liquid inlet overflow valve arranged at the liquid inlet of the processing liquid storage tank and a second flow sensor. Through the use of the one-way overflow valve and the flow sensor, the whole device can be more accurate and more stable in horizontal liquid level control.
The invention is used for controlling the real-time height of the liquid level through the liquid level control device; the liquid level control device comprises a liquid level control pump, a processing liquid temporary storage box, a central processing unit, a liquid level analog quantity analyzer and a temperature sensor, a liquid outlet of the liquid level control pump is communicated with a liquid inlet of the processing liquid temporary storage box, a liquid inlet of the liquid level control pump is communicated with a liquid flow circulating pipeline, and the central processing unit is used for receiving output data of the liquid level analog quantity analyzer, the temperature sensor, the first flow sensor and the second flow sensor and controlling opening and closing of the liquid level control pump, the liquid flow circulating pump, the filter and the cooler and opening of the unidirectional liquid outlet overflow valve and the unidirectional liquid inlet overflow valve. The invention adopts a liquid level control pump and a processing liquid temporary storage box to regulate the flow ratio of liquid inlet and liquid outlet of a processing liquid storage groove, reduces the liquid level in real time through liquid temporary storage in the laser processing process, ensures the liquid level to be equal to the high point position of a diamond sheet all the time, takes the change of the liquid temperature beside a laser processing area as a trigger signal for judging whether the liquid level needs to be reduced or not, protects the low point position of the diamond surface by utilizing the light-blocking and heat-absorbing effects of auxiliary processing liquid, ensures that the high point is removed more, the low point is not removed, and finally realizes the flattening processing of the whole surface of the diamond by utilizing the horizontal characteristic of the liquid level. The device has simple integral structure, uncomplicated operation process, high processing control precision and wide adaptability.
The invention also discloses a method for processing the diamond by the liquid level auxiliary laser, which comprises the following steps:
step S1: the device initialization specifically comprises the following steps:
s1.1: leveling, namely adjusting and leveling the whole processing liquid storage tank 2 to keep the surface of the position where the diamond piece 14 is placed in the processing liquid storage tank 2 horizontal;
s1.2: placing the diamond sheet, and adopting epoxy resin glue to bond and fix the diamond sheet 14 to be processed at the inner bottom of the processing liquid storage tank 2 or the processing platform, wherein the glue coating thickness is uniform, so that the bottom surface of the diamond sheet 14 is kept horizontal;
s1.3: the liquid level initialization adjustment, an operator sends a working signal to a liquid flow circulating pump 7 through a central processing unit to enable liquid to normally start circulating dynamic flow, then the operator sends a working signal to a liquid level control pump 8 through the central processing unit to enable auxiliary processing liquid to drop or rise to the position where the liquid overcomes the self tension and just submerges the highest point of a diamond sheet 14 to be processed when the auxiliary processing liquid flows circularly, and after the position is reached, a liquid level height analog analyzer 3 detects the liquid level height value at the moment and sends the liquid level height value to the central processing unit;
s1.4: the laser focusing adjusts the distance between the laser processing component 1 and the surface of the diamond sheet 14 to be processed to be equal to the laser focal length, and sets the range of the processing irradiation area of the laser processing component 1, wherein the range covers the whole surface of the diamond sheet 14 to be processed.
Step S2: the method for starting processing specifically comprises the following steps:
s2.1: the liquid flow circulates, the central processing unit sends working signals to the liquid flow circulating pump 7 and the cooler 11, and sends working stopping signals to the liquid level control pump, so that residues in the auxiliary processing liquid are filtered after the subsequent auxiliary processing liquid flows through the filter, and the auxiliary processing liquid is cooled by the cooler and then circulated into the processing liquid storage tank;
s2.2: laser processing, wherein a central processing unit sends a working signal to a laser processing assembly 1, laser starts to irradiate vertically downwards and is focused on the surface of a diamond sheet 14, and the irradiation covers the set whole area range in a point-by-point scanning manner;
the diamond sheet 14 is immersed below the liquid level, so that the laser beam is prevented from directly transmitting to the inside of the diamond to cause damage, the laser acts on a liquid film at the highest point on the surface of the diamond sheet 14 to generate a high-heat environment to carbonize the diamond at the position, the carbonization further aggravates the material removal under the laser ablation, and the other positions on the surface of the diamond sheet 14 are mostly taken away by flowing auxiliary processing liquid due to thicker liquid film, so that the diamond cannot be damaged, thereby realizing the fixed-point processing of the high-point more removal, the low-point less removal and even no removal of the surface of the diamond sheet 14.
