CN114522892A - Coupling method and device for optical module with AWG - Google Patents
Coupling method and device for optical module with AWG Download PDFInfo
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- CN114522892A CN114522892A CN202111672001.7A CN202111672001A CN114522892A CN 114522892 A CN114522892 A CN 114522892A CN 202111672001 A CN202111672001 A CN 202111672001A CN 114522892 A CN114522892 A CN 114522892A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 34
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- 238000001514 detection method Methods 0.000 claims abstract description 57
- 238000012360 testing method Methods 0.000 claims abstract description 51
- 230000007246 mechanism Effects 0.000 claims abstract description 42
- 230000002159 abnormal effect Effects 0.000 claims abstract description 4
- 238000003491 array Methods 0.000 claims description 8
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- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 6
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2501/00—Sorting according to a characteristic or feature of the articles or material to be sorted
- B07C2501/0063—Using robots
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- Optics & Photonics (AREA)
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Abstract
The invention relates to a coupling method of an optical module with an AWG (arrayed waveguide grating), which comprises S1, presetting an AWG yield detection platform and an AWG assembly platform; s2, grabbing the AWG to be assembled to the AWG yield detection platform by a grabbing mechanism, performing coupling test on the AWG yield detection platform, and judging whether the AWG is normal; s3, if the AWG is judged to be normal, the AWG is sent to the AWG assembly platform by the grabbing mechanism to be coupled and assembled; if judged abnormal, the damaged AWG is removed, and a new AWG to be assembled is grabbed again by the grabbing mechanism and the step S2 is repeated. The AWG yield detection platform is used for carrying out coupling test on the AWG to be assembled and judging whether the AWG is a normal AWG or not, and the AWG assembly platform is used for carrying out coupling assembly on the AWG which is judged to be normal after the AWG yield detection platform is tested on the optical module. The invention firstly carries out AWG yield detection before coupling, thereby improving the coupling efficiency.
Description
Technical Field
The invention relates to the technical field of optical devices, in particular to a coupling method and a coupling device of an optical module with an AWG (arrayed waveguide grating).
Background
With the rise of new foundries such as 5G construction and data centers, the demand for the optical module is continuously increased, and new requirements are provided for the production efficiency of the optical module. In order to improve the efficiency, the AWG component is introduced into the optical path of the module, and the AWG component has the advantages that the coupling of the multi-channel optical path can be carried out simultaneously in the production process of the optical module, so that the production efficiency is greatly improved.
However, with the large use of AWG, some AWGs may be damaged during the turnaround, delaying the coupling efficiency.
Disclosure of Invention
The invention aims to provide a coupling method of an optical module with an AWG and a CCC.
In order to achieve the above purpose, the embodiments of the present invention provide the following technical solutions: a method of coupling an optical module having an AWG, comprising the steps of:
s1, presetting an AWG yield detection platform and an AWG assembly platform;
s2, grabbing the AWG to be assembled to the AWG yield detection platform by a grabbing mechanism, performing coupling test on the AWG yield detection platform, and judging whether the AWG is normal;
s3, if the AWG is judged to be normal, the gripping mechanism sends the AWG to the AWG assembly platform for coupling assembly; if judged abnormal, the damaged AWG is removed, and a new AWG to be assembled is grabbed again by the grabbing mechanism and the step S2 is repeated.
Further, in the step S2, a test array PD is disposed on the AWG yield detection platform, and a product array PD is also disposed on the AWG assembly platform, so that the size of the photosensitive area of the test PD in each test array PD is larger than the size of the photosensitive area of the product PD in each product array PD, thereby ensuring that the undamaged AWG and the test array PD can be successfully coupled at a time.
Further, in the step S3, the damaged AWG is removed by the grasping mechanism.
Furthermore, the gripping mechanism adopts a suction nozzle to suck the AWG, and drives the AWG to move between the AWG yield detection platform and the AWG assembly platform through a moving assembly, and the AWG is gripped or placed.
Further, after the AWG yield detection platform and the AWG assembly platform are set, the levelness of the AWG yield detection platform and the levelness of the AWG assembly platform are adjusted.
The embodiment of the invention provides another technical scheme: a coupling device of optical module with AWG comprises an AWG yield rate detection platform, an AWG assembly platform and a grabbing mechanism,
the AWG yield detection platform is used for carrying out coupling test on the AWG to be assembled and judging whether the AWG is a normal AWG or not,
and the AWG assembling platform is used for coupling and assembling the AWG which is judged to be normal after being tested by the AWG yield detection platform on the optical module.
