CN110649041A - Light emitting module, electronic device, and method for controlling electronic device - Google Patents
Light emitting module, electronic device, and method for controlling electronic device Download PDFInfo
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- CN110649041A CN110649041A CN201910915962.2A CN201910915962A CN110649041A CN 110649041 A CN110649041 A CN 110649041A CN 201910915962 A CN201910915962 A CN 201910915962A CN 110649041 A CN110649041 A CN 110649041A
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- light
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- light emitting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/22—Illumination; Arrangements for improving the visibility of characters on dials
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
- H04M1/724—User interfaces specially adapted for cordless or mobile telephones
- H04M1/72448—User interfaces specially adapted for cordless or mobile telephones with means for adapting the functionality of the device according to specific conditions
- H04M1/72454—User interfaces specially adapted for cordless or mobile telephones with means for adapting the functionality of the device according to specific conditions according to context-related or environment-related conditions
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Environmental & Geological Engineering (AREA)
- Human Computer Interaction (AREA)
- Computer Networks & Wireless Communication (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a light-emitting component, an electronic device and a control method of the electronic device, wherein the light-emitting component comprises: a substrate layer; a plurality of light emitting parts, wherein the plurality of light emitting parts are arranged on one side surface of the substrate layer at intervals; the insulating part, the insulating part set up in on one side surface of substrate layer, just the insulating part with the illuminating part is located same one side of substrate layer, be equipped with around the illuminating part the insulating part. In the light-emitting component, the plurality of light-emitting parts are arranged on the same substrate layer and can independently emit light, and the light-emitting parts share the same substrate layer, so that the distance between the light-emitting parts can be smaller, the space occupied by the whole light-emitting component on the circuit board is smaller, and the space utilization rate of the circuit board is higher.
Description
Technical Field
The present invention relates to the field of light emitting devices, and in particular, to a light emitting device, an electronic apparatus, and a method for controlling an electronic apparatus.
Background
At present, electronic devices such as smart phones and tablet computers have become indispensable electronic products in life. With the continuous development of the electronic equipment industry, the functions of the electronic equipment gradually tend to be diversified and intelligentized, which puts higher demands on the structural design of the electronic equipment.
The electronic device may be provided with a light emitting device such as a flash lamp, which may perform a corresponding function when emitting light. Taking a flash lamp as an example, the flash lamp can supplement light when emitting light, so that the shooting quality of the electronic device is higher. In order to meet the use requirements of users in different environments, the electronic equipment can be provided with a plurality of flash lamps which are arranged on the same circuit board at intervals.
However, the space occupied by the plurality of flash lamps on the circuit board is large, which results in low space utilization of the circuit board.
Disclosure of Invention
The invention discloses a light-emitting component, electronic equipment and a control method of the electronic equipment, and aims to solve the problem of low space utilization rate of a circuit board.
In order to solve the problems, the invention adopts the following technical scheme:
a light emitting assembly comprising:
a substrate layer;
a plurality of light emitting parts, wherein the plurality of light emitting parts are arranged on one side surface of the substrate layer at intervals;
the insulating part, the insulating part set up in on one side surface of substrate layer, just the insulating part with the illuminating part is located same one side of substrate layer, be equipped with around the illuminating part the insulating part.
An electronic device comprises the light-emitting component.
A control method of an electronic device is applied to the electronic device, and comprises the following steps:
detecting light parameters of ambient light;
and determining the light-emitting parts needing to emit light according to the light parameters, and controlling the corresponding light-emitting parts to emit light.
The technical scheme adopted by the invention can achieve the following beneficial effects:
in the light-emitting component disclosed by the invention, the plurality of light-emitting parts are arranged on the same substrate layer, the light-emitting parts can respectively and independently emit light, and because the light-emitting parts share the same substrate layer, the distance between the light-emitting parts can be set smaller, so that the space occupied by the whole light-emitting component on the circuit board is smaller, and the space utilization rate of the circuit board is higher.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a cross-sectional view of a light emitting assembly according to an embodiment of the present disclosure;
FIG. 2 is a top view of the light emitting assembly shown in FIG. 1;
fig. 3 is a schematic structural diagram of a substrate layer, a first positive pad and a first ground pad in a light emitting module according to an embodiment of the disclosure;
FIG. 4 is a schematic diagram of a circuit board;
FIG. 5 is a cross-sectional view of a light emitting assembly according to another embodiment of the disclosure;
FIG. 6 is a schematic view of a color temperature adjustment layer in the light emitting device shown in FIG. 5;
fig. 7 is a top view of a light emitting device according to another embodiment of the disclosure.
