CN113561264A

CN113561264A - Device for processing raw materials into finished products

Info

Publication number: CN113561264A
Application number: CN202110786188.7A
Authority: CN
Inventors: 张舸; 贺云鹏
Original assignee: Xian Eswin Silicon Wafer Technology Co Ltd; Xian Eswin Material Technology Co Ltd
Current assignee: Xian Eswin Silicon Wafer Technology Co Ltd; Xian Eswin Material Technology Co Ltd
Priority date: 2021-07-12
Filing date: 2021-07-12
Publication date: 2021-10-29
Anticipated expiration: 2041-07-12
Also published as: TW202300309A; CN113561264B; TWI801283B

Abstract

The embodiment of the invention discloses a device for processing raw materials into finished products, which comprises: a first die plate and a second die plate for clamping the raw material in a thickness direction, the first die plate having a same outer peripheral profile shape as a cross section of the finished product perpendicular to the thickness direction, the second die plate being formed with a plurality of through holes corresponding to a plurality of open holes of the finished product in the thickness direction; a cutter for moving against an outer periphery of the first die plate to cut out a portion of the raw material extending to an outside of the first die plate in a direction perpendicular to the thickness direction; and a hole making sleeve, an axial end portion of which is formed as an annular blade portion, and which is configured to move toward the first die plate under the guidance of the through hole to cause the annular blade portion to cut the open hole in the raw material.

Description

Device for processing raw materials into finished products

Technical Field

The invention relates to the field of machining, in particular to a device for machining raw materials into finished products.

Background

Semiconductor silicon material is one of the main functional materials for the integrated circuit industry, so the progress of silicon wafer processing technology affects the development of the electronic information industry. As the feature size of integrated circuits becomes smaller, higher requirements are placed on the size and surface flatness of single crystal silicon wafers.

In the process of processing the silicon wafer, the silicon wafer needs to be polished to improve the surface flatness of the silicon wafer and obtain a final finished product. For a silicon wafer polishing process, a polishing pad, a polishing solution and a polishing device are three indispensable elements, wherein the polishing pad is used as a consumable auxiliary material and needs to be adhered to a fixed disc in the polishing device when in use, and a plurality of through holes are distributed on the polishing pad and are used as feed solution holes. During polishing, the polishing solution flows out through the through holes of the fixed plate in the polishing device and flows through the solution holes on the polishing pad into the working area. In order to ensure that the polishing solution can smoothly flow through the solution hole during the polishing process, the position and size of the solution hole on the polishing pad need to strictly correspond to the position and size of the through hole on the fixed plate in the polishing device.

The cutting and punching mode of the raw material of the polishing pad at present is as follows: the method comprises the steps of firstly placing a finished polishing pad on a raw material, then manually marking an outer contour and each liquid feeding hole corresponding to the finished polishing pad on the raw material by an operator by using a marking pen, cutting the raw material by using a cutter, and drilling the raw material by using a metal pipe and a hammer, wherein the drilling operation needs to be repeated until all the drilling operations are completed.

The existing operation mode has high requirements on the operation level of operators. Because the surface of polishing pad raw and other materials is smooth, operating personnel is cutting and trompil operation in-process, and the angle and the dynamics of operation are difficult to hold, for example, the condition such as beat the inclined to one side and beat the mistake appears easily when punching, consequently the operation consuming time, the effort, inefficiency, the accuracy is poor, has influenced the accuracy of the finished relevant size of polishing pad and even has leaded to the polishing pad to use, and this has also adversely influenced efficiency and the cost of silicon chip processing.

Disclosure of Invention

In order to solve the above technical problems, embodiments of the present invention are directed to an apparatus for processing raw materials into finished products, so as to reduce the difficulty of cutting and punching a polishing pad and improve the accuracy and efficiency of cutting and punching.

The technical scheme of the embodiment of the invention is realized as follows:

there is provided an apparatus for processing raw material into a finished product, the apparatus comprising:

a first die plate and a second die plate for clamping the raw material in a thickness direction, the first die plate having a same outer peripheral profile shape as a cross section of the finished product perpendicular to the thickness direction, the second die plate being formed with a plurality of through holes corresponding to a plurality of open holes of the finished product in the thickness direction;

a cutter for moving against an outer periphery of the first die plate to cut out a portion of the raw material extending to an outside of the first die plate in a direction perpendicular to the thickness direction; and

a hole forming sleeve, an axial end of which is formed as an annular blade portion, and which is configured to move toward the first die plate under guidance of the through hole to cause the annular blade portion to cut the open hole in the raw material.