Step S3: and the liquid level is regulated and controlled, the temperature value of the temperature sensor is monitored in real time through the central processing unit, and the central processing unit analyzes the change characteristic of the temperature signal and takes the change characteristic as the basis for controlling the start and stop of the pump and regulating and controlling the liquid level to drop.
The temperature sensor is immersed in the surface layer of the auxiliary processing liquid and is arranged next to the diamond processing area, and the temperature of the auxiliary processing liquid is monitored. After the processing is started, the temperature of the auxiliary processing liquid rises rapidly, but is very fast and stable and basically kept unchanged, along with the increase of the processing time, the high point position of the diamond is flattened and is fully immersed in the deep under the liquid level, at the moment, the laser energy is fully absorbed by the auxiliary processing liquid, the diamond material is not removed any more, the temperature of the auxiliary processing liquid is further raised, the temperature rise signal is monitored by the temperature sensor and is transmitted to the central processing unit, and the central processing unit outputs a signal to the liquid level control pump through operation, so that the auxiliary processing liquid flows according to a second path, and the liquid level in the processing liquid storage tank begins to fall. The time for the liquid level control pump to work can be calculated according to the liquid level descending target height, the capacity of the processing liquid storage tank and the flow difference monitored in real time by the first flow sensor and the second flow sensor, wherein the liquid level descending target height is a fixed set value and is set according to the transmittance of the auxiliary processing liquid and the laser energy intensity. Since the liquid level analog analyzer 3 is easily disturbed by the flow of the liquid, a control error may be introduced, and thus, the liquid level is precisely controlled by means of flow monitoring conversion. After the liquid level control pump stops working, the liquid level descends to lead the primary high-point area of the diamond surface to be separated from the liquid level protection, laser processing material removal is started aiming at the primary highest-point area and the primary high-point area of the diamond surface, and the auxiliary processing liquid temperature starts to fall back to some extent and is stabilized again.
In addition, the central processing unit can adjust the liquid flow circulation speed by controlling the rotating speed of the liquid flow circulation pump, so that the temperature stability value of auxiliary processing liquid is adjusted, and the stability degree of the liquid level height signal monitored by the liquid level height analog quantity analyzer can be used as a basis for judging whether the liquid flow circulation speed is proper or not. If the temperature of the auxiliary processing liquid is too high, the circulation speed of the liquid flow is increased; and if the fluctuation of the liquid level height signal is large, the circulation speed of liquid flow is reduced.
Step S4: finishing processing;
s4.1: the steps of laser processing and liquid level regulation are repeatedly and circularly executed, namely, the steps S2 and S3 are repeated for a total of N times until the Nth processing time and the N-1 th processing time are the same, at this time, the whole surface of the diamond sheet 14 is processed by the laser and is fully immersed under the liquid level, and the laser does not remove materials any more. The level and flatness of the whole processing surface of the diamond are ensured by utilizing the liquid level characteristic.
S4.2: calculating the diamond material removal thickness; after the Nth processing is finished, the central processing unit sends a control signal to the laser processing assembly 1 to stop light emission, the central processing unit controls the liquid level control pump 8 to work so that the liquid level in the processing liquid storage tank 2 is lowered again until the surface of the diamond sheet 14 is just submerged against the tension of the liquid level, and at the moment, the difference between the liquid level value detected by the liquid level analog quantity analyzer 3 and the liquid level value detected before processing is the removal thickness of the laser processing diamond.
The invention utilizes the light-blocking and heat-absorbing characteristics of auxiliary processing liquid and the horizontal characteristics of liquid level, and ensures that the depth of the concave-convex surface of the diamond to be processed immersed under the liquid level is different through the accurate regulation and control of the liquid level, thereby realizing that the high points on the diamond surface are directly ablated by laser and removed more, the low points on the diamond surface are protected by a liquid film and removed less or not removed, and finally achieving the aim of processing the whole surface of the diamond to be flat. The central processing unit receives signals of the liquid level height analog quantity analyzer, the temperature sensor, the first flow sensor, the second flow sensor and the like in real time, outputs signals to the laser processing assembly 1, the liquid flow circulating pump 7, the liquid level control pump 8 and the like in real time through analysis and operation, and automatically controls and completes the whole processing process.
