CN204785755U - Illuminator and ligthing paraphernalia - Google Patents
Illuminator and ligthing paraphernalia Download PDFInfo
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- CN204785755U CN204785755U CN201520561291.1U CN201520561291U CN204785755U CN 204785755 U CN204785755 U CN 204785755U CN 201520561291 U CN201520561291 U CN 201520561291U CN 204785755 U CN204785755 U CN 204785755U
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Abstract
The utility model provides an illuminator and ligthing paraphernalia is difficult for sheltering from semiconductor light -emitting element's radiation light. Component parts and emitting diode (63) of lighting the circuit are installed in base plate (3). Radiating part (2) formation is seeing from the thickness direction of base plate (3) greatlyyer than the appearance of base plate (3), and meets with base plate (3). The height dimensions who lights in the component parts of circuit is installed in the face of base plate (3) and the opposite one side of installation face emitting diode (63), and is installed the position of leaning on the outside in the region than installing emitting diode (63) (64a) than emitting diode (63) the condenser that height dimensions is big (41) and terminal platform (42). Radiating part (2) are formed with concave part (5) that are used for accomodating condenser (41) and terminal platform (42).
Description
Technical field
The utility model relates in general to a kind of light-emitting device and employs the ligthing paraphernalia of this light-emitting device, say in more detail, relate to a kind of light-emitting device that the semiconductor light-emitting elements of light emitting diode and so on is lighted and the ligthing paraphernalia employing this light-emitting device.
Background technology
In the past, there is following a kind of LED lamp device: possess multiple light emitting diodes (LED:LightEmittingDiode) of being connected in series and be the rectification circuit of pulsating volage by ac voltage rectifier, the number of lighting of LED is made to increase or reduce (for example, referring to Japan Patent numbering the 4581646th) according to the height of the pulsating volage provided from rectification circuit.
About the LED lamp device of above-mentioned document, when the magnitude of voltage of pulsating volage is lower than the magnitude of voltage specified, all LED are extinguished, and therefore ligthing paraphernalia likely seems flicker.In order to suppress this flicker, consider following methods: between the lead-out terminal of rectification circuit, connect smmothing capacitor, smoothing to pulsating volage.
Usually, the height dimension of capacitor is larger than the height dimension of LED.When capacitor and LED being closely installed on same on substrate, the height dimension of capacitor is larger than the height dimension of LED, therefore likely blocked from the light of LED radiation by capacitor, thus the light extraction efficiency of light reduces.
Utility model content
The utility model completes in view of the above problems, its object is to provide a kind of and not easily blocks the light-emitting device of the radiating light of semiconductor light-emitting elements and employ the ligthing paraphernalia of this light-emitting device.
Light-emitting device involved by a mode of the present utility model possesses: semiconductor light-emitting elements; Lighting circuit, it makes above-mentioned semiconductor light-emitting elements light; Substrate, it is provided with the component parts of above-mentioned lighting circuit and above-mentioned semiconductor light-emitting elements; And radiating part, its profile be formed as than aforesaid substrate viewed from the thickness direction of aforesaid substrate is large, and connect with aforesaid substrate, wherein, the high size component that height dimension in above-mentioned component parts is larger than above-mentioned semiconductor light-emitting elements height dimension be installed on aforesaid substrate with the face of the installed surface opposite side of above-mentioned semiconductor light-emitting elements and the position in the outer part, installation region be installed on than above-mentioned semiconductor light-emitting elements, above-mentioned radiating part is formed with the recess for receiving above-mentioned high size component.
Preferably, above-mentioned radiating part under being configured to the state being accommodated with above-mentioned high size component in above-mentioned recess above-mentioned high size component do not reach the outside of the profile of above-mentioned radiating part.
Preferably, the region that connects with aforesaid substrate of above-mentioned radiating part is larger than the above-mentioned installation region of above-mentioned semiconductor light-emitting elements.
Preferably, whole that is configured to except the position towards above-mentioned recess with the face of the installed surface opposite side of above-mentioned semiconductor light-emitting elements of aforesaid substrate connects with above-mentioned radiating part.
Preferably, the height dimension of above-mentioned high size component is more than 2 times of the height dimension of above-mentioned semiconductor light-emitting elements.
Preferably, above-mentioned high size component comprises electrolytic capacitor.
Ligthing paraphernalia involved by a mode of the present utility model possesses above-mentioned light-emitting device and for keeping the appliance body of above-mentioned light-emitting device.
According to aforesaid way, can provide a kind of and not easily block the light-emitting device of the radiating light of semiconductor light-emitting elements and employ the ligthing paraphernalia of this light-emitting device.
Accompanying drawing explanation
Accompanying drawing represents one or more embodiment according to this demonstration, but and is not used in restriction, only example.In the accompanying drawings, identical Reference numeral refers to identical or similar key element.
Fig. 1 is the front view of the light-emitting device involved by present embodiment.
Fig. 2 is the right side view of the light-emitting device involved by present embodiment.
Fig. 3 is the top view of the light-emitting device involved by present embodiment.
Fig. 4 is the stereogram of the light-emitting device involved by present embodiment.
Fig. 5 is the circuit diagram of the light-emitting device involved by present embodiment.
Fig. 6 is the figure of the action of the light-emitting device illustrated involved by present embodiment.
Fig. 7 is the outside drawing of the ligthing paraphernalia involved by present embodiment.
