CN115348728A - Circuit board assembly and circuit board assembly preparation method - Google Patents
Circuit board assembly and circuit board assembly preparation method Download PDFInfo
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- CN115348728A CN115348728A CN202211038861.XA CN202211038861A CN115348728A CN 115348728 A CN115348728 A CN 115348728A CN 202211038861 A CN202211038861 A CN 202211038861A CN 115348728 A CN115348728 A CN 115348728A
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- circuit board
- emitting element
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
The invention discloses a circuit board assembly and a circuit board assembly preparation method, wherein the circuit board assembly comprises: the substrate is provided with a first surface, and one side of the first surface is provided with a containing groove; the chip is arranged in the accommodating groove; and the light-emitting element is arranged on the first surface, the light-emitting element is electrically connected with the chip, and the light-emitting element and the chip are arranged in a staggered manner along the direction parallel to the first surface. In the direction that is on a parallel with the first surface, light emitting component and chip dislocation set, light emitting component and chip layering set promptly, through setting up the chip sinks for light emitting component, in order to avoid the chip to cause the light-emitting of light emitting component to shelter from, and simultaneously, because the chip can not cause the light-emitting of light emitting component to shelter from, therefore, compare in the correlation technique, light emitting component and chip also need not set up great distance again, the dark space that corresponds has been avoided appearing between light emitting component and chip, can increase light emitting component's density of setting, improve circuit board assembly's luminous intensity.
Description
Technical Field
The invention belongs to the technical field of electronic products, and particularly relates to a circuit board assembly and a circuit board assembly manufacturing method.
Background
The liquid crystal display device is a flat panel display device, and the working principle of the liquid crystal display device is that various light and shade changes are generated by utilizing the modulation effect of a liquid crystal material on light under the action of an electric field so as to form images. Since the liquid crystal material itself does not emit light, the liquid crystal display device requires a special backlight module.
The backlight module is one of the key components of the liquid crystal display device, and the main function of the backlight module is to provide uniform and high-brightness backlight for the liquid crystal display panel. The basic principle of the backlight module is to convert a commonly used point-type or linear luminous body into a surface luminous body with high brightness and uniform gray scale through an effective light mechanism, so that the liquid crystal display panel can normally display images.
The backlight module can be divided into a direct type backlight module and a side type backlight module according to the distribution position of the light source. In the direct type backlight module, the problem of dark space formed by the light emitted from the light emitting element is caused by the structural limitation of the existing circuit board assembly.
Therefore, a new circuit board assembly and a method for manufacturing the circuit board assembly are needed.
Disclosure of Invention
The embodiment of the invention provides a circuit board assembly and a circuit board assembly manufacturing method, wherein a chip is arranged in a sinking mode relative to a light-emitting element, so that the light-emitting of the light-emitting element is prevented from being shielded by the chip, and meanwhile, the light-emitting of the light-emitting element is not shielded by the chip.
In a first aspect, an embodiment of the present invention provides a circuit board assembly, including: the substrate is provided with a first surface, and one side of the first surface is provided with a containing groove; the chip is arranged in the accommodating groove; and the light-emitting element is arranged on the first surface, is electrically connected with the chip, and is arranged in a staggered manner along the direction parallel to the first surface.
In a second aspect, an embodiment of the present invention provides a method for manufacturing a circuit board assembly, including: providing a substrate having a first surface; forming a containing groove on the first surface, and placing a chip in the containing groove; and forming a light-emitting element on the first surface, wherein the light-emitting element is electrically connected with the chip, and the light-emitting element and the chip are arranged in a staggered mode along the direction parallel to the first surface.
