CN212569305U - Laser beam shaping device - Google Patents
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- CN212569305U CN212569305U CN202020962938.2U CN202020962938U CN212569305U CN 212569305 U CN212569305 U CN 212569305U CN 202020962938 U CN202020962938 U CN 202020962938U CN 212569305 U CN212569305 U CN 212569305U
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Abstract
The utility model belongs to the technical field of laser processing, and relates to a laser beam shaping device, which comprises a laser, an adjusting component for adjusting the diameter of the laser, a spatial light modulator, a first convex lens, a second convex lens, a focusing objective lens and a working platform, wherein the laser, the adjusting component, the spatial light modulator, the first convex lens, the second convex lens, the focusing objective lens and the working platform are sequentially arranged along a laser light path; laser emitted by the laser is adjusted by the adjusting component and then is incident on the spatial light modulator to generate spatial shaping laser; the shaped space shaping laser is incident to a focusing objective lens through a first convex lens and a second convex lens in sequence, and is focused and irradiated on a material to be processed of the working platform through the focusing objective lens; the spatial light modulator, the first convex lens, the second convex lens and the focusing objective lens together form a 4F system. The laser beam shaping device can freely regulate and control the energy distribution, the appearance and the quantity of the light spots through the change of the loading phase of the spatial light modulator, and improves the quality and the efficiency of laser grooving.
Description
Technical Field
The utility model relates to a laser beam machining technical field especially relates to a laser beam shaping device.
Background
In a semiconductor process, a Low-K dielectric (Low-K dielectric) material is a material having a small dielectric constant relative to silicon dioxide (e.g., SiOF, SiOC, etc.), and is located between metal interconnection layers in a chip, so that the parasitic capacitance of a circuit can be reduced, thereby achieving a faster switching speed and a lower heat dissipation. Therefore, the Low-K process is the focus of the current development in the industry, especially in the fields of logic operation, storage, and the like. In the traditional processing mode, a diamond cutter wheel is adopted to cut and process a Low-K wafer, so that the problems of collapse, cracks, passivation, lifting of a metal layer and the like of the Low-K and copper materials can be caused.
In order to solve the problem, the mainstream technology in the market at present is to remove the Low-K and copper metal layers on the surface of the wafer by laser grooving, and then cut the substrate material by a cutter wheel. The laser grooving method comprises the following steps: firstly, cutting a surface layer material by using double thin lines for isolating protection, and then slotting by using a wide light spot in the middle of the double thin lines. Except for Low-K materials, the grooving process of GaN (i.e. gallium nitride, belonging to the third generation semiconductor material, hexagonal wurtzite structure) and other materials has become a new hot spot and trend.
However, the laser grooving process has high requirements on the accuracy and quality of the light spots, and the shape and the distance of the light spots need to be adjusted. Among them, there are two common wide spot shaping schemes: one solution is a line spot DOE (diffraction Optical Elements), the initial length of which can be customized in the range of 20 um-80 um, and the grooving width is controlled mainly by rotating the DOE angle; the other scheme is that a Mask (called as a Mask) and an elliptical light spot shaping system are adopted, wherein the elliptical light spot shaping system mainly shapes an original Gaussian light spot into a nearly flat-top light spot, and the Mask controls the width change of the light spot. However, in the first scheme, the overlapping rate of light spots of the upper and lower side edge portions of the groove and the middle portion of the groove is inconsistent due to the rotation of the DOE, and the groove shape is finally deviated from a V shape (the depth of the middle is greatly different from that of the two sides); the groove shape obtained by the second scheme is good, but the Mask shields part of light spots and energy thereof, so that the conversion rate of laser beams is low, and the groove opening efficiency is greatly influenced.
Meanwhile, the laser grooving times are related to the requirements of grooving depth and quality, and the grooving times are usually 1-10 times, so that the problem of processing efficiency is faced. Under the existing processing technical conditions, parallel processing is mostly realized by splitting laser beams, and the existing laser beam splitting means includes laser beam splitter beam splitting, prism beam splitting, diffraction element beam splitting and the like. Due to the Gaussian distribution of laser, the laser beam splitter easily causes uneven energy distribution of split sub-laser, and influences the processing quality of subsequent laser grooving; although the prism beam splitting and the diffraction element beam splitting can solve the problem of uniformity, a plurality of elements are required to be configured for grooved light spots with different shapes, numbers and distributions to meet different requirements in the processing process.
