CN217768302U - LED chip transfer device with chip removing function - Google Patents
LED chip transfer device with chip removing function Download PDFInfo
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- CN217768302U CN217768302U CN202221348886.5U CN202221348886U CN217768302U CN 217768302 U CN217768302 U CN 217768302U CN 202221348886 U CN202221348886 U CN 202221348886U CN 217768302 U CN217768302 U CN 217768302U
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Abstract
The application provides a LED chip transfer device with chip gets rid of function, the device get rid of the module and remove the module including image acquisition module, bad chip. The image acquisition module is used for acquiring an image of the first chip carrier and identifying a bad LED chip in the image, and the first chip carrier is provided with an LED chip transferred to the first chip carrier. The bad chip removing module is used for removing bad LED chips on the first chip carrier, and the moving module is used for moving the bad LED chips on the first chip carrier to align with the bad chip removing module. The image acquisition module acquires an image of a first chip carrier and identifies a bad LED chip in the image; then the moving module moves the bad LED chips on the first chip carrier to align with the bad chip removing module, and the bad chip removing module removes the bad LED chips on the first chip carrier. Therefore, the influence of the poor LED chip moving to the next process on the production of the subsequent LED product is prevented.
Description
Technical Field
The application belongs to the technical field of chip manufacturing equipment, and particularly relates to an LED chip transfer device with a chip removing function.
Background
In the existing technology for transferring LED chips massively, chips are sucked by a suction nozzle from the impact of a raw material carrier film to a high point and are sent to a prearranged carrier plate. At present, poor problems such as erection, deflection or offset can still be generated after the LED chips on the raw material carrier are transferred onto the substrate, and the poor LED chips cannot be removed by the existing chip transfer equipment after the LED chips are transferred, so that the poor LED chips are moved to the next procedure, and the production of subsequent LED products is influenced.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides an LED chip transfer device with a chip removing function, so that the problem that poor LED chips cannot be removed after the LED chips are transferred by existing chip transfer equipment is solved.
The embodiment of the application provides an LED chip transfer device with chip removes function, LED chip transfer device with chip removes function includes:
the image acquisition module is used for acquiring an image of a first chip carrier and identifying a bad LED chip in the image, wherein the first chip carrier is provided with the LED chip transferred to the first chip carrier;
the defective chip removing module is used for removing the defective LED chip on the first chip carrier;
and the moving module is used for moving the bad LED chip on the first chip carrier to be aligned with the bad chip removing module.
Optionally, the bad chip removing module comprises an adsorption component and a first driving component, the adsorption component is used for adsorbing the bad LED chip, and the first driving component is used for driving the adsorption component to move.
Optionally, the adsorption component is a negative pressure adsorption component.
Optionally, the negative pressure adsorption assembly comprises a suction nozzle seat, a suction nozzle and a suction nozzle sleeve, the suction nozzle is arranged on the suction nozzle seat, and the suction nozzle is fixed on the suction nozzle seat by the suction nozzle sleeve; the suction nozzle is connected with a negative pressure source.
Optionally, the first driving assembly, the adsorption assembly and the first chip carrier are sequentially arranged along a first direction, and the first driving assembly drives the adsorption assembly to move in the first direction.
Optionally, the first driving assembly includes a first cylinder, a piston end of the first cylinder moves along the first direction, and the piston end of the first cylinder is connected to the adsorption assembly.
Optionally, the LED chip transferring apparatus with a chip removing function further includes:
the bearing module is used for bearing a second chip carrier, and the second chip carrier is provided with an LED chip to be transferred;
and the ejector pin module is used for impacting the LED chip on the second chip carrier onto the first chip carrier.
Optionally, the carrier module includes a second driving assembly, and the second driving assembly drives the second chip carrier to rotate along the first direction.
Optionally, the carrier module further includes a third driving assembly and a fourth driving assembly, the third driving assembly is configured to drive the second driving assembly and the second chip carrier to move along a third direction, and the fourth driving assembly is configured to drive the third driving assembly, the second driving assembly and the second chip carrier to move along a second direction;
the second direction is perpendicular to the first direction, the third direction is perpendicular to the first direction, and the third direction is perpendicular to the second direction.
