CN219686175U - Cutting device and wire cutting equipment - Google Patents

Abstract

The embodiment of the application provides a cutting device and wire cutting equipment, wherein the cutting device comprises: cutting the frame; three cutting heads arranged on the cutting frame; the three cutting machine heads can move vertically relative to the cutting frame so as to cut a workpiece to be cut through cutting lines wound on at least two cutting machine heads; at least two cutting heads are movable in a lateral direction relative to the cutting frame, one of the cutting heads being movable to a top center position of the workpiece to be cut to vertically move at that position to cut the workpiece to be cut. The cutting device and the linear cutting equipment provided by the embodiment of the application can meet the requirement of cutting the square bar into the half bar with smaller cross section area, and the small silicon chip with smaller size is directly obtained by slicing the half bar subsequently.

Description

Cutting device and wire cutting equipment

Technical Field

The present application relates to wire cutting, and more particularly, to a wire cutting apparatus and a wire cutting device.

Background

The demand for small silicon wafers in the current battery market is increasing. In the manufacturing process of forming small silicon chips, a cylindrical monocrystalline silicon rod is generally cut into square rods, then the square rods are cut into large silicon chips, and then the large silicon chips are diced and cut by adopting a laser technology to form the small silicon chips. However, the laser scribing process can cause damage and defect states on the cross section of the small silicon wafer, and the conversion efficiency of the heterojunction battery finally processed is seriously affected. At present, equipment which is not matched at the equipment end is subjected to one-time completion of squaring, halving or middle sectioning, the production process is complex, and the efficiency is low.

Disclosure of Invention

In order to solve one of the above technical drawbacks, an embodiment of the present application provides a cutting device and a wire cutting apparatus.

According to a first aspect of an embodiment of the present application, there is provided a cutting device including:

cutting the frame;

three cutting heads arranged on the cutting frame; the three cutting machine heads can move vertically relative to the cutting frame so as to cut a workpiece to be cut through cutting lines wound on at least two cutting machine heads; at least two cutting heads are movable in a lateral direction relative to the cutting frame, one of the cutting heads being movable to a top center position of the workpiece to be cut to vertically move at that position to cut the workpiece to be cut.

In the cutting device as described above, the first one of the three cutting heads is provided on the second cutting head, and moves vertically with respect to the cutting frame together with the second cutting head, or moves laterally with respect to the cutting frame together.

The cutting device is characterized in that the first cutting machine head is movably arranged on the second cutting machine head and can move transversely relative to the second cutting machine head.

The cutting device as described above, further comprising:

the vertical guide mechanism is arranged between the cutting machine head and the cutting frame so as to enable the cutting frame to vertically move along the vertical guide mechanism; the vertical guide mechanism includes:

The vertical sliding rail is arranged on the cutting frame and extends along the vertical direction;

the vertical sliding plate is in sliding fit with the vertical sliding rail; the cutting machine head is arranged on the vertical sliding plate and moves vertically together with the vertical sliding plate.

The cutting device as described above, further comprising: the vertical driving mechanism and the vertical transmission mechanism are arranged on the cutting frame; the vertical driving mechanism is used for providing driving force for the cutting machine head to move vertically; the vertical transmission mechanism is used for transmitting the driving force of vertical movement to the cutting machine head; the vertical transmission mechanism comprises: the vertical screw rod extends vertically, the nut is in threaded fit with the vertical screw rod, the vertical screw rod is connected with the vertical driving mechanism, and the nut is connected with the vertical sliding plate.

The cutting device as described above, further comprising:

and the locking mechanism is arranged at the upper part of the cutting frame and is used for locking the cutting machine head after the cutting machine head moves upwards to the proper position.

The cutting device as described above, further comprising:

the machine head frame is fixedly connected with the vertical sliding plate;

the transverse sliding rail is arranged on the machine head frame and extends along the transverse direction;

the transverse sliding plate is in sliding fit with the transverse sliding plate; the cutting head is fixed to the transverse slide.

The cutting device as described above, further comprising: the transverse driving mechanism and the transverse transmission mechanism are arranged on the machine head frame; the transverse driving mechanism is used for providing driving force for the cutting machine head to move transversely; the transverse transmission mechanism is used for transmitting the driving force of transverse movement to the cutting machine head; the transverse transmission mechanism comprises: the transverse screw rod is connected with the transverse driving mechanism, and the nut is connected with the transverse sliding plate.

A cutting device as described above, the cutting head comprising:

a headstock;

at least two cutting line wheels for winding the annular cutting line are arranged on the headstock;

the tension pulley assembly is arranged on the headstock; the tension wheel assembly comprises a tension wheel for adjusting the tension of the cutting line.

According to a second aspect of the embodiment of the present application, there is provided a wire cutting apparatus including: a cutting device as described above.

The wire cutting apparatus as described above, further comprising: a compacting device and a supporting device; the supporting device is used for supporting the piece to be cut from the bottom; the compressing device is used for compressing the piece to be cut from the top.

The wire cutting apparatus as described above, the pressing device includes: a main compression assembly and a half-bar compression assembly; the semi-rod compressing assembly is positioned at the periphery of the main compressing assembly and used for compressing the semi-rods; a cutting head is movable to a top center position of the workpiece to be cut and is positioned between the main pressing assembly and the half-bar pressing assembly to vertically move at that position to cut the workpiece to be cut.