In summary, how to implement compatible processing of high quality, high efficiency and flexibility of laser grooving becomes a problem to be solved urgently in the industry.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the utility model is to provide a laser beam shaping device for solve current laser fluting to high quality, high efficiency, the compatible technical problem of flexibility.
In order to solve the technical problem, an embodiment of the utility model provides a laser beam shaping device has adopted following technical scheme:
the laser beam shaping device includes:
the device comprises a laser, an adjusting component for adjusting the diameter and the energy of the laser, a spatial light modulator, a first convex lens, a second convex lens, a focusing objective and a working platform for loading materials to be processed, wherein the laser, the adjusting component, the spatial light modulator, the first convex lens, the second convex lens, the focusing objective and the working platform are sequentially arranged along a laser light path; wherein the content of the first and second substances,
laser emitted by the laser is adjusted by the adjusting component and then is incident on the spatial light modulator to generate spatially shaped laser; the shaped space shaping laser is incident to the focusing objective lens through the first convex lens and the second convex lens in sequence, and then is focused and irradiated on the material to be processed of the working platform through the focusing objective lens;
the spatial light modulator is used for spatially shaping the incident single laser beam into at least one spatially distributed laser beam through the loaded phase diagram and emitting the laser beam;
spatial light modulator, first convex lens, second convex lens and focus objective constitute 4F system jointly, the focus of first convex lens is F1, the focus of second convex lens is F2, spatial light modulator with distance between the first convex lens is F1, distance between first convex lens and the second convex lens is F1+ F2, distance between second convex lens and the focus objective is F2.
In some embodiments, the conditioning assembly comprises a beam expander and an energy conditioning system arranged in sequence along the same optical axis; wherein the content of the first and second substances,
the beam expander is positioned between the laser and the energy adjusting system and is used for adjusting the beam waist radius of the laser output light spot;
the energy adjusting system is used for freely adjusting the laser energy and enabling the polarization direction of the emergent laser to be horizontal.
In some embodiments, the energy adjusting system includes a half-wave plate for freely adjusting laser energy and a beam splitter crystal for leveling a polarization direction of the outgoing laser light, and the beam expander, the half-wave plate, the beam splitter crystal, and the spatial light modulator are sequentially disposed along a same optical axis.
In some embodiments, one side of the spectroscopic crystal is provided with a light barrier for eliminating the laser beam in the vertical polarization direction.
In some embodiments, the first and second convex lenses are double-convex lenses, and antireflection films are disposed on incident surfaces of the first and second convex lenses.
In some embodiments, an adjustable diaphragm is disposed between the first convex lens and the second convex lens, the spatially shaped laser light emitted by the first convex lens is incident on the second convex lens via the adjustable diaphragm, an optical path distance between the adjustable diaphragm and the first convex lens is equal to a focal length of the first convex lens, and an optical path distance between the adjustable diaphragm and the second convex lens is equal to a focal length of the second convex lens.
In some embodiments, a first reflective mirror is rotatably disposed between the spatial light modulator and the first convex lens, and the first reflective mirror is used for reflecting the spatially shaped laser light generated by the spatial light modulator to the first convex lens; and a second reflector is rotatably arranged between the adjustable diaphragm and the second convex lens and used for reflecting the laser beam adjusted by the adjustable diaphragm to the second convex lens.
In some embodiments, the spatial light modulator is configured to shape a single spot into at least two spots with adjustable pitch, or the spatial light modulator is configured to shape a gaussian spot into a flat-topped spot, a rectangular spot, an elliptical spot, or a shaped spot.
In some embodiments, the working platform is provided with a moving assembly, and the moving assembly is used for moving the material to be processed so that the laser beam injected onto the material to be processed can move relatively to the material to be processed.
In some embodiments, the laser beam shaping device further comprises a control module for controlling the operation of the laser, the spatial light modulator and the working platform.
