CN114506065A - Film sticking device, film sticking method and manufacturing method of film sticking device - Google Patents
Film sticking device, film sticking method and manufacturing method of film sticking device Download PDFInfo
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- CN114506065A CN114506065A CN202210196375.4A CN202210196375A CN114506065A CN 114506065 A CN114506065 A CN 114506065A CN 202210196375 A CN202210196375 A CN 202210196375A CN 114506065 A CN114506065 A CN 114506065A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0004—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0052—Testing, e.g. testing for the presence of pinholes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0073—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor of non-flat surfaces, e.g. curved, profiled
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
Abstract
The application provides a pad pasting device, it includes: the attaching part is used for attaching an attaching film to a surface to be attached of an object to be attached; the piezoelectric sensing layer is fixed on one side of the attaching part and used for sensing the pressure applied when the attaching part attaches the attaching film to the object to be attached; and the pressure control part is fixed on the piezoelectric sensing layer and is far away from one side of the laminating part, the pressure control part comprises a plurality of pressure regulating cavities and each pressure regulating cavity, the first end of the pressure regulating cavity is attached to the piezoelectric sensing layer, each pressure regulating cavity is adjustable in air pressure, and therefore the pressure received by the laminating part is adjustable. The application also provides a film pasting method and a manufacturing method of the film pasting device.
Description
Technical Field
The application relates to the field of machine manufacturing, in particular to a film sticking device, a film sticking method using the film sticking device and a manufacturing method of the film sticking device.
Background
The existing film sticking device can only stick to an expandable curved surface when being applied to curved surface sticking, can expand into a planar curved surface, and can not well control the sticking process for an unexpanded curved surface, so that bubbles exist between a sticking film and a product to be stuck. In addition, the current pad pasting device can't detect the real-time pressure variation in the product laminating process, and then can lead to the pad pasting and wait to have the bubble between the thing.
Disclosure of Invention
The present application provides in a first aspect a film laminating apparatus comprising:
the attaching part is used for attaching an attaching film to a surface to be attached of an object to be attached;
the piezoelectric sensing layer is fixed on one side of the attaching part and used for sensing the pressure applied when the attaching part attaches the attaching film to the object to be attached; and
the pressure control portion is fixed in piezoelectric sensing layer keeps away from one side of laminating portion, the pressure control portion includes a plurality of pressure regulating chambeies, each the first end in pressure regulating chamber with piezoelectric sensing layer laminating, each atmospheric pressure in the pressure regulating intracavity is adjustable, thereby makes the pressure that laminating portion received is adjustable.
In one embodiment, the attaching portion includes an attaching surface, and the attaching surface is matched with the contour of the surface to be attached.
In an embodiment, the attaching portion includes at least one adsorption structure for adsorbing the attaching film.
In one embodiment, the tensile strain of the piezoelectric sensing layer is greater than 150%.
In an embodiment, the piezoelectric sensing layer includes a first electrode layer, a piezoelectric material layer, and a second electrode layer, which are sequentially stacked, the first electrode layer includes a plurality of first electrodes arranged in parallel and at intervals, the second electrode layer includes a plurality of second electrodes arranged in parallel and at intervals, and projections of each of the first electrodes and the plurality of second electrodes on the piezoelectric material layer are respectively crossed, so that the piezoelectric sensing layer includes a plurality of piezoelectric sensing units arranged in an array.
In an embodiment, each of the piezoelectric sensing units is used for sensing a pressure received by a corresponding portion of the attaching portion.
In an embodiment, the pressure control portion further includes an air pressure adjusting device, and the air pressure adjusting device is connected to a second end of each pressure regulating cavity far away from the piezoelectric sensing layer, and is used for adjusting the air pressure in each pressure regulating cavity.
In one embodiment, the attaching device further includes: the control device is electrically connected with the piezoelectric sensing layer and used for recording the pressure; the control device is further connected with the air pressure adjusting device and used for controlling the air pressure adjusting device to adjust the air pressure in each pressure adjusting cavity, so that the pressure applied to the attaching part is adjusted.
In one embodiment, the attaching device further includes:
the supporting table is arranged on one side of the attaching part, which is far away from the piezoelectric sensing layer, and is used for conveying and bearing the object to be attached;
the supporting frame is arranged between the attaching part and the supporting table and used for conveying and bearing the attaching film; and
and the moving device is fixed with one or any combination of the bonding part, the piezoelectric sensing layer and the pressure control part and is used for controlling the bonding part to move towards the supporting table so as to bond the bonding film to the surface to be bonded.
The utility model provides a pad pasting device, have and treat the identical binding face of thing through setting up laminating portion, be favorable to laminating to inextensible curved surface, through setting up the pressure sensing layer, the pressure size that different positions received on can the real-time sensing binding face, and through pressure control portion, adjust the atmospheric pressure in the chamber to different pressure regulations, the pressure that makes each position of binding face receive equals, also be at the pad pasting in-process, the pressure department between laminating membrane and the thing of treating is equal, thereby be favorable to improving the optical representation of laminating back product, avoid laminating membrane and treat and produce the bubble between the thing.
