CN114643648A

CN114643648A - Silicon rod cutting and grinding integrated machine and silicon rod cutting and grinding method

Info

Publication number: CN114643648A
Application number: CN202011567775.9A
Authority: CN
Inventors: 卢建伟; 钱春军; 潘雪明; 曹奇峰
Original assignee: Shanghai Nissin Machine Tool Co Ltd
Current assignee: Tiantong Rijin Precision Technology Co ltd
Priority date: 2020-12-17
Filing date: 2020-12-25
Publication date: 2022-06-21
Also published as: CN114643653A; CN217196245U; CN214982281U; CN114643652A; CN216181765U; CN215039119U; CN215094804U; CN217196246U

Abstract

The application discloses a silicon rod cutting and grinding all-in-one machine and a silicon rod cutting and grinding method, the silicon rod cutting and grinding all-in-one machine comprises a cutting device and a grinding device, the cutting device comprises a first cutting unit, a first distance adjusting unit, a second cutting unit and a second distance adjusting unit, the first cutting unit comprises two orthogonal first cutting wire saws, the second cutting unit comprises two orthogonal second cutting wire saws, the cutting positions of the two orthogonal first cutting wire saws are adjusted by the first distance adjusting unit so as to adjust the cutting spaces formed by the two orthogonal first cutting wire saws, the cutting positions of the two orthogonal second cutting wire saws are adjusted by the second distance adjusting unit so as to adjust the cutting spaces formed by the two orthogonal second cutting wire saws, therefore, based on the silicon rod cutting and grinding all-in-one machine, the integrated operation of silicon rod cutting and grinding multiple processes can be completed, the production efficiency and the quality of product processing operation are improved, the cutting space formed by each cutting wire saw can be adjusted to adapt to silicon rods with different specifications and sizes.

Description

Silicon rod cutting and grinding integrated machine and silicon rod cutting and grinding method

Technical Field

The application relates to the technical field of silicon workpiece processing, in particular to a silicon rod cutting and grinding all-in-one machine and a silicon rod cutting and grinding method.

Background

At present, with the importance and the openness of the society on the utilization of green renewable energy sources, the field of photovoltaic solar power generation is more and more valued and developed. In the field of photovoltaic power generation, conventional crystalline silicon solar cells are fabricated on high quality silicon wafers that are cut and subsequently processed by multi-wire saw from a pulled or cast silicon ingot.

In the conventional silicon wafer manufacturing process, taking a single crystal silicon product as an example, the general working procedures may include: firstly, a silicon rod cutting machine is used for cutting the original long silicon rod to form a plurality of sections of short silicon rods; after the cutting is finished, cutting the cut short silicon rod by using a silicon rod cutting machine to form a single crystal silicon rod; then, processing operations such as surface grinding, chamfering and the like are carried out on each single crystal silicon rod, so that the surface of each single crystal silicon rod is shaped to meet the corresponding requirements on flatness and dimensional tolerance; and subsequently, slicing the single crystal silicon rod by using a slicing machine to obtain the single crystal silicon slice.

However, in general, in the related art, operations required for each process operation (for example, cutting and squaring, grinding, chamfering, and the like) are independently arranged, the corresponding processing devices are distributed in different production units or different production areas of a production workshop or a production workshop, the conversion of workpieces performing different process operations requires carrying and allocating, and a pretreatment operation may be required before each process operation is performed, so that the process is complicated, the efficiency is low, the quality of the silicon rod processing operation is easily affected, more manpower or transfer equipment is required, the potential safety hazard is great, in addition, the flow links among the operation equipment of each process are many, the risk of workpiece damage is increased in the workpiece transfer process, disqualification caused by non-production factors is easily generated, the yield of products and unreasonable loss caused by the existing processing mode are reduced, is a major improvement subject faced by each company.

Disclosure of Invention

In view of the above disadvantages of the related art, an object of the present invention is to disclose a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method, which are used to solve the problems of low efficiency between each process operation and poor silicon rod processing operation effect in the related art.

To achieve the above and other related objects, the present application discloses a silicon rod grinding machine, including: the base is provided with a silicon rod processing platform; the silicon rod processing platform comprises a first cutting area, a second cutting area and a grinding area; a cutting device, comprising: the device comprises a first cutting unit, a first distance adjusting unit, a second cutting unit and a second distance adjusting unit; the first cutting unit comprises two orthogonal first cutting wire saws, and the two orthogonal first cutting wire saws are used for cutting the silicon rod to be cut at the first cutting position to form two orthogonal side faces; the first distance adjusting unit is used for adjusting the cutting positions of two orthogonal first cutting wire saws in the first cutting unit; the second cutting unit comprises two orthogonal second cutting wire saws which are used for cutting the silicon rod to be cut at the second cutting position to form two orthogonal side faces and cutting the silicon rod into the silicon rod with the rectangular cross section; the second distance adjusting unit is used for adjusting the cutting positions of two orthogonal second cutting wire saws in the second cutting unit; the grinding device is used for grinding and chamfering the cut silicon rod at the grinding position; and the silicon rod conversion device is arranged on the silicon rod processing platform and used for converting the silicon rod among the first cutting area, the second cutting area and the grinding area.

The application discloses a silicon rod cutting and grinding all-in-one machine comprises a cutting device, a grinding device and a silicon rod conversion device, wherein the cutting device comprises a first cutting unit, a first distance adjusting unit, a second cutting unit and a second distance adjusting unit, the first cutting unit comprises two orthogonal first cutting wire saws, the second cutting unit comprises two orthogonal second cutting wire saws, the cutting positions of the two orthogonal first cutting wire saws are adjusted by the first distance adjusting unit so as to adjust the cutting spaces formed by the two orthogonal first cutting wire saws, the cutting positions of the two orthogonal second cutting wire saws are adjusted by the second distance adjusting unit so as to adjust the cutting spaces formed by the two orthogonal second cutting wire saws, therefore, based on the silicon rod cutting and grinding all-in-one machine, the integrated operation of silicon rod cutting and grinding multiple processes can be completed, the production efficiency and the quality of product processing operation are improved, the cutting space formed by each cutting wire saw can be adjusted to adapt to silicon rods with different specifications and sizes.

In certain embodiments of the first aspect of the present application, the first cutting unit comprises: the first cutting wire is wound on the first cutting wheels and the first transition wheels to form two orthogonal first cutting wire saws; the first distance adjusting unit comprises a first bobbin adjusting mechanism, and the first bobbin adjusting mechanism is used for adjusting the positions of the first bobbin and a plurality of first cutting wheels and first transition wheels on the first bobbin; the second cutting unit includes: the second cutting wire is wound around the plurality of second cutting wheels and the plurality of second transition wheels to form two orthogonal second cutting wire saws; the second distance adjusting unit comprises a second wire frame adjusting mechanism, and the second wire frame adjusting mechanism is used for adjusting the positions of the second wire frame and a plurality of second cutting wheels and second transition wheels on the second wire frame.

In certain embodiments of the first aspect of the present application, the first cutting wheel has at least two cutting wire slots, and the first pitch adjustment unit further comprises a first calibration mechanism for driving the first transition wheel to move so as to adjust a current wire slot wound by a first cutting wire in the first transition wheel from a first cutting wire slot corresponding to the first cutting wheel to a second cutting wire slot corresponding to the first cutting wheel; the second cutting wheel is provided with at least two cutting wire grooves, and the second distance adjusting unit further comprises a second calibrating mechanism which is used for driving the second transition wheel to move so that a current wire groove wound by a second cutting wire in the second transition wheel is adjusted from a first cutting wire groove corresponding to the second cutting wheel to a second cutting wire groove corresponding to the second cutting wheel.

In certain embodiments of the first aspect of the present application, the cutting device further comprises: the first cutting frame and the first cutting support are positioned in a first cutting area, the first cutting frame is arranged on the machine base, the first cutting support is movably lifted on the first cutting frame, and the first cutting unit is arranged on the first cutting support; the second cutting frame and the second cutting support are located in the second cutting area, the second cutting frame is arranged on the machine base, the second cutting support movably ascends and descends the second cutting frame, and the second cutting unit is arranged on the second cutting support.

In certain embodiments of the first aspect of the present application, the silicon rod slicing and grinding all-in-one machine further comprises: the first wire winding and unwinding unit corresponds to the first cutting unit, and the second wire winding and unwinding unit corresponds to the second cutting unit.

In certain embodiments of the first aspect of the present application, the first cut line is wound around the plurality of first cutting wheels and first transition wheels to form an end-to-end first closed loop cut line, and the second cut line is wound around the plurality of second cutting wheels and second transition wheels to form an end-to-end second closed loop cut line.

In certain embodiments of the first aspect of the present application, the cutting device further comprises: the cutting frame is arranged on the base; the cutting frame is positioned between the first cutting area and the second cutting area; the cutting support is movably lifted on the cutting frame; the cutting support comprises a support main body, a first support flank and a second support flank, wherein the first support flank and the second support flank are positioned on two opposite lateral sides of the support main body; the first cutting unit is arranged on a first support flank of the cutting support, and the second cutting unit is arranged on a second support flank of the cutting support.

In certain embodiments of the first aspect of the present application, the first cutting line and the second cutting line are the same cutting line, and the cutting support is further provided with an intermediate transition wheel located between the first cutting unit and the second cutting unit and around which the cutting line is wound.

In certain embodiments of the first aspect of the present application, the cutting device further comprises a take-up and pay-off unit.

In certain embodiments of the first aspect of the present application, the cutting line is wrapped around the plurality of first cutting wheels, the first transition wheel, the intermediate transition wheel, the plurality of second cutting wheels, and the second transition wheel to form an endless closed loop cutting line.

In certain embodiments of the first aspect of the present application, it is right in the first cutting unit to wait that the nodical point of the first cutting coping saw of two orthogonals is located when cutting the silicon rod and carrying out first plane of folding cutting in waiting to cut in the section of silicon rod, it is right in the second cutting unit to wait that the nodical point of the second cutting coping saw of two orthogonals is located when cutting the silicon rod and carrying out second plane of folding cutting in waiting to cut in the section of silicon rod.

In certain embodiments of the first aspect of the present application, the silicon rod slicing and grinding all-in-one machine further comprises: the first flaw-piece discharging device is used for discharging flaw-pieces generated after the first cutting unit performs first folding cutting; and the second flaw-piece discharging device is used for discharging the flaw-pieces generated after the second folding surface cutting is carried out on the second cutting unit.

In certain embodiments of the first aspect of the present application, any one of the first and second flaw-piece discharge devices comprises: a flaw-piece lifting unit for lifting the flaw-piece so that the flaw-piece tip protrudes out of the cut silicon rod; and the flaw-piece clamping and transferring unit is used for clamping the flaw-pieces and transferring the flaw-pieces.

In certain embodiments of the first aspect of the present application, the flaw-piece gripping transfer unit comprises: the clamping mechanism is used for clamping or releasing the top end of the side skin; and the lifting driving mechanism is used for driving the clamping mechanism to move up and down so as to enable the clamping mechanism to drive the clamped flaw-piece to be separated from the cut silicon rod.

In certain embodiments of the first aspect of the present application, the clamping mechanism comprises: the cover body is used for covering the side leather; the clamping assembly is arranged inside the cover body; the clamping assembly and the cover body form a clamping space for clamping the edge leather.

In certain embodiments of the first aspect of the present application, the cover comprises an arcuate plate having a semi-circular cross-section; the clamping assembly includes two orthogonal clamping members.

In certain embodiments of the first aspect of the present application, the clamping member is a movable press block controlled by a cylinder, and the movable press block is connected to an output shaft of the cylinder through a swing arm.

In certain embodiments of the first aspect of the present application, either the first and second flaw-piece discharge devices further comprise a wire-pulling mechanism for pulling the corresponding first or second cutting wire saw to expand outwardly to avoid interference of the first or second cutting wire saw with the cut silicon rod.

In certain embodiments of the first aspect of the present application, the grinding apparatus comprises: the grinding support is movably arranged on the machine base; and at least one pair of grinding tools are oppositely arranged on the grinding support.

In certain embodiments of the first aspect of the present application, the abrasive article comprises: a main shaft; and the grinding wheel assembly is arranged at the working end of the main shaft.

In certain embodiments of the first aspect of the present application, the grinding wheel assembly comprises a rough grinding wheel, a finish grinding wheel, or a nested combination of rough grinding wheel and finish grinding wheel.

In certain embodiments of the first aspect of the present application, the abrasive article comprises: a rotary chassis; the double-head main shaft is arranged on the rotary chassis, the first end of the double-head main shaft is provided with at least one coarse grinding wheel, and the second end of the double-head main shaft is provided with at least one fine grinding wheel; and the conversion motor is used for driving the rotary chassis to rotate so that the first end and the second end of the double-head spindle can exchange positions.

In certain embodiments of the first aspect of the present application, the grinding apparatus further comprises at least one chamfering tool, which is disposed on the grinding support for chamfering or rounding the edge of the cut silicon rod.

In certain embodiments of the first aspect of the present application, the chamfering tool comprises a chamfering wheel having an axis offset from an axis of the cut silicon rod.

In certain embodiments of the first aspect of the present application, the first cutting region, the second cutting region and the grinding region of the silicon rod processing platform are distributed at 120 ° between two adjacent cutting regions, and the rotation angle range of the silicon rod conversion device is ± 240 °.

In certain embodiments of the first aspect of the present application, the silicon rod processing platform is further provided with a pretreatment area, the silicon rod cutting and grinding all-in-one machine further comprises a silicon rod transfer device, and the adjacent silicon rod processing platform is arranged on the pretreatment area for transferring a silicon rod to be processed to the pretreatment area of the silicon rod processing platform or transferring the silicon rod after processing on the pretreatment area out of the silicon rod processing platform.

In certain embodiments of the first aspect of the present application, the first cutting zone, the second cutting zone, the grinding zone and the pretreatment zone of the silicon rod processing platform are distributed at 90 ° between two adjacent cutting zones, and the rotation angle range of the silicon rod conversion device is ± 270 °.

In certain embodiments of the first aspect of the present application, the silicon rod transfer device comprises: a conveying body; the silicon rod positioning mechanism is arranged on the conveying body and used for positioning the silicon rod; and the conversion driving mechanism is used for driving the conveying body to rotate so as to drive the silicon rod positioned by the silicon rod positioning mechanism to convert among all the regions.

The application discloses a silicon rod cutting and grinding method, which is applied to a silicon rod cutting and grinding all-in-one machine,

the silicon rod cutting and grinding method is applied to a silicon rod cutting and grinding all-in-one machine, the silicon rod cutting and grinding all-in-one machine comprises a machine base with a silicon rod processing platform, the silicon rod processing platform is provided with a first cutting area, a second cutting area and a grinding area, the silicon rod cutting and grinding all-in-one machine further comprises a cutting device, a grinding device and a silicon rod conversion device, the cutting device comprises a first cutting unit, a first distance adjusting unit, a second cutting unit and a second distance adjusting unit, the first cutting unit comprises two orthogonal first cutting wire saws, the second cutting unit comprises two orthogonal second cutting wire saws, and the silicon rod cutting and grinding method comprises the following steps:

the silicon rod conversion device converts the first silicon rod to a first cutting area, and two orthogonal first cutting wire saws in the first cutting unit cut the first silicon rod at the first cutting area to form two orthogonal side surfaces; the cutting position of the first cutting unit is adjusted by the distance adjusting unit according to the cutting task;

the silicon rod conversion device is used for converting the first silicon rod from the first cutting area to the second cutting area and converting the second silicon rod to the first cutting area, two orthogonal second cutting wire saws in the second cutting unit are used for cutting the first silicon rod in the second cutting area to form two orthogonal side surfaces, the first silicon rod is cut into the silicon rod with the rectangular cross section, and at the stage, the two orthogonal first cutting wire saws in the first cutting unit are used for cutting the second silicon rod in the first cutting area to form two orthogonal side surfaces;

the silicon rod conversion device is used for converting the first silicon rod from the second cutting area to the first grinding area, converting the second silicon rod from the first cutting area to the second cutting area and converting the third silicon rod to the first cutting area, the grinding device is used for grinding and chamfering the first silicon rod in the grinding area, at this stage, two orthogonal second cutting wire saws in the second cutting unit are used for cutting the second silicon rod in the second cutting area to form two orthogonal side surfaces, the second silicon rod is cut into the silicon rod with the rectangular cross section, and the two orthogonal first cutting wire saws in the first cutting unit are used for cutting the third silicon rod in the first cutting area to form two orthogonal side surfaces.

The silicon rod cutting and grinding method is applied to the silicon rod cutting and grinding all-in-one machine, when silicon rod cutting and grinding operation is executed, the first distance adjusting unit can adjust the cutting positions of the two orthogonal first cutting wire saws to adjust the cutting space formed by the two orthogonal first cutting wire saws, the second distance adjusting unit can adjust the cutting positions of the two orthogonal second cutting wire saws to adjust the cutting space formed by the two orthogonal second cutting wire saws, the silicon rod conversion device enables the silicon rod to be transferred between each processing position in an orderly and seamless mode, the cutting device enables the silicon rod to be subjected to surface folding cutting twice to form a square silicon rod, and the grinding device grinds the square silicon rod after being subjected to surface folding cutting twice, so that integrated operation of silicon rod cutting and grinding multiple processes is completed, and production efficiency and product processing operation quality are improved. Therefore, based on the silicon rod cutting and grinding all-in-one machine, the integrated operation of multiple processes of cutting and grinding the silicon rod can be completed, the production efficiency and the quality of product processing operation are improved, and the cutting space formed by each cutting wire saw can be adjusted to adapt to the silicon rods with different specifications and sizes.

Drawings

The specific features of the invention to which this application relates are set forth in the appended claims. The features and advantages of the invention to which the present application relates will be better understood by reference to the exemplary embodiments and drawings described in detail below. The brief description of the drawings is as follows:

fig. 1 is a schematic structural view of a silicon rod cutting and grinding all-in-one machine according to an embodiment of the present application.

Fig. 2 shows a top view of the silicon rod slicing and grinding all-in-one machine of the present application in one embodiment.

Fig. 3 is a top view of a cutting device in the silicon rod slicing and grinding all-in-one machine according to an embodiment of the invention.

Fig. 4 is a schematic structural diagram of a first cutting unit of the cutting device in the silicon rod cutting and grinding all-in-one machine.

Fig. 5 is a schematic structural view of the cutting device in fig. 3 from another view angle.

Fig. 6 shows a top view of the first cutting unit of the cutting device of fig. 3.

Fig. 7 is a partially enlarged schematic view of fig. 6.

Fig. 8 is a schematic view showing a state of a first flaw-piece discharging device and a second flaw-piece discharging device in the silicon rod cutting integrated machine according to the present application.

Fig. 9 is a second schematic view showing the states of the first flaw-piece discharging device and the second flaw-piece discharging device in the silicon rod cutting integrated machine of the present application.

Fig. 10 and 11 are schematic views showing the clamping assembly of the clamping mechanism in the first flaw-piece discharging device and the cover body in cooperation with clamping the flaw-pieces.

Detailed Description

The following description of the embodiments of the present application is provided for illustrative purposes, and other advantages and capabilities of the present application will become apparent to those skilled in the art from the present disclosure.

In the following description, reference is made to the accompanying drawings that describe several embodiments of the application. It is to be understood that other embodiments may be utilized and that mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present application is defined only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Spatially relative terms, such as "upper," "lower," "left," "right," "lower," "below," "lower," "above," "upper," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature as illustrated in the figures.

Although the terms first, second, etc. may be used herein to describe various elements or parameters in some instances, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another element or parameter. For example, a first direction may be referred to as a second direction, and similarly, a second direction may be referred to as a first direction, without departing from the scope of the various described embodiments.

Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

In the related art for processing a silicon rod, several steps such as cutting, grinding, chamfering, and the like are involved.

Generally, most of the conventional silicon rods have a cylindrical structure, and the silicon rods are cut by a silicon rod cutting device so that the cross section of the silicon rods after cutting process is similar to a rectangle (including a similar square), while the cut silicon rods are generally similar to a cuboid (including a similar cube).

