CN114597300A

CN114597300A - Packaging shell, packaging body, manufacturing method of packaging body, circuit and device

Info

Publication number: CN114597300A
Application number: CN202210271893.8A
Authority: CN
Inventors: 谈宏旭; 孙平如; 魏冬寒; 苏运冠; 文达宁; 张志超
Original assignee: Shenzhen Jufei Optoelectronics Co Ltd
Current assignee: Shenzhen Jufei Optoelectronics Co Ltd
Priority date: 2022-03-18
Filing date: 2022-03-18
Publication date: 2022-06-07

Abstract

The invention relates to a packaging shell, a packaging body, a manufacturing method thereof, a circuit and a device, wherein the packaging shell comprises a substrate, a side wall and a cover plate; the substrate comprises a conductive circuit for realizing the electric connection with an external circuit, a first conductor is arranged on the side wall, and the first conductor on the side wall corresponds to the conductive circuit of the substrate and is used for being in direct contact connection with the conductive circuit; the packaging shell further comprises a second conductor which is arranged on the side wall and/or the cover plate, corresponds to the first conductor on the side wall and is used for being in direct contact connection with the first conductor; the extended portion of the second electrical conductor is also used for a direct contact connection with the first electrical connection region of the light-emitting chip. The extra operation space is not needed to be reserved for the wire bonding process, and the volume of the packaged product is favorably reduced.

Description

Packaging shell, packaging body, manufacturing method of packaging body, circuit and device

Technical Field

The invention relates to the field of device packaging, in particular to a packaging shell, a packaging body, a manufacturing method of the packaging body, a circuit and a device.

Background

With the rise of 3D (3-dimension) sensing technology in recent years, technologies such as face payment and automatic driving have begun to be popularized, and 3D sensing mainly includes a light source projector and a receiving device. The light source projector at present includes a TOF (Time of flight) package product and the like. The existing 3D sensing market application has the requirements of larger power usage, faster response speed, smaller volume and the like for the light source. However, in the existing light source, the high-power light source occupies a large volume.

Therefore, how to realize a light emitting source with a smaller volume is an urgent problem to be solved.

Disclosure of Invention

In view of the above-mentioned shortcomings of the related art, the present application aims to provide a package casing, a package body, a manufacturing method thereof, a circuit and a device, which aim to solve the problem of large volume occupied by a high-power light source in the existing light source.

A package housing, comprising: a substrate, a sidewall and a cover plate; the substrate comprises a conductive circuit for realizing the electrical connection with an external circuit, a first conductor is arranged on the side wall, and the first conductor on the side wall corresponds to the conductive circuit of the substrate and is used for being in direct contact connection with the conductive circuit; the cover plate is matched with the side wall so as to be capable of covering the side wall;

the packaging shell further comprises a second conductor which is arranged on the side wall and/or the cover plate, corresponds to the first conductor on the side wall and is used for being in direct contact connection with the first conductor; when the second conductor is in direct contact connection with the first conductor, the second conductor further extends towards the direction within the area defined by the side walls, the extending part of the second conductor is also used for being in direct contact connection with a first electric connection area of the light-emitting chip, and the first electric connection area is an electric connection area on one side, away from the substrate, of the light-emitting chip arranged behind the packaging shell.

According to the packaging shell, the first conductive bodies are arranged on the side walls, the corresponding second conductive bodies are arranged on the side walls and/or the cover plate, after the light-emitting chips are packaged, the corresponding first conductive bodies and the corresponding second conductive bodies can be in contact with each other and can be connected with the corresponding second conductive bodies and the corresponding conductive circuits, and therefore a traditional wire welding process is not needed. On the other hand, the electric conductor is arranged on the packaging shell, the light-emitting chip is packaged, meanwhile, the electric conductor of the whole packaging body can be communicated, the packaging process is simple, and the manufacturing is convenient.

It should be understood that the light emitting chip in the present application is applied to a light emitting chip in a TOF packaged product, which emits light mainly of invisible infrared light; accordingly, in some applications, the cover plate may be made of a material that can transmit light emitted from the light emitting chip in the prior art so that the light can be transmitted.

Optionally, the conductive traces of the substrate include a first conductive trace and a second conductive trace;

the first conductive circuit corresponds to the first conductor on the side wall and is used for being in direct contact connection with the first conductor;

the second conductive circuit corresponds to a second electric connection area on the light-emitting chip and is used for being in direct contact connection with the second electric connection area, and the second electric connection area is an electric connection area which is arranged on the rear side of the packaging shell and close to one side of the substrate.

Based on the same inventive concept, the application also provides a light emitting chip package, which comprises the package shell and the light emitting chip;

the side wall is arranged on one surface of the substrate, the cover plate is arranged on the side wall, the side wall enables a gap to be formed between the cover plate and the substrate, the light-emitting chip is arranged in an accommodating space formed by the cover plate, the substrate and the side wall, the first electric connection area of the light-emitting chip is far away from the substrate, and the first electric connection area is electrically connected with the conducting circuit on the substrate through the second electric conductor and the first electric conductor.

The light-emitting chip packaging body is packaged by the packaging shell, so that an extra operation space does not need to be reserved for the traditional wire bonding process, and the light-emitting chip packaging body can be designed to be compact and small in size.

Optionally, the first electrical connection region of the light emitting chip has two sub-regions respectively disposed on two opposite sides of one surface of the light emitting chip away from the substrate, the first conductor includes two sub-conductors respectively corresponding to each of the sub-regions, and each of the sub-regions is electrically connected to a corresponding one of the sub-conductors through the second conductor.

Optionally, the light-emitting chip includes a light-emitting region, projections of the light-emitting region to the substrate are located between two projections of the two sub-regions to the substrate, and a projection of the second conductor to the substrate and a projection of the light-emitting region to the substrate do not overlap each other.

Optionally, a top surface of the sidewall is flush with a surface of the first electrical connection region of the light emitting chip, the second conductor is a sheet-shaped conductive layer disposed on the cover plate and/or the top surface of the sidewall, the first conductor is exposed at least on the top surface of the sidewall to be directly contacted and connected with the sheet-shaped conductive layer, and the top surface of the sidewall is a surface of the sidewall away from the substrate.

Based on the same inventive concept, the application also provides a manufacturing method of the light-emitting chip packaging body, which comprises the steps of providing the packaging shell and the light-emitting chip matched with the packaging shell;

arranging the light-emitting chip on the substrate, wherein the first electric connection region of the light-emitting chip is positioned on one side far away from the substrate;

and enabling the substrate, the side wall and the cover plate to form an accommodating space for accommodating the light-emitting chip, and enabling the light-emitting chip to be electrically connected with the conducting circuit through the first conductor and the second conductor.