Further, the AWG yield detection platform includes a first PCB and test arrays PD mounted on the first PCB, the AWG assembly platform includes a second PCB and product arrays PD mounted on the second PCB, and the size of the photosensitive area of the test PD in each test array PD is greater than the size of the photosensitive area of the product PD in each product array PD.
Further, the first PCB and the second PCB are arranged in parallel, and the direction from the first PCB to the second PCB is the translation direction of the grabbing mechanism.
Further, the PCB assembling machine further comprises a rest for placing the first PCB and the second PCB, and an adjusting mechanism for adjusting the levelness of the rest.
Further, the gripping mechanism comprises a suction nozzle for sucking the AWG and a moving component for driving the suction nozzle to move between the AWG yield detection platform and the AWG assembly platform and grip or place the AWG.
Compared with the prior art, the invention has the beneficial effects that: before coupling the products, AWG yield detection is carried out, and coupling efficiency is improved.
Drawings
Fig. 1 is a schematic diagram of a coupling device of an optical module having an AWG according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a test array PD of a coupling device of an optical module with an AWG according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a product array PD of a coupling device having an AWG optical module according to an embodiment of the present invention;
FIG. 4 is an enlarged schematic view at A of FIG. 1;
in the reference symbols: 1-AWG yield detection platform; 10-a first PCB board; 11-test PD; 12-a first photosensitive area; 13-test array PD; 2-AWG assembly platform; 20-a second PCB board; 21-product PD; 22-a second photosensitive area; 23-product array PD; 3-a gripping mechanism; 30-a suction nozzle; 31-horizontal driving module; 32-a vertical drive module; 4-a rest table; 5-an adjusting mechanism; a 50-X axis linear module; a 51-Y axis linear module; 52-Z axis linear module.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and 4, an embodiment of the present invention provides a coupling method for an optical module having an AWG, including the following steps: s1, presetting an AWG yield detection platform 1 and an AWG assembly platform 2; s2, grabbing the AWG to be assembled to the AWG yield detection platform 1 by the grabbing mechanism 3, performing coupling test on the AWG yield detection platform 1, and judging whether the AWG is normal; s3, if the AWG is judged to be normal, the gripping mechanism 3 sends the AWG to the AWG assembling platform 2 for coupling assembly; if judged abnormal, the damaged AWG is removed, and a new AWG to be assembled is picked up again by the picking mechanism 3 and the step S2 is repeated. In this embodiment, the AWG yield detection is performed before the product coupling, so as to improve the coupling efficiency. Because the coupling assembly of the product needs time adjustment and has higher precision, if the AWG is damaged, the damage of the AWG is found after the AWG is adjusted, the coupling cannot be carried out, the time is delayed, and the working efficiency is reduced. Therefore, the problem can be eliminated by setting an AWG yield detection platform 1 to detect whether the AWG is damaged or not in advance. Specifically, the AWG is placed on the AWG yield detection platform 1 to perform a coupling test, where the test accuracy is not high, and only whether the AWG can be normally coupled is determined, so as to determine whether the AWG is damaged. If damaged, the AWG mounting platform 2 is not required to be removed for coupling mounting, and if not damaged, the AWG mounting platform 2 is removed for coupling. During the stage switching, the AWG is grasped by the grasping mechanism 3.
