CN114643650B - Ring removing workbench for TAIKO wafer processing - Google Patents
Ring removing workbench for TAIKO wafer processing Download PDFInfo
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- CN114643650B CN114643650B CN202210235637.3A CN202210235637A CN114643650B CN 114643650 B CN114643650 B CN 114643650B CN 202210235637 A CN202210235637 A CN 202210235637A CN 114643650 B CN114643650 B CN 114643650B
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- fixedly connected
- frame
- connecting plate
- plate
- module
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- 238000001179 sorption measurement Methods 0.000 claims abstract description 20
- 239000012528 membrane Substances 0.000 claims 1
- 238000000926 separation method Methods 0.000 abstract description 5
- 239000002699 waste material Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 48
- 238000004519 manufacturing process Methods 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a de-ringing workbench for TAIKO wafer processing, which comprises a workbench surface, a module, a support frame, a fixed groove and an air cylinder, wherein the bottom end of the workbench surface is fixedly connected with the support frame, and the bottom end of the support frame is fixedly connected with a base. According to the invention, the limiting plate, the second fixing plate and the pushing block are arranged, the frame containing the wafer is conveyed onto the adsorption positioning disc through the last manipulator, the module and the sliding block drive the outer frame to move upwards, the wafer and the adsorption positioning disc are concentric through the last manipulator, then the wafer and the film are sucked through the vacuum generator and are conveyed into the adsorption positioning disc and the outer frame, then the connecting seat is driven through the air cylinder, the second fixing plate enables the second fixing plate to hold the frame, and then the outer frame is driven to move downwards through the module and the sliding block, so that the outer frame and the adsorption positioning disc have a certain distance, the next manipulator is convenient to take away wafer waste, the ring removing efficiency and the ring removing precision are effectively improved, and the quality of wafer separation is improved.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a de-ringing workbench for TAIKO wafer processing.
Background
The wafer process is a production process, and in terms of large scale, the wafer production comprises two steps of crystal bar manufacture and wafer manufacture, and the wafer process can be subdivided into the following main processes (wherein the crystal bar manufacture only comprises the following first process, and the rest is all wafer manufacture, so that the wafer process is sometimes called as post wafer post-slicing treatment process in a generic way), and the wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and the original material of the wafer is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished, and sliced to form a silicon wafer, i.e., a wafer.
The existing ring-removing workbench for TAIKO wafer processing often needs manual assistance for separation when in use, but the separation method has low efficiency and is easy to cause damage to the wafer.
Therefore, there is a need for a de-chucking table for TAIKO wafer processing that solves the above problems.
Disclosure of Invention
The invention aims to provide a ring-removing workbench for TAIKO wafer processing, which solves the problems that the ring-removing workbench for TAIKO wafer processing in the prior art is often used and needs to be separated by manual assistance, but the separation method has low efficiency and is easy to cause damage to wafers.
In order to achieve the above object, the present invention provides the following technical solutions: the air cylinder is fixedly connected with the bottom of the working table and the output end of the module, the bottom fixedly connected with base of the support frame, one side of the support frame is fixedly connected with a first fixing plate through a bolt, one side of the first fixing plate is fixedly connected with the module through a bolt, the other side of the working table is fixedly connected with a third fixing plate through a bolt, the third fixing plate is fixedly connected with a sliding block through a bolt, the bottom of the working table is fixedly connected with a third connecting plate, the top of the third connecting plate is fixedly connected with a second fixing plate, the top of the second fixing plate is fixedly connected with a first connecting plate, the top of the first connecting plate is fixedly connected with an adsorption positioning plate, the top of the working table is provided with an outer frame, the inside of the outer frame is provided with a fixing groove, the top of the working table is provided with a sliding groove, the inside of the mounting groove is fixedly connected with a connecting seat, the connecting seat is fixedly connected with the air cylinder is fixedly connected with an output end of the first connecting plate, the top of the air cylinder is fixedly connected with an outer frame fixedly connected with a limit piece, the top of the air cylinder is fixedly connected with a limit piece fixedly connected with the top of the air cylinder is fixedly connected with an outer frame, and the limit piece is fixedly connected with the top of the air cylinder is fixedly connected with a limit piece.
Preferably, the module drives the workbench to move up and down through the motor, the adsorption positioning disc is respectively connected with the first connecting plate, the second connecting plate and the third connecting plate, and the adsorption positioning disc adsorbs and positions the wafer.
Preferably, the module passes through electric connection with the fourth fixed plate, adsorb the output interconnect of positioning disk and slider, the cylinder passes through electric connection with the module, slider and module pass through electric connection, conveniently to the control of slider.
