CN219873466U

CN219873466U - Dicing saw with quick positioning function for processing semiconductor wafer

Info

Publication number: CN219873466U
Application number: CN202321330712.0U
Authority: CN
Inventors: 王波; 张克芹; 王赞玉; 柏文玲; 贾浩
Original assignee: Wuxi Keruitai Semiconductor Technology Co ltd
Current assignee: Wuxi Keruitai Semiconductor Technology Co ltd
Priority date: 2023-05-29
Filing date: 2023-05-29
Publication date: 2023-10-20
Anticipated expiration: 2033-05-29

Abstract

The utility model discloses a scribing machine with a rapid positioning function for processing a semiconductor wafer, which comprises a workbench, two positioning mechanisms, an adsorption mechanism, scribing mechanisms and a control panel, wherein the number of the two positioning mechanisms is two, the two positioning mechanisms are respectively arranged at two sides of the top of the workbench, each positioning mechanism consists of a servo electric cylinder and an arc clamping plate, two sides of the workbench are fixedly connected with bearing plates, and the two servo electric cylinders are respectively arranged at the tops of the two bearing plates. According to the utility model, the two positioning mechanisms are arranged on the workbench, the wafer moving position is pushed by means of the two arc clamping plates on the two positioning mechanisms, and real-time distance measurement is carried out by means of infrared rays, so that the wafer can be quickly moved to the designated position, the distance between the two arc clamping plates can be adapted to the change of the size of the wafer, the wafers with different sizes can be positioned, and the use range of the dicing saw is enlarged.

Description

Dicing saw with quick positioning function for processing semiconductor wafer

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a dicing saw with a rapid positioning function for processing a semiconductor wafer.

Background

Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished, and sliced to form a silicon wafer, i.e., a wafer. The wafer scribing method mainly comprises two steps of diamond grinding wheel scribing and laser scribing, wherein the diamond grinding wheel scribing is to cut a wafer by utilizing a motor to drive a diamond grinding wheel, and the laser scribing is to instantly gasify a silicon material in an irradiation local range by utilizing high temperature generated by focusing of a high-energy laser beam so as to finish wafer separation.

When the existing wafer dicing machine is used, the positioning structure on the wafer dicing machine is fixed, and wafers with different sizes cannot be positioned quickly, so that the use range of the dicing machine is limited. For example, a wafer dicing saw disclosed in CN217098383U, this patent is when needs are diced the wafer, just places the wafer on placing the dish, just starts the inside vacuum pump of standing groove, and the output of vacuum pump just drives the connecting pipe of intercommunication, adsorbs fixed connection's adsorption disc, and the adsorption disc just adsorbs the placing plate of top, and the top of placing the dish is provided with a plurality of adsorption holes, just adsorbs the wafer of placing the top through a plurality of adsorption holes to just can fix the wafer. But this patent place dish fixed connection in the top of adsorption disc, simultaneously, adsorption disc side fixedly connected with annular rubber frame to limited the size of placing the dish, consequently can only place the wafer of specific size on placing the dish, can't carry out quick location to the wafer of equidimension, lead to the application range of dicing saw limited.

Therefore, it is necessary to invent a dicing saw for semiconductor wafer processing with a rapid positioning function to solve the above-mentioned problems.

Disclosure of Invention

The utility model aims to provide a dicing saw with a rapid positioning function for processing a semiconductor wafer, which solves the problem that the prior wafer dicing saw in the prior art has a fixed positioning structure when in use, and cannot rapidly position wafers with different sizes, so that the use range of the dicing saw is limited.

In order to achieve the above object, the present utility model provides the following technical solutions: the utility model provides a semiconductor wafer processing is with scribing machine with quick locate function, includes workstation, positioning mechanism, adsorption mechanism, scribing mechanism and control panel, the positioning mechanism quantity is established to two, two positioning mechanism sets up respectively in workstation top both sides, positioning mechanism comprises servo electronic jar and arc splint, the equal fixedly connected with loading board in workstation both sides, two servo electronic jar install respectively in two loading board tops, two one is all installed to the output of servo electronic jar arc splint, two the equal fixedly connected with rubber pad of arc splint inboard one of them infrared emitter is installed at arc splint top, another arc splint top is installed infrared receiver, infrared emitter and infrared receiver phase-match, control panel installs in workstation top one corner, infrared emitter and infrared receiver and two servo electronic jar all with control panel electric connection.

Preferably, the workbench bottom is fixedly connected with a support frame, the adsorption mechanism consists of a vacuum pump, an exhaust pipe and a vacuum chuck, and the vacuum pump is arranged inside the support frame.

Preferably, the vacuum chuck is installed in the middle of the workbench, the vacuum chuck is connected with the vacuum pump through an exhaust pipe, and the vacuum pump is electrically connected with the control panel.

Preferably, the top of the vacuum chuck is fixedly connected with a second rubber pad, air holes are formed in the surface of the second rubber pad, and the two arc clamping plates are symmetrically distributed about the central line of the vacuum chuck.