According to the technical scheme provided by the embodiment of the application, three cutting machine heads are arranged on the cutting frame and can vertically move relative to the cutting frame so as to cut a piece to be cut through cutting lines wound on at least two cutting machine heads; at least two cutting machine heads can move along the transverse direction relative to the cutting frame so as to adjust the cutting position to move to the middle section position of the silicon rod, cut the silicon rod, realize two-wire cutting and three-wire cutting conversion of the silicon rod, obtain a half rod with smaller cross section area by using the scheme, and avoid the subsequent secondary equipment processing of the other rod to cut the half rod; and the small silicon wafer with smaller area is obtained by directly grinding and slicing the semi-rod in the follow-up process, laser scribing is not needed to be carried out on the silicon wafer, the damage to the surface of the silicon wafer is reduced, and the conversion efficiency of the heterojunction battery finally processed is improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:

FIG. 1 is a flow chart of a method for cutting a silicon rod according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a wire cutting apparatus according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a cutting device in a wire cutting apparatus according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of the cooperation of each cutting head in the wire cutting apparatus according to the embodiment of the present application;

fig. 5 is a schematic structural view of a cutting head in a wire cutting apparatus according to an embodiment of the present application;

FIG. 6 is a schematic view of a structure of a cutting head moving in a lateral direction according to an embodiment of the present application;

FIG. 7 is a schematic view of a relative lateral movement between cutting heads according to an embodiment of the present application;

fig. 8 is a schematic structural view of a pressing device and a supporting device for pressing a silicon rod in a wire cutting apparatus according to an embodiment of the present application;

fig. 9 is a schematic structural view of a pressing device in a wire cutting device according to an embodiment of the present application;

fig. 10 is a schematic structural view of a supporting device in a wire cutting apparatus according to an embodiment of the present application;

Fig. 11 is a schematic structural view of a supporting device rotated to another angle in a wire cutting apparatus according to an embodiment of the present application;

fig. 12 is a schematic structural view of a supporting floating head in a wire cutting apparatus according to an embodiment of the present application;

FIG. 13 is a cross-sectional view of a semi-bar support head provided in an embodiment of the application.

Reference numerals:

1-a stand;

2-supporting means; 21-a main support assembly; 211-supporting a floating head; 2111-substrate; 2112-support; 2113-let wire chase; 2114-a reference plane; 2115-supporting blocks; 212-a rotating assembly; 22-a side skin support assembly; 23-a semi-bar support assembly; 231-a semi-stick support housing; 232-half bar support compression springs; 233-half bar support guide; 234-half bar support hold-down bar; 235-a semi-stick supporting compaction block; 236-blocking;

3-a cutting device; 31-cutting the frame; 32-cutting a handpiece; 321-a headstock; 322-cutting line wheel; 323 (323); 331-vertical slide rail; 332-vertical skateboards; 333-vertical drive motor; 334-vertical screw; 34-sensing devices; 35-locking mechanism; 361-a handpiece frame; 362-a transverse slide rail; 363-transverse slide; 364—transverse lead screw; 365-transverse nut; 366-transverse sliders; 371—a head rail; 372-a head slider; 373-drive motor;

4-a compressing device; 41-a pressing mechanism; 411-a compression rack; 412-a main hold-down assembly; 4121-a main compression block; 413—a semi-bar compaction assembly; 414-edge skin compression assembly; 415-a buttress support; 42-compressing the driving mechanism; 43-pressing guide mechanism;

5-silicon rod.

Detailed Description

In order to make the technical solutions and advantages of the embodiments of the present application more apparent, the following detailed description of exemplary embodiments of the present application is provided in conjunction with the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present application and not exhaustive of all embodiments. It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.

The embodiment provides a cutting device which can be used in linear cutting equipment. The cutting device is provided with a cutting line through which the piece to be cut is cut. The wire cutting device may be a guillotine, squarer or other device. The piece to be cut can be a hard and brittle material rod such as monocrystalline silicon, polycrystalline silicon, magnetic material, sapphire and the like. In this embodiment, a single crystal silicon rod is taken as an example, and a cutting device for cutting a silicon rod is provided. The solution provided by the present embodiment can also be applied by those skilled in the art to cutting devices or wire cutting apparatuses for cutting other bars of hard and brittle material.

In the traditional scheme, the production process of the silicon wafer is as follows: firstly, square a cylindrical silicon rod, namely: and cutting the silicon rod along the length direction of the silicon rod to obtain a square rod with a rectangular cross section, wherein the cut part is made of side leather. And then slicing the square rod to obtain the silicon wafer. And finally, carrying out laser scribing on the silicon wafer to obtain the silicon wafer with smaller size. However, the laser scribing process can cause damage and defect states on the cross section of the small silicon wafer, and the conversion efficiency of the heterojunction battery finally processed is seriously affected.

The embodiment of the application adopts different cutting modes: the square rod is cut along the length direction of the square rod to obtain a half rod with smaller cross section area, then the half rod is sliced, a silicon wafer with smaller size can be directly obtained, and the problem can be solved by adopting a laser scribing mode.

As shown in fig. 1, one specific way is: firstly, cutting a cylindrical silicon rod along the length direction by adopting two parallel cutting lines; secondly, horizontally rotating the cut silicon rod by 90 degrees, and cutting the silicon rod along the length direction by adopting three parallel cutting lines to obtain two half rods with rectangular cross sections; two half bars and four side leather materials are obtained after two steps of cutting; and thirdly, grinding and slicing the semi-stick to obtain the small silicon wafer with rectangular cross section area.

Based on the above implementation manner, the present embodiment provides a wire cutting apparatus, as shown in fig. 2, where the wire cutting apparatus provided in the present embodiment includes: the machine seat 1, the supporting device 2, the cutting device 3 and the compacting device 4 are arranged on the machine seat 1, and the supporting device 2, the cutting device 3 and the compacting device 4 are arranged on the machine seat. The head of the cutting device 3 is fed in a vertical direction. During operation of the apparatus, the silicon rod 5 is vertically placed on the supporting device 2, and the supporting device 2 is used for supporting the silicon rod from the bottom. The pressing device 4 presses the silicon rod 5 downward from the top. The cutting device 3 is controlled to move downwards, and the silicon rod 5 is cut according to a preset position through the cutting line.

As shown in fig. 3 and 4, the present embodiment provides a cutting device 3 including a cutting frame 31 and three cutting heads 32. Wherein the cutting frame 31 is provided on the housing 1. The cutting frame 31 is a main body structure, and each component in the cutting device 3 is mounted to the cutting frame 31. The cutting head 32 is provided with cutting lines.

