CN114531784A - 芯板的制备方法和印制电路板的制备方法 - Google Patents
芯板的制备方法和印制电路板的制备方法 Download PDFInfo
- Publication number
- CN114531784A CN114531784A CN202210338278.4A CN202210338278A CN114531784A CN 114531784 A CN114531784 A CN 114531784A CN 202210338278 A CN202210338278 A CN 202210338278A CN 114531784 A CN114531784 A CN 114531784A
- Authority
- CN
- China
- Prior art keywords
- substrate
- core board
- air guide
- conductive
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210338278.4A CN114531784A (zh) | 2022-04-01 | 2022-04-01 | 芯板的制备方法和印制电路板的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210338278.4A CN114531784A (zh) | 2022-04-01 | 2022-04-01 | 芯板的制备方法和印制电路板的制备方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114531784A true CN114531784A (zh) | 2022-05-24 |
Family
ID=81625997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210338278.4A Pending CN114531784A (zh) | 2022-04-01 | 2022-04-01 | 芯板的制备方法和印制电路板的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114531784A (zh) |
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2022
- 2022-04-01 CN CN202210338278.4A patent/CN114531784A/zh active Pending
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20230703 Address after: 519002 No. 107, Baishi Road, Qianshan, Xiangzhou District, Zhuhai City, Guangdong Province Applicant after: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Applicant after: New founder holdings development Co.,Ltd. Address before: 519002 No. 107, Baishi Road, Qianshan, Xiangzhou District, Zhuhai City, Guangdong Province Applicant before: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Applicant before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. |
|
TA01 | Transfer of patent application right |