A second aspect of the present application provides a film laminating method, comprising:
providing the film sticking device;
arranging an object to be attached on one side of the attaching part, which is far away from the piezoelectric sensing layer;
arranging a bonding film between the bonding part and the object to be bonded;
moving the bonding part to enable the bonding part to adsorb the bonding film;
continuously moving the attaching part to enable the attaching part to cover the surface to be attached;
and sensing the pressure received by the laminating part, and adjusting the air pressure in the pressure adjusting cavities until the laminating film is laminated on the surface to be laminated.
In one embodiment, the step of providing the film sticking device comprises: and providing the attaching part comprising an attaching surface, wherein the attaching surface is matched with the contour of the surface to be attached.
In an embodiment, before moving the attaching portion continuously, the method further includes: and the air pressure in the pressure regulating cavity is partially raised, so that in the process of laminating the laminating film and the to-be-laminated surface, the position, corresponding to the partial pressure regulating cavity, on the laminating film is firstly contacted with the to-be-laminated surface.
In an embodiment, the sensing the pressure received by the attaching portion specifically includes: and respectively sensing piezoelectric signals generated at different positions of the piezoelectric sensing layer, and judging the pressure applied to each position on the piezoelectric sensing layer by taking the piezoelectric signal at any one position as a reference.
The film pasting method provided by the embodiment of the application comprises the steps that the film pasting device is adopted, the pressure received by the pasting part is sensed in the pasting process, the air pressure in the pressure regulating cavities is regulated, the pressure received between the pasting film and the object to be pasted in the pasting process can be equal everywhere, the optical performance of the product after the pasting is improved, and bubbles are prevented from being generated between the pasting film and the object to be pasted.
A third aspect of the present application provides a method of manufacturing a film laminating apparatus, including:
manufacturing a fitting part, wherein the fitting part is used for fitting a fitting film to a surface to be fitted of an object to be fitted;
manufacturing a piezoelectric sensing layer, and bonding the piezoelectric sensing layer to one side of the bonding part;
and the pressure control part is manufactured and comprises a plurality of pressure regulating cavities, and one end of each pressure regulating cavity is attached to one side of the piezoelectric sensing layer far away from the attaching part, so that the air pressure in each pressure regulating cavity is adjustable.
In one embodiment, the manufacturing of the fit comprises:
preparing a first mixed solution, wherein the first mixed solution comprises a first solute and a first solvent;
providing a mould, and placing the first mixed solution into the mould;
and after the first mixed solution is solidified to form the bonding part, taking out the bonding part from the mold.
In one embodiment, the step of providing a mould comprises providing a profile on the mould identical to the profile to be faced; the first mixed liquid covers the part of the profiling part and is solidified to form a binding surface.
In one embodiment, the fabricating the piezoelectric sensing layer includes:
preparing a second mixed solution, wherein the second mixed solution comprises a second solute and a second solvent;
coating the second mixed solution, and heating and curing the second mixed solution into a piezoelectric material layer;
polarizing the piezoelectric material layer;
the piezoelectric material layer is provided with a first electrode layer and a second electrode layer on two sides respectively, the first electrode layer comprises a plurality of first electrodes which are arranged in parallel, the second electrode layer comprises a plurality of second electrodes which are arranged in parallel, and projections of the first electrodes and the second electrodes on the piezoelectric material layer are crossed respectively.
The manufacturing method of the film sticking device provided by the embodiment of the application comprises the first solvent and the first solution through the material of the sticking part, and the sticking surface is arranged on the sticking part through the mold, so that the product is stuck. The material through setting up the piezoelectric material layer includes second solute and second solvent, is favorable to setting up the tensile stress and the piezoelectric coefficient of piezoelectric material layer to promote pressure measurement's precision.
Drawings
Fig. 1 is a schematic structural diagram of a film laminating apparatus according to a first embodiment of the present application.
Fig. 2 is a schematic structural diagram of a bonding portion in the first embodiment of the present application.
Fig. 3 is a schematic structural diagram of a piezoelectric sensing layer according to a first embodiment of the present application.
Fig. 4 is an IV-IV cross-sectional view of a piezoelectric sensing layer in one embodiment of the present application.
Fig. 5 is a schematic structural diagram of a pressure control portion in the first embodiment of the present application.
Fig. 6 is a flowchart of a film laminating method in the second embodiment of the present application.
Fig. 7 is a schematic view of the film sticking apparatus before step S25 in fig. 6.
Fig. 8 is a schematic view of another film of an object to be attached according to the second embodiment of the present application.
Fig. 9 is a schematic view of a film of another object to be attached according to the second embodiment of the present application.
Fig. 10 is a flowchart of a method for manufacturing a film laminating apparatus according to a third embodiment of the present application.
Description of the main elements
Bonding portions 10, 10a, 10b
Pressure regulating cavity 51
Air pressure adjusting device 53
Supporting frame 91
Supporting table 93
Adhesive film B
To-be-pasted material A, A'
Wainscot A1
Steps S21, S22, S23, S24, S25, S26, S31, S32, S33
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
To further explain the technical means and effects of the present application for achieving the intended purpose, the following detailed description is given to the present application in conjunction with the accompanying drawings and preferred embodiments.