Taking a single crystal silicon rod as an example, a process for forming the single crystal silicon rod may include: firstly, a silicon rod cutting machine is used for cutting the original long silicon rod to form a plurality of sections of short silicon rods; and after the cutting is finished, cutting the short silicon rod by using a silicon rod cutting machine to form the single crystal silicon rod with the rectangular-like cross section. Among them, patent publications such as CN105856445A, CN105946127A, and CN105196A can be referred to as a specific embodiment of forming a multi-stage short silicon rod by cutting an original long silicon rod with a silicon rod cutting machine, and patent publication such as CN105818285A can be referred to as a specific embodiment of forming a single crystal silicon rod having a rectangular-like cross section by cutting a short silicon rod with a silicon rod squarer. However, the process for forming the single crystal silicon rod is not limited to the foregoing technique, and in alternative examples, the process for forming the single crystal silicon rod may further include: firstly, using a full silicon rod squaring machine to perform squaring operation on an original long silicon rod to form a long monocrystalline silicon rod with a quasi-rectangular cross section; and after the cutting is finished, cutting off the cut long monocrystalline silicon rod by using a silicon rod cutting machine to form a short crystalline silicon rod. Among them, a specific embodiment of the above-described method for forming a long single crystal silicon rod having a substantially rectangular shape by squaring an initial long silicon rod using an all-silicon-rod squarer is disclosed in patent publication CN003443A, for example.

After the cylindrical silicon single crystal rod is cut into a quasi-rectangular silicon rod by the squaring device, the quasi-rectangular silicon rod can be ground, chamfered (or rounded) by the grinding device.

The inventors of the present application have found that in the related art of the processing operation for the silicon rod, the processing devices such as the cutting and grinding (for example, surface grinding, chamfering, and the like) are disposed separately and independently from each other, and the conversion of the silicon rod to perform different process operations requires the transfer and preparation and the pretreatment before the processing, which causes problems such as complicated processes and low efficiency.

In addition, in the related cutting device, a plurality of cutting wheels are often fixed by a mounting bracket after being respectively arranged on the rotating shaft, or a plurality of cutting wheels are fixed by a mounting bracket after being arranged on the same main shaft, and generally, once the cutting wheels are arranged in place, the positions and the mutual relations of the cutting wheels cannot be easily changed. In some cases, in order to cut round silicon rods with different sizes to form cuboid-like silicon rods with corresponding sizes, the cutting line in the squaring and cutting device needs to be adjusted to change the cutting space formed by the cutting line. Alternatively, in some cases, when the wire groove of one of the cutting wheels is worn, the wire groove needs to be replaced as a whole, and the wire groove needs to be replaced by adjusting the position of the cutting wheel or other components (such as the transition wheel) and calibrating. In the existing squaring cutting device, either the adjusting mechanism is not provided or the structure of the adjusting mechanism is complex, and the whole adjusting process is very complicated and has low efficiency.

In view of the above, the present application provides a silicon rod cutting and grinding all-in-one machine, which includes a machine base, a cutting device, a grinding device, and a silicon rod conversion device, where the cutting device includes a first cutting unit, a first distance adjusting unit, a second cutting unit, and a second distance adjusting unit, and the two orthogonal first cutting wire saws are used to cut a silicon rod to be cut at the first cutting location to form two orthogonal side surfaces; the first distance adjusting unit is used for adjusting the cutting positions of two orthogonal first cutting wire saws in the first cutting unit; the second cutting unit comprises two orthogonal second cutting wire saws, and the two orthogonal second cutting wire saws are used for cutting the silicon rod to be cut at the second cutting position to form two orthogonal side surfaces and cutting the silicon rod into the silicon rod with the rectangular cross section; the second distance adjusting unit is used for adjusting the cutting positions of two orthogonal second cutting wire saws in the second cutting unit; the grinding device is used for grinding and chamfering the cut silicon rod at the grinding position; the silicon rod conversion device is used for converting the silicon rod among the first cutting area, the second cutting area and the grinding area.

The application discloses silicon rod cutting and grinding all-in-one machine is used for carrying out the integration operation of evolution cutting and grinding multiple processes to the silicon rod. In an embodiment, the silicon rod may be, for example, a single crystal silicon rod, i.e., a rod-shaped single crystal silicon grown from a melt by using a czochralski method or a suspension float zone method, such as a single crystal silicon rod with a length of about 5000mm (e.g., 5360mm specification, etc.) or a single crystal silicon rod with a length of about 800mm, which is common in silicon rod processing, or a polysilicon rod, i.e., a silicon rod with a silicon deposited on the surface of a silicon core wire by using a deposition technique such as a chemical vapor deposition technique, but is not limited thereto.

In any of the embodiments provided herein, the end surfaces of the silicon rod refer to two opposing surfaces that point in the length direction of the silicon rod. For example, two end surfaces of a silicon rod to be cut are circular or similar to circular, and the side surface of the silicon rod is an arc surface; the cut silicon rod has a rectangular or quasi-rectangular shape at its two ends, i.e. four sides of the silicon rod in the longitudinal direction, which are generally rectangular.

Referring to fig. 1, a schematic structural view of an embodiment of a silicon rod slicing and grinding all-in-one machine according to the present application is shown, and fig. 2 is a top view of an embodiment of the silicon rod slicing and grinding all-in-one machine according to the present application.

The application discloses silicon rod evolution equipment includes: the silicon rod conversion device comprises a base, a cutting device, a grinding device and a silicon rod conversion device.

The base serves as a main body part of the silicon rod cutting and grinding all-in-one machine and is used for providing a silicon rod processing platform, and in one example, the size and the weight of the base are large so as to provide a larger mounting surface and firmer stability of the whole machine. It should be understood that the machine base can serve as a base for different structures or components of the silicon rod slicing and grinding machine for carrying out machining operations, and the specific structure of the machine base can be changed based on different functional requirements or structural requirements. In some examples, the machine base comprises a fixing structure or a limiting structure, such as a base, a rod body, a column body, a frame body and the like, for receiving different parts in the silicon rod cutting and grinding all-in-one machine.

Meanwhile, in some examples, the base may be an integrated base, and in other examples, the base may include a plurality of independent bases.

In the exemplary embodiment shown in fig. 1 and 2, the machine base 1 has a silicon rod processing platform, which can be divided into a plurality of functional areas according to the specific operation content of the silicon rod processing operation. For example, the silicon rod processing platform comprises at least a cutting section and a grinding section. The shape of the silicon rod processing platform can be determined according to the machine base or can be determined according to the processing requirements of the machine base and the cutting device.

And the silicon rod conversion device is arranged on the silicon rod processing platform and used for converting the silicon rod between the cutting area and the grinding area. In the embodiment shown in fig. 1 and 2, a silicon rod transfer device 4 is provided in a central region of the silicon rod processing platform for transferring silicon rods between the various functional locations on the silicon rod processing platform. In an embodiment, the silicon rod transfer device 4 is rotatably disposed on the silicon rod processing platform, and the silicon rod transfer device 4 may further include: the conveying body is in a disc shape, a circular ring shape, a square disc shape or other similar shapes; the silicon rod positioning mechanism is arranged on the conveying body and used for positioning the silicon rod; and the conversion driving mechanism is used for driving the conveying body to rotate so as to drive the silicon rod positioning mechanism and the silicon rod conversion position positioned by the silicon rod positioning mechanism.

In the silicon rod conversion device, the number of the silicon rod positioning mechanisms provided on the conveying body may be varied differently according to the layout of the silicon rod cutting and grinding integrated machine.

For example, in certain embodiments, the silicon rod processing platform may comprise a first processing location and a second processing location, and in order to accommodate these functional locations, the number of silicon rod positioning mechanisms on the conveying body may be two, and each silicon rod positioning mechanism may position at least one silicon rod. Further, the angle set between every two silicon rod positioning mechanisms is consistent with the angle distribution between every two functional areas. Thus, when a certain silicon rod positioning mechanism corresponds to a certain functional zone, inevitably, another silicon rod positioning mechanism also corresponds to another functional zone. Thus, in the pipelining operation, when at least one silicon rod is positioned on each silicon rod positioning mechanism and the silicon rod positioning mechanisms correspond to the functional regions, the silicon rods are positioned at the corresponding functional regions to perform corresponding processing operations, for example: the silicon rod located in the first processing region can be subjected to first processing operation, and the silicon rod located in the second processing region can be subjected to second processing operation.

In some embodiments, the silicon rod processing platform may include a first processing location, a second processing location, and a third processing location, and in order to be adapted to these functional locations, the number of silicon rod positioning mechanisms on the conveying body may be set to three, and each silicon rod positioning mechanism may position at least one silicon rod. Furthermore, the angles set between every two silicon rod positioning mechanisms are consistent with the angle distribution between every two silicon rod positioning mechanisms in the three functional areas. Thus, when one silicon rod positioning mechanism corresponds to one functional zone, inevitably, the other two silicon rod positioning mechanisms also correspond to the other two functional zones. Thus, in the pipelining operation, when at least one silicon rod is positioned on each silicon rod positioning mechanism and the silicon rod positioning mechanisms correspond to the functional regions, the silicon rods are positioned at the corresponding functional regions to perform corresponding processing operations, for example: the silicon rod located in the first processing region can be subjected to first processing operation, the silicon rod located in the second processing region can be subjected to second processing operation, and the silicon rod located in the third processing region can be subjected to third processing operation. In an alternative example, the first processing location, the second processing location and the third processing location on the silicon rod processing platform are arranged at 120 ° with respect to one another, so that correspondingly, the three silicon rod positioning means on the conveying body are also arranged at 120 ° with respect to one another. Of course, the number of the silicon rod positioning mechanisms may vary according to actual requirements, but is not limited thereto, for example, the number of the silicon rod positioning mechanisms may be determined according to the number of the functional regions arranged on the silicon rod processing platform.

In some embodiments, the silicon rod processing platform comprises a waiting area, a first processing area, a second processing area and a third processing area, and the number of the silicon rod positioning mechanisms on the conveying body can be four to match with the functional areas, and each silicon rod positioning mechanism can position at least one silicon rod. Further, the angles set between every two silicon rod positioning mechanisms are consistent with the angle distribution between every two silicon rod positioning mechanisms at the four functional areas. Thus, when one silicon rod positioning mechanism corresponds to one functional zone, inevitably, the other three silicon rod positioning mechanisms also correspond to the other three functional zones respectively. Thus, in the process of running water, at any time, when at least one silicon rod is positioned on each silicon rod positioning mechanism and the silicon rod positioning mechanisms correspond to the functional regions, the silicon rods are positioned at a corresponding functional region to perform corresponding processing operations, for example: the silicon rod in the waiting zone can be subjected to pretreatment operation, the silicon rod in the first processing zone can be subjected to first processing operation, the silicon rod in the second processing zone can be subjected to second processing operation, and the silicon rod in the third processing zone can be subjected to third processing operation. In an optional embodiment, the waiting area, the first processing area, the second processing area and the third processing area on the silicon rod processing platform are distributed at 90 ° with respect to each other, and therefore, correspondingly, the four silicon rod positioning mechanisms on the conveying body are also distributed at 90 ° with respect to each other. Of course, the number of the silicon rod positioning mechanisms may vary according to actual requirements, but is not limited thereto, for example, the number of the silicon rod positioning mechanisms may be determined according to the number of the functional regions arranged on the silicon rod processing platform.

In the silicon rod cutting and grinding all-in-one machine of the embodiment, at least a cutting device and a grinding device are included, so that, in certain embodiments, the silicon rod processing platform comprises a cutting area and a grinding area, wherein the cutting area or the grinding area comprises one or more areas. For example, the cutting zone can comprise a first cutting zone and a second cutting zone, and the milling zone can comprise a first milling zone and a second milling zone. In addition, the silicon rod processing platform may further comprise a waiting location. In the embodiment shown in fig. 1 and 2, the silicon rod processing platform includes a waiting area, a first cutting area, a second cutting area, and a grinding area, the number of the silicon rod positioning mechanisms on the conveying body can be four, and the waiting area, the first cutting area, the second cutting area, and the grinding area are distributed at 90 ° therebetween, so that the four silicon rod positioning mechanisms on the conveying body are also distributed at 90 ° therebetween.

In some embodiments, the silicon rod positioning mechanism may further comprise: a rotary bearing table, a rotary pressing device, a lifting driving device (not shown), and a rotary driving device (not shown).

The rotary support is arranged on the conveying body in the silicon rod transfer device 4 for supporting the silicon rods 100(200) and for allowing the silicon rods 100(200) to stand, i.e. the bottoms of the silicon rods 100(200) are seated on the rotary support. In the present embodiment, the susceptor is rotated and rotated together when the conveying body in the silicon rod transfer device 4 is rotated. In some embodiments, the rotating susceptor may be configured to rotate, for example, the rotating susceptor may have a rotation axis relative to the conveying body to rotate, such that the rotating susceptor and the silicon rods 100(200) thereon rotate together after the silicon rods 100(200) are held by the rotating susceptor. Further, the contact surface of the rotary carrying table for contacting the silicon rod is provided with a damping to provide a certain friction force for driving the silicon rod. The rotary stage is adapted to the silicon rod 100(200), and in some embodiments, the rotary stage may be a circular stage or a square stage adapted to the cross-sectional size of the silicon rod 100 (200).

The rotary pressing device is arranged above the rotary carrying table, and is used for pressing against the top of the silicon rod 100(200) to press the silicon rod 100 (200). The rotary pressing device can further comprise a support movably arranged and a top pressing movable block arranged at the bottom of the support. The support is movably arranged on a central mounting frame, and the central mounting frame is positioned in the central area of the conveying body and rotates along with the conveying body. The top pressure movable block is matched with the silicon rod 100(200), and in an optional embodiment, the top pressure movable block can be a round cake-shaped pressing block or a square pressing block matched with the cross section size of the silicon rod 100 (200). Furthermore, the jacking movable block in the rotary pressing device is pivotally connected to the support and can rotate relative to the support.

In the above description, the rotary bearing platform is designed to be capable of self-rotation, and the pressing movable block in the rotary pressing device is pivotally connected to the support, so that the rotary bearing platform or the pressing movable block can be linked to a rotary driving device. In one case, when the rotary bearing platform is linked with a rotary driving device, the rotary bearing platform is used as a driving rotating part, and the jacking movable block is used as a driven rotating part; in another case, when the pressing movable block is linked to a rotation driving device, the pressing movable block serves as a driving rotating part and the rotating bearing table serves as a driven rotating part.

In practical applications, the rotating pressing device may cooperate with a rotating platform below the rotating pressing device, specifically, after the silicon rod 100(200) is vertically placed on the rotating platform, the lifting driving device drives the support to move down along the central mounting frame until the pressing movable block on the support abuts against the top of the silicon rod 100 (200). Subsequently, when the silicon rod 100(200) needs to be rotated, the rotary bearing table or the top pressing movable block which is linked with the rotary bearing table is driven by the rotary driving device to rotate, and the silicon rod 100(200) is driven to rotate together with the top pressing movable block by utilizing the friction force among the rotary bearing table, the silicon rod 100(200) and the top pressing movable block, so that the operation surface or the operation area in the silicon rod 100(200) is adjusted, and the adjusted operation surface or operation area in the silicon rod 100 is processed. The rotation speed and the rotation angle of the silicon rods 100(200) can be controlled by the rotation driving device. In a specific implementation manner, the lifting driving device may be, for example, an air cylinder or a lifting motor, and the rotation driving device may be, for example, a rotating motor.

Further, as can be seen from the above, in some cases, the rotary carrying platform or the top pressing movable block can be controlled by the rotary driving device to rotate to drive the silicon rod 100(200) to rotate to change the working surface or the working area, and sometimes, when the silicon rod 100(200) rotates to the required working surface or working area, the operation needs to be stopped and positioned to receive the processing operation of the processing device in the corresponding functional area. Therefore, in the present application, the silicon rod positioning mechanism may also be provided with a locking mechanism, if necessary. In one implementation, a carrier locking mechanism (not shown) may be provided at the bottom of the central mount and adjacent the rotary carrier, and may include a lock bolt and a lock cylinder coupled to the lock bolt. In practical application, when the rotary bearing table needs to be locked, a locking cylinder in the bearing table locking mechanism drives a locking bolt to extend out and act on the bottom or the neck of the rotary bearing table, so that the rotary bearing table is ensured to be stable and immovable; when the silicon rod needs to be rotated to change the operation surface or the operation area, the locking cylinder in the bearing table locking mechanism drives the locking bolt to contract, so that the rotary bearing table is unlocked, and the rotary bearing table can rotate.

The conveying body is driven by the conversion driving mechanism to rotate, and the silicon rod positioning mechanism on the conveying body and the silicon rods 100(200) positioned by the silicon rod positioning mechanism are converted between different functional areas through the rotation of the conveying body.

In some embodiments, the transition drive mechanism further comprises: the conversion toothed belt is arranged on the periphery of the conveying body; the silicon rod processing device comprises a driving motor and a linkage structure which is connected with the driving motor and driven by the driving motor, the linkage structure is arranged on a silicon rod processing platform of the base 1, and the linkage structure comprises a rotating gear meshed with the conversion toothed belt. Thus, the rotating gear drives the conveying body to rotate under the driving of the driving motor so as to drive the silicon rod positioning mechanism and the

silicon rods

100 and 200 thereon to be converted to other functional areas to complete conveying, and the driving motor can be a servo motor.

In certain embodiments, the silicon rod transfer device 4 may further comprise a locking mechanism (not shown in the figures) for locking the conveying body. For example, the locking mechanism may include a plurality of locking bolts and a locking cylinder connected to the locking bolts, where the number of the locking bolts may be multiple and the locking bolts are uniformly distributed on the edge of the conveying body (for example, the number of the locking bolts is four and the locking bolts are uniformly distributed in a 90 ° angle manner), and in practical applications, when the silicon rod needs to be transferred from a certain processing region to another processing region, the locking cylinder drives the locking bolts to contract to unlock the conveying body, so that the conveying body can rotate; after the silicon rod is converted, namely the silicon rod is converted to a target processing position from a certain processing position, the locking cylinder in the locking mechanism drives the locking bolt to extend out and act on the conveying body, and the conveying body is locked.

As mentioned above, the silicon rods located at the waiting area can be pretreated. The silicon rod cutting and grinding all-in-one machine further comprises a silicon rod transferring device 6 which is adjacently arranged at a waiting position of the silicon rod processing platform and used for transferring the silicon rod 100(200) to be processed to the waiting position of the silicon rod processing platform or transferring the processed silicon rod on the waiting position out of the silicon rod processing platform.

The silicon rod transfer device 6 further includes: a transferring base, a silicon rod platform and a platform turnover mechanism.

As described above, the silicon rod transfer device is used to transfer the silicon rod 100 to be processed to the waiting location of the silicon rod processing platform or transfer the silicon rod 200 processed at the waiting location out of the silicon rod processing platform, wherein the cross section of the silicon rod 100 is circular and the cross section of the silicon rod 200 is square.

In certain embodiments, a first silicon rod transfer device dedicated to the circular silicon rod 100 and a second silicon rod transfer device dedicated to the square silicon rod 200 are provided.

In certain embodiments, silicon rod transfer devices are provided that may be used for both round silicon rods 100 and square silicon rods 200.

The transferring base is arranged on the machine base 1 in a sliding way through a sliding mechanism. In this embodiment, the sliding mechanism can realize sliding in at least two directions. For example, the sliding mechanism may include a support portion, a switching portion, a first direction sliding unit disposed between the support portion and the switching portion, and a second direction sliding unit disposed between the switching portion and the transfer base, wherein the first direction sliding unit may include a first direction slide rail, a first direction slider or slide bar corresponding to the first direction slide rail, and a first direction driving source, and the second direction sliding unit may include a second direction slide rail, a second direction slider or slide bar corresponding to the second direction slide rail, and a second direction driving source.

Wherein, first slide rail, first direction slider or draw runner, second slide rail, second direction slider or draw runner are laid with the horizontality, any one in first direction driving source and the second direction driving source can include: a sliding rack, a rotating gear (not shown in the drawing) meshed with the sliding rack and a sliding driving motor. And the first driving source can drive the conversion part and the transfer base on the conversion part to slide along the first direction through the first direction sliding block or the sliding strip and the first direction sliding rail. And the second driving source can drive the transfer base to slide along the second direction through a second direction sliding block or a sliding strip and a second direction sliding rail.