Compared with the prior art, the embodiment of the utility model provides a laser beam shaping device mainly has following beneficial effect:
first, the utility model discloses a laser beam shaping device, when being applied to laser grooving processing, can effectively avoid the beam splitting heterogeneity caused by the Gaussian distribution of laser itself, realize improving the homogeneity and the quality of wide facula;
secondly, the shapes of double thin light spots or wide light spots can be freely switched through the change of the loading phase of the spatial light modulator, the quantity and the distribution of the wide light spots can be freely regulated and controlled, various elements do not need to be configured, and the height adjustability is realized;
thirdly, the high-precision wide light spot array can be processed at one time through light beam shaping, and the positioning error between the wide light spots caused by a mechanical structure can be avoided while the efficiency is improved.
Drawings
In order to illustrate the solution of the present invention more clearly, the drawings needed for describing the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. Wherein:
fig. 1 is a schematic structural diagram of a laser beam shaping device according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a 4F system of the laser beam shaping device of the present invention;
fig. 3 is a diagram of double gaussian spots for beam shaping in a first embodiment of the present invention;
fig. 4 is a single flat-top light spot for beam shaping according to the second embodiment of the present invention;
fig. 5 is a diagram of a dual flat-top spot with adjustable space and size of 200um x 200um for beam shaping in the third embodiment of the present invention;
fig. 6 is a diagram of a dual flat-top spot with adjustable space and size of 300um × 300um for beam shaping in the fourth embodiment of the present invention.
The reference numbers in the drawings are as follows: 101. a laser; 102. a beam expander; 103. a half-wave plate; 104. a spectroscopic crystal; 105. a light barrier; 106. a spatial light modulator; 107. a first reflector; 108. a first convex lens; 109. an adjustable diaphragm; 110. a second reflector; 111. a second convex lens; 112. a focusing objective lens; 113. A material to be processed; 114. a working platform; 115. and a control module.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the description is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention, for example, the terms "length," "width," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or position illustrated in the drawings, which are for convenience of description only and are not to be construed as limiting of the present disclosure.
The terms "including" and "having," and any variations thereof, in the description and claims of this invention and the description of the above figures are intended to cover non-exclusive inclusions; the terms "first," "second," and the like in the description and in the claims, or in the drawings, are used for distinguishing between different objects and not necessarily for describing a particular sequential or chronological order. The meaning of "plurality" is two or more unless specifically limited otherwise.
In the description and claims of the present invention and in the description of the above figures, when an element is referred to as being "fixed" or "mounted" or "disposed" or "connected" to another element, it can be directly or indirectly located on the other element. For example, when an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.
Furthermore, reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
It should be noted that the laser beam shaping device in the embodiment of the present invention can be used in laser grooving, and can also be used in other suitable laser processing procedures such as laser engraving.
The embodiment of the utility model provides a laser beam shaping device, as shown in fig. 1 and fig. 2, this laser beam shaping device includes laser instrument 101, adjusting part (not marked in the figure), spatial light modulator 106, first convex lens 108, second convex lens 111, focusing objective 112 and work platform 114 that set gradually; the laser 101 is mainly used for outputting a single Gaussian beam, and the adjusting component is mainly used for adjusting the diameter and the energy of the laser; laser emitted by the laser 101 is adjusted by the adjusting component, and a laser beam is incident on the spatial light modulator 106 to generate spatially shaped laser; the shaped laser sequentially passes through the first convex lens 108 and the second convex lens 111 to be incident to the focusing objective lens 112, and is focused by the focusing objective lens 112 to irradiate on a material to be processed of the working platform 114; the spatial light modulator 106 is configured to load a phase diagram, spatially shape the laser, and shape a single light beam into at least one spatially distributed light beam for output; the spatial light modulator 106, the first convex lens 108, the second convex lens 111 and the focusing objective lens 112 together form a 4F system; the work platform 114 is used to mount the material 113 to be processed.
It can be understood that the working principle of the laser beam shaping device is roughly as follows: according to the shaping requirement of laser grooving processing, different phase diagrams are introduced into the spatial light modulator 106 for phase modulation. Wherein, the loading phase of the spatial light modulator 106 is set to be a specific phase for splitting a single gaussian beam laser into multiple beams, and laser parameters (power, repetition frequency, processing speed and the like) are adjusted to control indexes of groove width, groove depth, groove shape and the like of laser grooving processing; the laser energy range is set through the adjusting assembly to ensure that the laser energy density does not damage the spatial light modulator 106 due to the fact that the laser energy density exceeds the threshold value of the spatial light modulator 106, and the damage threshold value of the material 113 to be processed can be reached so as to carry out laser grooving processing; the shape of the beam before focusing is adjusted through shaping so as to adjust the width of the laser grooving.