Example one
In an embodiment of the present invention, a film pasting device 100 is provided, referring to fig. 1, the film pasting device 100 includes: bonding portion 10, piezoelectric sensing layer 30, pressure control portion 50, control device 70, support frame 91, and support table 93. The attaching part 10 is used for attaching an attaching film B to an object to be attached a 1. The piezoelectric sensing layer 30 is fixed on one side of the attaching portion 10, and is used for sensing the pressure applied when the attaching portion 10 attaches the attaching film B to the object a to be attached. The pressure control portion 50 is fixed on one side of the piezoelectric sensing layer 30 far away from the attaching portion 10, the pressure control portion includes a plurality of pressure regulating cavities 51, each pressure regulating cavity 51 is a closed cavity, and the pressure regulating cavities 51 are independent and not communicated with each other. The first end 511 of each pressure regulating cavity 51 is attached to the piezoelectric sensing layer 30, and the air pressure in each pressure regulating cavity 51 is adjustable, so that the pressure applied to the attaching portion 10 is adjustable.
In the present embodiment, referring to fig. 1 and fig. 2, the attaching portion 10 includes an attaching surface 11, and the shape of the attaching surface 11 matches with the contour of the to-be-attached surface a 1. Specifically, when the attaching part 10 contacts the article a to be attached, the attaching surface 11 may just coincide with the article a to be attached a 1. By providing attaching portion 10 including attaching surface 11, it is advantageous to attach the surface a1 when it is a non-developable curved surface.
In this embodiment, the a1 to be pasted on the object a is a non-developable curved surface, specifically, the curved surface of the a1 to be pasted cannot be unfolded to be a plane, that is, the gaussian curvature of any point on the a1 to be pasted is not zero. In other embodiments, the to-be-pasted surface a1 of the to-be-pasted object a may also be a developable surface or a flat surface, and the application may implement the pasting of the non-developable surface by arranging that the pasting part 10 includes the pasting surface 11 that matches with the contour of the to-be-pasted surface a 1.
In this embodiment, the attaching portion 10 further includes at least one adsorption structure 13 for adsorbing the attaching film B. Specifically, the adsorption structure 13 is a suction cup, and is disposed on the same side as the attaching surface 11, and can adsorb the attaching film B on the attaching portion 10 and attach the attaching film B to the object to be attached a. The laminating film B can include with the laminating district of waiting to paste thing A laminating and be used for the adsorption zone of being snatched by adsorption structure 13, after the laminating, can be through cutting laminating film B to with laminating district and adsorption zone separation. In other embodiments, the absorption structure 13 may also be a plurality of air holes opened on the surface of the attaching portion 10, and air in the air holes is exhausted by pressing on the attaching film B, so as to achieve an absorption effect similar to that of a suction cup.
In the present embodiment, the attaching portion 10 is a flexible material, and specifically, may be a polymer material with a low young's modulus, such as Thermoplastic Elastomer (TPE), Thermoplastic polyurethane Elastomer (TPU), Thermoplastic acrylic resin (TPA), or the like. The material has high density, good flexibility and certain bonding tension, so that higher bonding degree can be realized, and bubbles generated between the bonding film B and the object A to be bonded in the bonding process can be avoided. In other embodiments, other materials may be used for the fitting portion 10, which is not limited in this application.
In the present embodiment, the tensile strain of the piezoelectric sensing layer 30 is greater than 150%. Specifically, the piezoelectric sensing layer 30 can convert mechanical energy into electric energy when receiving pressure, and because the laminating portion 10 has a lower young's modulus, great deformation can take place under the effect of pressure to drive the piezoelectric sensing layer 30 to produce deformation, consequently, tensile strain through setting up the piezoelectric sensing layer 30 is greater than 150%, is favorable to preventing because the tensile structure damage that leads to the piezoelectric sensing layer 30 that deformation produced from.
In the present embodiment, referring to fig. 3 and fig. 4, the piezoelectric sensing layer 30 includes a first electrode layer 31, a piezoelectric material layer 33, and a second electrode layer 35 sequentially stacked. The first electrode layer 31 includes a plurality of first electrodes 310 arranged in parallel and at intervals, the second electrode layer 35 includes a plurality of second electrodes 350 arranged in parallel and at intervals, and projections of each first electrode 310 and the plurality of second electrodes 350 on the piezoelectric material layer 33 respectively intersect. Specifically, the direction in which the first electrodes 310 are arranged in parallel is perpendicular to the direction in which the second electrodes 350 are arranged in parallel, so that the projections of the first electrodes 310 and the second electrodes 350 on the piezoelectric material layer 33 form a plurality of intersection regions arranged in an array, each of the first electrodes 310, the second electrodes 350, which are overlapped with each other, and a portion of the piezoelectric material layer 33 corresponding to the intersection region form a capacitance structure, and the capacitance structure is a piezoelectric sensing unit, so that the piezoelectric sensing layer 30 includes a plurality of piezoelectric sensing units arranged in an array.