The number of the cutter heads 32 is three, and they are provided on the cutting frame. The three cutting heads 32 are fed in a vertically movable manner with respect to the cutting frame 31 to cut the silicon rod 5 by the cutting lines wound around at least two of the cutting heads 32, wherein at least two of the cutting heads 32 are movable in a transverse direction with respect to the cutting frame 31 to adjust the cutting position.

Referring to the cutting mode shown in fig. 1, in a first step, two cutting heads 32 are moved over the silicon rod, and at least one cutting head 32 is laterally moved to an adjustment position so that the cutting lines on the two cutting heads 32 reach a cutting position. The two cutting heads 32 are then controlled to move downward to cut the silicon rod 5. In a second step, three cutting heads 32 are moved over the silicon rod 5, at least two cutting heads 32 being laterally movable in an adjustment position, one of the cutting heads 32 being moved to a top centre position of the silicon rod, for example over the centre line of the silicon rod, the other two being on either side of the cutting head 32. The cutting head 32 is then controlled to move downwardly to cut the silicon rod to obtain two rod halves.

According to the technical scheme provided by the embodiment, three cutting machine heads are arranged on the cutting frame and can vertically move relative to the cutting frame so as to cut the silicon rod through cutting lines wound on at least two cutting machine heads; at least two cutting machine heads can move along the transverse direction relative to the cutting frame so as to adjust the cutting position to move to the middle section position of the silicon rod, cut the silicon rod, realize two-wire cutting and three-wire cutting conversion of the silicon rod, obtain a half rod with smaller cross section area by using the scheme, and avoid the subsequent secondary equipment processing of the other rod to cut the half rod; and the small silicon wafer with smaller area is obtained by directly grinding and slicing the semi-rod in the follow-up process, laser scribing is not needed to be carried out on the silicon wafer, the damage to the surface of the silicon wafer is reduced, and the conversion efficiency of the heterojunction battery finally processed is improved.

Based on the technical scheme, a specific implementation mode is as follows: the three cutting heads 32 move vertically and laterally independently of each other. In the cutting process, two cutting heads 32 or three cutting heads 32 are controlled to move vertically and horizontally to be in place respectively according to preset cutting positions to cut.

Another specific implementation mode is as follows: the three cutting heads 32 are respectively referred to as: a first cutting head 32a, a second cutting head 32b, and a third cutting head 32c. Wherein the first cutting head 32a is disposed on the second cutting head 32b and moves vertically with respect to the cutting frame 31 together with the second cutting head 32b or moves laterally with respect to the cutting frame 31 together. The third cutting head 32c moves vertically and laterally independently. The three cutting heads are arranged such that the first cutting head 32a is movably disposed on the second cutting head 32b and is movable in a lateral direction with respect to the second cutting head 32b, as shown in fig. 4.

Referring to the cutting steps of fig. 1, in the first step, the silicon rod is cut by the second and third cutting heads 32b and 32c, the first cutting head 32a moves vertically and laterally following the second cutting head 32b, and the first cutting head 32a is located outside the silicon rod after moving in place and does not participate in cutting. And secondly, cutting the silicon rod by three cutting heads. The first cutting head 32a follows the second cutting head 32b in a vertical, lateral movement, and after the second cutting head 32b reaches a target cutting position (e.g., above the silicon rod centerline), the first cutting head 32a moves laterally relative to the second cutting head 32b to the target position. In the above two steps, the third cutting head 32c is independently moved vertically and laterally.

On the basis of the above, the cutter head 32 may be driven by a mechanical arm to perform vertical or lateral movement, or may be driven by a guide mechanism to perform vertical or lateral movement.

In the present embodiment, a vertical guide mechanism is provided between the cutting head 32 and the cutting frame 31, so that the cutting head 32 is vertically moved along the vertical guide mechanism for feeding. The vertical guide mechanism can be a structure of matching a sliding groove with a sliding block, or a structure of matching a sliding rail with the sliding block.

One embodiment is: the vertical guiding mechanism includes: vertical slide rail 331 and vertical slide 332. The vertical sliding rail 331 is disposed on the cutting frame 31 and extends along a vertical direction. The vertical sliding plate 332 is in sliding fit with the vertical sliding rail 331, and the vertical sliding plate 332 can move up and down along the vertical sliding rail 331. The cutter head 32 is disposed on a vertical slide plate 332, and moves up and down along a vertical slide rail 331 together with the vertical slide plate 332.

Further, a vertical driving mechanism and a vertical transmission mechanism are adopted and are arranged on the cutting frame. Wherein the vertical drive mechanism is used to provide a driving force for the vertical movement of the cutter head 32. A vertical transmission mechanism is provided between the vertical driving mechanism and the cutter head 32 for transmitting a driving force of the vertical movement to the cutter head.

The vertical drive mechanism may be hydraulically, pneumatically or electrically driven, for example using a vertical drive motor 333, disposed on top of the cutting frame 31.

The vertical transmission mechanism can adopt a mode of linearly moving the push rod, and can also adopt a mode of changing rotation into linear movement by adopting screw and nut matching. In this embodiment, the vertical transmission mechanism includes: a vertical screw 334 and a nut (not shown) threadedly engaged with the vertical screw. The vertical screw 334 extends vertically and is located between two vertical slide rails 331. The top of the vertical screw 334 is connected with a vertical driving motor 333, and the vertical driving motor 333 drives the vertical screw 334 to rotate through a speed reducer. The nut is connected to a vertical slide 332, and the vertical slide 332 moves up and down with the nut relative to a vertical screw 334.

Further, an induction device 34 is provided at the lower portion of the cutting frame 31 for detecting the cutting head 32. When it is detected that the cutting head 32 is moved downward into position, a signal is sent to the controller to control the cutting head 32 to stop moving downward by the controller, thereby realizing automatic cutting stop. The sensing device 34 may be a contact type sensor or a non-contact type sensor.

