CN220887348U - Tool carrier for high-precision cutting of glass substrate - Google Patents
Tool carrier for high-precision cutting of glass substrate Download PDFInfo
- Publication number
- CN220887348U CN220887348U CN202322798962.3U CN202322798962U CN220887348U CN 220887348 U CN220887348 U CN 220887348U CN 202322798962 U CN202322798962 U CN 202322798962U CN 220887348 U CN220887348 U CN 220887348U
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- China
- Prior art keywords
- cutting
- glass substrate
- bar mechanism
- bottom plate
- feeding cylinder
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- 238000005520 cutting process Methods 0.000 title claims abstract description 70
- 239000000758 substrate Substances 0.000 title claims abstract description 50
- 239000011521 glass Substances 0.000 title claims abstract description 46
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 239000000428 dust Substances 0.000 claims description 19
- 230000006698 induction Effects 0.000 claims description 6
- 238000000137 annealing Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The application relates to the field of glass substrate cutting, and discloses a tool carrier for high-precision cutting of a glass substrate. According to the application, the upper surface of the bottom plate is provided with a four-bar mechanism, one end of the four-bar mechanism is provided with a cutter head, the rear of the four-bar mechanism is provided with a telescopic cylinder, a cutter feeding cylinder is fixedly arranged below the four-bar mechanism, and when an uncut glass substrate reaches a cutting position from an annealing furnace, the telescopic cylinder and the cutter feeding cylinder on a cutting tool start to work; the cutting is completed, the cutter feeding cylinder, the telescopic cylinder and the four-bar mechanism are restored to an initial state, the cutter head is separated from the glass substrate, and the cut glass substrate flows into the next station; wait that next piece not cut glass substrate to reach the cutting position and cut to make whole cutting device cutting effect more accurate in the use, the fixed stability to glass substrate has improved in the cutting process, and the efficiency of cutting is higher simultaneously.
Description
Technical Field
The application belongs to the technical field of glass substrate cutting, and particularly relates to a tool carrier for high-precision cutting of a glass substrate.
Background
At present, the domestic liquid crystal substrate industry is vigorously developed, the production and manufacturing efficiency and the automation degree of the liquid crystal panel are higher and higher, and therefore, the demand for the liquid crystal substrate is also growing. In recent years, domestic substrate production has been developed, and domestic equipment demands have been increased.
In the substrate production of the overflow method, glass is required to have a high precision, but the cutting precision of the current glass substrate is not high enough, so that the production quality in the whole liquid crystal substrate production process cannot be improved.
In response to this need, we have invented a tooling carrier for high precision cutting of glass substrates, which is more accurate, more stable and faster than the cutting mechanisms on the market.
Disclosure of utility model
The application aims at: in order to solve the above-mentioned problem, a tooling carrier for high-precision cutting of glass substrates is provided.
The technical scheme adopted by the application is as follows: the tool carrier for high-precision cutting of the glass substrate comprises a tool bit, a four-bar mechanism, a telescopic cylinder, an inductor, a tool feeding cylinder, a dust collecting pipe, a limiting block, an induction piece and a bottom plate;
The upper surface of the bottom plate is provided with a four-bar mechanism, one end of the four-bar mechanism is provided with a cutter head, the rear of the four-bar mechanism is provided with a telescopic cylinder, the lower part of the four-bar mechanism is fixedly provided with a cutter feeding cylinder, the rear end of the cutter feeding cylinder is provided with an inductor, and one side of the lower part of the four-bar mechanism is provided with a dust collecting pipe;
The induction piece is arranged at the edge of the upper side of the bottom plate, and the limiting block is arranged above the limiting block.
In a preferred embodiment, the dust collecting tube is located directly below the cutter head.
In a preferred embodiment, the surface of the base plate is provided with a plurality of mounting base holes.
In a preferred embodiment, the inductor is provided with a locking piece at the outside thereof, and the bottom of the locking piece is connected to the upper surface of the bottom plate by a bolt.
In summary, due to the adoption of the technical scheme, the beneficial effects of the application are as follows:
According to the application, when an uncut glass substrate reaches a cutting position from an annealing furnace, a telescopic cylinder and a cutter feeding cylinder on a cutting tool loading tool start to work, a cutter head is fed to a cutting point of the glass substrate for cutting through a four-bar mechanism, meanwhile, a dust collecting pipe below the cutter head starts to work, and dust generated by cutting is recovered in vacuum; the cutting is completed, the cutter feeding cylinder, the telescopic cylinder and the four-bar mechanism are restored to an initial state, the cutter head is separated from the glass substrate, and the cut glass substrate flows into the next station; wait that next piece not cut glass substrate to reach the cutting position and cut to make whole cutting device cutting effect more accurate in the use, the fixed stability to glass substrate has improved in the cutting process, and the efficiency of cutting is higher simultaneously.
Drawings
FIG. 1 is a schematic view of the whole structure of a tool loading tool according to the present application;
Fig. 2 is an overall top view of the tool carrier of the present application.
The marks in the figure: 1-tool bit, 2-four bar linkage, 3-telescopic cylinder, 4-inductor, 5-tool feed cylinder, 6-dust collecting pipe, 7-stopper, 8-induction piece, 9-bottom plate.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions in the embodiments of the present application will be clearly and completely described in the following in conjunction with the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
With reference to figures 1-2 of the drawings,
Examples:
The tool carrier for high-precision cutting of the glass substrate comprises a tool bit 1, a four-bar mechanism 2, a telescopic cylinder 3, an inductor 4, a tool feeding cylinder 5, a dust collecting pipe 6, a limiting block 7, an induction piece 8 and a bottom plate 9;
The upper surface of the bottom plate 9 is provided with a four-bar mechanism 2, one end of the four-bar mechanism 2 is provided with a cutter head 1, the rear of the four-bar mechanism 2 is provided with a telescopic cylinder 3, the lower part of the four-bar mechanism 2 is fixedly provided with a cutter feeding cylinder 5, the rear end of the cutter feeding cylinder 5 is provided with an inductor 4, and one side below the four-bar mechanism 2 is provided with a dust collecting pipe 6;
The utility model provides a carry out high accuracy cutting's frock carrier in liquid crystal glazing base plate production, has tool bit, flexible cylinder, send the sword cylinder, four link mechanism, dust collecting tube, stopper, response piece, bottom plate etc. (schematic).
