CN219417230U - Conductive adhesive bonding detection equipment - Google Patents

Abstract

The application provides a conductive adhesive bonding detection device, which comprises a machine base, wherein the machine base is provided with a detection station; the slide mechanism is arranged on the machine base and used for supplying chips to be detected; the slide moving mechanism is movably arranged on the machine base and is used for moving the chips on the slide carrying mechanism to the detection station one by one; and the visual detection mechanism is arranged in the detection station and is used for detecting the quality of the chip. During the detection operation, the chips to be detected are intensively placed on the slide mechanism, and then the slide mechanism is started, so that the chips can be automatically transferred from the slide mechanism into the detection stations one by one, and the visual detection mechanism can further automatically detect the attaching quality of the conductive adhesive on the chips entering the detection stations. The whole process does not need human intervention, has high automation degree, can greatly lighten the labor intensity of workers, and improves the detection efficiency and quality of chips, thereby being well suitable for the large-scale production requirement of the chips.

Description

Conductive adhesive bonding detection equipment

Technical Field

The utility model relates to a conductive adhesive bonding detection device, and belongs to the technical field of chip processing detection.

Background

The chip, also called microcircuit, microchip and integrated circuit (IC: integrated circuit, english) refers to a silicon chip with integrated circuit, which has small volume, usually part of computer or other electronic equipment, and plays a role in controlling the cooperative work of other functional equipment, so that the processing quality will be directly working performance, and the operation reliability of the electronic equipment is further affected.

In the chip manufacturing process, a process of adhering conductive adhesive on a chip is involved, and in order to detect the adhesion quality of the conductive adhesive, a detection operation is required. The current detection means relies on the workman to hold the instrument and observe the conductive adhesive on the chip one by one, has intensity of labour big, the low problem of detection efficiency, very big restriction chip's mass production.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model aims to provide conductive adhesive laminating detection equipment, which aims to solve the problems of high labor intensity, low detection efficiency and limitation of mass production of chips in the prior art.

According to an embodiment of the present utility model, there is provided a first aspect of: a conductive adhesive bonding detection apparatus, comprising:

the machine base is provided with a detection station;

the slide mechanism is arranged on the base and used for supplying chips to be detected;

the film moving mechanism is movably arranged on the machine base and is used for moving the chips on the film carrying mechanism to the detection station one by one; and

the visual detection mechanism is arranged in the detection station and used for detecting the quality of the chip.

Further, as a more preferred embodiment of the present utility model, the apparatus further comprises: the slide mechanism comprises a moving base and a slide holder, wherein the moving base is arranged on the base, the slide holder is connected with the moving base, and the slide holder can horizontally move relative to the base under the driving of the moving base.

Further, as a more preferred embodiment of the present utility model, the apparatus further comprises: the movable base comprises an X-direction movable unit, a Y-direction movable unit and a supporting arm, wherein the Y-direction movable unit is arranged on the X-direction movable unit, one end of the supporting arm is connected with the Y-direction movable unit, and the other end of the supporting arm is connected with the slide holder.

Further, as a more preferred embodiment of the present utility model, the apparatus further comprises: the conductive adhesive bonding detection equipment further comprises a top sheet mechanism, wherein the top sheet mechanism is arranged on the machine base and is positioned below the slide holder.

Further, as a more preferred embodiment of the present utility model, the apparatus further comprises: the slide holder comprises a frame and an elastic carrier plate, wherein the elastic carrier plate is arranged in a hollow cavity of the frame and is used for loading a plurality of chips arranged in an array;

the top sheet mechanism comprises a top sheet seat, a top sheet motor, a top sheet cam and a top rod, wherein the top sheet motor is arranged on the top sheet seat, the top sheet cam is connected with a driving shaft of the top sheet motor, the top rod is vertically and slidably arranged on the top sheet seat, one end of the top rod is contacted with a rim of the top sheet cam, and the other end of the top rod faces the elastic carrier plate.

Further, as a more preferred embodiment of the present utility model, the apparatus further comprises: the top sheet mechanism further comprises a reset spring, and the reset spring is abutted between the ejector rod and the top sheet seat.

Further, as a more preferred embodiment of the present utility model, the apparatus further comprises: the film moving mechanism comprises a power module and a film moving manipulator, wherein the power module is arranged on the machine base, and the film moving manipulator is connected with the power module and can reciprocate between the slide mechanism and the detection station.

