CN213459650U - Photovoltaic cell laser processing pattern precision detection device - Google Patents
Photovoltaic cell laser processing pattern precision detection device Download PDFInfo
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- CN213459650U CN213459650U CN202023011757.0U CN202023011757U CN213459650U CN 213459650 U CN213459650 U CN 213459650U CN 202023011757 U CN202023011757 U CN 202023011757U CN 213459650 U CN213459650 U CN 213459650U
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- 238000001514 detection method Methods 0.000 title claims abstract description 17
- 238000012545 processing Methods 0.000 title claims description 25
- 238000006073 displacement reaction Methods 0.000 claims abstract description 44
- 230000007246 mechanism Effects 0.000 claims abstract description 43
- 238000003754 machining Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract 7
- 230000005540 biological transmission Effects 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052710 silicon Inorganic materials 0.000 abstract description 4
- 239000010703 silicon Substances 0.000 abstract description 4
- 239000013078 crystal Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Abstract
The utility model relates to a crystal silicon battery piece laser beam machining technical field especially relates to a photovoltaic cell laser beam machining pattern precision detection device, including the bed plate, the material loading arm of machinery, the material loading sucking disc, X axle displacement mechanism, Y axle displacement mechanism, the workstation, the assembly jig, the CCD camera, the distance light camera lens, coaxial light source and backlight, the left side at bed plate top and the bottom fixed connection of material loading arm of machinery, material loading sucking disc fixed mounting is on the material loading arm, X axle displacement mechanism fixed mounting is at the intermediate position at bed plate top, Y axle displacement mechanism fixed mounting is on the free end on X axle displacement mechanism, the free end at Y axle displacement mechanism top and the bottom fixed connection of workstation. The utility model discloses reached and carried out on-line measuring's purpose to wafer laser beam machining pattern, can also revise in real time according to laser pattern's error through feedback system simultaneously, not only improved detection efficiency, but also can guarantee processingquality, reduce the incidence of wastrel.
Description
Technical Field
The utility model relates to a crystal silicon battery piece laser beam machining technical field especially relates to a photovoltaic cell laser beam machining pattern precision detection device.
Background
The solar photovoltaic cell is called photovoltaic cell for short and is used for directly converting solar energy into electric energy. Silicon solar cells which take silicon as a substrate are largely used in the ground photovoltaic system at present and can be divided into monocrystalline silicon, polycrystalline silicon and amorphous silicon solar cells, the monocrystalline silicon and the polycrystalline silicon cells are superior to the amorphous silicon cells in the aspects of comprehensive performances such as energy conversion efficiency, service life and the like, and the polycrystalline silicon has lower conversion efficiency than the monocrystalline silicon but is cheaper.
In the production process of the photovoltaic cell, the corresponding patterns of laser processing need to be carried out on the wafer in the photovoltaic cell, and the laser equipment needs to detect the wafer after drawing the patterns, so that the processing quality is ensured, the defective products are avoided, the current detection mode mainly depends on manual visual observation, the mode not only wastes time and energy, but also has lower detection efficiency, and therefore the production and use requirements cannot be met.
SUMMERY OF THE UTILITY MODEL
The utility model provides a not enough to prior art, the utility model provides a photovoltaic cell laser beam machining pattern precision detection device has reached and has carried out the purpose of on-line measuring to wafer laser beam machining pattern, can also revise in real time according to the error of laser pattern through feedback system simultaneously, has not only improved detection efficiency, but also can guarantee processingquality, reduces the incidence of wastrel.
In order to solve the technical problem, the utility model provides a following technical scheme: a photovoltaic cell laser processing pattern precision detection device comprises a base plate, a feeding mechanical arm, a feeding sucker, an X-axis displacement mechanism, a Y-axis displacement mechanism, a workbench, an assembly frame, a CCD camera, a high beam lens, a coaxial light source and a backlight source, wherein the left side of the top of the base plate is fixedly connected with the bottom of the feeding mechanical arm, the feeding sucker is fixedly installed on the feeding mechanical arm, the X-axis displacement mechanism is fixedly installed at the middle position of the top of the base plate, the Y-axis displacement mechanism is fixedly installed on the free end of the X-axis displacement mechanism, the free end of the top of the Y-axis displacement mechanism is fixedly connected with the bottom of the workbench, the assembly frame is fixedly installed at the top of the base plate, the front top of the assembly frame is fixedly connected with the CCD camera, the high beam lens is fixedly installed on the assembly frame, and the high beam lens is positioned below the bottom of the CCD camera, the coaxial light source is fixedly installed on the assembling frame, the coaxial light source is located below the bottom of the high beam lens, and the backlight source is fixedly installed on the workbench.
Furthermore, the X-axis displacement mechanism and the Y-axis displacement mechanism are of the same structure, and are distributed in a mutually perpendicular state.
Further, X axle displacement mechanism includes slide rail, linear electric motor and slider, slide rail fixed mounting is at the top of bed plate, the slider slidable mounting is on the slide rail.