The invention has simple structure, convenient operation and high liquid level control precision, ensures that the laser processing diamond planarization is more intelligent and accurate, and has wide applicability and popularization prospect.
In the description of the present invention, it should be noted that, for the azimuth words such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the azimuth and positional relationships are based on the azimuth or positional relationships shown in the drawings, it is merely for convenience of describing the present invention and simplifying the description, and it is not to be construed as limiting the specific scope of protection of the present invention that the device or element referred to must have a specific azimuth configuration and operation.
It should be noted that the terms "first," "second," and the like in the description and in the claims of the present application are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe the embodiments of the present application described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Note that the above is only a preferred embodiment of the present invention and uses technical principles. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the present invention has been described in connection with the above embodiments, it is to be understood that the invention is not limited to the specific embodiments disclosed and that many other and equally effective embodiments may be devised without departing from the spirit of the invention, and the scope thereof is determined by the scope of the appended claims.
Claims (7)
1. A processing method for flattening laser processing diamond with horizontal liquid level regulation is characterized in that:
the laser processing diamond flattening processing device comprises a laser processing component, a processing liquid storage tank, a light-blocking and heat-absorbing auxiliary processing liquid, a liquid flow circulating device and a liquid level control device, and further comprises the following steps:
step S1: the device initialization specifically comprises the following steps:
s1.1: leveling, namely adjusting and leveling the whole processing liquid storage tank to keep the surface of the processing platform for placing the diamond sheet in the processing liquid storage tank horizontal;
s1.2: placing the diamond sheet, adopting epoxy resin glue to bond and fix the diamond sheet to be processed on a processing platform in a processing liquid storage tank, and enabling the glue coating thickness to be uniform so as to keep the bottom surface of the diamond sheet horizontal;
s1.3: the liquid level initialization adjustment is carried out, an operator sends a working signal to a liquid flow circulating pump through a central processing unit to enable liquid to normally start circulating dynamic flow, then the operator sends a working signal to a liquid level control pump through the central processing unit to enable the light-blocking and heat-absorbing auxiliary processing liquid to drop or rise to the position where the liquid overcomes the self tension and just submerges the highest point of diamond to be processed when the liquid flows circularly, and after the position is reached, a liquid level height analog quantity analyzer detects the liquid level height value at the moment and sends the liquid level height value to the central processing unit;
s1.4: focusing laser, adjusting the distance between the laser processing component and the surface of the diamond sheet to be processed to be equal to the laser focal length, and setting the range of the processing irradiation area of the laser processing component, wherein the range covers the whole surface of the diamond to be processed;
step S2: the method for starting processing specifically comprises the following steps:
s2.1: the liquid flow circulates, the central processing unit sends working signals to the liquid flow circulating pump and the cooler, and sends working stop signals to the liquid level control pump, so that residues in the light-blocking and heat-absorbing auxiliary processing liquid are filtered after the subsequent light-blocking and heat-absorbing auxiliary processing liquid flows through the filter, and the light-blocking and heat-absorbing auxiliary processing liquid is cooled by the cooler and then circulated into the processing liquid storage tank;
s2.2: laser processing, wherein a central processing unit sends a working signal to a laser processing assembly, laser starts to irradiate vertically downwards and is focused on the surface of a diamond sheet, and the laser scans and irradiates all the set area range point by point;
step S3: regulating and controlling the liquid level, monitoring the temperature value of the temperature sensor in real time through a central processing unit, and analyzing the change characteristic of the temperature signal by the central processing unit to be used as the basis for controlling the start and stop of a pump and regulating and controlling the liquid level to drop; the method comprises the steps that as the high points on the surface of the diamond are removed, the temperature of the light-blocking and heat-absorbing auxiliary processing liquid is further increased, after a temperature rise signal is monitored by a temperature sensor, a central processing unit calculates the time for the liquid level control pump to work according to the liquid level descending target height, the capacity of a processing liquid storage tank and the flow difference monitored by a first flow sensor and a second flow sensor in real time, so that the liquid level descending height is accurately regulated and controlled;
step S4: finishing processing;
s4.1: repeating the steps of laser processing and liquid level regulation, namely repeating the step S2 and the step S3 for N times until the N-th processing time and the N-1 th processing time are the same, wherein the whole surface of the diamond sheet is processed by the laser and is completely immersed under the liquid level, and the laser does not remove materials any more, so that the planarization processing of the whole surface of the diamond sheet is realized;
s4.2: calculating the diamond material removal thickness; after the Nth processing is finished, the processor sends a control signal to the laser processing assembly to stop light emission, the central processor controls the liquid level control pump to work so that the liquid level in the processing liquid storage tank is lowered again until the surface of the diamond sheet is just submerged against the tension of the liquid level, and at the moment, the difference between the liquid level value detected by the liquid level analog quantity analyzer and the liquid level value detected before processing is the removal thickness of the laser processing diamond; the light-blocking and heat-absorbing auxiliary processing liquid adopts an aqueous solution in which black pigment and inorganic salt are dissolved.
