CN114582627B - Capacitor, preparation method and installation method thereof - Google Patents
Capacitor, preparation method and installation method thereof Download PDFInfo
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- CN114582627B CN114582627B CN202210215504.XA CN202210215504A CN114582627B CN 114582627 B CN114582627 B CN 114582627B CN 202210215504 A CN202210215504 A CN 202210215504A CN 114582627 B CN114582627 B CN 114582627B
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- 239000003990 capacitor Substances 0.000 title claims abstract description 129
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 238000009434 installation Methods 0.000 title abstract description 12
- 238000003466 welding Methods 0.000 claims abstract description 94
- 230000017525 heat dissipation Effects 0.000 claims abstract description 32
- 229910000679 solder Inorganic materials 0.000 claims abstract description 6
- 238000005476 soldering Methods 0.000 claims description 68
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 56
- 238000010438 heat treatment Methods 0.000 claims description 34
- 239000011148 porous material Substances 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 16
- 238000005452 bending Methods 0.000 claims description 7
- 238000009423 ventilation Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- 208000028571 Occupational disease Diseases 0.000 abstract description 3
- 239000002341 toxic gas Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 4
- 239000000779 smoke Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 210000000777 hematopoietic system Anatomy 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 210000000653 nervous system Anatomy 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a capacitor and a preparation method and an installation method thereof, the capacitor comprises a capacitor body, the right end face of the capacitor body extends out of a first pin and a second pin, the first pin and the second pin comprise the same protection pin, a heat dissipation pin and a welding pin, the length of the heat dissipation pin is larger than the radius of the capacitor body, a plurality of through holes which are uniformly distributed are arranged on the upper end surface of the welding pin, the through holes are in the shape of a quadrangular frustum, the four sides of the quadrangular frustum are respectively inclined upwards by 30 degrees to extend out of a circular duct, and the through holes and the circular duct are filled with full solder to achieve the whole capacitor heat dissipation effect, so that the space is saved, the welding is tighter, the materials are saved, the occupational diseases of workers are reduced, and the potential safety hazard is reduced.
Description
Technical Field
The invention relates to the technical field of capacitor application, in particular to a capacitor, and a preparation method and an installation method of the capacitor.
Background
Two conductors close to each other with a layer of non-conductive insulating medium therebetween, thus forming a capacitor, when a voltage is applied between two polar plates of the capacitor, the capacitor stores charge, the capacitance of the capacitor is equal to the ratio of the charge amount on one conductive polar plate to the voltage between the two polar plates in value, the basic unit of the capacitance of the capacitor is Farad (F), a capacitor element is generally indicated by letter C in a circuit diagram, the capacitor is equivalent to open circuit in a direct current circuit, the capacitor is an element capable of storing charge, and is one of the most common electronic elements, the types of the capacitor can be classified into a non-polar variable capacitor, a non-polar fixed capacitor, a polar capacitor and the like in principle, and the capacitor can be classified into a CBB capacitor (polyethylene), a polyester capacitor, a ceramic chip capacitor, a mica capacitor, a monolithic capacitor, an electrolytic capacitor, a tantalum capacitor and the like from materials;
the traditional vertical capacitor is too high in space and too high in space waste, the sitting capacitor is too tightly connected with the circuit board, the circuit board body is easy to be damaged by high temperature generated in the working process of the capacitor, the existing capacitor is complex in welding process, the welding compactness is insufficient, the waste of soldering tin raw materials in the soldering process is serious, the soldering tin on the circuit board is irregular, unnecessary potential safety hazards are caused, the manual operation error is large, and the capacitor, the preparation method and the installation method of the capacitor are needed to solve the problems.
Disclosure of Invention
The invention aims to provide a capacitor, a preparation method and an installation method of the capacitor, so as to solve the problems in the background technology.
In order to achieve the above purpose, the invention is realized by the following technical scheme:
the utility model provides a condenser, includes the condenser body, and first pin and second pin are stretched out to condenser body right side terminal surface, and first pin and second pin all include the same protection pin, heat dissipation pin and welding pin, and the length of heat dissipation pin is greater than the radius of condenser body, and welding pin upper end surface is equipped with a plurality of evenly distributed's through-hole, and the through-hole shape is quadrangular frustum, and a circular duct is extended to the oblique 30 degrees respectively upwards in four sides of quadrangular frustum, and all fills in through-hole and the circular duct and be full of soldering tin.
