CN114582627A - Capacitor, and preparation method and installation method of capacitor - Google Patents
Capacitor, and preparation method and installation method of capacitor Download PDFInfo
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- CN114582627A CN114582627A CN202210215504.XA CN202210215504A CN114582627A CN 114582627 A CN114582627 A CN 114582627A CN 202210215504 A CN202210215504 A CN 202210215504A CN 114582627 A CN114582627 A CN 114582627A
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- 239000003990 capacitor Substances 0.000 title claims abstract description 133
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000002360 preparation method Methods 0.000 title claims description 13
- 238000009434 installation Methods 0.000 title abstract description 12
- 238000003466 welding Methods 0.000 claims abstract description 89
- 238000005476 soldering Methods 0.000 claims abstract description 77
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 61
- 230000017525 heat dissipation Effects 0.000 claims abstract description 31
- 239000011148 porous material Substances 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims description 37
- 239000007788 liquid Substances 0.000 claims description 16
- 238000009423 ventilation Methods 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 5
- 208000028571 Occupational disease Diseases 0.000 abstract description 3
- 239000002341 toxic gas Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 239000000779 smoke Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 210000000777 hematopoietic system Anatomy 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 210000000653 nervous system Anatomy 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
Abstract
The invention discloses a capacitor, a manufacturing method and an installation method of the capacitor, and the capacitor comprises a capacitor body, wherein a first pin and a second pin extend out of the right end face of the capacitor body, the first pin and the second pin respectively comprise a same protection pin, a heat dissipation pin and a welding pin, the length of the heat dissipation pin is larger than the radius of the capacitor body, a plurality of uniformly distributed through holes are arranged on the upper end surface of the welding pin, the through holes are in a quadrangular frustum shape, a circular pore passage extends upwards from the four side faces of the quadrangular frustum in an inclined manner by 30 degrees respectively, and the through holes and the circular pore passage are filled with full-soldering tin, so that the heat dissipation effect of the whole capacitor is good, the space is saved, the welding is tighter, the material is saved, the occupational diseases of workers are reduced, and the potential safety hazard is reduced.
Description
Technical Field
The invention relates to the technical field of capacitor application, in particular to a capacitor, and a preparation method and an installation method of the capacitor.
Background
Two conductors close to each other with a non-conductive insulating medium sandwiched between them, which form a capacitor, when a voltage is applied between two plates of the capacitor, the capacitor stores charges, the capacitance of the capacitor is equal to the ratio of the amount of charges on one conductive plate to the voltage between the two plates, the basic unit of the capacitance of the capacitor is farad (F), the capacitance element is usually represented by letter C in the circuit diagram, in the dc circuit, the capacitor is equivalent to an open circuit, the capacitor is an element capable of storing charges, and is one of the most commonly used electronic elements, the types of the capacitors can be divided into a non-polar variable capacitor, a non-polar fixed capacitor, a polar capacitor and the like in principle, and can be divided into CBB capacitor (polyethylene), polyester capacitor, ceramic capacitor, mica capacitor, monolithic capacitor, electrolytic capacitor, etc. in terms of materials, Tantalum capacitors, etc.;
traditional vertical condenser space height is too high, too extravagant space, and sitting posture condenser is connected too closely with the circuit board, the high temperature that the condenser produced in the course of the work harms the circuit board body easily, and current condenser welding process is complicated, welded compactness is not enough, soldering tin raw materials are extravagant serious in the soldering tin in-process, soldering tin is irregular on the circuit board, cause unnecessary potential safety hazard, make the manual operation error big, the preparation method of a condenser and this condenser now, mounting method solves above-mentioned problem urgently.
Disclosure of Invention
The present invention is directed to a capacitor, a method for manufacturing the capacitor, and a method for mounting the capacitor, so as to solve the problems of the related art.
In order to achieve the purpose, the invention is realized by the following technical scheme:
the utility model provides a capacitor, includes the capacitor body, first pin and second pin are stretched out to capacitor body right side terminal surface, first pin and second pin all include the same protection pin, heat dissipation pin and welding pin, the length of heat dissipation pin is greater than the radius of capacitor body, welding pin upper end surface is equipped with a plurality of evenly distributed's through-hole, the through-hole shape is four prismatic table shapes, four sides of four prismatic table are the oblique upward 30 degrees respectively and are extended a circular pore, and all fill in through-hole and the circular pore and be full of soldering tin.