Fig. 8 is the outside drawing of another ligthing paraphernalia involved by present embodiment.
Fig. 9 is the top view of the light-emitting device involved by comparative example.
Figure 10 is the right side view of the light-emitting device involved by comparative example.
Detailed description of the invention
Below, based on accompanying drawing, the light-emitting device involved by the present embodiment applying technological thought of the present utility model and ligthing paraphernalia are described.In addition, in the following description, the y-axis direction gage shown in Fig. 1 is decided to be above-below direction, the x-axis direction gage shown in Fig. 1 is decided to be left and right directions.In addition, the z-axis direction gage shown in Fig. 2 is decided to be front and back and is always described, but this direction defines for convenience of explanation, the direction under the using state of reality is not defined in above-mentioned direction by aim.Such as shown in Figure 7, under the state that this ligthing paraphernalia is installed in below ceiling component, the top of Fig. 1 becomes the below under Construction State.
As shown in Figure 1 to 4, lighting circuit 10 (with reference to Fig. 5), substrate 3 and radiating part 2 that the light-emitting device 1 involved by present embodiment possesses multiple light emitting diode 63 (semiconductor light-emitting elements), multiple light emitting diode 63 is lighted.Lighting circuit 10 is made up of high size component 4 and low dimensional parts.In addition, in the present embodiment light emitting diode 63 is used as semiconductor light-emitting elements, but semiconductor light-emitting elements is not limited to light emitting diode, such as, also can uses the semiconductor light-emitting elements that organic electroluminescent etc. is suitable for.
Substrate 3 is configured to printed circuit board (PCB).The first surface 3a (being upper surface in the present embodiment) of substrate 3 is provided with multiple light emitting diode 63 and low dimensional parts (component parts except high size component 4 namely, in lighting circuit 10).High size component 4 and low dimensional parts will be described below.In addition, substrate 3 is not limited to printed circuit board (PCB), such as, also can be the substrate that common substrate etc. is suitable for.In addition, in Fig. 1 ~ Fig. 4, the low dimensional component omission except high size component 4 in lighting circuit 10 diagram.
Light emitting diode 63 is light emitting diodes of surface-mount type, and as shown in Figure 3, the first surface 3a (upper surface) of substrate 3 is provided with multiple light emitting diode 63.In the present embodiment, 42 light emitting diodes 63 are connected in series and constitute illuminating part 64.The mode that it is 1 row with 7 along the longitudinal direction that light emitting diode 63 is configured at the upper surface of substrate 3 arranges, and forms 6 row in left-right direction.Between two light emitting diodes 63 adjacent on x-axis direction or z-axis direction, the conductive part of film-form is formed at the surface of substrate 3.Two adjacent light emitting diodes 63 are electrically connected via this conductive part.
Illuminating part 64 has 3 circuit of LED be made up of 14 light emitting diodes 63.Illuminating part 64 has (first) circuit of LED 66, (second) circuit of LED 67 and (the 3rd) circuit of LED 68.Circuit of LED 66 ~ 68 is made up of 14 light emitting diodes 63 be connected in series respectively, and carries out an ON/OFF control by control part 65 described later.That is, in illuminating part 64, an ON/OFF control is carried out by every 14 light emitting diodes 63 in 42 light emitting diodes 63.
High size component 4 is parts that height dimension is larger than the height dimension of light emitting diode 63, such as comprises capacitor 41 and terminal board 42 in the present embodiment.Capacitor 41 and terminal board 42 are the parts of the component parts forming lighting circuit 10 (with reference to Fig. 5), are installed on second 3b (with the face of first surface 3a opposite side, being lower surface in the present embodiment) of substrate 3.Capacitor 41 and terminal board 42 as shown in figures 1 and 3 such position of marginal portion in the front near substrate 3 configure with arranging in left-right direction.
As shown in Figure 2, the height dimension of terminal board 42 has the height dimension L1 larger than 2 times of height dimension L0 of light emitting diode 63.Terminal board 42 place is connected with the electric wire of the such AC power of source power supply freely 60.
Capacitor 41 comprises electrolytic capacitor, smoothing to pulsating volage partly, makes the magnitude of voltage of the pulsating volage exported from rectification circuit 62 be not less than the lower limit preset.The height dimension L2 of capacitor 41 is larger than the height dimension L1 of terminal board 42.In addition, the function of capacitor 41 will describe later.
As shown in Figure 3, what capacitor 41 and terminal board 42 were installed on substrate 3 is installed on the outside of the region 64a (installation region of semiconductor light-emitting elements) being configured with light emitting diode 63 with second 3b (being lower surface in the present embodiment) of the first surface 3a opposite side of the installed surface as diode 63.Therefore, it is possible to make whole of the radiating part 2 of second 3b being arranged at substrate 3 and the back side surface of region 64a contact.Refer to installation 7 in the longitudinal direction at this said region 64a, in the lateral direction 6 regions of having installed altogether on the substrate 3 of 42 light emitting diodes 63 are installed.
