CN116638651A

CN116638651A - Cutting control method applied to wire cutting equipment

Info

Publication number: CN116638651A
Application number: CN202310293988.4A
Authority: CN
Inventors: 霍士凡; 薛俊兵; 郭世锋; 刘克村
Original assignee: Qingdao Gaoce Technology Co Ltd
Current assignee: Qingdao Gaoce Technology Co Ltd
Priority date: 2023-03-23
Filing date: 2023-03-23
Publication date: 2023-08-25

Abstract

The embodiment of the application provides a cutting control method applied to wire cutting equipment, which comprises the following steps: the pressing device is controlled to move towards the workpiece to be cut until the main pressing component abuts against one side area of the top surface of the workpiece to be cut to press the workpiece to be cut; controlling the cutting device to move to cut the workpiece to be cut for the first time; horizontally rotating the piece to be cut by 90 degrees, and controlling the cutting device to move to cut the piece to be cut for the second time to obtain a square rod; controlling the cutting device to move to a target position above the square rod; controlling the semi-bar pressing assembly to move towards the piece to be cut until the other side area of the top surface of the square bar is pressed; controlling the semi-bar supporting component to move towards the piece to be cut until the semi-bar supporting component contacts with the bottom surface of the square bar; and controlling the cutting device to move to cut the square bar for the third time to obtain two half bars. The cutting control method provided by the embodiment of the application can meet the requirement of cutting the square bar into the half bar with smaller cross section area, and the small silicon chip with smaller size is directly obtained by slicing the half bar subsequently.

Description

Cutting control method applied to wire cutting equipment

Technical Field

The application relates to a wire cutting technology, in particular to a cutting control method of wire cutting equipment.

Background

The demand for small silicon wafers in the current battery market is increasing. In the manufacturing process of forming small silicon chips, a cylindrical monocrystalline silicon rod is generally cut into square rods, then the square rods are cut into large silicon chips, and then the large silicon chips are diced and cut by adopting a laser technology to form the small silicon chips. However, the laser scribing process can cause damage and defect states on the cross section of the small silicon wafer, and the conversion efficiency of the heterojunction battery finally processed is seriously affected.

Disclosure of Invention

In order to solve one of the technical defects, an embodiment of the present application provides a cutting control method applied to a wire cutting apparatus.

According to a first aspect of an embodiment of the present application, there is provided a cutting control method applied to a wire cutting apparatus;

the wire cutting apparatus includes: the device comprises a cutting device, a supporting device and a compacting device; the support device includes: a main support assembly and a half-bar support assembly; the compressing device comprises: a main compression assembly and a half-bar compression assembly;

the method comprises the following steps:

when a starting instruction is received, the pressing device is controlled to move towards the to-be-cut piece until the main pressing component abuts against one side area of the top surface of the to-be-cut piece so as to press the to-be-cut piece;

Controlling the cutting device to move to a target position above the piece to be cut, and then moving along the central line direction of the piece to be cut so as to cut the piece to be cut for the first time through two parallel cutting lines on the cutting device;

the workpiece to be cut is horizontally rotated by 90 degrees, the cutting device is controlled to move to a target position above the workpiece to be cut, and the workpiece to be cut moves along the central line direction of the workpiece to be cut, so that the workpiece to be cut is cut for the second time through two sections of parallel cutting lines on the cutting device, and a square rod is obtained;

controlling the cutting device to move to a target position above the square rod;

controlling the semi-bar pressing assembly to move towards the piece to be cut until the other side area of the top surface of the square bar is pressed;

controlling the semi-bar supporting component to move towards the piece to be cut until the semi-bar supporting component contacts with the bottom surface of the square bar;

controlling the cutting device to move along the central line direction of the square rod so as to cut the square rod for the third time through a section of cutting line on the cutting device, thereby obtaining two half rods; namely, the process of obtaining two finished product semi-bars after the round bar is cut for three times is realized.

According to a second aspect of the embodiments of the present application, there is provided another cutting control method applied to a wire cutting apparatus;

the method comprises the following steps:

rotating the piece to be cut horizontally by 90 degrees;

controlling the cutting device to move to a target position above the piece to be cut;

controlling the semi-rod pressing assembly to move towards the piece to be cut until the other side area of the top surface of the piece to be cut is pressed;

controlling the semi-rod supporting component to move towards the piece to be cut until contacting with the bottom surface of the piece to be cut;

controlling the cutting device to move along the central line direction of the workpiece to be cut so as to cut the workpiece to be cut for the second time through three sections of parallel cutting lines on the cutting device, thereby obtaining two half bars; namely, the process of obtaining two finished product semi-bars after the round bar is cut twice is realized.

According to a third aspect of an embodiment of the present application, there is provided an electronic apparatus including:

a memory;

a processor; and

a computer program;

wherein the computer program is stored in the memory and configured to be executed by the processor to implement the control method as described above.

According to a fourth aspect of an embodiment of the present application, there is provided a computer-readable storage medium having a computer program stored thereon; the computer program is executed by a processor to implement the control method as described above.

According to the technical scheme provided by the embodiment of the application, the pressing device is controlled to move towards the piece to be cut until the main pressing component abuts against one side area of the top surface of the piece to be cut to press the piece to be cut; controlling the cutting device to move to cut the workpiece to be cut; horizontally rotating the piece to be cut by 90 degrees, and controlling the cutting device to move to cut the piece to be cut to obtain a square rod; controlling the cutting device to move to a target position above the square rod; controlling the semi-bar pressing assembly to move towards the piece to be cut until the other side area of the top surface of the square bar is pressed; controlling the semi-bar supporting component to move towards the piece to be cut until the semi-bar supporting component contacts with the bottom surface of the square bar; the cutting device is controlled to move to cut the square rod to obtain two half rods with smaller cross sections, the follow-up half rods are sliced to directly obtain small silicon wafers with smaller sizes, laser scribing is not needed to be conducted on the silicon wafers, damage to the surfaces of the silicon wafers is reduced, and the conversion efficiency of the heterojunction battery finally processed is improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:

FIG. 1 is a flow chart of a method for cutting a silicon rod according to an embodiment of the present application;

