CN107388074A - Lighting device - Google Patents
Lighting device Download PDFInfo
- Publication number
- CN107388074A CN107388074A CN201710341962.7A CN201710341962A CN107388074A CN 107388074 A CN107388074 A CN 107388074A CN 201710341962 A CN201710341962 A CN 201710341962A CN 107388074 A CN107388074 A CN 107388074A
- Authority
- CN
- China
- Prior art keywords
- light
- lighting device
- emitting elements
- light emitting
- cover member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/65—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/045—Optical design with spherical surface
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
提供一种既能够抑制亮度不均匀而得到均一的发光、且能够实现小型化以及薄型化的照明装置。照明装置(1)具备:多个发光元件(12);多个光扩散结构体(21),被形成为与多个发光元件(12)的每一个一一对应,并使从多个发光元件(12)的每一个射出的光扩散;以及罩部件(30),以覆盖多个发光元件(12)的方式而被配置,具有透光性以及光扩散性,多个发光元件(12)的每一个被配置成,朝向多个光扩散结构体(21)的每一个。
Provided is an illuminating device capable of suppressing unevenness in luminance and obtaining uniform light emission, and achieving miniaturization and thinning. The lighting device (1) has: a plurality of light-emitting elements (12); a plurality of light-diffusing structures (21), which are formed in one-to-one correspondence with each of the plurality of light-emitting elements (12), and make the plurality of light-emitting elements Each of (12) diffuses the light emitted; and the cover member (30) is configured to cover the plurality of light emitting elements (12), has light transmission and light diffusivity, and the plurality of light emitting elements (12) Each is arranged to face each of the plurality of light-diffusing structures (21).
Description
技术领域technical field
本发明涉及照明装置,尤其涉及将发光二极管(LED:Light Emitting Diode)作为光源的照明装置。The present invention relates to a lighting device, in particular to a lighting device using a light emitting diode (LED: Light Emitting Diode) as a light source.
背景技术Background technique
LED等固体发光元件作为高效节能型的光源,被广范应用于照明装置或显示器等各种设备。在照明用途中,LED例如用于被设置在天花板或墙壁等建筑构件的吸顶灯或筒灯等各种照明器具、或者作为照明器具的光源用于灯泡形灯、直管灯等各种灯。Solid-state light-emitting elements such as LEDs are used as high-efficiency and energy-saving light sources, and are widely used in various equipment such as lighting devices and displays. In lighting applications, LEDs are used in various lighting fixtures such as ceiling lamps and downlights installed on architectural components such as ceilings and walls, or in various lamps such as bulb-shaped lamps and straight tube lamps as light sources of lighting fixtures.
例如,在专利文献1中公开了一种细长状的照明器具,该细长状的照明器具具备:LED照明单元、以及能够装卸自如地安装LED照明单元的照明器具外壳,LED照明单元具备细长状的基板,在该细长状的基板上多个LED被排列配置呈直线状。For example, Patent Document 1 discloses an elongated lighting fixture that includes an LED lighting unit and a lighting fixture housing that can detachably mount the LED lighting unit. An elongated substrate on which a plurality of LEDs are arranged linearly.
现有技术文献prior art literature
专利文献patent documents
专利文献1日本特开2005-302484号公报Patent Document 1 Japanese Unexamined Patent Publication No. 2005-302484
特許文献2日本特开2009-259545号公报Patent Document 2 Japanese Patent Application Laid-Open No. 2009-259545
在采用了多个发光元件的照明装置中,在点灯时,光的颗粒感(亮点)显著,产生亮度不均匀。尤其LED是方向性较强的点光源,因此,在作为发光元件而采用了多个LED的照明装置中,亮度不均匀则更显著。并且,对于多个发光元件被配置成直线状的细长状的照明装置而言,与多个发光元件被配置成矩阵状的照明装置相比,则更容易感到亮度不均匀。In a lighting device using a plurality of light-emitting elements, light graininess (bright spots) is conspicuous at the time of lighting, resulting in uneven brightness. In particular, LEDs are point light sources with strong directivity. Therefore, in a lighting device using a plurality of LEDs as a light emitting element, the brightness unevenness becomes more conspicuous. In addition, in an elongated lighting device in which a plurality of light emitting elements are arranged linearly, brightness unevenness is more likely to be felt than in a lighting device in which a plurality of light emitting elements are arranged in a matrix.
这样,在采用了多个发光元件的照明装置中,由于产生亮度不均匀,因此难于得到均一的发光。As described above, in a lighting device using a plurality of light emitting elements, it is difficult to obtain uniform light emission due to uneven brightness.
因此提出了如下的细长状的照明装置,即,使来自LED的射出光由被设置在框体内部的扩散反射面进行一次扩散反射后在提取到外部,这样能够得到均一的、且没有亮斑的线状的发光(专利文献2)。Therefore, a slender lighting device has been proposed, that is, the emitted light from the LED is diffused and reflected once by the diffuse reflection surface provided inside the frame and then extracted to the outside, so that a uniform and non-luminous light can be obtained. Spotted linear light emission (Patent Document 2).
但是,在专利文献2公开的照明装置中,为了实现均一的发光,需要确保具有规定大小的用于对光进行扩散的内部空间区域。为此,在专利文献2所公开的照明装置的构成中,使装置全体小型化以及薄型化受到限制。However, in the lighting device disclosed in Patent Document 2, in order to realize uniform light emission, it is necessary to secure an internal space region having a predetermined size for diffusing light. For this reason, in the configuration of the lighting device disclosed in Patent Document 2, there are restrictions on reducing the size and thickness of the entire device.
发明内容Contents of the invention
本发明为了解决上述的课题,目的在于提供一种能够抑制亮度不均匀而得到均一的发光、且能够实现小型化以及薄型化的照明装置。In order to solve the above-mentioned problems, an object of the present invention is to provide an illuminating device capable of suppressing luminance unevenness, obtaining uniform light emission, and achieving miniaturization and thinning.
为了实现上述的目的,本发明所涉及的照明装置的一个形态为,具备:多个发光元件;多个光扩散结构体,被形成为与所述多个发光元件的每一个一一对应,并使从所述多个发光元件的每一个射出的光扩散;以及罩部件,以覆盖所述多个发光元件的方式而被配置,具有透光性以及光扩散性,所述多个发光元件的每一个被配置成,朝向所述多个光扩散结构体的每一个。In order to achieve the above object, an aspect of the lighting device according to the present invention includes: a plurality of light emitting elements; and a plurality of light diffusion structures formed in one-to-one correspondence with each of the plurality of light emitting elements, and Diffuse the light emitted from each of the plurality of light emitting elements; and the cover member is arranged to cover the plurality of light emitting elements, has light transmission and light diffusivity, and the plurality of light emitting elements Each is configured to face each of the plurality of light-diffusing structures.
通过本发明,能够抑制亮度不均匀而得到均一的发光、且能够实现小型化以及薄型化的照明装置。According to the present invention, it is possible to obtain uniform light emission while suppressing brightness unevenness, and to realize a miniaturized and thinned illuminating device.
附图说明Description of drawings
图1是示出实施方式所涉及的照明装置的外观的斜视图。FIG. 1 is a perspective view showing the appearance of a lighting device according to the embodiment.