Radiating part 2 has and the base portion 20 of second of substrate 3 tabular that 3b contacts and the multiple fin 21,22 (specifically 4 (first) fin 21 and 6 (second) fin 22) of lower surface being arranged at base portion 20.Fin 21 and fin 22 are arranged at the lower surface of base portion 20 respectively with the state making thickness direction arrange in left-right direction.Two panels fin 21 is arranged on primary importance and second position from the left side of base portion 20.In addition, other two panels fin 21 is configured in primary importance and second position from the right side of base portion 20.In addition, the upper surface of the base portion 20 of present embodiment is plane, and base portion 20 carries out face with substrate 3 with plane and contacts, but base portion 20 is not limited to plane with the contact surface of substrate 3, is configured to carry out mutually face and contacts.Such as base portion 20 and substrate 3 also can carry out face with curved surface and contact, even if base portion 20 and substrate 3 have stage portion, as long as there is the part of carrying out mutually face contact.In addition, radiating part 2 can carry out thermal coupling with substrate 3, both directly can contact with substrate 3, also can install between radiating part 2 and substrate 3 and have insulating properties and the high component (fin etc. of such as silicones) of heat conductivity.
6 fin 22 to be configured in from the left side of base portion 20 second fin 21 and from the right side of base portion 20 between second fin 21.
Radiating part 2 is formed with the recess 5 for receiving capacitor 41 and terminal board 42.About recess 5, the slot part rearward formed from the marginal portion in front in base portion 20 is utilized to be formed at radiating part 2 with the stage portion 221 being formed at fin 22 as shown in Figure 4.Recess 5 is formed as shown in Figure 2, and from the upper surface 20a of base portion 20 to the size of the upper surface of stage portion 221, namely, the height dimension L2 of height dimension L3 (depth dimensions from upper surface 20a sees) ratio capacitance device 41 is large.In addition, recess 5 is formed as shown in Figure 3, and width dimensions between the edge part 201 of the both sides of slot part is larger than the width dimensions of terminal board 42 and the width dimensions of capacitor 41 are added the size obtained.Further, recess 5 is formed as, and the depth size the edge part 202 at the rear from the marginal portion in the front of base portion 20 to slot part is than large from the size of marginal portion to the rear end part of capacitor 41 in the front of substrate 3.Mode between the marginal portion being configured in the rear end part of capacitor 41 and the front of region 64a to make edge part 202 forms recess 5.When base portion 20 seen from above, become reverse U shape shape.In addition, recess 5 is formed as the shape that the high size component 4 of second 3b being configured at substrate 3 can be accommodated in the inner side of the profile of radiating part 2.In the inner side of the profile of this said radiating part 2, refer to when supposing not form radiating part 2 of recess 5, respectively from viewed from above-below direction, left and right directions and fore-and-aft direction during radiating part 2, compared with the marginal portion of the most peripheral of radiating part 2 more in the inner part.That is, the so-called state being accommodated with high size component 4 in the inner side of the profile of radiating part 2, refers to that high size component 4 is not given prominence to from the marginal portion of the most peripheral of above-mentioned virtual radiating part 2 and is accommodated in the state of recess 5.
In addition, usually, use the ligthing paraphernalia of semiconductor light-emitting elements mostly in the substrate of ligthing paraphernalia, the opposition side in the face that is provided with semiconductor light-emitting elements is provided with heat sink.In order to discharge the heat that semiconductor light-emitting elements sends efficiently, need heat sink to be configured in as far as possible the position near semiconductor light-emitting elements.But, there is following problem: in the opposition side in face being provided with semiconductor light-emitting elements, be difficult to heat sink is installed on the position near semiconductor light-emitting elements.
Base portion 20 is formed as larger than the profile of substrate 3 viewed from above-below direction.As shown in Figure 3, base portion 20 be formed as size on left and right directions from the marginal portion of the left and right of substrate 3 each outstanding size Lx1.In addition, be formed as size on fore-and-aft direction from the marginal portion of the front and back of substrate 3 each outstanding size Lz1.Therefore, be easy to substrate 3 to be installed on base portion 20.In addition, substrate 3 is less than radiating part 2, and therefore when light-emitting device 1 being installed on described later appliance body 102,107, operator not easily touches substrate 3, not easily applies unnecessary power to substrate 3.In addition, the size being formed as the fore-and-aft direction of base portion 20 and left and right directions respectively than substrate 3 external diameter greatly, aim is not that the size from the outstanding base portion 20 of substrate 3 is defined in size Lx1, Lz1.In addition, the respective outstanding size of the left and right sides may not be same size.Similarly, the respective outstanding size of both sides, front and back may not be same size.
The upper surface 20a being formed as base portion 20 is larger than the profile of substrate 3 viewed from above-below direction, and whole of second 3b of the substrate 3 therefore except the position towards recess 5 connects with upper surface 20a.Below, the region connected with second 3b of substrate 3 in upper surface 20a is called contact surface 20b (region connected with substrate).Contact surface 20b is larger than the region 64a being provided with multiple light emitting diode 63, and therefore radiating part 2 can discharge via substrate 3 heat that multiple light emitting diode 63 sends efficiently.
Then, be described with reference to the circuit structure of Fig. 5 to lighting circuit 10.
Lighting circuit 10 possesses rectification circuit 62, capacitor 41, control part 65 and illuminating part 64.
Such as the AC powers such as source power supply 60 are connected with via fuse 61 in the primary side of rectification circuit 62.Rectification circuit 62 such as comprises the bridge circuit of diode, is configured to carry out full-wave rectification to alternating voltage.