FIG. 2 is a flow chart of another method for cutting a silicon rod according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a wire cutting apparatus according to an embodiment of the present application;

fig. 4 is a schematic structural view of a pressing device and a supporting device for pressing a silicon rod in a wire cutting apparatus according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of a pressing device in a wire cutting device according to an embodiment of the present application;

fig. 6 is a schematic structural view of a supporting device in a wire cutting apparatus according to an embodiment of the present application;

fig. 7 is a schematic structural view of a supporting device in a wire cutting apparatus according to an embodiment of the present application rotated to another angle;

fig. 8 is a schematic structural view of a supporting floating head in a wire cutting apparatus according to an embodiment of the present application;

FIG. 9 is a cross-sectional view of a semi-stick support head provided by an embodiment of the present application;

fig. 10 to fig. 12 are schematic diagrams illustrating the position actions of the pressing device and the supporting device in the first control method according to the embodiment of the present application;

Fig. 13-15 are schematic diagrams illustrating the position and motion of a cutting device in a first control method according to an embodiment of the present application;

fig. 16 to 21 are schematic diagrams illustrating actions of a blanking process in the control method according to the embodiment of the present application;

fig. 22-23 are schematic diagrams illustrating the position and motion of the pressing device and the supporting device in the second control method according to the embodiment of the present application;

fig. 24-25 are schematic diagrams illustrating the position and motion of a cutting device in a second control method according to an embodiment of the present application;

FIG. 26 is a flowchart of a cutting control method according to an embodiment of the present application;

fig. 27 is a flowchart of another cutting control method according to an embodiment of the present application.

Reference numerals:

1-a stand;

2-supporting means; 21-a main support assembly; 211-supporting a floating head; 2111-substrate; 2112-support; 2113-let wire chase; 2114-a reference plane; 2115-supporting blocks; 212-a rotating assembly; 22-a side skin support assembly; 23-a semi-bar support assembly; 231-a semi-stick support housing; 232-half bar support compression springs; 233-half bar support guide; 234-half bar support hold-down bar; 235-a semi-stick supporting compaction block; 236-blocking;

3-a cutting device; 31-a handpiece;

4-a compressing device; 41-a pressing mechanism; 411-a compression rack; 412-a main hold-down assembly; 4121-a main compression block; 413—a semi-bar compaction assembly; 414-edge skin compression assembly; 415-a buttress support; 42-compressing the driving mechanism; 43-pressing guide mechanism;

5-silicon rod; 51-half bar;

6-blanking clamping jaws;

7-cutting position.

Detailed Description

In order to make the technical solutions and advantages of the embodiments of the present application more apparent, the following detailed description of exemplary embodiments of the present application is provided in conjunction with the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present application and not exhaustive of all embodiments. It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.

The embodiment provides a control method applicable to wire cutting equipment, which is used for cutting a piece to be cut through a cutting wire on the wire cutting equipment. The wire cutting device may be a guillotine, squarer or other device. The piece to be cut can be a hard and brittle material rod such as monocrystalline silicon, polycrystalline silicon, magnetic material, sapphire and the like. The present embodiment provides a wire cutting apparatus for cutting a silicon rod, taking a single crystal silicon rod as an example. The solution provided by the present embodiment can also be applied by those skilled in the art to wire cutting equipment for cutting other bars of hard and brittle material.

In the traditional scheme, the production process of the silicon wafer is as follows: firstly, square a cylindrical silicon rod, namely: and cutting the silicon rod along the length direction of the silicon rod to obtain a square rod with a rectangular cross section, wherein the cut part is made of side leather. And then slicing the square rod to obtain the silicon wafer. And finally, carrying out laser scribing on the silicon wafer to obtain the silicon wafer with smaller size. However, the laser scribing process can cause damage and defect states on the cross section of the small silicon wafer, and the conversion efficiency of the heterojunction battery finally processed is seriously affected.

The embodiment of the application adopts different cutting modes: after the square rod is obtained, the square rod is cut again along the length direction of the square rod to obtain a half rod with smaller cross section area, and then the half rod is sliced, so that the silicon wafer with smaller size can be directly obtained, and the laser scribing mode is not adopted any more, and the problems can be solved.

As shown in fig. 1, one specific way is: firstly, cutting a cylindrical silicon rod along the length direction by adopting two parallel cutting lines; secondly, horizontally rotating the cut silicon rod by 90 degrees, and cutting the cylindrical silicon rod along the length direction by adopting two parallel cutting lines again to obtain a square rod with a rectangular cross section; thirdly, cutting the square bar along the length direction of the square bar by adopting a wire saw to obtain two half bars with smaller cross sectional areas; cutting in three steps to obtain two half bars and four side leather materials; and fourthly, slicing the semi-stick to obtain the small silicon chip with the rectangular cross section area.

As shown in fig. 2, another specific way is: firstly, cutting a cylindrical silicon rod along the length direction by adopting two parallel cutting lines; secondly, horizontally rotating the cut silicon rod by 90 degrees, and cutting the silicon rod along the length direction by adopting three parallel cutting lines to obtain two half rods with rectangular cross sections; two half bars and four side leather materials are obtained after two steps of cutting; and thirdly, slicing the semi-stick to obtain the small silicon chip with the rectangular cross section area.

Based on the above two specific implementations, the present embodiment provides a wire cutting apparatus, as shown in fig. 3 to 4, including: the machine seat 1, the supporting device 2, the cutting device 3 and the compacting device 4 are arranged on the machine seat 1, and the supporting device 2, the cutting device 3 and the compacting device 4 are arranged on the machine seat. The supporting device 2 is used for supporting the workpiece to be cut, and the pressing device 4 is used for applying pressing force to the workpiece to be cut from the top end so as to press the workpiece to be cut between the pressing device 4 and the supporting device 2. The cutting device 3 is movable toward the workpiece to be cut and cuts the workpiece to be cut by the cutting line during the movement.

Specifically, the nose of the cutting device 3 is fed vertically, and the cutting device 3 is wound with a cutting line. During the running process of the equipment, the silicon rod is vertically placed on the supporting device 2, and the pressing device 4 presses the silicon rod downwards from the top. The cutting device 3 is controlled to move downwards, and the silicon rod is cut according to the preset position through the cutting line.

The support device 2 includes: a main support assembly 21 and a half-bar support assembly 23. The half-bar supporting component 23 is located at the periphery of the main supporting component 21 and is used for supporting the half-bar obtained after the workpiece to be cut is cut. The half-bar support assembly 23 is movable toward and into contact with or away from the workpiece to be cut.