Further, a locking mechanism 35 is provided at the upper portion of the cutting frame 31 for locking the cutting head 32 after the cutting head 32 is moved upward into place, so as to prevent the cutting head 32 from freely falling under the action of gravity. For example: during service, the cutter head 32 is raised to the highest position and an operator enters under the cutter head 32 to perform an operation. The cutter head 32 is locked by adopting the locking mechanism 35, so that the cutter head 32 is prevented from falling down accidentally, and operators are protected.

The locking mechanism 35 may be mechanically locked, for example: the cylinder drives the bolt to extend and insert into a lock hole on the cutting head 32, so as to prevent the cutting head 32 from falling down. Other means may be employed, such as: the locking mechanism 25 extends out of the support arm to support the cutter head 32 from below.

On the basis of the above-described scheme, the present embodiment also provides a manner in which the cutter head 32 moves in the lateral direction. As shown in fig. 3 and 6, the head frame 361 is fixedly connected to the vertical sliding plate 332. The lateral slide rail 362 extends in a lateral direction and is disposed on the head frame 361. The lateral sliding plate 363 is slidably engaged with the lateral sliding rail 362 and is slidable laterally along the lateral sliding rail 362. The cutter head 32 is fixed to the lateral slide plate 363, and moves in the lateral direction together with the lateral slide plate 363.

As shown in fig. 6, a sliding groove is formed in the transverse sliding rail 362, and a transverse sliding block 366 is disposed in the sliding groove and can move along the sliding groove, and the transverse sliding block 366 is connected with a transverse sliding plate 363.

Further, a transverse driving mechanism and a transverse transmission mechanism are both arranged on the machine head frame 361. Wherein the lateral drive mechanism is for providing a driving force for the lateral movement of the cutting head 32, and the lateral transmission mechanism is for transmitting the driving force for the lateral movement to the cutting head 32. Specifically, the transverse driving mechanism adopts a transverse driving motor, the transverse transmission mechanism adopts a transverse screw rod 364 to be matched with a transverse nut 365, and the transverse screw rod 364 extends transversely. The transverse driving motor drives the transverse screw rod 364 to rotate through the speed reducer, and the transverse nut 365 and the transverse screw rod 364 are in threaded fit to change the rotation into linear movement to drive the transverse sliding plate 363 and the cutting machine head 32 to move transversely.

When the silicon rods are cut in batches, manufacturers can replace the silicon rods with different specifications. By adopting the scheme, the transverse position of the cutting machine head 32 can be automatically adjusted, so that the cutting requirements of silicon rods with different specifications are met, and the target size is achieved. Compared with the manual adjustment of the cutting head 32, the scheme provided by the embodiment can shorten the adjustment time, further improve the cutting efficiency, further improve the transverse movement precision and further improve the cutting precision.

For the first cutting head 32a to move laterally relative to the second cutting head 32b, one embodiment is: as shown in fig. 7, a drive, transmission and guide mechanism is provided between the two cutting heads. For example: a slide rail is provided on the head frame of the second cutting head 32b, and the head frame of the first cutting head 32a slides in cooperation with the slide rail through the slide plate. The driving motor 373 is used for driving the screw rod to rotate, and a nut in threaded fit with the screw rod is connected with the sliding plate, so that the driving motor drives the first cutting head 32a to move transversely relative to the second cutting head 32 b.

Specifically, a head slide rail 371 is disposed on a head frame of the second cutting head 32b, a slide groove is disposed in the head slide rail 371, a head slider 372 is disposed in the slide groove and can move along the slide groove, and the head slider 372 is connected with the first cutting head 32a through a slide plate.

In the drawing of the present embodiment, the wire cutting apparatus has two stations, each of which is provided with three cutting heads 32.

As shown in fig. 4 and 5, the present embodiment provides a cutter head 32 including: a headstock 321 and a cutting line wheel 322. The number of the cutting line wheels 322 is at least two, and an annular cutting line is wound on each cutting line wheel 322. The cutting wire between the two cutting wire wheels 322 serves as a wire saw for cutting the silicon rod.

In this embodiment, three wire wheels 322 are used, one wire wheel 322 being at the upper portion of the head frame 321 and two wire wheels 322 being at the lower portion of the head frame 321. The cutting line segment between the lower two cutting line wheels 322 acts as a wire saw.

Further, a tension pulley assembly 323 is disposed on the headstock 321, and the tension pulley assembly 323 includes a tension pulley and a tension arm for driving the tension pulley to swing. The cutting line is wound on the tension pulley, and the tension of the cutting line can be adjusted by swinging the tension pulley.

As shown in fig. 8, the supporting device 2 and the pressing device 4 are further used to support the workpiece to be cut from the bottom and to press the workpiece to be cut from the top, respectively.

As shown in fig. 9, the pressing device 4 includes: a main compression assembly 412 and a half-bar compression assembly 413. The half-bar pressing assembly 413 and the main pressing assembly 412 may be integrally formed or may be independent from each other. In the case of independent structures, the half-bar pressing assembly 413 is located at the periphery of the main pressing assembly 412, and is used for pressing the half-bar. A cutting head is movable to a top center position of the silicon rod between the main press assembly 412 and the half rod press assembly 413 to vertically move at that position to cut the silicon rod.

Further, the half-rod pressing assembly 413 may be moved toward the silicon rod into contact with the silicon rod or in a direction away from the silicon rod relative to the main pressing assembly 412.

As shown in fig. 10 and 11, the supporting device 2 includes: a main support assembly 21 and a half-bar support assembly 23; the half-bar support assembly 23 and the main support assembly 21 may be of an integral structure or of a mutually independent structure. In the case of the independent structure, the half-bar support assembly 23 is located at the periphery of the main support assembly 21 for supporting the half-bar obtained after the silicon bar is cut.

Further, the half-rod support assembly 23 may be moved toward the silicon rod into contact with the silicon rod or in a direction away from the silicon rod.

In the first step of fig. 1, the silicon rod is compacted by the main support assembly 21 and the main compacting assembly 412. In the third step, the half-rod supporting assembly 23 is moved upward to contact the silicon rod, and the half-rod pressing assembly 413 is moved downward to press the silicon rod, so that the silicon rod is entirely pressed by the main supporting assembly 21, the half-rod supporting assembly 23, the main pressing assembly 412 and the half-rod pressing assembly 413 in the process of cutting the silicon rod to obtain the half-rod. The scheme can meet the requirement of cutting the square bar into the half bars with smaller cross sectional areas.