The work sequence of the tool carrier for high-precision cutting in the production of the liquid crystal glass substrate is as follows: when the uncut glass substrate reaches a cutting position from the annealing furnace, a telescopic cylinder and a cutter feeding cylinder on the cutting tool loading tool send a cutter head to a cutting point of the glass substrate through a four-bar mechanism for cutting, and meanwhile, a dust collecting pipe below the cutter head starts to work and vacuum recovery is carried out on cut dust; and after the cutting is completed, the cutter feeding cylinder, the telescopic cylinder and the four connecting rods are restored to the initial state, and the cut glass substrate flows into the next station. And waiting for the next uncut glass substrate to reach a cutting position for cutting. The above actions are reciprocally formed into an integral cutting production.
The induction piece 8 is arranged at the edge of the upper side of the bottom plate 9, and the limiting block 7 is arranged above the limiting block 7.
The dust collecting tube 6 is located directly below the cutter head 1.
The surface of the bottom plate 9 is provided with a plurality of mounting base holes.
The outside of the inductor 4 is provided with a locking piece, and the bottom of the locking piece is connected to the upper surface of the bottom plate 9 by a bolt.
According to the application, when an uncut glass substrate reaches a cutting position from an annealing furnace, a telescopic cylinder and a cutter feeding cylinder on a cutting tool loading tool start to work, a cutter head is fed to a cutting point of the glass substrate for cutting through a four-bar mechanism, meanwhile, a dust collecting pipe below the cutter head starts to work, and dust generated by cutting is recovered in vacuum; the cutting is completed, the cutter feeding cylinder, the telescopic cylinder and the four-bar mechanism are restored to an initial state, the cutter head is separated from the glass substrate, and the cut glass substrate flows into the next station; wait that next piece not cut glass substrate to reach the cutting position and cut to make whole cutting device cutting effect more accurate in the use, the fixed stability to glass substrate has improved in the cutting process, and the efficiency of cutting is higher simultaneously.
The implementation principle of the embodiment of the tool carrier for high-precision cutting of the glass substrate is as follows: according to the application, when an uncut glass substrate reaches a cutting position from an annealing furnace, a telescopic cylinder and a cutter feeding cylinder on a cutting tool loading tool start to work, a cutter head is fed to a cutting point of the glass substrate for cutting through a four-bar mechanism, meanwhile, a dust collecting pipe below the cutter head starts to work, and dust generated by cutting is recovered in vacuum; the cutting is completed, the cutter feeding cylinder, the telescopic cylinder and the four-bar mechanism are restored to an initial state, the cutter head is separated from the glass substrate, and the cut glass substrate flows into the next station; wait that next piece not cut glass substrate to reach the cutting position and cut to make whole cutting device cutting effect more accurate in the use, the fixed stability to glass substrate has improved in the cutting process, and the efficiency of cutting is higher simultaneously.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (4)
1. A frock carrier for glass substrate high accuracy cutting, its characterized in that: the tool carrier for high-precision cutting of the glass substrate comprises a tool bit (1), a four-bar mechanism (2), a telescopic cylinder (3), an inductor (4), a tool feeding cylinder (5), a dust collecting pipe (6), a limiting block (7), an induction piece (8) and a bottom plate (9);
the automatic cutting machine is characterized in that a four-bar mechanism (2) is arranged on the upper surface of the bottom plate (9), a cutter head (1) is arranged at one end of the four-bar mechanism (2), a telescopic cylinder (3) is arranged at the rear of the four-bar mechanism (2), a cutter feeding cylinder (5) is fixedly arranged below the four-bar mechanism (2), an inductor (4) is arranged at the rear end of the cutter feeding cylinder (5), and a dust collecting pipe (6) is arranged at one side of the lower part of the four-bar mechanism (2);
The induction piece (8) is arranged at the edge of the upper side of the bottom plate (9), and the limiting block (7) is arranged above the limiting block (7).
2. The tooling carrier for high precision cutting of glass substrates as claimed in claim 1, wherein: the dust collecting pipe (6) is positioned right below the cutter head (1).
3. The tooling carrier for high precision cutting of glass substrates as claimed in claim 1, wherein: a plurality of mounting base holes are formed in the surface of the bottom plate (9).
4. The tooling carrier for high precision cutting of glass substrates as claimed in claim 1, wherein: the outside of inductor (4) is provided with the locking piece, and the bottom of locking piece passes through bolted connection in the upper surface of bottom plate (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322798962.3U CN220887348U (en) | 2023-10-19 | 2023-10-19 | Tool carrier for high-precision cutting of glass substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322798962.3U CN220887348U (en) | 2023-10-19 | 2023-10-19 | Tool carrier for high-precision cutting of glass substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220887348U true CN220887348U (en) | 2024-05-03 |
Family
ID=90842632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322798962.3U Active CN220887348U (en) | 2023-10-19 | 2023-10-19 | Tool carrier for high-precision cutting of glass substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220887348U (en) |
-
2023
- 2023-10-19 CN CN202322798962.3U patent/CN220887348U/en active Active
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