Compared with the prior art, the circuit board assembly provided by the embodiment of the invention comprises the substrate, the chip and the light-emitting element, wherein the chip is arranged in the accommodating groove of the substrate, the light-emitting element is arranged on the first surface, the light-emitting element and the chip are arranged in a staggered manner in the direction parallel to the first surface, namely the light-emitting element and the chip are arranged in a layered manner, the chip is arranged in a sinking manner relative to the light-emitting element so as to avoid the shielding of the chip on the light-emitting of the light-emitting element, and meanwhile, the chip can not shield the light-emitting of the light-emitting element, so that compared with the prior art, the light-emitting element and the chip do not need to be arranged at a larger distance, the corresponding dark space between the light-emitting element and the chip is avoided, meanwhile, the arrangement density of the light-emitting element can be increased, and the light-emitting intensity of the circuit board assembly is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a diagram illustrating a structure of a film layer of a circuit board assembly according to an embodiment of the related art;
FIG. 2 is a schematic diagram of a circuit board assembly provided in accordance with one embodiment of the present invention;
FIG. 3 isbase:Sub>A diagram ofbase:Sub>A film layer structure ofbase:Sub>A circuit board assembly provided by one embodiment at A-A in FIG. 2;
FIG. 4 isbase:Sub>A diagram of film layers ofbase:Sub>A circuit board assembly provided in another embodiment at A-A of FIG. 2;
FIG. 5 isbase:Sub>A diagram of film layers ofbase:Sub>A circuit board assembly provided in yet another embodiment at A-A in FIG. 2;
FIG. 6 isbase:Sub>A diagram of film layers ofbase:Sub>A circuit board assembly provided in yet another embodiment at A-A in FIG. 2;
FIG. 7 isbase:Sub>A diagram of film layers ofbase:Sub>A circuit board assembly provided in yet another embodiment at A-A in FIG. 2;
fig. 8 is a flowchart of a method for manufacturing a circuit board assembly according to an embodiment of the invention.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" comprises 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
Referring to fig. 1, fig. 1 is a diagram illustrating a structure of a film layer of a circuit board assembly according to an embodiment of the related art; in the related art, the chip 2 and the light emitting element 3 disposed on the circuit board are generally disposed on the same side, the arrangement mode is generally that the chip 2 is centered, and the light emitting element 3 is arranged on the periphery of the chip 2, but because the external dimension of the conventional chip 2 is much larger than that of the light emitting element 3, a certain distance is required to be left between the light emitting element 3 and the chip 2 to ensure that the light emitted from the light emitting element 3 is not blocked by the chip 2; because a certain distance needs to be left between the light emitting element 3 and the chip 2, a corresponding dark area is formed above the chip 2, which affects the light emitting effect of the circuit board assembly.
In order to solve the above problem, in the embodiment of the present invention, the chip 2 is disposed in a sinking manner with respect to the light emitting element 3, so as to prevent the chip 2 from blocking the light emitted from the light emitting element 3, and a dark area is not formed.
For a better understanding of the present invention, a circuit board assembly and a method for manufacturing the circuit board assembly according to an embodiment of the present invention will be described in detail below with reference to fig. 1 to 8.
Referring to fig. 2 to 3, fig. 2 is a schematic structural diagram of a circuit board assembly according to an embodiment of the invention; fig. 3 isbase:Sub>A diagram ofbase:Sub>A film layer structure ofbase:Sub>A circuit board assembly provided by an embodiment atbase:Sub>A-base:Sub>A in fig. 2.
An embodiment of the present invention provides a circuit board assembly, including: the substrate comprises a substrate 1, wherein the substrate 1 is provided with a first surface P1, and one side of the first surface P1 is provided with a containing groove C; the chip 2 is arranged in the accommodating groove C; and a light emitting element 3 provided on the first surface P1, the light emitting element 3 and the chip 2 being electrically connected, and the light emitting element 3 and the chip 2 being arranged in a shifted manner in a direction parallel to the first surface P1.