Further, linear electric motor fixed mounting is in one side on the slide rail, linear electric motor's output and the one side transmission of slider are connected.
Further, a wafer is arranged on the workbench, and a clapper is fixedly arranged on the right side of the workbench.
Further, the right side fixed mounting at bed plate top has the unloading arm, fixed mounting has the unloading sucking disc on the unloading arm.
The utility model provides a photovoltaic cell laser beam machining pattern precision detection device possesses following beneficial effect:
1. the utility model provides the precision of promotion laser beam machining pattern to can carry out on-line measuring to the precision of laser beam machining pattern, reach and carry out on-line measuring's purpose to wafer laser beam machining pattern, can also revise in real time according to the error of laser pattern through feedback system simultaneously, not only improve detection efficiency, but also can guarantee processingquality, reduce the incidence of wastrel.
2. The utility model discloses can carry out on-line measuring wafer processingquality to through measurement and the real-time feedback information of control to wafer laser processing pattern, showing and having reduced high yield laser equipment and taking place the bad frequency in batches, the laser beam machining system is fed back to the laser beam machining error that on-line measuring obtained moreover, revises the error of laser beam machining pattern in real time, promotes the precision and the product quality of laser beam machining pattern.
Drawings
Fig. 1 is a schematic perspective view of the present invention;
FIG. 2 is a top view of the structure of the present invention;
FIG. 3 is a front view of the structure of the present invention;
fig. 4 is a schematic view of the front side of the structure of the present invention.
In the figure: 1. a base plate; 2. a feeding mechanical arm; 3. a feeding sucker; 4. an X-axis displacement mechanism; 5. a Y-axis displacement mechanism; 6. a work table; 7. an assembly frame; 8. a CCD camera; 9. a high beam lens; 10. a coaxial light source; 11. a backlight source; 12. a wafer; 13. clapping the board; 14. blanking sucker; 15. a blanking mechanical arm; 41. a slide rail; 42. a linear motor; 43. a slide block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a photovoltaic cell laser processing pattern precision detection device comprises a base plate 1, a feeding mechanical arm 2, a feeding sucker 3, an X-axis displacement mechanism 4, a Y-axis displacement mechanism 5, a workbench 6, an assembly frame 7, a CCD camera 8, a high beam lens 9, a coaxial light source 10 and a backlight source 11, wherein the left side of the top of the base plate 1 is fixedly connected with the bottom of the feeding mechanical arm 2, the feeding sucker 3 is fixedly installed on the feeding mechanical arm 2, the X-axis displacement mechanism 4 is fixedly installed at the middle position of the top of the base plate 1, the Y-axis displacement mechanism 5 is fixedly installed on the free end of the X-axis displacement mechanism 4, the free end of the top of the Y-axis displacement mechanism 5 is fixedly connected with the bottom of the workbench 6, the assembly frame 7 is fixedly installed at the top of the base plate 1, the front top of the assembly frame 7 is fixedly connected with the CCD camera 8, the high beam lens 9 is fixedly installed on the assembly frame, a high beam lens 9 is positioned below the bottom of a CCD camera 8, a coaxial light source 10 is fixedly arranged on an assembly frame 7, the coaxial light source 10 is positioned below the bottom of the high beam lens 9, a backlight source 11 is fixedly arranged on a worktable 6, a wafer 12 after laser processing is placed on the worktable 6 by the action of a feeding mechanical arm 2 in cooperation with a feeding sucker 3, then the backlight source 11 is opened, the high beam lens 9 and the CCD camera 8 are used for searching and determining the edge position of the wafer 12, meanwhile, an X-axis displacement mechanism 4 and a Y-axis displacement mechanism 5 act and drive the worktable 6 to carry out position adjustment so as to position the wafer 12, then the coaxial light source 10 positioned above the wafer is opened, the high beam lens 9 and the CCD camera 8 are used for measuring the error of the laser pattern of the wafer 12, then the measured laser pattern error is fed back to a laser processing system to correct the error of the laser pattern in real time, the precision of the laser processing pattern is improved, so that the precision of the laser processing pattern can be detected on line, the purpose of detecting the wafer laser processing pattern on line is achieved, meanwhile, the error of the laser pattern can be corrected in real time through a feedback system, the detection efficiency is improved, the processing quality can be guaranteed, and the incidence rate of defective products is reduced.
The wafer 12 is arranged on the workbench 6, the clapper 13 is fixedly arranged on the right side of the workbench 6, the blanking mechanical arm 15 is fixedly arranged on the right side of the top of the base plate 1, the blanking suction cup 14 is fixedly arranged on the blanking mechanical arm 15, the X-axis displacement mechanism 4 and the Y-axis displacement mechanism 5 are of the same structure, the X-axis displacement mechanism 4 and the Y-axis displacement mechanism 5 are distributed in a mutually vertical state, the X-axis displacement mechanism 4 comprises a slide rail 41, a linear motor 42 and a slide block 43, the slide rail 41 is fixedly arranged on the top of the base plate 1, the slide block 43 is slidably arranged on the slide rail 41, the linear motor 42 is fixedly arranged on one side of the slide rail 41, the output end of the linear motor 42 is in transmission connection with one side of the slide block 43, the slide block 43 can be driven to move on the slide rail 41 to displace through the operation of the linear motor 42, the two are matched to drive the workbench 6 to perform corresponding axial movement displacement, so that the position of the wafer can be quickly adjusted, the wafer and the CCD camera 8 are in the coaxial position, the laser processing pattern can be quickly detected, and the detection efficiency is improved.
