CN114656895A - 一种用于车载水冷板的pi压敏胶带及其制备方法 - Google Patents
一种用于车载水冷板的pi压敏胶带及其制备方法 Download PDFInfo
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 100
- 238000001816 cooling Methods 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title claims description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 112
- 239000003063 flame retardant Substances 0.000 claims abstract description 112
- 239000010410 layer Substances 0.000 claims abstract description 79
- 239000011347 resin Substances 0.000 claims abstract description 57
- 229920005989 resin Polymers 0.000 claims abstract description 57
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000002904 solvent Substances 0.000 claims abstract description 23
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 17
- 238000001035 drying Methods 0.000 claims abstract description 11
- 238000009413 insulation Methods 0.000 claims abstract description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 24
- 239000004925 Acrylic resin Substances 0.000 claims description 13
- 229920000178 Acrylic resin Polymers 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 11
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 9
- 239000004593 Epoxy Substances 0.000 claims description 9
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 9
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052698 phosphorus Inorganic materials 0.000 claims description 7
- 239000011574 phosphorus Substances 0.000 claims description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 4
- 239000003085 diluting agent Substances 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 238000013329 compounding Methods 0.000 claims description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 claims description 2
- 150000004692 metal hydroxides Chemical class 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 2
- 238000007731 hot pressing Methods 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 13