The circuit board assembly provided by the embodiment of the invention comprises a substrate 1, a chip 2 and a light-emitting element 3, wherein the chip 2 is arranged in an accommodating groove C of the substrate 1, the light-emitting element 3 is arranged on a first surface P1, and the light-emitting element 3 and the chip 2 are arranged in a staggered manner along a direction parallel to the first surface P1, namely the light-emitting element 3 and the chip 2 are arranged in a layered manner, the chip 2 is arranged in a sinking manner relative to the light-emitting element 3 so as to avoid the light-emitting element 3 from being shielded by the chip 2, and meanwhile, the light-emitting element 3 and the chip 2 do not need to be arranged at a larger distance compared with the related technology because the chip 2 cannot shield the light-emitting element 3, so that a corresponding dark space between the light-emitting element 3 and the chip 2 is avoided, meanwhile, the arrangement density of the light-emitting element 3 can be increased, and the light-emitting intensity of the circuit board assembly is improved.
In this embodiment, since the chip 2 is disposed in the accommodating groove C, the chip 2 is less likely to be damaged due to the protection of the accommodating groove C, and the reliability of the circuit board assembly is improved.
In the related art, there is a structure form in which the chip 2 and the light emitting element 3 are respectively disposed on two opposite surfaces of the substrate 1, but since the chip 2 and the light emitting element 3 are respectively disposed on two opposite surfaces of the substrate 1, a double-sided printing process is required for molding, but there is a problem that multiple times of "reflow soldering" of double-sided components causes the devices to fall off. The accommodating groove C in this embodiment is also disposed on the first surface P1, that is, the light emitting element 3 and the chip 2 are located on the same side surface of the substrate 1, and can be formed by a single-sided printing process, so as to avoid the problem of device falling caused by reflow soldering.
The Light Emitting element 3 may be a Micro LED (Micro Light Emitting Diode) or a Mini-LED (small Light Emitting Diode). The Micro LED and the Mini-LED have the advantages of small size, high luminous efficiency, low energy consumption and the like, the size of the Micro LED is smaller than 50 mu m, and the size of the Mini-LED is smaller than 100 mu m.
In some alternative embodiments, the light emitting element 3 and the chip 2 are connected by a wire 4 provided in the substrate 1. It can be understood that, since the chip 2 is disposed in the containing groove C, in order to facilitate connection with the light emitting element 3, a via hole needs to be disposed in the substrate 1, and the electrical connection between the light emitting element 3 and the chip 2 is realized through the wire 4 disposed in the via hole, and the wire 4 may be made of opaque metal with low resistivity, such as copper, aluminum, and the like.
As shown in fig. 3, in some alternative embodiments, the accommodating cavity C has a second surface P2 parallel to the first surface P1, the chip 2 is disposed on the second surface P2, and the wires 4 include a first wire 41 and a second wire 42 connected to each other; the first wire 41 extends in a direction parallel to the second surface P2 and has one end electrically connected to the chip 2, and the second wire 42 extends in a direction perpendicular to the second surface P2 and has one end electrically connected to the light emitting element 3.
It should be noted that the second surface P2 may be understood as a bottom surface of the receiving cavity C, the chip 2 may be fixed on the second surface P2 by means of an adhesive, and the first conductive line 41 extends along a direction parallel to the second surface P2, and one end of the first conductive line 41 is electrically connected to the chip 2, so that the first conductive line 41 at least partially extends to the receiving cavity C, and thus the first conductive line 41 may be formed by etching and other processes after the receiving cavity C is formed, and the second conductive line 42 extends along a direction perpendicular to the second surface P2, that is, the second conductive line 42 is vertically disposed, and thus a via hole may be formed by means of etching and other processes for the second conductive line 42 to pass through. The chip 2 and the light emitting element 3 are connected in sequence by a first wire 41 and a second wire 42.
Referring to fig. 4, fig. 4 isbase:Sub>A diagram illustratingbase:Sub>A film structure ofbase:Sub>A circuit board assembly according to another embodiment atbase:Sub>A-base:Sub>A in fig. 2; in some alternative implementations, in a direction perpendicular to the first surface P1, the substrate 1 includes n insulating layers 11 and a metal layer 12 located between two adjacent insulating layers 11, n being an integer greater than or equal to 2; the first conductive line 41 and any one of the metal layers 12 are provided in the same layer.