2. The method for processing the planarization of the diamond by the laser processing with the horizontal liquid level control according to claim 1, wherein the method comprises the following steps: the liquid flow circulating device also comprises a one-way liquid outlet overflow valve arranged at the liquid outlet of the processing liquid storage tank, a first flow sensor, a one-way liquid inlet overflow valve arranged at the liquid inlet of the processing liquid storage tank and a second flow sensor.
3. The method for processing the planarization of the diamond by the laser processing with the horizontal liquid level control according to claim 2, wherein the method comprises the following steps: the laser processing assembly comprises a shell, a laser, a beam expander, a reflecting prism, a vibrating mirror and a focusing lens are arranged in the shell, a light outlet of the laser sequentially passes through the beam expander, the reflecting prism, the vibrating mirror and the focusing lens to a light outlet of the shell, and the light outlet of the shell is arranged right above a diamond sheet to be processed.
4. An apparatus for a laser processing diamond planarization method based on the horizontal liquid level control of claim 1, characterized in that: the device comprises a laser processing assembly, a processing liquid storage tank, light-blocking and heat-absorbing auxiliary processing liquid, a liquid flow circulating device and a liquid level control device, wherein a diamond sheet to be processed is horizontally placed and fixed in the processing liquid storage tank, a liquid inlet and a liquid outlet are respectively and horizontally formed in two ends of the processing liquid storage tank, the liquid flow circulating device is arranged between the liquid inlet and the liquid outlet, and the liquid level control device is used for accurately regulating and controlling the real-time height change of the liquid level in the processing liquid storage tank in the laser processing process;
the liquid flow circulating device comprises a liquid flow pipeline, a liquid flow circulating pump, a filter and a cooler, wherein two ends of the liquid flow pipeline are respectively communicated with a liquid inlet and a liquid outlet of the processing liquid storage tank, and the liquid flow circulating pump, the filter and the cooler are sequentially arranged on the liquid flow pipeline; the light-blocking and heat-absorbing auxiliary processing liquid adopts an aqueous solution in which black pigment and inorganic salt are dissolved.
5. The device for a laser processing diamond planarization method based on horizontal liquid level control according to claim 4, wherein: the liquid level control device comprises a liquid level control pump, a processing liquid temporary storage box, a central processing unit, a liquid level height analog quantity analyzer and a temperature sensor, wherein a liquid outlet of the liquid level control pump is communicated with a liquid inlet of the processing liquid temporary storage box, a liquid inlet of the liquid level control pump is communicated with a liquid flow circulating pipeline, the temperature sensor is immersed in a light-blocking and heat-absorbing auxiliary processing liquid in the processing liquid storage box and is arranged next to a diamond fixed position, the liquid level height analog quantity analyzer is arranged above the liquid level in the processing liquid storage box, and the central processing unit is used for receiving output data of the liquid level height analog quantity analyzer, the temperature sensor, the first flow sensor and the second flow sensor and controlling opening and closing of the liquid level control pump, the liquid flow circulating pump, the filter and the cooler as well as a unidirectional liquid outlet overflow valve and a unidirectional liquid inlet overflow valve.
6. The device for a laser processing diamond planarization method based on horizontal liquid level control according to claim 4, wherein: the liquid flow circulating device also comprises a one-way liquid outlet overflow valve arranged at the liquid outlet of the processing liquid storage tank, a first flow sensor, a one-way liquid inlet overflow valve arranged at the liquid inlet of the processing liquid storage tank and a second flow sensor.