Preferably, the top of the workbench is fixedly connected with a portal frame, the portal frame and the scribing mechanism are both arranged right above the vacuum chuck, and the scribing mechanism is arranged right below the portal frame.

Preferably, the scribing mechanism is composed of an X-axis linear module, a Y-axis linear module, an electric push rod and a laser cutter, wherein the X-axis linear module is arranged right below the portal frame, and the X-axis linear module, the Y-axis linear module, the electric push rod and the laser cutter are electrically connected with the control panel.

Preferably, the first sliding table plate is installed at the bottom of the X-axis linear module, the Y-axis linear module is installed at the bottom of the first sliding table plate, and the second sliding table plate is installed at the bottom of the Y-axis linear module.

Preferably, the electric putter installs in No. two slide platen bottoms, the laser cutter is installed in electric putter bottom output.

In the technical scheme, the utility model has the technical effects and advantages that:

through setting up two positioning mechanism on the workstation, positioning mechanism comprises servo electronic jar and arc splint, promote two arc splint to the wafer by two servo electronic jars respectively and be close to in opposite directions, infrared emitter and infrared receiver are installed respectively at two arc splint tops, the in-process of promotion, measure the interval between two arc splint by infrared emitter and infrared receiver, when the numerical value that infrared emitter and infrared receiver measured equals the diameter length of wafer, the wafer just two arc splint push to the middle of No. two rubber pads, thereby accomplish the quick location to the wafer, the size that the interval between two arc splint can adapt to the wafer changes, can fix a position the wafer of different sizes, be favorable to expanding the application range of dicing saw.

Drawings

FIG. 1 is a schematic view of the overall structure of a first view angle according to the present utility model;

FIG. 2 is a schematic view of the overall structure of a second view angle according to the present utility model;

FIG. 3 is a schematic view of a positioning mechanism according to the present utility model;

FIG. 4 is a schematic view of a dicing mechanism according to the present utility model;

fig. 5 is a structural cross-sectional view of the vacuum chuck of the present utility model.

Reference numerals illustrate:

1. a work table; 2. a control panel; 3. a servo electric cylinder; 4. an arc clamping plate; 5. a first rubber pad; 6. an infrared emitter; 7. an infrared receiver; 8. a support frame; 9. a vacuum pump; 10. an exhaust pipe; 11. a vacuum chuck; 12. a second rubber pad; 13. a portal frame; 14. an X-axis linear module; 15. a Y-axis linear module; 16. an electric push rod; 17. a laser cutter.

Detailed Description

In order to make the technical scheme of the present utility model better understood by those skilled in the art, the present utility model will be further described in detail with reference to the accompanying drawings.

The utility model provides a scribing machine with a rapid positioning function for processing a semiconductor wafer, which is shown in fig. 1-5, and comprises a workbench 1, positioning mechanisms, an adsorption mechanism, scribing mechanisms and a control panel 2, wherein the number of the positioning mechanisms is two, the two positioning mechanisms are respectively arranged at two sides of the top of the workbench 1, each positioning mechanism consists of a servo electric cylinder 3 and an arc clamping plate 4, two bearing plates are fixedly connected at two sides of the workbench 1, the two servo electric cylinders 3 are respectively arranged at the tops of the two bearing plates, the output ends of the two servo electric cylinders 3 are respectively provided with one arc clamping plate 4, the inner sides of the two arc clamping plates 4 are fixedly connected with a first rubber pad 5, one arc clamping plate 4 is provided with an infrared emitter 6 at the top, the top of the other arc clamping plate 4 is provided with an infrared receiver 7, the infrared emitter 6 is matched with the infrared receiver 7, the control panel 2 is arranged at one corner of the top of the workbench 1, and the infrared emitter 6 and the infrared receiver 7 as well as the two servo electric cylinders 3 are electrically connected with the control panel 2.

Embodiment one: when a wafer is positioned, the wafer size to be diced is input into the control panel 2, then the wafer is placed on the second rubber pad 12, the two arc clamping plates 4 are respectively pushed by the two servo electric cylinders 3 to approach the wafer in the opposite direction, in the pushing process, infrared rays are emitted to the infrared ray receiver 7 by the infrared ray emitter 6 to measure the distance between the two arc clamping plates 4, when the numerical value measured by the infrared ray emitter 6 and the infrared ray receiver 7 is equal to the diameter length of the wafer, the wafer is just pushed to the middle of the second rubber pad 12, and the servo electric cylinders 3 are immediately controlled to pull the arc clamping plates 4 to restore to the original position after the control panel 2 receives the data, so that the wafer is positioned quickly.

Embodiment two: when the wafer is diced, the X-axis linear module 14, the Y-axis linear module 15, the electric push rod 16 and the laser cutter 17 are started through the control panel 2, the electric push rod 16 is firstly used for adjusting the laser cutter 17 to a proper height, the X-axis linear module 14 drives the first sliding table plate to drive the Y-axis linear module 15 to transversely move, so that the wafer is transversely diced, and finally the Y-axis linear module 15 drives the second sliding table plate to drive the laser cutter 17 to longitudinally move, so that the wafer is longitudinally diced.