It can be understood that, the substrate 1 is generally formed by sequentially stacking a plurality of insulating layers 11 and a plurality of metal layers 12, in order to reduce the production cost, a user may etch and pattern a portion of the metal layer 12 to form a desired conductive structure on the metal layer 12, in this embodiment, the first conductive line 41 and any one of the metal layers 12 are disposed on the same layer, specifically, the first conductive line 41 may be formed by the same process as the one of the metal layer 12, or a portion of the metal layer 12 may be formed by a process such as etching to form the first conductive line 41 correspondingly, so as to reduce the production cost, for example, when the substrate 1 includes two insulating layers 11 and two metal layers 12, the first conductive line 41 may be formed on the lower second metal layer 12, so as to form the accommodating groove C.
The metal layer 12 may be made of an opaque metal having a low resistivity, such as copper, aluminum, or the like. The insulating layer 11 may be made of glass fiber, which is an inorganic non-metallic material with excellent performance. The components are silicon dioxide, aluminum oxide, calcium oxide, boron oxide, magnesium oxide, sodium oxide and the like.
Specifically, the substrate 1 in the embodiment of the present invention is a multilayer board in which more single-sided or double-sided wiring boards are used to increase the area in which wiring can be routed. A printed circuit board with two surfaces as inner layer and two single surfaces as outer layer or two printed circuit boards with two surfaces as inner layer and two single surfaces as outer layer is used, and the printed circuit boards are alternately connected together by a positioning system and an insulating binding material, and the conductive patterns are interconnected according to the design requirement, so that the printed circuit board becomes a four-layer or six-layer printed circuit board, also called a multilayer printed circuit board. The number of layers of the board does not represent that there are several independent wiring layers, and in special cases, empty layers are added to control the board thickness, and the number of layers is usually even and includes two outermost layers. The substrate 1 in the present embodiment may specifically have a structure of 4 to 8 layers formed of the metal layer 12 and the insulating layer 11, and is not particularly limited.
As the chip 2 does not affect the light emitted from the light emitting element 3, the minimum distance between the light emitting element 3 and the chip 2 can be adjusted according to actual needs, and referring to fig. 3, optionally, in a direction parallel to the first surface P1, the minimum distance a between the light emitting element 3 and the chip 2 ranges from 0mm to 0.2mm. Considering that the light emitting element 3 and the chip 2 need to be connected by the wire 4, the minimum distance a between the light emitting element 3 and the chip 2 is not too small for the convenience of arranging the wire 4, and optionally, the minimum distance a between the light emitting element 3 and the chip 2 is 0.1mm.
In order to avoid the influence of the chip 2 on the light emitted from the light emitting element 3, the chip 2 may be entirely sunk in the accommodating groove C, that is, the chip 2 may not be exposed from the accommodating groove C, specifically, the depth of the accommodating groove C is greater than the height of the chip 2 in the direction perpendicular to the first surface P1. In this embodiment, because the depth of the accommodating groove C is greater than the height of the chip 2, that is, the upper surface of the chip 2 is lower than the first surface P1 of the substrate 1, the chip 2 can be effectively prevented from being damaged due to the external influence. Of course, the depth of the containing groove C may also be equal to the height of the chip 2, i.e. the upper surface of the chip 2 is flush with the first surface P1, as shown in fig. 5.
Referring to fig. 3 to 7, in consideration of the difficulty of manufacturing, the light emitting element 3 and the chip 2 may not overlap in a direction perpendicular to the first surface P1.