- 238000012360 testing method Methods 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005587 bubbling Effects 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007706 flame test Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
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Abstract
一种用于车载水冷板的PI压敏胶带,包括PI基材膜、阻燃压敏胶粘层和单面离型层,所述阻燃压敏胶粘层位于PI基材膜和单面离型层之间;所述阻燃压敏胶粘层由阻燃压敏胶粘剂烘干获得,此阻燃压敏胶粘剂由以下重量份组分组成:主体树脂50‑100份、增粘树脂10‑30份、固化剂0.01‑1份、阻燃剂1‑30份、溶剂30‑50份。本发明用于车载水冷板的PI压敏胶带无需热压,能够极好地贴附于在水冷板表面,达到绝缘、阻燃的效果,以提高电池包的整体安全性,并且操作简单,使用便利。
Description
技术领域
本发明属于压敏胶带技术领域,尤其涉及一种用于车载水冷板的PI压敏胶 带及其制备方法。
背景技术
近年来,随着新能源汽车的高速发展,对新能源汽车的性能与安全性提出 来越来越高的要求。电池包作为新能源汽车的心脏,为整车提供动力,而动力 电池在充放电过程中会释放大量热,造成电池包内部温度上升。目前市场上大 多采用水冷板对电池模组进行冷却。为了保证导热性,水冷板一般为金属铝材 质,因此需对水冷板进行绝缘处理,以防止电池组短路。因此,如何开发一种 绝缘阻燃性能优异的胶带,成为本领域技术人员努力的方向。
发明内容
本发明目的在于提供一种用于车载水冷板的PI压敏胶带,该用于车载水冷 板的PI压敏胶带无需热压,能够极好地贴附于在水冷板表面,达到绝缘、阻燃 的效果,以提高电池包的整体安全性,并且操作简单,使用便利。
为达到上述目的,本发明采用的技术方案是:一种用于车载水冷板的PI压 敏胶带,包括PI基材膜、阻燃压敏胶粘层和单面离型层,所述阻燃压敏胶粘层 位于PI基材膜和单面离型层之间;
所述阻燃压敏胶粘层由阻燃压敏胶粘剂烘干获得,此阻燃压敏胶粘剂由以 下重量份组分组成:主体树脂50-100份、增粘树脂10-30份、固化剂0.01-1份、 阻燃剂1-30份、溶剂30-50份。
上述技术方案中进一步改进的技术方案如下:
1.上述方案中,所述主体树脂为丙烯酸树脂、环氧改性丙烯酸树脂、聚氨 酯中的任意一种或至少两种的混合物。
2.上述方案中,所述增粘树脂为芳香族树脂、松香改性酚醛树脂和改性松 香树脂中的任意一种或至少两种的混合物。
3.上述方案中,所述阻燃剂为磷系阻燃剂、氮系阻燃剂、硅系阻燃剂、金 属氢氧化物阻燃剂、金属氧化物阻燃剂、阻燃型丙烯酸树脂和金属硼化物阻燃 剂中的任意一种或至少两种的混合物。
4.上述方案中,所述溶剂为乙酸乙酯、丁酮、环己酮、乙酸丁酯和丙酮中 的任意一种或至少两种的混合物。
5.上述方案中,所述PI基材层厚度为50-100μm,所述胶层厚度为 25-100μm,所述离型材层厚度为25-100μm。
本发明的另一技术方案为:一种用于车载水冷板的PI压敏胶带的制备方法, 包括以下步骤:
S1、制备阻燃压敏胶粘剂:取部分溶剂,在其中加入固化剂0.01-1份,搅 拌得稀释液,然后在剩余溶剂中加入阻燃剂1-30份,搅拌分散得分散液;
在反应釜中加入主体树脂50-100份与增粘树脂10-30份,然后将稀释液与 分散液依次加入,在20~40℃温度下,以600~900转/min的搅拌速度搅拌1~2H, 得到阻燃压敏胶黏剂;
S2、涂布:将S1得到的阻燃压敏胶黏剂通过刮刀均匀涂敷在PI基材膜上, 经烘箱干燥后,在PI基材膜上形成阻燃压敏胶粘层,与单面离型层复合,得到 PI压敏胶带。
本发明的另一技术方案为:上述PI压敏胶带,用于车载水冷板的绝缘保护。
由于上述技术方案的运用,本发明与现有技术相比具有下列优点:
1、本发明用于车载水冷板的PI压敏胶带,其由PI基材膜层、阻燃压敏胶 粘层、单面离型层三部分组成,可直接贴附于水冷板表面,服帖性优异,长时 间放置不易与水冷板局部分离鼓泡,绝缘阻燃性良好,可有效提高电池包安全 性。