According to the manufacturing method of the light-emitting chip packaging body, the packaging shell is adopted, the electric connection arrangement of the light-emitting chip in the packaging shell is realized through the electric conductor on the packaging shell, the traditional wire bonding process is not needed, and the manufactured light-emitting chip packaging body can be designed to be compact and small in size. On the other hand, when the light-emitting chip is packaged, the communication of the conductor of the whole packaging body can be completed, independent processes such as arrangement, connection of bonding wires and the like are not needed, the packaging process is simple, and the manufacturing is convenient.

Optionally, the electrically connecting the first conductor to the second conductor and the light emitting chip includes at least one of the following steps:

arranging the cover plate provided with the second conductor on the side wall in a conductive adhesive or metal solder eutectic mode;

and arranging the side wall provided with the second conductor on the substrate.

Based on the same inventive concept, the present application also provides a circuit comprising: the LED lamp comprises a circuit board, a side wall, a cover plate and a light-emitting chip, wherein the circuit board comprises a driving circuit and a driving device, the driving circuit is connected with the driving device, a first conductor is arranged on the side wall, and the first conductor on the side wall corresponds to the driving circuit of the circuit board and is used for being connected with the driving circuit; the cover plate is matched with the side wall so as to be capable of covering the side wall;

the circuit also comprises a second conductor which is arranged on the side wall and/or the cover plate, corresponds to the first conductor on the side wall and is used for being in direct contact connection with the first conductor; when the second conductor is in direct contact connection with the first conductor, the second conductor further extends towards the direction within the area enclosed by the side walls, the extending part of the second conductor is also used for being in direct contact connection with a first electric connection area of the light-emitting chip, and the first electric connection area is an electric connection area on one side, far away from the substrate, of the light-emitting chip.

According to the circuit, the light-emitting chip of the package can be electrically connected with the substrate by utilizing the first conductor and the second conductor, so that the package of the light-emitting chip can be designed according to the size of the light-emitting chip as much as possible in structural space, an extra operation space does not need to be reserved for the traditional wire bonding process, and the occupied volume is favorably reduced. On the other hand, when the light-emitting chip is packaged, the light-emitting chip and the circuit board can be electrically connected, and the packaging process is simple and convenient to manufacture.

Based on the same inventive concept, the present application also provides a light emitting device, which includes a circuit board and a light emitting chip package, wherein the light emitting chip package includes the light emitting chip package as described above; the circuit board is provided with a circuit layer, and the conductive circuit of the light-emitting chip packaging body is electrically connected with the circuit layer;

and/or the light emitting device comprises the circuit as described above.

The light-emitting device adopts the light-emitting chip package or the circuit, and can be designed to be small in size.

Drawings

Fig. 1 is a first schematic structural diagram of a package housing according to an embodiment of the present invention;

FIG. 2 is a diagram of a related art light emitting chip package;

fig. 3 is a second schematic structural diagram of a package housing according to an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a first electrical conductor according to an embodiment of the present invention;

fig. 5 is a third schematic structural diagram of the package housing according to the embodiment of the present invention;

FIG. 6 is a schematic structural diagram of a second electrical conductor according to an embodiment of the present invention;

fig. 7 is a fourth schematic structural diagram of the package housing according to the embodiment of the present invention;

fig. 8 is a schematic structural diagram of a package housing according to an embodiment of the present invention;

fig. 9 is a sixth schematic structural view of the package housing according to the embodiment of the present invention;

fig. 10 is a first schematic structural diagram of a light emitting chip package according to an embodiment of the present invention;

fig. 11 is a second schematic structural diagram of a light emitting chip package according to an embodiment of the present invention;

fig. 12 is a third schematic structural diagram of a light emitting chip package according to an embodiment of the present invention;

fig. 13 is a fourth schematic structural diagram of a light emitting chip package according to an embodiment of the present invention;

FIG. 14 is a schematic top view of the cover plate of FIG. 12 with the cover plate omitted;

fig. 15 is a schematic flowchart of a method for manufacturing a light emitting chip package according to another alternative embodiment of the invention;

FIG. 16 is a schematic diagram of a circuit according to yet another alternative embodiment of the present invention;

fig. 17 is a first schematic structural diagram of a light-emitting device according to yet another alternative embodiment of the present invention;

fig. 18 is a schematic structural diagram of a light-emitting device according to yet another alternative embodiment of the present invention;

description of reference numerals:

1-a substrate; 2-a side wall; 21-a first step surface; 22-a second step face; 3-cover plate; 31-cover rim; 41-conductive lines; 411 — first conductive line; 412-a second conductive trace; 42-a first electrical conductor; 421-a first subconductor; 422-a second subconductor; 43-a second electrical conductor; 431-a first conductive layer; 432-a second conductive layer; 5-a light emitting chip; 51-a bonding wire; 52-a first electrode; 53-a second electrode; 54-a light emitting region; 6-a circuit board; 61-a conductive layer on a circuit board; 100-light emitting chip package.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

In the related art, the high-power TOF light source occupies a large volume, so that the application to a mobile terminal or a wearable device is limited.

Based on this, the present application intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.

Example (b):

in the present embodiment, referring to fig. 1, a substrate 1, a sidewall 2 and a cover plate 3 are provided; the substrate 1 comprises a conductive circuit 41 for realizing conductive connection with an external circuit, a first conductor 42 is arranged on the side wall 2, and the first conductor 42 on the side wall 2 corresponds to the conductive circuit 41 of the substrate 1 and is used for being in direct contact connection with the conductive circuit 41; the cover plate 3 is adapted to the side wall 2 so as to be capable of covering the side wall 2.

The packaging shell further comprises a second conductor 43, the second conductor 43 is arranged on the side wall 2 and/or the cover plate 3, the second conductor 43 corresponds to the first conductor 42 on the side wall 2 and is used for being in direct contact connection with the first conductor 42; when the second conductor 43 is directly connected to the first conductor 42, the second conductor 43 further extends toward the inside of the region surrounded by the side wall 2, and the extended portion of the second conductor 43 is also used for being directly connected to the first electrical connection region of the light emitting chip, which is the electrical connection region on the side away from the substrate 1 after the light emitting chip is disposed in the package housing.