Further, as a more preferred embodiment of the present utility model, the apparatus further comprises: the power module comprises a power cylinder, a first transmission block, a transmission arm, a second transmission block and a transmission shaft, wherein the power cylinder is vertically arranged on the base, the first transmission block is connected with a piston rod of the power cylinder, the two opposite ends of the transmission arm are respectively and movably connected with the first transmission block and the second transmission block, the transmission shaft is vertically and rotatably arranged on the base, one end of the transmission shaft is movably connected with the second transmission block, and the other end of the transmission shaft is connected with the moving manipulator.

Further, as a more preferred embodiment of the present utility model, the apparatus further comprises: the film moving manipulator comprises a rotary driver, a first clamping arm and a second clamping arm, wherein the rotary driver comprises a first driving shaft and a second driving shaft which are oppositely arranged, the first clamping arm is connected with the first driving shaft, the second clamping arm is connected with the second driving shaft, and the first clamping arm and the second clamping arm can be mutually rotated to be closed or opened; or alternatively

The film moving manipulator comprises a rotary driver, a rotary arm and a sucker, wherein one end of the rotary arm is connected with the rotary driver, and the other end of the rotary arm is connected with the sucker.

Further, as a more preferred embodiment of the present utility model, the apparatus further comprises: the visual detection mechanism comprises a position adjustment mechanism and a visual camera, the position adjustment mechanism is arranged on the base, the visual camera is connected with the position adjustment mechanism, and the visual camera is arranged towards the detection station.

Compared with the prior art, in the application provided technical scheme's conductive adhesive laminating check out test set was applied to the work occasion that detects the conductive adhesive laminating quality on the chip, during the detection operation, the chip that waits to detect was concentrated and is placed on slide glass mechanism, immediately moves the start of piece mechanism, can be automatic from slide glass mechanism with the chip transfer one by one to detect in the station, visual detection mechanism and then automatic detect the laminating quality of the conductive adhesive on the chip that gets into the detection station. Compared with the manual detection mode in the prior art, the full-process detection method does not need manual intervention, has high automation degree, can greatly lighten the labor intensity of workers, improves the detection efficiency and quality of chips, and is suitable for the large-scale production requirement of the chips.

Drawings

Fig. 1 is a schematic structural diagram of a conductive adhesive bonding detection device according to an embodiment of the present application;

FIG. 2 is a partially enlarged structural view of the portion A in FIG. 1;

fig. 3 is a schematic side view of fig. 1.

Reference numerals:

the slide machine comprises a machine base 1, a slide mechanism 2, an X-direction moving unit 21, a Y-direction moving unit 22, a supporting arm 23, a slide holder 24, a slide moving mechanism 3, a power module 31, a power cylinder 311, a first transmission block 312, a transmission arm 313, a second transmission block 314, a transmission shaft 315, a slide moving manipulator 32, a vision detecting mechanism 4, a position adjusting mechanism 41, a vision camera 42, a slide mechanism 5, a slide base 51, a slide motor 52, a slide cam 53, a slide rod 54 and a return spring 55.

Detailed Description

In order to better understand the technical solutions in the present application, the following description will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

It is noted that when an element is referred to as being "fixed" or "disposed on" another element, it can be directly on the other element or be indirectly disposed on the other element; when an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "are used to refer to the terms" length "," width "," upper "," lower "," front "," rear "," left "," right "," vertical "," and "lower".

The orientation or positional relationship indicated by horizontal "," top "," bottom "," inner "," outer ", etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description and to simplify the description, and are not indicative or implying that the apparatus or components in question must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" or "a number" is two or more, unless explicitly defined otherwise.

It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the scope of the present disclosure, since any structural modifications, proportional changes, or dimensional adjustments made by those skilled in the art should not be made in the present disclosure without affecting the efficacy or achievement of the present disclosure.

As shown in fig. 1 to 3, according to an embodiment of the present utility model, there is provided a first scheme of: a conductive adhesive bonding detection device comprises a machine base 1, a slide loading mechanism 2, a slide moving mechanism 3 and a visual detection mechanism 4.