Preferably, the first pin is horizontally parallel to the second pin, and the first pin is at the front end of the second pin and at the same height.
Preferably, the protection pins are vertically arranged on the right end face of the capacitor body and are parallel to the whole capacitor body.
Preferably, the heat dissipation pin is parallel to the right end face of the capacitor body and is vertically arranged downwards, and the heat dissipation pin is vertically arranged on the rightmost side of the protection pin.
Preferably, the welding pins are perpendicular to the lowest end of the heat dissipation pins and perpendicular to the space direction of the capacitor body, the welding pins in the first pins extend to the front end, and the welding pins in the second pins extend to the rear end.
Preferably, the diameters of the first pin and the second pin are 0.45-1.5mm.
Preferably, the protection pins and the heat dissipation pins are cylindrical, and the welding pins are flat cuboid.
Preferably, the welding pins are divided into an upper layer and a lower layer, the upper side is the position where the through holes are located, and the front side, the rear side, the left side and the right side of the lower side are provided with baffle plates.
The preparation method of the capacitor comprises the following steps:
s1: bending the first pin 2 and the second pin 3 to form a three-section type;
S2: flattening the welding pin 6, and punching the welding pin into a through hole 7 and a circular duct 8 by using a through hole die;
S3: immersing the welding pins 6 in tin liquid, standing for 3min, taking out and cooling after fully oxidized bonding pads are padded below the welding pins 6, and waiting for soldering tin to be molded in the through holes 7 and the circular pore canals 8;
s4, preparation is completed.
The method for installing the capacitor comprises the following steps:
step one: placing the capacitor body 1 on a circuit board to be soldered;
Step two: the welding pins 6 are contacted with the welding positions of the circuit board;
step three: placing a heating plate 10 above the soldering pins 6;
Step four: the heating plate 10 transfers heat to the welding pins 6, so that soldering tin in the through holes 7 and the circular pore canals 8 is melted, flows out of the through holes 7 and reaches the lower layers of the welding pins 6;
step five: a ventilation pipe 11 is arranged in the heating plate 10 to ventilate the heating plate, and a wind port is aligned to each through hole 7 to pressurize and dissipate heat;
Step six: solder is filled in the lower layer of the welding pin 6, and the heating disc 10 is moved away;
Step seven: and (5) finishing soldering.
Compared with the prior art, the invention has the beneficial effects that:
1. the capacitor, the preparation method and the installation method thereof are provided with the protection pins, so that the lead wires extend out of the capacitor body, and the phenomenon that the lead wires in the capacitor body are broken due to bending of the lead wires in the welding process of the capacitor is prevented, so that the whole capacitor is damaged.
2. According to the capacitor, the preparation method and the installation method of the capacitor, the heat dissipation pins are used for enabling the capacitor body to have a certain height from the circuit board when the capacitor body is in flat soldering, so that a certain gap exists between the whole capacitor and the soldered circuit board, and certain heat of the capacitor body can be taken away by circulating air, so that the heat dissipation of the capacitor body is better, the heat of the capacitor body cannot influence the circuit board, and the service life of the capacitor body is prolonged.
3. According to the capacitor, the manufacturing method and the mounting method of the capacitor, the welding pins are arranged to be flat cuboid extending forwards and backwards, so that the contact area is larger during soldering, the welding is firmer, the temperature of a soldering position cannot be influenced by heat generated by the capacitor body in the direction, and the service life of the soldering position is prolonged.
4. According to the capacitor, the plurality of through holes are formed in the welding pins, the through holes are shaped into the shape of the quadrangular frustum and the four sides obliquely extend out of the round pore canal upwards, so that the welding contact area between the lower part of the welding lead and the circuit board is larger due to the fact that the upper part of the quadrangular frustum is small and the lower part of the quadrangular frustum is large, welding is firmer, and the heating plate is used for heating and soldering the welding lead to avoid the emission of lead smoke, so that the body loss of a worker welded for a long time is avoided.
5. The circular pore canal is arranged in the through hole, and the circular pore canal is obliquely upwards arranged at 30 degrees, so that the soldering raw material is sufficient in the soldering process, and if a part of sufficient soldering tin is remained in the circular pore canal, the situation that the subsequent circuit board is reversed in the mounting and carrying process can also exist, the soldering pin and the circuit board soldering circular pore canal play a firmer role, and the capacitor and the circuit board are not separated in a falling way no matter how the soldered circuit board moves, so that the firmness is further ensured.