Each part of the package housing in this embodiment can cooperate to form an accommodating space for accommodating the light emitting chip, and when the light emitting chip is packaged in the package housing, the first electrical connection region of the light emitting chip can be electrically connected to the conductive trace 41 on the substrate 1 through the second electrical conductor 43 and the first electrical conductor 42 due to the corresponding relationship among the first electrical conductor 42, the second electrical conductor 43 and the conductive trace 41. It is understood that the first conductor and the conductive trace, and the second conductor and the first conductor are corresponding in the present embodiment, including but not limited to the positions and/or numbers of the first conductor and the conductive trace, so that the first conductor and the conductive trace, and the first conductor and the second conductor are directly contacted or can be contacted under certain conditions to realize the electrical connection, for example, the second conductor is disposed on the cover plate, and the second conductor is corresponding in the positions and numbers to the first conductor, when the cover plate is disposed on the side wall, the first conductor and the second conductor can be contacted in a partial region to realize the electrical connection, or when the side wall is disposed on the substrate, at least a partial region between the first conductor and the conductive trace can be contacted to realize the electrical connection. Due to the corresponding relationship among the conductive structures, the packaging shell can be effectively connected with the light-emitting chip without an additional lead in some implementation processes, so that the problem that the traditional wire bonding process needs a certain operation space to influence the compactness of the light-emitting chip during packaging is avoided. Moreover, in order to ensure that the TOF light source normally works under high power in the conventional packaging mode, the light-emitting chip may be provided with a plurality of parallel wires.

In order to better understand the beneficial effects of the package housing and the light emitting chip package packaged by the package housing of the present embodiment, please refer to fig. 2, in some conventional packaging manners of the light emitting chip, the left and right sides of the light emitting chip 5 are respectively provided with 4 wires, i.e. bonding wires 51, which are respectively connected to the anode and the cathode of the light emitting chip 5. Since the wire is usually made of precious metal such as gold wire or silver wire, the wire diameter of the bonding wire 51 is usually small to reduce the cost, and a plurality of bonding wires 51 are needed to ensure that the light emitting chip 5 can pass large current under high-power working conditions. The bonding wires 51 need not only a certain space, but also a certain space for the bonding apparatus such as a bonding head to perform the bonding operation. Therefore, the embodiment avoids the traditional wire bonding process, and is beneficial to reducing the volume of the packaged product. Moreover, the inductance effect between these wires may affect the response speed of the light emitting chip (especially under high frequency conditions); the first conductor and the second conductor of the present embodiment are disposed on the solid structure of the package housing, so that a larger cross-sectional area is easier to form (for example, the first conductor and the second conductor may be disposed as plate-shaped conductors, and the conductors are large enough to carry a larger current, so that in some embodiments, precious metals such as gold and silver are not required to be used as conductors, and copper materials are also required), and compared with the conventional arrangement manner of multiple parallel wires, the first conductor and the second conductor of the present embodiment can ensure normal operation with fewer conductive paths than the wires in some specific implementation processes (for example, one wire may be regarded as a conductive path, and one first conductor and the second conductor connected thereto may be regarded as a conductive path), thereby helping to reduce the inductance effect between the conductive paths, and ensuring the response speed of the packaged product.

It is understood that the substrate and the sidewall are usually made of insulating materials, and in order to ensure the stability of the structure and provide protection for the light emitting chip, the substrate and the sidewall may include hard insulating materials, including but not limited to ceramics, hard insulating metals, hard insulating plastics, and the like. In practical applications, the specific shapes of the substrate and the sidewalls are not limited, but may be configured to exactly fit the size and shape of the light emitting chip in order to reduce the volume of the product. Illustratively, the sidewall may be disposed around an edge of the substrate, the sidewall having a thickness, the sidewall extending in a thickness direction of the substrate and formed with a height, which is generally not less than a height of the light emitting chip.

After the light-emitting chip is packaged, the cover plate is covered on the side wall, that is, the cover plate is fixed with the side wall, and the side wall is located between the cover plate and the substrate. It is understood that the cover plate needs to be disposed on the side wall after the light emitting chip is disposed, that is, when the light emitting chip is not disposed, the package housing in this embodiment is usually separated. However, in this embodiment, it is not limited whether the substrate and the sidewall are separated, that is, the substrate and the sidewall may be an integrally formed whole, and may be formed by combining two separated parts.

As shown in the foregoing example of fig. 1, the second conductive body 43 is disposed on the cover plate 3, and when the package housing is properly assembled, that is, when the cover plate 3 is properly covered on the sidewall 2, the first conductive body 42 and the second conductive body 43 on the sidewall 2 are in contact with each other, so as to achieve electrical connection. The portion of the second conductor 43 corresponding to the first conductor 42 is directly connected to the first conductor 42, so as to electrically connect the second conductor 43, the first conductor 42 and the conductive trace 41, and when the light emitting chip is packaged therein, the second conductor 43 is also directly connected to the first electrical connection region of the light emitting chip, so as to connect the light emitting chip to the conductive trace 41 of the substrate 1.

Referring again to fig. 3, in the example where the second conductor 43 is provided on the side wall 2, the second conductor 43 and the first conductor 42 may be directly connected to each other, or the second conductor 43 and the first conductor 42 may be integrally formed. It is understood that, when the package housing of this example is applied, the light emitting chip may be first disposed on the substrate 1, and then the sidewall 2 provided with the second conductor 43 is disposed on the substrate 1, or in some implementations, the second conductor 43 may be formed on the sidewall 2 after the light emitting chip is disposed on the substrate 1.

In fact, the specific position, shape, pattern, etc. of the conductor can be set according to the actual requirement as long as the above-mentioned function can be achieved.

In some embodiments, a first electrical conductor is disposed extending inside the side wall, and the region of the first electrical conductor for making electrical connection is exposed from both ends of the side wall. That is, the first conductor is exposed only at the part which needs to be directly contacted and connected with other conductors or conductive circuits, and the rest part is protected inside by the side wall.

As shown in fig. 4, as an example of the above-described embodiment, fig. 4 may correspond to a schematic plan view of fig. 1 with the cover plate omitted, and the first conductor 42 may be a metal plate embedded in the side wall 2, and a thickness direction of the metal plate may be aligned with a thickness direction of the side wall 2. It is understood that the first conductive body is disposed in the sidewall, so that the first conductive body can be disposed with a larger cross-sectional area, and the first conductive body can be more conditionally endured with a larger current than the bonding wire, and each first conductive body can be formed into a single and complete structure (such as a single plate-like or sheet-like structure) to avoid the inductance effect. In other embodiments, the first conductor 42 may be a metal plate that covers the inner wall of the sidewall 2 to facilitate inspection of the form of the first conductor 42.