The pressing device 4 includes: a main compression assembly 412 and a half-bar compression assembly 413. Wherein, the half-stick compressing assembly 413 is located at the periphery of the main compressing assembly 412, and is used for compressing the half-stick. The half-bar compression assembly 413 may be moved toward or away from the workpiece to be cut relative to the main compression assembly 412.

In the first and second steps of fig. 1 (first step of fig. 2), the silicon rod is compacted by the main support assembly 21 and the main compacting assembly 412. In the third step of fig. 1 (second part of fig. 2), the half-rod supporting assembly 23 is moved upward to be in contact with the silicon rod, and the half-rod pressing assembly 413 is moved downward to press the silicon rod, so that the silicon rod is entirely pressed by the main supporting assembly 21, the half-rod supporting assembly 23, the main pressing assembly 412 and the half-rod pressing assembly 413 during the cutting of the silicon rod to obtain the half-rod.

According to the technical scheme provided by the embodiment, a cutting device, a supporting device and a compressing device are arranged on a machine base, the supporting device is used for supporting a piece to be cut, and the compressing device is used for applying compressing force to the piece to be cut from the top end so as to compress the piece to be cut between the compressing device and the supporting device; the cutting device can move towards the piece to be cut and cut the piece to be cut through the cutting line in the moving process. Wherein, strutting arrangement includes: a main support assembly and a half-bar support assembly; the semi-rod supporting component is positioned at the periphery of the main supporting component and is used for supporting the semi-rod obtained after the piece to be cut is cut; the semi-stick support assembly can move towards the to-be-cut piece to be contacted with the to-be-cut piece or away from the to-be-cut piece. The compressing device comprises: a main compression assembly and a half-bar compression assembly; the semi-rod compressing assembly is positioned at the periphery of the main compressing assembly and used for compressing the semi-rods; the half-bar pressing assembly is movable relative to the main pressing assembly toward the workpiece to be cut into contact with or away from the workpiece to be cut. The scheme can meet the requirement of cutting the square rod into the semi-rod with smaller cross section area, the follow-up semi-rod is cut into slices to directly obtain the small silicon wafer with smaller size, laser scribing is not needed to be carried out on the silicon wafer, the damage to the surface of the silicon wafer is reduced, and the conversion efficiency of the heterojunction battery finally processed is improved.

Further, the half-bar pressing assemblies 413 correspond to the positions of the half-bar supporting assemblies 23 to clamp the workpiece to be cut from the corresponding positions of both ends of the workpiece to be cut, respectively. For example: the half rod pressing assembly 413 and the half rod supporting assembly 23 are all positioned on the left side, or are all positioned on the right side, or are all positioned on the left side and the right side and correspond to each other in position, so that the force application direction of the half rod pressing assembly 413 and the half rod supporting assembly 23 to the silicon rod is collinear, and the half rod pressing assembly is parallel to the central line of the silicon rod, and the pressing stability is improved.

In this embodiment, the half-rod supporting assembly 23 is located on one side of the main supporting assembly 21, and the half-rod compressing assembly 413 is located on one side of the main compressing assembly 412, so that only half of the silicon rod is compressed when the half-rod is obtained by cutting.

As shown in fig. 5, the present embodiment provides a pressing device 4 including: the pressing mechanism 41, a pressing driving mechanism 42 for driving the pressing mechanism 41 to move in the feeding direction, and a pressing guide mechanism 43. In this embodiment, the feeding direction is vertical. The pressing guide 43 extends vertically, in particular may be a vertical guide rail. The hold-down mechanism 41 slides vertically along the rail. The pressing drive mechanism 42 supplies a driving force to the pressing mechanism 41, driving the pressing mechanism 41 to slide vertically.

As shown in fig. 4 and 5, the pressing mechanism 41 includes: a compression bracket 411, a main compression assembly 412 and a half bar compression assembly 413. The pressing frame 411 is a frame body structure and is connected with the pressing driving mechanism 42, and moves vertically under the driving action of the pressing driving mechanism 42. The pressing frame 411 has a portion connected to the pressing driving mechanism 42, a middle portion, and a mounting portion extending to the top of the silicon rod 5. The main packing assembly 412 and the half-bar packing assembly 413 are disposed at the mounting portion of the packing frame 411.

The main pressing assembly 412 is provided at the middle of the mounting portion for applying a downward pressing force to the silicon rod from the top to press the silicon rod.

The half-rod compressing assembly 413 is located at the periphery of the main compressing assembly 412, and is used for compressing the half-rods obtained after the silicon rods are cut.

Further, the pressing mechanism 41 further includes a side skin pressing assembly 414 disposed at the mounting portion of the pressing frame 411. The edge skin compressing assembly 414 is located at the periphery of the main compressing assembly 412, and is used for compressing the edge skin obtained after the silicon rod is cut. The distance between the edge skin compression assembly 414 and the main compression assembly 412 is greater than the distance between the rod half compression assembly 413 and the main compression assembly 412.

In the cutting method of fig. 1 and 2 described above, before the half-bar is formed by intermediate cutting, the head of the cutting device is moved inward in the radial direction of the silicon bar until the cutting line reaches the vicinity of the center line of the silicon bar, and then the head is moved downward to intermediate cut the silicon bar through the cutting line. To yield the cut line during radial movement of the hand piece, the main compression assembly 412 can only be positioned on one side of the silicon rod to compress the silicon rod, while the other side of the silicon rod compresses the silicon rod by the independently moving half-rod compression assembly.

On the basis of the above technical solution, the half-bar compressing assemblies 413 may be distributed at both sides of the main compressing assembly 412 for compressing two half-bars.

Alternatively, the half-bar compression assembly 413 may be located on one side of the main compression assembly 412 for compressing only one of the half-bars. In the scheme, the step sequence of taking down the half bars is reasonably set, so that the half bar pressing assembly 413 only presses one of the half bars, and the two half bars can be taken away smoothly in sequence, thereby reducing the number of the half bar pressing assemblies 413 and reducing the component cost; on the other hand, the installation layout and the installation steps are simplified, the assembly difficulty and the cost are reduced, and the subsequent maintenance cost is also reduced.

