CN212146684U - Cutting device for thin product wafer - Google Patents
Cutting device for thin product wafer Download PDFInfo
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- CN212146684U CN212146684U CN202020561875.XU CN202020561875U CN212146684U CN 212146684 U CN212146684 U CN 212146684U CN 202020561875 U CN202020561875 U CN 202020561875U CN 212146684 U CN212146684 U CN 212146684U
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- fixing device
- cutter
- bearing
- connecting rod
- mould
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Abstract
The utility model discloses a cutting device of slim product disk, including last mould and lower mould, it includes fixing device to go up the mould, fixing device's upper end middle part rigid coupling has the supporting rod of being connected with external rotary device, be equipped with the bearing in the fixing device, be connected with the vertical connecting rod of arranging in the bearing, the lower extreme rigid coupling of connecting rod has clamp plate 7, be equipped with the spring of cup jointing on the connecting rod between clamp plate and the bearing, be equipped with the cutter on one side outer wall of fixing device, open the lower mould upper end have with cutter matched with annular. Compared with the prior art, the utility model the advantage lie in: mechanical equipment can be used for processing wafers in batches, so that the labor intensity of personnel is reduced, and the processing efficiency of products is improved.
Description
Technical Field
The utility model relates to a slim disk product processing technology field specifically indicates a cutting device of slim product disk.
Background
For light and thin-skin materials, clamping is not easy to carry out, and the currently available method for processing the thin-skin materials into wafers comprises the following steps:
1. the round punch is suitable for soft material, such as rubber, and has the advantages of manual operation, low efficiency and easy abrasion of the cutter.
2. The disc sampler is suitable for very thin materials, such as paper with the thickness less than 0.2mm, rubber with the thickness less than 0.3mm and the like, is similar to compasses, is manually operated, and has very low efficiency.
3. The desk type cutter is suitable for thin hard materials such as paper, aluminum plates and the like, is similar to punching, can be used in various shapes, and is not suitable for soft materials such as rubber and the like.
4. The upper and lower punch hole punching tools are suitable for hard materials such as metal plates, can be used in various shapes, and are not suitable for soft materials such as rubber.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to overcome above technical defect, provide a cutting device of slim product disk, can use mechanical equipment to carry out batch processing disk, reduce personnel intensity of labour, promote product machining efficiency.
In order to solve the technical problem, the utility model provides a technical scheme does: the utility model provides a cutting device of slim product disk, includes mould and lower mould, it includes fixing device to go up the mould, fixing device's upper end middle part rigid coupling has the supporting rod of being connected with external rotary device, be equipped with the bearing in the fixing device, be connected with the vertical connecting rod of arranging in the bearing, the lower extreme rigid coupling of connecting rod has clamp plate 7, be equipped with the spring of cup jointing on the connecting rod between clamp plate and the bearing, be equipped with the cutter on one side outer wall of fixing device, open the lower mould upper end have with cutter matched with annular.
Compared with the prior art, the utility model the advantage lie in: when the device is used, the clamping rod on the upper die is connected with an external rotating device, a processed material is placed on the lower die, then the upper die descends, the pressing plate of the upper die is firstly contacted with the material and is pressed and fixed under the action of the spring, the upper die continues to descend, the pressing plate is connected with the bearing through the connecting rod, so that the fixing device drives the cutter to rotate and the pressing plate presses the processed material to keep the processed material still, the cutter penetrates through the processed material to be cut, the material can be processed into a wafer or a round hole, meanwhile, the upper end of the lower die is provided with a ring groove matched with the cutter, the cutter of the upper die can be prevented from contacting other positions after penetrating through the processed material to break up the cutter, the processed material is automatically fixed, the rotary cutter is processed into a wafer, the clamping and processing of the light material are synchronously performed, and the device is suitable for the quick rotation of mechanical equipment, the mass production of the light material cutting wafers is realized, the labor intensity of personnel is reduced, and the product processing efficiency is improved.
As an improvement, the fixing device is provided with screw holes which are arranged up and down on one side surface provided with the cutter, the cutter is screwed in the screw holes through screws and is fixedly connected with the fixing device, and the cutter is convenient and fast to mount and dismount.
As an improvement, the fixing device and the lower die are both cylindrical structures, and the occupied space is small.
Drawings
Fig. 1 is a schematic structural diagram of a cutting device for thin product wafers according to the present invention.
Fig. 2 is a schematic diagram of the internal structure of the cutting device for thin product wafers according to the present invention.