In practical applications, if the second conductive body is disposed on the cover plate and there is no additional physical connecting structure between the cover plate and the sidewall to achieve connection matching, the second conductive body on the cover plate needs to be electrically connected to the sidewall. It should be noted that the direct contact connection in the present invention refers to a connection not through a separate conductive structure such as a wire or other conductive body, and the direct contact connection in the present invention also includes a case where a bonding material including, but not limited to, an adhesive or a welding material for helping to achieve a stable connection is provided between the connected objects. For example, the cover plate and the side wall may be directly connected in contact by means including, but not limited to, eutectic soldering with metal solder or by using conductive adhesive, for example, the metal solder or the conductive adhesive is pre-disposed in a corresponding area on the cover plate and/or the side wall, and the fixing is achieved by using the metal solder or the conductive adhesive, and at the same time, due to the conductivity of the metal solder or the conductive adhesive, the electrical connection between the first electrical conductor and the second electrical conductor is ensured while the fixing is performed. If the second conductor is disposed on the sidewall, the cover plate may be disposed on the sidewall in other conventional manners.

In other examples, the first electrical conductor may include a conductive via, a through-slot, etc., for example, a conductive layer may be disposed on an inner wall of the via, the through-slot, etc. In this example, the second conductor may include a connection structure that is matched with the conductive through hole and the conductive through groove, and the connection structure is clamped into the conductive through hole and the conductive through groove, and is fixed by matching with a physical structure.

The first conductor may be provided on the surface of the substrate or the side wall, but in order to avoid external interference, a single insulating layer may be provided on the surface of the first conductor to form protection.

For example, when the second conductor is disposed on the sidewall, it may be a conductive metal sheet, which may be directly adhered to or otherwise disposed on the top of the sidewall and in contact with the first conductor on the sidewall, or the second conductor may be a conductive structure integrally formed with the first conductor.

For example, when the second conductor is disposed on the cover plate, it may be disposed only on the surface of the cover plate, for example, a conductive metal is plated on the surface of the cover plate or a conductive metal sheet is disposed as the second conductor. The second conductor may be partially embedded in the cover plate, and as shown in fig. 5, a portion of the second conductor 43 corresponding to the first electrical connection region of the light emitting chip is exposed from the surface of the cover plate 3, a portion for electrical connection with the first conductor 42 on the side wall 2 is exposed from the surface of the cover plate 3, and the rest is provided in the cover plate 3.

It can be understood that, after the light emitting chip is packaged in the package housing of the present embodiment, the light of the light emitting chip is emitted outwards through the cover plate. Therefore, the second electric conductor can be made of light-transmitting materials, so that light can penetrate through the second electric conductor or the blocking of the second electric conductor to the light can be avoided or reduced by controlling the area where the second electric conductor is arranged.

The first electrical conductor, the second electrical conductor, and the conductive traces can comprise various conductive materials, such as various types of conductive metals, including but not limited to silver, copper, gold, aluminum, tungsten, nickel, iron, platinum, lead, palladium, tin, and the like.

As a specific example, in some embodiments, the first electrical conductor in the sidewall includes two sub-electrical conductors located on opposite sides of the sidewall (e.g., as shown in fig. 4); for example, as shown in fig. 6, the second conductor 43 also includes two conductive layers corresponding to the two sub-conductors of the first conductor one by one, and the two conductive layers are respectively provided on opposite sides of one surface of the cover plate 3 for contacting the side wall. One of the conductive layers is used for connecting with one of the sub-conductors in the first conductor and one of the first electrical connection regions in the light-emitting chip, and the other of the conductive layers is used for connecting with the other sub-conductor in the first conductor and the other first electrical connection region in the light-emitting chip. In practical applications, the shape of the conductive layer may be square, or may be other shapes.

In some embodiments, the conductive layer may include an elastic metal sheet, and may form a good electrical connection contact with the first electrical connection region of the light emitting chip. In some embodiments, the conductive layer may be a metal plating layer. In some examples, a metal material with a certain thickness and a certain ductility is used, for example, the metal material may include at least one of gold, copper, palladium, and tin to form a plating layer, and the material with a better ductility can also ensure that an effective electrical connection is formed while avoiding damage to the light emitting chip. It is understood that a non-metallic conductive material may also be applied as the conductive layer.

The cover plate is capable of emitting light, and the cover plate in the present embodiment includes, but is not limited to, an optical cover plate or a general cover plate. The optical cover plate can adjust the light of the light emitting chip, for example, the light emitted finally is more uniform, or the light emitting direction of the light is more concentrated. The light of the light-emitting chip can not be adjusted by the common cover plate, and only the functions of packaging, protection and the like are achieved, and the common cover plate can be a light-transmitting glass cover plate or a plastic cover plate and the like.

The Light Emitting chip that the package housing can be used for packaging includes but is not limited to a VCSEL (Vertical-Cavity Surface-Emitting Laser) chip, various LED (Light Emitting Diode) chips, and the like. As mentioned above, the light emitting chip is mainly a light emitting chip of invisible light applied in TOF package products, such as an infrared VCSEL chip, etc., but it is understood that in practical applications, the package housing of the present application can be applied to a light emitting chip of visible light as well. The electric connection area on the light-emitting chip comprises an electrode or an electrode pad and the like, the light-emitting direction of the light-emitting chip is on the same side with the first electric connection area, namely when the light-emitting chip is packaged in the packaging shell, the light emitted by the light-emitting chip is emitted through the cover plate.

The manner in which the conductive traces are connected to the external circuit may be arbitrary. It should be noted that the connection with the outside in this embodiment includes, but is not limited to, connection with other circuit structures or components besides the light emitting chip, that is, after the light emitting chip is packaged, the formed light emitting chip package may be electrically connected with other circuit structures or components through the conductive circuit. These circuit structures include, but are not limited to, circuits for driving the light emitting chips, which may be separate driving boards, or circuit boards integrated with various circuits.

For example, as shown in fig. 1 or fig. 3, the conductive traces 41 on the substrate 1 may extend from a surface of the substrate 1 close to the side wall 2 to a surface far from the side wall 2, that is, the conductive traces 41 penetrate through the substrate 1 and penetrate through two surfaces of the substrate 1, wherein the surface of the conductive trace 41 close to the side wall 2 is directly connected to the first conductor 42 on the side wall 2 in a contact manner, and an exposed area of the conductive trace 41 on the surface of the substrate 1 far from the side wall 2 may be used for connecting to other circuit structures or components.