图2A是在模式上示出实施方式所涉及的照明装置的内部结构的截面图。2A is a cross-sectional view schematically showing the internal structure of the lighting device according to the embodiment.
图2B是图2A的IIB-IIB线处的实施方式所涉及的照明装置的截面图。FIG. 2B is a cross-sectional view of the lighting device according to the embodiment at the line IIB-IIB in FIG. 2A .
图3A是用于说明实施方式所涉及的照明装置的光学作用的主要部分的放大截面图。3A is an enlarged cross-sectional view of main parts for explaining the optical action of the lighting device according to the embodiment.
图3B是用于说明实施方式所涉及的照明装置的光学作用的截面图。3B is a cross-sectional view for explaining the optical action of the lighting device according to the embodiment.
图4A是在模式上示出变形例所涉及的照明装置的内部结构的截面图。4A is a cross-sectional view schematically showing the internal structure of a lighting device according to a modified example.
图4B是图4A的IVB-IVB线处的变形例所涉及的照明装置的截面图。FIG. 4B is a cross-sectional view of the lighting device according to a modified example taken along line IVB-IVB of FIG. 4A .
符号说明Symbol Description
1 照明装置1 Lighting device
10 发光模块10 Lighting modules
11 基板11 Substrate
12 发光元件12 light emitting elements
12a 封装体12a package
12b LED芯片12b LED chip
12c 密封部件12c Sealing parts
20、20A 反射部件20, 20A reflective part
20a 倾斜面20a sloped surface
21 光扩散结构体21 light diffusing structure
30 罩部件30 cover parts
40 基台40 Abutments
41 底部41 bottom
42 第1侧壁部42 1st side wall
43 第2侧壁部43 Second side wall
50 末端罩50 end shield
60 电源单元60 power supply unit
具体实施方式detailed description
以下对本发明的实施方式进行说明。并且,以下将要说明的实施方式均为示出本发明的优选的具体例子。因此,以下的实施方式所示的数值、形状、材料、构成要素、构成要素的配置位置以及连接方式等均为一个例子,主旨并非是对本发明进行限定。因此,对于以下的实施方式的构成要素中的示出本发明的最上位概念的技术特征中所没有记载的构成要素,作为任意的构成要素来说明。Embodiments of the present invention will be described below. In addition, the embodiments described below are all preferred specific examples showing the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement positions of the constituent elements, connection methods, etc. shown in the following embodiments are all examples, and are not intended to limit the present invention. Therefore, among the constituent elements of the following embodiments, those not described in the technical features showing the most general concept of the present invention will be described as arbitrary constituent elements.
各个图为模式图,并非严谨的图示。因此,例如各个图中的比例尺等也可以不必一致。并且,在各个图中,对于是之上相同的构成赋予相同的符号,并省略重复的说明或进行简化。Each figure is a schematic diagram, not a strict illustration. Therefore, for example, scales and the like in the respective drawings do not necessarily have to match. In addition, in each figure, the same code|symbol is attached|subjected to the same structure above and above, and repeated description is abbreviate|omitted or simplified.
并且,在本说明书以及附图中,X轴、Y轴以及Z轴表示三维正交坐标系的三个轴。X轴以及Y轴彼此正交,并且是均与Z轴正交的轴。In addition, in this specification and the drawings, the X axis, the Y axis, and the Z axis represent three axes of a three-dimensional orthogonal coordinate system. The X-axis and the Y-axis are orthogonal to each other, and both are orthogonal to the Z-axis.
(实施方式)(implementation mode)
[照明装置的构成][Structure of lighting device]
利用图1、图2A以及图2B对实施方式所涉及的照明装置1的构成进行说明。图1是示出实施方式所涉及的照明装置1的外观的斜视图。图2A是在模式上示出该照明装置1的内部结构的截面图(XY平面上的截面图),图2B是图2A的IIB-IIB线处的该照明装置1的截面图(YZ平面上的截面图)。The structure of the lighting device 1 which concerns on embodiment is demonstrated using FIG. 1, FIG. 2A, and FIG. 2B. FIG. 1 is a perspective view showing the appearance of a lighting device 1 according to the embodiment. 2A is a schematic sectional view (sectional view on the XY plane) showing the internal structure of the lighting device 1, and FIG. 2B is a sectional view (on the YZ plane) of the lighting device 1 at the IIB-IIB line in FIG. sectional view).
如图1、图2A以及图2B所示,照明装置1具备:具有多个发光元件12的发光模块10、具有多个光扩散结构体21的反射部件20、覆盖多个发光元件12的罩部件30、基台40、以及末端罩50。As shown in FIG. 1 , FIG. 2A and FIG. 2B , the lighting device 1 includes: a light-emitting module 10 having a plurality of light-emitting elements 12 , a reflection member 20 having a plurality of light-diffusing structures 21 , and a cover member covering the plurality of light-emitting elements 12 . 30 , abutment 40 , and end cap 50 .
本实施方式中的照明装置1是细长状的照明器具,例如被设置在住宅或设施等建筑物的墙壁或天花板等建筑构件、或者厨房、洗面台等住宅设备等规定的设置位置。The lighting device 1 in this embodiment is an elongated lighting fixture, and is installed, for example, at predetermined installation positions such as building members such as walls and ceilings of buildings such as houses and facilities, or residential equipment such as kitchens and washstands.
发光模块10是照明装置1的光源模块,照射规定的颜色的光。例如,发光模块10虽然照射白光,但是并非受此所限。在本实施方式中,发光模块10为细长状。并且,被内置于照明装置1的发光模块10可以是一个或多个。The light emitting module 10 is a light source module of the lighting device 1 and emits light of a predetermined color. For example, although the light emitting module 10 emits white light, it is not limited thereto. In this embodiment, the light emitting module 10 is elongated. Also, there may be one or more light emitting modules 10 built into the lighting device 1 .
如图2A以及图2B所示,发光模块10具备:基板11、被配置在基板11的多个发光元件12。As shown in FIGS. 2A and 2B , the light emitting module 10 includes a substrate 11 and a plurality of light emitting elements 12 arranged on the substrate 11 .
基板11是用于安装发光元件12的安装基板。作为基板11,例如能够采用玻璃环氧材料等树脂材料为基底的树脂基板、以金属为基底并被绝缘被覆的金属基底基板、或者氧化铝等陶瓷材料的烧结体的陶瓷基板等。The substrate 11 is a mounting substrate for mounting the light emitting element 12 . As the substrate 11 , for example, a resin substrate based on a resin material such as glass epoxy material, a metal base substrate with an insulating coating on a metal base, or a ceramic substrate such as a sintered body of a ceramic material such as alumina can be used.
在本实施方式中,基板11虽然是细长状的矩形基板,但是基板11的形状并非受此所限。并且,基板11虽然是硬质基板,不过并非受此所限,也可以是具有柔性的柔性基板。In this embodiment, although the substrate 11 is an elongated rectangular substrate, the shape of the substrate 11 is not limited thereto. In addition, although the substrate 11 is a hard substrate, it is not limited thereto, and may be a flexible substrate having flexibility.
另外,虽然没有进行图示,在基板11上设置了用于将直流电供给到发光元件12的金属布线、以及用于从外部接受使发光元件12发光的电力的连接端子。金属布线以规定的图案被形成在基板11的一侧的面上。In addition, although not shown in the figure, metal wiring for supplying direct current to the light emitting element 12 and connection terminals for externally receiving electric power for causing the light emitting element 12 to emit light are provided on the substrate 11 . Metal wiring is formed in a predetermined pattern on one surface of the substrate 11 .