Optionally, the image acquisition module comprises an image acquisition unit, a second lead screw and a second lead screw nut, and an axis of the second lead screw is parallel to the first direction; the second lead screw nut is in threaded connection with the second lead screw, and the second lead screw nut is connected with the image acquisition unit.
In the LED chip transfer device with the chip removal function provided by the embodiment of the application, the image acquisition module acquires the image of the first chip carrier and identifies a bad LED chip in the image; then the moving module moves the bad LED chips on the first chip carrier to be aligned with the bad chip removing module, and the bad chip removing module removes the bad LED chips on the first chip carrier. Therefore, the influence of the poor LED chip moving to the next process on the production of the subsequent LED product is prevented.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the application, and that other drawings can be derived from these drawings by a person skilled in the art without inventive effort.
For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts in the following description.
Fig. 1 is a schematic structural diagram of an LED chip transfer device with a chip removal function according to an embodiment of the present application.
Fig. 2 is an exploded view of the LED chip transfer device with a chip removal function in fig. 1.
Fig. 3 is a schematic structural diagram of a carrier module in an LED chip transfer device with a chip removal function according to an embodiment of the present disclosure.
Fig. 4 is an exploded schematic view of a carrier module in an LED chip transfer device with a chip removal function according to an embodiment of the present disclosure.
Fig. 5 is a partial enlarged view of a portion a in fig. 4.
Fig. 6 is a schematic structural diagram of an image capturing module in an LED chip transfer device with a chip removal function according to an embodiment of the present application.
Fig. 7 is an exploded schematic view of an image capturing module in an LED chip transfer device with a chip removal function according to an embodiment of the present disclosure.
Fig. 8 is a schematic structural diagram of a thimble module in an LED chip transfer device with a chip removal function according to an embodiment of the present application.
Fig. 9 is an exploded view of a thimble module in an LED chip transfer device with a chip removal function according to an embodiment of the present disclosure.
Fig. 10 is a schematic structural diagram of a moving module in an LED chip transfer device with a chip removal function according to an embodiment of the present application.
Fig. 11 is an exploded schematic view of a moving module in an LED chip transfer device with a chip removal function according to an embodiment of the present disclosure.
Fig. 12 is a partial enlarged view at B in fig. 11.
Fig. 13 is a schematic structural diagram of a rack in an LED chip transfer device with a chip removal function according to an embodiment of the present application.
Fig. 14 is an exploded view of a rack in an LED chip transfer device with a chip removal function according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the existing technology for transferring LED chips massively, chips are sucked by a suction nozzle from the impact of a raw material carrier film to a high point and are sent to a prearranged carrier plate. At present, poor problems such as erection, deflection or offset can still occur after LED chips on a raw material carrier are transferred onto a substrate, and the poor LED chips cannot be removed by the conventional chip transfer equipment after the LED chips are transferred, so that the poor LED chips are transferred to enter the next procedure, and the production of subsequent LED products is influenced.
In order to solve the above problem, an embodiment of the present application provides an LED chip transfer device with a chip removal function, as shown in fig. 1 and fig. 2, fig. 1 and fig. 2 are schematic structural diagrams of the LED chip transfer device with a chip removal function provided in the embodiment of the present application, and the LED chip transfer device with a chip removal function includes an image acquisition module 200, a defective chip removal module 600, and a moving module 400. The image capturing module 200 is used to capture an image of the first chip carrier 800 and identify a defective LED chip in the image, where the LED chip transferred to the first chip carrier 800 is on the first chip carrier 800. The defective chip removal module 600 is used for removing a defective LED chip on the first chip carrier 800; the moving module 400 is used for moving the defective LED chip on the first chip carrier 800 to align with the defective chip removing module 600.
In the LED chip transfer device with a chip removal function provided in the embodiment of the present application, the image acquisition module 200 acquires an image of the first chip carrier 800, and identifies a defective LED chip in the image; then, the moving module 400 moves the defective LED chip on the first chip carrier 800 to align with the defective chip removing module 600, and the defective chip removing module 600 removes the defective LED chip on the first chip carrier 800. Therefore, the influence of the poor LED chip moving to the next process on the production of the subsequent LED product is prevented.