Further, the half-bar pressing assemblies 413 correspond to the positions of the half-bar supporting assemblies 23 to clamp the workpiece to be cut from the corresponding positions of both ends of the workpiece to be cut, respectively. For example: the half rod pressing assembly 413 and the half rod supporting assembly 23 are all positioned on the left side, or are all positioned on the right side, or are all positioned on the left side and the right side and correspond to each other in position, so that the force application direction of the half rod pressing assembly 413 and the half rod supporting assembly 23 to the silicon rod is collinear, and the half rod pressing assembly is parallel to the central line of the silicon rod, and the pressing stability is improved.

In this embodiment, the half-rod supporting assembly 23 is located on one side of the main supporting assembly 21, and the half-rod compressing assembly 413 is located on one side of the main compressing assembly 412, so that only half of the silicon rod is compressed when the half-rod is obtained by cutting.

As shown in fig. 9, the present embodiment provides a pressing device 4 including: the pressing mechanism 41, a pressing driving mechanism 42 for driving the pressing mechanism 41 to move in the feeding direction, and a pressing guide mechanism 43. In this embodiment, the feeding direction is vertical. The pressing guide 43 extends vertically, in particular may be a vertical guide rail. The hold-down mechanism 41 slides vertically along the rail. The pressing drive mechanism 42 supplies a driving force to the pressing mechanism 41, driving the pressing mechanism 41 to slide vertically.

As shown in fig. 8 and 9, the pressing mechanism 41 includes: a compression bracket 411, a main compression assembly 412 and a half bar compression assembly 413. The pressing frame 411 is a frame body structure and is connected with the pressing driving mechanism 42, and moves vertically under the driving action of the pressing driving mechanism 42. The pressing frame 411 has a portion connected to the pressing driving mechanism 42, a middle portion, and a mounting portion extending to the top of the silicon rod 5. The main packing assembly 412 and the half-bar packing assembly 413 are disposed at the mounting portion of the packing frame 411.

The main pressing assembly 412 is provided at the middle of the mounting portion for applying a downward pressing force to the silicon rod from the top to press the silicon rod.

The half-rod compressing assembly 413 is located at the periphery of the main compressing assembly 412, and is used for compressing the half-rods obtained after the silicon rods are cut.

Further, the pressing mechanism 41 further includes a side skin pressing assembly 414 disposed at the mounting portion of the pressing frame 411. The edge skin compressing assembly 414 is located at the periphery of the main compressing assembly 412, and is used for compressing the edge skin obtained after the silicon rod is cut. The distance between the edge skin compression assembly 414 and the main compression assembly 412 is greater than the distance between the rod half compression assembly 413 and the main compression assembly 412.

In the cutting method of fig. 1 described above, before the half-bar is formed by the intermediate section, the head of the cutting device is moved inward in the radial direction of the silicon bar until the cutting line reaches the vicinity of the center line of the silicon bar, and then the head is moved downward to intermediate section the silicon bar through the cutting line. To yield the cut line during radial movement of the hand piece, the main compression assembly 412 can only be positioned on one side of the silicon rod to compress the silicon rod, while the other side of the silicon rod compresses the silicon rod by the independently moving half-rod compression assembly.

On the basis of the above technical solution, the half-bar compressing assemblies 413 may be distributed at both sides of the main compressing assembly 412 for compressing two half-bars.

Alternatively, the half-bar compression assembly 413 may be located on one side of the main compression assembly 412 for compressing only one of the half-bars. In the scheme, the step sequence of taking down the half bars is reasonably set, so that the half bar pressing assembly 413 only presses one of the half bars, and the two half bars can be taken away smoothly in sequence, thereby reducing the number of the half bar pressing assemblies 413 and reducing the component cost; on the other hand, the installation layout and the installation steps are simplified, the assembly difficulty and the cost are reduced, and the subsequent maintenance cost is also reduced.

The number of the half-bar pressing assemblies 413 may be set according to the diameter of the silicon bar to be cut, and the size of the main pressing assembly 412. For example: the number of the half-bar pressing assemblies 413 is at least two, and the distances between each half-bar pressing assembly 413 and the main pressing assembly 412 are equal, namely: the rod pressing assemblies 413 are spaced apart and located on the same circle. In this embodiment, two half-bar pressing assemblies 413 are used, and are respectively located at two sides of a group of edge skin pressing assemblies 414.

One embodiment is: the half-bar compression assembly 413 includes: a half-bar compressing head and a half-bar driving piece. The semi-rod driving piece is used for driving the semi-rod supporting head to move towards the silicon rod or move away from the silicon rod. Specifically, in the cutting method shown in fig. 1, in the first step, the half-bar pressing head is in the initial position, that is: the top of the half-bar compression head is higher than the main compression assembly 412 and does not contact the silicon bar. Before the second step begins, the half-rod pressing member drives the half-rod pressing head to move toward contact with the silicon rod to apply pressing force. After the second step is finished, before the compressed half rod needs to be taken away, the blanking mechanism clamps the half rod, and then the half rod compressing piece drives the half rod compressing head to ascend and separate from the half rod.

The semi-stick pressing piece can be driven by a motor, hydraulically or pneumatically. In this embodiment, the half-bar pressing member is a pneumatic driving member, and drives the half-bar pressing head to move up and down in a pneumatic driving manner.

The side skin pressing assemblies 414 are multiple and symmetrically distributed on two sides of the main pressing assembly 412 to support the side skin materials on two sides respectively. Similarly, the edge skin compressing assembly 414 specifically includes an edge skin compressing head and an edge skin compressing driving member, and the edge skin compressing driving member is a pneumatic driving member.