Embodiments of the present invention provide an apparatus for processing a raw material into a finished product, in which when the raw material of a polishing pad is processed by using the apparatus of the present invention, an outer peripheral dimension of the raw material in a direction perpendicular to a thickness direction can be cut to the outer peripheral dimension of the finished product of the polishing pad by using a cutter in cooperation with a first template, and holes corresponding to the layout and the dimensions of the holes in the finished product can be formed in the raw material by punching the raw material by using a hole-making sleeve in cooperation with a second template. Compared with the prior art, the device reduces the difficulty of cutting and punching raw materials, and improves the accuracy and efficiency of cutting and punching operation.

Drawings

Fig. 1 shows schematically the raw material to be processed and the finished product processed by the apparatus according to the invention; the embodiment of the invention provides an assembly schematic diagram of a device for processing raw materials into finished products;

FIG. 2 is an overall front view of an embodiment of the device according to the invention;

FIG. 3 is a front view of an embodiment of a part member of the device according to the invention;

FIG. 4 is an enlarged partial view of the dashed circular area in FIG. 3;

FIG. 5 is a partial front view of another embodiment of an apparatus according to the present invention;

FIG. 6 is a partial front view of another embodiment of an apparatus according to the present invention;

FIG. 7 is a schematic view of a sleeve for making a hole according to the present invention.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

An embodiment of the invention provides an apparatus for processing a raw material M, which is exemplarily shown in fig. 1, into a finished product P, which is also exemplarily shown in fig. 1. As shown in fig. 1, the finished product P is formed by removing a portion of the raw material M in the thickness direction, specifically, the edge portion of the raw material M is removed to obtain the peripheral outline shape of the finished product P, and a plurality of central portions of the raw material M are removed to obtain a corresponding plurality of openings H of the finished product P, as schematically shown in fig. 1 by a plurality of ellipses on the finished product P that are not filled by hatching. In fig. 1, the raw material M is specifically shown to be rectangular and to be sheet-like, but in the present invention, the raw material M may be in another shape such as an arbitrary irregular shape, and the raw material M may also be block-like, that is, the thickness of the raw material M may be close to its length and/or width. In fig. 1, the finished product P is shown in particular as being circular, but in the present invention, the finished product P may also be another shape, such as an oval or any other irregular shape.

Referring to fig. 2, the apparatus 1 described above may include:

the first template 11 and the second template 12 for clamping said raw material M in the thickness direction F, for "clamping" to be achieved, for example, the first template 11 may have a greater mass, in the case as shown in figure 2, the first template 11 may clamp the raw material M to the second template 12 by its own weight, and also may exert a clamping force towards the second template 12, for example by means not shown in the figures, which is readily known to the skilled person and therefore not described in detail, said first template 11 having the same peripheral profile shape as a section of said finished product P perpendicular to said thickness direction F, said second template 12 being formed with a plurality of through holes 121 corresponding to a plurality of apertures H of said finished product P in said thickness direction F, as schematically shown in figure 2 by dashed lines inside the template 12, and only a single via 121 is shown by way of example in fig. 2;

a cutting knife 13 for moving against the outer periphery of the first die plate 11, as schematically shown by arrow a1 in fig. 2, to cut out a portion of the raw material M extending outside the first die plate 11 in a direction perpendicular to the thickness direction F (as schematically shown by the hatched portion in the raw material M in fig. 2), in particular, the cutting knife 13 may be a separate component from the first die plate 11, or may be connected to the first die plate 11 as described in detail below; and

a hole making sleeve 14, an axial end portion 14A (a lower end portion as shown in fig. 2) of the hole making sleeve 14 being formed as an annular blade portion 141, and the hole making sleeve 14 being configured to move toward the first die plate 11 under guidance of the through hole 121, as schematically shown by an arrow a2 in fig. 2, so that the annular blade portion 141 cuts the open hole H in the raw material M.

It is understood that the through holes 121 may have the same relative positional relationship with the openings H of the product P, so that the cut openings H meet the requirements of the relative positional relationship.