In the present embodiment, the plurality of first electrodes 310 are electrically connected to the control device 70, respectively, and are used for transmitting electrical signals to the control device 70, and the plurality of second electrodes 350 are electrically connected to the control device 70, respectively, and are used for transmitting electrical signals to the control device 70. The control device 70 detects the electrical signals on each first electrode 310 and each second electrode 350, respectively, so as to obtain the piezoelectric signal generated by each of the piezoelectric sensing units.
In this embodiment, the distance between two adjacent first electrodes 310 is 10 μm, the distance between two adjacent second electrodes 350 is 10 μm, and the density of the piezoelectric sensing units on the piezoelectric sensing layer 30 can be further adjusted by setting the distance between the adjacent electrodes, so as to adjust the measurement precision, thereby accurately obtaining the pressure generated at different positions on the piezoelectric sensing layer 30. In other embodiments, the distance between adjacent electrodes may also be adjusted according to the requirement of measurement accuracy, which is not limited in this application.
In this embodiment, the piezoelectric material layer 33 is made of polyvinylidene fluoride (PVDF), the PVDF piezoelectric film deforms under the action of pressure to generate an electric field, when the piezoelectric material layer 33 at the overlapping portion of a first electrode 310 and a second electrode 350 deforms, the voltage difference between the first electrode 310 and the second electrode 350 changes, and the magnitude of the pressure can be determined by detecting the degree of the voltage change. For example, a voltage difference between one first electrode 310 and one second electrode 350 may be transmitted to the control device 70 by a current signal, and after the control device 70 receives the current signals transmitted by the first electrode 310 and the second electrode 350, the voltage difference at the corresponding position may be obtained according to the two current signals, so as to obtain the pressure. By analyzing the plurality of current signals transmitted by each first electrode 310 and each second electrode 350, the voltage difference generated on each piezoelectric sensing unit can be obtained, so as to obtain the pressure applied to different positions on the piezoelectric sensing layer 30. The sensitivity of the voltage change is related to the piezoelectric coefficient of the piezoelectric material layer 33, and the higher the piezoelectric coefficient of the piezoelectric material layer 33 is, the larger the voltage change value at the time of the deformation is.
In the present embodiment, referring to fig. 1 and fig. 5, the pressure control portion includes a plurality of pressure regulating cavities 51 densely arranged, and each pressure regulating cavity 51 is a hexagonal cavity. The pressure-regulating cavities 51 are adjacent to each other, and form a honeycomb structure, so that the pressure-regulating cavities 51 cover the piezoelectric sensing layer 30 to the maximum extent. The first end 511 of the pressure regulating cavity 51 is attached to the piezoelectric sensing layer 30, so that sealing is realized; the second end 513 is connected to the air pressure adjusting device 53, thereby realizing a hermetic structure. When a pressure regulating cavity 51 is pressurized, under the action of air pressure, the pressure regulating cavity 51 generates pressure on the piezoelectric sensing layer 30, the piezoelectric sensing layer 30 deforms under the action of the pressure, and when the attaching part 10 is not attached to the object a to be attached, part of the attaching part 10 corresponding to the pressure regulating cavity 51 deforms; when the attaching portion 10 is attached to the object a to be attached, the pressure of the attaching portion 10 corresponding to the pressure regulating chamber 51 to the object a to be attached is increased. Through adjusting the atmospheric pressure in the different pressure regulating chambeies 51, be favorable to adjusting the pressure of laminating portion 10 each position to can adjust the pressure of laminating portion 10 and treat each position between the thing A at the laminating in-process. In other embodiments, the pressure regulating cavity 51 may also be a cylindrical cavity or a cavity with other shapes, which is not limited in the present application.
In this embodiment, the cavity wall of the pressure regulating cavity 51 may be made of a material with a high young's modulus, so that the pressure regulating cavity 51 is not easily deformed under the action of air pressure, thereby avoiding an error generated when applying pressure to the piezoelectric sensing layer 30. In addition, the cavity wall can also be used to support the piezoelectric sensing layer 30 and the attachment portion 10, thereby improving the structural stability of the film attachment apparatus 100.
In the present embodiment, referring to fig. 1, an air pressure adjusting device 53 is respectively connected to each pressure regulating cavity 51 for respectively adjusting the air pressure in each pressure regulating cavity 51. In other embodiments, the film pasting device 100 may further include a plurality of air pressure adjusting devices 53, and each air pressure adjusting device 53 is connected to one or more pressure regulating cavities 51, and is used for adjusting the air pressure in each pressure regulating cavity 51, which is not limited in the present application.
In the present embodiment, the control device 70 is electrically connected to the piezoelectric sensing layer 30 and the air pressure adjusting device 53, respectively, for recording the pressure between the attaching portion 10 and the object a to be attached, and adjusting the air pressure in each pressure adjusting cavity 51, thereby adjusting the pressure applied to the attaching portion 10. Specifically, the control device 70 may record capacitance values of each capacitor on the piezoelectric sensing layer 30, so as to calculate the pressure applied to the piezoelectric sensing layer 30 according to the capacitance values, further obtain the pressure at each position between the attaching portion 10 and the object a to be attached, and control the air pressure in each pressure regulating cavity 51 to regulate the pressure at each position between the attaching portion 10 and the object a to be attached.