Capacitor 41 is connected with in parallel between the lead-out terminal of the primary side of rectification circuit 62.In addition, between the two ends of capacitor 41, illuminating part 64 and on-off circuit 78 is connected with.In the present embodiment, constitute control part 65 with control circuit 75 and on-off circuit 78, but aim is not in this structure by the structure qualification of control part 65.
Capacitor 41 is to pulsating volage smoothingization exported by rectification circuit 62.Capacitor 41 will describe later in detail, but have selected the capacitor with following static capacity: to a part smoothingization of voltage V1, make the magnitude of voltage of the voltage V1 when the magnitude of voltage of the pulsating volage exported by rectification circuit 62 is minimum also be not less than 40V.In addition, if consider frequency characteristic, then expecting that capacitor 41 is electrolytic capacitors, but except electrolytic capacitor, also can be to follow the change of the pulsating volage exported by rectification circuit 62 and the suitable capacitor of smoothingization.
Illuminating part 64 has 42 light emitting diodes 63 be connected in series.Each light emitting diode 63 connects towards the mode of the low potential side of capacitor 41 towards the hot side of capacitor 41, cathode terminal to make anode terminal.In addition, in Figure 5, in order to simplicity of illustration, the diagram of a part of light emitting diode 63 is eliminated.
Utilize starting at the 1st ~ the 14th light emitting diode 63 from the hot side of capacitor 41 and form circuit of LED 66 in illuminating part 64.The tie point 661 of starting at the 14th light emitting diode 63 and the 15th light emitting diode 63 from the hot side of capacitor 41 in illuminating part 64 is connected with the collector terminal of (first) switch element 69 be made up of the bipolar transistor of NPN type.Resistance 72 is connected with between the terminal of the emitter terminal of switch element 69 and the low potential side of capacitor 41.That is, between the two ends of capacitor 41, circuit of LED 66, switch element 69 and resistance 72 is connected in series with.
Utilize starting at the 15th ~ the 28th light emitting diode 63 from the hot side of capacitor 41 and form circuit of LED 67 in illuminating part 64.The tie point 671 of starting at the 28th light emitting diode 63 and the 29th light emitting diode 63 from the hot side of capacitor 41 in illuminating part 64 is connected with the collector terminal of (second) switch element 70.Resistance 73 is connected with between the emitter terminal of switch element 70 and the terminal of the low potential side of capacitor 41.That is, between the terminal of the low potential side of tie point 661 and capacitor 41, circuit of LED 67, switch element 70 and resistance 73 is connected in series with.
Utilize starting at the 29th ~ the 42nd light emitting diode 63 from the hot side of capacitor 41 and form circuit of LED 68 in illuminating part 64.The cathode terminal of starting at the 42nd light emitting diode 63 from the hot side of capacitor 41 in illuminating part 64 is connected with the collector terminal of (the 3rd) switch element 71.Resistance 74 is connected with between the emitter terminal of switch element 71 and the terminal of the low potential side of capacitor 41.That is, between the terminal of the low potential side of tie point 671 and capacitor 41, circuit of LED 68, switch element 71 and resistance 74 is connected in series with.
On-off circuit 78 is constituted with above-mentioned switch element 69 ~ 71 and resistance 72 ~ 74.In addition, aim is not that on-off circuit 78 is defined in this structure, as long as the control (aftermentioned) be configured to according to control circuit 75 is by circuit of LED 66 ~ 68 conduction and cut-off respectively.In addition, the switch element 69 ~ 71 of present embodiment is formed with the bipolar transistor of NPN type respectively, but aim is not be defined in form with bipolar transistor, also can form with suitable switch element.
The terminal that the magnitude of voltage of the voltage V1 between control circuit 75 has the two ends of capacitor 41 is measured and the terminals P 1 ~ P3 exporting control signal.Control circuit 75 exports control signal for carrying out an ON/OFF control to illuminating part 64 according to the magnitude of voltage of voltage V1 respectively from terminals P 1 ~ P3.Terminals P 1 is connected with the base terminal of switch element 69.Terminals P 2 is connected with the base terminal of switch element 70.Terminals P 3 is connected with the base terminal of switch element 71.In addition, from the electric power needed for the action providing control circuit 75 between the two ends of capacitor 41, but control circuit 75 is connected to suitable power supply.In addition, diagram and the explanation of the detailed circuit structure of control circuit 75 are omitted, but control circuit 75 such as both can be made up of microcomputer, also can be made up of the discrete circuit be suitable for.
Control circuit 75 carrys out gauge tap circuit 78 according to the magnitude of voltage of voltage V1, thus makes circuit of LED 66 ~ 68 light respectively or extinguish.That is, control circuit 75 carries out an ON/OFF control by every 14 light emitting diodes 63 in 42 light emitting diodes 63 of illuminating part 64.
At this, illustrate that control circuit 75 pairs of circuit of LED 66 ~ 68 carry out the action of an ON/OFF control respectively with reference to Fig. 6.
Fig. 6 be represent capacitor 41 two ends between the waveform of voltage V1 and the sequential chart of output state of control signal of the terminals P 1 ~ P3 of control circuit 75.
When carrying out the pulsating volage that full-wave rectification obtains from rectification circuit 62 output, capacitor 41 is charged, and the voltage V1 between the two ends of capacitor 41 starts to rise.Control circuit 75 during voltage V1 is less than the time t0-t1 of 40V in, the level of the signal exported from terminals P 1 ~ P3 is set to low level, makes switch element 69 ~ 71 be all cut-off state.