The machine base 1 is a main body structure of the whole conductive adhesive bonding detection device and plays a role in loading and supporting the slide mechanism 2, the slide moving mechanism 3 and the visual detection mechanism 4. For example, the machine base 1 includes a base plate on which the slide mechanism 2 is directly mounted and an upright on which the slide moving mechanism 3 and the visual inspection mechanism 4 are respectively mounted. The machine base 1 is provided with a detection station.

The slide mechanism 2 is arranged on the base 1 and is used for supplying chips to be detected; the slide moving mechanism 3 is movably arranged on the machine base 1, and the slide moving mechanism 3 is used for moving the chips on the slide carrying mechanism 2 to the detection station one by one; the visual detection mechanism 4 is arranged in the detection station and is used for detecting the quality of the chip.

Compared with the prior art, in the application provided technical scheme's conductive adhesive laminating check out test set was applied to the work occasion that detects the conductive adhesive laminating quality on the chip, during the detection operation, the chip of waiting to detect was concentrated and is placed on slide glass mechanism 2, immediately moves the start of piece mechanism 3, can be automatic from slide glass mechanism 2 with the chip transfer one by one to detect in the station, visual detection mechanism 4 and then automatic detect the laminating quality of the conductive adhesive on the chip that gets into the detection station. Compared with the manual detection mode in the prior art, the full-process detection method does not need manual intervention, has high automation degree, can greatly lighten the labor intensity of workers, improves the detection efficiency and quality of chips, and is suitable for the large-scale production requirement of the chips.

Further, as a more preferable embodiment of the present utility model, the slide mechanism 2 includes a moving base and a slide table 24, the moving base is disposed on the base 1, the slide table 24 is connected to the moving base, and the slide table 24 can move horizontally relative to the base 1 under the driving of the moving base. The slide holder 24 can bear a plurality of chips at the last time, the slide holder 24 is driven to move in the horizontal plane through the moving base, and the chips at different positions on the slide holder 24 can be adjusted to the proper grabbing positions of the slide moving mechanism 3, so that the slide moving mechanism 3 can be ensured to continuously and effectively take the chips.

Specifically, the mobile base includes an X-direction mobile unit 21, a Y-direction mobile unit 22, and a support arm 23, wherein the Y-direction mobile unit 22 is disposed on the X-direction mobile unit 21, one end of the support arm 23 is connected to the Y-direction mobile unit 22, and the other end of the support arm 23 is connected to the stage 24.

When the slide holder is in operation, the X-direction moving unit 21 and the Y-direction moving unit 22 can independently or simultaneously output linear reciprocating power in the X direction and the Y direction, so that the slide holder 24 can be driven to flexibly move in the horizontal plane, and chips in different positions can be conveniently and accurately and effectively grasped by the slide moving mechanism 3. The support arm 23 enables the slide holder 24 to be installed in a cantilever shape, so that a safe distance can be formed between the slide holder 24 and the X-direction moving unit 21 and the Y-direction moving unit 22, and interference problems in working are avoided.

Alternatively, the X-direction moving unit 21 and the Y-direction moving unit 22 may be any one of a motor screw module, a manual screw nut pair, and the like.

Typically, the individual chips are small in thickness and surface area and, after being placed on the stage 24, are tightly bonded to the surface of the stage 24, thereby creating a difficult grasping problem. In view of this, further, as a more preferable embodiment of the present utility model, the apparatus for detecting adhesion of conductive adhesive further includes a top sheet mechanism 5, and the top sheet mechanism 5 is mounted on the base 1 and located below the stage 24. The top sheet mechanism 5 can jack up the target chip at a certain height position on the surface of the slide holder 24, so that the jacked chip is suspended all around and forms a large enough grabbing space, thereby facilitating the chip to be effectively grabbed by the sheet moving mechanism 3 and reducing the sheet taking difficulty.

Further, the slide holder 24 includes a frame and an elastic carrier plate, where the elastic carrier plate is disposed in the hollow cavity of the frame, and the elastic carrier plate is used to load a plurality of chips arranged in an array. The frame acts as a skeleton to provide the rigidity and rigidity required by stage 24 to load and secure the flexible carrier. The elastic carrier plate is used for flexibly loading a plurality of chips arranged in an array, and has excellent elastic deformation capacity, when the chips are subjected to upward jacking force of the top sheet mechanism 5, the stress area can be deformed upwards to bulge, so that the objective chips are jacked up, the purpose of conveniently taking the chips is achieved, and meanwhile, the elastic carrier plate cannot be damaged.

