Honeycomb type jig for large circuit board
Technical Field
The utility model relates to a frock clamp especially indicates a honeycomb formula tool of large circuit board.
Background
At present, the execution mode of the procedures of chip mounting, plug-in, reflow soldering and the like of a circuit board is determined according to the size of the circuit board and the process edges at the edge, and the circuit board can directly execute the procedures under the condition that the circuit board has smaller size and the process edges; if the size of the circuit board is large, or no process edge exists, or some special requirements are met, the process flows need to be executed by means of a jig. The traditional jig is made of bakelite or synthetic stone, the jig is hollowed at the position of a device of a circuit board, the size of a general small circuit board is 100mm multiplied by 102mm multiplied by 0.6mm (length multiplied by width multiplied by height), and a large circuit board is characterized by extremely large size which reaches 800mm multiplied by 500mm (length multiplied by width) or more.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art not enough and provide a light, non-deformable and can ensure welding quality's large circuit board's honeycomb formula tool.
In order to achieve the above purpose, the solution of the present invention is:
the utility model provides a honeycomb formula tool of large-scale circuit board, its includes bottom plate and apron, and bottom plate and apron all adopt honeycomb structure, honeycomb structure includes shrouding and honeycomb holes.
Preferably, the honeycomb structure is any one or any combination of a single-layer continuous honeycomb structure, a single-layer staggered honeycomb structure and a double-layer continuous honeycomb structure.
Preferably, in the single-layer continuous honeycomb structure, the honeycomb holes are continuously arranged, the sealing plate is arranged at the bottom of the honeycomb holes, and the size of the honeycomb holes, the height of the honeycomb holes and the wall thickness of the honeycomb holes can be adjusted according to the proportion.
Preferably, in the staggered honeycomb structure of individual layer, the shrouding sets up respectively at the top and the bottom of honeycomb holes, and top shrouding and crisscross honeycomb holes that expose of bottom shrouding, honeycomb holes size, honeycomb holes height, honeycomb wall thickness, honeycomb holes interval can be according to proportion adjustment.
Preferably, among the double-deck continuous honeycomb structure, the honeycomb holes are arranged in succession, and the shrouding sets up in the middle part of honeycomb holes, and honeycomb holes's size, two-layer honeycomb holes's height, honeycomb wall thickness can be according to proportion adjustment.
Preferably, the bottom plate includes carriage and strengthening rib, and the strengthening rib is crossing in the carriage with great ease, forms a plurality of fretwork grooves between carriage and the strengthening rib, the apron is equipped with the fretwork groove corresponding with the bottom plate.
Preferably, the bottom plate includes carriage and strengthening rib, the carriage is cavity rectangle frame, and the strengthening rib is crossing in the carriage with great ease, forms a plurality of fretwork grooves between carriage and the strengthening rib, the apron is equipped with the fretwork groove corresponding with the bottom plate.
Preferably, the supporting frame and the reinforcing ribs respectively comprise plates arranged on the periphery and the bottom.
Preferably, the bottom plate is further provided with a plurality of pin holes on the support frame and/or the reinforcing ribs, and the cover plate is provided with a plurality of pin holes corresponding to the bottom plate.
Preferably, the jig is made of an aluminum alloy plate subjected to hard anodizing or other materials with suitable physical properties.
After the scheme is adopted, the utility model discloses large-scale circuit board's honeycomb formula tool has following advantage:
(1) the utility model discloses the tool adopts the honeycomb structure, furthest reduces the volume and the weight of entity material, and the thermal capacity and the weight of this tool are about the third of non-honeycomb structure, at the in-process of crossing the backward flow, and the welding temperature curve to reflow soldering influences very little.
(2) The utility model discloses the whole weight of honeycomb formula tool is about the third of traditional tool weight, and light in weight has greatly reduced the load of transmission line, and online tool quantity in the time on the multiplicable transmission line, and then improves the productivity.
(3) Large-scale circuit board uses in process of production the utility model discloses the honeycomb formula tool can reduce the spoilage of circuit board by a wide margin, improves plug-in components and paster precision and welding quality, according to the difference of circuit board size, simply modify bottom plate and apron size and shape can, have very strong commonality.
Drawings
Fig. 1 is a schematic top view of the bottom plate of the present invention.
Fig. 2 is a schematic view of the cover plate according to the present invention.
Fig. 3A is a top view of the single-layer continuous honeycomb structure of the present invention.
Fig. 3B is a cross-sectional view of the single-layer continuous honeycomb structure of the present invention.
Fig. 3C is a front perspective view of the single-layer continuous honeycomb structure of the present invention.
Fig. 3D is a schematic back perspective view of the single-layer continuous honeycomb structure of the present invention.
Fig. 4A is a top view of a single layer staggered honeycomb structure of the present invention.
Fig. 4B is a cross-sectional view of a single layer staggered honeycomb structure of the present invention.
Fig. 4C is a front perspective view of the single-layer staggered honeycomb structure of the present invention.
Fig. 4D is a schematic back perspective view of the single-layer staggered honeycomb structure of the present invention.
Fig. 5A is a top view of the double-layer continuous honeycomb structure of the present invention.
Fig. 5B is a cross-sectional view of the double-layer continuous honeycomb structure of the present invention.
Fig. 5C is a front perspective view of the double-layer continuous honeycomb structure of the present invention.