Compared with the prior art, the laser beam shaping device at least has the following beneficial effects: first, the laser grooving beam shaping device of the present invention, when applied to laser grooving processing, can effectively avoid beam splitting heterogeneity caused by the gaussian distribution of the laser itself, and realize the improvement of the uniformity and quality of the wide light spot; secondly, the shapes of double thin light spots or wide light spots can be freely switched through the change of the loading phase of the spatial light modulator 106, the quantity and the distribution of the wide light spots can be freely regulated, various elements do not need to be configured, and the height adjustability is realized; thirdly, the high-precision wide light spot array can be processed at one time through light beam shaping, and the positioning error between the wide light spots caused by a mechanical structure can be avoided while the efficiency is improved.
In order to make the technical solution of the present invention better understood, the technical solution of the embodiment of the present invention will be clearly and completely described below with reference to fig. 1 to 6.
In one embodiment, as shown in FIG. 1, the adjustment assembly includes a beam expander 102 and an energy adjustment system (not shown) disposed in sequence along the same optical axis; the beam expander 102 is used for increasing or decreasing the beam waist radius of the light spot output by the laser 101, so that the light spot can fill the liquid crystal screen of the spatial light modulator 106 as much as possible; the laser energy is freely adjusted, and the polarization direction of the emergent laser is horizontal. Specifically, the energy adjusting system comprises a half-wave plate 103 and a light splitting crystal 104, wherein the half-wave plate 103 is used for freely adjusting the laser energy, and the light splitting crystal 104 is used for enabling the polarization direction of the emergent laser to be horizontal. One side of the dispersing crystal 104 is provided with a light barrier 105 for eliminating the laser beam in the vertical polarization direction, and the light barrier 105 can eliminate the laser beam in the other polarization direction of the dispersing crystal 104 and the energy thereof.
In this embodiment, the spatial light modulator 106 is configured to shape a single light spot into a plurality of light spots with adjustable pitches, and in other embodiments, the spatial light modulator 106 is configured to shape a light spot into a flat-top light spot, a rectangular light spot, an elliptical light spot, or a special-shaped light spot. The shapes of the double fine light spots and the wide light spots (rectangular Gaussian spots, elliptical Gaussian spots or flat-top light spots) can be freely switched through the change of the loading phase of the spatial light modulator 106, the number and the distribution of the wide light spots can be freely regulated, various elements do not need to be configured, and the height adjustability is realized.
As shown in fig. 1 and 2, the first convex lens 108 and the second convex lens 111 are double-convex lenses, the focal length of the double-convex lenses is short, and the space volume of the laser beam shaping device can be saved, the first convex lens 108 and the second convex lens 111 are provided with antireflection films, the antireflection films can reduce or eliminate the reflected light on the surfaces of the first convex lens 108 and the second convex lens 111, so as to increase the light transmission amount of the first convex lens 108 and the second convex lens 111, and reduce or eliminate the stray light of the system, and the applicable wavelength of the antireflection films is within the range of 0.2 μm to 10.6 μm. The focal length of the first convex lens 108 is f1, the focal length of the second convex lens 111 is f2, the spatial light modulator 106 and the distance between the first convex lens 108 is f1, the distance between the first convex lens 108 and the second convex lens 111 is f1+ f2, and the distance between the second convex lens 111 and the focusing objective lens 112 is f 2. The beam quality is optimized through a 4F system, so that the light field modulated by the spatial light modulator 106 has no diffraction effect before reaching the focusing objective lens 112, the first convex lens 108 and the second convex lens 111 jointly form a beam contracting/expanding system of the spatial light beam, the beam waist radius of the laser spot is adjusted, and the ratio of the spot size on the spatial light modulator 106 to the spot size on the focusing objective lens 112 is F1/F2.
Further, an adjustable diaphragm 109 is arranged between the first convex lens 108 and the second convex lens 111, the adjustable diaphragm 109 is located on a light path from the first convex lens 108 to the second convex lens 111, and a light path distance between the adjustable diaphragm 109 and the first convex lens 108 is f 1. In particular, the aperture size of the adjustable diaphragm 109 is adjustable for removing higher order diffraction from the spatial light modulator 106.