When voltage V1 is more than 40V, control circuit 75 exports the signal of high level from terminals P 1, from the signal (time t1-t2) of terminals P 2, P3 output low level.Become conducting state between the colelctor electrode-emitter terminal of switch element 69, between switch element 70,71 respective colelctor electrode-emitter terminals, become cut-off state.Circulating current I1 in circuit of LED 66 and resistance 72, thus 14 light emitting diodes 63 that circuit of LED 66 has are lighted.
When voltage V1 is more than 80V, control circuit 75, from the signal of terminals P 1, P3 output low level, exports the signal (time t2-t3) of high level from terminals P 2.About the timing exporting control signal, the timing that terminals P 1 and the signal of terminals P 2 export can be identical, also can a little lingeringly from the signal of terminals P 1, P3 output low level after exporting the signal of high level from terminals P 2.When the signal of the high level of terminals P 2 is imported into the base terminal of switch element 70, between the colelctor electrode-emitter terminal of switch element 70, become conducting state.Cut-off state is become between switch element 69,71 respective colelctor electrode-emitter terminals.That is, the path of the electric current I 1 in during time t1-t2 is circuit of LED 66 → switch element 69 → resistance 72, on the other hand, during time t2-t3, the path of electric current I 1 is switched to circuit of LED 66,67 → switch element, 70 → resistance 73.Be more than 80V and during being less than 120V (during time t2-t3) at voltage V1, the light emitting diode 63 (namely, amounting to 28 light emitting diodes 63) that circuit of LED 66 and circuit of LED 67 have separately is lighted.
When voltage V1 is more than 120V, control circuit 75, from the signal of terminals P 1, P2 output low level, exports the signal (time t3-t4) of high level from terminals P 3.About the timing exporting control signal, the timing that terminals P 2 and the signal of terminals P 3 export can be identical, also can a little lingeringly from the signal of terminals P 1, P2 output low level after outputing the signal of high level from terminals P 3.When the signal of the high level of terminals P 3 is imported into the base terminal of switch element 71, between the colelctor electrode-emitter terminal of switch element 71, become conducting state.Cut-off state is become between switch element 69,70 respective colelctor electrode-emitter terminals.That is, the path of the electric current I 1 in during time t2-t3 is circuit of LED 66,67 → switch element, 70 → resistance 73, on the other hand, during time t3-t4, the path of electric current I 1 is switched to circuit of LED 66 ~ 68 → switch element 71 → resistance 74.During time t3-t4, whole light emitting diodes 63 (namely, whole 42 light emitting diodes 63) that circuit of LED 66 ~ 68 has separately are lighted.
When the pulsating volage exported by rectification circuit 62 exceed decline voltage after peak value time, voltage V1 start decline.When voltage V1 is lower than 120V, control circuit 75 exports the signal of high level from terminals P 2, from the signal (time t4-t5) of terminals P 1, P3 output low level.About the timing exporting control signal, the timing that terminals P 2 and the signal of terminals P 1, P3 export can be identical, also can a little lingeringly from the signal of terminals P 3 output low level after exporting the signal of high level from terminals P 2.That is, the path of the electric current I 1 in during time t4-t5 be switched to during time t2-t3 in identical path, the path of electric current I 1.14 light emitting diodes 63 that circuit of LED 68 has extinguish, and 28 light emitting diodes 63 altogether that circuit of LED 66 and circuit of LED 67 have are lighted.
When voltage V1 is lower than 80V, control circuit 75 exports the signal of high level from terminals P 1, from the signal (time t5-t6) of terminals P 2, P3 output low level.About the timing exporting control signal, the timing that terminals P 1 and the signal of terminals P 2, P3 export can be identical, also can a little lingeringly from the signal of terminals P 2, P3 output low level after exporting the signal of high level from terminals P 1.That is, the path of the electric current I 1 in during time t5-t6 be switched to during time t1-t2 in identical path, the path of electric current I 1.Then, 14 light emitting diodes 63 that circuit of LED 67 has extinguish, and 14 light emitting diodes 63 that circuit of LED 66 has are lighted.
During time t5-t6, the pulsating volage continuous decrease exported by rectification circuit 62, but utilize capacitor 41 pairs of voltage V1 smoothingization and voltage V1 is declined lentamente.About capacitor 41, have selected the capacitor that voltage V1 is not less than the such static capacity of 40V, therefore voltage V1 is not less than 40V.That is, the light emitting diode 63 that circuit of LED 66 has all can not extinguish after timet and continue to light within the whole cycle of the pulsating volage exported by rectification circuit 62.
About the action of the control circuit 75 after time t6, periodically repeatedly carry out the action identical with the action of above-mentioned time t1-t6, therefore omit the description.
Utilize capacitor 41 to make the magnitude of voltage of voltage V1 all be not less than 40V within the whole cycle of the pulsating volage exported by rectification circuit 62, therefore lighting circuit 10 light period in can not become the state that whole light emitting diode 63 is extinguished.Therefore, lighting circuit 10 inhibits the flicker occurred because whole light emitting diode 63 extinguishes.
Lighting circuit 10 carries out an ON/OFF control according to the periodically variable magnitude of voltage of voltage V1 respectively to circuit of LED 66 ~ 68.Therefore, such as, compared with the lighting circuit controlling with use chopper circuit etc. the current value flowed in lighting load, lighting circuit 10 can make illuminating part 64 light with fairly simple circuit structure.