In the present embodiment, the supporting platform 93 is disposed on a side of the attaching portion 10 away from the piezoelectric sensing layer 30, and is used for conveying and supporting the object to be attached a. Particularly, the supporting table 93 can be used for supporting the object a to be attached, so that the object a to be attached can be conveniently attached, and in addition, the supporting table 93 can also be used as a conveying belt to sequentially convey a plurality of objects a to be attached to the lower side of the attaching portion 10, so that the assembly line operation is realized.
In this embodiment, the supporting frame 91 is disposed between the bonding portion 10 and the supporting table 93, and is used for conveying and supporting the bonding film B. Specifically, the supporting frame 91 may be two rollers, and conveys the attachment film B by rotation and simultaneously plays a supporting role. The laminating film B can include a plurality of laminating districts that are used for with treating the laminating of thing A, and after the pad pasting, the support frame 91 can remove laminating film B to with new laminating district with treat that the thing A of pasting the membrane aligns, realize the flow process. In other embodiments, the supporting frame 91 may further include a rotating shaft, the adhesive film B is wound around the rotating shaft in a reel form, and the adhesive area is aligned with the object a to be attached without the adhesive film by the rotation of the rotating shaft.
In this embodiment, the film pasting device 100 further includes a moving device (not shown), which is fixed to one or a combination of the pasting unit 10, the piezoelectric sensing layer 30 and the pressure control unit 50, and is used to control the pasting unit 10 to move toward the support table 93, so as to paste the pasting film B onto the surface to be pasted a 1. Specifically, the moving means may be a guide rail perpendicular to the support table 93, and controls the movement of the bonding section 10 by fitting the bonding section 10, the piezoelectric sensing layer 30, or the pressure control section 50. In other embodiments, the moving device may also be a robot, and the control of the bonding part 10 is realized by grabbing the bonding part 10, the piezoelectric sensing layer 30 or the pressure control part 50. The moving device may be any mechanical device that can control the approaching and departing of the attaching portion 10 to and from the supporting platform 93, which is not limited in this application.
The film sticking device 100 provided by the embodiment of the application comprises the sticking surface 11 matched with the contour of the to-be-stuck A1 object through the sticking part 10, and is favorable for realizing sticking of an inextensible curved surface structure. By providing the piezoelectric sensing layer 30, the pressure at each position between the attaching portion 10 and the object a to be attached can be measured in the attaching process, and the attaching state can be known. Through setting up pressure control portion 50, can realize the pressure control to each position of piezoelectricity sensing layer 30 through the atmospheric pressure of adjusting each pressure regulating chamber 51, and then adjust laminating portion 10 and wait the pressure on each position between the thing A for the pressure that laminating film in-process laminating film B received is even, is favorable to improving the optical performance behind the laminating film, avoids laminating film B and waits to paste and produce the bubble between the thing A.
Example two
An embodiment of the present application provides a film pasting method, please refer to fig. 6, which includes:
step S21: providing the film sticking device;
step S22: arranging an object to be attached on one side of the attaching part, which is far away from the piezoelectric sensing layer;
step S23: arranging a bonding film between the bonding part and the object to be bonded;
step S24: moving the bonding part to enable the bonding part to adsorb the bonding film;
step S25: continuously moving the attaching part to enable the attaching part to cover the surface to be attached;
step S26: and sensing the pressure received by the laminating part, and adjusting the air pressure in the pressure adjusting cavities until the laminating film is laminated on the surface to be laminated.
In the present embodiment, step S21 includes: a bonding portion 10 comprising a bonding surface 11 is provided, the bonding surface 11 conforming to the contour of the to-be-bonded a 1. Specifically, when the film sticking apparatus 100 is provided, it is necessary to select the corresponding sticking portion 10 according to the shape of the object a to be stuck, thereby achieving a good sticking effect.
In this embodiment, step S22 specifically includes: the object to be attached a is disposed on the supporting platform 93, and the surface to be attached a1 is aligned with the attaching surface 11. Step S23 specifically includes: the attaching film B is conveyed to between the attaching part 10 and the object a to be attached through the supporting frame 91.
In this embodiment, step S24 specifically includes: and (3) attaching the attaching part 10 to the attaching film B, and continuously pressing down to enable the adsorption structure 13 on the attaching part 10 to adsorb the attaching film B. Specifically, after the bonding portion 10 is bonded to the bonding film B, a certain pressure may be generated between the bonding film B and the bonding portion 10 by continuously pressing the bonding portion 10, so that the adsorption structure 13 on the bonding portion 10 adsorbs the bonding film B, that is, under the action of the pressure, the air holes or the air in the suction cup on the bonding portion 10 are exhausted, thereby realizing the adsorption of the bonding film B.