Preferably, the first pin is horizontally parallel to the second pin, and the first pin is at the front end of the second pin and at the same height.
Preferably, the protection pin is vertically arranged on the right end face of the capacitor body and is parallel to the whole capacitor body.
Preferably, the heat dissipation pin is parallel to the end face of the right side of the capacitor body and is vertically arranged downwards, and the heat dissipation pin is vertically arranged at the rightmost side of the protection pin.
Preferably, the soldering pins are vertical to the lowest end of the heat dissipation pin and vertical to the space direction of the capacitor body, the soldering pins in the first pins extend towards the front end, and the soldering pins in the second pins extend towards the rear end.
Preferably, the diameter of the first pin and the second pin is 0.45-1.5 mm.
Preferably, the protection pin and the heat dissipation pin are cylindrical, and the soldering pin is a flat cuboid.
Preferably, the welding pins are divided into an upper layer and a lower layer, the upper side is the position of the through hole, and baffles are arranged on the front side, the rear side, the left side and the right side of the lower side.
The preparation method of the capacitor comprises the following steps:
s1: bending the first pin 2 and the second pin 3 to form a three-section shape;
s2: flattening the welding pins 6, and punching through holes 7 and circular pore passages 8 into the welding pins by using a through hole die;
s3: immersing the welding pin 6 into tin liquid, standing for 3min, filling a pad completely oxidized below the welding pin 6, taking out and cooling, and waiting for the soldering tin to be formed in the through hole 7 and the circular pore channel 8;
s4, finishing the preparation.
The mounting method of the capacitor comprises the following steps:
the method comprises the following steps: placing the capacitor body 1 on a circuit board to be welded;
step two: contacting the welding pin 6 with the welding position of the circuit board;
step three: a heating plate 10 is placed above the welding pins 6;
step four: the heating plate 10 is heated to transfer heat to the welding pins 6, so that the soldering tin in the through holes 7 and the circular pore canals 8 is melted and flows out of the through holes 7 to reach the lower layers of the welding pins 6;
step five: a ventilation pipe 11 is arranged in the heating plate 10 to ventilate the heating plate, and the air ports are aligned to each through hole 7 to pressurize and radiate the heating plate;
step six: the lower layer of the welding pin 6 is filled with soldering tin, and the heating plate 10 is moved;
step seven: and (7) completing soldering.
Compared with the prior art, the invention has the beneficial effects that:
1. the capacitor, the manufacturing method and the installation method of the capacitor are provided with the protection pins, the capacitor body is protected, and the lead extends out of the capacitor body, so that the phenomenon that the lead in the capacitor body is broken due to the fact that the lead is bent in the welding process of the capacitor is prevented, and the whole capacitor is damaged.
2. The capacitor, the manufacturing method and the installation method of the capacitor utilize the heat dissipation pins to enable the capacitor body to have a certain height from the circuit board when the capacitor body is in flat lying and tin soldering, so that a certain gap exists between the whole capacitor and the welded circuit board, certain heat of the capacitor body can be taken away by circulating air, the heat dissipation of the capacitor body is better, the circuit board cannot be affected by the heat of the capacitor body, and the service life of the capacitor body is prolonged.
3. According to the capacitor, the manufacturing method and the mounting method of the capacitor, the welding pins are arranged into the flat cuboids which extend forwards and backwards, so that the contact area is larger during soldering, the welding is firmer, the temperature of a soldering position cannot be influenced by heat generated by the capacitor body due to the arrangement in the direction, and the service life of the soldering position is prolonged.
4. According to the capacitor, the manufacturing method and the installation method of the capacitor, the welding pins are provided with the through holes, the through holes are arranged in a quadrangular frustum pyramid shape, and the four side faces of the through holes extend upwards in an inclined mode to form the circular pore passages, so that the welding contact area between the lower part of the welding pins and a circuit board is larger due to the fact that the quadrangular frustum pyramid is small in the upper part and large in the lower part, welding is firmer, heating plates are used for heating and soldering the welding pins, lead smoke is prevented from being emitted, and physical loss of workers who weld for a long time is avoided.
5. The capacitor and the preparation method and the installation method of the capacitor are characterized in that the circular hole is arranged in the through hole and is obliquely arranged at 30 degrees upwards, so that insufficient soldering tin exists in the soldering process, the soldering raw materials are sufficient, and if a part of soldering tin is sufficiently remained in the circular hole, the situation that the subsequent circuit board is possibly inverted in the installation and transportation processes can exist, the soldering pin and the circuit board soldering circular hole play a firmer role, the capacitor and the circuit board cannot fall off and separate no matter how the welded circuit board moves, and the firmness is further ensured.