As shown in fig. 3 to 5, the defective chip removing module 600 includes a suction component 610 and a first driving component 620, wherein the suction component 610 is used for sucking the defective LED chip, and the first driving component 620 is used for driving the suction component 610 to move. The operating principle of the bad chip removal module 600 is as follows:
first, the first driving component 620 drives the suction component 610 to move towards the defective LED chip on the first chip carrier 800, so that the wall of the nozzle hole of the nozzle 611 in the suction component 610 touches the edge of the defective LED chip (the size of the nozzle hole on the nozzle is larger than the size of the defective LED chip);
then, the loading module 100 described later drives the bad LED chip on the first chip carrier 800 to rotate relative to the adsorption component 610, and the edge of the bad LED chip abuts against the hole wall of the suction nozzle hole of the suction nozzle 611, so that the bad LED chip moves relative to the first chip carrier 800, and the bad LED chip slightly loosens from the first chip carrier 800, but does not fall from the first chip carrier 800 (the principle that the loading module 100 drives the first chip carrier 800 to move or rotate is referred to the following description);
finally, negative pressure is generated in the nozzle holes of the nozzles 611 in the suction module 610, and the defective LED chips are sucked from the first chip carrier 800 into the nozzles 611, thereby removing the defective LED chips from the first chip carrier 800 (a filter device for filtering the defective LED chips is provided in the nozzle duct of the nozzles 611).
As shown in fig. 5, the suction assembly 610 is illustratively a negative pressure suction assembly 610. As exemplarily shown in fig. 5, the negative pressure suction assembly 610 includes a nozzle holder 613, a suction nozzle 611, and a nozzle sleeve 612, wherein the suction nozzle 611 is disposed on the nozzle holder 613, and the nozzle sleeve 612 fixes the suction nozzle 611 on the nozzle holder 613; the suction nozzle 611 is connected with a negative pressure source. The first driving assembly 620 drives the suction assembly 610 to move towards the defective LED chip, and when the defective LED chip is slightly released from the first chip carrier 800, a negative pressure is generated in the suction nozzle hole of the suction nozzle 611, so that the defective LED chip is sucked into the suction nozzle 611 from the first chip carrier 800, and the defective LED chip is removed.
As shown in fig. 5, first driving assembly 620, suction assembly 610, and first chip carrier 800 are sequentially disposed along a first direction, and first driving assembly 620 drives suction assembly 610 to move along the first direction; wherein the first direction is shown in the direction of arrow Z in fig. 4.
Illustratively, as shown in fig. 5, the first driving assembly 620 includes a first cylinder having a piston end moving in a first direction, and the piston end of the first cylinder is connected to the adsorption assembly 610. Illustratively, the piston end of the first cylinder is connected to the suction nozzle.
As shown in fig. 1 and fig. 2, the LED chip transferring apparatus with a chip removing function further includes a carrying module 100 and a thimble module 300, where the carrying module is used to carry a second chip 700 carrier, and the second chip carrier is provided with an LED chip to be transferred. Ejector pin module 300 is used to impact the good LED chips on second chip carrier 700 onto first chip carrier 800. The moving module 400 is used for transferring the first chip carrier 800 in a first direction, a second direction and a third direction, wherein the second direction is perpendicular to the first direction. The second direction is shown in the direction of arrow X in fig. 2, and the third direction is shown in the direction of arrow Y in fig. 2. As shown in fig. 3 to 5, the defective chip removing module 600 is disposed on the carrier module 100, and the first cylinder in the exemplary defective chip removing module 600 is disposed on the carrier module 100 (as shown in fig. 5, the first cylinder is fixedly disposed on the first carrier plate 102 in the carrier module 100).
After the arrangement, ejector pin module 300 impacts the good LED chip on second chip carrier 700 onto first chip carrier 800, thereby transferring the good LED chip on second chip carrier 700 onto first chip carrier 800; and the moving module 400 transfers the first chip carrier 800, thereby transferring the good LED chips on the first chip carrier 800 to the next process for production. As shown in fig. 8 and 9, the thimble module 300 includes a voice coil motor 301, a thimble holder 302, and a thimble 303, and the thimble holder 302 holds the thimble 303. Voice coil motor 301 is configured to drive thimble clamping member 302 and thimble 303 to reciprocate along a first direction, so as to enable thimble 303 to strike a good LED chip on second chip carrier 700 onto first chip carrier 800. Wherein the first chip carrier may be a glass substrate and the second chip carrier may be a blue film.