Preferably, the inside fixedly connected with fourth fixed plate of support frame, table surface's inside is equipped with the second connecting plate, the inner wall of second connecting plate and the outer wall phase-match of first connecting plate make things convenient for the fixed in first connecting plate and the second connecting plate.
Preferably, a plurality of mounting holes are formed in the outer side of the support frame, a plurality of fixing hole holes are formed in two sides of the base, and the base is convenient to mount and fix.
Preferably, the number of the mounting grooves is four, and the mounting grooves are distributed on the outer side of the fixing groove at equal intervals in an annular mode, so that the wafer can be conveniently positioned and fixed.
Preferably, the number of the sliding grooves is four, the sliding grooves are annularly distributed on the outer side of the fixed groove at equal intervals, the sliding grooves and the mounting grooves are alternately distributed on the outer side of the fixed groove at equal intervals in sequence, and the leg frames are conveniently separated from the wafer.
In the technical scheme, the invention has the technical effects and advantages that:
Through setting up limiting plate, second fixed plate and ejector pad, through the circular cutting processing wafer, then through UV dispergation, get rid of the gluey of wafer outer lane that the wafer circular cut. The frame containing the wafer is conveyed to the adsorption positioning disc through the last manipulator, meanwhile, the module and the sliding block drive the outer frame to move upwards, so that the outer frame and the adsorption positioning disc are at the same height, after the wafer and the adsorption positioning disc are concentric through the last manipulator, the wafer and the film are sucked through the adsorption positioning disc and the outer frame through the vacuum generator, then the connecting seat is driven through the air cylinder, the second fixing plate enables the second fixing plate to hold the frame, and then the outer frame is driven to move downwards through the module and the sliding block, so that the outer frame and the adsorption positioning disc have a certain distance, the next step of manipulator is convenient to take away wafer waste, the ring removing efficiency and the ring removing precision are effectively improved, and the separating quality of the wafer is improved;
Through setting up table surface, support frame and frame, drive connecting seat and second fixed plate through the cylinder for the frame is held to the second fixed plate, thereby separates the ring to the wafer, and the snatch of cooperation manipulator, thereby carries out high-efficient accurate ring removal and separation to the wafer, effectively promotes the efficiency of ring removal.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram of the overall frontal structure of the present invention;
FIG. 3 is a front elevational view in cross-section of the present invention;
FIG. 4 is a schematic top view of the present invention;
FIG. 5 is a schematic view of a partial structure of the present invention;
Fig. 6 is a schematic diagram of the structure of fig. 4a according to the present invention.
Reference numerals illustrate:
1. A work table; 2. a module; 3. a support frame; 4. a fixing groove; 5. a cylinder; 6. a wafer; 7. a frame; 8. a mounting groove; 9. a first fixing plate; 10. a base; 11. a slide block; 12. a fourth fixing plate; 13. a fixing member; 14. a second fixing plate; 15. a connecting seat; 16. a sliding groove; 17. a mounting base; 18. a first connection plate; 19. adsorbing a positioning disc; 20. a third fixing plate; 21. a third connecting plate; 22. an outer frame fixing member; 23. a pushing block; 24. a limiting plate; 25. a second connecting plate; 26. an outer frame.
Detailed Description
In order to make the technical scheme of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings.
The invention provides a cylinder as shown in fig. 1-5, the bottom end of a working table is fixedly connected with the output end of a module, the bottom end of a supporting frame is fixedly connected with a base, one side of the supporting frame is fixedly connected with a first fixing plate through a bolt, one side of the first fixing plate is fixedly connected with the module through a bolt, the other side of the working table is fixedly connected with a third fixing plate through a bolt, the third fixing plate is fixedly connected with a sliding block through a bolt, the bottom end of the working table is fixedly connected with a third connecting plate, the top end of the third connecting plate is fixedly connected with a second fixing plate, the top end of the second fixing plate is fixedly connected with a first connecting plate, the top end of the first connecting plate is fixedly connected with an adsorption positioning plate, the top end of the working table is provided with an outer frame, the inner part of the outer frame is provided with a fixing groove, the outer wall of the wafer is connected with a frame through a film, the top end of the working table is provided with a mounting groove, the top end of the working table is provided with a sliding groove, the inner part of the mounting groove is fixedly connected with a second connecting seat, the top end of the working table is fixedly connected with a second connecting plate through a film, and the air cylinder is fixedly connected with a limit seat fixedly connected with the first connecting plate, and the first connecting seat is fixedly connected with the first connecting plate through a bolt.