多个发光元件12的每一个例如是LED光源。作为一个例子,各个发光元件12是每个被分别封装的表面贴装(SMD:Surface Mount Device)型的LED元件,如图2B所示,具备:具有凹部的白色树脂制的封装体12a、被一次安装到封装体12A的凹部的底面的LED芯片12b(裸芯片)、以及被封入到封装体12A的凹部内的密封部件12c。密封部件12c例如由硅树脂等透光性树脂材料构成。密封部件12c是含有荧光体等波长变换材料的含荧光体树脂。在本实施方式中,各个发光元件12是B-Y型的白光光源,作为LED芯片12b采用发出蓝色光的蓝色LED芯片,并且作为分散到密封部件12c的荧光体采用YAG等黄色荧光体。Each of the plurality of light emitting elements 12 is, for example, an LED light source. As an example, each light-emitting element 12 is a surface mount (SMD: Surface Mount Device) type LED element that is individually packaged. As shown in FIG. The LED chip 12b (bare chip) mounted once on the bottom surface of the concave portion of the package 12A, and the sealing member 12c sealed in the concave portion of the package 12A. The sealing member 12c is made of a translucent resin material such as silicone resin, for example. The sealing member 12c is a phosphor-containing resin containing a wavelength conversion material such as a phosphor. In this embodiment, each light emitting element 12 is a B-Y type white light source, a blue LED chip emitting blue light is used as the LED chip 12b, and a yellow phosphor such as YAG is used as the phosphor dispersed in the sealing member 12c.
多个发光元件12被配置在基板11的一侧的面上(正面)。具体而言,多个发光元件12沿着基板11的长度方向(X轴方向)而被安装成一条直线状。并且,多个发光元件12虽然被等间隔地配置,不过并非受此所限。A plurality of light emitting elements 12 are arranged on one surface (front surface) of the substrate 11 . Specifically, the plurality of light emitting elements 12 are mounted in a straight line along the longitudinal direction (X-axis direction) of the substrate 11 . In addition, although the plurality of light emitting elements 12 are arranged at equal intervals, it is not limited thereto.
多个发光元件12的每一个被配置成朝向多个光扩散结构体21的每一个。多个发光元件12与多个光扩散结构体21一一对应。即被形成为,一个光扩散结构体21与一个发光元件12对应。具体而言,多个光扩散结构体21沿着与多个发光元件12的排列方向相同的方向被配置成一列,相邻的两个光扩散结构体21的间隔(间距)与相邻的两个发光元件12的间隔(间距)相同。并且,虽然光扩散结构体21与发光元件12的数量相同,但是并非受此所限。Each of the plurality of light-emitting elements 12 is disposed facing each of the plurality of light-diffusing structures 21 . The plurality of light-emitting elements 12 corresponds to the plurality of light-diffusing structures 21 one-to-one. That is, one light-diffusing structure 21 is formed so as to correspond to one light-emitting element 12 . Specifically, the plurality of light-diffusing structures 21 are arranged in a row along the same direction as the direction in which the plurality of light-emitting elements 12 are arranged, and the interval (pitch) between two adjacent light-diffusing structures 21 is the same as that between two adjacent light-diffusing structures 21 . The intervals (pitches) of the light emitting elements 12 are the same. Moreover, although the number of the light-diffusion structure 21 and the light emitting element 12 is the same, it is not limited to this.
这样,多个发光元件12以及多个光扩散结构体21以并列的方式被分别配置成直线状。并且,多个发光元件12以及多个光扩散结构体21沿着罩部件30的长度方向(X轴方向)而被配置。In this way, the plurality of light-emitting elements 12 and the plurality of light-diffusing structures 21 are arranged in a straight line, respectively, in parallel. And the some light emitting element 12 and the some light-diffusion structure 21 are arrange|positioned along the longitudinal direction (X-axis direction) of the cover member 30. As shown in FIG.
在本实施方式中,各个光扩散结构体21被形成为,与对应的各个发光元件12的光轴重叠。因此,光扩散结构体21被形成为,位于发光元件12的配光角的中心方向的延长线上。作为一个例子,各个发光元件12的光轴方向是与Y轴平行的方向。In the present embodiment, each light diffusion structure 21 is formed so as to overlap the optical axis of each corresponding light emitting element 12 . Therefore, the light-diffusing structure 21 is formed so as to be located on an extension line in the central direction of the light distribution angle of the light-emitting element 12 . As an example, the direction of the optical axis of each light emitting element 12 is a direction parallel to the Y axis.
多个光扩散结构体21的每一个,使从多个发光元件12的每一个射出的光扩散。具体而言,从一个发光元件12射出的光通过在与该发光元件12相对而形成的光扩散结构体21被散射,从而被扩散。Each of the plurality of light-diffusing structures 21 diffuses light emitted from each of the plurality of light-emitting elements 12 . Specifically, the light emitted from one light-emitting element 12 is diffused by being scattered by the light-diffusing structure 21 formed to face the light-emitting element 12 .
在本实施方式中,多个光扩散结构体21的每一个通过对多个发光元件12的每一个射出的光进行反射,从而使光扩散。具体而言,从一个发光元件12射出的光到达与该发光元件12相对而形成的光扩散结构体21的表面,通过散射、反射而被扩散。In the present embodiment, each of the plurality of light-diffusing structures 21 diffuses light by reflecting light emitted from each of the plurality of light-emitting elements 12 . Specifically, the light emitted from one light-emitting element 12 reaches the surface of the light-diffusing structure 21 formed to face the light-emitting element 12, and is diffused by scattering and reflection.
光扩散结构体21的形状可以是,能够使来自发光元件12的光均等地向全方位扩散的形状。例如,图2A以及图2B所示,通过使各个光扩散结构体21为半球状,使表面形状为球面,从而能够将从发光元件12射出的光在光扩散结构体21反射,并以能够使光向全方位行进的方式来进行扩散。The shape of the light-diffusing structure 21 may be a shape capable of uniformly diffusing light from the light-emitting element 12 in all directions. For example, as shown in FIG. 2A and FIG. 2B, by making each light-diffusing structure 21 hemispherical and making the surface shape spherical, the light emitted from the light-emitting element 12 can be reflected on the light-diffusing structure 21, and the Light diffuses in a way that travels in all directions.
光扩散结构体21例如由金属微粒子等光扩散材料分散而成的树脂材料构成。作为一个例子,光扩散结构体21是将作为光扩散材料的白色的光扩散微粒子(白色微粒子)分散到聚碳酸脂或丙烯酸等树脂材料的白色树脂。并且,光扩散结构体21并非受树脂材料所限,也可以由在表面形成有白色塗膜等光反射膜的金属体构成。The light-diffusing structure 21 is made of, for example, a resin material in which a light-diffusing material such as metal fine particles is dispersed. As an example, the light-diffusing structure 21 is a white resin obtained by dispersing white light-diffusing fine particles (white fine particles) as a light-diffusing material in a resin material such as polycarbonate or acrylic. Moreover, the light-diffusion structure 21 is not limited to a resin material, You may consist of the metal body in which the light reflection film, such as a white coating film, was formed in the surface.