For example, the elastic carrier plate is a rubber plate.

With continued reference to fig. 2 and 3, the top sheet mechanism 5 includes a top sheet seat 51, a top sheet motor 52, a top sheet cam 53 and a top rod 54, the top sheet motor 52 is disposed on the top sheet seat 51, the top sheet cam 53 is connected with a driving shaft of the top sheet motor 52, the top rod 54 is vertically slidably disposed on the top sheet seat 51, and one end of the top rod 54 contacts with a rim of the top sheet cam 53, while the other end faces the elastic carrier plate.

In operation, when the concave edge of the top sheet cam 53 contacts with the top rod 54, the top rod 54 is not pushed upwards, and at this time, the top rod 54 is not contacted with the elastic carrier plate. When a piece is required to be taken, the moving base firstly drives the slide holder 24 to horizontally move to a proper position so as to enable the target chip to be aligned with the ejector rod 54 up and down, then the top piece motor 52 is started, the top piece cam 53 is driven to rotate, when the flange of the top piece cam 53 is contacted with the ejector rod 54, the ejector rod 54 is lifted upwards, and the ejector rod 54 further pushes the elastic carrier plate upwards, so that the purpose of lifting the target chip can be achieved. When the chip moving mechanism 3 takes away the jacked chip, the top sheet motor 52 further drives the top sheet cam 53 to rotate for a certain angle, and the concave edge is contacted with the ejector rod 54 again, so that the effect of resetting the ejector rod 54 can be achieved. The whole top sheet mechanism 5 is simple in structure and working principle, can intermittently and continuously jack up chips at different positions, and is efficient and reliable in work.

Further, as a more preferable embodiment of the present utility model, the top sheet mechanism 5 further includes a return spring 55, and the return spring 55 is abutted between the ejector 54 and the top sheet holder 51. When the jack 54 is jacked up, the return spring 55 is in a compressed state; once the concave edge of the top sheet cam 53 is contacted with the push rod 54, the push rod 54 is not pushed by the cam any more, and the push rod can be quickly and reliably lowered and reset under the action of the releasing elastic force of the reset spring 55 so as to be convenient for secondary operation.

In addition, as a more preferable embodiment of the present utility model, the slide moving mechanism 3 includes a power module 31 and a slide moving manipulator 32, the power module 31 is disposed on the base 1, and the slide moving manipulator 32 is connected to the power module 31 and can reciprocate between the slide mechanism 2 and the detection station. The power module 31 provides the power required by the slide robot 32 to reciprocate between the stage 24 and the inspection station, so that the slide robot 32 can continuously transfer chips from the stage 24 to the inspection station one by one.

With continued reference to fig. 1, further, as a more preferred embodiment of the present utility model, the power module 31 includes a power cylinder 311, a first transmission block 312, a transmission arm 313, a second transmission block 314, and a transmission shaft 315, where the power cylinder 311 is vertically disposed on the base 1, the first transmission block 312 is connected with a piston rod of the power cylinder 311, two opposite ends of the transmission arm 313 are respectively movably connected with the first transmission block 312 and the second transmission block 314, the transmission shaft 315 is vertically rotatably disposed on the base 1, one end of the transmission shaft 315 is movably connected with the second transmission block 314, and the other end is connected with the film-moving manipulator 32. Therefore, under the output of the rotary power of the power cylinder 311, the chip moving manipulator 32 can swing reciprocally between the slide holder 24 and the detection station under the transmission of the first transmission block 312, the transmission arm 313, the second transmission block 314 and the transmission shaft 315, so that chips can be grabbed from the slide holder 24 one by one and transferred and released into the detection station, the space occupied by the rotary motion of the chip moving manipulator 32 is small, the flexibility is high, the chip grabbing and transferring speed is improved, and the chip detection efficiency is improved.

In other embodiments, the film-moving manipulator 32 may be driven by the power module 31 to perform linear or composite linear and arc motions.

Further, as a more preferable embodiment of the present utility model, the film-moving robot 32 includes a rotary driver including a first drive shaft and a second drive shaft disposed opposite to each other, a first clamp arm connected to the first drive shaft, and a second clamp arm connected to the second drive shaft, the first clamp arm and the second clamp arm being rotatable to be closed or opened with each other; or alternatively

The film moving manipulator 32 comprises a rotary driver, a rotary arm and a sucker, wherein one end of the rotary arm is connected with the rotary driver, and the other end of the rotary arm is connected with the sucker. Therefore, the film-moving manipulator 32 has simple structure and working principle, and the film-taking mode for clamping or adsorbing the chip is safe and reliable.