At this, in order to the effect of present embodiment is described, with reference to Fig. 9 and Figure 10, comparative example is described.
As shown in Figure 9, the light-emitting device 1A of comparative example is provided with capacitor 41 and terminal board 42 at the upper surface of substrate 3.The height dimension L2 of capacitor 41 is higher than the height dimension L0 of light emitting diode 63, therefore likely blocks a part of light radiated by light emitting diode 63.Such as shown in Figure 10, the light that the region A2 of the corner portion that the upper part of capacitor 41 is blocked in the region A1 that irradiates light emitting diode 63 irradiates, likely reduces region A1 thus.In addition, except capacitor 41, the corner portion of the high parts of the height dimension L0 of the ratio light emitting diode 63 as terminal board 42 also likely occlusion area A1.
On the other hand, the high size component 4 comprising capacitor 41 and terminal board 42 is configured at second 3b (being lower surface in the present embodiment) of substrate 3 by the light-emitting device 1 of present embodiment, therefore capacitor 41 and terminal board 42 region that light emitting diode 63 can not be disturbed to irradiate.In addition, even if high size component 4 to be configured at second 3b of substrate 3, because whole except being configured with the position of recess 5 of second 3b of substrate 3 connects with radiating part 2, therefore radiating part 2 can discharge the heat of radiating from light emitting diode 63 efficiently.
As described above, the light-emitting device 1 of the present embodiment lighting circuit 10, substrate 3 and the radiating part 2 that possess light emitting diode 63 (semiconductor light-emitting elements), light emitting diode 63 is lighted.Substrate 3 is provided with component parts and the light emitting diode 63 of lighting circuit 10.Radiating part 2 is formed as seeing larger than the profile of substrate 3 from the thickness direction (being above-below direction in the present embodiment) of substrate 3, and connects with substrate 3.The high size component 4 that height dimension in the component parts of lighting circuit 10 is larger than the height dimension of light emitting diode 63 be installed on substrate 3 with the face (second 3b) of installed surface (first surface 3a) opposite side of light emitting diode 63 and installation region (the being region 64a in the present embodiment) position be in the outer part installed on than light emitting diode 63.In the present embodiment, high size component 4 comprises capacitor 41, terminal board 42.Radiating part 2 is formed with the recess 5 for receiving high size component 4.
High size component 4 is configured at second 3b (being lower surface in the present embodiment) of substrate 3, and high size component 4 can not block the radiating light from light emitting diode 63, and therefore the light extraction efficiency of the light of light emitting diode 63 improves.In addition, even if capacitor 41 and terminal board 42 to be configured at second 3b of substrate 3, because whole except the position towards recess 5 of second 3b of substrate 3 connects with radiating part 2, therefore, it is possible to discharge the heat of radiating from light emitting diode 63 efficiently.Further, it is larger than substrate 3 that radiating part 2 is formed as profile viewed from thickness direction, is therefore easy to radiating part 2 to be installed on substrate 3.In addition, substrate 3 is less than radiating part 2, and therefore when light-emitting device 1 being installed on the appliance body 102 (with reference to Fig. 7) of ligthing paraphernalia 100 described later, operator not easily touches substrate 3, therefore not easily applies power to substrate 3.High size component 4 is accommodated in recess 5, therefore when light-emitting device 1 is installed on appliance body 102, can reduce the installing space needed for appliance body 102.Therefore, following effect can also be played: be configured with compared with the ligthing paraphernalia of the light-emitting device of high size component at the upper surface of substrate with having, the ligthing paraphernalia 100 with light-emitting device 1 can be made miniaturized.About the ligthing paraphernalia 110 possessing appliance body 107 (with reference to Fig. 8) described later, also identical effect can be played.
Radiating part 2 is preferably configured to high size component 4 under the state that high size component 4 (capacitor 41, terminal board 42) is accommodated in recess 5 and does not reach the outside of the profile of radiating part 2.Capacitor 41 and terminal board 42 can not be given prominence to from the profile of radiating part 2, and therefore when light-emitting device 1 is installed on the appliance body of ligthing paraphernalia described later, capacitor 41 and terminal board 42 are not easy to block appliance body, are therefore easy to carry out installation exercise.
The region (being contact surface 20b in the present embodiment) that radiating part 2 connects with substrate 3 is preferably large than the installation region (being region 64a in the present embodiment) of light emitting diode 63 (semiconductor light-emitting elements).Radiating part 2 connects with the entirety of the rear side part of region 64a on second 3b of substrate 3, therefore, it is possible to transmit the heat sent by the light emitting diode 63 being installed on region 64a efficiently from substrate 3.The radiating part 2 of present embodiment is also preferred to connect with substrate 3 at contact surface 20b viewed from the thickness direction of substrate 3, and the inner side inclusion region 64a of this contact surface 20b makes to connect with region 64a entirety.
Substrate 3 preferably make whole except the position towards recess 5 to connect with radiating part 2 with the face of the installed surface opposite side of light emitting diode 63 (semiconductor light-emitting elements) (being lower surface in the present embodiment).Because except the position towards recess 5 second in substrate 3 whole of 3b (lower surface) connects with the contact surface 20b of radiating part 2, therefore radiating part 2 can discharge by whole except the position of configuration recess 5 of second of substrate 3 3b heat sent from light emitting diode 63 efficiently.