Further, in order to reduce the floor area of the laser beam shaping device, a first reflective mirror is rotatably disposed between the spatial light modulator 106 and the first convex lens 108, and the first reflective mirror is used for reflecting the spatially shaped laser light generated by the spatial light modulator 106 to the first convex lens 108; a second reflective mirror is rotatably arranged between the adjustable diaphragm 109 and the second convex lens 111, and the second reflective mirror is used for reflecting the laser limited by the adjustable diaphragm 109 to the second convex lens 111. The first reflective mirror and the second reflective mirror can reflect at a full angle, so that light path transmission is facilitated.
Further, a galvanometer component (not shown in the figure) for controlling the laser to move on the material to be processed is arranged on the focusing objective 112, so that the material to be processed by the laser can be conveniently controlled, and the processing requirement can be met.
Further, the work platform 114 is provided with a moving assembly (not shown) for moving the material. In this embodiment, the moving assembly may be an X-axis screw module (not shown) and a Y-axis screw module (not shown), the working platform 114 is disposed on the Y-axis screw module, the Y-axis screw module is disposed on the X-axis screw module, and the moving assembly controls the movement of the working platform 114 to move the material. In other embodiments, the moving assembly is disposed on the working platform 114, and the moving assembly may be an X-axis cylinder (not shown) and a Y-axis cylinder (not shown), and the moving assembly directly pushes the material to move.
Further, in order to improve the automation level of the laser beam shaping device, the laser beam shaping device further comprises a control module 115 for controlling the operation of the laser 101, the spatial light modulator 106 and the working platform 114. Specifically, the control module 115 stores a computer program, which can be executed to control one or more of the laser 101, the spatial light modulator 106, and the working platform 114 to work, and includes a moving component disposed on the working platform 114, and the moving component drives the working platform 114 or the material to be processed to move through the moving mechanism; or the control module 115 performs laser grooving on the material on the working platform 114 by adjusting the height or the focusing position of the laser 101; or the control module 115 controls the galvanometer component, and the laser is controlled to move on the material to be processed by the galvanometer mechanism.
The present invention will be further described with reference to the accompanying drawings and specific embodiments.
Here, a preferred embodiment is set, and grooving is performed on the material under the following processing conditions.
Wavelength: 532nm
Repetition frequency < 1000kHz
Pulse width: 30ps
The diameter of the light spot: 5mm
Light field distribution: gaussian distribution
Embodiment one of the laser beam shaping device of the utility model
In this embodiment, as shown in fig. 1 and 3, a single gaussian beam is spatially shaped to obtain a double gaussian beam.
The first embodiment comprises the following specific processing steps: and (3) putting each light path element into the optical platform according to the diagram shown in figure 1 to build a light path, and adjusting the collimation of the light path. After the optical path adjustment is completed, the laser pulse repetition frequency of the laser is set to 1000kHz, and after twice expansion by the beam expander 102, a gaussian beam with a diameter of 10mm is incident on the liquid crystal screen of the spatial light modulator 106. The corresponding double-Gaussian beam phase map is loaded on the spatial light modulator 106, and then the light field is transmitted to the upper part of the focusing objective 112 through the 4F system without diffraction, and the light spot is shaped into two phi 8mm Gaussian beams with adjustable intervals at the moment, as shown in FIG. 3. Finally, the shaping light spot is acted on the material 113 to be processed fixed on the working platform 114 through the focusing objective 112, so as to realize the double-thin-line cutting of the laser grooving processing.
Embodiment two of the laser beam shaping device of the utility model
In this embodiment, as shown in fig. 1 and 4, the gaussian beam is spatially shaped to obtain a square flat-topped spot.
The second embodiment comprises the following specific processing steps: and (3) putting each light path element into the optical platform according to the diagram shown in figure 1 to build a light path, and adjusting the collimation of the light path. After the optical path adjustment is completed, the laser pulse repetition frequency of the laser is set to be 500kHz, and after the laser pulse repetition frequency is doubled by the beam expander 102, a 10 mm-phi Gaussian beam is incident on the liquid crystal screen of the spatial light modulator 106. The corresponding flat-topped spot phase map is loaded on the spatial light modulator 106, and then the light field is transmitted above the focusing objective 112 through the 4F system without diffraction, at this time, the gaussian beam is shaped into a square flat-topped spot, and the spot size is adjustable within the range of 15um-100um, as shown in fig. 4. Finally, the shaping light spot is acted on the material 113 to be processed fixed on the working platform 114 through the focusing objective 112, so as to realize the wide light spot grooving processing.