6. According to the capacitor, the preparation method and the installation method of the capacitor, after the whole welding pin is heated in the soldering process, the soldering tin is melted by utilizing the high temperature in the through hole, so that the soldering tin flows to the lower layer of the welding pin to be soldered, the whole step is completed, the soldering tin smoothly and conveniently flows to the welding position of the welding pin and the circuit board, and the baffles are arranged on the four sides of the lower layer, so that the soldering tin cannot flow to other surfaces of the circuit board, materials are saved, the circuit board is attractive and tidy, the soldering precision is not needed to be nearly achieved by workers in the operation process by heating the heating disc, and the damage of toxic gas generated in the soldering process to the workers is avoided.
7. According to the capacitor, the preparation method and the installation method of the capacitor, soldering tin is melted and controlled in the through hole in the soldering process, no turbulence is generated on the circuit board, the material is saved, the appearance is attractive, and the compactness is better.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a capacitor according to the present invention;
FIG. 2 is a top view of the overall structure of the capacitor of the present invention;
FIG. 3 is a schematic diagram of the first and second pins of FIG. 1 according to the present invention;
FIG. 4 is a schematic diagram of the solder pin structure of FIG. 1 according to the present invention;
FIG. 5 is a front view of the via structure of FIG. 1 in accordance with the present invention;
FIG. 6 is a schematic view of the underside of the welding pin of FIG. 1 according to the present invention;
FIG. 7 is a schematic view of the heating plate of FIG. 1 according to the present invention;
The capacitor comprises a capacitor body 1, a first pin 2, a second pin 3, a protection pin 4, a heat dissipation pin 5, a welding pin 6, a through hole 7, a circular duct 8, a baffle 9, a heating disc 10 and a ventilation pipe 11.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Examples: referring to figures 1-6 of the drawings,
A capacitor comprises a capacitor body 1, wherein the right end surface of the capacitor body 1 extends out of a first pin 2 and a second pin 3, the first pin 2 and the second pin 3 respectively comprise a protection pin 4, a heat dissipation pin 5 and a welding pin 6 which are the same, the length of the heat dissipation pin 5 is larger than the radius of the capacitor body 1, a plurality of through holes 7 which are uniformly distributed are arranged on the upper end surface of the welding pin 6, the through holes 7 are in a quadrangular frustum shape, four sides of the quadrangular frustum are respectively inclined upwards by 30 degrees to extend out of a circular duct 8, soldering tin is filled in the through holes 7 and the circular duct 8, the heat dissipation pin 5 can enable a certain gap to exist between the capacitor body 1 and a circuit board after the capacitor body is welded, air can normally circulate around the capacitor body 1, heat dissipation is faster, the circuit board is not influenced by high temperature generated during the operation of the capacitor body 1, the service life of the whole capacitor is prolonged, the arrangement of the through holes 7 is to fix the soldering tin in the space when the soldering tin is heated to flow downwards, so that the soldering tin can not flow everywhere on the circuit board, the utility of workpieces in other areas of the circuit board is affected, the circuit board is more attractive, the arrangement of the four-sided square table shape is to ensure that the contact area between the lower part of the soldering pins 6 and the circuit board is larger, the upper end opening is small, the heat loss is reduced in the heating process, the inside of the through holes 7 is locked, the soldering efficiency is improved, the toxic gas scattering in the soldering process can be avoided, the physical health of workers is protected, the circular pore canal 8 is arranged to increase the soldering tin capacity in the through holes 7, the incomplete soldering tin is prevented, and when the soldering tin is completely remained in the circular pore 8, the connection of the circuit board is firmer under the condition that the circuit board is possibly overturned during the installation and transportation, the circular pore canal 8 can integrate the soldering tin in the circular pore canal and the soldering tin at the lower layer of the soldering pin 6, so that the soldering tin cannot fall off, and the connection compactness is better;
The first pins 2 are horizontally parallel to the second pins 3, the first pins 2 are arranged at the front ends of the second pins 3 and at the same height, and the front and rear parallel of the pins can save more space when the circuit board is welded, so that the whole circuit board is more regular and attractive;
The protection pins 4 are vertically arranged on the right end face of the capacitor body 1, are parallel to the whole capacitor body 1 and are vertically arranged on the capacitor body 1, so that the first pin 2 and the second pin 3 cannot interfere with the pins inside the capacitor body 1 in the first bending process, the whole capacitor body 1 is protected, the capacitor body 1 can be welded in parallel to a circuit board, and the space is saved;