The number of the half-bar pressing assemblies 413 may be set according to the diameter of the silicon bar to be cut, and the size of the main pressing assembly 412. For example: the number of the half-bar pressing assemblies 413 is at least two, and the distances between each half-bar pressing assembly 413 and the main pressing assembly 412 are equal, namely: the rod pressing assemblies 413 are spaced apart and located on the same circle. In this embodiment, two half-bar pressing assemblies 413 are used, and are respectively located at two sides of a group of edge skin pressing assemblies 414.

One embodiment is: the half-bar compression assembly 413 includes: a half-bar compressing head and a half-bar driving piece. The semi-rod driving piece is used for driving the semi-rod supporting head to move towards the silicon rod or move away from the silicon rod. Specifically, in the cutting method shown in fig. 1, in the first step and the second step, the half-bar pressing head is in the initial position, that is: the top of the half-bar compression head is higher than the main compression assembly 412 and does not contact the silicon bar. Before the third step begins, the half-rod pressing piece drives the half-rod pressing head to move downwards to be in contact with the silicon rod to apply pressing force. After the third step is finished, before the compressed half rod needs to be taken away, the blanking mechanism clamps the half rod, and then the half rod compressing piece drives the half rod compressing head to ascend and separate from the half rod.

In the first step, the half-bar pressing head is in the initial position, i.e.: the top of the half-bar compression head is higher than the main compression assembly 412 and does not contact the silicon bar. Before the second step begins, the half-rod pressing member drives the half-rod pressing head to move toward contact with the silicon rod to apply pressing force. After the second step is finished, before the compressed half rod needs to be taken away, the blanking mechanism clamps the half rod, and then the half rod compressing piece drives the half rod compressing head to ascend and separate from the half rod.

The semi-stick pressing piece can be driven by a motor, hydraulically or pneumatically. In this embodiment, the half-bar pressing member is a pneumatic driving member, and drives the half-bar pressing head to move up and down in a pneumatic driving manner.

The side skin pressing assemblies 414 are multiple and symmetrically distributed on two sides of the main pressing assembly 412 to support the side skin materials on two sides respectively. Similarly, the edge skin compressing assembly 414 specifically includes an edge skin compressing head and an edge skin compressing driving member, and the edge skin compressing driving member is a pneumatic driving member.

As shown in the cutting methods of fig. 1 and 2, before the first step begins, each of the edge skin pressing driving members drives the edge skin pressing head to move downward to contact with the area of the silicon rod to be cut to form the edge skin and apply pressing force. After the first step of cutting is finished, the edge leather unloading mechanism is used for clamping the edge leather material, the edge leather pressing driving piece is used for driving the edge leather pressing head to ascend, the edge leather unloading mechanism is used for taking away the two edge leather obtained by cutting, and then the second step is executed. Before the second step is started, each edge skin compressing driving piece drives the edge skin compressing head to downwards move again to be in contact with the area to be cut to form the edge skin of the silicon rod for supporting, and the action process of the follow-up edge skin compressing driving piece is the same as that of the first step.

The present embodiment provides an implementation of the main compression assembly 412: as shown in fig. 5, the main compression assembly 412 includes: a main compression driver, a main compression head and a main compression block 4121. The main compaction driver is connected with the main compaction head and drives the main compaction head to rotate. Specifically, a main compression driving shaft is connected between a main compression driver and a main compression head, the main compression driver drives the main compression head to rotate through the main compression driving shaft, and a main compression block 4121 is arranged on the end face of the main compression head.

The main compression drive, main compression drive shaft, main compression head may be implemented using solutions known in the art, and the present embodiment is not described in detail, nor is the drawing labeled in detail.

The main compaction driver drives the main compaction head to rotate through the main compaction driving shaft and can horizontally rotate so as to meet the requirement that the silicon rod horizontally rotates by 90 degrees. The main pressing head can also be adjusted in the vertical direction or a universal rotating mechanism is adopted, so that the main pressing head can adapt to the condition that the end face of the silicon rod is uneven or the end face of the silicon rod is not perpendicular to the central line. The main compaction driver can adopt a conventional scheme in the field, for example, the main compaction driver is composed of a motor, a harmonic reducer, a rotating shaft and other parts, and can meet the action requirements of silicon rod detection, rotation and universal rotation.

The number of the main compression blocks 4121 is at least two, all the main compression blocks 4121 are positioned in one half area of the main compression head, and the main compression blocks 4121 compress only one half area of the end face of the silicon rod.

One embodiment is: the end face of the main pressing head is circular, and the main pressing blocks 4121 are all positioned in one semicircle. The main compression block 4121 is provided to the end face of the main compression head in a protruding manner, and the main compression block 4121 extends along the center line direction of the main compression head. The main compression block 4121 comprises a guide rod and a spring, and the end part of the main compression block is provided with a polyurethane compression block for contacting with the silicon rod, so that the end face of the silicon rod is prevented from being scratched. The length of the main compression block 4121 is adjusted by the elasticity of the spring so as to meet the condition that the end face of the silicon rod is rugged or the end face of the silicon rod is not perpendicular to the central line.

Further, the two opposite sides of the pressing frame 411 are also provided with edge skin supports 415, and the edge skin supports 415 extend towards the direction of the silicon rod and extend to the two sides of the top of the silicon rod, so that edge skin materials are blocked from the side surfaces, and the edge skin materials are placed to be poured. In this embodiment, the welt skin support 415 has a plate-like structure, one end of which is fixed to the pressing frame 411, and the other end of which extends downward.

Further, as shown in fig. 6 and 7, the present embodiment further provides a supporting device 2, where the supporting device 2 includes: a main support assembly 21 and a half-bar support assembly 23. The silicon rod is placed on the main support assembly 21, and the main support assembly 21 is located below the middle of the silicon rod and is used for mainly supporting the silicon rod. The half-bar support assembly 23 is disposed at the periphery of the main support assembly 21 and below the half-bar obtained by cutting the silicon bar, for auxiliary support of the half-bar.

Further, the supporting device 2 further includes a side skin supporting component 22, where the side skin supporting component 22 is disposed at the periphery of the main supporting component 21 and is located below the side skin material obtained after the silicon rod is cut, and is used for supporting the side skin material. The distance between the side skin support member 22 and the main support member 21 is greater than the distance between the half bar support member 23 and the main support member 21.

The width of the main support assembly 21 is typically less than the diameter of the silicon rod. The main support assembly 21 is capable of independently supporting the silicon rod before the silicon rod is cut. After cutting, the side skin and the half stick are separated from each other, the bottom is stably supported by the side skin supporting component 22 and the half stick supporting component 23 respectively, and the side skin and the half stick are taken away by the subsequent waiting blanking mechanism.