Description of reference numerals:
100-substrate layer, 200-light emitting part, 300-insulating part, 400-color temperature adjusting layer, 510-first positive pad, 520-first ground terminal pad, 600-circuit board, 610-second positive pad, 620-second ground terminal pad.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
As shown in fig. 1-2, an embodiment of the present invention discloses a light emitting assembly, which can be applied to an electronic device, and the light emitting assembly can be mounted on a circuit board (e.g., a motherboard) of the electronic device to be used as a fill-in light, a breathing light, or an effect light. The light emitting module may specifically include a substrate layer 100, a light emitting section 200, and an insulating section 300.
The substrate layer 100 is mainly used for carrying the light emitting parts 200, the number of the light emitting parts 200 is plural, and the plural light emitting parts 200 are arranged on one side surface of the substrate layer 100 at intervals. The light emitting units 200 may have different functions, for example, some light emitting units 200 may be used for light supplement, and some light emitting units 200 may be used for generating different light effects, but the functions of the light emitting units 200 may be the same. More specifically, the color temperature, luminance, and the like of light emitted from each light emitting unit 200 may be the same or different. The specific number of the light emitting units 200 may be 2, 3, 4 or more, and may be determined according to factors such as the functions required to be provided in the electronic device, which is not limited herein. The insulating part 300, which serves to ensure independent operation of each light emitting part 200, is disposed on one side surface of the substrate layer 100, and the insulating part 300 and the light emitting parts 200 are located on the same side of the substrate layer 100. The insulating part 300 is provided around the light emitting part 200, and specifically, the insulating part 300 may surround at least one light emitting part 200, or may be in contact with only a part of the surface of at least one light emitting part 200, so that the plurality of light emitting parts 200 are insulated by the insulating part 300.
In the above-described light-emitting module, since the plurality of light-emitting sections 200 are provided on the same substrate layer 100, and the light-emitting sections 200 can emit light independently of each other, and the light-emitting sections 200 share the same substrate layer 100, the distance between the light-emitting sections 200 can be set smaller, and therefore, the space occupied by the entire light-emitting module on the circuit board is smaller, and the space utilization rate of the circuit board is higher. In addition, after the distance between the light emitting parts 200 of the light emitting assembly is reduced, the size of the lampshade arranged above the light emitting assembly can be correspondingly reduced, so that the appearance texture of the lampshade is improved.
As shown in fig. 5 and fig. 6, in order to make the plurality of light emitting portions 200 emit different lights, so as to better meet the use requirements of users in different environments, the light emitting assembly may further include a plurality of color temperature adjusting layers 400, and the plurality of color temperature adjusting layers 400 are disposed on one-to-one correspondence surfaces of the plurality of light emitting portions 200, which are away from the substrate layer 100. Each color temperature adjusting layer 400 may cover each light emitting part 200, and light emitted from the light emitting part 200 passes through the color temperature adjusting layer 400 and is then emitted. The color temperature adjusting layer 400 has the ability to adjust the color temperature, and thus the color temperature of the light emitted from each light emitting portion 200 can be made different. Specifically, the color temperature adjustment layer 400 may be made of phosphor, and when the color temperature adjustment layer 400 is prepared, the ratio of each component of the phosphor may be adjusted, so that different color temperature adjustment layers 400 have different color temperature adjustment capabilities, and finally, the light emitted by different light emitting parts 200 has different color temperatures.
As described above, the light emitting part 200 and the insulating part 300 are provided in the same layer, and the color temperature adjusting layer 400 may cover only the light emitting part 200, and the insulating part 300 may be covered with another material. However, this structure increases the manufacturing process of the light emitting device, resulting in high cost. In order to reduce the manufacturing cost of the light emitting element, the adjacent color temperature adjustment layers 400 may be in contact. That is, the color temperature adjusting layer 400 covers not only the light emitting part 200 but also the insulating part 300, so that an additional process is not required to be added to cover the insulating part 300 after the color temperature adjusting layer 400 is prepared, thereby simplifying the manufacturing process of the light emitting device and reducing the cost thereof.
The light emitting assembly may be soldered on a circuit board of the electronic device through the solder pad. Specifically, as shown in fig. 3, a surface of the substrate layer 100 on a side away from the light emitting section 200 is provided with a first positive electrode pad 510 and a first ground terminal pad 520. In one embodiment, the substrate layer 100 may be provided with a plurality of first positive pads 510 and a plurality of first ground pads 520 corresponding to each light emitting part 200, and the first positive pads 510 and the first ground pads 520 are electrically connected to the light emitting part 200. In another embodiment, the number of the first positive electrode pads 510 is plural, the plural first positive electrode pads 510 are electrically connected to the plural light emitting portions 200 in a one-to-one correspondence, and the plural light emitting portions 200 are electrically connected to the same first ground terminal pad 520. In other words, the light emitting parts 200 can share the same first ground terminal pad 520, and compared with the configuration in which a plurality of first ground terminal pads 520 are disposed, the structure can reduce the number of the first ground terminal pads 520, thereby further simplifying the manufacturing process of the light emitting device and simplifying the wiring design of the light emitting device.