As a more preferable embodiment of the present utility model, the vision inspection mechanism 4 includes a position adjustment mechanism 41 and a vision camera 42, the position adjustment mechanism 41 is disposed on the machine base 1, the vision camera 42 is connected to the position adjustment mechanism 41, and the vision camera 42 is disposed toward the inspection station. The position adjusting mechanism 41 is operated to flexibly adjust the position of the visual camera 42, finish preliminary focusing of the visual camera 42, then adjust the visual camera 42 to obtain clear images of the chip in the detection station, and the photographed images are transmitted to the display in real time, so that the bonding condition of the conductive adhesive on the chip can be intuitively and accurately judged.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. An electroconductive adhesive bonding detection apparatus, characterized by comprising:

the machine base is provided with a detection station;

the slide mechanism is arranged on the base and used for supplying chips to be detected;

the film moving mechanism is movably arranged on the machine base and is used for moving the chips on the film carrying mechanism to the detection station one by one; and

the visual detection mechanism is arranged in the detection station and used for detecting the quality of the chip.

2. The apparatus according to claim 1, wherein the slide mechanism includes a moving base and a slide stage, the moving base is disposed on the base, the slide stage is connected to the moving base, and the slide stage can move horizontally relative to the base under the driving of the moving base.

3. The apparatus according to claim 2, wherein the moving base includes an X-direction moving unit, a Y-direction moving unit, and a support arm, the Y-direction moving unit is disposed on the X-direction moving unit, one end of the support arm is connected to the Y-direction moving unit, and the other end of the support arm is connected to the stage.

4. The apparatus according to claim 2, further comprising a top sheet mechanism mounted on the base and below the stage.

5. The apparatus according to claim 4, wherein the stage comprises a frame and an elastic carrier plate, the elastic carrier plate is disposed in a hollow cavity of the frame, and the elastic carrier plate is used for loading a plurality of chips arranged in an array;

the top sheet mechanism comprises a top sheet seat, a top sheet motor, a top sheet cam and a top rod, wherein the top sheet motor is arranged on the top sheet seat, the top sheet cam is connected with a driving shaft of the top sheet motor, the top rod is vertically and slidably arranged on the top sheet seat, one end of the top rod is contacted with a rim of the top sheet cam, and the other end of the top rod faces the elastic carrier plate.

6. The apparatus according to claim 5, wherein the top sheet mechanism further comprises a return spring, the return spring being abutted between the ejector pin and the top sheet holder.

7. The apparatus according to claim 1, wherein the slide moving mechanism comprises a power module and a slide moving manipulator, the power module is disposed on the base, and the slide moving manipulator is connected with the power module and can reciprocate between the slide moving mechanism and the detecting station.

8. The conductive adhesive bonding detection device according to claim 7, wherein the power module comprises a power cylinder, a first transmission block, a transmission arm, a second transmission block and a transmission shaft, the power cylinder is vertically arranged on the base, the first transmission block is connected with a piston rod of the power cylinder, the opposite ends of the transmission arm are respectively and movably connected with the first transmission block and the second transmission block, the transmission shaft is vertically and rotatably arranged on the base, one end of the transmission shaft is movably connected with the second transmission block, and the other end of the transmission shaft is connected with the sheet moving manipulator.

9. The apparatus according to claim 7, wherein the film transfer robot includes a rotary driver including a first drive shaft and a second drive shaft disposed opposite to each other, the first clamp arm being connected to the first drive shaft, the second clamp arm being connected to the second drive shaft, the first clamp arm and the second clamp arm being rotatable to be closed or opened with each other; or alternatively

The film moving manipulator comprises a rotary driver, a rotary arm and a sucker, wherein one end of the rotary arm is connected with the rotary driver, and the other end of the rotary arm is connected with the sucker.

10. The apparatus according to claim 1, wherein the visual inspection mechanism includes a position adjustment mechanism and a visual camera, the position adjustment mechanism is disposed on the base, the visual camera is connected to the position adjustment mechanism, and the visual camera is disposed toward the inspection station.