The supporting device adopts the main supporting component to support the piece to be cut, the semi-rod supporting component and the edge skin supporting component are respectively arranged on the periphery of the main supporting component and are respectively used for supporting the semi-rod and the edge skin, the semi-rod and the edge skin are stably supported firstly, then the blanking mechanism is waited to take away the semi-rod and the edge skin respectively, the cutting procedure is smoothly carried out, and the semi-rod is further prevented from collapsing by adopting the semi-rod supporting. The scheme can meet the requirement of cutting the square bar into the half bars with smaller cross sectional areas.

On the basis of the above technical solution, the half-bar supporting assemblies 23 may be distributed on both sides of the main supporting assembly 21 for supporting two half-bars.

Alternatively, the half-bar support assembly 23 may be located on one side of the main support assembly 21, with only one half-bar being supported in an auxiliary manner. In the scheme, the step sequence of taking down the half bars is reasonably arranged, so that the half bar support assembly 23 only carries out auxiliary support on one half bar, and the two half bars can be smoothly taken away, thereby reducing the number of the half bar support assemblies 23 and the component cost on the one hand; on the other hand, the installation layout and the installation steps are simplified, the assembly difficulty and the cost are reduced, and the subsequent maintenance cost is also reduced.

The number of the half-bar support assemblies 23 may be set according to the diameter of the silicon bar to be cut, the size of the main support assembly 21. For example: the number of the half-bar support assemblies 23 is at least two, and the distances between each half-bar support assembly 23 and the main support assembly 21 are equal, namely: the rod support members 23 are spaced apart and located on the same circle. In this embodiment, two half-bar support members 23 are used, and are respectively located on two sides of a set of edge skin support members 22.

One embodiment is: the half-bar support assembly 23 comprises: a half-stick support head and a half-stick driving piece. The semi-rod driving piece is used for driving the semi-rod supporting head to move towards the silicon rod or move away from the silicon rod. Specifically, in the cutting method shown in fig. 1, in the first step and the second step, the half-bar support head is in the initial position, that is: the top of the half-bar support head is lower than the main support assembly 21 and does not support the silicon bars. Before the third step starts, the half rod driving piece drives the half rod supporting head to move upwards to be contacted with the silicon rod for supporting. After the third step is finished, before the half rod supported by the half rod supporting head needs to be taken away, the blanking mechanism clamps the half rod, and then the half rod driving piece drives the half rod supporting head to descend so as to be separated from the half rod.

In a first step, the half-bar support head is in an initial position, i.e.: the top of the half-bar support head is lower than the main support assembly 21 and does not support the silicon bars. Before the second step starts, the semi-rod driving piece drives the semi-rod supporting head to move upwards to be contacted with the silicon rod for supporting. After the second step is finished, before the half rod supported by the half rod supporting head needs to be taken away, the blanking mechanism clamps the half rod, and then the half rod driving piece drives the half rod supporting head to descend so as to be separated from the half rod.

The semi-stick driving element can adopt a motor driving mode, a hydraulic driving mode or a pneumatic driving mode. In this embodiment, the semi-rod driving member is a pneumatic driving member, and drives the semi-rod supporting head to move up and down in a pneumatic driving manner.

The embodiment also provides an implementation mode of the half-bar supporting head. As shown in fig. 9, the half-bar support head includes: a half-bar support housing 231, a half-bar support compression spring 232, a half-bar support guide 233, a half-bar support pressing rod 234, and a half-bar support pressing block 235. Wherein the half-bar support housing 231 is connected to the half-bar driving member. A cavity is provided in the half-bar support housing 231, and one end of the cavity is blocked by a blocking block 236. The half bar support guide 233 is provided in the half bar support housing 231 at one end of the half bar support housing 231, and the half bar support guide 233 is provided with a center hole.

The half bar support pressing rod 234 is inserted into the half bar support housing 231 through a central hole of the half bar support guide 233, and the half bar support compression spring 232 is disposed between the half bar support pressing rod 234 and the blocking 236. One end of the half bar supporting pressing rod 234 is exposed out of the half bar supporting housing 231 and is connected to the half bar supporting pressing block 235. The half-bar support hold down blocks 235 are used to contact the silicon bars.

The half rod driving member drives the half rod supporting head to move upwards until the half rod supporting compressing block 235 applies pressure to the silicon rod, and the reaction force generated by the silicon rod causes the half rod supporting compressing block 235 to push the half rod supporting compressing rod 234 to move downwards and compress the half rod supporting compressing spring 232. The rebound force of the half-rod supporting compression spring 232 urges the half-rod supporting compression block 235 against the silicon rod, maintaining contact with the silicon rod.

The semi-rod pressing head may have a similar structure to the semi-rod supporting head, and will not be described in detail herein.

The number of the side skin supporting components 22 is plural, and the side skin supporting components are symmetrically distributed on two sides of the main supporting component 21 to respectively support the side skin materials on two sides. Similarly, the edge skin support assembly 22 specifically includes an edge skin support head and an edge skin drive, which is a pneumatic drive.

As shown in fig. 1 and 2, before the first step begins, each edge skin driving member drives the edge skin supporting head to move upwards to be contacted with the area of the silicon rod to be cut to form the edge skin for supporting. After the first step of cutting is finished, the edge leather unloading mechanism is used for clamping the edge leather material, the edge leather driving piece drives the edge leather supporting head to descend, the edge leather unloading mechanism is used for taking away the two edge leather pieces obtained by cutting, and then the second step is executed. Before the second step is started, each edge skin driving piece drives the edge skin supporting head to move upwards again to be in contact with the area of the silicon rod to be cut to form the edge skin for supporting, and the action process of the subsequent edge skin driving piece is the same as that of the first step.

On the basis of the technical scheme, the middle part of the top surface of the main support assembly 21 is recessed downwards to form a wire groove, and the wire groove penetrates from one end of the top surface of the main support assembly 21 to the other end of the top surface.