As shown in the figure: 1. the device comprises an upper die, a lower die, a clamping rod, a cutter, a bearing, a connecting rod, a pressing plate, a spring, a ring groove and a fixing device, wherein the upper die is 2, the lower die is 3, the clamping rod is 4, the cutter is 5, the bearing is 6, the connecting rod is 7, the pressing plate is 8, the spring.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
A cutting device for thin product wafers comprises an upper die 1 and a lower die 2, wherein the upper die 1 comprises a fixing device 10, the middle part of the upper end of the fixing device 10 is fixedly connected with a clamping rod 3 connected with an external rotating device, the clamping rod 3 is connected with the external rotating device through a twist drill chuck, a bearing 5 is arranged in the fixing device 10, a connecting rod 6 which is vertically arranged is connected in the bearing 5, a pressing plate 7 is fixedly connected at the lower end of the connecting rod 6, a spring 8 sleeved on the connecting rod 6 is arranged between the pressing plate 7 and the bearing 5, the upper end of the spring 8 is always kept in contact with the inner ring of the bearing, so that when the upper die 1 rotates, the inner ring of the bearing, the spring 8, the connecting rod 6 and the pressure plate 7 are not rotated, the outer wall of one side of the fixing device 10 is provided with a cutter 4, and the upper end of the lower die 2 is provided with a ring groove 9 matched with the cutter 4.
The fixing device 10 is provided with screw holes arranged up and down on one side surface provided with the cutter 4, and the cutter 4 is screwed in the screw holes through screws and is fixedly connected with the fixing device 10.
The fixing device 10 and the lower die 2 are both cylindrical structures.
When the utility model is implemented, 1, the clamping rod is connected with an external rotating device through the twist drill chuck, the processed material is placed on the lower die, the upper die moves downwards, the pressing plate of the upper die contacts the processed material at first and compresses the processed material under the action of the spring force;
2. the fixing device is connected with the pressure plate through a bearing, and the fixing device is prevented from driving the pressure plate to synchronously rotate in the rotating process;
3. the upper die is continuously moved downwards, and the cutter penetrates through the processed material.
4. The annular groove is arranged above the lower die, so that the cutter of the upper die can be prevented from contacting other positions after penetrating through the processed material to break the blade;
5. and in the rotating process of the cutter, the material to be processed is processed into a wafer and a round hole.
Through the automatic fixed by the processing material, the rotary blade processes into the disk, realizes going on in step with processing to the clamping of light material, is applicable to mechanical equipment's quick rotation, realizes the mass production of light material cutting disk, reduces personnel intensity of labour, promotes product machining efficiency.
The present invention and the embodiments thereof have been described above, but the description is not limited thereto, and the embodiment shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should understand that they should not be limited to the embodiments described above, and that they can design the similar structure and embodiments without departing from the spirit of the invention.
Claims (3)
1. A cutting device for thin product wafers is characterized in that: including last mould (1) and lower mould (2), it includes fixing device (10) to go up mould (1), the upper end middle part rigid coupling of fixing device (10) has supporting rod (3) of being connected with external rotary device, be equipped with bearing (5) in fixing device (10), be connected with vertical connecting rod (6) of arranging in bearing (5), the lower extreme rigid coupling of connecting rod (6) has clamp plate (7), be equipped with between clamp plate (7) and bearing (5) and cup joint spring (8) on connecting rod (6), be equipped with cutter (4) on one side outer wall of fixing device (10), open lower mould (2) upper end have with cutter (4) matched with annular (9).
2. A cutting device for thin product wafers as set forth in claim 1 wherein: the fixing device (10) is provided with screw holes which are arranged up and down on one side face provided with the cutter (4), and the cutter (4) is screwed in the screw holes through screws and is fixedly connected with the fixing device (10).
3. A cutting device for thin product wafers as set forth in claim 1 wherein: the fixing device (10) and the lower die (2) are both cylindrical structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020561875.XU CN212146684U (en) | 2020-04-16 | 2020-04-16 | Cutting device for thin product wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020561875.XU CN212146684U (en) | 2020-04-16 | 2020-04-16 | Cutting device for thin product wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212146684U true CN212146684U (en) | 2020-12-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020561875.XU Active CN212146684U (en) | 2020-04-16 | 2020-04-16 | Cutting device for thin product wafer |
Country Status (1)
| Country | Link |
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| CN (1) | CN212146684U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113442181A (en) * | 2021-06-29 | 2021-09-28 | 西安奕斯伟硅片技术有限公司 | Cutting device and method for polishing pad |
| CN113561264A (en) * | 2021-07-12 | 2021-10-29 | 西安奕斯伟硅片技术有限公司 | Device for processing raw materials into finished products |
-
2020
- 2020-04-16 CN CN202020561875.XU patent/CN212146684U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113442181A (en) * | 2021-06-29 | 2021-09-28 | 西安奕斯伟硅片技术有限公司 | Cutting device and method for polishing pad |
| CN113561264A (en) * | 2021-07-12 | 2021-10-29 | 西安奕斯伟硅片技术有限公司 | Device for processing raw materials into finished products |
| TWI801283B (en) * | 2021-07-12 | 2023-05-01 | 大陸商西安奕斯偉材料科技有限公司 | A device for processing raw materials into finished products |
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