As shown in the cutting method of fig. 1, before the first step starts, each edge skin pressing driving member drives the edge skin pressing head to move downward to contact with the area of the silicon rod to be cut to form the edge skin and apply pressing force. After the first step of cutting is finished, the edge leather unloading mechanism is used for clamping the edge leather material, the edge leather pressing driving piece is used for driving the edge leather pressing head to ascend, the edge leather unloading mechanism is used for taking away the two edge leather obtained by cutting, and then the second step is executed. Before the second step is started, each edge skin compressing driving piece drives the edge skin compressing head to downwards move again to be in contact with the area to be cut to form the edge skin of the silicon rod for supporting, and the action process of the follow-up edge skin compressing driving piece is the same as that of the first step.

The present embodiment provides an implementation of the main compression assembly 412: as shown in fig. 9, the main pressing assembly 412 includes: a main compression driver, a main compression head and a main compression block 4121. The main compaction driver is connected with the main compaction head and drives the main compaction head to rotate. Specifically, a main compression driving shaft is connected between a main compression driver and a main compression head, the main compression driver drives the main compression head to rotate through the main compression driving shaft, and a main compression block 4121 is arranged on the end face of the main compression head.

The main compression drive, main compression drive shaft, main compression head may be implemented using solutions known in the art, and the present embodiment is not described in detail, nor is the drawing labeled in detail.

The main compaction driver drives the main compaction head to rotate through the main compaction driving shaft and can horizontally rotate so as to meet the requirement that the silicon rod horizontally rotates by 90 degrees. The main pressing head can also be adjusted in the vertical direction or a universal rotating mechanism is adopted, so that the main pressing head can adapt to the condition that the end face of the silicon rod is uneven or the end face of the silicon rod is not perpendicular to the central line. The main compaction driver can adopt a conventional scheme in the field, for example, the main compaction driver is composed of a motor, a harmonic reducer, a rotating shaft and other parts, and can meet the action requirements of silicon rod detection, rotation and universal rotation.

The number of the main compression blocks 4121 is at least two, all the main compression blocks 4121 are positioned in one half area of the main compression head, and the main compression blocks 4121 compress only one half area of the end face of the silicon rod.

One embodiment is: the end face of the main pressing head is circular, and the main pressing blocks 4121 are all positioned in one semicircle. The main compression block 4121 is provided to the end face of the main compression head in a protruding manner, and the main compression block 4121 extends along the center line direction of the main compression head. The main compression block 4121 comprises a guide rod and a spring, and the end part of the main compression block is provided with a polyurethane compression block for contacting with the silicon rod, so that the end face of the silicon rod is prevented from being scratched. The length of the main compression block 4121 is adjusted by the elasticity of the spring so as to meet the condition that the end face of the silicon rod is rugged or the end face of the silicon rod is not perpendicular to the central line.

Further, the two opposite sides of the pressing frame 411 are also provided with edge skin supports 415, and the edge skin supports 415 extend towards the direction of the silicon rod and extend to the two sides of the top of the silicon rod, so that edge skin materials are blocked from the side surfaces, and the edge skin materials are placed to be poured. In this embodiment, the welt skin support 415 has a plate-like structure, one end of which is fixed to the pressing frame 411, and the other end of which extends downward.

Further, as shown in fig. 10 and 11, the present embodiment further provides a supporting device 2, where the supporting device 2 includes: a main support assembly 21 and a half-bar support assembly 23. The silicon rod is placed on the main support assembly 21, and the main support assembly 21 is located below the middle of the silicon rod and is used for mainly supporting the silicon rod. The half-bar support assembly 23 is disposed at the periphery of the main support assembly 21 and below the half-bar obtained by cutting the silicon bar, for auxiliary support of the half-bar.

Further, the supporting device 2 further includes a side skin supporting component 22, where the side skin supporting component 22 is disposed at the periphery of the main supporting component 21 and is located below the side skin material obtained after the silicon rod is cut, and is used for supporting the side skin material. The distance between the side skin support member 22 and the main support member 21 is greater than the distance between the half bar support member 23 and the main support member 21.

The width of the main support assembly 21 is typically less than the diameter of the silicon rod. The main support assembly 21 is capable of independently supporting the silicon rod before the silicon rod is cut. After cutting, the side skin and the half stick are separated from each other, the bottom is stably supported by the side skin supporting component 22 and the half stick supporting component 23 respectively, and the side skin and the half stick are taken away by the subsequent waiting blanking mechanism.

The supporting device adopts the main supporting component to support the piece to be cut, the semi-rod supporting component and the edge skin supporting component are respectively arranged on the periphery of the main supporting component and are respectively used for supporting the semi-rod and the edge skin, the semi-rod and the edge skin are stably supported firstly, then the blanking mechanism is waited to take away the semi-rod and the edge skin respectively, the cutting procedure is smoothly carried out, and the semi-rod is further prevented from collapsing by adopting the semi-rod supporting. The scheme can meet the requirement of cutting the square bar into the half bars with smaller cross sectional areas.

On the basis of the above technical solution, the half-bar supporting assemblies 23 may be distributed on both sides of the main supporting assembly 21 for supporting two half-bars.

Alternatively, the half-bar support assembly 23 may be located on one side of the main support assembly 21, with only one half-bar being supported in an auxiliary manner. In the scheme, the step sequence of taking down the half bars is reasonably arranged, so that the half bar support assembly 23 only carries out auxiliary support on one half bar, and the two half bars can be taken away smoothly in sequence, thereby reducing the number of the half bar support assemblies 23 and reducing the component cost on one hand; on the other hand, the installation layout and the installation steps are simplified, the assembly difficulty and the cost are reduced, and the subsequent maintenance cost is also reduced.

The number of the half-bar support assemblies 23 may be set according to the diameter of the silicon bar to be cut, the size of the main support assembly 21. For example: the number of the half-bar support assemblies 23 is at least two, and the distances between each half-bar support assembly 23 and the main support assembly 21 are equal, namely: the rod support members 23 are spaced apart and located on the same circle. In this embodiment, two half-bar support members 23 are used, and are respectively located on two sides of a set of edge skin support members 22.