The module 2 is electrically connected with the fourth fixing plate 12, and the adsorption positioning disc 19 is connected with the output end of the sliding block 11, so that the adsorption positioning disc 19 can conveniently adsorb and position the wafer 6.
The cylinder 5 is electrically connected with the module 2, and the sliding block 11 is electrically connected with the module 2, so that the sliding block 11 can be conveniently controlled.
The inside fixedly connected with fourth fixed plate 12 of support frame 3, table surface 1's inside is equipped with second connecting plate 25, and the inner wall of second connecting plate 25 and the outer wall phase-match of first connecting plate 18 make things convenient for the fixed of first connecting plate 18 and second connecting plate 25.
The outside of support frame 3 is provided with a plurality of mounting holes, and the both sides of base 10 all are equipped with a plurality of fixed orificess, and the convenience is fixed to the installation of base 10.
The number of the mounting grooves 8 is four, and the mounting grooves 8 are distributed on the outer side of the fixing groove 4 at equal intervals in an annular mode, so that the wafer 6 can be positioned and fixed conveniently.
The number of the sliding grooves 16 is four, the sliding grooves 16 are annularly and equidistantly distributed on the outer side of the fixed groove 4, the sliding grooves 16 and the mounting grooves 8 are alternately and equidistantly distributed on the outer side of the fixed groove 4 in sequence, and the outer frame 26 can be conveniently fixed and the wafers 6 are separated after circular cutting.
Referring to fig. 1-5 of the specification, when the device is used, firstly, a wafer 6 is processed through circular cutting, then UV photoresist is removed, the adhesive on the outermost ring of the wafer, which is formed by circular cutting of the wafer 6, is removed, a frame 7 containing the wafer 6 is conveyed onto an adsorption positioning disc 19 through a last manipulator, meanwhile, a module 2 and a sliding block 11 drive an outer frame 26 to move upwards, so that the outer frame 26 is equal to the adsorption positioning disc 19, the wafer 6 and the adsorption positioning disc 19 are concentric through the last manipulator, then the wafer 6 and the film are sucked through a vacuum generator, then a connecting seat 15 is driven through a cylinder 5, a second fixing plate 14 is used for holding the frame 7, and then the outer frame 26 is driven to move downwards through the module 2 and the sliding block 11, so that the outer frame 26 and the adsorption positioning disc 19 have a certain distance, the next manipulator is convenient for taking away wafer wastes, and the ring removing efficiency and the precision are effectively improved;
referring to the description attached drawings 1-5, when the device is used, the working table top 1, the supporting frame 3 and the outer frame 26 are arranged, the connecting seat 15 and the second fixing plate 14 are driven by the air cylinder 5, so that the second fixing plate 14 holds the frame 7, a separating ring is separated from the wafer 6, and the wafer is effectively and accurately separated from the ring by matching with the grabbing of a mechanical arm, and the ring removing efficiency is effectively improved.
Claims (5)
1. A de-ringing workstation for TAIKO wafer processing, includes table surface (1), module (2), support frame (3), and cylinder (5), its characterized in that: the bottom of the working table surface (1) is fixedly connected with the output end of the module (2), the bottom of the supporting frame (3) is fixedly connected with the base (10), one side of the supporting frame (3) is fixedly connected with the first fixing plate (9) through a bolt, one side of the first fixing plate (9) is fixedly connected with the module (2) through a bolt, the other side of the working table surface (1) is fixedly connected with the third fixing plate (20) through a bolt, the third fixing plate (20) is fixedly connected with the sliding block (11) through a bolt, the bottom of the working table surface (1) is fixedly connected with the third connecting plate (21), the top of third connecting plate (21) fixedly connected with second connecting plate (25), the top fixedly connected with first connecting plate (18) of second connecting plate (25), the top fixedly connected with of first connecting plate (18) adsorbs positioning disk (19), the top of table surface (1) is equipped with frame (26), the inside of frame (26) is equipped with fixed slot (4), wafer (6) have been placed to fixed slot (4) inside, the outer wall of wafer (6) is connected with frame (7) through the membrane, the top of table surface (1) is equipped with mounting groove (8), the top of table surface (1) is equipped with sliding tray (16), the inside fixedly connected with connecting seat (15) of mounting groove (8), connecting seat (15) pass through bolt fixed connection with cylinder (5), the output fixedly connected with limiting plate (24) of cylinder (5), one side fixedly connected with second fixed plate (14) of limiting plate (24), connecting seat (15) are ninety degrees contained angles with second fixed plate (14), the inside fixedly connected with mounting seat (17) of sliding tray (16), the top fixedly connected with frame mounting (22) of mounting seat (17), the top fixedly connected with ejector pad (23) of frame mounting (22), the output fixedly connected with of frame mounting (22) and slider (11), one side fixedly connected with mounting (13) of module (2), the top fixedly connected with frame (26) of slider (11), the module (2) pass through motor drive table surface (1) and reciprocate, adsorb locating plate (19), first connecting plate (19), second connecting plate (19), the locating plate (19) are connected with each other to first connecting plate (19) and are adsorbed locating plate (19) respectively, the module (2) is electrically connected with the fourth fixing plate (12), the adsorption positioning disc (19) is connected with the output end of the sliding block (11) mutually, the air cylinder (5) is electrically connected with the module (2), and the sliding block (11) is electrically connected with the module (2).