The working principle of the utility model is as follows:

referring to fig. 1-5 of the specification, when the utility model is used, firstly, a wafer is placed on a second rubber pad 12 at the top of a vacuum chuck 11, then a servo electric cylinder 3 is started through a control panel 2, two arc clamping plates 4 are pushed by the two servo electric cylinders 3 to approach the wafer in the opposite direction, in the pushing process, an infrared transmitter 6 transmits infrared rays to an infrared receiver 7 to measure the distance between the two arc clamping plates 4, when the wafer is pushed to the middle of the second rubber pad 12 by the two arc clamping plates 4, at the moment, the numerical value measured by the infrared transmitter 6 and the infrared receiver 7 is exactly equal to the diameter length of the wafer, and a signal is sent to the control panel 2, the servo electric cylinder 3 is controlled by the control panel 2 to pull the arc clamping plates 4 to the original position, then the vacuum pump 9 is started through the control panel 2, the air inside the vacuum chuck 11 is pumped by the vacuum pump 9, the wafer is firmly pressed on the second rubber pad 12 by external atmospheric pressure, at the moment, the wafer is then fixed by the suction of the wafer, the linear sliding table is driven by the X-axis module 16 and the linear sliding table 17, and the linear sliding table 17 is cut by the linear sliding table 17, and finally, the linear sliding table 17 is cut and the linear sliding table is cut by the linear sliding table 17, and the linear sliding table is cut and moved in the longitudinal direction by the linear sliding table 17.

Claims

1. The utility model provides a semiconductor wafer processing is with dicing machine with quick locate function, includes workstation (1), positioning mechanism, adsorption equipment, scribing mechanism and control panel (2), its characterized in that: the utility model provides a servo motor control panel, including workstation (1) and arc splint (4), including workstation (1) and arc splint, positioning mechanism sets up to two in quantity positioning mechanism sets up respectively in workstation (1) top both sides, positioning mechanism comprises servo motor cylinder (3) and arc splint (4), equal fixedly connected with loading board in workstation (1) both sides, two servo motor cylinder (3) install respectively in two loading board tops, two servo motor cylinder (3) output all installs one arc splint (4), two equal fixedly connected with rubber pad (5) in arc splint (4), one of them infrared emitter (6) are installed at arc splint (4) top, another arc splint (4) top is installed infrared receiver (7), infrared emitter (6) and infrared receiver (7) phase-match, control panel (2) install in workstation (1) top one corner, infrared emitter (6) and infrared receiver (7) and two servo motor control panel (3) all electric connection.

2. The dicing saw with a rapid positioning function for semiconductor wafer processing according to claim 1, wherein: the workbench is characterized in that a supporting frame (8) is fixedly connected to the bottom of the workbench (1), the adsorption mechanism consists of a vacuum pump (9), an exhaust pipe (10) and a vacuum chuck (11), and the vacuum pump (9) is arranged inside the supporting frame (8).

3. The dicing saw with a rapid positioning function for semiconductor wafer processing according to claim 2, wherein: the vacuum chuck (11) is arranged in the middle of the workbench (1), the vacuum chuck (11) is connected with the vacuum pump (9) through the exhaust pipe (10), and the vacuum pump (9) is electrically connected with the control panel (2).

4. The dicing saw with a rapid positioning function for semiconductor wafer processing according to claim 2, wherein: the vacuum chuck is characterized in that a second rubber pad (12) is fixedly connected to the top of the vacuum chuck (11), air holes are formed in the surface of the second rubber pad (12), and the two arc clamping plates (4) are symmetrically distributed about the central line of the vacuum chuck (11).

5. The dicing saw with a rapid positioning function for semiconductor wafer processing according to claim 2, wherein: the top of the workbench (1) is fixedly connected with a portal frame (13), the portal frame (13) and the scribing mechanism are both arranged right above the vacuum chuck (11), and the scribing mechanism is arranged right below the portal frame (13).

6. The dicing saw with rapid positioning function for semiconductor wafer processing according to claim 5, wherein: the scribing mechanism consists of an X-axis linear module (14), a Y-axis linear module (15), an electric push rod (16) and a laser cutter (17), wherein the X-axis linear module (14) is arranged right below the portal frame (13), and the X-axis linear module (14), the Y-axis linear module (15), the electric push rod (16) and the laser cutter (17) are electrically connected with the control panel (2).

7. The dicing saw with rapid positioning function for semiconductor wafer processing of claim 6, wherein: a first sliding table plate is arranged at the bottom of the X-axis linear module (14), the Y-axis linear module (15) is arranged at the bottom of the first sliding table plate, and a second sliding table plate is arranged at the bottom of the Y-axis linear module (15).

8. The dicing saw with rapid positioning function for semiconductor wafer processing according to claim 7, wherein: the electric push rod (16) is arranged at the bottom of the second sliding table plate, and the laser cutter (17) is arranged at the output end of the bottom of the electric push rod (16).