One embodiment is: the half-bar support assembly 23 comprises: a half-stick support head and a half-stick driving piece. The semi-rod driving piece is used for driving the semi-rod supporting head to move towards the silicon rod or move away from the silicon rod. Specifically, as shown in fig. 1, in the first step, the half-bar support head is in the initial position, namely: the top of the half-bar support head is lower than the main support assembly 21 and does not support the silicon bars. Before the second step starts, the semi-rod driving piece drives the semi-rod supporting head to move upwards to be contacted with the silicon rod for supporting. After the second step is finished, before the half rod supported by the half rod supporting head needs to be taken away, the blanking mechanism clamps the half rod, and then the half rod driving piece drives the half rod supporting head to descend so as to be separated from the half rod.

The semi-stick driving element can adopt a motor driving mode, a hydraulic driving mode or a pneumatic driving mode. In this embodiment, the semi-rod driving member is a pneumatic driving member, and drives the semi-rod supporting head to move up and down in a pneumatic driving manner.

The embodiment also provides an implementation mode of the half-bar supporting head. As shown in fig. 13, the half-bar support head includes: a half-bar support housing 231, a half-bar support compression spring 232, a half-bar support guide 233, a half-bar support pressing rod 234, and a half-bar support pressing block 235. Wherein the half-bar support housing 231 is connected to the half-bar driving member. A cavity is provided in the half-bar support housing 231, and one end of the cavity is blocked by a blocking block 236. The half bar support guide 233 is provided in the half bar support housing 231 at one end of the half bar support housing 231, and the half bar support guide 233 is provided with a center hole.

The half bar support pressing rod 234 is inserted into the half bar support housing 231 through a central hole of the half bar support guide 233, and the half bar support compression spring 232 is disposed between the half bar support pressing rod 234 and the blocking 236. One end of the half bar supporting pressing rod 234 is exposed out of the half bar supporting housing 231 and is connected to the half bar supporting pressing block 235. The half-bar support hold down blocks 235 are used to contact the silicon bars.

The half rod driving member drives the half rod supporting head to move upwards until the half rod supporting compressing block 235 applies pressure to the silicon rod, and the reaction force generated by the silicon rod causes the half rod supporting compressing block 235 to push the half rod supporting compressing rod 234 to move downwards and compress the half rod supporting compressing spring 232. The rebound force of the half-rod supporting compression spring 232 urges the half-rod supporting compression block 235 against the silicon rod, maintaining contact with the silicon rod.

The semi-rod pressing head may have a similar structure to the semi-rod supporting head, and will not be described in detail herein.

The number of the side skin supporting components 22 is plural, and the side skin supporting components are symmetrically distributed on two sides of the main supporting component 21 to respectively support the side skin materials on two sides. Similarly, the edge skin support assembly 22 specifically includes an edge skin support head and an edge skin drive, which is a pneumatic drive.

As shown in the cutting method of fig. 1, before the first step, each edge skin driving member drives the edge skin supporting head to move upwards to be contacted with the area of the silicon rod to be cut to form the edge skin for supporting. After the first step of cutting is finished, the edge leather unloading mechanism is used for clamping the edge leather material, the edge leather driving piece drives the edge leather supporting head to descend, the edge leather unloading mechanism is used for taking away the two edge leather pieces obtained by cutting, and then the second step is executed. Before the second step is started, each edge skin driving piece drives the edge skin supporting head to move upwards again to be in contact with the area of the silicon rod to be cut to form the edge skin for supporting, and the action process of the subsequent edge skin driving piece is the same as that of the first step.

On the basis of the technical scheme, the middle part of the top surface of the main support assembly 21 is recessed downwards to form a wire groove, and the wire groove penetrates from one end of the top surface of the main support assembly 21 to the other end of the top surface.

The main component in the main support assembly 21 is a supporting floating head 211, and a silicon rod is placed on the supporting floating head 211, and the supporting floating head 211 contacts and supports the silicon rod. The further main support assembly 21 further comprises: the rotating assembly 212 is arranged below the supporting floating head 211, and is connected with the supporting floating head 211 to drive the supporting floating head 211 to rotate. The support float head 211 may be rotated horizontally to meet the 90 degree horizontal rotation required in the step of fig. 1. The supporting floating head 211 can also realize universal rotation to adapt to the silicon rod with uneven end surface, for example: the end surface of the silicon rod is not perpendicular to the central line of the silicon rod, or the end surface is uneven, the supporting floating head 211 can generate universal rotation, so that the central line of the silicon rod is always kept vertical, and the cutting requirement can be met.

In the third step of fig. 1, a cutting line will cut from the vicinity of the center pin of the silicon rod, and after cutting the silicon rod downward, the cutting line enters the let-down groove 2113, avoiding damage to the supporting floating head 211 caused by cutting of the cutting line. After the subsequent removal of the half-stick from the support device, the cutting device is moved back up to the original position with the cutting line.

As shown in fig. 12, the supporting floating head 211 provided in this embodiment includes: a base 2111 and a support 2112, the support 2112 being provided on top of the base 2111. The middle of the top surface of the support 2112 is recessed downward to form a wire groove 2113, and the wire groove 2113 penetrates from one end of the top surface of the support 2112 to the other end of the top surface.

The position of the wire grooves 2113 on the substrate can be set according to the position of cutting the silicon rod, for example: if the silicon rod is cut through the center line of the silicon rod, the wire groove 2113 can be arranged at the center position of the base 2111; if the silicon rod is not cut through its center line, the wire grooves 2113 may be provided at positions corresponding to the cutting positions.

In this embodiment, the support 2112 is a cylinder with a circular top surface. The wire slots 2113 are allowed to pass through the top surface diameter of the support 2112, i.e., through the centerline of the support 2112. When the center line of the silicon rod coincides with the center line of the support 2113, the cut line cuts through the center line of the silicon rod, cuts the silicon rod into two half rods having the same cross-sectional area, and the cut line enters the line groove 2113. The cross sectional areas of the two half bars are equal, and the two half bars can enter a slicing machine to be cut subsequently, so that small silicon wafers with the same specification are obtained, production and storage according to the unified specification are facilitated, production efficiency and storage efficiency can be improved, and storage space utilization rate is improved.