For example, the image capturing module 200 in this embodiment may also capture an image of the second chip carrier 700, and identify a good LED chip in the image of the second chip carrier 700; the good LED chip of the second chip carrier is a chip on which the problems of standing, skewing, shifting, and chipping do not exist. When the image capturing module 200 captures the image of the second chip carrier 700, the moving module 400 may move the first chip carrier 800 to be misaligned with the image capturing module 200, so that the image capturing module 200 can capture the image of the second chip carrier 700. When the subsequent image capturing module 200 needs to capture the image of the first chip carrier 800, the moving module 400 moves the first chip carrier 800 to a position right under the image capturing module 200, so that the image capturing module 200 can capture the image of the first chip carrier 800.
After the carrying module 100 and the thimble module 300 are added, the working principle of the LED transferring device in this embodiment is as follows:
first, the image capture module 200 may also capture an image of the second chip carrier 700 and identify good LED chips in the image of the second chip carrier 700; the good LED chip of the second chip carrier is a chip without the problems of erection, deflection, deviation and fragmentation on the second chip carrier;
then, the carrier module 100 drives different good LED chips on the second chip carrier 700 to align with the thimble module 300 (please refer to the second driving component 110, the third driving component 120, and the fourth driving component 130, which will be described later, can drive the second chip carrier 700 to move relative to the thimble module 300, so as to drive different good LED chips on the second chip carrier 700 to align with the thimble module 300);
then, ejector pin module 300 impacts the good LED chip on second chip carrier 700 onto first chip carrier 800;
then, the image acquisition module 200 acquires an image of the first chip carrier 800, and identifies a defective LED chip in the image, where the defective LED chip of the first chip carrier is a chip that has a problem of standing, skewing, or shifting after being transferred to the first chip carrier;
then the moving module 400 moves the bad LED chip on the first chip carrier 800 to align with the bad chip removing module 600;
finally, the defective chip removing module 600 removes the defective LED chip on the first chip carrier 800.
As shown in fig. 3 and 4, the carrier module 100 includes a second driving assembly 110, a third driving assembly 120, a fourth driving assembly 130, a second carrier plate 104, and a third carrier plate 105, wherein the second driving assembly 110 is used for driving the second chip carrier 700 to rotate along a first direction (a direction of an arrow Z in fig. 4), the third driving assembly 120 is used for driving the second driving assembly 110 and the second chip carrier 700 to move along a third direction on the second carrier plate 104, and the fourth driving assembly 130 is used for driving the third driving assembly 120, the second driving assembly 110, and the second chip carrier 700 to move along the second direction on the third carrier plate 105.
As shown in fig. 4, the carrier module 100 further includes a first carrier plate 102 and a first carrier 101, wherein the first carrier 101 is rotatably disposed on a bearing 103 of the first carrier plate 102, and the first carrier 101 can rotate on the first carrier plate 102. The first chip carrier 800 is carried on the first carrier 101, and the first driving assembly 620, the adsorbing assembly 610 and the first carrier 101 are sequentially arranged along the first direction, so that the first driving assembly 620, the adsorbing assembly 610 and the first chip carrier 800 are sequentially arranged along the first direction.
As shown in fig. 4, the second driving mechanism 110 includes a third motor, a third lead screw nut, a third guide rail 111 and a transmission member 112, the third guide rail 111 is fixedly disposed on the first loading plate 102, a guiding direction of the third guide rail 111 is parallel to the second direction, and the third lead screw nut is slidably connected to the third guide rail 111, so that the third lead screw nut can slide on the third guide rail 111 along the second direction. An output shaft of the third motor is coaxially connected with a third lead screw, and the axis of the third lead screw is parallel to the second direction; and the third screw nut is in threaded connection with the third screw. Rotation of the output shaft by the third motor may be moved in a second direction by the third lead screw nut. The third screw nut is rotatably connected to the first carrier 101 through the transmission member 112, wherein one end of the transmission member 112 is rotatably connected to the third screw nut, and the other end of the transmission member 112 is also rotatably connected to the first carrier 101, so that the first carrier 101 and the second chip carrier 700 can be driven to rotate through the transmission member by the third screw nut moving along the second direction.