The main component in the main support assembly 21 is a supporting floating head 211, and a silicon rod is placed on the supporting floating head 211, and the supporting floating head 211 contacts and supports the silicon rod. The further main support assembly 21 further comprises: the rotating assembly 212 is arranged below the supporting floating head 211, and is connected with the supporting floating head 211 to drive the supporting floating head 211 to rotate. The support float head 211 may be rotated horizontally to meet the requirement of being rotated horizontally 90 ° in the steps of fig. 1 and 2. The supporting floating head 211 can also realize universal rotation to adapt to the silicon rod with uneven end surface, for example: the end surface of the silicon rod is not perpendicular to the central line of the silicon rod, or the end surface is uneven, the supporting floating head 211 can generate universal rotation, so that the central line of the silicon rod is always kept vertical, and the cutting requirement can be met.

In the third step of fig. 1 and the second step of fig. 2, a cutting line will cut from the vicinity of the center pin of the silicon rod, and after cutting the silicon rod downward, the cutting line enters the wire groove 2113, avoiding damage to the supporting floating head 211 caused by cutting of the cutting line. After the subsequent removal of the half-stick from the support device, the cutting device is moved back up to the original position with the cutting line.

As shown in fig. 8, the supporting floating head 211 provided in this embodiment includes: a base 2111 and a support 2112, the support 2112 being provided on top of the base 2111. The middle of the top surface of the support 2112 is recessed downward to form a wire groove 2113, and the wire groove 2113 penetrates from one end of the top surface of the support 2112 to the other end of the top surface.

The position of the wire grooves 2113 on the substrate can be set according to the position of cutting the silicon rod, for example: if the silicon rod is cut through the center line of the silicon rod, the wire groove 2113 can be arranged at the center position of the base 2111; if the silicon rod is not cut through its center line, the wire grooves 2113 may be provided at positions corresponding to the cutting positions.

In this embodiment, the support 2112 is a cylinder with a circular top surface. The wire slots 2113 are allowed to pass through the top surface diameter of the support 2112, i.e., through the centerline of the support 2112. When the center line of the silicon rod coincides with the center line of the support 2113, the cut line cuts through the center line of the silicon rod, cuts the silicon rod into two half rods having the same cross-sectional area, and the cut line enters the line groove 2113. The cross sectional areas of the two half bars are equal, and the two half bars can enter a slicing machine to be cut subsequently, so that small silicon wafers with the same specification are obtained, production and storage according to the unified specification are facilitated, production efficiency and storage efficiency can be improved, and storage space utilization rate is improved.

In the cutting step shown in fig. 1 and 2, before the first step of cutting, the floating head is at the angle shown in fig. 6, and two cutting line segments for cutting the silicon rod are perpendicular to the line grooves 2113. After the first step is finished, the floating head is controlled to rotate 90 degrees, and meanwhile the silicon rod is driven to rotate 90 degrees, and the angle of the silicon rod is changed to the angle of fig. 7. In the second step, two cutting line segments for cutting the silicon rod are parallel to the wire-letting groove, and then the cutting line segment located in the middle in the third step in fig. 1 and the second step in fig. 2 enters the wire-letting groove 2113 after cutting.

Further, the side wall of the support 2112 is provided with a reference plane 2114, and the reference plane 2114 extends vertically and is parallel to the extending direction of the wire groove 2113, which corresponds to cutting out a part at the edge of the support 2112. The reference plane 2114 is used for positioning during the installation of the support 2112, and whether the support 2112 is installed in place is judged by detecting the angle and the position of the reference plane 2114; and on the other hand, the edge skin supporting component 22 is abducted, so that the edge skin supporting component 22 is prevented from being bumped in the horizontal rotation process. The reference planes 2114 are specifically two, and are symmetrically arranged on both sides of the line groove 2113.

Further, a plurality of support blocks 2115 are provided on the top surface of the support 2112, and the support blocks 2115 are in contact with the silicon rod. Specifically, the supporting blocks 2115 are uniformly distributed on the top surface of the supporting piece 2112, so as to uniformly support the silicon rod, so that the stress of the silicon rod is uniform, and the probability of overturning is reduced.

In the above-mentioned scheme, the slot 2113 divides the top surface of the support member 2112 into two parts, and each part is provided with a plurality of support blocks 2115, and the support blocks 2115 are uniformly arranged on the part. As shown in fig. 6 and 7, three support blocks 2115 are provided per part, two support blocks 2115 being located beside the line groove 2113, and the other being located in the vicinity of the reference plane 2114.

Based on the above wire cutting apparatus, the present embodiment provides a control method corresponding to the cutting method of fig. 1, as shown in fig. 26, including the steps of:

and 11, when a starting instruction is received, controlling the pressing device to move towards the workpiece to be cut until the main pressing component abuts against one side area of the top surface of the workpiece to be cut so as to press the workpiece to be cut.

The starting instruction can be triggered by a mechanical button on the wire cutting machine, a man-machine interaction screen on the wire cutting machine and a remote control platform. The starting instruction is used for starting the wire cutting equipment and cutting according to preset steps.

After receiving the starting instruction, the wire cutting equipment can be self-checked first, and cutting can be started after the equipment is normal.

The pressing device 2 is controlled to move towards the piece to be cut, namely: the pressing driving mechanism 42 in the control pressing device 2 drives the pressing mechanism 41 to move downwards along the pressing guide mechanism 43 until the main pressing assembly 412 abuts against the top surface of the silicon rod. The main compression block 4121 in the main compression assembly 412 presses against half of the top surface of the silicon rod as shown in fig. 10.

In this step, the half-rod support assembly 23 is lowered out of contact with the silicon rod 5. The half-rod pressing assembly 413 is lifted out of contact with the silicon rod 5. The edge skin supporting component 22 and the edge skin pressing component 413 respectively support and press the edge skin position to be cut. The let-down grooves 2113 on the support floating head 211 are perpendicular to the cutting line segment for cutting the silicon rod.

And 12, controlling the cutting device to move to a target position above the piece to be cut, and then moving along the central line direction of the piece to be cut so as to cut the piece to be cut for the first time through two parallel cutting lines on the cutting device.

As shown in fig. 13, after the pressing mechanism 41 is moved into place, the two heads 31 in the cutting device 3 are controlled to move to a target position above the silicon rod, for example: the head 31 is movable vertically, radially of the silicon rod, so that the cutting line on the head is aligned with the position where the silicon rod is to be cut, as in cutting position 7 in fig. 10. When the heads 31 are moved into position, the two heads 31 are controlled to move downward, and each head 31 is provided with an annular cutting line. The cutting lines on the two heads 31 are parallel, the silicon rod is cut, and the side skin materials on the two sides are cut off.