In some examples, the first direction may be, for example, a left-right direction (i.e., an X-axis direction in fig. 2 and 3), and the second direction may be, for example, a front-back direction (i.e., a Y-axis direction in fig. 2 and 3).

The silicon rod platform is movably disposed on the transfer base for laterally (i.e., horizontally) positioning the silicon rod 100 (200). In this embodiment, the silicon rod platform is a plate-shaped structure or a frame structure, and at least one silicon rod supporting bracket is disposed at least at the front and rear ends of the silicon rod platform, respectively, for supporting the front and rear ends of the silicon rods 100(200), so that the silicon rods 100(200) can be horizontally disposed. Meanwhile, stopper structures may be provided at both left and right sides of the silicon rod platform, respectively, for restricting movement of the silicon rods 100(200) in the left-right direction.

It is known that the silicon rod 100 needs to be converted from a horizontal state (horizontal placement) to an upright state (vertical placement) in a subsequent processing operation, and therefore, in the present application, a silicon rod fastening mechanism may also be provided for fastening the silicon rod (not shown in the drawings) during the silicon rod transfer. In certain embodiments, the silicon rod fastening mechanism may comprise a fastening jaw and a fastening motor or a fastening cylinder controlling the fastening jaw. Furthermore, the silicon rod fastening mechanism comprises at least two pairs of fastening claws, wherein the at least two pairs of fastening claws correspond to the two silicon rod support brackets respectively, namely, one pair of fastening claws corresponds to one silicon rod support bracket, two fastening claws of the pair of fastening claws are oppositely arranged on the left side and the right side of the silicon rod support bracket respectively, and each fastening claw is provided with a fastening motor or a fastening air cylinder. In practical applications, when the silicon rod 100(200) is lying on the silicon rod platform, the fastening motor or the fastening cylinder drives the respective fastening jaw towards the silicon rod 100(200) on the silicon rod platform, so that the silicon rod 100(200) is fastened as a whole by the cooperation of at least two pairs of fastening jaws. Preferably, the pressing part of the fastening claw contacting with the silicon rod 100(200) may be provided with a buffer part to avoid or reduce damage to the silicon rod 100 (200).

In order to convert the silicon rod 100 from the horizontal state (horizontal placement) to the vertical state (vertical placement), the silicon rod transfer device 6 further includes a platform-overturning mechanism. The platform turnover mechanism is used for driving the silicon rod platform to turn over relative to the transfer base, so that the silicon rods 100(200) are vertically placed on the silicon rod conversion device 4. In this embodiment, the platform turnover mechanism includes: mounting bracket, removal frame, upset cylinder or upset motor, upset rack and upset gear. The mounting bracket is fixedly arranged on the transferring base. In some embodiments, the mounting bracket is a plate-like structure or a frame structure. The movable frame is movably arranged above the mounting frame. In some embodiments, the movable frame is a hollow plate-like structure or a frame structure. Furthermore, the left and right opposite sides of the part of the movable frame adjacent to the silicon rod conversion device 4 are respectively provided with a turnover rack, correspondingly, the left and right opposite sides of the turnover end of the silicon rod platform adjacent to the silicon rod conversion device 4 are respectively provided with a turnover gear, and the turnover rack corresponding to the turnover gear is arranged on and meshed with the turnover rack. The overturning cylinder or the overturning motor is used for driving the moving frame to move relative to the mounting frame. Taking a turning cylinder as an example, the turning cylinder is integrally arranged in a hollow area of the moving frame, specifically, a cylinder body (for example, including a cylinder barrel and a piston) in the turning cylinder is arranged on the mounting frame, and a piston rod in the turning cylinder is connected to the moving frame. In practical application, aiming at the problem that the silicon rod platform is turned from a horizontal state to a vertical state: the upset cylinder actuates, and the piston rod extends and promotes the carriage for the carriage moves relative mounting bracket under promoting, and the upset rack on the carriage also follows the carriage and removes, rotates under the drive of upset rack with upset rack engaged with upset gear on the silicon rod platform, thereby drives the silicon rod platform and overturns, finally realizes that the silicon rod platform is overturned into vertical state by the horizontality. Aiming at the problem that the silicon rod platform is turned from a vertical state to a horizontal state: the upset cylinder actuates, and the piston rod contracts and stimulates the carriage for the carriage moves relative mounting bracket under promoting, and the upset rack on the carriage also follows the carriage and removes, rotates under the drive of upset rack with upset rack engaged with upset gear on the silicon rod platform, thereby drives the silicon rod platform and overturns, finally realizes that the silicon rod platform overturns into the horizontality by vertical state.

What is needed is: in addition, in order to enable the movable frame to smoothly and stably move relative to the mounting frame, slide rails are arranged on the left and right opposite sides of the mounting frame, and slide blocks or slide bars for sliding on the slide rails are arranged on the left and right opposite sides of the bottom of the movable frame. For example, in other embodiments, the slide rail may be disposed on the movable frame instead, and the slide block or the slide bar may be disposed on the mounting frame instead. Furthermore, in order to avoid or reduce the collision damage of the silicon rod platform to the movable frame, the mounting frame or the overturning cylinder or the overturning motor in the overturning process (for example, when the silicon rod platform is overturned from the vertical state to the horizontal state), a relatively convex buffer can be further arranged on the movable frame or the mounting frame.

The silicon rod transfer device 6 may further include a lifting mechanism. The lifting mechanism is arranged on the silicon rod platform and is used for lifting and descending the overturned silicon rod 100 (200). In this embodiment, the lifting mechanism may include a slide rail or a slide rod and a lifting motor or a lifting cylinder, wherein to realize the lifting motion of the silicon rod 100(200), the silicon rod support bracket is disposed on the silicon rod platform through the slide rail or the slide rod (the silicon rod fastening mechanism is mounted and connected to the silicon rod support bracket), and the lifting motor or the lifting cylinder controls the silicon rod support bracket (together with the silicon rod fastening mechanism) to perform the lifting motion, so as to drive the silicon rod 100(200) to realize the lifting. Still take the lifting cylinder as an example, the whole lifting cylinder is arranged in the middle of the silicon rod platform, specifically, the cylinder body (for example, including the cylinder barrel and the piston) in the lifting cylinder is arranged on the silicon rod platform, and the piston rod in the lifting cylinder is connected to the silicon rod support bracket. In practical application, the lifting cylinder is actuated, the piston rod extends and retracts (extends or contracts) and pushes and pulls (pushes or pulls) the silicon rod support bracket, so that the silicon rod support bracket moves up and down relative to the mounting frame under pushing and pulling, and the silicon rods 100(200) on the silicon rod support bracket also move up and down along with the silicon rod support bracket.

The silicon rod transfer device 6 is only an exemplary one, but not limited thereto, and other variations of the silicon rod transfer device may be made.

In certain embodiments, the silicon rod transfer device may include: the reversing mechanism comprises a reversing carrier, a silicon rod clamp arranged on the reversing carrier and a reversing driving mechanism used for driving the reversing carrier to do reversing motion.

The reversing carrier is a main body device used for arranging other various components in the silicon rod transfer device, the other various components mainly comprise a silicon rod clamp, but not limited to the silicon rod clamp, and the other components can also be a mechanical structure, an electrical control system, numerical control equipment and the like. In this embodiment, the reversing carrier may include a base, a top frame opposite to the base, and a supporting structure disposed between the base and the top frame. In addition, the reversing carrier has another important function of supporting the reversing conversion of the silicon rod clamp through reversing movement. The reversing carrier can be moved in a reversing manner, for example, by means of a reversing drive. By using the reversing driving mechanism, the reversing carrier can be driven to perform reversing motion so that the silicon rod clamp on the reversing carrier clamps the silicon rod 100 to be processed and transfers the silicon rod from the loading and unloading area to the waiting area, or clamps the processed silicon rod 200 corresponding to the waiting area and transfers the silicon rod from the waiting area to the loading and unloading area.

In a specific implementation manner, the reversing driving mechanism for realizing the reversing motion of the reversing carrier can comprise a rotating shaft and a rotating motor, and the reversing carrier is connected with the installation foundation structure below the reversing carrier through the rotating shaft. When the steering movement is implemented, the rotating motor is started to drive the rotating shaft to rotate so as to drive the reversing carrier to rotate to realize the reversing movement. The aforementioned rotation of the drive rotation shaft can be designed as a unidirectional rotation, which can be, for example, a unidirectional clockwise rotation or a unidirectional counterclockwise rotation, and also as a bidirectional rotation, which can be, for example, a clockwise rotation and a counterclockwise rotation. In addition, the angle at which the driving rotation shaft rotates may be set according to the actual configuration of the silicon rod transfer device. Moreover, the base in the reversing carrier can adopt a disc structure, a rectangular disc or an elliptical disc, and the central position of the base is connected with the rotating shaft, but the shape of the base is not limited to the above, and in other embodiments, the base can also adopt other shapes.

And a silicon rod clamp is arranged on the reversing carrier and used for clamping a corresponding silicon rod. For example, in some embodiments, a silicon rod clamp is arranged on a certain mounting surface of the reversing carrier, and the silicon rod clamp may include at least two silicon rod clamping parts, wherein the at least two silicon rod clamping parts are arranged at intervals. The silicon rod holder in the silicon rod clamp may be used for holding a round silicon rod (i.e. a silicon rod to be processed) as well as a square silicon rod (i.e. a processed silicon rod). Therefore, the silicon rod clamp on the reversing carrier is switched between the loading and unloading area and the waiting area to transfer the silicon rod to be processed and between the waiting area and the loading and unloading area to transfer the processed silicon rod by driving the reversing carrier to perform reversing motion. In practical applications, the rotation angle of the reversing carrier for reversing motion is determined according to the position relationship between the loading and unloading area and the waiting area. In some embodiments, the loading and unloading area and the waiting area are arranged oppositely, and the silicon rod transfer device is positioned between the loading area and the waiting area, so that the reversing carrier is driven by the reversing driving mechanism to rotate by 180 degrees. In some embodiments, the loading and unloading area and the waiting area are disposed at an angle of 90 °, and the reversing carrier is driven by the reversing driving mechanism to rotate at an angle of 90 °. However, no matter how, the positional relationship between the loading and unloading area and the waiting area is not particularly limited, and the arrangement order and the arrangement angle therebetween can be changed, so long as unnecessary interference is not generated between the stations, and thus the rotation direction and the rotation angle of the reversing carrier can be adjusted adaptively.

In certain embodiments, both the silicon rod to be processed and the processed silicon rod are placed vertically, so that at least two silicon rod holders of the silicon rod clamp are arranged at a distance from one another. Any one of the silicon rod holders may further comprise: the reversing carrier comprises a clamping arm mounting seat and two clamping arms, wherein the clamping arm mounting seat is arranged on the reversing carrier, and at least two clamping arms are movably arranged on the clamping arm mounting seat. The two clamping arms are arranged in bilateral symmetry, and the two clamping arms can form a clamping space for clamping a single-crystal-circle silicon rod or a silicon cube. Additionally, the silicon rod clamping piece can have the function of centering adjustment. In general, when the clamping arms in the silicon rod clamping part are in a clamping state, the center of the clamping space formed by the two clamping arms coincides with the center of the silicon rod to be processed and the center of the processed silicon rod. Therefore, when the silicon rod clamping piece is used for clamping a vertically placed silicon rod to be processed or a processed silicon rod, the two clamping arms in the silicon rod clamping piece are contracted and are abutted against the silicon rod to be processed or the processed silicon rod by the clamping arms. In the process that the clamping arms shrink and clamp the silicon rod to be processed or the processed silicon rod, the silicon rod to be processed or the processed silicon rod is pushed by the two clamping arms at two sides and moves towards the central area of the clamping space until the silicon rod to be processed or the processed silicon rod is clamped by the two clamping arms in the silicon rod clamping piece, and at the moment, the center of the silicon rod to be processed or the processed silicon rod can be located at the center of the clamping space of the silicon rod clamping piece.

In order to enable the at least two clamping arms in the silicon rod clamping part to smoothly and stably clamp silicon rods to be processed or processed silicon rods with different sizes, at least one of the clamping arms in the silicon rod clamping part is of an adjustable design. Taking two clamping arms as an example, at least one of the two clamping arms is designed to be movable (one or two of the two clamping arms are designed to be movable), so that the clamping distance between the two clamping arms can be adjusted.

In addition, the silicon rod clamp in the silicon rod transfer device of the present application may have other variations. For example, the silicon rod transfer device may be provided with two silicon rod clamps, which may be respectively disposed on two opposite mounting surfaces of the reversing carrier. And, the two silicon rod clamps may be the same or different. In embodiments where the two silicon rod clamps are identical, the two silicon rod clamps are used to clamp a round and a square silicon rod. In an embodiment in which the two silicon rod clamps are not identical, one of the two silicon rod clamps is used for clamping a round silicon rod and the other silicon rod clamp is used for clamping a square silicon rod.

Furthermore, the silicon rod transfer device 6 according to the present application may further provide movement in at least one direction. For example, the silicon rod transfer device may further include a forward and backward direction advancing and retreating mechanism, and the advancing and retreating mechanism may include: the reversing device comprises a forward and backward guide rail and a forward and backward motor, wherein the forward and backward guide rail is arranged along the front and back direction, and a base of the reversing carrier can be rested on the forward and backward guide rail through a sliding block.

This application silicon rod surely grinds all-in-one still includes location detection device. In the present exemplary embodiment, the position detection device (not shown in the figures) serves for the edge detection and the centering of the silicon rod 100 located at the waiting position.

The positioning detection device further includes: ridge line detection unit and axle center adjusting unit.

In some embodiments, the ridge line detection unit includes a contact detection mechanism for sending an on-off signal to a detection controller by contacting with the ridge line of the silicon rod, a rotation mechanism for adjusting the position of the silicon rod according to the control of the detection controller, and a detection controller electrically connected to the contact detection mechanism and the rotation mechanism.

The number of the silicon rod positioning mechanisms may vary according to actual requirements, but is not limited thereto, for example, the number of the silicon rod positioning mechanisms may be determined according to the number of the functional regions provided on the silicon rod processing platform.

In some embodiments, the silicon rod positioning mechanism may further comprise: a rotary bearing platform,

In certain embodiments, the axis center adjusting unit is configured to position the axis center of the silicon rod 100 at the center of the pretreatment region, and includes a clamping mechanism configured to form a clamping space for clamping the silicon rod, and the center of the clamping space coincides with the center of the pretreatment region.

In a specific implementation, the clamping mechanism may include at least two clamping members, and each clamping member may include at least two clamping arms.

In view of the circular cross-section of the silicon rod, in some examples, the clamping element as a whole is a circular workpiece holder, the two clamping arms forming the clamping element are of symmetrical design, the single clamping arm is designed to have an arc-shaped clamping surface, preferably, the arc-shaped clamping surface of the single clamping arm exceeds 100-quarter of the arc of the silicon rod, and thus, the arc-shaped clamping surface of the clamping element formed by the two clamping arms exceeds 100-half of the arc of the silicon rod. Certainly, the arc-shaped clamping surface in the clamping arm can be additionally provided with a buffer cushion for avoiding the damage to the surface of the silicon rod in the process of clamping the silicon rod and playing a good role in protecting the silicon rod. In general, when the clamping arms of the clamping member are in a clamped state, the center of the clamping space formed by the two clamping arms coincides with the center of the silicon rod 100. Therefore, when the silicon rod 100 vertically placed on the to-be-processed region is clamped by the clamping member, the two clamping arms of the clamping member are contracted and abutted against the silicon rod by the arc-shaped clamping surfaces of the clamping arms. During the process of contracting and clamping silicon rod 100 by the clamping arms, silicon rod 100 is pushed by the two clamping arms on both sides and moves towards the central region of the clamping space until silicon rod 100 is clamped by the clamping arms in the clamping member, at which time, the center of silicon rod 100 can be located at the center of the clamping space of the clamping member.

After the silicon rod 100 to be processed is transferred to the waiting location of the silicon rod processing platform by the silicon rod transfer device 6 and is pretreated, the silicon rod may be transferred from the waiting location to another processing location by the silicon rod transfer device 4.

The cutting device is used for performing squaring and cutting operation on the silicon rod so as to cut the silicon rod with a circular cross section into a square silicon rod with a rectangular-like cross section.

The cutting device comprises a cutting unit, wherein the cutting unit comprises two orthogonal cutting wire saws used for cutting the silicon rod to be cut at the cutting position to form two orthogonal side faces.

In some embodiments, the silicon rod cutting and grinding all-in-one machine comprises a cutting device, the cutting device comprises a cutting unit, and correspondingly, the silicon rod processing platform comprises a cutting area. When the cutting device is used for conducting cutting operation on the silicon rod, the cutting unit is firstly utilized to conduct first folding cutting on the silicon rod to be cut at the cutting position, two orthogonal side faces are formed, then the position of the silicon rod to be cut or the position of the cutting unit are converted, then the cutting unit is utilized to conduct second folding cutting on the silicon rod to be cut at the cutting position, two orthogonal side faces are formed, and therefore the cross section of the silicon rod to be cut is rectangular.

In some embodiments, the silicon rod cutting and grinding all-in-one machine comprises two cutting devices, wherein each cutting device comprises at least one cutting unit, for example, the silicon rod cutting and grinding all-in-one machine comprises a first cutting device and a second cutting device, wherein the first cutting device comprises a first cutting unit, the second cutting device comprises a second cutting unit, and correspondingly, the silicon rod processing platform comprises a first cutting area corresponding to the first cutting device and a second cutting area corresponding to the second cutting device. When the silicon rod is subjected to squaring and cutting operation, a first cutting unit in a first cutting device is used for carrying out first folding cutting on the silicon rod to be cut at a first cutting position to form two orthogonal side faces, then the position of the silicon rod to be cut is converted to a second cutting position from the first cutting position, and then a second cutting unit in a second cutting device is used for carrying out second folding cutting on the silicon rod to be cut at the second cutting position to form two orthogonal side faces, so that the section of the silicon rod to be cut is rectangular.

In certain embodiments, the silicon rod cutting and grinding all-in-one machine comprises a cutting device, the cutting device comprises a first cutting unit and a second cutting unit, and correspondingly, the silicon rod processing platform comprises a first cutting area corresponding to the first cutting unit and a second cutting area corresponding to the second cutting unit. When the silicon rod is subjected to squaring and cutting operation, the first cutting unit is firstly utilized to cut the silicon rod to be cut at the first cutting position to perform first folding cutting to form two orthogonal side faces, then the position of the silicon rod to be cut is converted to the second cutting position from the first cutting position, and then the second cutting unit is utilized to cut the silicon rod to be cut at the second cutting position to perform second folding cutting to form two orthogonal side faces, so that the cross section of the silicon rod to be cut is in a similar rectangular shape.

In the embodiment shown in fig. 1 and 2, the silicon rod cutting and grinding all-in-one machine comprises a cutting device 2, and the cutting device 2 further comprises a first cutting unit and a second cutting unit. The cutting device 2 is arranged on the base 1 and is used for performing first folding cutting on the silicon rod 100 in a first cutting area of the silicon rod processing platform and performing second folding cutting on the silicon rod 100 in a second cutting area of the silicon rod processing platform to form a silicon rod with a rectangular-like cross section. Wherein either of the first and second facet cuts are cuts made to the silicon rod to form two orthogonal sides.

Referring to fig. 1 to 3, in the silicon rod slicing and grinding all-in-one machine, a cutting device 2 includes: a cutting frame 21, a cutting support 22, a first cutting unit 23, and a second cutting unit 25.

The cutting frame 21 is arranged on the machine base 1. In the present embodiment, the cutting frame 21 is a column structure or a frame structure, and serves as a support body of the cutting device 2, and can provide support for other components in the cutting device 2.

The cutting support 22 is arranged on the cutting frame 21 in a lifting manner by a lifting mechanism. In some embodiments, the lifting mechanism may include a mechanism that can realize the vertical movement of the cutting support 22, such as a lifting motor, a lifting guide rail, and a lifting slider, wherein the lifting guide rail is vertically disposed on the cutting frame 21, the lifting slider is disposed on the back of the cutting support 22 and is matched with the lifting guide rail, and a dual-guide design may be adopted, that is, two lifting guide rails are adopted, and the two lifting guide rails are disposed in parallel, so that the cutting support 22 can realize stable lifting on the mounting structure of the machine base 1. The cutting support 22 can be moved up and down relative to the cutting frame 21 and the machine base 1 by means of a lifting guide and the lifting slide, driven by the lifting motor (which can be, for example, a servo motor).