In this embodiment, referring to fig. 7, before step S25, the method further includes: the air pressure in the partial pressure regulating cavity 51 is lifted, so that the position of the corresponding partial pressure regulating cavity 51 of the attaching film B is firstly contacted with the A1 to be attached in the process of attaching the attaching film B to the A1 to be attached. Specifically, before the attaching part 10 is moved and the attaching film B is brought into contact with the to-be-attached surface a1, the air pressure in the partial pressure regulating chamber 51 may be increased, so that the corresponding partial attaching part 10 and the corresponding attaching film B are deformed by the pressure and are brought into contact with the to-be-attached surface a 1. Through arranging that part of the adhesive film B contacts with the surface A1 to be adhered firstly, the part which is adhered firstly can be used as the center to extend to the periphery in the subsequent process, so that the adhesive film B is completely adhered with the surface A1 to be adhered, and bubbles are prevented from being generated in the adhering process.
In this embodiment, step S26 specifically includes: through piezoelectric sensing layer 30, the pressure that different positions received between sensing laminating portion 10 and the thing A of waiting to paste to according to the pressure that senses, adjust the atmospheric pressure in a plurality of pressure regulating chambeies 51, make the pressure that each position of laminating portion 10 received everywhere equal, until the laminating is accomplished. The pressure between the attaching part 10 and the object A to be attached is equal everywhere, so that the attaching film B can be attached to the object A uniformly, and bubbles generated due to uneven stress in the attaching process can be avoided.
Specifically, the piezoelectric sensing layer 30 includes a plurality of piezoelectric sensing units, each of which is used for sensing a piezoelectric signal generated when a corresponding portion of the attaching portion 10 is subjected to a pressure, and for facilitating subsequent adjustment, the pressure sensed by the piezoelectric sensing unit at any position can be used as a reference to determine the pressure generated at different positions on the attaching portion 10. In other embodiments, the pressure at other positions may be measured using the position where the attaching portion 10 first contacts the object to be attached a as a reference point.
In the present embodiment, referring to fig. 8 and 9, the contour of the object a to be attached may be recessed in a direction away from the attaching portion 10a, and the attaching portion 10a is also configured to match the contour of the object a to be attached. When an object a 'to be attached to which an attaching film B is attached needs to be attached to the object a, the object a' to be attached may be first adsorbed to the attaching portion 10B through the adsorbing structure 13, and then the attaching portion 10B is moved, so that the attaching film B is attached to the object a to be attached. In the above process, the pressure between the bonding portion and the object a to be bonded can be sensed by the piezoelectric sensing layer 30, and the bonding effect can be improved by controlling the air pressure in the pressure regulating cavity 51. In other embodiments, the contour of the object a to be attached may be other curved surfaces, and the attaching portion 10 matched with the contour of the object a to be attached is provided, and the pressure between the attaching portion 10 and the object a to be attached is equal everywhere through the piezoelectric sensing layer 30 and the pressure control portion 50 during the attaching process, so that the film attaching effect can be improved, and the generation of bubbles can be avoided.
According to the film pasting method provided by the embodiment of the application, the pressure of each position between the pasting part 10 and the object A to be pasted is sensed in the film pasting process, the pressure of different positions of the pasting part 10 is adjusted by the pressure control part 50, the pasting film B can be better pasted on the object A to be pasted, the optical effect is improved, and bubbles are prevented from being generated between the pasting film B and the object A to be pasted.
EXAMPLE III
In an embodiment of the present invention, a method for manufacturing a film pasting device is provided, for manufacturing the film pasting device 100 in the first embodiment, please refer to fig. 10, which includes:
step S31: manufacturing a fitting part, wherein the fitting part is used for fitting a fitting film to a surface to be fitted of an object to be fitted;
step S32: manufacturing a piezoelectric sensing layer, and bonding the piezoelectric sensing layer to one side of the bonding part;
step S33: and the pressure control part is manufactured and comprises a plurality of pressure regulating cavities, and one end of each pressure regulating cavity is attached to one side of the piezoelectric sensing layer far away from the attaching part, so that the air pressure in each pressure regulating cavity is adjustable.
In the present embodiment, step S31 includes:
step S311: preparing a first mixed solution, wherein the first mixed solution at least comprises a first solute and a first solvent;
step S312: providing a mould, and placing the first mixed solution into the mould;
step S313: and after the first mixed solution is solidified to form the bonding part, taking out the bonding part from the mold.
Wherein, step S312 specifically includes: a profiling part with the same profile as the A1 of the surface to be pasted is arranged on the die; the first mixed solution covers the part of the profiling part and is solidified to form a binding surface 11. That is, when preparing the bonded portion 10, by providing a copying portion having the same contour as the surface to be bonded a1 on the mold, the bonded portion 10 formed by curing the first mixed liquid can include the bonding surface 11.