6. This condenser and preparation method of this condenser, the installation method makes soldering tin melt at the high temperature in utilizing the through-hole after heating whole welding pin at the soldering process earlier, thereby soldering tin flows to welding pin lower floor and carries out the soldering thereby accomplish whole step, make soldering tin smooth convenient flow to welding pin and circuit board welding position like this, and be equipped with the baffle in four sides of lower floor department, make soldering tin can not flow other surfaces of circuit board, save material, keep the circuit board pleasing to the eye clean and tidy, utilize the heating plate to heat and make the precision that the workman need not be close to accomplish the soldering in operation process, avoid the harm of toxic gas that the soldering process produced to the workman.
7. The capacitor, the preparation method and the installation method of the capacitor control the melting of the soldering tin in the through hole in the soldering process, the soldering tin does not flow around the circuit board, the material is saved, the appearance is attractive, and the tightness is better.
Drawings
FIG. 1 is a schematic view of the overall structure of the capacitor of the present invention;
FIG. 2 is a top view of the overall structure of the capacitor of the present invention;
FIG. 3 is a schematic diagram of the first lead and the second lead of FIG. 1 according to the present invention;
FIG. 4 is a schematic diagram of the structure of the bonding pin of FIG. 1 according to the present invention;
FIG. 5 is a front view of the via structure of FIG. 1 according to the present invention;
FIG. 6 is a schematic view of the underside structure of the solder pin of FIG. 1 according to the present invention;
FIG. 7 is a schematic view of the heating plate of FIG. 1 according to the present invention;
the capacitor comprises a capacitor body 1, a first pin 2, a second pin 3, a protection pin 4, a heat dissipation pin 5, a welding pin 6, a through hole 7, a circular pore channel 8, a baffle 9, a heating plate 10 and a ventilation pipe 11.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example (b): referring now to figures 1-6 of the drawings,
a capacitor comprises a capacitor body 1, a first pin 2 and a second pin 3 extend out of the end face of the right side of the capacitor body 1, the first pin 2 and the second pin 3 respectively comprise a same protection pin 4, a heat dissipation pin 5 and a welding pin 6, the length of the heat dissipation pin 5 is larger than the radius of the capacitor body 1, the upper end face of the welding pin 6 is provided with a plurality of through holes 7 which are uniformly distributed, the through holes 7 are in a quadrangular frustum shape, a round hole 8 extends obliquely upwards for 30 degrees from each side face of the quadrangular frustum, the through holes 7 and the round hole 8 are filled with soldering tin, the heat dissipation pin 5 can enable a certain gap to be formed between the capacitor body 1 and a circuit board after welding, air can normally circulate around the capacitor body 1 to enable the heat dissipation to be faster, the circuit board cannot be affected by high temperature generated when the capacitor body 1 works, and the service life of the whole capacitor is prolonged, the through hole 7 is arranged to fix the soldering tin in the space when the soldering tin flows downwards by heating, so that the soldering tin cannot flow around on the circuit board, the effect of workpieces in other areas of the circuit board is influenced, the soldering tin is more attractive, the quadrangular frustum shape is arranged to ensure that the contact area between the lower part of the welding pin 6 and the circuit board is larger, the opening at the upper end is small, the heat loss is reduced in the heating process, the through hole 7 is locked, the soldering efficiency is improved, the toxic gas is prevented from dispersing in the soldering process, the body health of workers is protected, the circular hole 8 is arranged to increase the soldering tin capacity in the through hole 7, the incomplete soldering caused by insufficient soldering tin capacity is prevented, when the soldering tin is completely remained in the circular hole 8, the circuit board can be connected more firmly under the condition that the circuit board is installed and transported and possibly overturned, and the circular hole 8 can integrate the soldering tin inside with the soldering tin at the lower layer of the welding pin 6, the connecting device can not fall off and has better connection tightness;
the first pins 2 are horizontally parallel to the second pins 3, the first pins 2 are arranged at the front ends of the second pins 3 and are at the same height, and the pins are parallel in the front and back direction so as to save more space when a circuit board is welded, and the whole structure is more neat and beautiful;
the protection pin 4 is vertically arranged on the right end face of the capacitor body 1, is parallel to the whole capacitor body 1 and is vertical to the capacitor body 1, so that the first bending process of the first pin 2 and the second pin 3 cannot interfere with pins inside the capacitor body 1, the whole capacitor body 1 is protected, the capacitor body 1 can be welded in parallel with a circuit board, and space is saved;