As an optimized solution of the embodiment of the present invention, referring to fig. 1 and fig. 4, in the step S2, a test array PD13 is disposed on the AWG yield detection platform 1, and product arrays PD23 are also disposed on the AWG assembly platform 2, so that the size of the photosensitive area of the test PD11 in each test array PD13 is larger than that of the photosensitive area of the product PD21 in each product array PD23, thereby ensuring that an undamaged AWG can be successfully coupled with the test array PD13 at one time. In this embodiment, by designing and testing a large-area photosensitive region of PD11, it is easier to couple compared with a small photosensitive region of PD21, i.e. it is not necessary to adjust slowly, it can be known whether AWG is damaged or not quickly, and then it is moved to AWG mounting platform 2 by grabbing mechanism 3 to mount safely, so as to greatly improve efficiency and avoid doing useless work. Preferably, the test PD11 is in a popsicle shape, and its photosensitive region (i.e. the first photosensitive region 12 in fig. 2) can have a wide photosensitive surface at the popsicle-shaped popsicle, while the product PD21 is in a petal shape, and its photosensitive region (i.e. the second photosensitive region 22 in fig. 3) is only at the round point at the end of the petal-shaped structure, and its area is very small, usually only 10-70 μm, and the coupling precision is high, and it takes time to couple. Therefore, the embodiment utilizes the advantage that the test PD11 with a wide photosensitive area (much larger than 10-70 μm) can complete the coupling quickly, and determines whether the AWG is damaged or not in advance, thereby ensuring that the AWG sent to the PD21 of the product is intact. Preferably, the AWG yield detection platform 1 includes a first PCB and a test array PD13, the test array PD13 is disposed on the first PCB, light emitted from the AWG light outlet can fall onto four large PDs to generate four photocurrents, and then sampling is performed by the communication board ADC, and the GUI at the PC end can calculate the maximum responsivity of the four channels at once, thereby determining whether the AWG can be normally coupled, so as to determine whether the AWG is intact. Similarly, the AWG assembly platform 2 includes the second PCB and the product array PD23, and after the determination, the coupling can be normally coupled in the same manner as described above, except that the coupling speed is not as fast as that of the large-area photosensitive surface. Preferably, the test array PD13 is located at the edge of the first PCB and the product array PD23 is located at the edge of the second PCB board 20, so that the coupling test can be started only by aligning the edge of the AWG with the edge of the PCG board, further improving efficiency.
Referring to fig. 1 and 4 as an optimization scheme of the embodiment of the present invention, in the step S3, damaged AWG is taken away by the grasping mechanism 3. In this embodiment, damaged AWGs can be removed by the grasping mechanism 3 and then placed in a designated storage area, so that full automation of coupling can be achieved. Of course, here manual removal is also possible.
Referring to fig. 1, as an optimized solution of the embodiment of the present invention, the gripping mechanism 3 uses a suction nozzle 30 to suck the AWG, and drives the AWG to move between the AWG yield detection platform 1 and the AWG assembly platform 2 through a moving component to grip or place the AWG. In this embodiment, the nozzle 30 and the moving assembly can be used to cooperate to complete the taking and placing of the AWG. Preferably, the moving assembly comprises a horizontal driving module 31 and a vertical driving module 32, i.e. a horizontal driving force and a vertical driving force are formed, and the suction nozzle 30 can be carried to move back and forth between the two platforms and the suction nozzle 30 can be carried to move up and down to complete the grabbing or placing respectively. Linear modules may be used here.
Referring to fig. 1 and 4 as an optimization scheme of the embodiment of the present invention, after the AWG yield detection platform 1 and the AWG assembly platform 2 are set, the levelness of the AWG yield detection platform 1 and the AWG assembly platform 2 is adjusted. In this embodiment, the AWG yield detection platform 1 and the AWG assembling platform 2 need to adjust the levelness before working, so as to ensure the transmission of the optical path. Preferably, the shelf 4 may be used to hold the AWG yield detection platform 1 and the AWG mounting platform 2, and specifically, the first PCB board 10 and the second PCB board 20 may be placed on the shelf 4, and then the levelness of the shelf 4 is adjusted by the adjusting mechanism 5 under the shelf 4, so as to determine the levelness of the AWG yield detection platform 1 and the AWG mounting platform 2. The adjustment mechanism 5 includes an X-axis linear module 50, a Y-axis linear module 51, and a Z-axis linear module 52, and can be adjusted in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively.
Referring to fig. 1 and 4, an embodiment of the invention provides a coupling device for an optical module with an AWG, including an AWG yield detection platform 1, an AWG assembly platform 2, and a gripping mechanism 3. The AWG yield detection platform 1 is used for performing coupling test on an AWG to be assembled and judging whether the AWG is a normal AWG or not, and the AWG assembly platform 2 is used for performing coupling assembly on the AWG which is judged to be normal after being tested by the AWG yield detection platform 1 on an optical module. In this embodiment, the AWG yield detection is performed before the product coupling, so as to improve the coupling efficiency. Because the coupling assembly of the product needs time adjustment and has higher precision, if the AWG is damaged, the damage of the AWG is found after the AWG is adjusted, the coupling cannot be realized, the time is delayed, and the working efficiency is reduced. Therefore, the problem can be eliminated by setting an AWG yield detection platform 1 to detect whether the AWG is damaged or not in advance. Specifically, the AWG is placed on the AWG yield detection platform 1 to perform a coupling test, where the test accuracy is not high, and only whether the AWG can be normally coupled is determined, so as to determine whether the AWG is damaged. If damaged, the AWG mounting platform 2 is not required to be removed for coupling mounting, and if not damaged, the AWG mounting platform 2 is removed for coupling. During the stage switching, the AWG is grasped by the grasping mechanism 3.