In this embodiment, the first mixed solution prepared in step S311 may have a first solute that is a thermoplastic elastomer material, such as hydrogenated Styrene-butadiene block copolymer (SEBS), and a first solvent that is a material miscible with the first solute, such as white mineral oil. In addition, the first mixed solution may further include other components, such as polypropylene (PP), an Ultraviolet (UV) curable material, and an antioxidant. One possible first mixed solution comprises, by mass: SEBS: 10 +/-10%, PP: 6.5 ± 10%, white mineral oil: 105 ± 10%, UV curable material: 0.15 +/-10% of antioxidant: 0.15 +/-10%. Through setting up the material of first mixed liquid, can make laminating portion 10 after the solidification have lower young modulus, and laminating portion 10's density is high, the compliance is good and have certain laminating tension, consequently can realize higher laminating degree, is favorable to avoiding laminating in-process laminating membrane B and treating to produce the bubble between the thing A.
In the present embodiment, step S32 includes:
step S321: preparing a second mixed solution, wherein the second mixed solution comprises a second solute and a second solvent;
step S322: coating the second mixed solution, and heating and curing the second mixed solution into a piezoelectric material layer;
step S323: polarizing the piezoelectric material layer;
step S324: the piezoelectric material layer is provided with a first electrode layer and a second electrode layer on two sides respectively, the first electrode layer comprises a plurality of first electrodes which are arranged in parallel, the second electrode layer comprises a plurality of second electrodes which are arranged in parallel, and projections of the first electrodes and the second electrodes on the piezoelectric material layer are crossed respectively.
Specifically, the second solute of the second mixed solution in step S321 may be a piezoelectric polymer material, the second solvent is used for mutual dissolution with the second solute, a mass ratio of the second solute may be 10% to 30%, and a mass ratio of the second solvent may be 70% to 90%. By providing the second mixed liquid including the second solute and the second solvent, the tensile stress of the piezoelectric material layer 33 can be made greater than 150% and have a higher piezoelectric coefficient.
In this embodiment, the step S322 may include baking at a low temperature to solidify the second mixture, and then baking at a high temperature to crystallize the second mixture, thereby forming the piezoelectric material layer 33. The step S323 is to polarize the piezoelectric material layer 33 so as to have piezoelectric characteristics, and specifically may be to polarize the piezoelectric material layer 33 by mechanical stretching or by a high electric field. Step S324 may specifically be: the first electrode layer 31 and the second electrode layer 35 are printed on both sides of the piezoelectric material layer 33 by screen printing.
In the manufacturing method of the film sticking device provided by the embodiment of the application, the material of the sticking part 10 is the first mixed liquid, and the first mixed liquid is solidified through the mold, so that the contour of the sticking surface 11 can be set according to the contour of the object A to be stuck; through setting up the component of first mixed liquid, can make laminating portion 10 have lower young modulus, and have higher density and laminating tension to promote the effect of pad pasting. By setting the material of the piezoelectric sensing layer 30 to include the second mixed liquid and setting the components of the second mixed liquid, it is advantageous to improve the tensile stress of the piezoelectric material layer 33 and improve the tensile coefficient of the piezoelectric material layer 33, thereby improving the effect of piezoelectric sensing.
It should be understood by those skilled in the art that the above embodiments are only for illustrating the present application and are not used as limitations of the present application, and that suitable modifications and changes of the above embodiments are within the scope of the claims of the present application as long as they are within the spirit and scope of the present application.
Claims (17)
1. A film laminating apparatus, comprising:
the attaching part is used for attaching an attaching film to a surface to be attached of an object to be attached;
the piezoelectric sensing layer is fixed on one side of the attaching part and used for sensing the pressure applied when the attaching part attaches the attaching film to the object to be attached; and
the pressure control portion is fixed in piezoelectric sensing layer keeps away from one side of laminating portion, the pressure control portion includes a plurality of pressure regulating chambeies, each the first end in pressure regulating chamber with piezoelectric sensing layer laminating, each atmospheric pressure in the pressure regulating intracavity is adjustable, thereby makes the pressure that laminating portion received is adjustable.
2. The film applicator of claim 1, wherein the attachment portion comprises an attachment surface that conforms to the contour of the surface to be attached.
3. The film attachment device of claim 1, wherein the attachment portion comprises at least one suction structure for suctioning the attachment film.
4. The film attachment device of claim 1, wherein the piezoelectric sensing layer has a tensile strain greater than 150%.
5. The film pasting device of claim 1, wherein the piezoelectric sensing layer comprises a first electrode layer, a piezoelectric material layer and a second electrode layer, which are sequentially stacked, the first electrode layer comprises a plurality of first electrodes arranged in parallel and at intervals, the second electrode layer comprises a plurality of second electrodes arranged in parallel and at intervals, and projections of each first electrode and the plurality of second electrodes on the piezoelectric material layer respectively intersect, so that the piezoelectric sensing layer comprises a plurality of piezoelectric sensing units arranged in an array.
6. The film laminating device of claim 5, wherein each of the piezoelectric sensing units is configured to sense a pressure applied to the corresponding portion of the laminating portion.
7. The film sticking device as recited in claim 1, wherein the pressure control portion further comprises an air pressure adjusting device, and the air pressure adjusting device is connected with a second end of each pressure regulating cavity far away from the piezoelectric sensing layer and is used for adjusting the air pressure in each pressure regulating cavity.