7. The device for a laser processing diamond planarization method based on horizontal liquid level control according to claim 4, wherein: the laser processing assembly comprises a shell, a laser, a beam expander, a reflecting prism, a vibrating mirror and a focusing lens are arranged in the shell, a light outlet of the laser sequentially passes through the beam expander, the reflecting prism, the vibrating mirror and the focusing lens to a light outlet of the shell, and the light outlet of the shell is arranged right above a diamond sheet to be processed.
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Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10305374A (en) * | 1997-05-12 | 1998-11-17 | Nippon Sheet Glass Co Ltd | Laser processing method for transparent member |
| JPH11145108A (en) * | 1997-11-05 | 1999-05-28 | Denso Corp | Method and device of fine work device |
| JP2002018586A (en) * | 2000-07-03 | 2002-01-22 | Ricoh Microelectronics Co Ltd | Method of laser beam machining and device for laser beam machining |
| CN102886606A (en) * | 2012-10-16 | 2013-01-23 | 江苏大学 | Method and device for remanufacturing sheet metal welding piece by utilizing laser |
| CN204221201U (en) * | 2014-11-07 | 2015-03-25 | 宁波禾森自动化设备有限公司 | A kind of laser cutting machine |
| JP2016026886A (en) * | 2015-09-11 | 2016-02-18 | 芝浦メカトロニクス株式会社 | Lader processing device |
| CN106735871A (en) * | 2017-01-19 | 2017-05-31 | 中国科学院宁波材料技术与工程研究所 | Liquid auxiliary laser processing method and device |
| CN108655521A (en) * | 2018-04-27 | 2018-10-16 | 江苏大学 | A kind of processing unit (plant) that piezoelectric ceramic vibration is synchronous with electrochemical discharge and method |
| CN108838514A (en) * | 2018-06-28 | 2018-11-20 | 江苏大学 | A kind of device and method on laser cavitation polishing material surface |
| CN109093247A (en) * | 2018-08-21 | 2018-12-28 | 江苏大学 | A kind of device and method for realizing laser cavitation high-efficient rust-removing paint removal |
| CN110621426A (en) * | 2017-03-31 | 2019-12-27 | 株式会社尼康 | Processing method and processing system |
| CN111360345A (en) * | 2020-03-25 | 2020-07-03 | 苏州大学 | Processing method for forming microstructure on surface of workpiece and control system |
-
2022
- 2022-05-16 CN CN202210528615.6A patent/CN114669884B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10305374A (en) * | 1997-05-12 | 1998-11-17 | Nippon Sheet Glass Co Ltd | Laser processing method for transparent member |
| JPH11145108A (en) * | 1997-11-05 | 1999-05-28 | Denso Corp | Method and device of fine work device |
| JP2002018586A (en) * | 2000-07-03 | 2002-01-22 | Ricoh Microelectronics Co Ltd | Method of laser beam machining and device for laser beam machining |
| CN102886606A (en) * | 2012-10-16 | 2013-01-23 | 江苏大学 | Method and device for remanufacturing sheet metal welding piece by utilizing laser |
| CN204221201U (en) * | 2014-11-07 | 2015-03-25 | 宁波禾森自动化设备有限公司 | A kind of laser cutting machine |
| JP2016026886A (en) * | 2015-09-11 | 2016-02-18 | 芝浦メカトロニクス株式会社 | Lader processing device |
| CN106735871A (en) * | 2017-01-19 | 2017-05-31 | 中国科学院宁波材料技术与工程研究所 | Liquid auxiliary laser processing method and device |
| CN110621426A (en) * | 2017-03-31 | 2019-12-27 | 株式会社尼康 | Processing method and processing system |
| CN108655521A (en) * | 2018-04-27 | 2018-10-16 | 江苏大学 | A kind of processing unit (plant) that piezoelectric ceramic vibration is synchronous with electrochemical discharge and method |
| CN108838514A (en) * | 2018-06-28 | 2018-11-20 | 江苏大学 | A kind of device and method on laser cavitation polishing material surface |
| CN109093247A (en) * | 2018-08-21 | 2018-12-28 | 江苏大学 | A kind of device and method for realizing laser cavitation high-efficient rust-removing paint removal |
| CN111360345A (en) * | 2020-03-25 | 2020-07-03 | 苏州大学 | Processing method for forming microstructure on surface of workpiece and control system |
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