2、本发明用于车载水冷板的PI压敏胶带,其选用的主体树脂对铝板粘着性 良好,可使PI压敏胶带有效被贴于水冷板上;进一步地,选用的增粘树脂与聚 合物相容性良好,多为小分子,利于胶体的流动,以充分浸润水冷板表面,通 过调整增粘树脂添加量,可调整PI压敏胶带对铝板的黏着力;进一步地,根据 阻燃性的要求,可适当调整阻燃剂的含量。
具体实施方式
实施例1
一种用于车载水冷板的PI压敏胶带,所述PI压敏胶带包括PI基材膜、阻 燃压敏胶粘层和单面离型层,所述阻燃压敏胶粘层位于PI基材膜和单面离型层 之间,所述PI基材膜层厚度为100μm、阻燃压敏胶粘层厚度为50μm、单面离 型材层厚度为25μm,所述阻燃压敏胶粘层由阻燃压敏胶粘剂烘干获得,此阻燃 压敏胶粘剂由以下重量份组分组成:主体树脂80份,增粘树脂20份,固化剂 0.3份,阻燃剂30份,溶剂30份。
所述主体树脂为丙烯酸树脂;所述增粘树脂为芳香族树脂和松香改性酚醛 树脂的混合物;所述固化剂为改性环氧化合物;所述阻燃剂为磷系阻燃剂;所 述溶剂为乙酸乙酯。
实施例2
一种用于车载水冷板的PI压敏胶带,所述PI压敏胶带包括PI基材膜、阻 燃压敏胶粘层和单面离型层,所述阻燃压敏胶粘层位于PI基材膜和单面离型层 之间,所述PI基材膜层厚度为100μm、阻燃压敏胶粘层厚度为50μm、单面离 型材层厚度为25μm,所述阻燃压敏胶粘层由阻燃压敏胶粘剂烘干获得,此阻燃 压敏胶粘剂由以下重量份组分组成:主体树脂75份,增粘树脂25份,固化剂 0.25份,阻燃剂20份,溶剂35份。
所述主体树脂为丙烯酸树脂;所述增粘树脂为芳香族树脂和松香改性酚醛 树脂的混合物;所述固化剂为改性环氧化合物;所述阻燃剂为磷系阻燃剂;所 述溶剂为乙酸乙酯。
实施例3
一种用于车载水冷板的PI压敏胶带,所述PI压敏胶带包括PI基材膜、阻 燃压敏胶粘层和单面离型层,所述阻燃压敏胶粘层位于PI基材膜和单面离型层 之间,所述PI基材膜层厚度为100μm、阻燃压敏胶粘层厚度为50μm、单面离 型材层厚度为25μm,所述阻燃压敏胶粘层由阻燃压敏胶粘剂烘干获得,此阻燃 压敏胶粘剂由以下重量份组分组成:主体树脂100份,增粘树脂10份,固化剂 0.1份,阻燃剂30份,溶剂30份。
所述主体树脂为丙烯酸树脂;所述增粘树脂为芳香族树脂和松香改性酚醛 树脂的混合物,所述固化剂为改性环氧化合物;所述阻燃剂为磷系阻燃剂;所 述溶剂为乙酸乙酯。
实施例4
一种用于车载水冷板的PI压敏胶带,所述PI压敏胶带包括PI基材膜、阻 燃压敏胶粘层和单面离型层,所述阻燃压敏胶粘层位于PI基材膜和单面离型层 之间,所述PI基材膜层厚度为100μm、阻燃压敏胶粘层厚度为50μm、单面离 型材层厚度为25μm,所述阻燃压敏胶粘层由阻燃压敏胶粘剂烘干获得,此阻燃 压敏胶粘剂由以下重量份组分组成:主体树脂80份,增粘树脂20份,固化剂 0.3份,阻燃剂20份,溶剂30份。
所述主体树脂为环氧改性丙烯酸树脂;所述增粘树脂为芳香族树脂和松香 改性酚醛树脂的混合物;所述固化剂为改性多异氰酸酯;所述阻燃剂为磷系阻 燃剂;所述溶剂为乙酸乙酯。
实施例5
一种用于车载水冷板的PI压敏胶带,所述PI压敏胶带包括PI基材膜、阻 燃压敏胶粘层和单面离型层,所述阻燃压敏胶粘层位于PI基材膜和单面离型层 之间,所述PI基材膜层厚度为100μm、阻燃压敏胶粘层厚度为50μm、单面离 型材层厚度为25μm,所述阻燃压敏胶粘层由阻燃压敏胶粘剂烘干获得,此阻燃 压敏胶粘剂由以下重量份组分组成:主体树脂70份,增粘树脂30份,固化剂 1.0份,阻燃剂30份,溶剂35份。
所述主体树脂为环氧改性丙烯酸树脂;所述增粘树脂为芳香族树脂和松香 改性酚醛树脂的混合物;所述固化剂为改性多异氰酸酯;所述阻燃剂为磷系阻 燃剂;所述溶剂为乙酸乙酯。
实施例6
一种用于车载水冷板的PI压敏胶带,所述PI压敏胶带包括PI基材膜、阻 燃压敏胶粘层和单面离型层,所述阻燃压敏胶粘层位于PI基材膜和单面离型层 之间,所述PI基材膜层厚度为100μm、阻燃压敏胶粘层厚度为50μm、单面离 型材层厚度为25μm,所述阻燃压敏胶粘层由阻燃压敏胶粘剂烘干获得,此阻燃 压敏胶粘剂由以下重量份组分组成:主体树脂85份,增粘树脂15份,固化剂 0.5份,阻燃剂30份,溶剂35份。
所述主体树脂为环氧改性丙烯酸树脂;所述增粘树脂为芳香族树脂和改性 松香树脂;所述固化剂为改性环氧化合物;所述阻燃剂为氮系阻燃剂;所述溶 剂为乙酸乙酯。
对比例1
本对比例与实施例1的区别在于,PI基材膜层的厚度为125μm,阻燃压敏 胶粘剂层的厚度为25μm,其他的与实施例1均相同。
对比例2
本对比例与实施例1的区别在于,主体树脂为硅胶,其他的与实施例1均 相同。