8. The film attachment device of claim 7, further comprising: the control device is electrically connected with the piezoelectric sensing layer and used for recording the pressure; the control device is further connected with the air pressure adjusting device and used for controlling the air pressure adjusting device to adjust the air pressure in each pressure adjusting cavity, so that the pressure applied to the attaching part is adjusted.
9. The film attachment device of any one of claims 1-8, further comprising:
the supporting table is arranged on one side, away from the piezoelectric sensing layer, of the bonding part and used for conveying and bearing the object to be bonded;
the supporting frame is arranged between the attaching part and the supporting table and used for conveying and bearing the attaching film; and
and the moving device is fixed with one or any combination of the bonding part, the piezoelectric sensing layer and the pressure control part and is used for controlling the bonding part to move towards the supporting table so as to bond the bonding film to the surface to be bonded.
10. A method of laminating a film, comprising:
providing a film attachment device according to any one of claims 1-9;
arranging an object to be attached on one side of the attaching part, which is far away from the piezoelectric sensing layer;
arranging a bonding film between the bonding part and the object to be bonded;
moving the bonding part to enable the bonding part to adsorb the bonding film;
continuously moving the attaching part to enable the attaching part to cover the surface to be attached;
and sensing the pressure received by the laminating part, and adjusting the air pressure in the pressure adjusting cavities until the laminating film is laminated on the surface to be laminated.
11. The method of laminating of claim 10 wherein said step of providing said laminating device comprises: and providing the attaching part comprising an attaching surface, wherein the attaching surface is matched with the contour of the surface to be attached.
12. The method of laminating a film according to claim 10, further comprising, before continuing to move the laminating portion: and the air pressure in the pressure regulating cavity is partially raised, so that in the process of laminating the laminating film and the to-be-laminated surface, the position, corresponding to the partial pressure regulating cavity, on the laminating film is firstly contacted with the to-be-laminated surface.
13. The method of claim 10, wherein the sensing the pressure received by the attachment portion is specifically: and respectively sensing piezoelectric signals generated at different positions of the piezoelectric sensing layer, and judging the pressure applied to each position on the piezoelectric sensing layer by taking the piezoelectric signal at any one position as a reference.
14. A method of manufacturing a film laminating apparatus, comprising:
manufacturing a fitting part, wherein the fitting part is used for fitting a fitting film to a surface to be fitted of an object to be fitted;
manufacturing a piezoelectric sensing layer, and bonding the piezoelectric sensing layer to one side of the bonding part;
and the pressure control part is manufactured and comprises a plurality of pressure regulating cavities, and one end of each pressure regulating cavity is attached to one side of the piezoelectric sensing layer far away from the attaching part, so that the air pressure in each pressure regulating cavity is adjustable.
15. The method of manufacturing a film laminating apparatus according to claim 14, wherein the manufacturing of the laminating portion includes:
preparing a first mixed solution, wherein the first mixed solution comprises a first solute and a first solvent;
providing a mould, and placing the first mixed solution into the mould;
and after the first mixed solution is solidified to form the bonding part, taking out the bonding part from the mold.
16. The method of manufacturing a film attachment device according to claim 15, wherein the step of providing a mold comprises providing a copying portion on the mold in the same shape as the contour to be coated; and the first mixed solution covers part of the profiling part and is cured to form a binding surface.
17. The method of manufacturing a film attachment device according to claim 14, wherein the manufacturing of the piezoelectric sensing layer comprises:
preparing a second mixed solution, wherein the second mixed solution comprises a second solute and a second solvent;
coating the second mixed solution, and heating and curing the second mixed solution into a piezoelectric material layer;
polarizing the piezoelectric material layer;
the piezoelectric material layer is provided with a first electrode layer and a second electrode layer on two sides respectively, the first electrode layer comprises a plurality of first electrodes which are arranged in parallel, the second electrode layer comprises a plurality of second electrodes which are arranged in parallel, and projections of the first electrodes and the second electrodes on the piezoelectric material layer are crossed respectively.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210196375.4A CN114506065A (en) | 2022-03-01 | 2022-03-01 | Film sticking device, film sticking method and manufacturing method of film sticking device |
| TW111108456A TWI795227B (en) | 2022-03-01 | 2022-03-08 | Film adhering apparatus, film pasting method and manufacturing method of the film adhering apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210196375.4A CN114506065A (en) | 2022-03-01 | 2022-03-01 | Film sticking device, film sticking method and manufacturing method of film sticking device |
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| CN114506065A true CN114506065A (en) | 2022-05-17 |
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| CN202210196375.4A Pending CN114506065A (en) | 2022-03-01 | 2022-03-01 | Film sticking device, film sticking method and manufacturing method of film sticking device |
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| CN (1) | CN114506065A (en) |
| TW (1) | TWI795227B (en) |
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Also Published As
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| TW202335832A (en) | 2023-09-16 |
| TWI795227B (en) | 2023-03-01 |
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Application publication date: 20220517 |