In the present embodiment, since the cutting support 22 may be provided with the first cutting unit 23 and the second cutting unit 25, that is, the first cutting unit 23 and the second cutting unit 25 share the cutting support 22. Thus, in the present embodiment, on the one hand, the cutting carriage 21 and the cutting support 22 in the cutting device 2 are provided in a central position between the first cutting location and the second cutting location. On the other hand, the cutting support 22 is specially designed. As shown in fig. 1-5, the cutting support 22 in this embodiment may include a support body and first and second support wings located on opposite lateral sides of the support body.

The first cutting unit 23 is disposed at a first side of the cutting support 22, and is configured to perform a first plane cutting on the silicon rod 100 at a first cutting location of the silicon rod processing platform.

In the present embodiment, as described above, the cutting holder 22 includes a holder main body and first and second holder side wings located on opposite sides of the holder main body, and thus the first cutting unit 23 is mounted at the first holder side wings of the cutting holder 22. Specifically, the first cutting unit 23 includes a first wire frame 231 disposed on a side of the first holder, a plurality of first cutting wheels 233 disposed on the first wire frame 231, and a first cutting wire 235, wherein the first cutting wire 235 sequentially winds the plurality of first cutting wheels 233 to form two orthogonal first cutting wires.

In practical applications, the first cutting unit 23 may comprise at least four first cutting wheels 233, and the four first cutting wheels 233 may be combined into two orthogonal first cutting wheel sets, that is, one first cutting wheel set is formed by arranging two first cutting wheels along the M axis, and one first cutting wheel set is formed by two first cutting wheel sets along the N axis, wherein the M axis is orthogonal to the N axis. Specifically, the first cutting unit 23 includes two orthogonal first cutting wheel sets, wherein one first cutting wheel set includes two first cutting wheels 233 arranged in front and rear (along the M axis), and the other first cutting wheel set includes two first cutting wheels 233 arranged in front and rear (along the N axis).

The first cutting lines 235 are sequentially wound around the first cutting wheels 233 of the first cutting unit 23 to form a first wire mesh. In practical applications, the first cutting wire 235 sequentially winds around the four first cutting wheels 233 arranged in the first cutting unit 23 to form two mutually orthogonal first cutting wires, thereby forming a first cutting wire net. Specifically, the first cutting wire 235 is wound around two first cutting wheels 233 arranged in front and back (along the M axis) of one first cutting wheel set to form one first cutting wire saw, and the first cutting wire 235 is wound around two first cutting wheels 233 arranged in front and back (along the N axis) of the other first cutting wheel set to form another second cutting wire saw. Thus, the two mutually orthogonal first cutting wire saws are matched to form a first cutting wire net in a shape of a reversed L.

Of course, the first cutting unit 23 is not limited to the embodiment shown in fig. 1 to 3, and other variations can be made in other embodiments.

In the present embodiment, the first cutting unit 23 may further include a transition wheel 234 for implementing transition guiding of the first cutting line 235. The transition wheels 234 may not be limited to one, and may be disposed on the first bobbin 231 and/or the first holder wing, for example, in some embodiments, some of the transition wheels 234 may be disposed on the first bobbin 231, in some embodiments, some of the transition wheels 234 may be disposed on the first holder wing, in some embodiments, some of the transition wheels 234 may be disposed on the first bobbin 231, and some of the transition wheels 234 may be disposed on the first holder wing.

In addition, in some embodiments, the first cutting unit 23 may further include a tension pulley provided on the first bobbin 231 and/or the first holder side wing for performing tension adjustment of the first cutting wire 235.

The second cutting unit 25 is disposed at a second side of the cutting support 22, and is configured to perform a second plane-folding cutting on the silicon rod 100 at a second processing location of the silicon rod processing platform.

In the present embodiment, as described above, the cutting support 22 includes a support main body and first and second support wings located on opposite lateral sides of the support main body, and thus the second cutting unit 25 is mounted at the second support wing of the cutting support 22. Specifically, the second cutting unit 25 includes a second wire rack 251 disposed on the second support wing, a plurality of second cutting wheels 253 disposed on the second wire rack 251, and a second cutting wire 255, and the second cutting wire 255 sequentially winds around the plurality of second cutting wheels 253 to form two orthogonal second cutting wire saws.

In practical applications, the second cutting unit 25 may include at least four second cutting wheels 253, and the four second cutting wheels 253 can be combined into two orthogonal second cutting wheel sets, that is, two second cutting wheel sets are oppositely disposed along the M axis to form one second cutting wheel set, and two second cutting wheel sets are oppositely disposed along the N axis to form one second cutting wheel set, wherein the M axis is orthogonal to the N axis. Specifically, the second cutting unit 25 comprises two orthogonal sets of second cutting wheels, wherein one set of first cutting wheels comprises two first cutting wheels 253 arranged back and forth (along the M axis) and the other set of first cutting wheels comprises two first cutting wheels 253 arranged back and forth (along the N axis).

The second cutting lines 255 sequentially wind around each of the second cutting wheels 253 of the second cutting unit 25 to form a second cutting line net. In practical applications, the second cutting line 255 sequentially winds around the four second cutting wheels 253 of the second cutting unit 25 to form two second cutting wire saws orthogonal to each other, thereby forming a second cutting wire web. Specifically, the second cutting line 255 forms one second cutting wire saw around two second cutting wheels 253 arranged in front and back (along the M axis) in one second cutting wheel set, and the second cutting line 255 forms another second cutting wire saw around two second cutting wheels 253 arranged in front and back (along the N axis) in another second cutting wheel set. Thus, the two mutually orthogonal second cutting wires cooperate to form a second cutting wire web in the shape of a "Γ".

Of course, the second cutting unit 25 is not limited to the embodiment shown in fig. 1 to 4, and other variations can be made in other embodiments.

In this embodiment, the second cutting unit 25 may further include a transition wheel 254 for achieving transition guidance of the second cutting line 255. The transition wheels 254 may not be limited to one, and may be disposed on the first bobbin 231 and/or the first support wing, for example, in some embodiments, some of the transition wheels 254 may be disposed on the second bobbin 251, in some embodiments, some of the transition wheels 254 may be disposed on the second support wing, in some embodiments, some of the transition wheels 254 may be disposed on the second bobbin 251, and some of the transition wheels 254 may be disposed on the second support wing.

In addition, in some embodiments, the second cutting unit 25 may further include a tension wheel provided on the second string carrier 251 and/or the second holder wing for performing tension adjustment of the second cutting string 255.

In certain embodiments, the first cut line and the second cut line are the same cut line. The cutting device further comprises a take-up and pay-off unit. For example, the take-up and pay-off unit may include a pay-off reel and a take-up reel, which may be disposed on the base or the cutting frame.

In the embodiment of fig. 1, the first cutting line 235 in the first cutting unit 23 and the second cutting line 255 in the second cutting unit 25 may be the same cutting line. In this case, the common cutting line is sequentially wound around the plurality of first cutting wheels 233 (and the transition wheels) provided in the first cutting unit 23 to form two orthogonal first cutting wire saws, and then transferred to the second cutting unit at the side to sequentially wind around the plurality of second cutting wheels 253 (and the transition wheels) provided in the second cutting unit 25 to form two orthogonal second cutting wire saws. In this embodiment, therefore, the cutting support 22 is also provided with one or more guide wheels around which the common cutting line is wound, between the first cutting unit 23 and the second cutting unit 25. Specifically, in the embodiment shown in fig. 4, an intermediate transition wheel 26 around which the common cutting line is wound is provided on the holder body 221 between the first cutting unit 23 and the second cutting unit 25 in the cutting holder 22.

In addition, in the embodiment shown in fig. 1, the cutting device further comprises a take-up and pay-off unit. For example, the wire winding and unwinding unit may include a wire winding drum and a wire winding drum, which may be disposed on the base 1 and located at opposite sides of the cutting frame 21, for winding and unwinding the common cutting wire.

The first cutting unit 23 and the second cutting unit 25 share the same cutting line, so that the structure of the cutting unit can be simplified (for example, a set of paying-off cylinder and a set of winding cylinder are omitted), the integrity is good, the winding process is simplified, the efficiency is improved, and the line tension and the like of the two cutting units can be better controlled.

In some embodiments, the first cutting unit and the second cutting unit in the cutting device are independent components, and then the cutting device further includes a first take-up and pay-off unit matched with the first cutting unit and a second take-up and pay-off unit matched with the second cutting unit, wherein the first take-up and pay-off unit includes a first pay-off drum and a first take-up drum which are arranged on the base or the cutting frame and are used for taking up and paying off the first cutting line, and the second take-up and pay-off unit includes a second pay-off drum and a second take-up drum which are arranged on the base or the cutting frame and are used for taking up and paying off the second cutting line.

Of course, other variations of the cutting line are possible than with a take-up and pay-off unit.

In some embodiments, the first cutting unit and the second cutting unit in the cutting device are independent parts, wherein for the first cutting unit, the first cutting line is wound around a plurality of first cutting wheels and first transition wheels to form a first closed loop cutting line in an end-to-end connection, and for the second cutting unit, the second cutting line is wound around a plurality of second cutting wheels and second transition wheels to form a second closed loop cutting line in an end-to-end connection. The first closed loop cutting line and the second closed loop cutting line can avoid the acceleration and deceleration processes of the cutting lines from influencing the cutting precision in the process of being operated to execute cutting, so that the cutting precision is improved, and the follow-up procedures are facilitated to be simplified.

In some embodiments, the first cutting line in the first cutting unit and the second cutting line in the second cutting unit may be the same cutting line. In this case, the common cutting line is wound around the plurality of first cutting wheels, the first transition wheel, the intermediate transition wheel, the plurality of second cutting wheels, and the second transition wheel to form a closed loop cutting line in end-to-end relationship. The closed-loop cutting line can avoid the influence of the acceleration and deceleration processes of the cutting line on the cutting precision in the process of running to execute cutting, so that the cutting precision is improved, and the subsequent procedures are facilitated to be simplified.

When the cutting device 2 in the embodiment shown in fig. 2 is used to cut the silicon rod at the first cutting area and the silicon rod at the second cutting area of the silicon rod processing platform, the cutting support 22 is driven to descend relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously cut the silicon rod at the corresponding first cutting area and the silicon rod at the second cutting area, wherein the first cutting unit 23 performs first plane cutting on the silicon rod at the first cutting area (the first cutting unit 23 is provided with two orthogonal first cutting wire saws in a shape of 'Γ'), and the second cutting unit 25 performs second plane cutting on the silicon rod at the second cutting area (the second cutting unit 25 is provided with two orthogonal second cutting wire saws in a shape of 'Γ'). As can be seen, in the present embodiment, the first cutting unit 23 and the second cutting unit 25 of the cutting apparatus 2 share the cutting support 22, and the first cutting unit 23 and the second cutting unit 25 thereon can perform the first folding cutting on the silicon rod at the first cutting location and the second folding cutting on the silicon rod at the second cutting location, respectively, at the same time by driving the shared cutting support 22 to perform the lifting motion. The cutting device 2 is simple in structure on the whole, convenient to control and capable of improving the cutting efficiency and quality of the silicon rod.

It should be noted that, in this embodiment, the intersection point of the two orthogonal first cutting wire saws is located in the cross section of the silicon rod to be cut (including the case that the intersection point is located on the circumference of the cross section) when the first cutting unit 23 performs the first facet cutting on the silicon rod to be cut, and the intersection point of the two orthogonal second cutting wire saws is located in the cross section of the silicon rod to be cut (including the case that the intersection point is located on the circumference of the cross section) when the second facet cutting unit 25 performs the second facet cutting on the silicon rod to be cut, so that the formed cut silicon rod obtains a cross section as large as possible (the surface area of a silicon wafer obtained after subsequent slicing is large), material loss in subsequent grinding (such as surface grinding and chamfering) operations is reduced, and the utilization rate of silicon materials is improved.

With the above-described cutting apparatus 2, after the first cutting operation (first fold cutting of the silicon rod 100 by the first cutting unit 23) and the second cutting operation (second fold cutting of the silicon rod 100 to be cut by the second cutting unit 25) are performed on the silicon rod 100 to be cut, a square silicon rod (i.e., a silicon rod having a rectangular-like cross section) is formed.

In the silicon rod cutting and grinding all-in-one machine, the cutting device further comprises a distance adjusting unit. In the embodiment shown in fig. 1 and 2, the cutting apparatus includes a first distance adjusting unit 53 and a second distance adjusting unit 55 in addition to the cutting frame 21, the cutting support 22, the first cutting unit 23, and the second cutting unit 25. The first distance adjusting unit 53 is arranged on a first support flank of the cutting support 22 and is used for adjusting the position of the first cutting unit; the second pitch unit 55 is provided on a second support flank of the cutting support 22 for adjusting the position of the second cutting unit.

When the silicon rod to be cut is placed on the silicon rod positioning mechanism, the position of the silicon rod to be cut is fixed, the position of the corresponding cutting unit is adjusted through the distance adjusting unit, the cutting position of at least one cutting wire saw in the cutting unit 21 can be adjusted, the cutting amount of the silicon rod can be controlled, and therefore the silicon rods to be cut in different sizes can be cut and/or cut into cut silicon rods in different sizes according to the production process requirements.

Taking the first cutting unit as an example, the cutting position of at least one first cutting wire saw in the first cutting unit 21 can be adjusted by adjusting the position of the first cutting unit by the first distance adjusting unit. Taking the second cutting unit as an example, the cutting position of at least one second cutting wire saw in the second cutting unit 21 can be adjusted by adjusting the position of the second cutting unit through the second distance adjusting unit.

Thus, in some embodiments, the first pitch unit includes a first carriage adjustment mechanism for adjusting the position of the first carriage and the plurality of first cutting wheels and first transition wheels thereon, and the second pitch unit includes a second carriage adjustment mechanism for adjusting the position of the second carriage and the plurality of second cutting wheels and second transition wheels thereon.

Referring to fig. 3 and 4, fig. 3 is a plan view of a cutting device in a silicon rod slicing and grinding all-in-one machine according to an embodiment of the present invention, and fig. 4 is a schematic structural view of a first cutting unit of the cutting device in the silicon rod slicing and grinding all-in-one machine according to the present invention.

As shown in fig. 3 and 4, the first distance adjusting unit includes a first bobbin adjusting mechanism 53, and the first bobbin adjusting mechanism 53 is used for adjusting the positions of the first bobbin 231 and the plurality of first cutting wheels 233 and the first transition wheels 234 thereon. The adjusting of the position of the first wire frame 231 and the plurality of first cutting wheels 233 and the first transition wheels 234 thereon may be, for example, driving the first wire frame 231 and the plurality of first cutting wheels 233 and the first transition wheels 234 thereon to move along the X-axis, so that the two orthogonal first cutting lines in the first cutting unit change positions by moving along the X-axis. For example, driving the first wire frame 231 and the plurality of first cutting wheels 233 and the first transition wheels 234 thereon to move toward the silicon rod conversion device 4 along the X axis by the first wire frame adjusting mechanism 53 may move two orthogonal first cutting lines in the first cutting unit 23 toward the silicon rod to be cut on the silicon rod conversion device 4, may increase the cutting amount of the silicon rod to be cut, or may cut a silicon rod to be cut having a smaller size. The first wire frame 231, the plurality of first cutting wheels 233 and the first transition wheel 234 thereon are driven by the first wire frame adjusting mechanism 53 to move away from the silicon rod conversion device 4 along the X axis, so that two orthogonal first cutting lines in the first cutting unit 23 move away from the silicon rod to be cut on the silicon rod conversion device 4, the cutting amount of the silicon rod to be cut can be reduced, or the silicon rod to be cut with a larger size can be cut.

Similarly, the second distance adjusting unit includes a second bobbin adjusting mechanism 55, and the second bobbin adjusting mechanism 55 is used for adjusting the position of the second bobbin 251 and the plurality of second cutting wheels 253 and second transition wheels 254 thereon. The adjusting of the positions of the second bobbin 251 and the plurality of second cutting wheels 253 and the second transition wheels 254 thereon may be, for example, driving the second bobbin 251 and the plurality of second cutting wheels 253 and the second transition wheels 254 thereon to move along a Y-axis (the Y-axis is orthogonal to the X-axis) so that two orthogonal second cutting lines in the second cutting unit change positions by moving along the X-axis. For example, driving the second bobbin 251 and the plurality of second cutting wheels 253 and second transition wheels 254 thereon to move toward the silicon rod conversion device 4 along the Y axis using the second bobbin adjusting mechanism 55 may cause two orthogonal second cutting lines in the second cutting unit 25 to move toward the silicon rod to be cut on the silicon rod conversion device 4, may increase the cutting amount of the silicon rod to be cut or may cut the silicon rod to be cut having a smaller size. The second wire rack adjusting mechanism 55 is utilized to drive the second wire rack 251 and the plurality of second cutting wheels 253 and the second transition wheels 254 thereon to move away from the silicon rod conversion device 4 along the Y axis, so that two orthogonal second cutting lines in the second cutting unit 25 can move away from the silicon rod to be cut on the silicon rod conversion device 4, the cutting amount of the silicon rod to be cut can be reduced, or the silicon rod to be cut with a larger size can be cut.

In some embodiments, the first bobbin adjusting mechanism may include a first lead screw and a first motor, wherein the first lead screw is associated with the first bobbin, and the first bobbin is driven to move back and forth along the X-axis by the first motor driving the first lead screw to rotate forward and backward. For example, the first motor drives the first screw rod to rotate forwards, and drives the first bobbin to move towards the silicon rod conversion device along the X axis; the first motor drives the first screw rod to rotate reversely, and drives the first bobbin to move along the X axis away from the silicon rod conversion device.

Similarly, the second bobbin adjusting mechanism may include a second lead screw and a second motor, wherein the second lead screw is associated with the second bobbin, and the second bobbin is driven to move back and forth along the Y-axis by the second motor driving the second lead screw to rotate forward and backward. For example, the second motor drives the second screw rod to rotate forwards, and drives the second bobbin to move towards the silicon rod conversion device along the Y axis; and the second motor drives the second screw rod to rotate reversely, and drives the second wire rack to move along the Y axis away from the silicon rod conversion device.

As shown in fig. 4, the first bobbin adjusting mechanism 53 may include a first lead screw 531, a first synchronous belt 533, and a first motor 535, wherein the first lead screw 531 is associated with the first bobbin 231, the first lead screw 531 is associated with an output shaft of the first motor 535 through the first synchronous belt 533, and the first bobbin is driven to move back and forth along the X-axis by the first motor 535 driving the first lead screw 531 to rotate forward and backward. For example, the first motor 535 drives the first lead screw 531 to rotate forward, and drives the first bobbin 231 to move toward the silicon rod transferring device along the X-axis; the first motor 535 drives the first lead screw 531 in reverse, driving the first bobbin 231 to move along the X-axis away from the silicon rod transferring device. Similarly, the second carriage adjusting mechanism 55 may include a second lead screw 551, a second timing belt 553, and a second motor 555, wherein the second lead screw 551 is associated with the second carriage 251, the second lead screw 551 is associated with an output shaft of the second motor 555 through the second timing belt 553, and the second carriage is driven to move back and forth along the Y axis by the second motor 555 driving the second lead screw 551 to rotate forward and backward. For example, the second motor 555 drives the second lead screw 551 to rotate forward, and drives the second bobbin 251 to move along the Y axis toward the silicon rod transferring device; the second motor 555 drives the second lead screw 551 to rotate reversely, and drives the second creel 251 to move away from the silicon rod conversion device along the Y axis. In the embodiment shown in fig. 4, the lead screw and the motor in the wire frame adjusting mechanism are associated through the synchronous belt, so that the layout space of the mechanism on a straight line (such as an X axis or a Y axis) can be saved and the structure is more compact compared with the mode that the lead screw is directly connected with the motor.