After the step is finished, the edge leather is taken away by an edge leather unloading mechanism.

After this step, the silicon rod has two opposite flat surfaces and an arcuate surface joined between the two flat surfaces.

And 13, horizontally rotating the piece to be cut by 90 degrees, controlling the cutting device to move to a target position above the piece to be cut, and moving along the central line direction of the piece to be cut so as to cut the piece to be cut for the second time through two sections of parallel cutting lines on the cutting device, thereby obtaining the square rod.

The piece to be cut is horizontally rotated by 90 degrees, specifically, the main pressing assembly 412 and the main supporting assembly 21 are controlled to horizontally rotate by 90 degrees along the same direction, so that the silicon rods are driven to rotate together. After 90 deg. turn, the main compression assembly 412 turns to the right side portion of the top of the silicon rod, as shown in fig. 11. After 90 ° turn, the wire grooves 2113 are made parallel to the cutting line segment that cuts the silicon rod.

After the completion of step 12, the cutting device 3 is controlled to move back up to the initial position. In step 13, the control cutting device 3 cuts the silicon rod in the same manner as in step 12, as shown in fig. 14.

In this step, the half-rod support assembly 23 is lowered out of contact with the silicon rod 5. The half-rod pressing assembly 413 is lifted out of contact with the silicon rod 5. The edge skin supporting component 22 and the edge skin pressing component 413 respectively support and press the edge skin position to be cut.

After the steps, cutting off the other two pieces of the side leather materials, and taking the side leather materials away through a side leather unloading mechanism. And cutting the silicon rod to obtain a square rod with a rectangular cross section.

And 14, controlling the cutting device to move to a target position above the square rod.

After the completion of step 13, the cutting device 3 is controlled to move back up to the initial position.

In step 14, the square bar is held stationary in the current position and one of the heads 31 is controlled to move to the target position over the square bar. In this embodiment, a head 31 is controlled to move over the square bar to align the cutting line with the center line of the square bar and also with the wire slot.

In the above scheme, the main pressing block is pressed on the right side area of the square bar to give way to the cutting line in step 14, so that the cutting line can horizontally move above the central line of the square bar.

And 15, controlling the half rod pressing assembly to move towards the square rod until the other side area of the top surface of the square rod is pressed.

Specifically, the control half bar pressing assembly 413 is moved downward to press against the left side area of the top of the square bar.

And step 16, controlling the half rod supporting assembly to move towards the square rod until the half rod supporting assembly contacts with the bottom surface of the square rod.

Specifically, the control rod support member 23 is moved upward against the left side area of the bottom of the square rod. The half bar support assembly 23 and the half bar pressing assembly 413 press square bars from both ends as shown in fig. 12.

And 17, controlling the cutting device to move along the central line direction of the square rod so as to cut the square rod for the third time through a section of cutting line on the cutting device, thereby obtaining two half rods.

The target position may be specifically above the center line of the square bar. As shown in fig. 15, the control head 31 moves downward, and cuts along the center line of the square bar, resulting in two half bars 51. After cutting, the cutting line enters the wire groove. The steps realize the process of obtaining two finished product semi-bars after the round bars are cut for three times.

As shown in fig. 16 to 21, on the basis of the above scheme, an operation of sequentially blanking two half bars is also performed, and specifically includes:

step 18, controlling the blanking clamping jaw in the wire cutting equipment to clamp a half bar from the side, as shown in fig. 16.

Specifically, the upper and lower two blanking grippers 6 in the blanking mechanism are controlled to grip the right half bar 51 in the drawing from the side.

Step 19, control the lifting of the main hold-down assembly 412 and the half-bar hold-down assembly 413, as shown in FIG. 17.

Step 110, control the main hold-down assembly to turn 90 ° and then hold down the other half-bar (half-bar 51 on the left in the figure) as shown in fig. 18.

Step 111, the blanking gripper 6 is controlled to remove the clamped right half bar 51 (as shown in fig. 19) and place the right half bar on a blanking table.

Step 112, controlling the blanking claw 6 to clamp the other half bar (the left half bar 51) from the side, as shown in fig. 20.

Step 113, control the main hold-down assembly 412 to lift, as shown in fig. 21.

And 114, controlling the blanking clamp claw 6 to move the clamped left half rod 51 to the blanking table.

Based on the above wire cutting apparatus, the present embodiment provides a control method corresponding to the cutting method of fig. 2, as shown in fig. 27, comprising the steps of:

and step 21, when a starting instruction is received, controlling the pressing device to move towards the workpiece to be cut until the main pressing component abuts against one side area of the top surface of the workpiece to be cut so as to press the workpiece to be cut.

Specifically, the pressing driving mechanism 42 in the pressing device 2 is controlled to drive the pressing mechanism 41 to move downwards along the pressing guide mechanism 43 until the main pressing assembly 412 abuts against the top surface of the silicon rod. The main compression block 4121 in the main compression assembly 412 presses against half of the top surface of the silicon rod as shown in fig. 22.

In this step, the half-rod support assembly 23 is lowered out of contact with the silicon rod 5. The half-rod pressing assembly 413 is lifted out of contact with the silicon rod 5. The let-down grooves 2113 on the support floating head 211 are perpendicular to the cutting line segment for cutting the silicon rod.

And 22, controlling the cutting device to move to a target position above the piece to be cut, and then moving along the central line direction of the piece to be cut so as to cut the piece to be cut for the first time through two parallel cutting lines on the cutting device.

As shown in fig. 24, after the pressing mechanism 41 is moved into place, the head 31 in the cutting device 3 is controlled to move to a target position above the silicon rod, for example: the head 31 is movable vertically, radially of the silicon rod, so that the cutting line on the head is aligned with the position where the silicon rod is to be cut, as in cutting position 7 in fig. 24. When the heads 31 are moved into position, the two heads 31 are controlled to move downward, and each head 31 is provided with an annular cutting line. The cutting lines on the two heads 31 are parallel, the silicon rod is cut, and the side skin materials on the two sides are cut off.

In fig. 24, there are three handpieces 31, and two handpieces 31 on the left are mounted together, and the handpieces 31 on the right are independently disposed. The left two heads 31 are synchronously lifted and horizontally moved, and the two heads 31 can relatively horizontally move. In step 22, the three heads 31 are controlled to move up and down and horizontally so that the right head 31 and the left inner head 31 perform cutting, and the left outer head 31 does not participate in cutting.