It can be understood that, since the chip 2 is disposed in the containing groove C and the light emitting element 3 is disposed on the first surface P1, if the light emitting element 3 and the chip 2 are overlapped in a direction perpendicular to the first surface P1, the light emitting element 3 may also be partially disposed in the containing groove C, which affects the fixing stability of the light emitting element 3, and at the same time, the electrical connection between the light emitting element 3 and the chip 2 is not facilitated, so that the present embodiment can reduce the manufacturing difficulty and improve the fixing stability of the light emitting element 3 by making the light emitting element 3 and the chip 2 not overlapped in the direction perpendicular to the first surface P1.
In order to increase the distribution density of the light emitting elements 3 and facilitate the zone control of the light emitting elements 3, optionally, a single chip 2 and at least two light emitting elements 3 are electrically connected. The single chip 2 can control the light emission of the plurality of light emitting elements 3 at the same time, so that the number of the required chips 2 can be reduced, the production cost is reduced, more light emitting elements 3 can be arranged on the substrate 1, and the distribution density of the light emitting elements 3 is effectively improved. Alternatively, a single chip 2 may be electrically connected to four light emitting elements 3, and the light emitting elements 3 are uniformly arranged around the connected chip 2 to improve the uniformity of the emitted light from the light emitting elements 3.
Referring to fig. 2, in order to improve the uniformity of the light emitted from the light emitting elements 3, optionally, the minimum distances b between two adjacent light emitting elements 3 are equal in the light emitting elements 3 arranged in the same direction. Note that, in addition to the minimum distances b between the light emitting elements 3 connected to the same chip 2 being equal, the minimum distances b between the adjacent light emitting elements 3 arranged in the same direction are also equal in the light emitting elements 3 connected to the adjacent two chips 2. Optionally, the light emitting elements 3 are respectively arranged along a first direction X and a second direction Y, the second direction Y is perpendicular to the first direction X, the minimum distances b between two adjacent light emitting elements 3 are equal along the first direction X, and the minimum distances b between two adjacent light emitting elements 3 are equal along the second direction Y, so as to improve the light emitting uniformity of the circuit board assembly.
Referring to fig. 2, in some alternative embodiments, the chips 2 are arranged in an array on the substrate 1, and the light emitting elements 3 are uniformly disposed around the chips 2. In this embodiment, the chips 2 may be arranged in an array to form a corresponding shape according to the corresponding shape of the substrate 1, that is, the shape formed by arranging each chip 2 matches with the shape of the substrate 1, for example, when the substrate 1 is rectangular, the shape formed by arranging each chip 2 is also rectangular, so as to facilitate the arrangement of the chips 2 on the substrate 1. Light emitting component 3 evenly sets up around chip 2, and each light emitting component 3 that specifically can understand to be connected with same chip 2 evenly sets up around chip 2 connected, for example when chip 2 is the rectangle at base plate 1's orthographic projection, four light emitting component 3 that are connected with chip 2 can correspond four angle settings of chip 2 to improve light emitting component 3's setting regularity, the luminous control of chip 2 of being convenient for, and improve circuit board assembly's light-emitting homogeneity.
Referring to fig. 2 to 7, fig. 6 isbase:Sub>A diagram illustratingbase:Sub>A film structure ofbase:Sub>A circuit board assembly according to another embodiment atbase:Sub>A-base:Sub>A in fig. 2; fig. 7 isbase:Sub>A film structure diagram ofbase:Sub>A circuit board assembly provided by yet another embodiment atbase:Sub>A-base:Sub>A in fig. 2.
In order to realize the light emission control of the light emitting element 3, in some alternative embodiments, the light emitting element 3 includes a first electrode 32 and a second electrode 33, the first electrode 32 is electrically connected to the chip 2 through the wire 4, and each light emitting element 3 is electrically connected to the power line 5 through the second electrode 33.
It can be understood that the chip 2 sends the conducting signal to the first electrode 32 through the conducting wire 4 to control the lighting and extinguishing of the light emitting elements 3, and can control the brightness of the light emitting elements 3 by adjusting the voltage of the conducting signal, and each light emitting element 3 is electrically connected to the power line 5 through the second electrode 33, and the external power source can send the power signal to the light emitting element 3 through the power line 5, so that the light emitting element 3 can be lighted.