In the embodiment shown in fig. 4, the first bobbin adjusting mechanism may further include a first guide 537 disposed on the first bobbin 231 to facilitate the smoothness of movement of the first bobbin 231 along the X-axis, and similarly, the second bobbin adjusting mechanism may further include a second guide 557 disposed on the second bobbin 251 to facilitate the smoothness of movement of the second bobbin 251 along the Y-axis.

Still other variations of the first and second carriage adjustment mechanisms are possible, for example, the first or second carriage adjustment mechanism may include: the device comprises a sliding rack, a rotating gear meshed with the sliding rack and a sliding driving motor associated with the rotating gear.

In some examples, the at least one cutting unit further comprises at least one transition wheel, each transition wheel having at least two wire grooves; when the plurality of cutting wheels in the at least one cutting unit are driven by the at least one distance adjusting mechanism to move along the second direction, at least one transition wheel in the at least one cutting unit and the plurality of cutting wheels are kept relatively static.

The first distance adjusting unit comprises a first bobbin adjusting mechanism, and the first bobbin adjusting mechanism is used for adjusting the positions of the first bobbin and a plurality of first cutting wheels and first transition wheels on the first bobbin; the second cutting unit includes: the second cutting wire is wound around the plurality of second cutting wheels and the plurality of second transition wheels to form two orthogonal second cutting wire saws; the second distance adjusting unit comprises a second wire frame adjusting mechanism, and the second wire frame adjusting mechanism is used for adjusting the positions of the second wire frame and a plurality of second cutting wheels and second transition wheels on the second wire frame.

In the first cutting unit or the second cutting unit, each first cutting wheel 233 has at least two cutting wire grooves, different cutting wire grooves are parallel to each other, and a cutting wire groove interval is provided between two adjacent cutting wire grooves. The distance between two different adjacent cutting wire slots is not limited, and may be the same (i.e., equal distance) or different. For example, first cutting wheel has 4 cutting wire casing, is 1# cutting wire casing, 2# cutting wire casing, 3# cutting wire casing, 4# cutting wire casing respectively, has 1# cutting wire casing interval between 1# cutting wire casing and the 2# cutting wire casing, has 2# cutting wire casing interval between 2# cutting wire casing and the 3# cutting wire casing, has 3# cutting wire casing interval between 3# cutting wire casing and the 4# cutting wire casing. In some cases, the 1# cutting wire slot pitch, the 2# cutting wire slot pitch, and the 3# cutting wire slot pitch are the same. In some cases, the 1# cutting wire slot pitch, the 2# cutting wire slot pitch, and the 3# cutting wire slot pitch are not exactly the same, e.g., two of the 1# cutting wire slot pitch, the 2# cutting wire slot pitch, and the 3# cutting wire slot pitch are the same and different, e.g., three of the 1# cutting wire slot pitch, the 2# cutting wire slot pitch, and the 3# cutting wire slot pitch are different.

Taking the first cutting unit as an example, when the first cutting line 213 is changed to a cutting line groove wound around the first cutting wheel 233, the position of the first cutting wheel on the first line stand can be adjusted by using the first line stand adjusting mechanism.

For example, as shown in fig. 7, assuming that the first cutting wire 235 is wound around the outermost one of the cutting wire slots of the first cutting wheel 233 at an initial time, when the first cutting wire 235 is to be changed around the cutting wire slot on the first cutting wheel 233, for example, the winding position of the first cutting wire 235 is to be changed from the outermost one of the cutting wire slots to the other one of the cutting wire slots, the moving distance of the first cutting wheel 233 along the X-axis is determined according to the distance between the outermost one of the cutting wire slots and the cutting wire slot of the target position, such that the first wire frame and the first cutting wheel and the first transition wheel thereon are driven by the first wire frame adjusting mechanism to move toward the silicon rod transfer device along the X-axis by a distance corresponding to the determined moving distance, and then the first cutting wire 235 is wound around the cutting wire slot of the target position, and after the winding is completed, the cutting space formed by the two orthogonal first cutting wires in the first cutting unit 23 is not changed, that is, the cutting amount is not changed, and thus, the groove changing of the first cutting line is realized. Of course, when the first frame, the first cutting wheel and the first transition wheel thereon are driven by the first frame adjusting mechanism to move towards the silicon rod conversion device along the X axis and the determined moving distance does not correspond, the first cutting wire 235 is wound around the cutting wire slot at the target position, and after the winding is completed, the cutting space formed by the two orthogonal first cutting wire saws in the first cutting unit 23 is changed, that is, the cutting amount is changed, so that both the cutting wire slot switching and the cutting amount adjustment are realized. In the above description, the reason for the first cutting wire to be replaced includes, but is not limited to, the wear of the original cutting wire groove due to long-term use to the extent that replacement is required. In addition, the distance of movement of the first cutting wheel 233 along the X-axis, which is determined based on the distance between the cutting line groove at the starting position and the cutting line groove at the target position, is determined in relation to the relationship between the respective cutting line grooves in the first cutting wheel and the X-axis. In the embodiment shown in fig. 6, the plane of the cutting line grooves in the first cutting wheel is at an angle of 45 ° to the X-axis, so that the relationship between the distance between the cutting line groove of the starting position and the cutting line groove of the target position in the first cutting wheel and the movement distance along the X-axis satisfies the pythagorean theorem, i.e. the ratio between the distance between two cutting line grooves and the movement distance along the X-axis is √ 2: 1.

in addition, in the first cutting unit, since the first transition wheel and the first cutting wheel are relatively stationary, when the position of the first cutting wheel on the first wire frame is adjusted by the first wire frame adjusting mechanism, the first transition wheel may be designed differently so that the first cutting wire saw after the first cutting wire is wound around the wire cutting groove of the first cutting wheel 233 whose position is changed and the portion of the first cutting wire wound around the first transition wheel are still in the same plane (the plane may be, for example, a vertical plane).

In some embodiments, the first transition wheel has at least two guide line slots, different guide line slots are parallel to each other, and a guide line slot interval is provided between two adjacent guide line slots. The distance between two different adjacent guide wire slots is not limited, and may be the same (i.e., equal distance) or different. For example, the first transition wheel has 4 guide wire grooves, which are respectively a 1# guide wire groove, a 2# guide wire groove, a 3# guide wire groove and a 4# guide wire groove, a 1# guide wire groove interval is arranged between the 1# guide wire groove and the 2# guide wire groove, a 2# guide wire groove interval is arranged between the 2# guide wire groove and the 3# guide wire groove, and a 3# guide wire groove interval is arranged between the 3# guide wire groove and the 4# guide wire groove. In some cases, the # 1 guide line groove pitch, the # 2 guide line groove pitch, and the # 3 guide line groove pitch are the same. In some cases, the # 1 guide line slot pitch, the # 2 guide line slot pitch, and the # 3 guide line slot pitch are not all the same, e.g., two of the # 1 guide line slot pitch, the # 2 guide line slot pitch, and the # 3 guide line slot pitch are the same and one is different, e.g., three of the # 1 guide line slot pitch, the # 2 guide line slot pitch, and the # 3 guide line slot pitch are different.

In some embodiments, the number of guide wire slots in the first transition wheel is the same as the number of cutting wire slots in the first cutting wheel, and the pitch of each guide wire slot in the first transition wheel is consistent with the pitch of each corresponding cutting wire slot in the first cutting wheel. For example, the first cutting wheel has 4 cutting wire slots, which are respectively a 1# cutting wire slot, a 2# cutting wire slot, a 3# cutting wire slot, and a 4# cutting wire slot, wherein a 1# cutting wire slot spacing exists between the 1# cutting wire slot and the 2# cutting wire slot, a 2# cutting wire slot spacing exists between the 2# cutting wire slot and the 3# cutting wire slot, and a 3# cutting wire slot spacing exists between the 3# cutting wire slot and the 4# cutting wire slot, and similarly, the first transition wheel has 4 guide wire slots, which are respectively a 1# guide wire slot, a 2# guide wire slot, a 3# guide wire slot, and a 4# guide wire slot, wherein a 1# guide wire slot spacing exists between the 1# guide wire slot and the 2# guide wire slot, a 2# guide wire slot spacing exists between the 2# guide wire slot and the 3# guide wire slot, and a 3# guide wire slot spacing exists between the 3# guide wire slot and the 4# guide wire slot, wherein, 1# cutting wire casing interval is the same with 1# guide wire casing interval, 2# cutting wire casing interval is the same with 2# guide wire casing interval, 3# cutting wire casing interval is the same with 3# guide wire casing interval, 4# cutting wire casing interval is the same with 4# guide wire casing interval, when configuration first cutting wheel and first transition wheel, only need to align 1# cutting wire casing in the first cutting wheel with 1# guide wire casing in the first transition wheel can ensure 2# cutting wire casing and 2# guide wire casing, 3# cutting wire casing and 3# guide wire casing, 4# cutting wire casing and 4# guide wire casing all align.

In this implementation, when the position of the first cutting wheel on the first wire frame is adjusted by the first wire frame adjusting mechanism, the first transition wheel on the first wire frame is also adjusted synchronously with the first cutting wheel, when the first cutting wire is changed to be wound around the cutting wire slot on the first cutting wheel, the first cutting wire is also changed to be wound around the guide wire slot on the first transition wheel, and it can still be ensured that the first cutting wire saw after the first cutting wire is wound around the cutting wire slot on the first cutting wheel and the part of the first cutting wire after the first cutting wire is wound around the transition wire slot on the first transition wheel are still in the same vertical plane.

In some embodiments, although the first transition wheel has at least two guiding slots therein, the first transition wheel cannot be ensured to be relatively stationary with respect to the first cutting wheel when adjusted by the first wire frame adjusting mechanism alone due to one or more of, for example, the number of guiding slots in the first transition wheel is not the same as the number of cutting slots in the first cutting wheel, or the guiding slot pitch between each guiding slot in the first transition wheel is not the same as the cutting slot pitch between each cutting slot in the first cutting wheel, or the first cutting wheel and the first transition wheel are configured and mounted such that the guiding slots in the first transition wheel are not completely aligned with the cutting slots in the first cutting wheel.

In some embodiments, the first transition wheel only has one guiding line groove, and the relative rest of the first transition wheel and the first cutting wheel cannot be ensured when the first transition wheel is adjusted by the first line frame adjusting mechanism. In addition, the wire chase may have an alternate wire chase bushing that can be replaced with a new one after wear from long-term use.

As can be seen from the above, in some situations, when the adjustment is performed by the first wire frame adjusting mechanism, the first transition wheel and the first cutting wheel cannot be kept stationary. In view of the above, in some embodiments, the first distance adjusting unit further includes a first calibrating mechanism in addition to the first bobbin adjusting mechanism, and the first calibrating mechanism is configured to drive the first transition wheel to move relative to the first cutting wheel, so that a current wire groove wound by the first cutting wire in the first transition wheel is adjusted from a first cutting wire groove corresponding to the first cutting wheel to a second cutting wire groove corresponding to the first cutting wheel.

In some embodiments, the first alignment mechanism includes two racks engaged with each other, the two racks are respectively disposed on the first cutting wheel and the first transition wheel, and the relative movement of the first transition wheel and the first cutting wheel can be driven by the mutual movement of the two racks. For example, in the embodiment shown in fig. 6 and 7, the first alignment mechanism 83 includes a first rack 831 and a second rack 833 engaged with each other, wherein the first rack 831 is associated with the first cutting wheel 233, the second rack 833 is associated with the first transition wheel 234, the first rack 831 is associated with the first cutting wheel 233, for example, the first rack 831 may be disposed on the first wire frame 231, and the second rack 833 is associated with the first transition wheel 234, for example, the second rack 833 may be disposed on the bracket 2344 for mounting the first transition wheel.

The first rack can also be provided with a cutting wire groove mark corresponding to the cutting wire groove in the first cutting wheel, and correspondingly, the second rack can also be provided with a guide wire groove mark corresponding to the guide wire groove in the first transition wheel. In the embodiment shown in fig. 5, it is assumed that the first cutting wheel 233 has a plurality of cutting line slots, for example, 1 or more, and for example, 8 cutting line slots, the first rack 831 is provided with cutting line slot identifiers corresponding to the positions of the cutting line slots in the first cutting wheel 233, for example, the identifiers "1, 2, 3, 4, 5, 6, 7, and 8", wherein the identifier "1" corresponds to the 1# cutting line slot, the identifier "2" corresponds to the 2# cutting line slot, … …, the identifier "7" corresponds to the 7# cutting line slot, and the identifier "8" corresponds to the 8# cutting line slot. Assuming that the first transition wheel 234 has a plurality of cutting line grooves, for example, 1 or more, and taking 1 as an example, the second rack 833 is provided with a guide line groove mark corresponding to the position of the guide line groove in the first transition wheel, for example, a mark "0". When the wire groove mark on the second rack 833 corresponds to the cutting wire groove mark on the first rack 831, it indicates that a certain wire groove on the first transition wheel 234 corresponding to the wire groove mark is aligned with a certain cutting wire groove on the first cutting wheel 233 corresponding to the cutting wire groove mark, for example, the wire groove mark "0" on the second rack 833 is aligned with the cutting wire groove mark "5" on the first rack 831, which indicates that the wire groove on the first transition wheel 234 is aligned with the fifth cutting wire groove on the first cutting wheel 233. Assuming that the wire guide groove of the first transition wheel 234 is aligned with the fifth cutting wire groove of the first cutting wheel 233, the bracket 2344 on which the first transition wheel 234 is located is driven to move relative to the first rack 231, at this time, the second rack 833 on the bracket 2344 and the first rack 831 on the first rack 231 also move relatively until the guide wire groove mark "0" on the second rack 833 is aligned with the cutting wire groove mark "5" on the first rack 831, the guide wire groove mark "0" on the bracket 2344 is aligned with the cutting wire groove mark "5" on the first rack 831, and then the movement of the bracket 2344 is stopped, at this time, the wire guide groove on the first transition wheel 234 is aligned with the fifth cutting wire groove on the first cutting wheel 233, and the calibration operation is completed. The support 2344 on which the first transition wheel 234 is located can be driven by a corresponding driving mechanism, and can also be manually operated by an operator, for example, the driving mechanism can be configured on the support 2344 on which the first transition wheel 234 is located, and is used for driving the support 2344 to move relative to the first line frame.

Then, the first cutting wire is wound around the cutting wire groove of the first cutting wheel 233 after the position change and the guide groove of the first transition wheel 234, so that the first cutting wire wound around the cutting wire groove of the first cutting wheel 233 after the position change and the portion of the first cutting wire wound around the first transition wheel are still in the same plane (the plane may be a vertical plane, for example).

As can be seen from the above, the first wire frame 231 and the plurality of first cutting wheels 233 and the first transition wheel 234 thereon are driven by the first wire frame adjusting mechanism in the first distance adjusting unit to move along the X axis toward or away from the silicon rod conversion device 4, so that the two orthogonal first cutting lines in the first cutting unit 23 can move toward or away from the silicon rod to be cut on the silicon rod conversion device 4, and the cutting amount of the silicon rod to be cut or the silicon rods to be cut suitable for different sizes can be adjusted; additionally, the relative movement of the first transition wheel 234 and the first cutting wheel 233 is driven by the first calibration mechanism in the first distance adjustment unit, so that the current wire groove wound by the first cutting wire in the first transition wheel is adjusted from the first cutting wire groove corresponding to the first cutting wheel to the second cutting wire groove corresponding to the first cutting wheel, ensuring the relative rest of the first transition wheel and the first cutting wheel.

With respect to the second pitch unit associated with the second cutting unit, in some embodiments, the second pitch unit may include a second carriage adjustment mechanism, and in some embodiments, as shown in fig. 3, the second pitch unit may include a second carriage adjustment mechanism 55 and a second calibration mechanism 85. For the application of the second bobbin adjusting mechanism, or the second bobbin adjusting mechanism and the second calibrating mechanism and the working principle thereof, reference may be made to the description of the first bobbin adjusting mechanism, or the first bobbin adjusting mechanism and the first calibrating mechanism, which is not repeated herein.

In the embodiment, as can be seen from the above, the silicon rod may form a boundary skin after being cut by the cutting device, and in order not to hinder the rising of the wire cutting device, the boundary skin needs to be timely unloaded, and for the unloading of the boundary skin, in most of the common boundary skin unloading methods, the boundary skin is still manually separated from the cut silicon rod by an operator and is removed from the silicon rod cutting device, which is not only inefficient, but also increases the risk of damage to the cut silicon rod due to collision between the boundary skin and the cut silicon rod during the transportation process. In view of the above, the silicon rod cutting and grinding all-in-one machine further includes a flaw-piece discharging device, where the flaw-piece discharging device is configured to discharge a flaw-piece formed by performing squaring and cutting on a silicon rod by a wire cutting device, that is, in this embodiment, the first cutting unit further includes a first flaw-piece discharging device, and the first flaw-piece discharging device is configured to discharge a flaw-piece formed by performing first folding and cutting on the silicon rod by the first cutting unit; the second cutting unit further comprises a second flaw-piece discharging device, and the second flaw-piece discharging device is used for discharging flaw-pieces formed after the second cutting unit performs second flanging cutting on the silicon rods.

As shown in fig. 1 and 2, the silicon rod-cutting integrated machine of the present application further includes a first flaw-piece discharging device 73 corresponding to the first cutting unit 23, and a second flaw-piece discharging device 75 corresponding to the second cutting unit 25.

Referring to fig. 8 and 9, fig. 8 shows a schematic view of a first state of a first flaw-piece discharging device and a second flaw-piece discharging device in the silicon rod cutting machine of the present application, and fig. 9 shows a schematic view of a second state of the first flaw-piece discharging device and the second flaw-piece discharging device in the silicon rod cutting machine of the present application.

Since the first and second flaw-piece discharging devices have the same structure, only the first flaw-piece discharging device will be described as an example.

Generally, the first flaw-piece discharging device may include a flaw-piece lifting unit for lifting the flaw-piece so that a tip of the flaw-piece protrudes out of the cut silicon rod, and a flaw-piece clamping transfer unit for clamping the flaw-piece and transferring the flaw-piece.

The flaw-piece lifting unit comprises a jacking piece. As shown in fig. 8 and 9, the flaw-piece lifting unit of the first flaw-piece discharging device 73 includes a lifting member 7311 (the flaw-piece lifting unit of the first flaw-piece discharging device 75 includes a lifting member 7511), the lifting member 7311 is disposed on the first wire rack 231 of the first cutting unit, the lifting member 7311 can be driven by a telescopic member to move telescopically, and the lifting member 7311 is controlled to move telescopically and then supports the bottom of the flaw-piece to lift the flaw-piece.

In some embodiments, the jacking member includes an abutting plate and a supporting plate, the abutting plate extends upwards from the bottom of the supporting plate, further, the abutting plate may be an arc-shaped plate adapted to the arc-shaped surface of the flaw-piece, when the abutting plate abuts against the flaw-piece, the abutting plate can fully contact with the arc-shaped surface of the flaw-piece, the contact portion of the abutting plate and the flaw-piece is smooth, or a cushion pad is added to the inner surface of the abutting plate, which is in contact with the flaw-piece. The supporting plate is used for supporting the bottom of the side leather, and further the supporting plate can be an arched plate matched with the bottom surface of the side leather. In other embodiments, the chord edge of the arched plate as the bearing plate can be additionally provided with a convex block so as to increase the contact area with the bottom surface of the side skin.

In some embodiments, the telescopic member may be, for example, an air cylinder with a telescopic rod, wherein the telescopic rod may be connected to the support plate in the jacking member through a connecting structure, and the air cylinder may drive the telescopic rod to drive the jacking member to perform telescopic motion. Here, jacking piece does concertina movement include jacking piece's shrink motion with jacking piece's extension motion, wherein, jacking piece's shrink motion specifically indicates the cylinder drive the telescopic link shrink is in order to drive jacking piece is kept away from the boundary leather, jacking piece's extension motion specifically indicates the cylinder drive the telescopic link extends in order to drive jacking piece is close to the boundary leather. Of course, the aforementioned telescopic component may also adopt other implementation manners, for example, the telescopic component may also be, for example, a servo motor with a lead screw, the lead screw is connected to the jacking member, and the lead screw is driven by the servo motor to rotate so as to drive the jacking member to make telescopic motion, for example, the lead screw is driven to rotate forward to drive the jacking member to make contraction motion and drive the lead screw rotates reversely to drive the jacking member to make extension motion, or the lead screw is driven to rotate forward to drive the jacking member to make extension motion and drive the lead screw rotates reversely to drive the jacking member to make contraction motion. As to the specific structure of the first pelt discharging device and its implementation, reference can be made to patent publications such as CN 208148230U.