并且,光扩散结构体21并非受限于将发光元件12的光在表面进行全反射的构成,也可以是,使发光元件12的光入射到内部来进行散射的构成。即,光扩散结构体21只要是对光进行扩散的结构,其也可以具有透光性。Moreover, the light-diffusion structure 21 is not limited to the structure which totally reflects the light of the light-emitting element 12 on the surface, The light of the light-emitting element 12 may make it enter inside and scatter it. That is, the light-diffusion structure 21 may have translucency as long as it diffuses light.
光扩散结构体21被设置在反射部件20。在本实施方式中,多个光扩散结构体21以及反射部件20被形成为一体,光扩散结构体21是反射部件20的一部分。因此,反射部件20采用与光扩散结构体21相同的材料来构成。在这种情况下,反射部件20以及光扩散结构体21例如采用白色树脂通过一体成型而被制作。被这样制作的反射部件20具有与光扩散结构体21相同的光反射性,对发光元件12的光进行反射。The light diffusion structure 21 is provided on the reflection member 20 . In this embodiment, the some light-diffusion structure 21 and the reflection member 20 are integrally formed, and the light-diffusion structure 21 is a part of the reflection member 20. Therefore, the reflection member 20 is comprised using the same material as the light-diffusion structure 21. In this case, the reflective member 20 and the light-diffusion structure 21 are produced by integral molding using white resin, for example. The reflective member 20 produced in this way has the same light reflectivity as the light-diffusing structure 21 , and reflects light from the light-emitting element 12 .
反射部件20具有向多个发光元件12倾斜的倾斜面20a。具体而言,反射部件20是具有在大致为三角柱状体的罩部件30一侧的面上,设置了多个半球状的光扩散结构体21的形状的反射体,反射部件20的罩部件30一侧的面成为,向多个发光元件12倾斜的倾斜面20a。倾斜面20a相对于基台40的底部41的底面,以规定的角度倾斜。在本实施方式中,倾斜面20a是光反射面。The reflective member 20 has an inclined surface 20 a inclined toward the plurality of light emitting elements 12 . Specifically, the reflection member 20 is a reflector having a shape in which a plurality of hemispherical light diffusion structures 21 are provided on the surface of the cover member 30 side of a substantially triangular prism body, and the cover member 30 of the reflection member 20 One surface serves as an inclined surface 20 a inclined toward the plurality of light emitting elements 12 . The inclined surface 20 a is inclined at a predetermined angle with respect to the bottom surface of the bottom portion 41 of the base 40 . In this embodiment, the inclined surface 20a is a light reflection surface.
罩部件30具有透光性以及光扩散性(光散射性)。由光扩散结构体21扩散的、来自发光元件12的光入射到罩部件30。并且,在反射部件20的倾斜面20a反射的来自发光元件12的光以及直接来自发光元件12的光也入射到罩部件30。入射到罩部件30的光透过罩部件30而射出到外部。此时,入射到罩部件30的光被扩散(散射)而射出到外部。The cover member 30 has light-transmitting properties and light-diffusing properties (light-scattering properties). The light from the light emitting element 12 diffused by the light diffusion structure 21 enters the cover member 30 . In addition, the light from the light emitting element 12 reflected on the inclined surface 20 a of the reflection member 20 and the light directly from the light emitting element 12 also enter the cover member 30 . The light incident on the cover member 30 passes through the cover member 30 and is emitted to the outside. At this time, the light incident on the cover member 30 is diffused (scattered) and emitted to the outside.
罩部件30例如由聚碳酸脂或丙烯酸等透光性树脂材料或玻璃材料等具有透光性的材料构成。The cover member 30 is made of, for example, a translucent resin material such as polycarbonate or acrylic, or a translucent material such as a glass material.
罩部件30的光扩散性,例如通过将光反射微粒子等的光扩散材料分散到透光性树脂材料,或者在罩部件30的表面(内表面或外表面)形成含有光扩散材料等乳白色的光扩散膜来实现。并且,也可以不使用光扩散材料,而通过在罩部件30的表面进行表面纹理加工处理等而在表面形成微小的凹凸,或者对罩部件30的表面印刷点状图案等,来使罩部件30具有光扩散性。The light diffusibility of the cover member 30 is achieved by, for example, dispersing light-diffusing materials such as light-reflecting microparticles into a light-transmitting resin material, or forming a milky white light-diffusing material such as a light-diffusing material on the surface (inner surface or outer surface) of the cover member 30 . Diffusion membrane to achieve. In addition, instead of using a light diffusing material, the cover member 30 may be formed by performing surface texture processing on the surface of the cover member 30 to form minute unevenness on the surface, or by printing a dot pattern on the surface of the cover member 30. It has light diffusing properties.
具有以上这种构成的罩部件30以覆盖多个发光元件12(发光模块10)的方式而被配置。在本实施方式中,罩部件30被配置成不仅覆盖发光元件12,而且也覆盖反射部件20。在本实施方式中,罩部件30为细长状,罩部件30的长度方向与多个发光元件12的排列方向相同。并且,罩部件30的截面形状如图2B所示,例如是U字状,并且也可以是半圆弧状、形状或直线状。The cover member 30 having the above configuration is arranged to cover the plurality of light emitting elements 12 (light emitting modules 10 ). In the present embodiment, the cover member 30 is arranged not only to cover the light emitting element 12 but also to cover the reflective member 20 . In this embodiment, the cover member 30 has an elongated shape, and the longitudinal direction of the cover member 30 is the same as the arrangement direction of the plurality of light emitting elements 12 . Moreover, the cross-sectional shape of the cover member 30 is, for example, U-shaped as shown in FIG. shape or straight line.
罩部件30被固定在基台40。具体而言,如图2B所示,罩部件30的YZ截面的两端部被固定在基台40的第1侧壁部42以及第2侧壁部43。并且,罩部件30与基台40由粘着剂、咬合等卡合结构或螺钉等来固定。The cover member 30 is fixed to the base 40 . Specifically, as shown in FIG. 2B , both end portions of the YZ cross section of the cover member 30 are fixed to the first side wall portion 42 and the second side wall portion 43 of the base 40 . In addition, the cover member 30 and the base 40 are fixed by an adhesive, an engaging structure such as snapping, screws, or the like.
并且,从YZ截面的罩部件30的上部弯曲而存在的一对侧壁的长度可以按照照明装置1的配光来决定,如图2B所示,长度可以不同,也可以相同。并且,罩部件30也可以被构成为,对来自反射部件20(光扩散结构体21)的光进行配光控制。例如,罩部件30也可以具有聚光或发散的透镜功能。In addition, the lengths of the pair of side walls bent from the upper part of the cover member 30 in the YZ section can be determined according to the light distribution of the lighting device 1 , and as shown in FIG. 2B , the lengths can be different or the same. Moreover, the cover member 30 may be comprised so that light distribution control may be performed on the light from the reflection member 20 (light-diffusion structure 21). For example, the cover member 30 may also have a lens function of concentrating or diverging light.