Alternatively, the LED light emitting element 3 is divided into a front mount structure, a vertical structure, and a flip-chip structure. The embodiment of the invention is suitable for LEDs with a forward mounting structure, a vertical structure and an inverted structure. Optionally, the light emitting element 3 further includes a body portion 31, the first electrode 32 and the second electrode 33 are electrically connected to the body portion 31, and the body portion 31 includes an N-type GaN layer, an active layer, a P-type GaN layer, and may further include a sapphire substrate and the like.
Specifically, the first electrode 32 and the second electrode 33 of the light emitting element 3 in the forward mounting structure and the flip-chip structure are both located on the same side of the body portion 31, and thus the light emitting element 3 in the forward mounting structure and the flip-chip structure has the first electrode 32 and the second electrode 33 facing the substrate 1. The first electrode 32 and the second electrode 33 of the vertical-structured light-emitting element 3 are respectively disposed on two sides of the main body 31, so that only one electrode of the vertical-structured light-emitting element 3 is located on the side of the main body 31 facing the substrate 1, for example, the first electrode 32 of the vertical-structured light-emitting element 3 is located on the side of the main body 31 facing the substrate 1 and is electrically connected to the chip 2, and the second electrode 33 is electrically connected to the power line 5.
Referring to fig. 6, in some optional embodiments, the circuit board assembly further includes an encapsulant layer 6, the encapsulant layer 6 covers a portion of the first surface P1 where the light emitting element 3 is not disposed, the chip 2 faces the first surface P1 side, and the encapsulant layer is filled in a gap between the chip 2 and the accommodating groove C.
It can be understood that, by providing the encapsulating adhesive layer 6, on one hand, the stability of fixing the light emitting element 3 and the chip 2 can be improved, and on the other hand, the light emitting element 3 and the chip 2 can also be protected, and optionally, the encapsulating adhesive layer 6 may be made of a resin material, and may also be made of other adhesive materials, which is not limited in the embodiment of the present invention.
Since the light transmittance of the encapsulating adhesive layer 6 is relatively low, in order to avoid the encapsulating adhesive layer 6 from affecting the light emitting effect of the light emitting element 3, the encapsulating adhesive layer 6 needs to be prevented from covering the light emitting element 3, that is, the encapsulating adhesive layer 6 covers the portion of the first surface P1 where the light emitting element 3 is not disposed, so as to avoid the light emitting element 3. And the packaging adhesive layer 6 also needs to cover one side of the chip 2 facing the first surface P1 and fill the gap between the chip 2 and the accommodating groove C, so that the flatness of the side of the circuit board assembly provided with the light-emitting element 3 and the chip 2 can be improved while the chip 2 is fixed and protected.
Referring to fig. 7, in consideration that the light emitted from the light emitting element 3 is partially reflected to the substrate 1, in order to improve the utilization rate of the light emitted from the light emitting element 3, in some optional embodiments, the circuit board assembly further includes a reflective layer 7, and the reflective layer 7 covers a side surface of the encapsulation adhesive layer 6 away from the substrate 1.
In this embodiment, part of the light emitted from the light emitting element 3 to the substrate 1 is reflected by the reflective layer 7, so that the emitted light is emitted in a direction away from the substrate 1, thereby effectively improving the utilization rate of the emitted light of the light emitting element 3, the reflective layer 7 can be specifically made of a material with a high refractive index by a spraying process, for example, a metal material such as silver, copper, aluminum, or a resin material such as modified epoxy resin, the thickness of the reflective layer 7 formed by the spraying process is relatively reduced, the thickness of the reflective layer 7 can be ensured to be less than 0.1mm, and the overall thickness of the circuit board assembly is effectively reduced. Of course, the reflective layer 7 may be a conventional reflective sheet to reflect light, and is not particularly limited.