As exemplarily shown in fig. 4, the third driving assembly 120 includes a second linear motor 121 and a first connection plate 122, the second linear motor 121 is disposed on the second bearing plate 104, and a mover 123 of the second linear motor moves in a third direction; the mover 123 of the second linear motor is fixedly connected to the first carrier plate 102 through the first connection plate 122, and the first carrier 101 and the second chip carrier 700 can be driven to move along the third direction by the movement of the mover 123 of the second linear motor through the first carrier plate 102.
As exemplarily shown in fig. 4, the fourth driving assembly 130 includes a third linear motor 131 and a second connecting plate 132, the third linear motor 131 is disposed on the third bearing plate 105, and a mover 133 of the third linear motor moves in the second direction; the mover 133 of the third linear motor is fixedly connected to the second carrier plate 104 through the second connecting plate 132, and the first carrier plate 102, the first carrier 101 and the second chip carrier 700 can be driven to move along the second direction by the second carrier plate 104 through the movement of the mover 133 of the third linear motor.
The ejector pin module 300 is disposed on the third carrier plate 105, and the ejector pin module 300 is disposed under the second chip carrier 700. The second chip carrier 700 can be driven to move relative to the ejector pin module 300 or the defective chip removing module 600 by the second driving assembly 110, the third driving assembly 120 and the fourth driving assembly 130 (i.e. the carrying module 100 drives the first chip carrier 800 to move or rotate), so as to drive different good LED chips on the second chip carrier 700 to align with the ejector pin module 300, and then the ejector pin module 300 impacts the corresponding good LED chips on the second chip carrier 700 onto the first chip carrier 800.
As shown in fig. 10 and 11, the moving module 400 includes a fifth driving assembly 410, a sixth driving assembly 420, a seventh driving assembly 430, a fourth loading plate 403, a fifth loading plate 404, a sixth loading plate 405, and a second carrier 401, wherein the second carrier 401 is used for carrying the first chip carrier 800. The fifth driving assembly 410 is configured to drive the second carrier 401 and the first chip carrier 800 to move on the fourth carrier plate 403 along the third direction. The sixth driving assembly 420 is used for driving the fifth driving assembly 410 and the first chip carrier 800 to move along the second direction on the fifth carrying plate 404. The seventh driving assembly 430 is used for driving the sixth driving assembly 420, the fifth driving assembly 410 and the first chip carrier 800 to move on the third loading plate 105 along the first direction.
As exemplarily shown in fig. 11, the fifth driving assembly 410 includes a fourth linear motor 411 and a third connecting plate 412, the fourth linear motor 411 is disposed on the fourth carrier plate 403, and a mover 413 of the fourth linear motor moves in a third direction; the mover 413 of the fourth linear motor is fixedly connected to the second carrier 401 through the third connecting plate 412, and the first chip carrier 800 can be driven to move along the third direction by the movement of the mover 413 of the fourth linear motor through the third connecting plate 412 and the second carrier 401.
As exemplarily shown in fig. 11, the sixth driving assembly 420 includes a fifth linear motor 421 and a fourth connecting plate 422, the fifth linear motor 421 is disposed on the fifth bearing plate 404, and a mover 423 of the fifth linear motor moves in the second direction; the rotor 423 of the fifth linear motor is fixedly connected to the fourth bearing plate 403 through the fourth connecting plate 422, and the first chip carrier 800 is driven to move along the second direction by the movement of the rotor 423 of the fifth linear motor sequentially through the fourth connecting plate 422, the fourth bearing plate 403, the third connecting plate 412, and the second bearing member 401.
As shown in fig. 11 and 12, the sixth driving assembly 430 includes a first motor 431, a first lead screw 432, a first lead screw nut 433, a first wedge 434, a second wedge 435, a first guide rail 436, a first limiting block 437, and a fifth connecting plate 438. The first guide rail 436 is fixedly connected to the sixth carrier plate 405, a guiding direction of the first guide rail 436 is parallel to the second direction, and the first wedge 434 is slidably connected to the first guide rail, so that the first wedge 434 can slide on the first guide rail 436 along the second direction. An output shaft of the first motor 431 is connected to a first lead screw 432, and an axis of the first lead screw 432 is parallel to the second direction; first lead screw nut 433 is screwed on first lead screw 432, and first lead screw nut 433 is connected with first voussoir 434. The first wedge 434 may be moved in the second direction by the first lead screw nut 433 by the rotation of the output shaft of the first motor 431.