Embodiment three of the laser beam shaping device of the utility model
In this embodiment, as shown in fig. 1 and fig. 5, the gaussian beam is spatially shaped to obtain a dual flat-top spot with an adjustable pitch and a size of 200um × 200 um.
The third embodiment comprises the following specific processing steps: and (3) putting each light path element into the optical platform according to the diagram shown in figure 1 to build a light path, and adjusting the collimation of the light path. After the optical path adjustment is completed, the laser pulse repetition frequency of the laser is set to be 500kHz, and after the laser pulse repetition frequency is doubled by the beam expander 102, a 10 mm-phi Gaussian beam is incident on the liquid crystal screen of the spatial light modulator 106. The corresponding double flat-top spot phase map is loaded on the spatial light modulator 106, and then the light field is transmitted to the upper part of the focusing objective 112 through the 4F system without diffraction, at this time, the gaussian beam is shaped into two 200um × 200um flat-top spots, and the spot pitch is adjustable, as shown in fig. 5 (a), (b). Finally, the shaping light spot is acted on the material 113 to be processed fixed on the working platform 114 through the focusing objective lens 112, so as to realize the grooving processing with wide light spot, high efficiency, high quality and high flexibility.
The embodiment of the laser beam shaping device of the utility model is four
In this embodiment, as shown in fig. 1 and fig. 6, the gaussian beam is spatially shaped to obtain a dual flat-top spot with an adjustable pitch and a size of 300um × 300 um.
The fourth embodiment comprises the following specific processing steps: and (3) putting each light path element into the optical platform according to the diagram shown in figure 1 to build a light path, and adjusting the collimation of the light path. After the optical path adjustment is completed, the laser pulse repetition frequency of the laser is set to be 500kHz, and after the laser pulse repetition frequency is doubled by the beam expander 102, a 10 mm-phi Gaussian beam is incident on the liquid crystal screen of the spatial light modulator 106. The corresponding double flat-top spot phase map is loaded on the spatial light modulator 106, and then the light field is transmitted to the upper side of the focusing objective 112 through the 4F system without diffraction, at this time, the gaussian beam is shaped into two 300um × 300um flat-top spots, and the spot pitch is adjustable, as shown in (a), (b) in fig. 6. Finally, the shaping light spot is acted on the material 113 to be processed fixed on the working platform 114 through the focusing objective lens 112, so as to realize the grooving processing with wide light spot, high efficiency, high quality and high flexibility.
In summary, compared with the prior art, in the embodiment, the laser beam shaping device at least has the following beneficial effects:
first, the laser grooving beam shaping device of the present invention, when applied to laser grooving processing, can effectively avoid beam splitting heterogeneity caused by the gaussian distribution of the laser itself, and realize the improvement of the uniformity and quality of the wide light spot;
secondly, the number, the morphology and the distribution of light spots can be freely regulated and controlled through the change of the loaded phase of the spatial light modulator 106, and various elements do not need to be configured, so that the height adjustability is realized;
thirdly, the high-precision wide light spot array can be processed at one time through light beam shaping, and the positioning error between the wide light spots caused by a mechanical structure can be avoided while the efficiency is improved.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. A laser beam shaping device, comprising:
the laser device, the adjusting component for adjusting the diameter of the laser, the spatial light modulator, the first convex lens, the second convex lens, the focusing objective lens and the working platform for loading materials to be processed are sequentially arranged along a laser light path; wherein the content of the first and second substances,
laser emitted by the laser is adjusted by the adjusting component and then is incident on the spatial light modulator to generate spatially shaped laser; the shaped space shaping laser is incident to the focusing objective lens through the first convex lens and the second convex lens in sequence, and then is focused and irradiated on the material to be processed of the working platform through the focusing objective lens;
the spatial light modulator is used for spatially shaping the incident single laser beam into at least one spatially distributed laser beam through the loaded phase diagram and emitting the laser beam;
spatial light modulator, first convex lens, second convex lens and focus objective constitute 4F system jointly, the focus of first convex lens is F1, the focus of second convex lens is F2, spatial light modulator with distance between the first convex lens is F1, distance between first convex lens and the second convex lens is F1+ F2, distance between second convex lens and the focus objective is F2.
