CN114613763A - LED light-emitting chip light source and manufacturing process thereof - Google Patents
LED light-emitting chip light source and manufacturing process thereof Download PDFInfo
- Publication number
- CN114613763A CN114613763A CN202210270225.3A CN202210270225A CN114613763A CN 114613763 A CN114613763 A CN 114613763A CN 202210270225 A CN202210270225 A CN 202210270225A CN 114613763 A CN114613763 A CN 114613763A
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- Prior art keywords
- led light
- wafer
- emitting
- fixing groove
- light source
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention discloses an LED light-emitting chip light source, which comprises a bracket, a wafer fixing groove, an LED light-emitting wafer and surface layer packaging glue, wherein the wafer fixing groove is arranged on the bracket, the LED light-emitting wafer is arranged on the wafer fixing groove, and the surface layer packaging glue is arranged on the bracket, and the manufacturing process comprises the following steps: and manufacturing a wafer fixing groove on the support by using a laser engraving technology, putting the LED light-emitting wafer into the wafer fixing groove after dispensing glue at the bottom of the wafer fixing groove, baking, welding and conducting the LED light-emitting wafer and the support by using a wire, and packaging. The invention belongs to the technical field of LED chip manufacturing, and particularly relates to an LED light-emitting chip light source and a manufacturing process thereof, which effectively solve the problems that the prior art cannot meet the requirement of higher luminous efficiency and cannot meet the aims of more energy conservation and emission reduction, and are an LED light-emitting chip light source and a manufacturing process thereof, which can improve the highest luminous efficiency to 210lm/W and can save more energy and reduce emission.
Description
Technical Field
The invention belongs to the technical field of LED chip manufacturing, and particularly relates to an LED light-emitting chip light source and a manufacturing process thereof.
Background
In recent years, LED light-emitting chips and related technologies thereof have been developed dramatically, which enables the LED light-emitting chips to be applied and popularized in a large scale in many fields such as illumination and display, and according to the law of light-emitting efficiency of gallium nitride LED light-emitting chips under different current densities, the current density is maintained at the highest luminous efficiency point under the condition of using rated current, so that better light power output can be realized, the current highest luminous efficiency in the industry is 150lm/W, and the prior art cannot meet the requirement of higher luminous efficiency and the aims of saving energy and reducing emission.
Disclosure of Invention
Aiming at the situation, in order to overcome the defects of the prior art, the invention provides the LED light-emitting chip light source and the manufacturing process thereof, which effectively solve the problems that the prior art cannot meet the requirement of higher luminous efficiency and cannot meet the aims of more energy conservation and emission reduction, and are the LED light-emitting chip light source and the manufacturing process thereof which can improve the highest luminous efficiency to 210lm/W and can save more energy and reduce emission.
In order to realize the functions, the technical scheme adopted by the invention is as follows: the utility model provides a LED luminescence chip light source, includes support, wafer fixed slot, LED luminescence wafer and surface course encapsulation glue, wafer fixed slot locates on the support, LED luminescence wafer locates on the wafer fixed slot, surface course encapsulation glue locates on the support.
Further, thirty groups of LED luminous wafers are arranged, thirty groups of wafer fixing grooves are arranged, the thirty groups of wafer fixing grooves are uniformly distributed on the support in a matrix manner, and the thirty groups of LED luminous wafers are connected through wires.
Preferably, the size of the LED light-emitting wafer is 1.9mm by 3.6 mm.
Preferably, the scaffold has dimensions of 60mm by 60 mm.
The surface layer packaging adhesive is made of epoxy resin.
Further, the manufacturing process of the LED light-emitting chip light source comprises the following steps:
the method comprises the following steps: manufacturing a wafer fixing groove on the support by using a laser engraving technology;
step two: after glue is dispensed at the bottom of the wafer fixing groove, the LED light-emitting wafer is placed in the wafer fixing groove to obtain an unfixed product;
step three: baking the unfixed product to obtain a fixed product;
step four: welding and conducting the LED light-emitting chip on the fixed product and the bracket by using a lead to obtain a semi-finished product;
step five: and (5) wrapping the LED light-emitting wafer by the pouring surface layer packaging glue and baking to obtain a finished product.
The invention with the structure has the following beneficial effects: the wafer fixing groove is manufactured through the laser engraving technology, the light emitting area is enlarged, the problems that the prior art cannot meet the requirement of higher light efficiency and cannot meet the purpose of more energy conservation and emission reduction are effectively solved, and the LED light emitting chip light source and the manufacturing process thereof can improve the highest light efficiency to 210lm/W and can save more energy and reduce emission.