the heat dissipation pins 5 are parallel to the end face of the right side of the capacitor body 1 and are vertically arranged downwards, the heat dissipation pins 5 are perpendicular to the rightmost side of the protection pins 4, and the bending of the heat dissipation pins 5 is to enable the capacitor body 1 to have a certain gap from a welded circuit board, so that air can smoothly circulate around the whole capacitor body 1, more heat generated by the capacitor body 1 during working is taken away, and the heat dissipation effect is better;
the welding pins 6 are vertical to the lowest ends of the radiating pins 5 and vertical to the space direction of the capacitor body 1, the welding pins 6 in the first pins 2 extend towards the front end, the welding pins 6 in the second pins 3 extend towards the rear end, the welding pins 6 are bent again so as to save space to a greater extent and enable welding to be firmer, and the welding pins 6 respectively extend towards the front end and the rear end, so that the space occupied by the whole capacitor body 1 in height is minimum;
the diameters of the first pin 2 and the second pin 3 are 0.45-1.5mm, the diameter range of the first pin 2 and the second pin 3 is large, and more applicable capacitors are provided;
the protection pin 4 and the heat dissipation pin 5 are cylindrical, the welding pin 6 is a flat cuboid, the protection pin 4 and the heat dissipation pin 5 are conventional cylindrical, the production is convenient, the flat rectangular design of the welding pin 6 aims at larger welding area, lower welding height and firmer welding, and the welding is carried out in a tin soldering mode;
The preparation method of the capacitor comprises the following steps:
s1: bending the first pin 2 and the second pin 3 into a three-section shape, and bending the capacitor pin to enable the capacitor pin to present a protection pin 4, a heat dissipation pin 5 and a welding pin 6;
s2: the welding pins 6 are flattened, the through holes 7 and the circular pore channels 8 are punched into the through hole dies, and the through holes 7 and the circular pore channels 8 are integrally formed, so that the process of preparing the through holes 7 is quicker and more convenient, and the efficiency is higher;
s3: immersing a welding pin 6 into tin liquid, standing for 3min, filling a pad completely oxidized below the welding pin 6, taking out and cooling, waiting for soldering tin to be formed in a through hole 7 and a circular pore channel 8, wherein the welding pin 6 is provided with a space for the through hole 7 and the circular pore channel 8 and can enter the tin liquid, and standing for 3min to prevent bubbles from existing, so that the filling of the welding pin is more complete, and in the process of taking out the welding pin 6, the pad is placed on one surface of the through hole 7 by using the completely oxidized pad, and the completely oxidized pad can not stick the soldering tin, so that the cooled welding pin 6 can not influence the subsequent welding work, and the tin liquid can be perfectly remained in the through hole 7 and the circular pore channel 8 for cooling and shaping;
s4, completing the preparation to obtain the capacitor;
the mounting method of the capacitor comprises the following steps:
the method comprises the following steps: placing the capacitor body 1 on a circuit board to be welded, and determining the placement position of the capacitor;
step two: contacting the welding pin 6 with the welding position of the circuit board, and determining the position needing welding;
step three: the heating plate 10 is placed above the welding pins 6, the heating plate 10 is used for heating and pressurizing, heat is transferred to the welding pins 6 by heating the heating plate 10, toxic gas generated in the soldering process can be completely avoided by utilizing the heating plate 10, damage to the body of a worker is reduced, lead smoke can be generated in the common soldering process, the lead smoke can damage the human skeleton hematopoietic system and the nervous system, irreversible damage to the worker is caused, and the generation of the toxic gas can be effectively avoided by utilizing the heating plate 10;
step four: the heating plate 10 transfers heat to the welding pin 6, so that the soldering tin in the through hole 7 and the circular pore channel 8 is melted, flows out of the through hole 7 and reaches the lower layer of the welding pin 6, and the baffles 9 are arranged on four sides of the lower layer of the welding pin 6, so that the flowing-out tin liquid can be fixed in the baffles 9, the tin liquid can be regularly cooled and formed, the soldering effect is better, the cost is saved, toxic gas generated by soldering by directly using a soldering iron can be avoided, and the potential safety hazard is reduced;
step five: the heating plate 10 is internally provided with the ventilation pipe 11 for ventilation, the air port is aligned to each through hole 7 for pressurizing and radiating the through holes, so that the through holes 7 on the welding pins 6 are blown in the heating process, the molten tin is melted more quickly, the down-flow speed is higher, the soldering work efficiency is improved, and in the heating process, the molten tin is blown downwards due to wind, so that harmful gas possibly generated by molten tin is blown downwards, the volatilization of toxic gas is avoided, the health of workers is guaranteed, and the occupational diseases of long-term soldering workers are avoided;
step six: filling the lower layer of the welding pin 6 with the tin liquid, moving the heating plate 10, and waiting for cooling and shaping to finish tin soldering;
step seven: the soldering is completed to obtain the capacitor.
