CN213704071U - Efficient guiding and positioning mechanism for wafer cutting - Google Patents
Efficient guiding and positioning mechanism for wafer cutting Download PDFInfo
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- CN213704071U CN213704071U CN202022102566.9U CN202022102566U CN213704071U CN 213704071 U CN213704071 U CN 213704071U CN 202022102566 U CN202022102566 U CN 202022102566U CN 213704071 U CN213704071 U CN 213704071U
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Abstract
The utility model belongs to the technical field of the apparatus for producing, especially, wafer cutting is with high-efficient guiding orientation mechanism, including the platform, platform top one side is provided with the cylinder support, the inside fixedly connected with cylinder of cylinder support, cylinder one side is connected with the telescopic link, telescopic link one side is connected with the push pedal, platform top opposite side is provided with the slide rail, the slide rail top is provided with solid fixed ring, gu be provided with the wafer in the fixed ring, the wafer one end outside is provided with the holding ring; a limit ring is arranged on the lower surface of the platform, and a push rod is connected in the limit ring in a penetrating manner; the utility model discloses a solid fixed ring carries out the centre gripping with the wafer, utilizes cylinder, telescopic link and push pedal to promote solid fixed ring and wafer to the place ahead to remove simultaneously to accomplish guiding orientation's operation, through the baffle that sets up, can block the wafer, utilize push rod, scale and pointer to confirm the wafer cutting size simultaneously, further cut the location to the wafer cutting.
Description
Technical Field
The utility model relates to a apparatus for producing technical field especially relates to a wafer cutting is with high-efficient guiding orientation mechanism.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and the original material of the wafer is silicon; dissolving high-purity polycrystalline silicon, doping silicon crystal seed crystals, and slowly pulling out to form cylindrical monocrystalline silicon; after a silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed; at present, the domestic wafer production line mainly takes 8 inches and 12 inches, the main processing modes of the wafers are sheet processing and batch processing, namely 1 or more wafers are processed simultaneously, and as the characteristic size of a semiconductor is smaller and smaller, the processing and measuring equipment is more and more advanced, so that the wafer processing has new data characteristics.
The silicon column is required to be cut by the cutting device in the wafer processing process, the traditional cutting mode is poor in precision, the guiding error and the positioning error are great, the precision of wafer cutting is influenced, and the production quality of wafers is seriously influenced.
In order to solve the problem, the application provides a wafer cutting is with high-efficient guiding orientation mechanism.
SUMMERY OF THE UTILITY MODEL
Objects of the invention
For solving the technical problem who exists among the background art, the utility model provides a wafer cutting is with high-efficient guiding orientation mechanism carries out the centre gripping through solid fixed ring with the wafer, utilize the cylinder simultaneously, telescopic link and push pedal promote solid fixed ring and wafer and move to the place ahead to accomplish guiding orientation's operation, baffle through setting up, can block the wafer, utilize the push rod simultaneously, scale and pointer confirm the wafer cutting size, further cut the location to the wafer cutting, thereby effectively increase the precision of wafer cutting, increase the wafer production quality.
(II) technical scheme
In order to solve the problems, the utility model provides a high-efficiency guiding and positioning mechanism for wafer cutting, which comprises a platform, wherein one side above the platform is provided with a cylinder support, a cylinder is fixedly connected inside the cylinder support, one side of the cylinder is connected with a telescopic rod, one side of the telescopic rod is connected with a push plate, the other side above the platform is provided with a slide rail, a fixed ring is arranged above the slide rail, a wafer is arranged inside the fixed ring, and the outer side of one end of the wafer is provided with a positioning ring; the lower surface of the platform is provided with a limiting ring, a push rod penetrates through the inside of the limiting ring, one end of the push rod is connected with a baffle, and a pointer is arranged below one side edge of the platform.
Preferably, the surface of the fixing ring is connected with a clamping bolt in a penetrating manner, and one end of the clamping bolt is connected with a clamping plate.
Preferably, the fixing ring is connected with a sliding rod below, the sliding rod is connected with a sliding block below, and the sliding block is located inside the sliding rail.
Preferably, a guide wheel bracket is arranged in the positioning ring, and a guide wheel is arranged in the guide wheel bracket.
Preferably, a piston is arranged inside the cylinder, one side of the piston is connected with a telescopic rod, and an air faucet is arranged on one side above the cylinder.
Preferably, a structural support is fixedly connected to the lower portion of the platform.
Preferably, the surface of the push rod is provided with scales, and a limiting bolt is connected below the limiting ring in a penetrating manner.