Referring to fig. 8, an embodiment of the present invention further provides a method for manufacturing a circuit board assembly, including:
s110: providing a substrate 1, wherein the substrate 1 is provided with a first surface P1;
s120: forming a containing groove C on the first surface P1, and placing the chip 2 in the containing groove C;
s130: the light emitting element 3 is formed on the first surface P1, the light emitting element 3 and the chip 2 are electrically connected, and the light emitting element 3 and the chip 2 are arranged by being shifted in a direction parallel to the first surface P1.
In the method for manufacturing a circuit board assembly according to the embodiment of the present invention, the accommodating groove C is formed in the first surface P1 of the substrate 1, and the chip 2 is disposed in the accommodating groove C, so that the light emitting element 3 and the chip 2 are disposed in a staggered manner in a direction parallel to the first surface P1, that is, the light emitting element 3 and the chip 2 are disposed in a layered manner, and the chip 2 is disposed in a manner of sinking relative to the light emitting element 3, so as to prevent the chip 2 from shielding the light emitted from the light emitting element 3, and meanwhile, since the chip 2 does not shield the light emitted from the light emitting element 3, compared with the related art, the light emitting element 3 and the chip 2 do not need to be disposed at a larger distance, thereby increasing the disposition density of the light emitting element 3 and improving the light emitting intensity of the circuit board assembly.
In step S110, the substrate 1 may be a composite structure formed by alternately stacking a plurality of insulating layers 11 and a plurality of metal layers 12, and may be formed by a pressing process so as to form the conductive line 4.
In step S120, the accommodating groove C may be formed by a photolithography process or a laser etching, a solution etching, a drilling process, or the like, and specifically, the accommodating groove C may be formed by a depth control gong machine.
In step S130, in order to electrically connect the light emitting element 3 and the chip 2, a via hole needs to be formed before the light emitting element 3 is formed, and specifically, between the steps of forming the accommodating groove C on the first surface P1 and forming the light emitting element 3 on the first surface P1, the method further includes: forming a via hole penetrating a part of the substrate 1 on the substrate 1, and then forming the light emitting element 3 on the first surface P1 further includes: a light emitting element 3 is formed on the first surface P1, and the light emitting element 3 is electrically connected to the chip 2 through a via hole.
The via hole may be formed by drilling the substrate 1, and then performing chemical copper deposition and electroplating to metalize the wall of the via hole, i.e. to form the conductive wire 4, so that the light emitting element 3 can be connected to the chip 2.
The circuit board assembly in the embodiment of the present invention may be specifically applied to a Display device using an LCD (Liquid Crystal Display) Display panel, and the circuit board assembly is used to provide a backlight source for the Display panel.
The display device provided by the embodiment of the invention has the technical effects of the technical solutions of the circuit board assemblies in any of the embodiments, and the structures and terms identical to or corresponding to those in the embodiments are not repeated herein. The display device provided by the embodiment of the invention can be a mobile phone and can also be any electronic product with a display function, including but not limited to the following categories: the touch screen display system comprises a television, a notebook computer, a desktop display, a tablet computer, a digital camera, an intelligent bracelet, intelligent glasses, a vehicle-mounted display, medical equipment, industrial control equipment, a touch interaction terminal and the like, and the embodiment of the invention is not particularly limited in this respect.
As described above, only the specific embodiments of the present invention are provided, and it is clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the system, the module and the unit described above may refer to the processes in the foregoing method embodiments, and are not described herein again. It should be understood that the scope of the present invention is not limited thereto, and any equivalent modifications or substitutions can be easily made by those skilled in the art within the technical scope of the present invention.
It should also be noted that the exemplary embodiments mentioned in this patent describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above steps, that is, the steps may be performed in the order mentioned in the embodiments, may be performed in an order different from the order in the embodiments, or may be performed at the same time.