In other examples, such as shown in fig. 7, the conductive trace 41 is only disposed on one side of the substrate 1 near the sidewall 2, a part of the conductive trace 41 corresponds to the first conductor 42 to achieve direct contact connection with the first conductor 42, and the rest of the conductive trace extends outward, and these outward extending regions can be used for connection with other circuit structures or components.

In some embodiments, the conductive traces of the substrate include a first conductive trace and a second conductive trace, wherein the first conductive trace corresponds to a first electrical conductor on the sidewall, and the first conductive trace is for direct contact connection with the first electrical conductor; the second conductor corresponds to the light-emitting chip, specifically to a second electrical connection region on the light-emitting chip, and is used for being in direct contact connection with the second electrical connection region, and the second electrical connection region is an electrical connection region on one side of the light-emitting chip, which is close to the substrate, after the light-emitting chip is arranged in the package housing. That is, the package housing in this embodiment may be applied to a light emitting chip of a vertical structure, such as a VCSEL or an LED chip of a vertical structure.

In some embodiments, the second electrical conductor has a thickness and is disposed between the cover and the top surface of the sidewall such that the cover and the sidewall are raised to form a gap and the second electrical conductor is also exposed to the external environment to a certain extent. In order to reduce the exposure of the second conductor, a shielding structure may be provided, which forms a shield on the side of the second conductor.

In one example, a cover rim may be formed on the cover plate, as shown in fig. 8, the cover plate 3 includes a cover rim 31 extending from a surface of the cover plate 3 to a height direction by a predetermined distance, the second conductive body 43 is provided in a region inside the cover rim 31, and an inner dimension of the cover rim 31 of the cover plate 3 matches an outer dimension of the sidewall 2. The cover rim 31 can shield the second conductor 43, so as to prevent the second conductor 43 from being directly exposed. And in some embodiments, the cover plate can apply pressure to the second electric conductor to a certain extent, so that the second electric conductor and the first electric conductor and the second electric conductor and the first electric connection area on the light-emitting chip are in direct contact connection and keep stable connection.

In another example, a step may be formed on the sidewall, as shown in fig. 9, and a side of the sidewall 2 away from the substrate 1 includes a step structure. In the step structure, the first step surface 21 near the inner side is lower in height than the second step surface 22 near the outer side; the inner dimension of the side wall 2 at the second step surface 22 is matched with the outer dimension of the cover plate 3, so that when the cover plate 3 is covered on the side wall 2, one surface of the cover plate 3 close to the substrate 1 is contacted with the first step surface 21, and the first conductor 42 is contacted with the second conductor 43 at the first step surface 21 to realize electric connection. In this example, the second conductive body 43 is shielded by the higher step on the outer side, so that the second conductive body 43 is prevented from being directly exposed.

The package shell of the embodiment is characterized in that the first conductor is arranged on the side wall, the second conductor is arranged on the cover plate, after the light-emitting chip is packaged, the first conductor and the second conductor can be utilized to realize the electric connection between the light-emitting chip and the conducting circuit on the substrate, and no bonding wire is needed. Meanwhile, in some implementation processes, the influence of the inductance effect between the bonding wires on the response speed of the light-emitting chip is reduced, and the performance of a packaged product is ensured. On the other hand, this embodiment locates the electric conductor respectively on apron and base plate, the lateral wall, when will accomplish the encapsulation to luminescent chip, can accomplish the intercommunication of the electric conductor of whole packaging body, and its packaging process is simple, the preparation of being convenient for.

In this embodiment, a light emitting chip package is further provided, as shown in fig. 10, including a light emitting chip 5 and a package housing for packaging the light emitting chip 5, where the package housing is the package housing in the foregoing example of this embodiment; it should be noted that a part of the aforementioned non-illustrated embodiments of the package housing are also further embodied in the following description of the light emitting chip package.

The side wall 2 is arranged on the substrate 1, the cover plate 3 is arranged on the side wall 2, the side wall 2 is positioned between the cover plate 3 and the substrate 1, a gap exists between the cover plate 3 and the substrate 1, an accommodating space is formed between the cover plate 3 and the substrate 1 and between the cover plate 3 and the side wall 2, the light-emitting chip 5 is arranged in the accommodating space, a first electric connection area of the light-emitting chip 5 is far away from the substrate 1 and is in contact with a part of the second electric conductor 43 corresponding to the first electric connection area so as to realize electric connection, and the first electric connection area is electrically connected with the conductive circuit 41 on the substrate 1 through the second electric conductor 43 and the first electric conductor 42.

The light emitting chips include, but are not limited to, VCSEL chips, various LED chips, and the like. The light emitting direction of the light emitting chip and the first electric connection area are on the same side, namely when the light emitting chip is packaged in the packaging shell, light emitted by the light emitting chip is emitted through the cover plate.

In some embodiments, the first electrical connection region of the light emitting chip has two sub-regions respectively disposed on two opposite sides of a surface of the light emitting chip away from the substrate, the first conductor includes two sub-conductors corresponding to each sub-region, and each sub-region is electrically connected to a corresponding sub-conductor through the second conductor.

As an example, when the packaged light emitting chip is an LED chip, the LED chip is in a forward mounting structure, that is, the light emitting direction is a side thereof provided with an electrode, and the first electrical connection region of the LED chip includes two sub-regions, namely, an anode sub-region and a cathode sub-region. The positive and negative electrodes of the LED chip are arranged on one side far away from the substrate, and the second conductor is used for being connected with at least one of the positive and negative electrodes of the LED chip. For example, as shown in fig. 11, the light emitting chip 5 may be a common forward-mounted LED chip, and taking as an example that the positive electrode and the negative electrode of the light emitting chip 5 are both packaged and connected by using the conductor of the package housing, the first conductor 42 includes two sub-conductors respectively corresponding to the first electrode 52 (one of the positive electrode and the negative electrode) and the second electrode 53 (the other of the positive electrode and the negative electrode) of the light emitting chip 5, that is, the first conductor 42 includes a first sub-conductor 421 and a second sub-conductor 422 corresponding to the two electrodes of the light emitting chip 5, and the second conductor 43 includes two conductive layers corresponding to the two sub-conductors one to one, that is, a first conductive layer 431 and a second conductive layer 432. Illustratively, the first conductive layer 431 and the first sub-conductor 421 are directly connected in contact, and the first conductive layer 431 is directly connected in contact with the first electrode 52 of the light emitting chip 5, the second conductive layer 432 is directly connected in contact with another sub-conductor (i.e. the second sub-conductor 422), and the second conductive layer 432 is directly connected in contact with the second electrode 53 of the light emitting chip 5.