As an optimized solution of the embodiment of the present invention, please refer to fig. 1, fig. 2, fig. 3 and fig. 4, the AWG yield testing platform 1 includes a first PCB 10 and a testing array PD13 mounted on the first PCB 10, the AWG assembly platform 2 includes a second PCB 20 and a product array PD23 mounted on the second PCB 20, and the size of the photosensitive area of the testing PD11 in each testing array PD13 is larger than the size of the photosensitive area of the product PD21 in each product array PD 23. In this embodiment, by designing and testing a large-area photosensitive region of PD11, it is easier to couple compared with a small photosensitive region of PD21, i.e. it is not necessary to adjust slowly, it can be known whether AWG is damaged or not quickly, and then it is moved to AWG mounting platform 2 by grabbing mechanism 3 to mount safely, so as to greatly improve efficiency and avoid doing useless work. Preferably, the test PD11 is in a popsicle shape, and its photosensitive region (i.e. the first photosensitive region 12 in fig. 2) can have a wide photosensitive surface at the popsicle-shaped popsicle, while the product PD21 is in a petal shape, and its photosensitive region (i.e. the second photosensitive region 22 in fig. 3) is only at the round point at the end of the petal-shaped structure, and its area is very small, usually only 10-70 μm, and the coupling precision is high, and it takes time to couple. Therefore, the embodiment utilizes the advantage that the test PD11 with a wide photosensitive area (much larger than 10-70 μm) can complete the coupling quickly, and determines whether the AWG is damaged or not in advance, thereby ensuring that the AWG sent to the PD21 of the product is intact. Preferably, the AWG yield detection platform 1 includes a first PCB and a test array PD13, the test array PD13 is disposed on the first PCB, light emitted from the AWG light outlet can fall onto four large PDs to generate four photocurrents, and then sampling is performed by the communication board ADC, and the GUI at the PC end can calculate the maximum responsivity of the four channels at once, thereby determining whether the AWG can be normally coupled, so as to determine whether the AWG is intact. Similarly, the AWG assembly platform 2 includes the second PCB and the product array PD23, and after the determination, the coupling can be normally coupled in the same manner as described above, except that the coupling speed is not as fast as that of the large-area photosensitive surface. Preferably, the test array PD13 is located at the edge of the first PCB and the product array PD23 is located at the edge of the second PCB 20, so that the coupling test can be initiated only by aligning the edge of the AWG with the edge of the PCG board, further improving efficiency.
Further optimizing the above solution, please refer to fig. 1 and fig. 4, the first PCB 10 and the second PCB 20 are arranged in parallel, and a direction from the first PCB 10 to the second PCB 20 is a translation direction of the grabbing mechanism 3. In this embodiment, the first PCB 10 and the second PCB 20 may be arranged in parallel, and the grasping mechanism 3 may be moved laterally with higher efficiency.
Referring to fig. 1 and 4 as an optimized solution of the embodiment of the present invention, the apparatus further includes a rest 4 for resting the first PCB 10 and the second PCB 20, and an adjusting mechanism 5 for adjusting a levelness of the rest 4. In this embodiment, in the above-mentioned AWG yield detection platform 1 and AWG assembling platform 2, the levelness needs to be adjusted before working, so as to ensure the transmission of the optical path. Preferably, the shelf 4 may be used to hold the AWG yield detection platform 1 and the AWG mounting platform 2, and specifically, the first PCB board 10 and the second PCB board 20 may be placed on the shelf 4, and then the levelness of the shelf 4 is adjusted by the adjusting mechanism 5 under the shelf 4, so as to determine the levelness of the AWG yield detection platform 1 and the AWG mounting platform 2. The adjustment mechanism 5 includes an X-axis linear module 50, a Y-axis linear module 51, and a Z-axis linear module 52, and can be adjusted in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively.