The working principle is as follows: the welding pins 6 on the capacitor body 1 are soldered on the circuit board, so that the whole capacitor body 1 can be parallel to the whole circuit board, the space is saved in height, the length of the heat dissipation pin 5 is higher than the radius of the capacitor body 1, so that a certain gap is formed between the capacitor body and the circuit board, the temperature outside the capacitor body 1 is taken away around the capacitor body 1, which enables the air to normally circulate, thereby preventing the influence on the circuit board, thereby prolonging the service life of the whole capacitor, protecting the pins 4 so as not to cause the danger of breaking the pins in the capacitor body 1 in the bending process, the protection pins 4 with a certain height ensure that the temperature of the capacitor body 1 is not excessively supplied to the position of a welded circuit board, the soldering position is prevented from being infirm due to high temperature, the whole capacitor has good heat dissipation effect, the space is saved, and the pins have multiple models and specifications;
in the capacitor mounting process, the through hole 7 on the welding pin 6 is aligned to the welding position on the circuit board, then the heating plate 10 is placed on the welding pin 6 to heat the heating plate 10, then the ventilation pipe 11 in the heating plate 10 is blown, when the heating is heated to a certain heat, the tin liquid in the through hole 7 of the welding pin and the circular pore passage 8 is melted and flows downwards along with the gravity of the tin liquid, and enters the lower layer of the welding pin 6, the baffle plates 9 are arranged on four sides of the lower layer, the melted tin liquid is blocked on the lower layer of the welding pin 6 by the baffle plates 9 to be soldered with the circuit board, so that the tin liquid can not flow everywhere, the soldering shape is regular, the cost is saved, the ventilation effect of the heating plate 10 is utilized to improve the speed of the molten tin flowing downwards, the soldering efficiency is improved, the ventilation pipe 11 ventilates downwards, and no harmful gas can be generated in the soldering process to harm the health of workers, preventing occupational diseases of workers;
the setting of circular pore 8 is in order to improve the molten tin content in the through-hole 7 when the molten tin in the through-hole 7 is not enough, under normal conditions, the molten tin in the circular pore 8 can be with the molten tin cooling shaping of through-hole and welding pin 6 lower floor formula as an organic whole, so be in order to make its soldering more firm under the possible upset condition of circuit board installation transport, if upset welding pin 6 probably produces the condition that drops because of the shape of through-hole 7, and circular pore 8 can form the integral type with its inside soldering tin, make it can not drop, it is better to connect the compactness, whole condenser and preparation method are better for traditional condenser radiating effect, the welding is more firm, save material is more pleasing to the eye, the potential safety hazard is still less.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. The utility model provides a capacitor, a serial communication port, includes capacitor body (1), first pin (2) and second pin (3) are stretched out to capacitor body (1) right side terminal surface, first pin (2) and second pin (3) all include the same protection pin (4), heat dissipation pin (5) and welding pin (6), the length of heat dissipation pin (5) is greater than the radius of capacitor body (1), welding pin (6) upper end surface is equipped with through-hole (7) of a plurality of evenly distributed, through-hole (7) shape is four prismoids, and four sides of four prismoids extend a circular pore (8) to 30 degrees in the slant respectively, and all fill in through-hole (7) and circular pore (8) and be full of soldering tin.
2. A capacitor according to claim 1, characterized in that the first pin (2) is horizontally parallel to the second pin (3), and the first pin (2) is at the front end of the second pin (3) and at the same height.
3. A capacitor according to claim 1, characterized in that the protection pin (4) is arranged perpendicularly to the right-hand end face of the capacitor body (1) and parallel to the entire capacitor body (1).
4. A capacitor according to claim 1, characterized in that the heat dissipation pin (5) is parallel to the right end face of the capacitor body (1) and is vertically downward, and the heat dissipation pin (5) is vertically at the rightmost side of the protection pin (4).