As an example, when the packaged light emitting chip is in a vertical structure, such as a vertical LED chip or a vertical VCSEL chip, the anode and the cathode of the light emitting chip are disposed on opposite surfaces. The first electrical connection region of the light emitting chip includes a first electrode 52 of the light emitting chip, and the light emitting chip further includes a second electrical connection region disposed at an opposite side of the first electrical connection region. As shown in fig. 12, the conductive trace 41 of the substrate 1 includes a first conductive trace 411 and a second conductive trace 412, the first conductive trace 411 is electrically connected to a first electrical connection region on a side of the light emitting chip 5 away from the substrate 1 through a first conductor 42 and a second conductor 43, and the second conductive trace 412 is directly electrically connected to a second electrical connection region on a side of the light emitting chip 5 close to the substrate 1. The second electrical connection region includes the second electrode 53 of the light emitting chip 5, and when the light emitting chip 5 is packaged in the package housing, the second electrical connection region can be connected to the outside through the second conductive trace 412 from the side of the substrate 1 far away from the light emitting chip 5. It is to be understood that the "first electrical connection region" and the "second electrical connection region" in the present embodiment are only used to distinguish the electrical connection regions at the arrangement positions, and do not constitute a limitation on the function of the electrical connection regions. It should be noted that even if the light emitting chip is in a vertical structure, that is, includes the second electrical connection region, the first electrical connection region and/or the second electrical connection region may include more than one location, and accordingly, the first electrical conductor and the second electrical conductor on the package housing may include more than one portion corresponding to the first electrical connection region.

In some embodiments, the first electrical conductor is exposed at least at the top surface of the side wall, the height of the side wall may be equal to the height of the light emitting chip, i.e. the top surface of the side wall is flush with the surface of the first electrical connection region of the light emitting chip, and the cover plate and/or the second electrical conductor at the top surface of the side wall may be formed as a sheet-like conductive layer. As an example, the second conductive body is disposed on the cover plate, and when the cover plate is disposed, the second conductive body naturally contacts with the first electrical connection region of the light emitting chip and the first conductive body exposed from the top surface of the sidewall to form an electrical connection, which can make the cover plate more simple to manufacture, and only need to form a conductive layer with the same thickness as the second conductive body, without other complex structures. Such as forming a metal plating layer, depositing a metal film, disposing a conductive metal sheet, etc., can be easily made into the second conductor. Therefore, most manufacturing processes of the cover plate can still be manufactured according to the original process, and only one additional conductive layer is needed to be arranged to serve as a second conductor. When the second conductor is arranged on the top surface of the side wall, the cover plate can be arranged on the second conductor, and the cover plate can be easily and stably arranged on the side wall due to the fact that the second conductor is formed into the sheet-shaped conducting layer.

As shown in fig. 13, in some examples, the top surface of the sidewall 2 may also be higher than the first electrical connection region (not shown in the figure) of the light emitting chip 5, and the second conductive body 43 of the cover plate 3 includes a metal elastic sheet that elastically tilts up at a position corresponding to the first electrical connection region of the light emitting chip 5 to contact the first electrical connection region. In other examples, the second electrical conductor may contact the first electrical connection region using other resilient structures. The elastic structure enables the contact between the second conductor and the light-emitting chip not to be affected by the tolerance on the side wall and the height of the light-emitting chip, and poor contact or excessive contact is avoided to a certain extent.

Similarly, the second conductive body should also avoid affecting the light-emitting area of the light-emitting chip, for example, as indicated in the above examples, the second conductive body may be made of a light-transmitting material, and when the second conductive body is made of a light-transmitting material, the area occupied by the second conductive body may be relatively made larger, which also better ensures the coverage of the first electrical connection area of the light-emitting chip, and the requirement for the corresponding manufacturing accuracy is lower. When the light-tight material is adopted, the second electric conductor should be matched with the size of the first electric connection region of the light-emitting chip and the spacing distance between the side walls, so that the first electric connection region and the first electric conductor on the side walls can be just electrically connected and conducted, and the light emission of the light-emitting chip cannot be influenced by exceeding the first electric connection region.

In some embodiments, the first electrical connection region of the light emitting chip has two sub-regions, the two sub-regions are respectively disposed on two opposite sides of one surface of the light emitting chip away from the substrate, the light emitting chip includes a light emitting region, a projection of the light emitting region to the substrate is located between two projections of the two sub-regions to the substrate, and a projection of the second electrical conductor to the substrate does not overlap with a projection of the light emitting region to the substrate. As a specific example, please refer to fig. 14 again, in which the second conductive body 43 can be an opaque conductive metal material. In this example, the light emitting chip 5 is a VCSEL chip, two sub-regions of the first electrical connection region are the first electrode 52 (one of the positive and negative electrodes), the second electrical connection region includes the second electrode (the other of the positive and negative electrodes, not shown in the figure) electrically connected to the third electrical conductor on the substrate 1, the first electrode 52 is disposed on a side away from the substrate 1, and the first electrode 52 includes two portions disposed on two opposite sides of the surface of the light emitting chip 5, and a light emitting region of the light emitting chip 5 is located between the first electrodes 52 on the two sides. Referring to fig. 12 and 14, fig. 14 is a schematic plan view of fig. 12 with the cover plate 3 omitted, fig. 14 shows the position of the second conductor 43 by a dotted line, the second conductor 43 may be two metal pieces corresponding to the two first electrodes 52 of the light emitting chip 5, and the projection of the second conductor 43 of the cover plate 3 onto the substrate 1 does not overlap with the projection of the light emitting region 54 onto the substrate 1. That is to say, in this example, the size of the second conductive body can be controlled, so as to avoid the influence on the light emission of the light emitting chip.

The light emitting chip package provided by the embodiment adopts the package shell for packaging, does not need to reserve an additional operation space for a wire bonding process, and can be designed to be more compact and small in size; and in some implementation processes, the influence of the inductance effect between the bonding wires on the response speed of the light-emitting chip can be reduced, and the performance of a packaged product is ensured.

Another alternative embodiment of the invention:

the present embodiment provides a method for manufacturing a light emitting chip package, referring to fig. 15, including:

s101, providing a packaging shell and a light-emitting chip matched with the packaging shell;

it should be noted that the package housing provided is the package housing illustrated in the above embodiments. The light-emitting chip matched with the packaging shell comprises an accommodating space which can be arranged in the packaging shell, the position of the first electric connection area of the light-emitting chip corresponds to the second electric conductor of the cover plate, and after the cover plate is arranged, the first electric connection area of the light-emitting chip is contacted with the second electric conductor to form effective electric connection.