In the above-described case, it is understood that, in the case where, for example, the peripheral outline shape of the finished product P is a circular shape, the peripheral outline shape of the first die plate 11 is also a circular shape, it is not necessary to consider the relative positional relationship between the plurality of through holes 121 formed in the second die plate 12 and the outer peripheral profile shape of the first die plate 11, as long as the second die plate 12 clamps the raw material M together with the first die plate 11, in the case where, for example, the peripheral outline shape of the finished product P is not circular, the peripheral outline shape of the first die plate 11 is also not circular, it is therefore necessary to maintain a specific relative positional relationship between the plurality of through holes 121 formed in the second template 12 and the peripheral outline shape of the first template 11, i.e. the same relative positional relationship between the peripheral profile shape of the finished product P and the plurality of holes H, it is possible to clamp the raw material M together with the second die plate 12 and the first die plate 11.

It will be appreciated that if the plurality of apertures H in the finished product P have the same shape, the number of sleeves 14 may be single, the annular lip 141 of the single sleeve 14 may have the same shape as the plurality of apertures H to conform the cut apertures H to the shape requirements, whereas if the plurality of apertures H in the finished product P have different shapes, for example two different shapes as shown in fig. 1, with the aperture of one aperture H1 being larger than the aperture of the other aperture H2, the number of sleeves 14 may be two, with the annular lip 141 of one sleeve 14 having the same shape as the aperture H1 and the annular lip 141 of the other sleeve 14 having the same shape as the aperture H2.

The sheet-like raw material M shown in fig. 1 may be a raw material of a polishing pad used in the field of silicon wafer polishing, and the finished product P may be a finished polishing pad for polishing a silicon wafer, wherein an opening H2 having a larger aperture may be used for mounting a sensor, and the other opening H1 having a smaller aperture may be used for circulating a polishing liquid.

In order to make the cutting operation of the raw material M easier, in some possible implementations, embodiments of the present invention contemplate connecting the cutting knife 13 to the first template 11.

Based on this, in some examples, referring to fig. 3 and 4, the first die plate 11 is formed with a slide groove 111 recessed radially inward from an outer peripheral surface 11A of the first die plate 11 and extending along a circumferential direction of the first die plate 11, the cutting knife 13 is connected to a slider 15, the slider 15 is slidably fitted to the slide groove 111, wherein the slide groove 111 is configured to prevent the slider 15 from moving in a radial direction of the first die plate 11 and to prevent the slider 15 from moving in a direction perpendicular to the first die plate 11. In this case, the sliding block 15 is simply driven to move in the sliding chute 111, so that the raw material M can be cut by the cutting knife 13, and the operation is convenient.

It will be appreciated that there are many implementations of having the runners 111 prevent the slider 15 from moving in a radial direction of the first die plate 11 and preventing the slider 15 from moving in a direction perpendicular to the first die plate 11, one possible implementation being specifically illustrated in fig. 4. Referring to fig. 4, the slide groove 111 may be defined by wedge portions 112 formed in the first template 11 to protrude toward each other in a direction perpendicular to the first template 11, and accordingly, the slider 15 may be formed with a concave portion 151 that matches the wedge portions 112.

In the process of processing the raw material M into the finished product P by means of the device 1 according to the previous embodiment, it is not desirable that the cutting knife 13 extends from the first die plate 11 towards the second die plate 12 as shown in fig. 2 to 4, during the process of clamping the raw material M by bringing the first die plate 11 and the second die plate 12 close to each other, since in this case the cutting knife 13 interferes with the raw material M, or the cutting knife 13 must "pierce" the raw material M in order to be able to effect the clamping, but rather that the cutting knife 13 extends, for example, parallel to the first die plate 11. On this basis, with reference to fig. 5, the slide 15 may be provided with a pivot 16 extending in the radial direction of the first die plate 11, the cutter 13 being connected to the pivot 16 in such a way as to be able to rotate about the pivot 16. In this way, during the processing of the raw material M into the finished product P by means of the device 1, it is possible to first arrange the cutting knife 13 in a position parallel to the first template 11, i.e. rotated 90 degrees about the pivot 16 from the position shown in fig. 5, and then place the raw material M on the first template 11, without interference between the raw material M and the cutting knife 13. When the edge portion of the raw material M is required, the cutter 13 may be rotated to a position perpendicular to the first die plate 11, i.e., the position shown in fig. 5, while cutting the raw material M.