In practical application, in an initial state, the telescopic rod drives the jacking part to be in a contraction state, the first cutting unit is driven to descend along with the cutting support so that the first cutting line section in the first cutting unit performs first folding cutting on the silicon rod located on the first processing position until the first cutting line section penetrates through the silicon rod, the first folding cutting on the silicon rod is completed and a flaw-piece is formed, at the moment, the flaw-piece lifting unit descends to the bottom along with the first bobbin, the cylinder drives the telescopic rod to extend so as to drive the jacking part to be close to the flaw-piece until a butting plate in the jacking part is in contact with the flaw-piece and butting is abutted against the flaw-piece, subsequently, the first cutting unit is driven to ascend along with the cutting support, the flaw-piece lifting unit ascends along with the cutting support to drive the flaw-piece to generate ascending displacement relative to the silicon rod which is subjected to one-time cutting, so that the top end of the flaw-piece protrudes out of the silicon rod, when the top end of the flaw-piece meets the set conditions compared with the projecting part of the silicon rod, the cutting support can be controlled to stop rising, so that the top end of the flaw-piece can be used as a force application part for grabbing, the flaw-piece is grabbed and unloaded, then the air cylinder drives the telescopic rod to contract to drive the jacking piece to return to the initial state, and simultaneously the cutting support is controlled to drive the first cutting unit and the flaw-piece lifting unit to continuously rise above the silicon rod for executing next cutting operation.

In other embodiments, the flaw-piece lifting unit may include an adsorption member and a telescopic member for driving the adsorption member to perform telescopic movement, and the adsorption member is controlled by the telescopic member to abut against the flaw-piece and adsorb the flaw-piece. The adsorption piece further comprises an abutting plate and an adsorption element. The abutting plate can be an arc-shaped plate matched with the arc-shaped surface of the edge leather, and can be fully contacted with the arc-shaped surface of the edge leather when the abutting plate abuts against the edge leather. The suction element may be, for example, a vacuum cup, and a plurality of vacuum cups may be arranged on a contact surface of the abutment plate to be in contact with the flaw-piece. The telescopic component can be, for example, an air cylinder with a telescopic rod or a servo motor with a screw rod, taking the air cylinder with a telescopic rod as an example, the telescopic rod can be connected with the abutting plate in the jacking piece through a connecting structure, the air cylinder can drive the telescopic rod to contract so as to drive the abutting plate to be far away from the edge leather, and the air cylinder can drive the telescopic rod to extend so as to drive the abutting plate to be close to the edge leather and be adsorbed by the adsorption element after the abutting plate is contacted with the edge leather. Subsequently, the cutting support is driven to rise, the flaw-piece lifting unit and the first cutting unit rise along with the cutting support, and the flaw-piece lifting unit can drive the flaw-piece to move upwards relative to the silicon rod by utilizing the adsorption force, so that the top end of the flaw-piece protrudes out of the silicon rod.

In certain embodiments, the first skin discharge device may further comprise a wire pulling mechanism for pulling the corresponding first or second cutting wire saw to expand outward to avoid interference of the first or second cutting wire saw with the cut silicon rod. For example, the wire-setting mechanism may include: the wire poking device comprises a wire poking piece and a wire poking driving source for driving the wire poking piece to move horizontally, or the wire poking piece and a rotating motor for driving the wire poking piece to swing along an arc line path through a transmission piece. As for a specific structure of the thread take-up mechanism and its implementation, for example, patent publication CN109129947A and the like can be referred to.

In addition, the flaw-piece discharging device also comprises a flaw-piece clamping and transferring unit which is arranged above the base and used for clamping the top end of the flaw-piece and lifting the flaw-piece to separate the silicon rod.

In certain embodiments, the flaw-piece gripping transfer unit comprises: the clamping mechanism is used for clamping or releasing the top end of the side skin; and the lifting driving mechanism is used for driving the clamping mechanism to move up and down so that the clamping mechanism can separate the clamped flaw-piece from the cut silicon rod.

The lifting driving mechanism drives the clamping mechanism to move up and down, so that the clamping mechanism separates the clamped flaw-piece from the cut silicon rod. The lifting mechanism can comprise a lifting guide structure and a lifting driving source, and the lifting guide structure can be arranged along the vertical direction; the lifting driving source is associated with the clamping mechanism and used for driving the clamping mechanism to do lifting motion along the lifting guide structure.

As shown in fig. 8 and 9, the lifting mechanism 735 of the first pelt discharging device includes a lifting guide structure 7351 and a lifting driving source 7353, wherein the lifting guide structure 7351 can be, for example, a vertically arranged lifting guide rod, the number of which can be one or more, the lifting driving source 7353 can be, for example, a servo motor with a timing belt 7355, and in practical applications, the movable base structure 7330 (for example, a movable block or a movable plate) which is in linkage with the clamping mechanism is movably arranged on the lifting guide rod 7351 and is in linkage with the servo motor 7353 through the timing belt 7355. The servo motor is used for driving the movable base structure 7330 and the associated clamping mechanism to move up and down along the setting direction of the lifting guide rod 7351 through the synchronous belt 7355 in forward rotation or reverse rotation. With respect to the second flaw-piece discharging device, the lifting mechanism 755 in the second flaw-piece discharging device includes a lifting guide 7551 and a lifting driving source 7553, wherein the lifting guide 7551 may be, for example, a vertically arranged lifting guide rod, the number of which may be one or more, and the lifting driving source 7553 may be, for example, a servo motor with a timing belt 7555.

The lifting guide structure and the lifting driving source in the lifting driving mechanism can still have other changes, for example, in other embodiments, in the lifting driving mechanism, the lifting guide structure can be, for example, a lifting rod, the lifting driving source can be, for example, a lifting cylinder, the lifting rod is connected with the clamping mechanism, and the lifting cylinder can be used for controlling the lifting rod to stretch and retract so as to drive the clamping mechanism to move up and down. In another embodiment, in the lifting driving mechanism, the lifting guide structure may be a lifting guide rod or a lifting guide rail, the lifting driving source may be a servo motor with a screw assembly, the screw assembly is connected with the clamping mechanism (for example, the screw assembly is connected with a movable base structure, and the movable base structure is connected with the clamping mechanism), and the screw assembly is driven to lift by the motor to drive the clamping mechanism to move up and down.

The clamping mechanism can comprise a cover body and a clamping assembly arranged in the cover body. As shown in fig. 10 and 11, still taking the first apron discharging device as an example, the clamping mechanism 733 may include a cover 7331 and a clamping component, where the clamping component is disposed inside the cover; the clamping assembly and the cover body form a clamping space for clamping the edge leather.

In some embodiments, the clamping assembly may include a retractable clamping member disposed inside the cover body, and a clamping space for clamping the flaw-piece is formed between the clamping member and the cover body. In an embodiment, the cover body 7331 is used for covering the edge skin, and the size of the cover body that can be covered is slightly larger than the cross-sectional circle of the silicon rod to be cut. In this embodiment, the first cutting unit 23 includes two orthogonal first cutting wire saws, the second cutting unit 25 includes two orthogonal second cutting wire saws, two edges at 90 ° can be formed after the silicon rod is cut by the first cutting unit 23, two edges at 90 ° can be formed after the silicon rod is cut by the second cutting unit 25, therefore, the cover 7331 includes an arc plate with a semicircular cross section, the clamping assembly includes two orthogonal clamping members 7333, and the two orthogonal clamping members 7333 correspond to the two orthogonal side surfaces. The clamping member 7333 is controlled by a driving source 7335, and the driving source 7335 can drive the clamping member 7333 to move, so that the clamping member 7333 moves closer to or away from the cover body 7331. In some embodiments, the clamping member 7333 may be a movable pressing block or a swing arm, and the driving source 7335 may be an air cylinder, and the movable pressing block or the swing arm is directly connected to an output shaft of the air cylinder or connected to an output shaft of the air cylinder through a connecting rod assembly, and the air cylinder may drive the movable pressing block or the swing arm to actuate. For example, in one case, a movable pressing piece or a swing arm as the clamping member 7333 is driven by an air cylinder as the driving source 7335 to swing toward the cover 7331, and the flaw-piece 101 located therebetween is clamped by the clamping member 7333 and the cover 7331 (see fig. 10 and 11, which show schematic diagrams of the clamping assembly and the cover cooperating to clamp the flaw-piece). In one case, a cylinder as a driving source 7335 drives a movable pressing piece or a swing arm as a clamping member 7333 to swing back to the cover body 7331, thereby increasing a clamping space between the clamping member 7333 and the cover body 7331 and releasing the original clamped hemmer 101.

The structure of the clamping assembly is not limited to this, and in other embodiments, the clamping assembly includes an arc-shaped plate and a retractable clamping member, and a clamping space for clamping the flaw-piece is formed between the clamping member and the arc-shaped plate.

The flaw-piece clamping and transferring unit can further comprise a transferring mechanism moving along at least one direction. The transfer mechanism may include: the guide structure sets up along at least one direction and transports the driving source. In some embodiments, as shown in FIGS. 8 and 9, the guide structure may be oriented in a direction such that guide structure 7371 of the first flaw-piece discharge apparatus 73 is oriented along the X-axis and guide structure 7571 of the second flaw-piece discharge apparatus 75 is oriented along the Y-axis (as shown in FIG. 2). In the embodiment shown in fig. 8 and 9, the guide structure 7371 may be, for example, a rack structure, the driving source 7373 is a servo motor with a driving gear 7375, wherein the driving gear 7375 is connected to an output shaft of the servo motor 7373, the driving gear 7375 is engaged with the rack structure 7371, and the driving gear 7375 is driven by the servo motor 7373 to rotate forward or backward to move the clamping assembly and the frame leather clamped by the clamping assembly along the installation direction of the rack structure 7371.

The guide structure and the rotary drive source in the transfer mechanism may still be varied in other ways, for example in other embodiments the guide structure may also be a slide rail structure, for example, and the transfer drive source may be a servomotor with a transfer screw. The servo motor is used for driving the transfer screw rod to rotate forwards or reversely so as to drive the clamping assembly and the flaw-piece clamped by the clamping assembly to move along the arrangement direction of the slide rail structure.

When the first cutting unit is used to discharge the edge skin formed by performing the first folding cutting on the silicon rod by using the first edge skin discharging device, the lifting member 7311 is driven to perform an extending motion and then supports the bottom of the edge skin to lift the edge skin 101, so that the top of the edge skin 101 is lifted and then protrudes out of the silicon rod 100 (or the silicon rod 200), as shown in fig. 8; then, the clamping mechanism 733 is controlled to move to the flaw-piece and is driven to clamp the convex flaw-piece 101, and the lifting driving mechanism drives the clamping mechanism 733 and the flaw-piece 101 clamped by the clamping mechanism to ascend until the flaw-piece 101 is separated from the silicon rod 100 (or the silicon rod 200), wherein the separation of the flaw-piece 101 from the silicon rod 100 (or the silicon rod 200) means that the bottom end of the flaw-piece 101 is higher than the top end of the silicon rod 100 (or the silicon rod 200), as shown in fig. 9; and then, the transfer mechanism is used for driving the clamping mechanism 733 and the flaw-piece 101 clamped by the clamping mechanism to move along a preset guide structure so as to transfer the flaw-piece to a flaw-piece unloading area, and the flaw-piece 101 is unloaded in the flaw-piece unloading area. The whole process is convenient to operate, the flaw-piece unloading efficiency is improved, and the silicon rod cannot be damaged.

In the silicon rod slicing and grinding all-in-one machine shown in fig. 1 and 2, the cutting device 2 includes: a cutting frame 21, a cutting support 22, a first cutting unit 23, and a second cutting unit 25. However, the invention is not limited thereto, and in other embodiments, other variations of the cutting device of the silicon rod cutting and grinding integrated machine can be made.

In certain embodiments, the cutting device may comprise a first cutting device provided at the first cutting location of the silicon rod processing platform and a second cutting device provided at the second cutting location of the silicon rod processing platform, wherein the first cutting device and the second cutting device are two separate devices.

The first cutting device includes: the cutting device comprises a first cutting frame, a first cutting support and a first cutting unit.

The first cutting frame is arranged on the machine base. The first cutting frame is of a columnar structure or a frame structure and serves as a supporting body of the first cutting device, and the first cutting frame can provide support for other components in the first cutting device.

The first cutting support is movably lifted on the first cutting frame. In some embodiments, the first cutting support is movably elevated from the first cutting frame by an elevating mechanism. The lifting mechanism can be including the mechanism that can realize that first cutting support carries out vertical removal by elevator motor, riser guide and elevator slide block etc. wherein, riser guide vertically sets up on first cutting frame, elevator slide block sets up in the back of first cutting support and cooperatees with riser guide, for making first cutting support can realize stablizing the mounting structure who goes up and down in the frame, can adopt the design of two guide rails, namely, adopt two riser guide, these two riser guide set up in parallel. The first cutting support can be driven by the lifting motor (the lifting motor can be a servo motor for example) to perform lifting motion relative to the first cutting frame and the base by virtue of the lifting guide rail and the lifting slide block.

The first cutting unit may comprise at least four first cutting wheels, and the four first cutting wheels may be combined into two orthogonal first cutting wheel sets, that is, one first cutting wheel set is formed by arranging two first cutting wheels along the M axis, and one pair of first cutting wheel sets is formed by two first cutting wheel sets along the N axis, wherein the M axis is orthogonal to the N axis. In particular, the first cutting unit comprises two orthogonal sets of first cutting wheels, wherein one set of first cutting wheels comprises two first cutting wheels arranged back and forth (along the M axis) and the other set of first cutting wheels comprises two first cutting wheels arranged back and forth (along the N axis).

The first cutting lines are sequentially wound around each first cutting wheel in the first cutting unit to form a first cutting line net. In practical applications, the first cutting wire is sequentially wound around the four first cutting wheels in the first cutting unit to form two mutually orthogonal first cutting wire saws, so as to form a first cutting wire net. Specifically, the first cutting wire is wound around two first cutting wheels arranged in front and back (along the M axis) of one first cutting wheel set to form one first cutting wire saw, and the first cutting wire is wound around two first cutting wheels arranged in front and back (along the N axis) of the other first cutting wheel set to form the other second cutting wire saw. Thus, the two mutually orthogonal first cutting wire saws are matched to form a first cutting wire net in a shape of a reversed L.

Of course, in some embodiments, the position, orientation, number, etc. of the first cutting wheel and the first cutting wire in the first cutting unit may be varied.

The second cutting device includes: the second cutting frame, the second cutting support and the second cutting unit.

The second cutting frame is arranged on the machine base. The second cutting frame is a columnar structure or a frame structure and serves as a supporting main body of the second cutting device, and the second cutting frame can provide support for other components in the second cutting device.

The second cutting support is movably lifted on the second cutting frame. In some embodiments, the second cutting support may be movably elevated with respect to the second cutting frame by an elevating mechanism. The lifting mechanism can be including the mechanism that can realize that the second cutting support carries out vertical removal by elevator motor, riser guide and elevator slide block etc. wherein, riser guide vertically sets up on the second cutting frame, elevator slide block sets up in the back of second cutting support and cooperatees with riser guide, for making the second cutting support can realize stablizing the mounting structure who goes up and down in the frame, can adopt two guide rail designs, promptly, adopts two riser guide, and these two riser guide set up in parallel. The second cutting support can be driven by the lifting motor (the lifting motor can be a servo motor for example) to perform lifting motion relative to the first cutting frame and the machine base by virtue of the lifting guide rail and the lifting slide block.

The second cutting unit may comprise at least four second cutting wheels, and the four second cutting wheels may be combined into two orthogonal second cutting wheel sets, that is, one second cutting wheel set is formed by two second cutting wheels oppositely arranged along the M axis, and one pair of second cutting wheel sets is formed by two second cutting wheel sets along the N axis, wherein the M axis is orthogonal to the N axis. Specifically, the second cutting unit comprises two orthogonal second cutting wheel sets, wherein one first cutting wheel set comprises two first cutting wheels arranged in front and back (along the M axis) and the other first cutting wheel set comprises two first cutting wheels arranged in front and back (along the N axis).

The second cutting lines are sequentially wound around each second cutting wheel in the second cutting units to form a second cutting line net. In practical applications, the second cutting line sequentially winds around the four second cutting wheels in the second cutting unit to form two second cutting wire saws orthogonal to each other, so as to form a second cutting wire web. Specifically, the second cutting line is wound around two second cutting wheels 253 arranged in front and back (along the M axis) of one second cutting wheel set to form one second cutting wire saw, and the second cutting line is wound around two second cutting wheels arranged in front and back (along the N axis) of the other second cutting wheel set to form the other second cutting wire saw. Thus, the two mutually orthogonal second cutting wires cooperate to form a second cutting wire web in the shape of a "Γ".

Of course, in some embodiments, the position, direction, number, etc. of the second cutting wheel and the second cutting wire saw in the second cutting unit can be varied.

The grinding device 3 is arranged on the base 1 and is used for grinding the square silicon rod which is subjected to the cutting and squaring in the grinding position of the silicon rod processing platform. In this embodiment, the polishing operation includes polishing and chamfering.

The grinding device 3 has a receiving space for receiving a silicon rod which has been subjected to an open cut and is transferred from the second cutting zone to the grinding zone by means of the silicon rod transfer device 4. The grinding device 3 mainly comprises a grinding support 31 and at least one pair of grinding tools 33, wherein the at least one pair of grinding tools 33 is oppositely arranged on the grinding support 31 and is used for grinding the silicon rod which is positioned at the grinding position and has finished the cutting.

In the present embodiment, the silicon rod after the cutting is square in cross section (the silicon rod is a rectangular-like body as a whole), and has four vertical cutting surfaces and four connecting edge surfaces, so that the grinding tools 33 are at least one pair disposed opposite to each other, and a receiving space for receiving the silicon rod 200 is left therebetween, and after the silicon rod 200 is transferred to the grinding section and is located in the receiving space between the at least one pair of grinding tools 33, the at least one pair of grinding tools 33 can contact the pair of vertical cutting surfaces or the pair of connecting edge surfaces opposite to each other in the silicon rod 200, and then the silicon rod is ground by moving up and down.

Wherein, the grinding support is movably arranged on the machine base. In this embodiment, the grinding holder 31 can be slidably disposed on the machine base 1 by a first sliding mechanism. The sliding mechanism can realize sliding in at least one direction. For example, the first sliding mechanism may allow the grinding carriage 31 to slide in a first direction (e.g., along the X-axis as shown in fig. 2). Specifically, the first sliding mechanism may include a first direction slide rail, a first direction slider or slide corresponding to the first direction slide rail, and a first direction driving source. The first direction driving source may be, for example, a driving motor.

The grinding tool 33 can be slidably disposed on the grinding support 31 by a second sliding mechanism.

In certain embodiments, at least one pair of abrasive tools 33 in the abrading device 3 are independently provided. Taking a pair of grinding tools 33 as an example, the two grinding tools 33 are respectively slidably disposed on the grinding support 31 through respective second sliding mechanisms, wherein the second sliding mechanisms can realize sliding movement in at least two directions. Specifically, the second sliding mechanism may include a first direction sliding unit and a second direction sliding unit, wherein the first direction sliding unit is a lifting sliding unit, and includes a lifting guide rail disposed on the grinding support 31, a lifting slider or a sliding bar disposed on a movable mounting rack, and a lifting driving source. The elevating driving source may be, for example, a driving motor. The second direction sliding unit includes a second direction guide rail (the second direction is the Y-axis direction shown in fig. 2) disposed on the movable mounting frame, a second direction slider or slider disposed on the grinding tool 33, and a second direction driving source. The second direction driving source may be, for example, a driving motor.