Claims (15)
1. A circuit board assembly, comprising:
the substrate is provided with a first surface, and one side of the first surface is provided with a containing groove;
the chip is arranged in the accommodating groove;
and the light-emitting element is arranged on the first surface, is electrically connected with the chip and is arranged in a staggered way along the direction parallel to the first surface.
2. The circuit board assembly of claim 1, wherein the light emitting element and the chip are connected by a wire disposed within the substrate.
3. The circuit board assembly of claim 2, wherein the receiving cavity has a second surface parallel to the first surface, the chip is disposed on the second surface, and the conductive wires include a first conductive wire and a second conductive wire connected to each other;
the first conducting wire extends along the direction parallel to the second surface, one end of the first conducting wire is electrically connected with the chip, and the second conducting wire extends along the direction perpendicular to the second surface, and one end of the second conducting wire is electrically connected with the light-emitting element.
4. The circuit board assembly according to claim 3, wherein in a direction perpendicular to the first surface, the substrate includes n insulating layers and a metal layer between adjacent two insulating layers, n being an integer greater than or equal to 2;
the first conducting wire and any one of the metal layers are arranged on the same layer.
5. The circuit board assembly of claim 1, wherein a minimum distance between the light emitting element and the chip in a direction parallel to the first surface is in a range of 0mm to 0.2mm.
6. The circuit board assembly of claim 1, wherein the depth of the receiving slot is greater than the height of the chip in a direction perpendicular to the first surface.
7. The circuit board assembly of claim 1, wherein the light emitting element and the chip do not overlap in a direction perpendicular to the first surface.
8. The circuit board assembly of claim 1, wherein a single said chip is electrically connected to at least two said light emitting elements.
9. The circuit board assembly according to claim 8, wherein the minimum distances between each adjacent two of the light emitting elements among the light emitting elements arranged in the same direction are all equal.
10. The circuit board assembly of claim 1, wherein the chips are arranged in an array on the substrate, and the light emitting elements are uniformly disposed around the chips.
11. The circuit board assembly of claim 2, wherein the light emitting elements include a first electrode and a second electrode, the first electrode being electrically connected to the chip through the wire, each of the light emitting elements being electrically connected to a power line through the second electrode.
12. The circuit board assembly according to claim 1, further comprising an encapsulation adhesive layer covering a portion of the first surface where the light emitting element is not disposed, a side of the chip facing the first surface, and a gap between the chip and the receiving groove.
13. The circuit board assembly of claim 12, further comprising a reflective layer covering a surface of the encapsulation adhesive layer facing away from the substrate.
14. A method of making a circuit board assembly, comprising:
providing a substrate having a first surface;
forming a containing groove on the first surface, and placing a chip in the containing groove;
and forming a light-emitting element on the first surface, wherein the light-emitting element is electrically connected with the chip, and the light-emitting element and the chip are arranged in a staggered mode along the direction parallel to the first surface.
15. The method for preparing a circuit board assembly according to claim 14, wherein between the steps of forming a receiving groove on the first surface and forming a light emitting element on the first surface, further comprising: forming a via hole penetrating through a part of the substrate on the substrate;
the step of forming a light emitting element on the first surface further includes: and forming a light-emitting element on the first surface, wherein the light-emitting element is electrically connected with the chip through the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202211038861.XA CN115348728A (en) | 2022-08-29 | 2022-08-29 | Circuit board assembly and circuit board assembly preparation method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211038861.XA CN115348728A (en) | 2022-08-29 | 2022-08-29 | Circuit board assembly and circuit board assembly preparation method |
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| CN115348728A true CN115348728A (en) | 2022-11-15 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI843560B (en) | 2023-05-10 | 2024-05-21 | 友達光電股份有限公司 | Light-emitting element substrate, light-emitting element structure and display device |
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- 2022-08-29 CN CN202211038861.XA patent/CN115348728A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI843560B (en) | 2023-05-10 | 2024-05-21 | 友達光電股份有限公司 | Light-emitting element substrate, light-emitting element structure and display device |
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