As shown in fig. 4, it should be noted that a plurality of second positive pads 610 and a plurality of second ground pads 620 are correspondingly disposed on the circuit board 600 of the electronic device, and the number of the second positive pads 610 is the same as that of the first ground pads 520. The plurality of first positive pads 510 of the light emitting module are soldered to the plurality of second positive pads 610 of the circuit board 600, and the first ground pads 520 of the light emitting module are soldered to the second ground pads 620 of the circuit board 600, thereby achieving electrical connection between the light emitting module and the circuit board 600. At this time, the routing design of the circuit board 600 is simpler.
Further, a projected area of the first ground terminal pad 520 is larger than a projected area of each first positive electrode pad 510 in a direction perpendicular to the substrate layer 100. Since the plurality of light emitting parts 200 share the same first ground terminal pad 520, the first ground terminal pad 520 can be set larger, and heat generated when the light emitting device operates can be more rapidly dissipated through the first ground terminal pad 520, so that the heat dissipation capability of the light emitting device is more excellent. Meanwhile, after the structure is adopted, the circuit impedance of the light-emitting component and the circuit board 600 is lower, and therefore the light-emitting effect of the light-emitting component is improved.
As shown in fig. 2, in an alternative embodiment, the plurality of light emitting portions 200 may be arranged in a matrix. This arrangement can simplify the arrangement of the light emitting part 200, and make the structure of the light emitting device simpler. In this case, the shape of the light emitting section 200 may be circular, elliptical, rectangular, or the like, and the shape of the light emitting section 200 may be rectangular in order to make full use of the space of the substrate layer 100. As shown in fig. 7, in another alternative embodiment, at least some of the light emitting sections 200 are arranged along the same circumference among the plurality of light emitting sections 200. This arrangement also simplifies the arrangement of the light emitting part 200, and makes the structure of the light emitting device simpler. In this case, the shape of the light emitting section 200 may be circular, elliptical, rectangular, or the like, and the shape of the light emitting section 200 may be semicircular or partially annular in order to make full use of the space of the substrate layer 100.
The embodiment of the invention also discloses electronic equipment which comprises a circuit board 600 and the light-emitting component in any embodiment, wherein the light-emitting component can be arranged on the circuit board 600.
Further, the electronic apparatus further includes a photosensitive element electrically connected to the controller, and a controller electrically connected to the plurality of light emitting portions 200. The light sensing element can detect light parameters of ambient light, such as brightness, color temperature, etc. of the light. The light parameter detected by the photosensitive element can be transmitted to the controller, and the controller controls the light-emitting portion 200 to emit light according to the light parameter. Therefore, after the photosensitive elements and the controller are added, the state control of the light-emitting part 200 is more accurate, so that the use requirements of users can be better met.
The electronic device disclosed by the embodiment of the invention can be a smart phone, a tablet computer, an electronic book reader or a wearable device. Of course, the electronic device may also be other devices, and the embodiment of the present invention is not limited thereto.
The embodiment of the invention also discloses a control method of the electronic equipment, which is applied to the electronic equipment in any embodiment. The control method specifically comprises the following steps:
s110, detecting light parameters of ambient light;
optionally, the light parameter may include at least one of brightness and color temperature of the light.
S120, according to the light parameters, the light-emitting parts 200 needing to emit light are determined, and the corresponding light-emitting parts 200 are controlled to emit light.
Specifically, a correspondence table of the light parameters and the light-emitting portions 200 that need to emit light may be stored in advance, and then the light-emitting portions 200 that need to emit light may be obtained from the correspondence table and the detected light parameters, after which the corresponding light-emitting portions 200 may be controlled to emit light. For example: if the current environment is night and the brightness of the ambient light is extremely low, the plurality of light emitting units 200 (for example, all light emitting units 200) are controlled to emit light; if the current environment is cloudy and the brightness of the ambient light is relatively low, the control part light emitting part 200 (for example, one light emitting part 200) emits light; when the color temperature of the ambient light is low, the light emitting part 200 with high color temperature is controlled to emit light; when the color temperature of the ambient light is high, the light emitting unit 200 having a low color temperature is controlled to emit light.