Alternatively, the three heads 31 may be lifted and moved horizontally independently, so that in step 22, two heads 31 may be controlled to move to perform cutting, and the other head 31 is always at the initial position.

Step 23, horizontally rotating the piece to be cut by 90 degrees.

The piece to be cut is horizontally rotated by 90 degrees, specifically, the main pressing assembly 412 and the main supporting assembly 21 are controlled to horizontally rotate by 90 degrees along the same direction, so that the silicon rods are driven to rotate together. After 90 deg. turn, the main compression assembly 412 turns to the right side portion of the top of the silicon rod as shown in fig. 23. After 90 ° turn, the wire grooves 2113 are made parallel to the cutting line segment that cuts the silicon rod.

Step 24, controlling the cutting device to move to a target position above the piece to be cut.

After the completion of step 22, the cutting device 3 is controlled to move back up to the initial position.

After the completion of step 23, the three heads 31 in the cutting device 3 are controlled to move to a target position above the silicon rod, for example: the head 31 is movable vertically and radially along the silicon rod so that the cutting line on the head is aligned with the position where the silicon rod is to be cut. The cut lines in the three heads 31 are parallel.

In each of the above steps, the main pressing block 4121 of the main pressing assembly 412 presses against a half area of the top surface of the silicon rod, so as to allow the head to be unseated, and the cutting line to be horizontally moved above the center line of the silicon rod.

And step 25, controlling the semi-bar pressing assembly to move towards the piece to be cut until the other side area of the top surface of the piece to be cut is pressed.

Specifically, the control half-bar pressing assembly 413 is moved downward to press against the left side area of the top of the silicon rod.

And step 26, controlling the semi-bar supporting component to move towards the to-be-cut piece until contacting with the bottom surface of the to-be-cut piece.

Specifically, the control rod half support assembly 23 moves upward against the left side region of the bottom of the silicon rod. The half-rod supporting assembly 23 and the half-rod pressing assembly 413 press the silicon rods from both ends as shown in fig. 23.

And step 27, controlling the cutting device to move along the central line direction of the workpiece to be cut so as to cut the workpiece to be cut for the second time through three parallel cutting lines on the cutting device, thereby obtaining two half bars.

As shown in fig. 25, the three heads 31 are controlled to move downward, and the silicon rod is cut by three parallel cutting lines, so that two half rods 51 with smaller cross-sectional areas and two other pieces of edge skin are obtained. After cutting, the cutting line enters the wire groove.

The steps realize the process of obtaining two finished semi-bars after cutting the round bar for three times.

And 28, controlling a side skin unloading mechanism to take off the side skin.

Further, the operation of sequentially blanking the two half bars is also performed, and the specific scheme is the same as that of fig. 16 to 21, and is not repeated here.

According to the scheme, two half bars and four pieces of edge leather are obtained by cutting for two times, the cutting steps are fewer, the cutting time is shortened, and the production efficiency is improved.

According to the two control methods provided by the embodiment, the silicon rod is directly cut into the half rod with the smaller cross section area, the small silicon wafer with the smaller size is directly obtained by slicing the half rod, laser scribing is not needed, damage to the surface of the silicon wafer is reduced, and the conversion efficiency of the heterojunction battery finally processed is improved.

The embodiment also provides an electronic device, including: memory, processor and computer program. Wherein the computer program is stored in the memory and configured to be executed by the processor to implement the control method provided by any of the above.

The present embodiment also provides a computer-readable storage medium having stored thereon a computer program that is executed by a processor to implement the control method provided in any one of the above.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element in question must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may communicate with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

While preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the application.

It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims

1. A cutting control method applied to a wire cutting apparatus, characterized in that the wire cutting apparatus includes: the device comprises a cutting device, a supporting device and a compacting device; the support device includes: a main support assembly and a half-bar support assembly; the compressing device comprises: a main compression assembly and a half-bar compression assembly;

the method comprises the following steps:

controlling the half rod pressing assembly to move towards the square rod until the other side area of the top surface of the square rod is pressed;

controlling the semi-bar supporting component to move towards the square bar until the semi-bar supporting component contacts with the bottom surface of the square bar;

2. The method of claim 1, wherein the target location is above a centerline of a square bar.

3. Method according to claim 1 or 2, characterized in that the piece to be cut is turned horizontally by 90 °, in particular comprising:

The main supporting component and the main compacting component are controlled to horizontally rotate by 90 degrees so as to drive the workpiece to be cut to rotate together.

4. A method according to claim 3, further comprising: sequentially blanking two half bars, specifically comprising:

controlling a blanking clamping jaw in the linear cutting equipment to clamp a half rod from the side face;

controlling the main pressing component and the half-bar pressing component to lift;

the main pressing component is controlled to rotate by 90 degrees and then presses the other half rod downwards;

controlling the blanking clamping claw to move the clamped half rod to the blanking table;

controlling the blanking clamping jaw to clamp the other half rod from the side face;

controlling the main pressing component to lift;

and controlling the blanking clamping claw to move the clamped half rod to the blanking table.

5. A cutting control method applied to a wire cutting apparatus, characterized in that the wire cutting apparatus includes: the device comprises a cutting device, a supporting device and a compacting device; the support device includes: a main support assembly and a half-bar support assembly; the compressing device comprises: a main compression assembly and a half-bar compression assembly;

the method comprises the following steps:

rotating the piece to be cut horizontally by 90 degrees;

6. The method of claim 5, wherein controlling movement of the cutting device to a target position over the piece to be cut comprises:

two cutting heads in the cutting device are controlled to reach the positions of the skin to be cut, and the other cutting head reaches the position above the central line of the piece to be cut.

7. Method according to claim 5 or 6, characterized in that the piece to be cut is turned horizontally by 90 °, in particular comprising:

8. The method as recited in claim 7, further comprising: sequentially blanking two half bars, specifically comprising:

controlling the main pressing component to lift;

9. An electronic device, comprising:

a memory;

a processor; and

a computer program;

wherein the computer program is stored in the memory and configured to be executed by the processor to implement the control method of any one of claims 1-4, or the control method of any one of claims 5-8.

10. A computer-readable storage medium, characterized in that a computer program is stored thereon; the computer program being executed by a processor to implement the control method of any one of claims 1-4, or the control method of any one of claims 5-8.