The above technical scheme of the utility model has following profitable technological effect:
1. the wafer is clamped through the fixing ring, and meanwhile, the fixing ring and the wafer are pushed to move forwards by the air cylinder, the telescopic rod and the push plate, so that the guiding and positioning operation is completed;
2. through the baffle that sets up, can block the wafer, utilize push rod, scale and pointer to confirm the wafer cutting size simultaneously, further cut the wafer and fix a position, the baffle and the holding ring between the distance be the cutting size of wafer promptly, the staff utilize cutting tool hug closely the holding ring and cut can.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the fixing ring of the present invention;
FIG. 3 is a schematic view of the inner structure of the positioning ring according to the present invention;
fig. 4 is the internal structure schematic diagram of the middle cylinder of the present invention.
In the figure: 1. a platform; 2. a cylinder support; 3. a cylinder; 4. a telescopic rod; 5. pushing the plate; 6. a slide rail; 7. a slide bar; 8. a fixing ring; 9. clamping the bolt; 10. a wafer; 11. a positioning ring; 12. a baffle plate; 13. a limiting ring; 14. a limit bolt; 15. a push rod; 16. calibration; 17. a pointer; 18. a structural support; 19. an air tap; 20. a clamping plate; 21. a slider; 22. a guide wheel bracket; 23. a guide wheel; 24. a piston.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1, the utility model provides a high-efficient guiding and positioning mechanism for wafer cutting, including platform 1, one side above platform 1 is provided with cylinder support 2, cylinder 3 is fixedly connected with in cylinder support 2, cylinder 3 one side is connected with telescopic link 4, telescopic link 4 one side is connected with push pedal 5, the other side above platform 1 is provided with slide rail 6, slide rail 6 is provided with solid fixed ring 8 above, gu be provided with wafer 10 in the solid fixed ring 8, the one end outside of wafer 10 is provided with holding ring 11;
the lower surface of the platform 1 is provided with a limiting ring 13, a push rod 15 is connected inside the limiting ring 13 in a penetrating mode, one end of the push rod 15 is connected with a baffle 12, and a pointer 17 is arranged below one side edge of the platform 1.
In this embodiment, a structural support 18 is fixedly connected to the lower portion of the platform 1, scales 16 are arranged on the surface of the push rod 15, and a limit bolt 14 is connected to the lower portion of the limit ring 13 in a penetrating manner.
It should be noted that, the wafer 10 is clamped by the fixing ring 8, the cylinder 3, the telescopic rod 4 and the push plate 5 are used for pushing the fixing ring 8 and the wafer 10 to move forward to complete the guiding and positioning operation, the advancing directions of the fixing ring 8 and the wafer 10 can be limited by the arranged slide rail 6, the slide rod 7 and the slide block 21, and the deviation is prevented, the wafer 10 can be blocked by the arranged baffle 12, the cutting size of the wafer 10 is determined by the push rod 15, the scale 16 and the pointer 17, the wafer 10 is further cut and positioned, the distance between the baffle 12 and the positioning ring 11 is the cutting size of the wafer 10, the worker can cut the wafer by tightly attaching the cutting tool to the positioning ring 11, the cutting size is determined by the pointer 17 according to the scale 16, and the push rod 15 is fixed by the limit bolt 14.
As shown in fig. 2-4, the surface of the fixing ring 8 is connected with a clamping bolt 9 in a penetrating manner, one end of the clamping bolt 9 is connected with a clamping plate 20, the lower portion of the fixing ring 8 is connected with a slide rod 7, the lower portion of the slide rod 7 is connected with a slide block 21, the slide block 21 is located inside the slide rail 6, a guide wheel bracket 22 is arranged inside the positioning ring 11, a guide wheel 23 is arranged inside the guide wheel bracket 22, a piston 24 is arranged inside the cylinder 3, one side of the piston 24 is connected with the telescopic rod 4, and one side above the cylinder 3 is provided with an.
It should be noted that, the clamping bolt 9 and the clamping plate 20 can be used to cooperate with the fixing ring 8 to fix the wafer 10, so as to increase the stability of the wafer 10, the guide wheel bracket 22 and the guide wheel 23 are arranged, so that the wafer 10 can be lubricated and limited in the moving process of the wafer 10, air can be filled into the cylinder 3 through the arranged air nozzle 19, and the air pushes the piston 24 to drive the telescopic rod 4 and the push plate 5 to move, so that the wafer 10 can be conveyed.