基台40是支承发光模块10以及反射部件20的基础部件(框架)。如图2B所示,基台40具有底部41、第1侧壁部42、以及第2侧壁部43。基台40例如由板金制成,通过对SPCC(Steel Plate Cold Commercial;冷轧钢板)制的板金(金属板)进行辊轧成形加工或冲压加工等,来形成规定的形状。具体而言,基台40通过底部41、第1侧壁部42、以及第2侧壁部43、从而被形成为截面形状呈“コ”形状。并且,在本实施方式中,虽然第1侧壁部42的高度比第2侧壁部43的高度高,但是并非受此所限。The base 40 is a base member (frame) that supports the light emitting module 10 and the reflection member 20 . As shown in FIG. 2B , the base 40 has a bottom 41 , a first side wall portion 42 , and a second side wall portion 43 . The base 40 is made of sheet metal, for example, and is formed into a predetermined shape by subjecting sheet metal (metal plate) made of SPCC (Steel Plate Cold Commercial) to roll forming or press processing. Specifically, the base 40 is formed to have a U-shaped cross-sectional shape through the bottom 41 , the first side wall portion 42 , and the second side wall portion 43 . Moreover, in this embodiment, although the height of the 1st side wall part 42 is higher than the height of the 2nd side wall part 43, it is not limited to this.
在基台40固定发光模块10。具体而言,发光模块10被固定在基台40的第1侧壁部42。在这种情况下,以在第1侧壁部42的内表面与基板11的其他的面(背面)相接的方式,将发光模块10载置于基台40,通过将基板11固定到第1侧壁部42,从而能够以发光元件12朝向光扩散结构体21的状态,使基台40保持发光模块10。The light emitting module 10 is fixed to the base 40 . Specifically, the light emitting module 10 is fixed to the first side wall portion 42 of the base 40 . In this case, the light-emitting module 10 is placed on the base 40 so that the inner surface of the first side wall portion 42 is in contact with the other surface (back surface) of the substrate 11, and the substrate 11 is fixed to the second surface. 1 side wall portion 42, so that the base 40 can hold the light-emitting module 10 in a state where the light-emitting element 12 faces the light-diffusing structure 21.
并且,在基台40固定反射部件20。具体而言,以反射部件20的底面与基台40的底部41的内表面接触、且反射部件20的侧面与基台40的第2侧壁部43的内表面接触的状态,反射部件20被固定在基台40。Furthermore, the reflection member 20 is fixed to the base 40 . Specifically, in a state where the bottom surface of the reflective member 20 is in contact with the inner surface of the bottom portion 41 of the base 40, and the side surface of the reflective member 20 is in contact with the inner surface of the second side wall portion 43 of the base 40, the reflective member 20 is held. Fixed on the abutment 40.
发光模块10与基台40以及反射部件20与基台40可以通过粘着剂、咬合等卡合结构或者螺钉等来固定。The light emitting module 10 and the base 40 as well as the reflective member 20 and the base 40 can be fixed by an adhesive, snap-fitting structure, or screws.
在本实施方式中,罩部件30与基台40构成框体,在由罩部件30与基台40构成的框体内收纳发光模块10以及反射部件20。并且,如图2A所示,罩部件30的长度方向的长度与基台40的长度方向的长度几乎相同。In this embodiment, the cover member 30 and the base 40 constitute a frame body, and the light emitting module 10 and the reflection member 20 are accommodated in the frame constituted by the cover member 30 and the base 40 . Furthermore, as shown in FIG. 2A , the length in the longitudinal direction of the cover member 30 is substantially the same as the length in the longitudinal direction of the base 40 .
末端罩50是覆盖罩部件30以及基台40的长度方向的两端部的末端盖。即,末端罩50为两个,被安装在罩部件30以及基台40的长度方向的一方与另一方的端部。The end cover 50 is an end cover that covers both ends in the longitudinal direction of the cover member 30 and the base 40 . That is, two end covers 50 are attached to one end and the other end of the cover member 30 and the base 40 in the longitudinal direction.
末端罩50例如通过粘着剂、咬合等卡合结构或者螺钉等被固定在罩部件30以及基台40。末端罩50例如是由PBT(聚对苯二甲酸丁二酯)等树脂材料构成的树脂成形品,也可以由金属材料构成。The end cover 50 is fixed to the cover member 30 and the base 40 with, for example, an adhesive, an engaging structure such as snapping, or screws. The end cover 50 is, for example, a resin molded product made of a resin material such as PBT (polybutylene terephthalate), or may be made of a metal material.
在将具有这种构成的照明装置1设置到建筑材料等设置面的情况下,可以以罩部件30的上部朝向照射方向的方式来配置。在这种情况下,例如可以以基台40的底部41的外表面与设置面相对的姿势来设置照明装置1,也可以以基台40的第1侧壁部42的外表面与设置面相对的姿势来设置照明装置1。When the lighting device 1 having such a configuration is installed on an installation surface such as building materials, it can be arranged so that the upper part of the cover member 30 faces the irradiation direction. In this case, for example, the lighting device 1 may be installed in such a posture that the outer surface of the bottom 41 of the base 40 faces the installation surface, or the outer surface of the first side wall portion 42 of the base 40 may face the installation surface. pose to set the lighting device 1.
并且,在将照明装置1设置到设置面的情况下,也可以使基台40与设置面接触,将基台40固定到设置面,在设置面另外固定安装板,通过将基台40安装到安装板,从而可以将照明装置1设置到设置面。Furthermore, when installing the lighting device 1 on the installation surface, the base 40 may be brought into contact with the installation surface, the base 40 may be fixed to the installation surface, and an installation plate may be separately fixed on the installation surface. The mounting plate, so that the lighting device 1 can be installed on the installation surface.
并且,虽然没有图示,照明装置1经由电源线与电源单元连接。电源单元是生成用于使多个发光元件12发光的电力的电源装置,具有电源电路,通过对商用的交流电进行整流、平滑以及降压等,而转换为规定电平的直流电。电源单元例如具有电路基板、以及被安装在电路基板的多个电路部件(电子部件)。电路基板是铜箔等金属布线被图案化后的印刷电路板(PCB)。多个电路部件例如是电解电容、陶瓷电容等电容元件、电阻器等电阻元件、整流电路元件、线圈元件、扼流线圈(扼流变压器)、静噪滤波器、二极管或集成电路元件等半导体元件等。在电源单元生成的直流电经由电源线被供给到发光模块10。据此,发光模块10(发光元件12)发光。In addition, although not shown in the figure, the lighting device 1 is connected to a power supply unit via a power supply line. The power supply unit is a power supply device that generates electric power for causing the plurality of light emitting elements 12 to emit light. It has a power supply circuit and converts commercial AC power into DC power of a predetermined level by rectifying, smoothing, and stepping down. The power supply unit includes, for example, a circuit board and a plurality of circuit components (electronic components) mounted on the circuit board. The circuit board is a printed circuit board (PCB) in which metal wiring such as copper foil is patterned. The plurality of circuit components are, for example, capacitive elements such as electrolytic capacitors and ceramic capacitors, resistive elements such as resistors, rectifier circuit elements, coil elements, choke coils (choke transformers), noise filters, semiconductor elements such as diodes, and integrated circuit elements Wait. The direct current generated by the power supply unit is supplied to the light emitting module 10 via a power supply line. Accordingly, the light emitting module 10 (light emitting element 12) emits light.
[照明装置的光学作用等][Optical effects of lighting devices, etc.]