5. A capacitor according to claim 1, wherein the soldering pin (6) is vertically arranged at the lowest end of the heat dissipation pin (5) and is vertically arranged in the space direction of the capacitor body (1), the soldering pin (6) in the first pin (2) extends towards the front end, and the soldering pin (6) in the second pin (3) extends towards the rear end.
6. A capacitor according to claim 1, characterized in that the diameter of the first pin (2) and the second pin (3) is 0.45-1.5 mm.
7. A capacitor according to claim 1, characterized in that the protection pin (4) and the heat dissipation pin (5) are cylindrical and the soldering pin (6) is a flat cuboid.
8. The capacitor as claimed in claim 1, wherein the soldering pins (6) are divided into an upper layer and a lower layer, the upper side is the position of the through hole (7), and the lower side is provided with baffles (9) at the front, the rear, the left side and the right side.
9. A capacitor comprising the method of claims 1-8, wherein the method comprises the steps of:
s1: bending the first pin (2) and the second pin (3) to form a three-section shape;
s2: flattening the welding pins (6), and driving through holes (7) and circular pore passages (8) into the welding pins by using a through hole die;
s3: immersing the welding pin (6) in tin liquid, standing for 3min, filling a pad completely oxidized below the welding pin (6), taking out and cooling, and waiting for tin soldering to be formed in the through hole (7) and the circular pore channel (8);
s4, finishing the preparation.
10. A capacitor comprising the method of mounting of claims 1-9, wherein the method comprises the steps of:
the method comprises the following steps: placing the capacitor body (1) on a circuit board to be welded;
step two: contacting the welding pin (6) with the welding position of the circuit board;
step three: a heating plate (10) is placed above the welding pins (6);
step four: the heating plate (10) is heated to transfer heat to the welding pins (6), so that soldering tin in the through holes (7) and the circular pore passages (8) is melted and flows out of the through holes (7) to reach the lower layers of the welding pins (6);
step five: a ventilation pipe (11) is arranged in the heating plate (10) to ventilate the heating plate, and the air port is aligned to each through hole (7) to pressurize and radiate the heating plate;
step six: the lower layer of the welding pin (6) is filled with soldering tin, and the heating plate (10) is moved;
step seven: and (7) completing soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210215504.XA CN114582627A (en) | 2022-03-07 | 2022-03-07 | Capacitor, and preparation method and installation method of capacitor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210215504.XA CN114582627A (en) | 2022-03-07 | 2022-03-07 | Capacitor, and preparation method and installation method of capacitor |
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| CN114582627A true CN114582627A (en) | 2022-06-03 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05101965A (en) * | 1991-10-08 | 1993-04-23 | Meitec Corp | Electrode terminal for electronic component and soldering method therefor |
| JPH09245859A (en) * | 1996-03-04 | 1997-09-19 | Fujitsu Ten Ltd | Connector connecting structure |
| US20100267252A1 (en) * | 2006-09-29 | 2010-10-21 | Matsushita Electric Industrial Co., Ltd. | Electronic component and electronic control device using the same |
| US20180374641A1 (en) * | 2017-06-27 | 2018-12-27 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and mount structure therefor |
| CN208781720U (en) * | 2018-08-27 | 2019-04-23 | 安远南佳盛电子科技有限公司 | Patch electrolysis capacitor |
| CN113178329A (en) * | 2021-03-31 | 2021-07-27 | 深圳圣融达科技有限公司 | SMD box-packed film capacitor |
-
2022
- 2022-03-07 CN CN202210215504.XA patent/CN114582627A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05101965A (en) * | 1991-10-08 | 1993-04-23 | Meitec Corp | Electrode terminal for electronic component and soldering method therefor |
| JPH09245859A (en) * | 1996-03-04 | 1997-09-19 | Fujitsu Ten Ltd | Connector connecting structure |
| US20100267252A1 (en) * | 2006-09-29 | 2010-10-21 | Matsushita Electric Industrial Co., Ltd. | Electronic component and electronic control device using the same |
| US20180374641A1 (en) * | 2017-06-27 | 2018-12-27 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and mount structure therefor |
| CN208781720U (en) * | 2018-08-27 | 2019-04-23 | 安远南佳盛电子科技有限公司 | Patch electrolysis capacitor |
| CN113178329A (en) * | 2021-03-31 | 2021-07-27 | 深圳圣融达科技有限公司 | SMD box-packed film capacitor |
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