The working principle is as follows: when the wafer 10 is used, the wafer 10 is clamped through the fixing ring 8, the air cylinder 3, the telescopic rod 4 and the push plate 5 are used for pushing the fixing ring 8 and the wafer 10 to move forwards to complete the operation of guiding and positioning, the advancing directions of the fixing ring 8 and the wafer 10 can be limited through the arranged slide rail 6, the slide rod 7 and the slide block 21, the deviation is prevented, the wafer 10 can be fixed through the fixing ring 8 in a matching manner by utilizing the clamping bolt 9 and the clamping plate 20, the stability of the wafer 10 is improved, the wafer 10 can be lubricated and limited in the moving process of the wafer 10 through the arranged guide wheel bracket 22 and the arranged guide wheel 23, air can be filled into the air cylinder 3 through the arranged air nozzle 19, the air pushes the piston 24 to drive the telescopic rod 4 and the push plate 5 to move, so that the conveying operation of the wafer 10 can be realized, the wafer 10 can be blocked through the arranged baffle plate, meanwhile, the cutting size of the wafer 10 is determined by the aid of the push rod 15, the scales 16 and the pointer 17, the wafer 10 is further cut and positioned, the cutting size is determined by the pointer 17 according to the scales 16, the push rod 15 is fixed by the aid of the limiting bolt 14, the distance between the baffle 12 and the positioning ring 11 is the cutting size of the wafer 10, and a worker can cut the wafer by the aid of the cutting tool tightly attached to the positioning ring 11.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. A high-efficiency guiding and positioning mechanism for wafer cutting comprises a platform (1) and is characterized in that a cylinder support (2) is arranged on one side above the platform (1), a cylinder (3) is fixedly connected inside the cylinder support (2), a telescopic rod (4) is connected on one side of the cylinder (3), a push plate (5) is connected on one side of the telescopic rod (4), a slide rail (6) is arranged on the other side above the platform (1), a fixing ring (8) is arranged above the slide rail (6), a wafer (10) is arranged inside the fixing ring (8), and a positioning ring (11) is arranged on the outer side of one end of the wafer (10);
the lower surface of the platform (1) is provided with a limiting ring (13), a push rod (15) penetrates through the inside of the limiting ring (13), one end of the push rod (15) is connected with a baffle (12), and a pointer (17) is arranged below one side edge of the platform (1).
2. The efficient guiding and positioning mechanism for wafer cutting as claimed in claim 1, wherein a clamping bolt (9) penetrates through the surface of the fixing ring (8), and one end of the clamping bolt (9) is connected with a clamping plate (20).
3. The efficient guiding and positioning mechanism for wafer cutting as claimed in claim 1, wherein a sliding rod (7) is connected below the fixing ring (8), a sliding block (21) is connected below the sliding rod (7), and the sliding block (21) is located inside the sliding rail (6).
4. The efficient guiding and positioning mechanism for wafer cutting as claimed in claim 1, wherein a guide wheel bracket (22) is arranged inside the positioning ring (11), and a guide wheel (23) is arranged inside the guide wheel bracket (22).
5. The efficient guiding and positioning mechanism for wafer cutting as claimed in claim 1, wherein a piston (24) is arranged inside the cylinder (3), one side of the piston (24) is connected with the telescopic rod (4), and an air nozzle (19) is arranged on one side above the cylinder (3).
6. The efficient guiding and positioning mechanism for wafer cutting as claimed in claim 1, wherein a structural support (18) is fixedly connected below the platform (1).
7. The efficient guiding and positioning mechanism for wafer cutting as claimed in claim 1, wherein the surface of the push rod (15) is provided with scales (16), and a limit bolt (14) is connected below the limit ring (13) in a penetrating manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022102566.9U CN213704071U (en) | 2020-09-22 | 2020-09-22 | Efficient guiding and positioning mechanism for wafer cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022102566.9U CN213704071U (en) | 2020-09-22 | 2020-09-22 | Efficient guiding and positioning mechanism for wafer cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213704071U true CN213704071U (en) | 2021-07-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022102566.9U Active CN213704071U (en) | 2020-09-22 | 2020-09-22 | Efficient guiding and positioning mechanism for wafer cutting |
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| CN (1) | CN213704071U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115194963A (en) * | 2022-08-16 | 2022-10-18 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Semiconductor wafer manufacturing production device |
-
2020
- 2020-09-22 CN CN202022102566.9U patent/CN213704071U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115194963A (en) * | 2022-08-16 | 2022-10-18 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Semiconductor wafer manufacturing production device |
| CN115194963B (en) * | 2022-08-16 | 2023-04-28 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Semiconductor wafer manufacturing apparatus |
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