The first limiting block 437 is fixedly connected to the first guide rail 436, and a first guide groove is formed on the first limiting block, a guide direction of the first guide groove is parallel to the first direction, and the second wedge 435 is slidably connected in the first guide groove. The second wedge 435 is connected to the fifth carrier plate 404 by a fifth connecting plate 438; the lower surface of the second wedge 435 is a sloped surface, the upper surface of the first wedge 434 is a sloped surface, and the sloped surface of the lower surface of the second wedge 435 contacts the sloped surface of the upper surface of the first wedge 434. The first wedge 434 is driven by the rotation of the output shaft of the first motor 431 through the first lead screw nut 433 to move along the second direction, and the second wedge 435 and the fifth loading plate 404 are driven by the first wedge 434 to move along the first direction after moving along the second direction, so as to drive the first chip carrier 800 on the fifth loading plate 404 to move along the first direction.
After such a configuration, the fifth driving assembly 410, the sixth driving assembly 420, and the seventh driving assembly 430 may drive the first chip carrier 800 to move relative to the defective chip removing module 600, so as to drive different defective LED chips on the first chip carrier 800 to align with the defective chip removing module 600, and then the defective chip removing module 600 removes the corresponding defective LED chips on the first chip carrier 800.
As exemplarily shown in fig. 6 and 7, the image capturing module 200 includes an image capturing unit 201, a second lead screw 202, and a second lead screw nut 203, wherein an axis of the second lead screw 202 is parallel to the first direction; the second lead screw nut 203 is screwed on the second lead screw 202, and the second lead screw nut 203 is connected with the image acquisition unit 201. If the second screw 202 rotates after the arrangement, the second screw nut 203 can drive the image acquisition unit 201 carrier to move along the first direction, so that the image acquisition unit 201 can be lifted. For example, the image capturing unit 201 is a camera in this embodiment, and it should be understood that the image capturing module 200 in this embodiment may further include an image recognizing unit, where after the image capturing unit 201 captures the image of the first chip carrier 800, the image recognizing unit recognizes a defective LED chip in the image; collecting the image of the first chip carrier 800 and identifying the bad LED chip in the image is prior art in the present technical field, and therefore is not described in detail. As shown in fig. 7, the image capturing module 200 further includes a second motor 206, an output shaft of the second motor 206 is coaxially and fixedly connected to the second lead screw 202, and the second lead screw 202 is driven to rotate by the rotation of the output shaft of the second motor 206, so as to drive the image capturing unit 201 to move along the first direction.
As shown in fig. 7, the image capturing module 200 further includes a second guiding rail 204 and a second slider 205, a guiding direction of the second guiding rail 204 is parallel to the first direction, the second slider 205 is slidably connected to the second guiding rail 204, and the second slider 205 is connected to the image capturing unit 201. So configured, the second slider 205 is guided by the second guide rail 204, so that the image capturing unit 201 can move along the first direction. Wherein the second lead screw nut 203 is connected with the second slider 205 such that the image capturing unit 201 is connected with the second lead screw nut 203.
As shown in fig. 13 and 14, the LED chip transferring apparatus with a chip removing function further includes a frame 500, and the carrier module 100, the image capturing module 200, and the moving module 400 are disposed on the frame 500. As shown in fig. 14, the rack 500 includes a platform 510, a support arm 520, and a support frame 530, wherein the support frame 530, the platform 510, and the support arm 520 are connected in sequence from bottom to top. The carrying module 100 and the moving module 400 are disposed on the platform 510, and the image capturing module 200 is disposed on the supporting frame 530. As shown in fig. 14, two ion fans 540 are further disposed on the supporting frame 530, and the two ion fans 540 are respectively disposed on two opposite sides of the carrying module 100; the ion blower 540 has a static electricity removing performance, thereby preventing the LED chip from being contaminated by static electricity during the transfer of the LED chip.