接着,利用图3A以及图3B,对包括本实施方式中的照明装置1的光学作用的效果进行说明。图3A是用于说明该照明装置1的光学作用的主要部分的放大截面图(XY平面上的截面图)。图3B是用于说明该照明装置1的光学作用的截面图(YZ平面上的截面图)。Next, effects including the optical action of the lighting device 1 in this embodiment will be described with reference to FIGS. 3A and 3B . FIG. 3A is an enlarged cross-sectional view (cross-sectional view on the XY plane) of main parts for explaining the optical action of the lighting device 1 . FIG. 3B is a cross-sectional view (cross-sectional view on the YZ plane) for explaining the optical action of the lighting device 1 .
如图3A以及图3B所示,各个发光元件12与光扩散结构体21一一对应,并且以朝向光扩散结构体21的方式而被配置。As shown in FIGS. 3A and 3B , each light-emitting element 12 corresponds to the light-diffusing structure 21 one-to-one, and is arranged to face the light-diffusing structure 21 .
据此,从发光元件12射出的光,在对应的光扩散结构体21扩散。在本实施方式中,从发光元件12射出的光由光扩散结构体21反射而被扩散。此时,光扩散结构体21不仅对与该光扩散结构体21相对的一个发光元件12射出的光进行扩散,而且可以对从该发光元件12以外的发光元件12(例如,位于一个发光元件12的相邻两侧的发光元件12)射出的光进行扩散。Accordingly, the light emitted from the light-emitting element 12 is diffused in the corresponding light-diffusing structure 21 . In the present embodiment, the light emitted from the light emitting element 12 is reflected by the light diffusion structure 21 to be diffused. At this time, the light-diffusing structure 21 not only diffuses the light emitted from one light-emitting element 12 facing the light-diffusing structure 21, but also diffuses light emitted from light-emitting elements 12 other than the light-emitting element 12 (for example, located in one light-emitting element 12). The light emitted by the light-emitting elements 12) on the adjacent two sides is diffused.
在光扩散结构体21反射的光透过罩部件30,而射出到罩部件30的外部。此时,在光扩散结构体21反射的光如图3B所示,在透过罩部件30时进行扩散,从而射出到外部。The light reflected by the light diffusion structure 21 passes through the cover member 30 and is emitted to the outside of the cover member 30 . At this time, as shown in FIG. 3B , the light reflected by the light-diffusing structure 21 is diffused while passing through the cover member 30 , and is emitted to the outside.
这样,从发光元件12射出的光在由光扩散结构体21扩散的同时,也由罩部件30扩散。即,从发光元件12射出的光,在光扩散结构体21与罩部件30被两次扩散后射出到外部。In this way, the light emitted from the light emitting element 12 is diffused by the cover member 30 while being diffused by the light diffusion structure 21 . That is, the light emitted from the light emitting element 12 is emitted to the outside after being diffused twice by the light diffusion structure 21 and the cover member 30 .
据此,即使多个发光元件12被离散地配置,从发光元件12射出的光由于被多次扩散,因此,在点灯时因多个发光元件12的光而造成的颗粒感(亮点)则不会显眼。这样,抑制了亮度不均匀,并且能够提高均匀度,因此能够得到均一的发光。Accordingly, even if a plurality of light emitting elements 12 are discretely arranged, since the light emitted from the light emitting elements 12 is diffused multiple times, the graininess (bright spot) caused by the light of the plurality of light emitting elements 12 at the time of lighting will not be affected. will be conspicuous. In this way, unevenness in luminance is suppressed and uniformity can be improved, so that uniform light emission can be obtained.
并且,通过本实施方式的照明装置1,由于无需像专利文献2那样需要较大的内部空间,因此能够容易地实现装置全体的小型化以及薄型化。Furthermore, according to the lighting device 1 of the present embodiment, since it is not necessary to require a large internal space as in Patent Document 2, it is possible to easily reduce the size and thickness of the entire device.
[总结][Summarize]
如以上所述,本实施方式的照明装置1具备:多个发光元件12;多个光扩散结构体21,被形成为与多个发光元件12的每一个一一对应,使从多个发光元件12的每一个射出的光扩散;以及罩部件30,以覆盖多个发光元件12的方式而被配置,具有透光性以及光扩散性。并且,多个发光元件12的每一个与多个光扩散结构体21的每一个相对而置。As described above, the lighting device 1 of the present embodiment includes: a plurality of light emitting elements 12; 12 diffuses light emitted from each one; and the cover member 30 is disposed so as to cover the plurality of light emitting elements 12 and has light transmission and light diffusion properties. And each of the several light-emitting elements 12 is opposed to each of the several light-diffusion structures 21. As shown in FIG.
据此,能够得到抑制了亮度不均匀的均一的发光,并且能够实现小型化以及薄型化的照明装置1。Accordingly, uniform light emission with suppressed brightness unevenness can be obtained, and the illuminating device 1 can be reduced in size and thickness.
并且,在本实施方式中,多个光扩散结构体21的每一个通过对从多个发光元件12的每一个射出的光进行反射,而对光进行扩散。Moreover, in this embodiment, each of the several light-diffusion structures 21 diffuses light by reflecting the light emitted from each of the some light-emitting elements 12 .
这样,通过使从发光元件12射出的光在光扩散结构体21反射并扩散,从而不会使光通量降低,并能够对光进行扩散。因此,能够得到抑制了亮度不均匀的、大光通量的均一的发光。In this way, by reflecting and diffusing the light emitted from the light-emitting element 12 on the light-diffusing structure 21 , the light can be diffused without reducing the luminous flux. Therefore, uniform light emission with a large luminous flux can be obtained with suppressed brightness unevenness.
并且,在本实施方式中,多个光扩散结构体21被设置在反射部件20。Moreover, in this embodiment, the some light-diffusion structure body 21 is provided in the reflection member 20. As shown in FIG.
据此,即使在反射部件20的表面,由于也能够对来自发光元件12的光进行反射,因此能够进一步抑制亮度不均匀,从而能够得到更均一的发光。Accordingly, since the light from the light emitting element 12 can be reflected even on the surface of the reflection member 20 , unevenness in luminance can be further suppressed, and more uniform light emission can be obtained.
而且,在这种情况下,在本实施方式中,反射部件20具有向多个发光元件12倾斜的倾斜面20a。Furthermore, in this case, in this embodiment, the reflective member 20 has the inclined surface 20a inclined toward the plurality of light emitting elements 12 .
据此,能够容易地使来自发光元件12的光到达光扩散结构体21的中央部附近,因此来自发光元件12的光能够容易地被均等的扩散。并且,由于倾斜面20a朝向罩部件30,因此,能够使来自发光元件12的光在倾斜面20a反射,并容易地入射到罩部件30。因此,能够得到更加均一的发光。According to this, the light from the light emitting element 12 can easily reach the vicinity of the center of the light diffusing structure 21 , and therefore the light from the light emitting element 12 can be easily and uniformly diffused. Furthermore, since the inclined surface 20 a faces the cover member 30 , the light from the light emitting element 12 can be reflected on the inclined surface 20 a and easily enter the cover member 30 . Therefore, more uniform light emission can be obtained.
并且,在本实施方式中,多个光扩散结构体21以及反射部件20为一体。Moreover, in this embodiment, the some light-diffusion structure body 21 and the reflection member 20 are integrated.