The control method can accurately control the working state of the light-emitting component, thereby better meeting the use requirements of users.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (12)
1. A light emitting assembly, comprising:
a substrate layer (100);
a plurality of light emitting parts (200), wherein the number of the light emitting parts (200) is multiple, and the plurality of light emitting parts (200) are arranged on one side surface of the substrate layer (100) at intervals;
the insulating part (300), insulating part (300) set up in on one side surface of substrate layer (100), just insulating part (300) with illuminating part (200) are located same one side of substrate layer (100), be equipped with around illuminating part (200) insulating part (300).
2. The light-emitting assembly according to claim 1, further comprising a plurality of color temperature adjusting layers (400), wherein the plurality of color temperature adjusting layers (400) are disposed in a one-to-one correspondence with a side surface of the plurality of light-emitting portions (200) facing away from the substrate layer (100).
3. The light emitting assembly of claim 2, wherein adjacent color temperature adjusting layers (400) are in contact.
4. The light-emitting assembly according to claim 1, wherein a surface of the substrate layer (100) on a side away from the light-emitting portion (200) is provided with a plurality of first positive electrode pads (510) and a plurality of first ground terminal pads (520), the plurality of first positive electrode pads (510) are electrically connected to the plurality of light-emitting portions (200) in a one-to-one correspondence, and the plurality of light-emitting portions (200) are electrically connected to the same first ground terminal pad (520).
5. The light emitting assembly of claim 4, wherein a projected area of the first ground terminal pad (520) is larger than a projected area of each of the first positive electrode pads (510) in a direction perpendicular to the substrate layer (100).
6. The light-emitting assembly according to claim 1, wherein the plurality of light-emitting portions (200) are arranged in a matrix.
7. The light-emitting assembly according to claim 1, wherein at least a part of the plurality of light-emitting portions (200) are arranged along the same circumference.
8. An electronic device comprising the light-emitting assembly according to any one of claims 1 to 7.
9. The electronic device according to claim 8, further comprising a light-sensing element and a controller, wherein the light-sensing element is electrically connected to the controller, and the controller is electrically connected to the plurality of light-emitting portions (200).
10. A control method of an electronic device, applied to the electronic device of claim 8 or 9, the control method comprising:
detecting light parameters of ambient light;
and determining the light-emitting parts needing to emit light according to the light parameters, and controlling the corresponding light-emitting parts to emit light.
11. The method according to claim 10, wherein the determining the light-emitting portion that needs to emit light according to the light parameter includes:
and determining the light-emitting part corresponding to the light parameter according to the corresponding relation table of the light parameter and the light-emitting part needing to emit light.
12. The control method of claim 10, wherein the light parameter comprises at least one of a brightness and a color temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910915962.2A CN110649041A (en) | 2019-09-26 | 2019-09-26 | Light emitting module, electronic device, and method for controlling electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910915962.2A CN110649041A (en) | 2019-09-26 | 2019-09-26 | Light emitting module, electronic device, and method for controlling electronic device |
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| CN110649041A true CN110649041A (en) | 2020-01-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910915962.2A Pending CN110649041A (en) | 2019-09-26 | 2019-09-26 | Light emitting module, electronic device, and method for controlling electronic device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112034665A (en) * | 2020-09-15 | 2020-12-04 | Oppo（重庆）智能科技有限公司 | Flash lamp assembly and electronic equipment |
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| CN109681831A (en) * | 2019-03-01 | 2019-04-26 | 安徽亮亮电子科技有限公司 | A kind of intelligent light-controlled street lamp of LED solar energy and its application method |
| CN209087838U (en) * | 2018-08-27 | 2019-07-09 | 成都东旭智能科技有限公司 | LED light source and LED light |
| CN209170492U (en) * | 2017-11-06 | 2019-07-26 | 亿光电子工业股份有限公司 | Light emitting device and electronic equipment |
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2019
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209170492U (en) * | 2017-11-06 | 2019-07-26 | 亿光电子工业股份有限公司 | Light emitting device and electronic equipment |
| CN108598071A (en) * | 2018-06-28 | 2018-09-28 | 山西高科华兴电子科技有限公司 | A kind of three-primary color LED module device of TOP structures and preparation method thereof |
| CN209087838U (en) * | 2018-08-27 | 2019-07-09 | 成都东旭智能科技有限公司 | LED light source and LED light |
| CN109681831A (en) * | 2019-03-01 | 2019-04-26 | 安徽亮亮电子科技有限公司 | A kind of intelligent light-controlled street lamp of LED solar energy and its application method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112034665A (en) * | 2020-09-15 | 2020-12-04 | Oppo（重庆）智能科技有限公司 | Flash lamp assembly and electronic equipment |
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