In the using process, a wafer 12 after laser processing is placed on a workbench 6 through the action of a feeding mechanical arm 2 in cooperation with a feeding sucker 3, then a backlight source 11 is opened, a high beam lens 9 and a CCD camera 8 are used for searching and determining the edge position of the wafer 12, meanwhile, an X-axis displacement mechanism 4 and a Y-axis displacement mechanism 5 act and drive the workbench 6 to carry out position adjustment, so that the wafer 12 is positioned, then a coaxial light source 10 positioned above the wafer is opened, the high beam lens 9 and the CCD camera 8 are used for measuring the error of the laser pattern of the wafer 12, then the measured laser pattern error is fed back to a laser processing system, the error of the laser pattern is corrected in real time, the precision of the laser processing pattern is improved, and the precision of the laser processing pattern can be detected on line, the utility model can carry out on-line detection on the processing quality of the wafer, and can feed back the information in real time through the measurement and monitoring on the laser, the frequency of batch badness of high-yield laser equipment is obviously reduced, and the laser pattern error obtained by online measurement is fed back to a laser processing system, so that the error of the laser pattern is corrected in real time, and the precision and the product quality of the laser processed pattern are improved.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a photovoltaic cell laser beam machining pattern precision detection device, includes bed plate (1), material loading arm (2), material loading sucking disc (3), X axle displacement mechanism (4), Y axle displacement mechanism (5), workstation (6), assembly jig (7), CCD camera (8), distance light camera lens (9), coaxial light source (10) and backlight (11), its characterized in that: the left side of the top of the base plate (1) is fixedly connected with the bottom of a feeding mechanical arm (2), the feeding sucker (3) is fixedly installed on the feeding mechanical arm (2), the X-axis displacement mechanism (4) is fixedly installed at the middle position of the top of the base plate (1), the Y-axis displacement mechanism (5) is fixedly installed at the free end of the X-axis displacement mechanism (4), the free end of the top of the Y-axis displacement mechanism (5) is fixedly connected with the bottom of a workbench (6), an assembly frame (7) is fixedly installed at the top of the base plate (1), the front top of the assembly frame (7) is fixedly connected with a CCD camera (8), a high beam lens (9) is fixedly installed on the assembly frame (7), the high beam lens (9) is located below the bottom of the CCD camera (8), and a coaxial light source (10) is fixedly installed on the assembly frame (7), the coaxial light source (10) is positioned below the bottom of the high beam lens (9), and the backlight source (11) is fixedly arranged on the workbench (6).
2. The device for detecting the laser processing pattern precision of the photovoltaic cell as claimed in claim 1, wherein: the X-axis displacement mechanism (4) and the Y-axis displacement mechanism (5) are of the same structure, and the X-axis displacement mechanism (4) and the Y-axis displacement mechanism (5) are distributed in a mutually perpendicular state.
3. The device for detecting the laser processing pattern precision of the photovoltaic cell as claimed in claim 1, wherein: the X-axis displacement mechanism (4) comprises a sliding rail (41), a linear motor (42) and a sliding block (43), the sliding rail (41) is fixedly installed at the top of the base plate (1), and the sliding block (43) is installed on the sliding rail (41) in a sliding mode.
4. The device for detecting the laser processing pattern accuracy of the photovoltaic cell as claimed in claim 3, wherein: the linear motor (42) is fixedly installed on one side of the sliding rail (41), and the output end of the linear motor (42) is in transmission connection with one side of the sliding block (43).
5. The device for detecting the laser processing pattern precision of the photovoltaic cell as claimed in claim 1, wherein: the wafer (12) is arranged on the workbench (6), and the clapper (13) is fixedly arranged on the right side of the workbench (6).
6. The device for detecting the laser processing pattern precision of the photovoltaic cell as claimed in claim 1, wherein: the right side fixed mounting at bed plate (1) top has unloading arm (15), fixed mounting has unloading sucking disc (14) on unloading arm (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023011757.0U CN213459650U (en) | 2020-12-15 | 2020-12-15 | Photovoltaic cell laser processing pattern precision detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023011757.0U CN213459650U (en) | 2020-12-15 | 2020-12-15 | Photovoltaic cell laser processing pattern precision detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213459650U true CN213459650U (en) | 2021-06-15 |
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ID=76305411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023011757.0U Expired - Fee Related CN213459650U (en) | 2020-12-15 | 2020-12-15 | Photovoltaic cell laser processing pattern precision detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213459650U (en) |
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2020
- 2020-12-15 CN CN202023011757.0U patent/CN213459650U/en not_active Expired - Fee Related
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210615 |