据此,通过对多个光扩散结构体21以及反射部件20一体成型,从而能够容易地进行制作。According to this, it can manufacture easily by integrally molding the some light-diffusion structure 21 and the reflection member 20.
并且,在本实施方式中,罩部件30为细长状,多个发光元件12以及多个光扩散结构体21沿着罩部件30的长度方向而被配置。In addition, in the present embodiment, the cover member 30 is elongated, and the plurality of light emitting elements 12 and the plurality of light diffusion structures 21 are arranged along the longitudinal direction of the cover member 30 .
据此,能够实现具有直线状均一发光的细长状的照明装置1(直线状光源)。Accordingly, it is possible to realize the elongated lighting device 1 (linear light source) having linear uniform light emission.
(变形例)(Modification)
以上基于实施方式对本发明所涉及的照明装置进行了说明,不过,本发明并非受上述实施方式所限。As mentioned above, although the lighting device which concerns on this invention was demonstrated based on embodiment, this invention is not limited to the said embodiment.
例如,在上述实施方式中,生成用于使多个发光元件12发光的电力的电源单元与照明装置1没有被形成为一体,而是另外设置在照明装置1的外部,不过也可以内置于照明装置1。For example, in the above-mentioned embodiment, the power supply unit for generating the electric power for making the plurality of light emitting elements 12 emit light is not integrally formed with the lighting device 1, but is provided separately outside the lighting device 1, but it may also be built into the lighting device. device 1.
具体而言,在图2A以及图2B中,通过在发光模块10的基板11安装构成电源电路的电路部件,从而能够将电源单元内置于照明装置1。在这种情况下,在照明装置1被提供有来自商用电源的交流电。Specifically, in FIGS. 2A and 2B , by mounting circuit components constituting a power supply circuit on the substrate 11 of the light emitting module 10 , the power supply unit can be incorporated in the lighting device 1 . In this case, the lighting device 1 is supplied with AC power from a commercial power supply.
并且,在将电源单元内置于照明装置的情况下,如图4A以及图4B的照明装置1A所示,可以将反射部件20A作为框体,将电源单元60配置到反射部件20A的内部空间。电源单元60具有:电路基板61、被安装到电路基板61的多个电路部件62。In addition, when the power supply unit is built into the lighting device, as shown in the lighting device 1A of FIG. 4A and FIG. 4B , the reflection member 20A can be used as a housing, and the power supply unit 60 can be arranged in the inner space of the reflection member 20A. The power supply unit 60 has a circuit board 61 and a plurality of circuit components 62 mounted on the circuit board 61 .
在图4A以及图4B,反射部件20A是反射板,例如能够由薄板构成。并且,光扩散结构体21能够通过对薄板的一部分压出成半球状来形成。在这种情况下,构成电源单元60的多个电路部件可以被分散配置在与多个光扩散结构体21对应的位置。并且,在与光扩散结构体21的位置对应的反射部件20A的空间区域中,也可以配置电解电容等具有高度的电路部件。In FIGS. 4A and 4B , the reflective member 20A is a reflective plate, and can be formed of a thin plate, for example. In addition, the light-diffusing structure 21 can be formed by extruding a part of the thin plate into a hemispherical shape. In this case, a plurality of circuit components constituting the power supply unit 60 may be distributed and arranged at positions corresponding to the plurality of light diffusion structures 21 . Moreover, you may arrange|position high circuit components, such as an electrolytic capacitor, in the space area of 20 A of reflective members corresponding to the position of the light-diffusion structure 21.
反射部件20A与上述实施方式相同,可以采用白色树脂等绝缘性树脂材料来形成,只要能够确保与电源单元60(电路部件)的沿面放电的最短距离,也可以采用金属材料来形成。在这种情况下,反射部件20A例如能够采用在表面形成有白色塗膜等的光反射膜的金属板来形成。The reflective member 20A can be formed of an insulating resin material such as white resin as in the above embodiment, or can be formed of a metal material as long as the shortest distance to the power supply unit 60 (circuit component) for creeping discharge can be ensured. In this case, the reflection member 20A can be formed using, for example, a metal plate on which a light reflection film such as a white coating film is formed.
这样,如图4A以及图4B所示,通过将电源单元60配置到反射部件20A内来隐藏,从而与将构成电源电路的电路部件安装到基板11的情况相比,能够实现更加均一的发光。即,若将电路部件安装到基板11,则会因电路部件而遮挡发光元件12的光,从而产生阴影(非发光部)而造成亮度不均匀,然而,通过将电源单元60收纳在反射部件20A内,从而能够防止因电路部件而导致的亮度不均匀的发生。因此,能够实现均一的、且没有非发光部分的连续的发光。Thus, as shown in FIGS. 4A and 4B , by arranging and hiding the power supply unit 60 in the reflective member 20A, more uniform light emission can be realized than when the circuit components constituting the power supply circuit are mounted on the substrate 11 . That is, if the circuit components are mounted on the substrate 11, the light of the light emitting element 12 will be blocked by the circuit components, thereby causing shadows (non-light emitting parts) to cause uneven brightness. inside, thereby preventing the occurrence of brightness unevenness due to circuit components. Therefore, uniform and continuous light emission without non-light emitting portions can be realized.
进一步如图4A以及图4B所示,通过对电路部件进行分散配置,从而能够对多个电路部件之中的发热部件(集成电路等)与耐热性低的电路部件(电解电容等)分离。据此,由于能够抑制电源单元的热老化,因此,能够实现可靠性高的照明装置1A。Further, as shown in FIG. 4A and FIG. 4B , by distributing circuit components, it is possible to separate heat-generating components (integrated circuits, etc.) from circuit components with low heat resistance (electrolytic capacitors, etc.) among a plurality of circuit components. Accordingly, since thermal degradation of the power supply unit can be suppressed, highly reliable lighting device 1A can be realized.
并且,在上述的实施方式中,光扩散结构体21的形状虽然为半球状,但是并非受此所限。例如,也可以是三角锥或四角锥等多角锥状或圆锥等。Moreover, in the above-mentioned embodiment, although the shape of the light-diffusion structure 21 was hemispherical, it is not limited to this. For example, polygonal pyramids such as triangular pyramids and quadrangular pyramids, or cones may be used.
并且,在上述的实施方式中,光扩散结构体21的形状虽然是从反射部件20的表面突出的形状,但是并非受此所限。例如,也可以是,使反射部件20的倾斜面20a粗燥化等,通过在反射部件20的表面形成微小凹凸,来构成光扩散结构体21。在这种情况下,可以是仅在与各个发光元件12相对的部分的倾斜面20a形成圆形或矩形的微小凹凸区域,也可以是针对反射部件20的整个倾斜面20a形成微小凹凸。Moreover, in the above-mentioned embodiment, although the shape of the light-diffusion structure 21 protruded from the surface of the reflection member 20, it is not limited to this. For example, the light-diffusion structure 21 may be comprised by roughening the inclined surface 20a of the reflection member 20, etc., and forming micro uneven|corrugation on the surface of the reflection member 20. In this case, the circular or rectangular minute unevenness region may be formed only on the inclined surface 20 a of the portion facing each light emitting element 12 , or the minute unevenness may be formed on the entire inclined surface 20 a of the reflection member 20 .