2. The laser beam shaping device according to claim 1, wherein the adjustment assembly comprises a beam expander and an energy adjustment system arranged in sequence along the same optical axis; wherein the content of the first and second substances,
the beam expander is positioned between the laser and the energy adjusting system and is used for adjusting the beam waist radius of the laser output light spot;
the energy adjusting system is used for freely adjusting the laser energy and enabling the polarization direction of the emergent laser to be horizontal.
3. The laser beam shaping device according to claim 2, wherein the energy adjusting system comprises a half-wave plate for freely adjusting the laser energy and a beam splitter crystal for leveling the polarization direction of the outgoing laser light, and the beam expander, the half-wave plate, the beam splitter crystal and the spatial light modulator are arranged in sequence along the same optical axis.
4. The laser beam shaping device according to claim 3, wherein one side of the beam splitting crystal is provided with a light barrier for eliminating the laser beam in the vertical polarization direction.
5. The laser beam shaping device according to claim 1, wherein the first and second convex lenses are double convex lenses, and antireflection films are disposed on incident surfaces of the first and second convex lenses.
6. The laser beam shaping device according to claim 1, wherein an adjustable diaphragm is disposed between the first convex lens and the second convex lens, the spatially shaped laser light emitted from the first convex lens is incident on the second convex lens via the adjustable diaphragm, an optical path distance between the adjustable diaphragm and the first convex lens is equal to a focal length of the first convex lens, and an optical path distance between the adjustable diaphragm and the second convex lens is equal to a focal length of the second convex lens.
7. The laser beam shaping device according to claim 6, wherein a first mirror is rotatably disposed between the spatial light modulator and the first convex lens, the first mirror being configured to reflect the spatially shaped laser light generated by the spatial light modulator to the first convex lens; and a second reflector is rotatably arranged between the adjustable diaphragm and the second convex lens and used for reflecting the laser beam adjusted by the adjustable diaphragm to the second convex lens.
8. The laser beam shaping device according to any one of claims 1 to 7, wherein the spatial light modulator is configured to shape a single spot into at least two spots with adjustable pitch, or the spatial light modulator is configured to shape a spot into a flat-topped spot, a rectangular spot, an elliptical spot, or a shaped spot.
9. The laser beam shaping device according to any one of claims 1 to 7, wherein the working platform is provided with a moving assembly for moving the material to be processed such that the laser beam incident on the material to be processed can be moved relatively with respect to the material to be processed.
10. The laser beam shaping device according to any one of claims 1 to 7, further comprising a control module for controlling the operation of the laser, the spatial light modulator, and the work platform.
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| CN113960826A (en) * | 2021-06-10 | 2022-01-21 | 北京航空航天大学 | Beam shaping method and device for pumping laser |
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| CN113252536A (en) * | 2021-05-13 | 2021-08-13 | 长春长光辰英生物科学仪器有限公司 | Ejection sorting device and ejection sorting method |
| CN113252536B (en) * | 2021-05-13 | 2024-04-16 | 长春长光辰英生物科学仪器有限公司 | Ejection sorting device and ejection sorting method |
| CN113960826A (en) * | 2021-06-10 | 2022-01-21 | 北京航空航天大学 | Beam shaping method and device for pumping laser |
| CN113960826B (en) * | 2021-06-10 | 2023-12-22 | 北京航空航天大学 | Beam shaping method and device for pumping laser |
| WO2023024449A1 (en) * | 2021-08-27 | 2023-03-02 | 苏州大学 | Apparatus and method for generating dynamically adjustable tophat beam |
| CN114260601A (en) * | 2021-12-22 | 2022-04-01 | 江苏荣生电子有限公司 | Multi-beam ultrafast laser continuous precise uniform hole distribution method and device for capacitor electrode foil |
| CN114326327A (en) * | 2021-12-31 | 2022-04-12 | 南方科技大学 | Photoetching system and method |
| CN116184681A (en) * | 2023-04-27 | 2023-05-30 | 成都莱普科技股份有限公司 | Beam shaping device and beam shaping method for carbon dioxide laser |
| CN116184681B (en) * | 2023-04-27 | 2023-08-04 | 成都莱普科技股份有限公司 | Beam shaping device and beam shaping method for carbon dioxide laser |
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