The heat dissipation pins 5 are parallel to the right end face of the capacitor body 1 and are vertically downwards arranged, the heat dissipation pins 5 are vertically arranged on the rightmost side of the protection pins 4, and the heat dissipation pins 5 are bent to enable the capacitor body 1 to have a certain gap from a welded circuit board, so that air can smoothly circulate around the whole capacitor body 1, more heat generated during the operation of the capacitor body 1 is taken away, and the heat dissipation effect is better;
the welding pins 6 are perpendicular to the lowest end of the heat dissipation pins 5 and perpendicular to the space direction of the capacitor body 1, the welding pins 6 in the first pins 2 extend to the front end, the welding pins 6 in the second pins 3 extend to the rear end, the welding pins 6 are bent again to save space to a greater extent, welding is firmer, and the welding pins 6 extend to the front and rear ends respectively, so that the space occupied by the whole capacitor body 1 in height is minimum;
The diameters of the first pin 2 and the second pin 3 are 0.45-1.5mm, the diameters of the first pin 2 and the second pin 3 are in a larger range, and more capacitors are applicable;
The protection pin 4 and the heat dissipation pin 5 are cylindrical, the welding pin 6 is a flat cuboid, the protection pin 4 and the heat dissipation pin 5 are in a conventional cylindrical shape, the production is convenient, the flat rectangle design of the welding pin 6 is used for realizing larger welding area, the welding height is lower, the welding is firmer, and the welding is performed in a tin welding mode;
The welding pin 6 is divided into an upper layer and a lower layer, the upper side is the position of the through hole 7, the four sides around the downside are provided with baffle plates 9, the position of the upper side through hole 7 is heated, the tin liquid in the solder flows downwards and flows to the space of the downside, and the tin liquid can be left in the baffle plates 9 because the baffle plates 9 are arranged around the downside, so that the tin liquid is prevented from flowing outwards, the aesthetic property of the device is better, the tin liquid can be saved, and the cost is saved.
The preparation method of the capacitor comprises the following steps:
s1: bending the first pin 2 and the second pin 3 to form three sections, and bending the capacitor pin to enable the capacitor pin to present a protection pin 4, a heat dissipation pin 5 and a welding pin 6;
S2: flattening the welding pin 6, and punching the welding pin into the through hole 7 and the circular duct 8 by using a through hole die, wherein the through hole 7 and the circular duct 8 are integrally formed, so that the process of preparing the through hole 7 is quicker and more convenient, and the efficiency is higher;
s3: immersing the welding pin 6 in tin liquid, standing for 3min, placing a completely oxidized bonding pad under the welding pin 6, taking out and cooling, waiting for soldering tin to be molded in the through hole 7 and the circular duct 8, wherein the welding pin 6 is provided with a space of the through hole 7 and the circular duct 8, and can enter the tin liquid, standing for 3min is used for preventing bubbles from being present, so that the filling is more complete, and placing one surface of the through hole 7 by using the completely oxidized bonding pad in the process of taking out the welding pin 6, the completely oxidized bonding pad cannot be adhered with soldering tin, so that the welding pin 6 cannot influence the subsequent welding work after cooling, and the tin liquid can be perfectly reserved in the through hole 7 and the circular duct 8 for cooling and molding;
s4, preparing to obtain the capacitor;
the method for installing the capacitor comprises the following steps:
Step one: placing the capacitor body 1 on a circuit board to be welded, and determining the placement position of the capacitor;
step two: the welding pins 6 are contacted with the welding positions of the circuit board, and the positions to be welded are determined;
Step three: a heating plate 10 is arranged above the welding pins 6, the heating plate 10 is used for heating and pressurizing, heat is transferred to the welding pins 6 by heating the heating plate 10, toxic gases generated in the soldering process can be completely avoided by using the heating plate 10, the damage to the body of a worker is reduced, lead smoke is generated in the common soldering process, the damage to the human skeleton hematopoietic system and the nervous system can be destroyed by the lead smoke, irreversible damage is caused to the worker, and the generation of the toxic gases can be effectively avoided by using the heating plate 10;
Step four: the heating plate 10 is used for transferring heat to the welding pins 6, so that soldering tin in the through holes 7 and the circular pore channels 8 is melted, flows out of the through holes 7 and reaches the lower layers of the welding pins 6, and the baffles 9 are arranged on four sides of the lower layers of the welding pins 6, so that the flowing out tin liquid can be fixed in the baffles 9, the tin liquid can be regularly cooled and molded, the soldering effect is better, the cost is saved, toxic gas generated by soldering iron soldering can be avoided, and the potential safety hazard is reduced;