In summary, in the LED chip transfer apparatus with a chip removal function provided in the present application, the image acquisition module 200 acquires an image of the first chip carrier 800, and identifies a defective LED chip in the image; then, the moving module 400 moves the defective LED chip on the first chip carrier 800 to align with the defective chip removing module 600, and the defective chip removing module 600 removes the defective LED chip on the first chip carrier 800. Therefore, the influence of the poor LED chip moving to the next process on the production of the subsequent LED product is prevented.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. The LED chip transfer device with a chip removal function provided in the embodiments of the present application is described in detail above, and specific examples are applied herein to explain the principles and embodiments of the present application, and the description of the embodiments above is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. An LED chip transfer device with a chip removal function, characterized in that the LED chip transfer device with a chip removal function comprises:
the image acquisition module is used for acquiring an image of a first chip carrier and identifying a bad LED chip in the image, wherein the first chip carrier is provided with the LED chip transferred to the first chip carrier;
the defective chip removing module is used for removing the defective LED chip on the first chip carrier;
and the moving module is used for moving the bad LED chip on the first chip carrier to be aligned with the bad chip removing module.
2. The LED chip transfer device with the chip removing function according to claim 1, wherein the bad chip removing module comprises an adsorption component and a first driving component, the adsorption component is used for adsorbing the bad LED chip, and the first driving component is used for driving the adsorption component to move.
3. The LED chip transfer device with the chip removing function according to claim 2, wherein the suction component is a negative pressure suction component.
4. The LED chip transfer device with the chip removing function according to claim 3, wherein the negative pressure suction assembly comprises a suction nozzle seat, a suction nozzle and a suction nozzle sleeve, the suction nozzle is arranged on the suction nozzle seat, and the suction nozzle sleeve fixes the suction nozzle on the suction nozzle seat; the suction nozzle is connected with a negative pressure source.
5. The LED chip transfer device with chip removal function according to any one of claims 2 to 4, wherein the first driving assembly, the suction assembly and the first chip carrier are sequentially arranged along a first direction, and the first driving assembly drives the suction assembly to move in the first direction.
6. The LED chip transfer device with the chip removing function according to claim 5, wherein the first driving assembly comprises a first cylinder, a piston end of the first cylinder moves along the first direction, and the piston end of the first cylinder is connected with the adsorption assembly.
7. The LED chip transfer device with chip removal function according to claim 6, further comprising:
the bearing module is used for bearing a second chip carrier, and the second chip carrier is provided with an LED chip to be transferred;
and the ejector pin module is used for impacting the LED chip on the second chip carrier onto the first chip carrier.
8. The LED chip transfer device with chip removal function of claim 7, wherein said carrier module comprises a second driving assembly, said second driving assembly driving said second chip carrier to rotate along a first direction.
9. The LED chip transferring device with chip removing function according to claim 8, wherein the carrying module further comprises a third driving assembly and a fourth driving assembly, the third driving assembly is used for driving the second driving assembly and the second chip carrier to move along a third direction, and the fourth driving assembly is used for driving the third driving assembly, the second driving assembly and the second chip carrier to move along a second direction;
the second direction is perpendicular to the first direction, the third direction is perpendicular to the first direction, and the third direction is perpendicular to the second direction.
10. The LED chip transfer device with the chip removing function according to claim 9, wherein the image capturing module comprises an image capturing unit, a second lead screw and a second lead screw nut, and an axis of the second lead screw is parallel to the first direction; the second lead screw nut is in threaded connection with the second lead screw, and the second lead screw nut is connected with the image acquisition unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221348886.5U CN217768302U (en) | 2022-05-31 | 2022-05-31 | LED chip transfer device with chip removing function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221348886.5U CN217768302U (en) | 2022-05-31 | 2022-05-31 | LED chip transfer device with chip removing function |
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| Publication Number | Publication Date |
|---|---|
| CN217768302U true CN217768302U (en) | 2022-11-08 |
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| CN202221348886.5U Active CN217768302U (en) | 2022-05-31 | 2022-05-31 | LED chip transfer device with chip removing function |
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| CN (1) | CN217768302U (en) |
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2022
- 2022-05-31 CN CN202221348886.5U patent/CN217768302U/en active Active
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