CN216698774U

CN216698774U - Anti-drop's welded structure

Info

Publication number: CN216698774U
Application number: CN202123001998.1U
Authority: CN
Inventors: 付小军
Original assignee: Shenzhen Sangrui Biotechnology Co ltd
Current assignee: Shenzhen Sangrui Biotechnology Co ltd
Priority date: 2021-12-01
Filing date: 2021-12-01
Publication date: 2022-06-07
Anticipated expiration: 2031-12-01

Abstract

The utility model provides an anti-falling welding structure which comprises a substrate and an adapter plate with low heat conductivity coefficient, wherein the adapter plate is communicated with a substrate circuit, the substrate is provided with a first through hole, the adapter plate is provided with a bonding pad, a second through hole and a plurality of air holes, the second through hole is positioned in the middle of the bonding pad, an external lead can sequentially penetrate through the first through hole and the second through hole and is welded with the bonding pad through a tin wire, and therefore the perforated welding wire of an aluminum substrate is achieved. During wire welding, the molten tin wire can flow to the bonding pads at the edges of the orifices at the two ends of the second through hole through the hole wall of the second through hole, so that the welding area is increased, and the reinforcing effect is achieved. So, need not very high welding temperature just can weld the wire to the keysets on, welding efficiency is high, and the wire also is difficult for droing for the base plate quality can be guaranteed. The plurality of air holes are distributed on the edge of the adapter plate, and the first through holes and the air holes remove gas generated when soldering flux is melted at high temperature in the welding process, so that the adapter plate is prevented from being jacked up after welding, and the adapter plate is prevented from being disconnected with the substrate circuit.

Description

Anti-drop's welded structure

Technical Field

The utility model relates to the technical field of circuit board welding, in particular to an anti-falling welding structure.

Background

Circuit boards are important electronic components, and are supports for electronic components and carriers for electrically interconnecting the electronic components. In order to electrically interconnect the respective components, a printed board is used. The printed circuit board consists of an insulating bottom plate, a connecting lead and a welding disc for assembling and welding electronic elements, and has double functions of a conductive circuit and the insulating bottom plate. The novel electronic product wiring device can replace complex wiring, realizes electrical connection among elements in a circuit, simplifies assembly and welding work of electronic products, reduces wiring workload in a traditional mode, and greatly reduces labor intensity of workers.

In order to achieve a better heat dissipation effect of the existing lamp, an aluminum substrate is mostly adopted as a base material for a circuit board of the existing lamp, the aluminum substrate belongs to a metal conductor, a double-sided board cannot be manufactured, only a bonding layer is added on a single side, a copper foil is attached to the single-sided board to manufacture a circuit, a bonding pad is manufactured on the surface of the copper foil attached surface for a bonding wire, and the bonding wire is welded on the bonding pad. However, the welding wire on the bonding pad is greatly influenced by temperature, and the falling risk exists after a long time, so that the lamp cannot be normally used; and the aluminum base plate with higher heat conductivity coefficient needs higher welding temperature due to fast heat transfer, has higher requirements on the welding technology of a welder master, and the welding levels of the welder master are different, so that the welding efficiency is low and the quality is difficult to control.

In the prior art, the FR4 board with low thermal conductivity is welded on the aluminum substrate, and the FR4 board is communicated with the circuit of the aluminum substrate, so that a welder can directly weld a conducting wire on the FR4 board. However, at the contact position between the FR4 board and the aluminum substrate, because the contact area is small (the contact area occupies a large space), the flux can help and promote the soldering process in the soldering process, and has chemical substances with protective effect and oxidation reaction prevention. And the scaling powder can be used often in the welding process, and the scaling powder can volatilize and produce gas in the welding process, with FR4 board jack-up, leads to the junction position probably to become invalid for aluminium base board can't normal use, is unfavorable for the welding master to weld FR4 board and aluminium base board.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects in the prior art and provides an anti-drop welding structure and a lead

The utility model is realized by the following technical scheme:

the utility model provides an anti-falling welding structure which comprises a substrate and an adapter plate with low heat conductivity coefficient, wherein the adapter plate is communicated with a substrate circuit, the substrate is provided with a first through hole, the adapter plate is provided with a bonding pad, a second through hole positioned in the middle of the bonding pad and a plurality of air holes, the first through hole is communicated with the second through hole, an external lead can sequentially penetrate through the first through hole and the second through hole and is welded with the bonding pad through a tin wire, and the air holes are distributed on the edge of the adapter plate.

Further, the first through hole is larger than the second through hole.

Furthermore, the adapter plate is provided with a plurality of conductive discs, and the conductive discs are communicated with the substrate circuit.

Furthermore, the adapter plate is provided with a plurality of insulating disks, and the insulating disks can not be communicated with the base plate in a circuit mode.

Furthermore, the conductive disc and the insulating disc are provided with the air holes.

The utility model has the beneficial effects that: the adapter plate is communicated with the circuit of the substrate and is fixed with the substrate in an attaching mode, the first through hole avoids the circuit, enough creepage distance is reserved, the lead can sequentially penetrate through the first through hole and the second through hole and is welded with the bonding pad through the tin wire, and therefore the perforated welding wire of the aluminum substrate is achieved. During wire welding, the molten tin wire can flow to the bonding pads at the edges of the orifices at the two ends of the second through hole through the hole wall of the second through hole, so that the welding area is increased, and the reinforcing effect is achieved. So, need not very high welding temperature just can weld the wire to the keysets on, welding efficiency is high, and the wire also is difficult for droing for the base plate quality can be guaranteed. Meanwhile, the first through holes and the air holes are used for removing gas generated when the soldering flux is melted at high temperature in the welding process, so that the adapter plate is prevented from being jacked up after welding, and the adapter plate is prevented from being disconnected with the substrate circuit.