step five: the ventilation pipes 11 are arranged in the heating disc 10 to ventilate the soldering pins, the air ports are aligned to each through hole 7 to pressurize and dissipate heat, so that the through holes 7 on the soldering pins 6 are blown in the heating process, molten tin is melted faster, the downward flow speed is also faster, the soldering work efficiency is improved, in addition, the molten tin is blown downwards by wind in the heating process, so that harmful gas possibly generated by molten tin is also blown downwards, the volatilization of toxic gas is avoided, the physical health of workers is ensured, and the occupational diseases of long-term soldering workers are avoided;
Step six: the lower layer of the welding pin 6 is filled with tin liquid, the heating disc 10 is moved away, cooling and shaping are waited for, and the tin soldering is completed;
Step seven: and (5) finishing soldering to obtain the capacitor.
Working principle: soldering the welding pins 6 on the capacitor body 1 on the circuit board, so that the whole capacitor body 1 can be parallel to the whole circuit board, space is saved in height, the length of the heat dissipation pins 5 is higher than the radius of the capacitor body 1, a certain gap exists between the capacitor body and the circuit board, so that air can normally circulate around the capacitor body 1, the temperature outside the capacitor body 1 is taken away, the circuit board is prevented from being influenced, the service life of the whole capacitor is prolonged, the existence of the protection pins 4 is in order to prevent the pins in the capacitor body 1 from being broken in the bending process, the temperature of the capacitor body 1 is prevented from being excessively supplied to the position of the welding circuit board by the protection pins 4 with a certain height, the soldering position is prevented from becoming unstable due to high temperature, the whole capacitor has good heat dissipation effect, the space is saved, and the specifications of the pins are multiple;
In the capacitor mounting process, through holes 7 on the welding pins 6 are aligned with welding positions on a circuit board, then a heating disc 10 is placed on the welding pins 6, the heating disc 10 is heated, then ventilation pipes 11 in the heating disc 10 are blown, when the heating disc is heated to a certain amount, molten tin in the through holes 7 of the welding pins and the circular pore canal 8 flows downwards along with gravity of the molten tin, the molten tin enters the lower layer of the welding pins 6, baffles 9 are arranged on four sides of the lower layer, the baffles 9 block the molten tin on the lower layer of the welding pins 6 and the circuit board for soldering, so that the molten tin cannot flow everywhere, the shape of soldering is regular, the cost is saved, the ventilation effect of the heating disc 10 is utilized to improve the speed of molten tin flowing downwards, the efficiency of soldering is improved, the ventilation pipes 11 are ventilated downwards, harmful gases can not be generated in the soldering melting process, the body health of workers is prevented from being damaged, and occupational diseases are prevented;
The setting of circular duct 8 is in order to improve the tin liquid content in through-hole 7 when the tin liquid in through-hole 7 is insufficient, under the normal condition, the tin liquid in circular duct 8 can be cooled and formed as an organic whole with the tin liquid of through-hole and welding pin 6 lower floor, so in order to make its tin soldering more firm under the possible upset condition of circuit board installation transport, if upset welding pin 6 can produce the condition that drops because of the shape of through-hole 7, and circular duct 8 can form its inside soldering tin integral type, make it can not drop, connect the compactness better, whole condenser and preparation method for traditional condenser radiating effect better, the welding is more firm, save material is more pleasing to the eye, the potential safety hazard is less.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (7)
1. The capacitor is characterized by comprising a capacitor body (1), wherein the right end face of the capacitor body (1) extends out of a first pin (2) and a second pin (3), the first pin (2) and the second pin (3) comprise identical protection pins (4), heat dissipation pins (5) and welding pins (6), the length of each heat dissipation pin (5) is larger than the radius of the capacitor body (1), a plurality of through holes (7) which are uniformly distributed are formed in the upper end surface of each welding pin (6), the through holes (7) are in a quadrangular frustum shape, a circular pore channel (8) is formed in the way that four sides of each quadrangular frustum are respectively obliquely upwards extended by 30 degrees, and soldering tin is filled in each through hole (7) and each circular pore channel (8);
The protection pins (4) are vertically arranged on the right end face of the capacitor body (1) and are parallel to the whole capacitor body (1); the heat dissipation pins (5) are parallel to the right end face of the capacitor body (1) and are vertically arranged downwards, and the heat dissipation pins (5) are vertically arranged on the rightmost side of the protection pins (4); the welding pins (6) are perpendicular to the lowest end of the heat dissipation pins (5) and perpendicular to the space direction of the capacitor body (1), the welding pins (6) in the first pins (2) extend towards the front end, and the welding pins (6) in the second pins (3) extend towards the rear end;
Wherein the through hole (7) is in a quadrangular frustum pyramid shape with a small upper end opening and a large lower end opening.