In certain embodiments, at least one pair of abrasive tools 33 in the abrading device 3 are provided in combination. Taking a pair of grinding tools 33 as an example, the two grinding tools 33 are slidably disposed on the grinding support 31 through a second sliding mechanism, wherein the second sliding mechanism can realize sliding movement in at least two directions. Specifically, the second sliding mechanism may include a first direction sliding unit and a second direction sliding unit, wherein the first direction sliding unit is a lifting sliding unit, and includes a lifting guide rail disposed on the grinding support 31, a lifting slider or a sliding bar disposed on a common movable mounting rack, and a lifting driving source. The elevating driving source may be, for example, a driving motor. The two grinding tools 33 are slidably disposed on the common movable mounting frame through a second direction sliding unit, which includes a second direction guide rail (the second direction is the Y-axis direction shown in fig. 2) disposed on the common movable mounting frame, a second direction slider or slider disposed on the grinding tool 33, and a second direction driving source. The second direction driving source may be, for example, a driving motor.

In the present embodiment, the grinding support 31 may be slidably disposed on the machine base 1 through a first sliding mechanism, so as to enable the grinding support 31 to move forward and backward, i.e. to approach or move away from the silicon rod. The grinding tool 33 can be slidably disposed on the grinding support 31 through a second sliding mechanism, the second sliding mechanism can include a first direction sliding unit and a second direction sliding unit, so that the grinding tool 33 can be slidably disposed on the grinding support 31 through the first direction sliding unit to realize the lifting of the grinding tool 33, the grinding tool 33 can also be slidably disposed on the grinding support 31 through the second direction sliding unit to realize the advancing and retreating of the grinding tool 33, that is, the grinding tool is close to or far away from the silicon rod to control the grinding amount of the silicon rod.

In certain embodiments, the abrasive article may include a spindle and at least one grinding wheel, wherein the at least one grinding wheel is disposed at a working end of the spindle.

In certain embodiments, each of the abrasive articles in the abrading apparatus is a dual head structure. Specifically, each abrasive article comprises: a rotary chassis; the double-head main shaft is arranged on the rotary chassis, a first end of the double-head main shaft is provided with a coarse grinding wheel, and a second end of the double-head main shaft is provided with a fine grinding wheel; and the driving motor is used for driving the rotary chassis to rotate so as to enable the position of the rough grinding wheel and the position of the fine grinding wheel in the double-head spindle to be changed. In practical application, during grinding, the rough grinding wheel of the double-head main shaft in at least one pair of grinding tools in the grinding device is used for performing rough grinding operation on the silicon rod which is subjected to the cutting, then the rotary chassis is driven to rotate so as to enable the rough grinding wheel and the finish grinding wheel in the double-head main shaft to exchange positions, and the finish grinding wheel of the double-head main shaft in at least one pair of grinding tools in the grinding device is used for performing finish grinding operation on the silicon rod which is subjected to the cutting. Wherein, the corase grind operation can include that the vertical tangent plane to the silicon rod that has accomplished the evolution cutting carries out the rough grinding face and connect the facet to carry out thick chamfer, the finish grind operation can include that the vertical tangent plane to the silicon rod that has accomplished the evolution cutting carries out the finish grinding face and connect the facet to carry out the finish chamfer.

In certain embodiments, each of the abrasive articles in the abrading device is a double-ended structure. Specifically, each abrasive article comprises: a rotating chassis; the double-head main shaft is arranged on the rotary chassis, a first end of the double-head main shaft is provided with a coarse grinding wheel, and a second end of the double-head main shaft is provided with a fine grinding wheel; and the driving motor is used for driving the rotary chassis to rotate so as to enable the position of the rough grinding wheel and the position of the fine grinding wheel in the double-head spindle to be changed. In practical application, during grinding, the rough grinding wheel of the double-head main shaft in at least one pair of grinding tools in the grinding device is used for performing rough grinding operation on the silicon rod which is subjected to the cutting, then the rotary chassis is driven to rotate so as to enable the rough grinding wheel and the finish grinding wheel in the double-head main shaft to exchange positions, and the finish grinding wheel of the double-head main shaft in at least one pair of grinding tools in the grinding device is used for performing finish grinding operation on the silicon rod which is subjected to the cutting. Wherein, the corase grind operation can include that the vertical tangent plane to the silicon rod that has accomplished the evolution cutting carries out the rough grinding face and connect the facet to carry out thick chamfer, the finish grind operation can include that the vertical tangent plane to the silicon rod that has accomplished the evolution cutting carries out the finish grinding face and connect the facet to carry out the finish chamfer.

In certain embodiments, each grinding tool in the grinding apparatus comprises a rough grinding wheel and a finish grinding wheel nested within one another. For example, the rough grinding wheel is nested within the finish grinding wheel, or the finish grinding wheel is nested within the rough grinding wheel.

For example, the grinding tool includes a tool seat, and a rough grinding wheel and a finish grinding wheel both disposed on the tool seat, wherein the rough grinding wheel is nested inside the finish grinding wheel, the finish grinding wheel is larger than the rough grinding wheel, the finish grinding wheel is circular and hollow in the middle (i.e., circular ring structure), the rough grinding wheel can be circular structure or the rough grinding wheel can be circular and hollow in the middle (i.e., circular ring structure). The abrasive grain size of the finish grinding wheel is smaller than that of the rough grinding wheel, and the abrasive grain density of the finish grinding wheel is larger than that of the rough grinding wheel.

When the grinding tool comprises a rough grinding wheel and a finish grinding wheel, the silicon rod clamped by the first silicon rod clamp or the second silicon rod clamp can be subjected to rough grinding operation and finish grinding operation by using the grinding tool. Therefore, at least one of the rough grinding wheel and the finish grinding wheel is provided with a telescopic driving mechanism. For example, when the rough grinding wheel is nested in the finish grinding wheel, the rough grinding wheel may be provided with a telescopic driving mechanism, when performing rough grinding operation, the telescopic driving mechanism is used to drive the rough grinding wheel to extend out and protrude out of the finish grinding wheel, so as to perform rough grinding operation on a silicon rod by using the protruding rough grinding wheel, and when performing finish grinding operation, the telescopic driving mechanism is used to drive the rough grinding wheel to contract and sink into the finish grinding wheel, so as to perform finish grinding operation on the silicon rod by using the finish grinding wheel. Or when the rough grinding wheel is nested in the fine grinding wheel, the fine grinding wheel can be provided with a telescopic driving mechanism, when rough grinding operation is carried out, the telescopic driving mechanism is used for driving the fine grinding wheel to contract and recess in the rough grinding wheel so as to carry out rough grinding operation on a silicon rod by using the rough grinding wheel, and when fine grinding operation is carried out, the telescopic driving mechanism is used for driving the fine grinding wheel to extend out and protrude out of the rough grinding wheel so as to carry out fine grinding operation on the silicon rod by using the protruding fine grinding wheel.

For example, the finish grinding wheel is nested within the rough grinding wheel, the rough grinding wheel is larger than the finish grinding wheel, the rough grinding wheel is circular and hollow in the middle (i.e., circular ring structure), the finish grinding wheel can be circular in structure or the finish grinding wheel can be circular and hollow in the middle (i.e., circular ring structure). The grain size of the fine grinding wheel is smaller than that of the rough grinding wheel, and the grain density of the fine grinding wheel is larger than that of the rough grinding wheel.

When the grinding tool comprises a rough grinding wheel and a finish grinding wheel, the silicon rod clamped by the first silicon rod clamp or the second silicon rod clamp can be subjected to rough grinding operation and finish grinding operation by using the grinding tool. Therefore, at least one of the rough grinding wheel and the finish grinding wheel is provided with a telescopic driving mechanism. For example, when the finish grinding wheel is nested in the rough grinding wheel, the rough grinding wheel may be provided with a telescopic driving mechanism, when performing rough grinding operation, the telescopic driving mechanism is used to drive the rough grinding wheel to extend out and protrude out of the finish grinding wheel, so as to perform rough grinding operation on a silicon rod by using the protruding rough grinding wheel, and when performing finish grinding operation, the telescopic driving mechanism is used to drive the rough grinding wheel to contract and sink into the finish grinding wheel, so as to perform finish grinding operation on a silicon rod by using the finish grinding wheel. Or when the accurate grinding wheel is nested in the rough grinding wheel, the accurate grinding wheel can be provided with a telescopic driving mechanism, when the rough grinding operation is carried out, the telescopic driving mechanism is utilized to drive the accurate grinding wheel to contract and recess in the rough grinding wheel so as to utilize the rough grinding wheel to carry out the rough grinding operation on the silicon rod, and when the accurate grinding operation is carried out, the telescopic driving mechanism is utilized to drive the accurate grinding wheel to extend out and protrude out of the rough grinding wheel so as to utilize the protruding accurate grinding wheel to carry out the accurate grinding operation on the silicon rod.

In some embodiments, the grinding device comprises a grinding tool and a chamfering tool, wherein the grinding tool comprises a main shaft and at least one grinding wheel assembly, the grinding wheel assembly is arranged at the working end of the main shaft, and the chamfering tool is arranged on the grinding support and is used for chamfering or rounding the edge of the cut silicon rod.

In the present embodiment, as shown in fig. 2, the grinding device 3 mainly includes a grinding support 31, at least one pair of grinding tools 33, and a chamfering tool 35, wherein the at least one pair of grinding tools 33 is oppositely disposed on the grinding support 31 for grinding the cut silicon rod at the grinding location, and the chamfering tool 35 is disposed on the grinding support 31 for chamfering or rounding the edge of the cut silicon rod.

The chamfer grinding tool may comprise a chamfer grinding wheel.

In some embodiments, the bevel grinder 35 may move with the grinding grinder 33, for example, one or a combination of one or more of moving back and forth along the X-axis, moving along the Y-axis, and moving up and down along the vertical direction.

In some embodiments, the chamfering tool 35 may be independently configured with a corresponding chamfering tool advancing and retracting mechanism for driving the chamfering tool to advance and retract along the X-axis and/or a chamfering tool translating mechanism for driving the chamfering tool to move along the Y-axis.

In practical application, the chamfering grinding tool can be driven to move along the direction of the plumb line so as to enable the chamfering grinding tool to contact with the silicon rod edges, the cut silicon rod is driven to rotate along the axial lead of the cut silicon rod so as to enable the silicon rod edges to contact with the chamfering grinding tool to achieve rounding, or the cut silicon rod is driven to rotate along the axial lead of the cut silicon rod by a preset angle so as to enable the silicon rod edges to contact with the chamfering grinding tool or drive the chamfering grinding tool to advance and retreat so as to contact with the silicon rod edges to achieve chamfering.

In addition, the axis of the chamfering grinding wheel and the axis of the cut silicon rod have an offset. As shown in fig. 2, the axis of the chamfering wheel as the chamfering grinding tool 35 is offset from the axis of the cut silicon rod (i.e., the center of the silicon rod chuck in the silicon rod transfer device), so that the chord part of the chamfering wheel is brought into contact with the cut silicon rod, a large contact area is obtained as much as possible, and the working efficiency of chamfering or rounding is improved.

For example, in the description of the polishing operation as the polishing device, the chamfering operation of the silicon rod is performed after the polishing operation of the silicon rod is performed, but the invention is not limited thereto, and in other embodiments, the chamfering operation of the silicon rod is performed after the chamfering operation of the silicon rod is performed, and the invention is also applicable and is within the scope of the present application.

Subsequently, after the silicon rod 200 is ground by the grinding device 3, the silicon rod 200 is switched from the grinding location to the waiting location by the silicon rod switching device 4, and the processed silicon rod is unloaded from the waiting location of the silicon rod processing platform by the silicon rod loading and unloading device. Of course, before unloading the silicon rod 200, if necessary, in the waiting section, the silicon rod 200 after the machining operation may be inspected by an inspection device, for example, a flatness inspection apparatus for a plane flatness of the silicon rod. By using the flatness detector, on one hand, whether the silicon rod meets the product requirements after each processing operation can be detected by detecting the plane flatness of the silicon rod 200 so as to determine the effect of each processing operation; on the other hand, the wear condition of the processing parts in each processing device can be indirectly obtained through detecting the plane flatness of the silicon rod 200, so that the calibration or correction, even the maintenance or replacement can be conveniently carried out in real time.

Furthermore, in the cutting and grinding all-in-one machine, in an optional embodiment, a silicon rod cleaning device can be further included. The silicon rod cleaning device can be arranged on the base and used for cleaning the silicon rod. In the silicon rod cleaning apparatus, generally, after the silicon rod is subjected to the above-described processing operation, cutting chips generated during the operation adhere to the surface of the silicon rod, and therefore, it is necessary to clean the silicon rod as necessary. Generally, the silicon rod cleaning device comprises a cleaning brush head and a cleaning solution spraying device matched with the cleaning brush head, wherein during cleaning, the cleaning solution spraying device sprays cleaning solution towards the silicon rod, and meanwhile, the cleaning brush head is driven by a motor to act on the silicon rod to complete cleaning operation. In practice, the cleaning liquid may be pure water, for example, and the cleaning brush head may be a rotary brush head, for example.

In addition, the cutting and grinding integrated machine of the present application, it is particularly pointed out that, if the cutting and grinding integrated machine increases or decreases the corresponding processing operation device, the number and the position relationship of the functional location on the silicon rod processing platform and the silicon rod positioning mechanism on the conveying body need to be correspondingly adjusted.

In certain embodiments, the silicon rod changeover device is also reduced by a corresponding one of the silicon rod positioning means, provided that the silicon rod multi-station processing machine omits a waiting zone. Further, preferably, the angles set between two of the three silicon rod positioning mechanisms are also consistent with the angle distribution between two of the three functional areas. Thus, when one silicon rod positioning mechanism corresponds to one functional zone, the other two silicon rod positioning mechanisms also correspond to the other two functional zones respectively. Therefore, in the running water operation, at any moment, when one silicon rod is positioned on each silicon rod positioning mechanism and the silicon rod positioning mechanisms correspond to the function areas, the silicon rods are positioned at the corresponding function areas to execute corresponding processing operation. In an alternative embodiment, the three functional regions on the silicon rod processing platform are arranged at 120 ° with respect to one another, so that correspondingly, the four silicon rod positioning means on the disk-shaped or ring-shaped conveying body are also arranged at 120 ° with respect to one another.

In addition, in the cutting and grinding all-in-one machine, it is particularly noted that if a corresponding processing operation device is additionally arranged on the cutting and grinding all-in-one machine, the number and the position relationship of the functional location on the silicon rod processing platform and the silicon rod positioning mechanism on the conveying body need to be correspondingly adjusted. Supposing that a processing operation device is additionally arranged on the silicon rod multi-station processing machine, a functional zone bit is correspondingly additionally arranged on the silicon rod processing platform, and a silicon rod positioning mechanism is correspondingly additionally arranged on the silicon rod conversion device. Further, preferably, the angles set between every two of the five silicon rod positioning mechanisms are consistent with the angle distribution between every two of the five functional areas. Thus, when one silicon rod positioning mechanism corresponds to one functional zone, the other four silicon rod positioning mechanisms also correspond to the other four functional zones respectively. Therefore, in the running water operation, at any moment, when one silicon rod is positioned on each silicon rod positioning mechanism and the silicon rod positioning mechanisms correspond to the function areas, the silicon rods are positioned at the corresponding function areas to execute corresponding processing operation. In an alternative embodiment, the five functional regions on the silicon rod processing platform are arranged at 72 ° with respect to one another, so that correspondingly, the four silicon rod positioning means on the disk-shaped or ring-shaped conveying body are also arranged at 72 ° with respect to one another.

The application discloses silicon rod surely grinds all-in-one has assembleed cutting device and grinder, and usable silicon rod conversion equipment can shift the silicon rod between each processingequipment in order and seamlessly to utilize cutting device to carry out the evolution cutting to the silicon rod in order to form square silicon rod and utilize grinder to grind the square silicon rod after the evolution cutting, thereby accomplish the evolution of silicon rod and grind the integration operation of multiple operation, improve the quality of production efficiency and product processing operation.

The application discloses silicon rod surely grinds method is applied to in a silicon rod surely grinds all-in-one, silicon rod surely grinds all-in-one including the frame that has silicon rod processing platform, silicon rod processing platform is equipped with cutting position and grinding position, silicon rod surely grinds all-in-one still includes cutting device, grinder and silicon rod conversion equipment, cutting device includes cutting unit and roll adjustment unit.

The silicon rod cutting and grinding method disclosed by the application can comprise the following steps of:

the silicon rod conversion device is used for converting the first silicon rod to a cutting position, and a cutting unit in the cutting device is used for cutting the first silicon rod on the cutting position to form two orthogonal side surfaces so as to cut the first silicon rod into the silicon rod with the rectangular cross section; the cutting position of a distance adjusting unit in the cutting device is adjusted by the distance adjusting unit according to a cutting task;

and at the stage, a cutting unit in the cutting device cuts the second silicon rod on the cutting area to form two orthogonal side surfaces so as to cut the second silicon rod into the silicon rod with the rectangular section.

The silicon rod cutting and grinding method is applied to the silicon rod cutting and grinding all-in-one machine, when silicon rod cutting and grinding operation is executed, the distance adjusting unit in the silicon rod cutting device can adjust the cutting position of the cutting unit according to a silicon rod cutting task to adapt to silicon rods with different specifications and sizes, the silicon rod conversion device transfers the silicon rods among all processing devices orderly and seamlessly, the cutting device cuts the silicon rods in a folded surface mode twice to form square silicon rods, and the grinding device grinds the square silicon rods after being cut in the unfolded surface mode, so that integrated operation of multiple procedures of unfolding and grinding of the silicon rods is completed, and production efficiency and product processing operation quality are improved.

In some embodiments, as shown in fig. 1, the silicon rod cutting and grinding all-in-one machine comprises a base with a silicon rod processing platform, the silicon rod processing platform is provided with a waiting zone, a first cutting zone, a second cutting zone and a grinding zone, the silicon rod cutting and grinding all-in-one machine further comprises a cutting device, a grinding device and a silicon rod conversion device, and the waiting zone, the first cutting zone, the second cutting zone and the grinding zone of the silicon rod processing platform are distributed at 90 degrees between two adjacent positions. In the present embodiment, it is assumed that the sequence of the waiting zone, the first cutting zone, the second cutting zone, and the polishing zone is defined as the forward direction.

The silicon rod cutting and grinding method at least comprises the following steps:

and S101, enabling the distance adjusting unit in the cutting device to adjust the cutting position of the distance adjusting unit in the cutting device according to the cutting task.

Step S103, loading a first silicon rod in a waiting area, and preprocessing the first silicon rod. In this embodiment, in step S101, the first silicon rod to be processed is transferred to the waiting section of the silicon rod processing platform by the silicon rod transfer device.

For a specific manner of transferring the first silicon rod to be processed to the waiting position of the silicon rod platform by using the silicon rod transfer device, reference may be made to the foregoing description, and further description thereof will be omitted.

In addition, the pretreatment may include ridge detection and centering of the first silicon rod located at the waiting location with a positioning detection device.

Step S105, the silicon rod conversion device is made to rotate by a first preset angle so as to convert the first silicon rod from the waiting position to the first cutting position, the first cutting unit in the cutting device is made to perform first folding surface cutting on the first silicon rod in the first cutting position, and at this stage, the second silicon rod is loaded in the waiting position and is preprocessed.

In step S105, since the waiting location and the first cutting location are 90 °, the first preset angle for rotating the silicon rod conversion device is that the silicon rod conversion device is rotated 90 ° in the forward direction.

And (4) rotating the silicon rod conversion device 4 forward by 90 degrees, and converting the first silicon rod to be processed from the waiting position to the first cutting position.

In this way, the first silicon rod at the first cutting location can be cut with the first cutting unit 23 in the cutting device 2.

When the first cutting unit 23 of the cutting device 2 is used to cut the first silicon rod at the first cutting location, referring to fig. 1, the cutting support 22 is driven to descend relative to the cutting frame 21, and the first cutting unit 23 at one side of the cutting support 22 performs the first folding cutting on the first silicon rod at the first cutting location (the first cutting unit 23 is provided with a first cutting wire net in a shape of a letter t).

For loading the second silicon rod in the waiting area and preprocessing the second silicon rod, reference may be made to the description of the first silicon rod in step S103, which is not repeated herein.