Drawings

FIG. 1 is an overall schematic view of the anti-dropout welding structure of the present invention;

FIG. 2 is an exploded view of FIG. 1;

FIG. 3 is an exploded view in the other direction of FIG. 2;

FIG. 4 is an enlarged detail view of portion A of FIG. 2;

fig. 5 is an enlarged detail view of part B of fig. 3.

Detailed Description

In order to more clearly and completely explain the technical scheme of the utility model, the utility model is further explained by combining the attached drawings.

Referring to fig. 1 to 5, the present invention provides an anti-drop welding structure, including a substrate 100 and an interposer 200 with a low thermal conductivity, the interposer 200 is in circuit communication with the substrate 100, one surface of the interposer 200 is attached to and fixed to the substrate 100, the substrate 100 is provided with a first through hole 110, the interposer 200 is provided with a plurality of vent holes 210, two end surfaces of the interposer 200 are respectively provided with a pad 220 and a second through hole 230 located in the middle of the pad 220, the first through hole 110 is communicated with the second through hole 230, an external wire 300 can sequentially pass through the first through hole 110 and the second through hole 230 and is welded to the pad 220 through a tin wire, and the plurality of vent holes 210 are distributed at an edge of the interposer 200.

In this embodiment, one side of the interposer 200 is fixed to the substrate 100, the substrate 100 is provided with the first through hole 110 at a position where a wire bonding is required, the edge of the two end openings of the second through hole 230 are both provided with the bonding pads 220, and the first through hole 110 is communicated with the second through hole 230, the wire 300 can sequentially pass through the first through hole 110 and the second through hole 230 and is welded to the bonding pads 220 through a tin wire, the first through hole 110 avoids a circuit, a sufficient creepage distance is reserved, it is ensured that the wire 300 can pass through the first through hole 110 and the second through hole 230 and be connected to the interposer 200, thereby realizing the wire bonding through the hole of the substrate 100. During wire bonding, the melted tin wire flows to the bonding pads 220 at the edges of the two end openings of the second through hole 230 through the hole wall of the second through hole 230, so as to increase the welding area and play a role in reinforcement. Therefore, the lead 300 can be welded on the adapter plate 200 without high welding temperature, the welding efficiency is high, the lead 300 is not easy to fall off from the bonding pad 220, and the quality of the substrate 100 is ensured.

In the present embodiment, the first through holes 110 and the ventilation holes 210 remove gas generated when the flux is melted at a high temperature during the soldering process, thereby preventing the interposer 200 from being lifted up after the soldering process, preventing the interposer 200 from being electrically disconnected from the substrate 100, and further strengthening the connection if excess tin flows into the ventilation holes 210.

In the present embodiment, the substrate 100 is an aluminum substrate 100.

In the present embodiment, the interposer 200 is an FR4 double-sided board with low thermal conductivity.

In other embodiments, the interposer 200 is a PCB board with low thermal conductivity.

Further, the first through hole 110 is larger than the second through hole 230.

In the present embodiment, the first through holes 110 are larger than the second through holes 230, so as to facilitate the removal of the gas generated by the flux when melted at high temperature, and at the same time, the substrate 100 does not shield the pads 220 of the second through holes 230 facing the aperture edge of the substrate 100, so that the melted tin wires can flow to the pads 220 of the second through holes 230 facing the aperture edge of the substrate 100 through the hole walls of the second through holes 230.

Further, the interposer 200 is provided with a plurality of conductive pads 240, and the conductive pads 240 are in electrical communication with the substrate 100. The interposer 200 is provided with a plurality of insulating disks 250, the insulating disks 250 not being in electrical communication with the substrate 100.

In this embodiment, the interposer 200 further includes a conductive plate 240 and an insulating plate 250, the conductive plate 240 is used for electrically communicating with the substrate 100, and the insulating plate 250 is used for reinforcing the substrate 100, so as to improve the fixing force between the connection plate and the substrate 100.

Further, the conductive plate 240 and the insulating plate 250 are provided with the airing holes 210.

In the present embodiment, the conductive plate 240 and the insulating plate 250 are provided with the ventilation holes 210, and the ventilation holes 210 can remove gas generated when the flux is melted at a high temperature.

Of course, the present invention may have other embodiments, and based on the embodiments, those skilled in the art can obtain other embodiments without any creative effort, and all of them are within the protection scope of the present invention.

Claims

1. The utility model provides an anti-drop's welded structure, its characterized in that includes the keysets that base plate and coefficient of heat conductivity are low, the keysets with base plate circuit intercommunication, the base plate is equipped with first through-hole, the keysets is equipped with the pad, is located second through-hole and a plurality of bleeder vent in the middle of the pad, first through-hole with second through-hole intercommunication, outside wire can pass in proper order first through-hole with the second through-hole and through the tin wire with the pad welding, it is a plurality of the bleeder vent distributes the limit portion of keysets.

2. The drop-proof weld structure according to claim 1, wherein the first through hole is larger than the second through hole.

3. A drop-proof weld structure according to claim 1, wherein the interposer is provided with a plurality of conductive pads in circuit communication with the substrate.

4. A drop-off prevention weld structure according to claim 3, wherein the interposer is provided with a plurality of insulating disks that are not in circuit communication with the substrate.

5. A drop-proof welded structure according to claim 4, wherein the conductive plate and the insulating plate are provided with the ventilation holes.