2. A capacitor according to claim 1, characterized in that the first pin (2) is horizontally parallel to the second pin (3), the first pin (2) being at the front end of the second pin (3) and at the same height.
3. A capacitor according to claim 1, characterized in that the diameter of the first pin (2) and the second pin (3) is 0.45-1.5mm.
4. A capacitor according to claim 1, characterized in that the protection pins (4) and the heat dissipation pins (5) are cylindrical and the soldering pins (6) are flat rectangular solids.
5. A capacitor according to claim 1, wherein the solder pins (6) are divided into an upper layer and a lower layer, the upper side is the position of the through hole (7), and four sides of the lower side are provided with baffles (9).
6. A method of manufacturing a capacitor as claimed in any one of claims 1 to 5, comprising the steps of:
s1: bending the first pin (2) and the second pin (3) to form a three-section type;
S2: flattening the welding pin (6), and punching the welding pin into a through hole (7) and a circular duct (8) by using a through hole die;
S3: immersing the welding pins (6) in tin liquid, standing for 3min, taking out and cooling after fully oxidized bonding pads are padded on the lower sides of the welding pins (6), and waiting for soldering tin to be molded in the through holes (7) and the circular pore channels (8);
s4, preparation is completed.
7. A method of mounting a capacitor as claimed in any one of claims 1 to 5, the method comprising the steps of:
Step one: placing the capacitor body (1) on a circuit board to be soldered;
Step two: contacting the welding pins (6) with the welding positions of the circuit board;
Step three: placing a heating plate (10) above the welding pins (6);
step four: the heating plate (10) is used for transmitting heat to the welding pins (6) so that soldering tin in the through holes (7) and the circular pore channels (8) is melted and flows out of the through holes (7) to reach the lower layers of the welding pins (6);
step five: a ventilation pipe (11) is arranged in the heating disc (10) to ventilate the heating disc, and the air port is aligned to each through hole (7) to pressurize and dissipate heat;
step six: solder is filled in the lower layer of the welding pin (6), and the heating disc (10) is moved away;
Step seven: and (5) finishing soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208781720U (en) * | 2018-08-27 | 2019-04-23 | 安远南佳盛电子科技有限公司 | Patch electrolysis capacitor |
| CN113178329A (en) * | 2021-03-31 | 2021-07-27 | 深圳圣融达科技有限公司 | SMD box-packed film capacitor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH05101965A (en) * | 1991-10-08 | 1993-04-23 | Meitec Corp | Electrode terminal for electronic component and soldering method therefor |
| JPH09245859A (en) * | 1996-03-04 | 1997-09-19 | Fujitsu Ten Ltd | Connector connecting structure |
| DE112007000056T5 (en) * | 2006-09-29 | 2008-08-07 | Matsushita Electric Industrial Co., Ltd., Kadoma | Electronic component and electronic control device using this |
| JP2019009361A (en) * | 2017-06-27 | 2019-01-17 | 株式会社村田製作所 | Ceramic electronic component and mounting structure thereof |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208781720U (en) * | 2018-08-27 | 2019-04-23 | 安远南佳盛电子科技有限公司 | Patch electrolysis capacitor |
| CN113178329A (en) * | 2021-03-31 | 2021-07-27 | 深圳圣融达科技有限公司 | SMD box-packed film capacitor |
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