Height dimension L1, L2 of high size component 4 (capacitor 41, terminal board 42) are preferably more than 2 times of the height dimension L0 of light emitting diode 63 (semiconductor light-emitting elements).If by height dimension be second 3b that the high size component 4 of more than 2 times of the height dimension L0 of light emitting diode 63 is installed on substrate 3, even then luminous intensity distribution is the light emitting diode of wide-angle compared with common light emitting diode, high size component 4 also not easily blocks the radiating light of light emitting diode 63.
High size component 4 (capacitor 41) preferably includes electrolytic capacitor.Electrolytic capacitor frequency characteristic compared with the capacitor of other kind is good, therefore, it is possible to follow the change of pulsating volage and the voltage V1 between the two ends of capacitor 41 is remained more than 40V.
In addition, the radiating part 2 of present embodiment possesses 4 fin 21 and 6 fin 22, but the quantity of fin is not limited to this sheet number.In addition, aim is not the shape and the configuration that the shape of fin and configuration are also defined in present embodiment.Radiating part 2 is formed with recess 5, but also can possess the fin of suitable sheet number and suitable shape, and fin can also be configured in suitable position relative to base portion 20.
The substrate 3 of present embodiment is formed as rectangle viewed from above-below direction, but also can be such as the shape that circle etc. is suitable for.
The recess 5 of present embodiment is formed as the height dimension L2 of height dimension L3 (depth dimensions from upper surface 20a sees) ratio capacitance device 41 greatly, but it is larger than the height dimension of the highest parts in high size component 4 also can be formed as height dimension L3.
Second 3b of the substrate 3 of present embodiment also except being configured with high size component 4, can also be configured with the parts forming lighting circuit 10.
What the control part 65 of present embodiment controlled illuminating part 64 according to the magnitude of voltage of voltage V1 lights/OFF state, but such as also can be configured to control as follows: input dim signal, makes illuminating part 64 dimming igniting according to this dim signal.
Whenever the magnitude of voltage of inputted voltage V1 is more than 40V, 80V, 120V, the control circuit 75 of present embodiment makes the illuminating state of illuminating part 64 change, but aim is not that the magnitude of voltage that the illuminating state of illuminating part 64 is changed is defined in above-mentioned magnitude of voltage.What also can make the illuminating state of illuminating part 64 and ligthing paraphernalia 100 to control circuit 75 setting arranges the suitable magnitude of voltage that environment correspondingly changes.
Then, be described with reference to the ligthing paraphernalia 100,110 of Fig. 7 and Fig. 8 to present embodiment.
Figure 7 illustrates the ligthing paraphernalia 100 of Down lamp type (downlight).
Ligthing paraphernalia 100 possesses light-emitting device 1 and keeps the appliance body 102 of light-emitting device 1.Appliance body 102 such as utilizes metal material to be formed as tubular, and maintains light-emitting device 1 in inside.
Ligthing paraphernalia 100 is used as ceiling-mounted and irradiates the Down lamp of below.Appliance body 102 is provided with the frame portion 105 of the marginal portion in the hole for appliance body 102 being fixed on ceiling.In addition, ligthing paraphernalia 100 also can possess the diffusion part 103 for making the light diffusion of radiating from illuminating part 64.
In addition, as shown in Figure 8, ligthing paraphernalia also can be the ligthing paraphernalia 110 of the projector type possessing appliance body 107.Figure 8 illustrates the example of the ligthing paraphernalia 110 being accommodated with following light-emitting device 1, this light-emitting device 1 possesses discoideus substrate 3 and profile is formed as cylindric radiating part 2.
Ligthing paraphernalia 110 possesses light-emitting device 1 and keeps the appliance body 107 of light-emitting device 1.Appliance body 107 such as utilizes metal material to be formed as tubular, and maintains light-emitting device 1 in inside.Maintain light-emitting device 1 in the inside of appliance body 107, one end of cable 104 is electrically connected on terminal board 42.Each fore-end of the arm 106 of bifurcated is rotatably installed on appliance body 107.Appliance body 107 change in the vertical direction towards.The middle body of the bifurcated of arm 106 is installed in the mode rotatable in horizontal plane relative to base portion 120.Base portion 120 is installed on the rectangular distribution trough 121 being fixed on ceiling with moving freely.The conductive member of power supply is installed on distribution trough 121 along its length, and the collecting ring being electrically connected on this conductive member is arranged at base portion 120.The other end of cable 104 is electrically connected on the collecting ring of base portion 120.That is, appliance body 107 suspends in midair from distribution trough 121, makes it possible to change illumination direction, lighting position freely, and provides electric power via cable 104 from distribution trough 121.In addition, ligthing paraphernalia 110 also can possess the diffusion part 103 for making the light diffusion of radiating from illuminating part 64.
In addition, aim is not that the embodiment of ligthing paraphernalia is defined in the ligthing paraphernalia 110 shown in the ligthing paraphernalia 100 shown in Fig. 7 and Fig. 8.Ligthing paraphernalia 100,110 possesses the appliance body keeping above-mentioned light-emitting device 1, also can be the suitable ligthing paraphernalia formed according to environment for use.