With the above-described manner of achieving the rotation of the cutter 13, it is necessary to provide the cutter 13 so as to be rotatable about the pivot 16, and therefore it is necessary to add elements such as bearings, making the configuration of the apparatus 1 complicated, and increasing the production cost. In this regard, still referring to fig. 4, the cutting knife 13 is fixedly connected to the slide 15, while the cross section of the slide 15 in a plane perpendicular to the first die plate 11 and perpendicular to the radial direction of the first die plate 11 is circular, that is to say the slide 15 does not extend along the circumferential direction of the first die plate 11 but is cylindrical as a whole, so that the slide 15, in addition to being able to move along the slide groove 111, is also able to rotate about its central axis 15X. By this way of constructing the slider 15, the construction of the device 1 is simplified and the production costs are reduced.

In the case of the previous embodiment, as can be appreciated with reference to fig. 4 or 5, when the cutting knife 13 moves against the outer periphery of the first die plate 11, the portion of the cutting knife 13 remote from the slider 15 may deflect around the slider 15 in a radially outward direction of the first die plate 11, thereby affecting the accuracy of the outer peripheral profile shape of the final finished product. Based on this, referring to fig. 6, the surface 12A of the second die plate 12 adjacent to the first die plate 11 is formed with an annular groove 122, and the tip 131 of the cutter 13 remote from the shoe 15 is fitted into the annular groove 122 in correspondence with the rotation of the cutter 13 to a position perpendicular to the first die plate 11. In this way, the portion of the cutting blade 13 remote from the slider 15 is prevented from deflecting around the slider 15 in the radially outward direction of the first die plate 11, thereby achieving higher accuracy in the outer peripheral profile shape of the finished product to be finally obtained.

It is understood that the boring sleeve 14 is surrounded by a cylindrical wall having a certain thickness, and the annular blade portion 141 formed at the boring sleeve 14 may be specifically formed at any position along the thickness direction of the wall. However, in a preferred embodiment of the present invention, referring to fig. 7, the annular blade portion 141 is formed at the outer circumferential surface 142 of the boring sleeve 14. Thus, the diameter of the opening of the finished product finally obtained can be made to meet the requirements as long as the outer diameter of the hole forming sleeve 14 is accurately controlled, and the outer diameter of the hole forming sleeve 14 is relatively easy to control; further, the portion of the raw material M that needs to be cut out to obtain the opening H may be temporarily accommodated in the hollow portion of the hole forming sleeve 14 in its entirety.

In some possible implementations, the first template 11 is made of metal. In other implementations, the first template 11 may also be formed of other materials, such as a composite material.

In some possible implementations, the second form 12 is made of polytetrafluoroethylene for good flexibility, aging resistance, and corrosion resistance of the second form 12. In other implementations, the second template 12 may be made of other materials as well.

It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims

1. An apparatus for processing raw material into a finished product, the apparatus comprising:

2. The apparatus according to claim 1, wherein the first die plate is formed with a slide groove recessed radially inward from an outer peripheral surface of the first die plate and extending in a circumferential direction of the first die plate, the cutting knife is connected to a slider, the slider is slidably fitted to the slide groove, wherein the slide groove is configured to prevent the slider from moving in a radial direction of the first die plate and to prevent the slider from moving in a direction perpendicular to the first die plate.

3. The apparatus according to claim 2, wherein the slide is provided with a pivot extending in a radial direction of the first die plate, the cutter being connected to the pivot in a manner rotatable about the pivot.

4. The device according to claim 2, characterized in that said cutting knife is fixedly connected to said slider, said slider having a circular section in a plane perpendicular to said first template and perpendicular to the radial direction of said first template, so that said slider, in addition to being able to move along said chute, is also able to rotate about its central axis.

5. The apparatus according to claim 3 or 4, wherein a surface of the second die plate adjacent to the first die plate is formed with an annular groove into which a tip of the cutter away from the slider is fitted in correspondence with the cutter being rotated to a position perpendicular to the first die plate.

6. The apparatus of claim 1, wherein the annular blade is formed at an outer peripheral surface of the hole forming sleeve.

7. The apparatus of claim 1, wherein the first template is made of metal.

8. The apparatus of claim 1, wherein the second template is made of polytetrafluoroethylene.

9. The apparatus of claim 1, wherein the raw material is a sheet-like raw material.

10. The apparatus of claim 9, wherein the sheet stock material is a polishing pad stock material.