对比例3
本对比例与实施例1的区别在于,阻燃剂的添加量为0份,减少的阻燃剂 用量按比例增加至其余组分,以保证总量不变,其他的与实施例1均相同。
对比例4
本对比例与实施例1的区别在于,增粘树脂的添加量为0份,减少的增粘 树脂用量按比例增加至其余组分,以保证总量不变,其他的与实施例1均相同
对上述实施例1-6和对比例1-4中PI压敏胶带的性能进行测试,测试项目 与方法包括:
(1)厚度:使用千分尺对PI基材膜与阻燃压敏胶粘剂层厚度进行测量。具 体测试标准参照GB/T 7125-2014;
(2)剥离强度:将PI压敏胶带裁切成24mm宽幅样条,尺寸为 24mm*125mm,贴合铝板静置20min后,在25℃室温下测试180°剥离力,剥离 速率为300mm/min,单位为N/24mm,测试仪器为日本岛津万能拉力机AGS J。 具体测试标准参照GB/T 2792-2014;
(3)绝缘性:击穿电压测试,升压速率为0.5KV/s。具体测试标准参照GB/T 1408.1-2016;
(4)阻燃性:将PI压敏胶带裁切成13mm宽幅样条,尺寸为125mm*13mm, 依据UL94标准,进行燃烧测试。依据标准判定阻燃等级。
(5)可靠性:将PI压敏胶带直接贴附在车载水冷板表面,在25℃室温下 静置168H,观察是否发生局部胶带与水冷板界面分离,产生鼓泡不良。
测试结果如下:
表2
可靠性评价:
◇:表示可靠性OK,满足使用要求;×:表示可靠性较差。
从上述测试结果可看出:
本发明可以有效地贴附在车载水冷板上,绝缘阻燃性能优异,服帖性好, 有利于提高电池包的安全性能。
对比例1中增加了PI基材膜的厚度,降低了压敏胶的胶厚,会导致黏着力 与可靠性下降。
对比例2中使用硅胶替代丙烯酸树脂做主体树脂,会导致黏着力与可靠性 下降。
对比例3中不使用阻燃剂,会导致阻燃性的下降。
对比例4中不使用增粘树脂,会导致黏着力与可靠性的下降。
上述实施例只为说明本发明的技术构思及特点,其目的在于让熟悉此项技 术的人士能够了解本发明的内容并据以实施,并不能以此限制本发明的保护范 围。凡根据本发明精神实质所作的等效变化或修饰,都应涵盖在本发明的保护 范围之内。
Claims (8)
1.一种用于车载水冷板的PI压敏胶带,其特征在于:包括PI基材膜、阻燃压敏胶粘层和单面离型层,所述阻燃压敏胶粘层位于PI基材膜和单面离型层之间;
所述阻燃压敏胶粘层由阻燃压敏胶粘剂烘干获得,此阻燃压敏胶粘剂由以下重量份组分组成:主体树脂50-100份、增粘树脂10-30份、固化剂0.01-1份、阻燃剂1-30份、溶剂30-50份。
2.根据权利要求1所述的用于车载水冷板的PI压敏胶带,其特征在于:所述主体树脂为丙烯酸树脂、环氧改性丙烯酸树脂、聚氨酯中的任意一种或至少两种的混合物。
3.根据权利要求1所述的用于车载水冷板的PI压敏胶带,其特征在于:所述增粘树脂为芳香族树脂、松香改性酚醛树脂和改性松香树脂中的任意一种或至少两种的混合物。
4.根据权利要求1所述的用于车载水冷板的PI压敏胶带,其特征在于:所述阻燃剂为磷系阻燃剂、氮系阻燃剂、硅系阻燃剂、金属氢氧化物阻燃剂、金属氧化物阻燃剂、阻燃型丙烯酸树脂和金属硼化物阻燃剂中的任意一种或至少两种的混合物。
5.根据权利要求1所述的用于车载水冷板的PI压敏胶带,其特征在于:所述溶剂为乙酸乙酯、丁酮、环己酮、乙酸丁酯和丙酮中的任意一种或至少两种的混合物。
6.根据权利要求1所述的用于车载水冷板的PI压敏胶带,其特征在于:所述PI基材层厚度为50-100μm,所述胶层厚度为25-100μm,所述离型材层厚度为25-100μm。
7.一种权利要求1~6中任一项所述的用于车载水冷板的PI压敏胶带的制备方法,其特征在于:包括以下步骤:
S1、制备阻燃压敏胶粘剂:取部分溶剂,在其中加入固化剂0.01-1份,搅拌得稀释液,然后在剩余溶剂中加入阻燃剂1-30份,搅拌分散得分散液;
在反应釜中加入主体树脂50-100份与增粘树脂10-30份,然后将稀释液与分散液依次加入,在20~40℃温度下,以600~900转/min的搅拌速度搅拌1~2H,得到阻燃压敏胶黏剂;
S2、涂布:将S1得到的阻燃压敏胶黏剂通过刮刀均匀涂敷在PI基材膜上,经烘箱干燥后,在PI基材膜上形成阻燃压敏胶粘层,与单面离型层复合,得到PI压敏胶带。
8.一种权利要求1所述的PI压敏胶带,其特征在于:所述PI压敏胶带用于车载水冷板的绝缘保护。
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