S102, arranging a light-emitting chip on a substrate;

the first electric connection region of the light-emitting chip is arranged on one side far away from the substrate. The light-emitting chip and the substrate can be bonded and fixed through the bonding material. In some examples, the adhesive material may be a material with good thermal conductivity, such as silicone grease, so as to conduct heat of the light emitting chip out through the substrate.

S103, enabling the substrate, the side wall and the cover plate to form an accommodating space for accommodating the light-emitting chip, and enabling the light-emitting chip to be electrically connected with the conducting circuit through the first conductor and the second conductor;

in some embodiments, the second conductor is disposed on the cover plate, the substrate and the sidewall can be pre-disposed, and the cover plate is disposed on the sidewall after the light emitting chip is disposed on the substrate.

In some embodiments, the second conductive body is disposed on the sidewall, and the light emitting chip can be disposed on the substrate first, and then the sidewall and the cover plate are sequentially disposed to encapsulate the light emitting chip; or the cover plate is arranged on the side wall in advance, and then the side wall and the cover plate are arranged on the substrate provided with the light-emitting chip.

Because the first conductor corresponds to the conducting circuit of the substrate and the second conductor corresponds to the first conductor on the side wall, the first conductor can be connected with the second conductor and the light-emitting chip as long as the light-emitting chip, the substrate, the side wall and the cover plate are reasonably arranged.

It can be seen that, in the present embodiment, the sequence of each step of the packaging process is not strictly limited, as long as the light emitting chip is accommodated by the substrate, the sidewall, and the cover plate.

In this embodiment, the manner of covering the cover plate on the side wall includes any one of the following:

the first conductor is electrically connected with the second conductor through the conductive adhesive, and the cover plate and the side wall are fixed simultaneously;

the first conductor is electrically connected with the second conductor through metal solder eutectic, and the cover plate and the side wall are fixed simultaneously.

The conductive adhesive and the metal solder not only realize electric connection, but also can ensure the overall strength while ensuring the conductive performance.

In other embodiments, the cover plate and the sidewall can be fixed by physical connection structures, such as the connection structures provided in the above embodiments. The step S103 may include the step of connecting the connection structures of the cover plate and the side wall in a matching manner.

In the method for manufacturing the light emitting chip package provided by the embodiment, by using the package housing of the embodiment, the first conductor is electrically connected with the second conductor, so that the light emitting chip is electrically connected in the package housing, a wire bonding process is not required, and the manufactured light emitting chip package can be designed to be compact and small in size; and in some implementation processes, the influence of the inductance effect between the bonding wires on the response speed of the light-emitting chip can be reduced, and the performance of a packaged product is ensured. On the other hand, the cover plate is covered by the packaging structure, meanwhile, the communication of the conductor of the whole packaging body can be completed, independent processes such as arrangement and connection of bonding wires are not needed, the packaging process is simple, and the packaging structure is convenient to manufacture.

Yet another alternative embodiment of the invention:

the present embodiment provides a circuit, as shown in fig. 16, the circuit includes a circuit board 6, a side wall 2, a cover plate 3 and a light emitting chip 5, the circuit board 6 includes a driving circuit and a driving device, the driving circuit is connected to the driving device, a first conductive body 42 is disposed on the side wall 2, the first conductive body 42 on the side wall 2 corresponds to the driving circuit of the circuit board 6 and is used for being connected to the driving circuit; the cover plate 3 is matched with the side wall 2 so as to be capable of covering the side wall 2;

the circuit further comprises a second conductor 43, the second conductor 43 is arranged on the side wall 2 and/or the cover plate 3, the second conductor 43 corresponds to the first conductor 42 on the side wall 2 and is used for being in direct contact connection with the first conductor 42; when the second conductor 43 is directly connected to the first conductor 42, the second conductor 43 further extends in a direction within the area surrounded by the side wall 2, and the extended portion of the second conductor 43 is also used for being directly connected to a first electrical connection area of the light emitting chip 5, which is an electrical connection area on the side of the light emitting chip 5 away from the circuit board 6.

Similar to the light emitting chip package of the previous embodiment, the circuit of the present embodiment electrically connects the light emitting chip and the driving circuit on the circuit board through the first conductive body on the sidewall and the second conductive body on the sidewall and/or the cover plate. Unlike the light emitting chip package of the previous embodiment, the light emitting chip in the circuit of the present embodiment does not form an independent package device, but is directly disposed and packaged on a molded circuit board.

Similarly, the circuit of the embodiment can package the light emitting chip thereon without performing a wire bonding process, which is beneficial to reducing the volume occupied by the light emitting chip on the circuit board, and thus is also beneficial to reducing the overall volume of the circuit. Meanwhile, in some implementation processes, the influence of the inductance effect between the bonding wires on the response speed of the light-emitting chip is reduced, and the performance of a packaged product is ensured. On the other hand, when the light-emitting chip is packaged, the light-emitting chip and the circuit board can be electrically connected, and the packaging process is simple and convenient to manufacture.

In an embodiment, the light emitting device includes the circuit described in this embodiment.

In another embodiment, as shown in fig. 17, the light emitting device includes a circuit board 6 and a light emitting chip package 100, and the light emitting chip package 100 includes the light emitting chip package of the example shown in the above embodiment. The conductive traces 41 of the light emitting chip package 100 are electrically connected to the circuit layer 61 on the circuit board. For example, as shown in fig. 18, a through hole is formed in the circuit board 6, the light emitting chip package is disposed at the position of the through hole, the conductive trace 41 of the light emitting chip package 100 is electrically connected to the circuit layer 61 on the circuit board, in this example, the circuit layer 61 on the circuit board is located on the bottom surface of the circuit board 6 (with reference to the direction shown in the figure), the conductive trace 41 of the light emitting chip package 100 does not need to penetrate through both surfaces of the substrate, and the conductive trace 41 extends in the direction away from the light emitting chip on the surface provided with the side wall, and is connected to the circuit board 6 through the extended region.

It is understood that, in the same light emitting device, both of the above two embodiments may be used, that is, the light emitting chip may be formed as an independent light emitting chip package and then disposed on the circuit board, or the light emitting chip may be directly packaged on the circuit board by using the side wall and the cover plate, or a part of the light emitting chip in the light emitting device adopts the former embodiment and another part of the light emitting chip adopts the latter embodiment. The light-emitting device comprises at least one circuit board, and the light-emitting chips packaged in different embodiments can be arranged on the same circuit board or different circuit boards, but the side walls and the cover plate between the light-emitting chips in different packaging forms are usually independent. The circuit board in this embodiment and the substrate in the light emitting chip package may be made of the same or different materials, and the main difference is that the circuit board in this embodiment generally refers to a carrier board provided with a conductive pattern such as a circuit layer and provided with other electronic components besides the light emitting chip such as, but not limited to, a driving device, and the substrate in the light emitting chip package is only used for carrying the light emitting chip and a portion such as a package housing for packaging the light emitting chip, such as a sidewall or other structures for packaging the light emitting chip.