2. A decyclization platen for TAIKO wafer processing as recited in claim 1, wherein: the inside of table surface (1) is equipped with second connecting plate (25), the inner wall of second connecting plate (25) and the outer wall phase-match of first connecting plate (18).
3. A decyclization platen for TAIKO wafer processing as recited in claim 2, further comprising: the outer side of the support frame (3) is provided with a plurality of mounting holes, and two sides of the base (10) are provided with a plurality of fixing holes.
4. A decyclization table for TAIKO wafer processing according to claim 3, wherein: the number of the mounting grooves (8) is four, and the mounting grooves (8) are distributed on the outer side of the fixing groove (4) at equal intervals in an annular mode.
5. A decyclization table for TAIKO wafer processing as in claim 4 wherein: the number of the sliding grooves (16) is four, the sliding grooves (16) are annularly and equidistantly distributed on the outer side of the fixed groove (4), and the sliding grooves (16) and the mounting grooves (8) are alternately and equidistantly distributed on the outer side of the fixed groove (4) in sequence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210235637.3A CN114643650B (en) | 2022-03-11 | 2022-03-11 | Ring removing workbench for TAIKO wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210235637.3A CN114643650B (en) | 2022-03-11 | 2022-03-11 | Ring removing workbench for TAIKO wafer processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114643650A CN114643650A (en) | 2022-06-21 |
| CN114643650B true CN114643650B (en) | 2024-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210235637.3A Active CN114643650B (en) | 2022-03-11 | 2022-03-11 | Ring removing workbench for TAIKO wafer processing |
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| Country | Link |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101807542A (en) * | 2009-02-13 | 2010-08-18 | 株式会社迪思科 | The processing method of wafer |
| CN110323183A (en) * | 2019-08-01 | 2019-10-11 | 沛顿科技（深圳）有限公司 | A method of 3D NAND wafer thin slice sliver is solved the problems, such as using laser ring cutting |
| CN110931419A (en) * | 2019-12-24 | 2020-03-27 | 苏州展德自动化设备有限公司 | Automatic grabbing, press-fitting and cutting device for LED wafer expansion outer ring |
| CN111564367A (en) * | 2020-05-21 | 2020-08-21 | 江苏汇成光电有限公司 | Method for processing wafer cracking abnormity before wafer grinding |
| CN115244680A (en) * | 2020-02-17 | 2022-10-25 | 捷普有限公司 | Apparatus, system and method for providing a semiconductor wafer leveling edge |
| CN219026335U (en) * | 2022-12-14 | 2023-05-16 | 苏州川普光电有限公司 | Double-cutting-head high-precision laser equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI467695B (en) * | 2011-03-24 | 2015-01-01 | Sony Corp | Semiconductor device and method for manufacturing same |
-
2022
- 2022-03-11 CN CN202210235637.3A patent/CN114643650B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101807542A (en) * | 2009-02-13 | 2010-08-18 | 株式会社迪思科 | The processing method of wafer |
| CN110323183A (en) * | 2019-08-01 | 2019-10-11 | 沛顿科技（深圳）有限公司 | A method of 3D NAND wafer thin slice sliver is solved the problems, such as using laser ring cutting |
| CN110931419A (en) * | 2019-12-24 | 2020-03-27 | 苏州展德自动化设备有限公司 | Automatic grabbing, press-fitting and cutting device for LED wafer expansion outer ring |
| CN115244680A (en) * | 2020-02-17 | 2022-10-25 | 捷普有限公司 | Apparatus, system and method for providing a semiconductor wafer leveling edge |
| CN111564367A (en) * | 2020-05-21 | 2020-08-21 | 江苏汇成光电有限公司 | Method for processing wafer cracking abnormity before wafer grinding |
| CN219026335U (en) * | 2022-12-14 | 2023-05-16 | 苏州川普光电有限公司 | Double-cutting-head high-precision laser equipment |
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| CN114643650A (en) | 2022-06-21 |
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