Referring to fig. 1 and 4, as an optimized solution of the embodiment of the present invention, the gripping mechanism 3 includes a suction nozzle 30 for sucking the AWG, and a moving component for driving the suction nozzle 30 to move between the AWG yield detection platform 1 and the AWG assembling platform 2 and gripping or placing the AWG. In this embodiment, the nozzle 30 and the moving assembly can be used to cooperate to complete the taking and placing of the AWG. Preferably, the moving assembly comprises a horizontal driving module 31 and a vertical driving module 32, i.e. a horizontal driving force and a vertical driving force are formed, and the suction nozzle 30 can be carried to and fro between the two platforms and the suction nozzle 30 can be carried to and fro to complete the grabbing or placing respectively. Linear modules may be used here.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A method of coupling an optical module having an AWG, comprising the steps of:
s1, presetting an AWG yield detection platform and an AWG assembly platform;
s2, grabbing the AWG to be assembled to the AWG yield detection platform by a grabbing mechanism, performing coupling test on the AWG yield detection platform, and judging whether the AWG is normal;
s3, if the AWG is judged to be normal, the gripping mechanism sends the AWG to the AWG assembly platform for coupling assembly; if judged abnormal, the damaged AWG is removed, and a new AWG to be assembled is grabbed again by the grabbing mechanism and the step S2 is repeated.
2. A method of coupling an optical module having an AWG as recited in claim 1, wherein: in the step S2, the testing arrays PD are disposed on the AWG yield detection platform, and the product arrays PD are also disposed on the AWG assembling platform, so that the photosensitive areas of the testing PDs in each testing array PD are all larger than the photosensitive areas of the product PDs in each product array PD, thereby ensuring that the undamaged AWG and the testing arrays PD can be successfully coupled at a time.
3. A method of coupling an optical module having an AWG as recited in claim 1, wherein: in said step S3, the damaged AWG is removed by said grasping mechanism.
4. A method of coupling an optical module having an AWG as recited in claim 1, wherein: the gripping mechanism adopts a suction nozzle to suck the AWG, and drives the AWG to move between the AWG yield detection platform and the AWG assembly platform through a moving assembly, and the AWG is gripped or placed.
5. A method of coupling an optical module having an AWG as recited in claim 1, wherein: after the AWG yield detection platform and the AWG assembly platform are set, adjusting the levelness of the AWG yield detection platform and the AWG assembly platform.
6. A coupling device for an optical module having an AWG, characterized by: comprises an AWG yield detection platform, an AWG assembly platform and a grabbing mechanism,
the AWG yield detection platform is used for carrying out coupling test on the AWG to be assembled and judging whether the AWG is a normal AWG or not,
and the AWG assembling platform is used for coupling and assembling the AWG which is judged to be normal after being tested by the AWG yield detection platform on the optical module.
7. The coupling apparatus of an optical module having an AWG as recited in claim 6, wherein: the AWG yield detection platform comprises a first PCB and test arrays PD arranged on the first PCB, the AWG assembly platform comprises a second PCB and product arrays PD arranged on the second PCB, and the size of the photosensitive area of each test PD in each test array PD is larger than that of the photosensitive area of each product PD in each product array PD.
8. The coupling apparatus of an optical module having an AWG as recited in claim 7, wherein: the first PCB and the second PCB are arranged in parallel, and the direction from the first PCB to the second PCB is the translation direction of the grabbing mechanism.
9. A coupling arrangement for an optical module having an AWG according to claim 7, wherein: the PCB assembling machine further comprises a placing table used for placing the first PCB and the second PCB, and an adjusting mechanism used for adjusting the levelness of the placing table.
10. The coupling apparatus of an optical module having an AWG as recited in claim 6, wherein: the gripping mechanism comprises a suction nozzle for sucking the AWG and a moving assembly for driving the suction nozzle to move between the AWG yield detection platform and the AWG assembly platform and grip or place the AWG.
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| CN202111672001.7A CN114522892A (en) | 2021-12-31 | 2021-12-31 | Coupling method and device for optical module with AWG |
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| CN202111672001.7A CN114522892A (en) | 2021-12-31 | 2021-12-31 | Coupling method and device for optical module with AWG |
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