In some embodiments, the light emitting chip of the light emitting chip package includes a second electrical connection region disposed on an opposite side of the first electrical connection region, and the substrate includes a third electrical conductor that is also electrically connected to a circuit layer on the circuit board.

Illustratively, the circuit board may include a driving circuit for driving the light emitting chip, and the driving circuit is electrically connected to the light emitting chip package for driving and controlling the light emitting chip in the light emitting chip package.

The light emitting device of the present embodiment includes various electronic devices capable of emitting light, including, for example, but not limited to, an illumination device, an advertisement board, a display, a 3D sensing device including a light source projector, and the like. The light-emitting device of the embodiment adopts the light-emitting chip package, can be designed to be small in size, can reduce the influence of the inductance effect between the bonding wires on the response speed of the light-emitting chip in some implementation processes, and has good performance.

The light emitting chip package provided in the foregoing embodiment can be applied to various light emitting fields, for example, the light emitting chip package can be manufactured into a backlight module applied to a display backlight field (which can be a backlight module of a terminal such as a television, a display, a mobile phone, and the like). It can be applied to a backlight module at this time. The touch screen can be applied to the field of display backlight, key backlight, shooting, household lighting, medical lighting, decoration, automobile, traffic, sensing and the like. When the LED backlight source is applied to the key backlight field, the LED backlight source can be used as a key backlight light source of mobile phones, calculators, keyboards and other devices with keys; when the camera is applied to the field of shooting, a flash lamp of a camera can be manufactured; when the lamp is applied to the field of household illumination, the lamp can be made into a floor lamp, a table lamp, an illuminating lamp, a ceiling lamp, a down lamp, a projection lamp and the like; when the lamp is applied to the field of medical illumination, the lamp can be made into an operating lamp, a low-electromagnetic illuminating lamp and the like; when the decorative material is applied to the decorative field, the decorative material can be made into various decorative lamps, such as various colored lamps, landscape illuminating lamps and advertising lamps; when the material is applied to the field of automobiles, the material can be made into automobile lamps, automobile indicating lamps and the like; when the lamp is applied to the traffic field, various traffic lights and various street lamps can be manufactured; when the sensor is applied to the sensing field, a 3D sensing light source can be manufactured to be used as a light source projector of the 3D sensing technology. The above applications are only a few applications exemplified by the present embodiment, and it should be understood that the applications of the light emitting chip package in the present embodiment are not limited to the above exemplified fields.

It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.

Claims

1. A package housing, comprising:

a substrate, a sidewall and a cover plate; the substrate comprises a conductive circuit for realizing the electrical connection with an external circuit, a first conductor is arranged on the side wall, and the first conductor on the side wall corresponds to the conductive circuit of the substrate and is used for being in direct contact connection with the conductive circuit; the cover plate is matched with the side wall so as to be capable of covering the side wall;

2. The package housing of claim 1, wherein the conductive traces of the substrate comprise a first conductive trace and a second conductive trace;

3. A light emitting chip package comprising the package body of claim 1 or 2, and a light emitting chip;

the side wall is arranged on one surface of the substrate, the cover plate is arranged on the side wall, the side wall enables the cover plate and the substrate to form a gap, the light-emitting chip is arranged in an accommodating space formed by the substrate, the side wall and the cover plate, the first electric connection area of the light-emitting chip is far away from the substrate, and the first electric connection area is electrically connected with the conducting circuit on the substrate through the second electric conductor and the first electric conductor.

4. The light emitting chip package according to claim 3, wherein the first electrical connection region of the light emitting chip has two sub-regions respectively disposed on two opposite sides of a surface of the light emitting chip away from the substrate, the first electrical conductor includes two sub-electrical conductors respectively corresponding to each of the sub-regions, and each of the sub-regions is electrically connected to a corresponding one of the sub-electrical conductors through the second electrical conductor.

5. The light-emitting chip package according to claim 4, wherein the light-emitting chip includes a light-emitting region, projections of the light-emitting region to the substrate are located between two projections of the two sub-regions to the substrate, and a projection of the second conductor to the substrate does not overlap with a projection of the light-emitting region to the substrate.

6. The light emitting chip package according to any one of claims 3 to 5, wherein a top surface of the sidewall is flush with a surface of the first electrical connection region of the light emitting chip, the second electrical conductor is a sheet-like conductive layer provided on the cover plate and/or the top surface of the sidewall, the first electrical conductor is exposed at least on the top surface of the sidewall to be in direct contact with the sheet-like conductive layer, and the top surface of the sidewall is a surface of the sidewall away from the substrate.

7. A method for manufacturing a light emitting chip package, comprising providing the package body of claim 1 or 2 and a light emitting chip adapted to the package body;

8. The method of claim 7, wherein the electrically connecting the first conductor to the second conductor and to the light emitting chip comprises at least one of:

9. A circuit, comprising: the LED lamp comprises a circuit board, a side wall, a cover plate and a light-emitting chip, wherein the circuit board comprises a driving circuit and a driving device, the driving circuit is connected with the driving device, a first conductor is arranged on the side wall, and the first conductor on the side wall corresponds to the driving circuit of the circuit board and is used for being connected with the driving circuit; the cover plate is matched with the side wall so as to be capable of covering the side wall;

the circuit also comprises a second conductor which is arranged on the side wall and/or the cover plate, corresponds to the first conductor on the side wall and is used for being in direct contact connection with the first conductor; when the second conductor is in direct contact connection with the first conductor, the second conductor also extends towards the direction within the area surrounded by the side wall, the extending part of the second conductor is also used for being in direct contact connection with a first electric connection area of the light-emitting chip, and the first electric connection area is an electric connection area on one side, away from the circuit board, of the light-emitting chip.

10. A light emitting device comprising a circuit board and a light emitting chip package, wherein the light emitting chip package comprises the light emitting chip package according to any one of claims 3 to 6; the circuit board is provided with a circuit layer, and the conductive circuit of the light-emitting chip packaging body is electrically connected with the circuit layer;

and/or the light emitting device comprises the circuit of claim 9.