Drawings
Fig. 1 is a schematic view of an overall structure of an LED light-emitting chip light source according to the present invention.
The LED light-emitting device comprises a substrate, a support, a wafer fixing groove 2, an LED light-emitting wafer 3, a surface layer packaging adhesive 4 and a chip fixing groove.
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments; all other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, the LED light-emitting chip light source provided by the present invention includes a support 1, a wafer fixing groove 2, an LED light-emitting wafer 3 and a surface layer packaging adhesive 4, wherein the wafer fixing groove 2 is disposed on the support 1, the LED light-emitting wafer 3 is disposed on the wafer fixing groove 2, and the surface layer packaging adhesive 4 is disposed on the support 1.
Thirty groups of LED luminous wafers 3 are arranged, thirty groups of wafer fixing grooves 2 are arranged, the thirty groups of wafer fixing grooves 2 are uniformly distributed on the support 1 in a matrix manner, and the thirty groups of LED luminous wafers 3 are connected through wires.
The size of the LED light-emitting chip 3 is 1.9mm 36mm, the size of the bracket 1 is 60mm, and the surface layer packaging adhesive 4 is made of epoxy resin.
Example 1:
a manufacturing process of an LED light-emitting chip light source comprises the following steps:
the method comprises the following steps: manufacturing a wafer fixing groove 2 on the support 1 by using a laser engraving technology;
step two: after glue is dispensed at the bottom of the wafer fixing groove 2, the LED light-emitting wafer 3 is placed in the wafer fixing groove 2 to obtain an unfixed product;
step three: baking the unfixed product to obtain a fixed product;
step four: welding and conducting the LED light-emitting chip 3 on the fixed product and the bracket 1 by using a lead to obtain a semi-finished product;
step five: and wrapping the LED light-emitting wafer 3 with the pouring surface layer packaging adhesive 4 and baking to obtain a finished product.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
The present invention and its embodiments have been described above, and the description is not intended to be limiting, and the drawings are only one embodiment of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. An LED light emitting chip light source, characterized in that: the LED light-emitting device comprises a support, a wafer fixing groove, an LED light-emitting wafer and surface layer packaging glue, wherein the wafer fixing groove is formed in the support, the LED light-emitting wafer is arranged on the wafer fixing groove, and the surface layer packaging glue is arranged on the support.
2. The LED light source as claimed in claim 1, wherein: thirty groups of LED luminous wafers are arranged, thirty groups of wafer fixing grooves are arranged, the thirty groups of wafer fixing grooves are uniformly distributed on the support in a matrix manner, and the thirty groups of LED luminous wafers are connected through wires.
3. The LED light source as claimed in claim 1, wherein: the size of the LED light-emitting wafer is 1.9mm by 3.6 mm.
4. The LED light source as claimed in claim 1, wherein: the size of the scaffold is 60mm by 60 mm.
5. The LED light source as claimed in claim 1, wherein: the surface layer packaging adhesive is made of epoxy resin.
6. A manufacturing process of an LED light-emitting chip light source is characterized by comprising the following steps: the method comprises the following steps:
the method comprises the following steps: manufacturing a wafer fixing groove on the support by using a laser engraving technology;
step two: after glue is dispensed at the bottom of the wafer fixing groove, the LED light-emitting wafer is placed in the wafer fixing groove to obtain an unfixed product;
step three: baking the unfixed product to obtain a fixed product;
step four: welding and conducting the LED light-emitting chip on the fixed product and the bracket by using a lead to obtain a semi-finished product;
step five: and (5) wrapping the LED light-emitting wafer by the pouring surface layer packaging glue and baking to obtain a finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210270225.3A CN114613763A (en) | 2022-03-18 | 2022-03-18 | LED light-emitting chip light source and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210270225.3A CN114613763A (en) | 2022-03-18 | 2022-03-18 | LED light-emitting chip light source and manufacturing process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114613763A true CN114613763A (en) | 2022-06-10 |
Family
ID=81864361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210270225.3A Pending CN114613763A (en) | 2022-03-18 | 2022-03-18 | LED light-emitting chip light source and manufacturing process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114613763A (en) |
-
2022
- 2022-03-18 CN CN202210270225.3A patent/CN114613763A/en active Pending
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