并且,在上述的实施方式中,照明装置1也可以具有用于对发光模块10的发光状态进行控制的人感传感器或照度传感器。Furthermore, in the above-mentioned embodiments, the lighting device 1 may include a human detection sensor or an illuminance sensor for controlling the light emitting state of the light emitting module 10 .
并且,在上述的实施方式中,照明装置1具有调光功能。并且,照明装置1也可以具有调色功能。在这种情况下,发光模块10例如具有色温不同的多个发光元件12。Furthermore, in the above-mentioned embodiment, the lighting device 1 has a dimming function. In addition, the lighting device 1 may also have a color adjustment function. In this case, the light emitting module 10 has, for example, a plurality of light emitting elements 12 having different color temperatures.
并且,在上述的实施方式中,发光模块10虽然是作为发光元件12采用了SMD型的LED元件的SMD型的LED模块,但是并非受此所限。例如,发光模块10也可以是作为发光元件12而采用安装了LED芯片的COB(Chip On Board)型的LED模块。在这种情况下,发光模块10的构成中包括:基板11、被直接安装在基板11的一个或多个LED芯片(裸芯片)、以及对LED芯片进行密封的含荧光体树脂等密封部件。In addition, in the above-mentioned embodiment, although the light-emitting module 10 is an SMD-type LED module using an SMD-type LED element as the light-emitting element 12, it is not limited thereto. For example, the light emitting module 10 may be a COB (Chip On Board) type LED module in which an LED chip is mounted as the light emitting element 12 . In this case, the light emitting module 10 includes a substrate 11 , one or more LED chips (bare chips) directly mounted on the substrate 11 , and a sealing member such as phosphor-containing resin that seals the LED chips.
并且,在上述的实施方式中,照明装置1虽然为细长状,但是并非受此所限。例如,照明装置1也可以是圆形或四边形,或者可以是圆环状。In addition, in the above-mentioned embodiment, although the lighting device 1 has a long and thin shape, it is not limited thereto. For example, the lighting device 1 may be circular or quadrilateral, or may be circular.
另外,在不脱离本发明的主旨的情况下,将本领域技术人员所能够想到的各种变形执行于实施方式以及变形例而得到的形态,或者对实施方式以及变形例中的构成要素以及功能进行组合而得到的形态均包含在本发明的范围内。In addition, without departing from the gist of the present invention, various modifications that can be conceived by those skilled in the art are carried out in the embodiment and the modified example, or the components and functions in the embodiment and the modified example are modified. All forms obtained by combining are included in the scope of the present invention.
Claims (7)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-099068 | 2016-05-17 | ||
| JP2016099068A JP6775180B2 (en) | 2016-05-17 | 2016-05-17 | Lighting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107388074A true CN107388074A (en) | 2017-11-24 |
Family
ID=60338980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710341962.7A Pending CN107388074A (en) | 2016-05-17 | 2017-05-16 | Lighting device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6775180B2 (en) |
| CN (1) | CN107388074A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7274820B2 (en) * | 2018-02-02 | 2023-05-17 | 三菱電機株式会社 | lighting equipment |
| EP4548003A4 (en) * | 2022-06-30 | 2025-10-08 | Elemental Led Inc | LINEAR LAMP |
| US11821597B1 (en) | 2022-06-30 | 2023-11-21 | Elemental LED, Inc. | Linear luminaire |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM367286U (en) * | 2008-12-22 | 2009-10-21 | Hsin I Technology Co Ltd | Structure of LED lamp tube |
| CN102032528A (en) * | 2009-09-18 | 2011-04-27 | 敦网光电股份有限公司 | Light emitting device and light diffusion plate |
| US20110103053A1 (en) * | 2009-11-02 | 2011-05-05 | Ledtech Electronics Corp. | LED Lighting Device |
| US20130188347A1 (en) * | 2012-01-22 | 2013-07-25 | Ecolivegreen Corp. | LED Light Fixture |
| CN103574351A (en) * | 2012-07-30 | 2014-02-12 | 船井电机株式会社 | Lighting device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009067098A (en) * | 2007-09-10 | 2009-04-02 | Harison Toshiba Lighting Corp | Lighting device |
| JP5669479B2 (en) * | 2009-08-19 | 2015-02-12 | エルジー イノテック カンパニー リミテッド | Lighting device |
| JP2012174634A (en) * | 2011-02-24 | 2012-09-10 | Sharp Corp | Light source module and optical member |
| JP2013077454A (en) * | 2011-09-30 | 2013-04-25 | Sanyo Electric Co Ltd | Lighting device |
| JP6100645B2 (en) * | 2013-08-21 | 2017-03-22 | 株式会社ロイヤル | Display shelf lighting equipment |
-
2016
- 2016-05-17 JP JP2016099068A patent/JP6775180B2/en active Active
-
2017
- 2017-05-16 CN CN201710341962.7A patent/CN107388074A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM367286U (en) * | 2008-12-22 | 2009-10-21 | Hsin I Technology Co Ltd | Structure of LED lamp tube |
| CN102032528A (en) * | 2009-09-18 | 2011-04-27 | 敦网光电股份有限公司 | Light emitting device and light diffusion plate |
| US20110103053A1 (en) * | 2009-11-02 | 2011-05-05 | Ledtech Electronics Corp. | LED Lighting Device |
| US20130188347A1 (en) * | 2012-01-22 | 2013-07-25 | Ecolivegreen Corp. | LED Light Fixture |
| CN103574351A (en) * | 2012-07-30 | 2014-02-12 | 船井电机株式会社 | Lighting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6775180B2 (en) | 2020-10-28 |
| JP2017208205A (en) | 2017-11-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5327601B2 (en) | Light emitting module and lighting device | |
| CN101794762B (en) | Light source module and lighting device | |
| US20120300430A1 (en) | Light-emitting module and lighting apparatus | |
| JP5681451B2 (en) | Lamp and lighting device | |
| JP2010135747A (en) | Light-emitting module and lighting apparatus | |
| JP6308434B2 (en) | Lighting device | |
| JP6741978B2 (en) | lighting equipment | |
| JP2010251213A (en) | Light emitting module and lighting device | |
| US20170077172A1 (en) | Light-emitting device and illumination light source | |
| CN107388074A (en) | Lighting device | |
| JP6876972B2 (en) | Lighting device | |
| JP2013143215A (en) | Lighting fixture | |
| JP7591851B2 (en) | Lighting fixture and light diffusion cover used therewith | |
| TWI774937B (en) | Lighting units and lighting fixtures | |
| JP2014110120A (en) | Led lighting fixture | |
| CN205859797U (en) | Ligthing paraphernalia | |
| JP7174930B2 (en) | lighting equipment | |
| JP7131865B2 (en) | Fixtures, fixture sets and lighting fixtures using them | |
| JP6635251B2 (en) | Lighting equipment | |
| JP2014182940A (en) | Light emitting module and lighting device | |
| TW201437554A (en) | Lamp and lighting device | |
| JP2018185911A (en) | Illuminating device | |
| JP2016213055A (en) | Lighting device | |
| JP2009016094A (en) | LIGHTING DEVICE AND LIGHTING DEVICE MANUFACTURING METHOD | |
| JP7308571B2 (en) | Fixtures, fixture sets and lighting fixtures using them |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171124 |
|
| WD01 | Invention patent application deemed withdrawn after publication |