Fig. 5D is a schematic back perspective view of the double-layer continuous honeycomb structure of the present invention.
Detailed Description
In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following embodiments.
In the description of the present invention, it should be understood that the shapes, layouts and sizes of the various parts of the jig shown in the schematic drawings are only used for explaining the specific embodiments, and are not to be understood as limitations of the present invention, and all the different shapes, layouts and sizes of the jig are within the scope of the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
As shown in fig. 1 and 2, the present invention discloses a honeycomb jig for large circuit board, which includes a bottom plate 10 and a cover plate 20 cooperating with the bottom plate 10, wherein the bottom plate 10 and the cover plate 20 both use a honeycomb structure.
The bottom plate 10 is aluminum alloy plate or other materials that physical properties are suitable, and it includes carriage 12 and strengthening rib 13, and carriage 12 is hollow rectangle frame, and strengthening rib 13 is vertically and horizontally intersected in carriage 12, forms a plurality of fretwork grooves 15 between carriage 12 and the strengthening rib 13, carriage 12 is including setting up plate 11 all around and the bottom, and whether plate 11 uses honeycomb according to the thickness decision. The plate 11, the support frame 12 and the reinforcing ribs 13 can also be provided with a plurality of pin holes 14, the pin holes 14 can guide a large circuit board arranged on the substrate 10, the cover plate 20 is connected and supported, and the pin holes 14 are arranged to avoid the positions of components of the circuit board. In order to match with the good thermal expansion adaptability of the honeycomb structure, the aluminum alloy plate of the substrate 10 can be subjected to hard anodizing treatment, so that the performance of the aluminum alloy plate is improved, and the deformation of the substrate 10 is ensured to be extremely small in the whole process.
The honeycomb structures of the bottom plate 10 and the cover plate 20 may be various, and the honeycomb structures include sealing plates and honeycomb holes. As shown in fig. 3A to 5D, three specific embodiments of the honeycomb structure are enumerated: the single-layer continuous honeycomb structure 30A, the single-layer staggered honeycomb structure 30B, and the double-layer continuous honeycomb structure 30C, and the honeycomb structure may also adopt other structures extended from the above three structures, such as a three-layer honeycomb structure or a multi-layer honeycomb structure.
As shown in fig. 3A to 3D, a first embodiment of the honeycomb structure: the continuous honeycomb structure 30A of single-layer, in this embodiment, honeycomb holes 32A are arranged in succession, the closing plate 31A is arranged at the bottom of the honeycomb holes 32A, and the size d of the honeycomb holes 32A, the height h of the honeycomb holes and the wall thickness w of the honeycomb holes can be adjusted according to the proportion.
As shown in fig. 4A to 4D, a second embodiment of the honeycomb structure: a single-layer staggered honeycomb structure, in this embodiment, the cover plates 31B are arranged on the tops of the honeycomb holes 32B, the cover plates 31B are arranged on the bottoms of the cover plates 32B, the adjacent cover plates 32B are staggered to expose the honeycomb holes 32B, and the size d of the honeycomb holes 32B, the height h of the honeycomb holes 32B, the wall thickness w of the honeycomb, and the intervals g1 and g2 of the honeycomb can be adjusted according to the proportion.
As shown in fig. 5A to 5D, a third embodiment of the honeycomb structure: the double-layer continuous honeycomb structure is characterized in that honeycomb holes are continuously arranged, the closing plate 31C is arranged in the middle of the honeycomb holes 32C, and the size d of the honeycomb holes 32C, the heights h1 and h2 of the honeycomb holes 32C and the wall thickness w of the honeycomb holes can be adjusted according to the proportion.
The cover plate 20 is detachably fitted on the bottom plate 10, and the cover plate 20 is provided with a hollow groove 21 and a pin hole 22.
The utility model discloses when the production tool of large-scale circuit board used, be with the horizontal conveyor cooperation use on the production line to use in chip mounter, unleaded hot reflux welding machine combine. The large-scale circuit board is placed on the bottom plate 10, after being subjected to surface mounting by the surface mounting machine, the surface mounting and the plug-in of the large-scale circuit board are completed, and then the small board is accurately placed at the corresponding position of the large-scale circuit board by the manipulator. Before the reflow soldering process, the positioning pins are manually placed, the cover plate 20 covers the bottom plate 10 and the circuit board and is fixed, the lead-free thermal reflow soldering machine flows in for reflow soldering, the cover plate 20 is taken down after the reflow soldering machine flows out, and the bottom plate 10 and the large circuit board matched with the bottom plate 10 flow in the next process.
The utility model discloses the tool adopts honeycomb on bottom plate 10 and apron 20, furthest reduces the volume and the weight of entity material, and the weight and the thermal capacity of this tool are about non-honeycomb's third, at the in-process of crossing the backward flow, and the welding temperature curve to reflow soldering influences very little. The utility model discloses carry out stereoplasm anodic oxidation to the aluminum alloy plate of tool and handle, cooperate the good thermal expansion adaptability of honeycomb, can ensure that the tool is in carrying out whole process flow, and the deflection is minimum. The utility model discloses the weight of honeycomb formula tool is about the third of traditional tool weight, and light in weight has greatly reduced the load of transmission line, and online tool quantity in the time on the multiplicable transmission line, and then improves the productivity. According to the difference of the circuit board size, can simply revise the size and the shape of bottom plate and apron can, have very strong commonality.