In the cutting step shown in fig. 1, before the first step of cutting, the floating head is at the angle shown in fig. 10, and two cutting line segments for cutting the silicon rod are perpendicular to the wire grooves 2113. After the first step is finished, the floating head is controlled to rotate 90 degrees, and meanwhile the silicon rod is driven to rotate 90 degrees, and the angle of the figure 11 is reached. In the second step, two cutting line segments for cutting the silicon rod are parallel to the wire-letting groove, and then the cutting line segment in the middle in the second step in fig. 1 enters the wire-letting groove 2113 after cutting.

Further, the side wall of the support 2112 is provided with a reference plane 2114, and the reference plane 2114 extends vertically and is parallel to the extending direction of the wire groove 2113, which corresponds to cutting out a part at the edge of the support 2112. The reference plane 2114 is used for positioning during the installation of the support 2112, and whether the support 2112 is installed in place is judged by detecting the angle and the position of the reference plane 2114; and on the other hand, the edge skin supporting component 22 is abducted, so that the edge skin supporting component 22 is prevented from being bumped in the horizontal rotation process. The reference planes 2114 are specifically two, and are symmetrically arranged on both sides of the line groove 2113.

Further, a plurality of support blocks 2115 are provided on the top surface of the support 2112, and the support blocks 2115 are in contact with the silicon rod. Specifically, the supporting blocks 2115 are uniformly distributed on the top surface of the supporting piece 2112, so as to uniformly support the silicon rod, so that the stress of the silicon rod is uniform, and the probability of overturning is reduced.

In the above-mentioned scheme, the slot 2113 divides the top surface of the support member 2112 into two parts, and each part is provided with a plurality of support blocks 2115, and the support blocks 2115 are uniformly arranged on the part. As shown in fig. 10 and 11, three support blocks 2115 are provided per part, two support blocks 2115 being located beside the line groove 2113, and the other being located in the vicinity of the reference plane 2114.

The wire cutting device and the cutting apparatus provided by the embodiment can be produced and sold as independent products. The wire cutting apparatus has the same technical effects as the cutting device described above.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element in question must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may communicate with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

While preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the application.

It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims (12)

1. A cutting device, comprising:

cutting the frame;

three cutting heads arranged on the cutting frame; the three cutting machine heads can move vertically relative to the cutting frame so as to cut a workpiece to be cut through cutting lines wound on at least two cutting machine heads; at least two cutting heads are movable in a lateral direction relative to the cutting frame, one of the cutting heads being movable to a top center position of the workpiece to be cut to vertically move at that position to cut the workpiece to be cut.

2. The cutting device according to claim 1, wherein a first of the three cutting heads is arranged on a second cutting head, and moves vertically with the second cutting head relative to the cutting frame or moves laterally with the cutting frame.

3. The cutting device of claim 2, wherein the first cutting head is movably disposed on the second cutting head and is movable in a lateral direction relative to the second cutting head.

4. The cutting device of claim 1, further comprising:

the vertical guide mechanism is arranged between the cutting machine head and the cutting frame so as to enable the cutting frame to vertically move along the vertical guide mechanism; the vertical guide mechanism includes:

the vertical sliding rail is arranged on the cutting frame and extends along the vertical direction;

the vertical sliding plate is in sliding fit with the vertical sliding rail; the cutting machine head is arranged on the vertical sliding plate and moves vertically together with the vertical sliding plate.

5. The cutting device of claim 4, further comprising: the vertical driving mechanism and the vertical transmission mechanism are arranged on the cutting frame; the vertical driving mechanism is used for providing driving force for the cutting machine head to move vertically; the vertical transmission mechanism is used for transmitting the driving force of vertical movement to the cutting machine head; the vertical transmission mechanism comprises: the vertical screw rod extends vertically, the nut is in threaded fit with the vertical screw rod, the vertical screw rod is connected with the vertical driving mechanism, and the nut is connected with the vertical sliding plate.

6. The cutting device of any one of claims 1-5, further comprising:

and the locking mechanism is arranged at the upper part of the cutting frame and is used for locking the cutting machine head after the cutting machine head moves upwards to the proper position.

7. The cutting device of claim 4, further comprising:

the machine head frame is fixedly connected with the vertical sliding plate;

the transverse sliding rail is arranged on the machine head frame and extends along the transverse direction;

the transverse sliding plate is in sliding fit with the transverse sliding plate; the cutting head is fixed to the transverse slide.

8. The cutting device of claim 7, further comprising: the transverse driving mechanism and the transverse transmission mechanism are arranged on the machine head frame; the transverse driving mechanism is used for providing driving force for the cutting machine head to move transversely; the transverse transmission mechanism is used for transmitting the driving force of transverse movement to the cutting machine head; the transverse transmission mechanism comprises: the transverse screw rod is connected with the transverse driving mechanism, and the nut is connected with the transverse sliding plate.

9. The cutting device of claim 1, wherein the cutting head comprises:

a headstock;

at least two cutting line wheels for winding the annular cutting line are arranged on the headstock;

the tension pulley assembly is arranged on the headstock; the tension wheel assembly comprises a tension wheel for adjusting the tension of the cutting line.

10. A wire cutting apparatus, characterized by comprising: a cutting device as claimed in any one of claims 1 to 9.

11. The wire cutting apparatus as set forth in claim 10, further comprising: a compacting device and a supporting device; the supporting device is used for supporting the piece to be cut from the bottom; the compressing device is used for compressing the piece to be cut from the top.

12. The wire cutting apparatus according to claim 11, wherein the pressing device comprises: a main compression assembly and a half-bar compression assembly; the semi-rod compressing assembly is positioned at the periphery of the main compressing assembly and used for compressing the semi-rods; a cutting head is movable to a top center position of the workpiece to be cut and is positioned between the main pressing assembly and the half-bar pressing assembly to vertically move at that position to cut the workpiece to be cut.