As described above, the ligthing paraphernalia 100 of present embodiment possesses above-mentioned light-emitting device 1 and keeps the appliance body 102 of light-emitting device 1.The ligthing paraphernalia 110 of present embodiment possesses above-mentioned light-emitting device 1 and keeps the appliance body 107 of light-emitting device 1.Ligthing paraphernalia 100,110 can realize following ligthing paraphernalia by possessing light-emitting device 1: the high size component 4 be installed on substrate 3 not easily blocks the radiating light of light emitting diode 63, and is easy to radiating part 2 to be installed on substrate 3.In addition, the ligthing paraphernalia 100,110 of present embodiment also plays following effect: light-emitting device 1 miniaturized compared with the light-emitting device configuring high size component 4 by use and the upper surface at substrate 3, and appliance body can be made miniaturized.
Claims (7)
1. a light-emitting device, is characterized in that, possesses:
Semiconductor light-emitting elements;
Lighting circuit, it makes above-mentioned semiconductor light-emitting elements light;
Substrate, it is provided with the component parts of above-mentioned lighting circuit and above-mentioned semiconductor light-emitting elements; And
Radiating part, it is formed as larger than the profile of aforesaid substrate viewed from the thickness direction of aforesaid substrate, and connects with aforesaid substrate,
Wherein, the high size component that height dimension in above-mentioned component parts is larger than the height dimension of above-mentioned semiconductor light-emitting elements be installed on aforesaid substrate with the face of the installed surface opposite side of above-mentioned semiconductor light-emitting elements and the position in the outer part, installation region be installed on than above-mentioned semiconductor light-emitting elements
Above-mentioned radiating part is formed with the recess for receiving above-mentioned high size component.
2. light-emitting device according to claim 1, is characterized in that,
Above-mentioned radiating part under being configured to the state being accommodated with above-mentioned high size component in above-mentioned recess above-mentioned high size component do not reach the outside of the profile of above-mentioned radiating part.
3. light-emitting device according to claim 1 and 2, is characterized in that,
The region that above-mentioned radiating part connects with aforesaid substrate is larger than the above-mentioned installation region of above-mentioned semiconductor light-emitting elements.
4. light-emitting device according to claim 1 and 2, is characterized in that,
Whole that is configured to except the position towards above-mentioned recess with the face of the installed surface opposite side of above-mentioned semiconductor light-emitting elements of aforesaid substrate connects with above-mentioned radiating part.
5. light-emitting device according to claim 1 and 2, is characterized in that,
The height dimension of above-mentioned high size component is more than 2 times of the height dimension of above-mentioned semiconductor light-emitting elements.
6. light-emitting device according to claim 1 and 2, is characterized in that,
Above-mentioned high size component comprises electrolytic capacitor.
7. a ligthing paraphernalia, is characterized in that, possesses:
Light-emitting device according to any one in claim 1 ~ 6; And
Appliance body, it is for keeping above-mentioned light-emitting device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-155385 | 2014-07-30 | ||
| JP2014155385A JP6471887B2 (en) | 2014-07-30 | 2014-07-30 | Light emitting device and lighting apparatus using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204785755U true CN204785755U (en) | 2015-11-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520561291.1U Active CN204785755U (en) | 2014-07-30 | 2015-07-29 | Illuminator and ligthing paraphernalia |
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| Country | Link |
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| JP (1) | JP6471887B2 (en) |
| CN (1) | CN204785755U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110036237A (en) * | 2016-11-22 | 2019-07-19 | 胡贝尔公司 | The LED circuit board of slim lighting apparatus is laid out |
| CN111836509A (en) * | 2019-04-18 | 2020-10-27 | 威刚科技股份有限公司 | Controller device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7199048B2 (en) * | 2018-09-19 | 2023-01-05 | パナソニックＩｐマネジメント株式会社 | LIGHT-EMITTING DEVICE AND MOVING OBJECT INCLUDING THE SAME |
| JP2021051928A (en) * | 2019-09-25 | 2021-04-01 | 東芝ライテック株式会社 | Light emitting module and lighting device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5614794B2 (en) * | 2008-02-14 | 2014-10-29 | 東芝ライテック株式会社 | Lighting device |
| JP5347515B2 (en) * | 2009-01-09 | 2013-11-20 | 東芝ライテック株式会社 | Lighting device |
| JP2011204442A (en) * | 2010-03-25 | 2011-10-13 | Mitsubishi Electric Lighting Corp | Lighting system |
| JP5681530B2 (en) * | 2011-03-03 | 2015-03-11 | パナソニックＩｐマネジメント株式会社 | Emergency lighting equipment |
-
2014
- 2014-07-30 JP JP2014155385A patent/JP6471887B2/en not_active Expired - Fee Related
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2015
- 2015-07-29 CN CN201520561291.1U patent/CN204785755U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110036237A (en) * | 2016-11-22 | 2019-07-19 | 胡贝尔公司 | The LED circuit board of slim lighting apparatus is laid out |
| US10928048B2 (en) | 2016-11-22 | 2021-02-23 | Hubbell Incorporated | LED circuit board layout for low profile lighting fixture |
| US11143391B2 (en) | 2016-11-22 | 2021-10-12 | Hubbell Incorporated | LED circuit board layout for low profile lighting fixture |
| CN111836509A (en) * | 2019-04-18 | 2020-10-27 | 威刚科技股份有限公司 | Controller device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6471887B2 (en) | 2019-02-20 |
| JP2016031923A (en) | 2016-03-07 |
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