Step S107, the silicon rod conversion device is enabled to rotate by a first preset angle so as to convert the first silicon rod from the first cutting area to the second cutting area and convert the second silicon rod from the waiting area to the first cutting area, the cutting device is enabled to carry out second fold face cutting on the first silicon rod in the second cutting area and carry out first fold face cutting on the second silicon rod in the first cutting area, and at this stage, the third silicon rod is loaded in the waiting area to carry out pretreatment on the third silicon rod.

In step S107, since the waiting location, the first cutting location, and the second cutting location of the silicon rod processing platform differ by 90 ° in sequence, the first preset angle for rotating the silicon rod conversion device is that the silicon rod conversion device is rotated by 90 ° in the forward direction.

The silicon rod conversion device 4 is rotated forward by 90 degrees, the first silicon rod is converted from the first cutting area to the second cutting area, and the second silicon rod is converted from the waiting area to the first cutting area.

In this way, the cutting device 2 can be used to cut a first silicon rod in the second cutting region of the silicon rod processing platform and a second silicon rod in the first cutting region.

When the cutting device 2 cuts the second silicon rod on the first cutting area of the silicon rod processing platform and the second silicon rod 100 on the first cutting area, referring to fig. 1, the cutting support 22 is driven to descend relative to the cutting frame 21, and the first cutting units 23 and the second cutting units 25 on the left and right sides of the cutting support 22 simultaneously cut the second silicon rod on the corresponding first cutting area and the first silicon rod on the second cutting area, wherein the first cutting units 23 perform first folding cutting on the second silicon rod on the first cutting area (the first cutting units 23 are provided with the first cutting wire meshes in the shape of the inverted't'), and the second cutting units 25 perform second folding cutting on the first silicon rod on the second cutting area (the second cutting units 25 are provided with the second cutting wire meshes in the shape of the inverted't'). It should be noted that, before the second cutting unit 25 is used to perform the second folding cutting on the first silicon rod at the second cutting location, the silicon rod positioning mechanism in the silicon rod conversion device 6 is further used to drive the first silicon rod to rotate forward or backward by 180 ° to adjust the cutting surface due to the aforementioned problem of folding cutting. In this way, after the first silicon rod located at the second cutting location is subjected to second plane-folding cutting by the second cutting unit 25, a silicon rod that is square as a whole is formed.

For loading the third silicon rod in the waiting area to perform the pretreatment on the third silicon rod, reference may be made to the description of the first silicon rod in step S103, which is not repeated herein.

Step S109, rotating the silicon rod transfer device by a first preset angle to transfer the first silicon rod from the second cutting location to the grinding location, transferring the second silicon rod from the first cutting location to the second cutting location, transferring the third silicon rod from the waiting location to the first cutting location, and making the grinding device grind and chamfer the first silicon rod on the grinding location, at this stage, making the cutting device perform the second facet cutting on the second silicon rod on the second cutting location and perform the first facet cutting on the third silicon rod on the first cutting location, and simultaneously, loading the fourth silicon rod on the waiting location to preprocess the fourth silicon rod.

In step S109, since the waiting zone, the first cutting zone, the second cutting zone and the grinding zone of the silicon rod processing platform are sequentially 90 ° apart from each other, the first predetermined angle for rotating the silicon rod conversion device is that the silicon rod conversion device is rotated by 90 ° in the forward direction

The silicon rod conversion device 4 is enabled to rotate 90 degrees in the forward direction, the first silicon rod is converted from the second cutting area to the grinding area, the second silicon rod is converted from the first cutting area to the second cutting area, and the third silicon rod is converted from the waiting area to the first cutting area.

In this way, the grinding device 3 can be used to grind the first silicon rod in the grinding zone of the silicon rod processing platform. For a specific manner of performing the grinding operation on the first silicon rod on the grinding section of the silicon rod processing platform by using the grinding device 3, reference is made to the foregoing description, and details are not repeated herein.

Meanwhile, the third silicon rod on the first cutting area and the second silicon rod on the second cutting area of the silicon rod processing platform can be cut by the cutting device 2.

When the cutting device 2 is used to cut a third silicon rod on a first cutting area and a second silicon rod on a second cutting area of the silicon rod processing platform, referring to fig. 1, the cutting support 22 is driven to descend relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left side and the right side of the cutting support 22 simultaneously cut the third silicon rod on the corresponding first cutting area and the second silicon rod on the corresponding second cutting area, wherein the first cutting unit 23 performs first plane cutting on the third silicon rod on the first cutting area (the first cutting unit 23 is provided with a first cutting line network in a shape of a reversed L), and the second cutting unit 25 performs second plane cutting on the second silicon rod on the second cutting area (the second cutting unit 25 is provided with a second cutting line network in a shape of a reversed L). It should be noted that before the second cutting unit 25 is used to perform the second folding cutting on the second silicon rod at the second cutting location, the silicon rod positioning mechanism in the silicon rod conversion device 6 is further used to drive the second silicon rod to rotate forward or backward by 180 ° to adjust the cutting surface due to the aforementioned problem of folding cutting. In this way, after the second silicon rod located at the second cutting location is subjected to second plane-folding cutting by the second cutting unit 25, the silicon rod which is square as a whole is formed.

For loading the fourth silicon rod in the waiting area to perform the pretreatment on the fourth silicon rod, reference may be made to the description of the first silicon rod in step S103, which is not repeated herein.

And step S111, rotating the silicon rod conversion device by a second preset angle to convert the first silicon rod from the grinding position to a waiting position, convert the second silicon rod from the second cutting position to the grinding position, convert the third silicon rod from the first cutting position to the second cutting position, convert the fourth silicon rod from the waiting position to the first cutting position, unload the first silicon rod from the waiting position and load the fifth silicon rod, and pre-process the fifth silicon rod.

In step S111, since the waiting location, the first cutting location, the second cutting location, and the grinding location of the silicon rod processing platform are sequentially 90 ° apart from each other, the first preset angle for rotating the silicon rod conversion device is that the silicon rod conversion device is rotated by 90 ° in the forward direction or 270 ° in the reverse direction. The silicon rod conversion device reversely rotates 270 degrees, so that the silicon rod conversion device can return to the initial position, and a cable wound in the forward rotation process can be released.

The silicon rod transfer device 4 is rotated in the reverse direction (i.e. counterclockwise arrow in fig. 2) by 270 °, the first silicon rod is transferred from the grinding zone to the waiting zone, the second silicon rod is transferred from the second cutting zone to the grinding zone, the third silicon rod is transferred from the first cutting zone to the second cutting zone, and the fourth silicon rod is transferred from the waiting zone to the first cutting zone.

In this way, the first silicon rod processed at the waiting location may be transferred out of the silicon rod processing platform by the silicon rod transfer device 6, and the fifth silicon rod 108 to be processed may be transferred to the waiting location of the silicon rod processing platform.

Meanwhile, the second silicon rod on the grinding section of the silicon rod processing platform is ground by the grinding device 3. For a specific manner of using the grinding device 3 to grind the second silicon rod on the grinding section of the silicon rod processing platform, reference is made to the foregoing description, and further description is omitted here.

Meanwhile, the cutting device 2 may be used to cut a fourth silicon rod in the first cutting location and a third silicon rod in the second cutting location of the silicon rod processing platform.

When the cutting device 2 is used for cutting the fourth silicon rod on the first cutting area and the third silicon rod on the second cutting area of the silicon rod processing platform, referring to fig. 1, the cutting support 22 is driven to descend relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left side and the right side of the cutting support 22 simultaneously cut the fourth silicon rod on the corresponding first cutting area and the third silicon rod on the second cutting area, wherein the first cutting unit 23 performs first plane cutting on the fourth silicon rod on the first cutting area (the first cutting unit 23 is provided with a first cutting line network in a shape of a reversed L), and the second cutting unit 25 performs second plane cutting on the third silicon rod on the second cutting area (the second cutting unit 25 is provided with a second cutting line network in a shape of a reversed L). It should be noted that before the second cutting unit 25 is used to perform the second folding cutting on the third silicon rod at the second cutting location, the silicon rod positioning mechanism in the silicon rod conversion device 4 is further used to drive the third silicon rod to rotate forward or backward by 180 ° to adjust the cutting surface due to the aforementioned problem of folding cutting. In this way, after the third silicon rod located at the second cutting location is subjected to second plane-folding cutting by the second cutting unit 25, a silicon rod having a square shape as a whole is formed.

According to the silicon rod cutting and grinding method, the silicon rods can be transferred among the processing devices orderly and seamlessly, and meanwhile, the silicon rods can be cut to form square silicon rods by cutting, and the square silicon rods after cutting are ground, so that the integrated operation of cutting and grinding the silicon rods in multiple processes is completed, and the production efficiency and the quality of product processing operation are improved.

The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.

Claims

1. The utility model provides a silicon rod surely grinds all-in-one which characterized in that includes:

the base is provided with a silicon rod processing platform; the silicon rod processing platform comprises a first cutting area, a second cutting area and a grinding area;

a cutting device, comprising: the device comprises a first cutting unit, a first distance adjusting unit, a second cutting unit and a second distance adjusting unit; the first cutting unit comprises two orthogonal first cutting wire saws, and the two orthogonal first cutting wire saws are used for cutting the silicon rod to be cut at the first cutting position to form two orthogonal side faces; the first distance adjusting unit is used for adjusting the cutting positions of two orthogonal first cutting wire saws in the first cutting unit; the second cutting unit comprises two orthogonal second cutting wire saws, and the two orthogonal second cutting wire saws are used for cutting the silicon rod to be cut at the second cutting position to form two orthogonal side surfaces and cutting the silicon rod into the silicon rod with the rectangular cross section; the second distance adjusting unit is used for adjusting the cutting positions of two orthogonal second cutting wire saws in the second cutting unit;

the grinding device is used for grinding and chamfering the cut silicon rod at the grinding position; and

and the silicon rod conversion device is arranged on the silicon rod processing platform and used for converting the silicon rod among the first cutting area, the second cutting area and the grinding area.

2. The silicon rod cutting and grinding all-in-one machine as recited in claim 1,

the first cutting unit includes: the first cutting wire is wound on the first cutting wheels and the first transition wheels to form two orthogonal first cutting wire saws;

the first distance adjusting unit comprises a first bobbin adjusting mechanism, and the first bobbin adjusting mechanism is used for adjusting the positions of the first bobbin and a plurality of first cutting wheels and first transition wheels on the first bobbin;

the second cutting unit includes: the second wire frame, a plurality of second cutting wheels and second transition wheels which are arranged on the second wire frame, and a second cutting wire, wherein the second cutting wire is wound around the plurality of second cutting wheels and the second transition wheels to form two orthogonal second cutting wire saws; and

the second distance adjusting unit comprises a second wire frame adjusting mechanism, and the second wire frame adjusting mechanism is used for adjusting the positions of the second wire frame and a plurality of second cutting wheels and second transition wheels on the second wire frame.

3. The silicon rod cutting and grinding all-in-one machine as recited in claim 2, wherein the first cutting wheel has at least two cutting wire grooves, and the first distance adjusting unit further comprises a first calibrating mechanism for driving the first transition wheel to move so as to adjust a current wire groove wound by a first cutting wire in the first transition wheel from a first cutting wire groove corresponding to the first cutting wheel to a second cutting wire groove corresponding to the first cutting wheel; the second cutting wheel is provided with at least two cutting wire grooves, and the second distance adjusting unit further comprises a second calibrating mechanism which is used for driving the second transition wheel to move so that the current wire groove wound by a second cutting wire in the second transition wheel is adjusted from the first cutting wire groove corresponding to the second cutting wheel to the second cutting wire groove corresponding to the second cutting wheel.

4. The silicon rod cutting and grinding all-in-one machine as set forth in claim 2, wherein the cutting device further comprises:

the first cutting frame and the first cutting support are positioned in a first cutting area, the first cutting frame is arranged on the machine base, the first cutting support is movably lifted on the first cutting frame, and the first cutting unit is arranged on the first cutting support; and

the second cutting frame and the second cutting support are located in the second cutting area, the second cutting frame is arranged on the machine base, the second cutting support movably ascends and descends the second cutting frame, and the second cutting unit is arranged on the second cutting support.

5. The silicon rod cutting and grinding all-in-one machine as set forth in claim 4, further comprising: the first take-up and pay-off unit corresponds to the first cutting unit, and the second take-up and pay-off unit corresponds to the second cutting unit.

6. The silicon rod cutting and grinding all-in-one machine as recited in claim 4, wherein the first cutting line is wound around the plurality of first cutting wheels and first transition wheels to form a first closed loop cutting line that is connected end to end, and the second cutting line is wound around the plurality of second cutting wheels and second transition wheels to form a second closed loop cutting line that is connected end to end.

7. The silicon rod cutting and grinding all-in-one machine as set forth in claim 2, wherein the cutting device further comprises:

the cutting frame is arranged on the base; the cutting frame is positioned between the first cutting area and the second cutting area;

the cutting support is movably lifted on the cutting frame; the cutting support comprises a support main body, a first support side wing and a second support side wing, wherein the first support side wing and the second support side wing are positioned on two opposite lateral sides of the support main body;

the first cutting unit is arranged on a first support flank of the cutting support, and the second cutting unit is arranged on a second support flank of the cutting support.

8. The silicon rod cutting and grinding all-in-one machine as claimed in claim 7, wherein the first cutting line and the second cutting line are the same cutting line, and an intermediate transition wheel is further arranged on the cutting support and located between the first cutting unit and the second cutting unit for winding the cutting line.

9. The silicon rod cutting and grinding all-in-one machine as recited in claim 8, wherein the cutting device further comprises a take-up and pay-off unit.

10. The silicon rod cutting and grinding all-in-one machine as recited in claim 8, wherein the cutting line is wound around the plurality of first cutting wheels, the first transition wheel, the intermediate transition wheel, the plurality of second cutting wheels and the second transition wheel to form a closed loop cutting line that is connected end to end.

11. The silicon rod cutting and grinding all-in-one machine as claimed in claim 1, wherein the intersection point of two orthogonal first cutting wire saws in the first cutting unit when the first folding cutting is performed on the silicon rod to be cut is located in the section of the silicon rod to be cut, and the intersection point of two orthogonal second cutting wire saws in the second cutting unit when the second folding cutting is performed on the silicon rod to be cut is located in the section of the silicon rod to be cut.

12. The silicon rod cutting and grinding all-in-one machine as set forth in claim 1, further comprising: the first flaw-piece discharging device is used for discharging flaw-pieces generated after the first cutting unit performs first folding cutting; and the second flaw-piece discharging device is used for discharging the flaw-pieces generated after the second folding surface cutting is carried out on the second cutting unit.

13. The silicon rod slicing and grinding all-in-one machine as set forth in claim 12, wherein any one of the first and second flaw-piece discharge devices comprises:

a flaw-piece lifting unit for lifting the flaw-piece so that the flaw-piece tip protrudes out of the cut silicon rod; and

and the flaw-piece clamping and transferring unit is used for clamping the flaw-pieces and transferring the flaw-pieces.

14. The silicon rod cutting and grinding all-in-one machine as recited in claim 13, wherein the flaw-piece clamping and transferring unit comprises:

the clamping mechanism is used for clamping or releasing the top end of the side skin; and

and the lifting driving mechanism is used for driving the clamping mechanism to move up and down so as to enable the clamping mechanism to drive the clamped flaw-piece to be separated from the cut silicon rod.

15. The silicon rod cutting and grinding all-in-one machine as recited in claim 14, wherein the clamping mechanism comprises:

the cover body is used for covering the side leather; and

the clamping assembly is arranged inside the cover body; the clamping assembly and the cover body form a clamping space for clamping the edge leather.

16. The silicon rod slicing and grinding all-in-one machine as recited in claim 15, wherein the cover body comprises an arc-shaped plate with a semicircular cross section; the clamping assembly includes two orthogonal clamping members.

17. The silicon rod slicing and grinding all-in-one machine as claimed in claim 16, wherein the clamping member is a movable pressing block controlled by a cylinder, and the movable pressing block is connected with an output shaft of the cylinder through a swing arm.

18. The silicon rod slicing and grinding all-in-one machine as recited in claim 13, wherein any one of the first and second flaw-piece discharge devices further comprises a wire pulling mechanism for pulling the corresponding first or second cutting wire saw to expand towards the outside to avoid interference of the first or second cutting wire saw with the cut silicon rod.

19. The silicon rod cutting and grinding all-in-one machine as set forth in claim 1, wherein the grinding device comprises:

the grinding support is movably arranged on the machine base; and

and at least one pair of grinding tools are oppositely arranged on the grinding support.

20. The silicon rod slicing and grinding all-in-one machine as set forth in claim 19, wherein the grinding tool comprises:

a main shaft; and

and the grinding wheel assembly is arranged at the working end of the main shaft.

21. The silicon rod slicing and grinding all-in-one machine as claimed in claim 20, wherein the grinding wheel assembly comprises a rough grinding wheel, a finish grinding wheel, or a nested combination of rough grinding wheel and finish grinding wheel.

22. The silicon rod slicing and grinding all-in-one machine as set forth in claim 19, wherein the grinding tool comprises:

a rotary chassis;

the double-head main shaft is arranged on the rotary chassis, the first end of the double-head main shaft is provided with at least one coarse grinding wheel, and the second end of the double-head main shaft is provided with at least one fine grinding wheel; and

and the conversion motor is used for driving the rotary chassis to rotate so that the first end and the second end of the double-head spindle can exchange positions.

23. The silicon rod cutting and grinding all-in-one machine as claimed in claim 19, wherein the grinding device further comprises at least one chamfering tool, and the chamfering tool is arranged on the grinding support and is used for chamfering or rounding the edge of the cut silicon rod.

24. The silicon rod slicing and grinding all-in-one machine as claimed in claim 23, wherein the chamfering and grinding tool comprises a chamfering and grinding wheel, and the axis of the chamfering and grinding wheel is offset from the axis of the cut silicon rod.

25. The silicon rod cutting and grinding all-in-one machine as claimed in claim 1, wherein the first cutting area, the second cutting area and the grinding area of the silicon rod processing platform are distributed at 120 degrees between every two adjacent cutting areas, and the rotation angle range of the silicon rod conversion device is +/-240 degrees.

26. The silicon rod cutting and grinding all-in-one machine as claimed in claim 1, wherein the silicon rod processing platform is further provided with a pretreatment area, and the silicon rod cutting and grinding all-in-one machine further comprises a silicon rod transferring device which is arranged adjacent to the pretreatment area of the silicon rod processing platform and is used for transferring a silicon rod to be processed to the pretreatment area of the silicon rod processing platform or transferring a processed silicon rod on the pretreatment area out of the silicon rod processing platform.

27. The silicon rod cutting and grinding all-in-one machine as recited in claim 26, wherein the first cutting area, the second cutting area, the grinding area and the pre-processing area of the silicon rod processing platform are distributed at 90 ° between adjacent cutting areas, and the rotation angle range of the silicon rod conversion device is ± 270 °.

28. The silicon rod cutting and grinding all-in-one machine as recited in claim 1, wherein the silicon rod transfer device comprises:

a conveying body;

the silicon rod positioning mechanism is arranged on the conveying body and used for positioning the silicon rod; and

and the conversion driving mechanism is used for driving the conveying body to rotate so as to drive the silicon rod positioned by the silicon rod positioning mechanism to convert among all the regions.

29. The utility model provides a silicon rod surely grinds method, its characterized in that, silicon rod surely grinds method is applied to in a silicon rod surely grinds all-in-one, silicon rod surely grinds all-in-one including the frame that has silicon rod processing platform, silicon rod processing platform is equipped with first cutting position, second cutting position and grinds the position, silicon rod surely grinds all-in-one still includes cutting device, grinder and silicon rod conversion equipment, cutting device includes first cutting unit, first roll adjustment unit, second cutting unit and second roll adjustment unit, first cutting unit includes two orthogonal first cutting coping saws, the second cutting unit includes two orthogonal second cutting coping saws, silicon rod surely grinds method includes following step:

the silicon rod conversion device is used for converting the first silicon rod to a first cutting area, and two orthogonal first cutting wire saws in the first cutting unit are used for cutting the first silicon rod in the first cutting area to form two orthogonal side surfaces; the cutting position of the first cutting unit is adjusted by the distance adjusting unit according to the cutting task;