TWI795227B - Film adhering apparatus, film pasting method and manufacturing method of the film adhering apparatus - Google Patents

Abstract

The present disclosure provides a film adhering apparatus including an adhering part, a piezoelectric sensing layer, and a pressure control part. The adhering part is used to adhering a film to a surface of a target item. The piezoelectric sensing layer is fixed to a side portion of the adhering part to sense a pressure applied by the adhering part when the adhering part is pasting the film to the target item. The pressure control part is fixed to a side portion of the piezoelectric sensing layer away from the adhering part. The pressure control part includes a plurality of pressure adjusting chambers. A first end of each of the plurality of pressure adjusting chambers is attached to the piezoelectric sensing layer. The air pressure in each of the plurality of pressure adjusting chambers is adjustable, so that the pressure on the adhering part is adjustable. The present disclosure also provides a film pasting method and a manufacturing method of the film adhering apparatus.

Description

Film sticking device, film sticking method, and manufacturing method of film sticking device

The present application relates to the field of mechanical manufacturing, and in particular to a film sticking device, a film sticking method using the above film sticking device, and a manufacturing method of the above film sticking device.

Conventional film sticking devices, when applied to curved surfaces, usually can only fit developable curved surfaces, that is, curved surfaces that can be unfolded into a plane. For non-developable curved surfaces, the bonding process cannot be well controlled, resulting in There are air bubbles between the film and the product to be applied. In addition, conventional film sticking devices cannot detect real-time pressure changes during the product sticking process, which will cause air bubbles between the sticking film and the object to be stuck.

The first aspect of the present application provides a film sticking device, which includes: a sticking part, which is used to stick a sticking film to a surface to be sticking of an object to be sticked; a piezoelectric sensing layer, fixed to the sticking part One side of the sticking part is used to sense the pressure received when the sticking part sticks the sticking film to the object to be stuck; and the pressure control part is fixed on the piezoelectric sensing layer away from the sticking The pressure control part includes a plurality of pressure regulating chambers, the first end of each of the pressure regulating chambers is bonded to the piezoelectric sensing layer, and the air pressure in each of the pressure regulating chambers adjustable, so that the pressure on the fitting part can be adjusted.

In one embodiment, the bonding portion includes a bonding surface, and the bonding surface conforms to the contour of the surface to be bonded.

In one embodiment, the bonding part includes at least one adsorption structure for adsorbing the bonding film.

In one embodiment, the tensile strain of the piezoelectric sensing layer is greater than 150%.

In one embodiment, the piezoelectric sensing layer includes a first electrode layer, a piezoelectric material layer, and a second electrode layer stacked in sequence, and the first electrode layer includes a plurality of first electrodes arranged in parallel and at intervals. , the second electrode layer includes a plurality of second electrodes arranged in parallel and at intervals, each of the first electrodes intersects with the projections of the plurality of second electrodes on the piezoelectric material layer, so that the The piezoelectric sensing layer includes a plurality of piezoelectric sensing units arranged in an array.

In one embodiment, each of the piezoelectric sensing units is used to sense the pressure received by its corresponding part of the bonding portion.

In one embodiment, the pressure control part further includes an air pressure regulating device, and the air pressure regulating device is connected to the second end of each of the pressure regulating chambers away from the piezoelectric sensing layer, and is used to adjust the pressure of each pressure regulating chamber. The air pressure in the pressure regulating chamber.

In one embodiment, the bonding device further includes: a control device, electrically connected to the piezoelectric sensing layer, for recording the pressure; the control device is also connected to the air pressure adjustment device, for The air pressure regulating device is controlled to adjust the air pressure in each of the pressure regulating chambers, so as to adjust the pressure on the bonding portion.

In one embodiment, the laminating device further includes: a support table, located on a side of the laminating part away from the piezoelectric sensing layer, for transporting and carrying the object to be pasted; a support frame, Provided between the bonding part and the support table, used to transport and carry the bonding film; and a moving device, connected with the bonding part, the piezoelectric sensing layer and the pressure control part One or any combination of them is fixed, and is used to control the movement of the bonding part toward the support table, so as to bond the bonding film to the surface to be bonded.

The film sticking device provided in the embodiment of the present application, by setting the sticking part to have a sticking surface consistent with the object to be stuck, is beneficial to sticking the non-developable curved surface, and by setting the pressure sensing layer, it can sense the sticking in real time. The pressure received by different positions on the joint surface, and the pressure control part is used to adjust the air pressure in different pressure regulating chambers, so that the pressure received by each position on the joint surface is equal, that is, in the process of laminating the film, the pressure between the laminating film and the The pressure between the objects to be pasted is equal everywhere, which is beneficial to improve the optical performance of the pasted product and avoid air bubbles between the pasted film and the pasted objects.

The second aspect of the present application provides a film sticking method, which includes: providing the above film sticking device; The object to be pasted is arranged on the side of the bonding part away from the piezoelectric sensing layer; the bonding film is arranged between the bonding part and the object to be pasted; the bonding part is moved, Make the bonding part absorb the bonding film; continue to move the bonding part so that the bonding part covers the surface to be bonded; sense the pressure received by the bonding part and adjust the The air pressure in the plurality of pressure-regulating chambers is adjusted until the bonding film is bonded to the surface to be bonded.

In one embodiment, the step of providing the film sticking device includes: providing the fitting part including a fitting surface, and the fitting surface conforms to the contour of the surface to be pasted.

In one embodiment, before continuing to move the bonding part, it further includes: raising the air pressure in the pressure regulating chamber, so that during the bonding process of the bonding film and the surface to be bonded, the The position on the lamination film corresponding to the part of the pressure regulating cavity is first in contact with the surface to be laminated.

In one embodiment, the sensing the pressure received by the bonding part is specifically: sensing the piezoelectric signals generated at different positions of the piezoelectric sensing layer respectively, and taking the pressure at any one position The electrical signal is used as a reference to judge the pressure received by each position on the piezoelectric sensing layer.

The film sticking method provided in the embodiment of the present application, by using the above-mentioned film sticking device, and sensing the pressure received by the sticking part during the sticking process, and adjusting the air pressure in multiple pressure regulating chambers, the sticking process can be made The pressure received between the laminating film and the object to be attached is equal everywhere, which is conducive to improving the optical performance of the product after lamination and avoiding air bubbles between the laminating film and the object to be attached.

The third aspect of the present application provides a method for manufacturing a film sticking device, which includes: manufacturing a bonding part, the bonding part is used to bond a bonding film to the surface of an object to be bonded; manufacturing a piezoelectric measuring layer, and bonding the piezoelectric sensing layer to one side of the bonding part; manufacturing a pressure control part, including manufacturing a plurality of pressure regulating chambers, and bonding one end of each of the pressure regulating chambers On the side of the piezoelectric sensing layer away from the bonding part, the air pressure in each of the pressure regulating chambers is adjustable.

In one embodiment, the manufacturing of the bonding part includes: preparing a first mixed solution, the first mixed solution including a first solute and a first solvent; providing a mold, and putting the first mixed solution into the In the mold; after the first mixed liquid solidifies to form the bonding part, take out the bonding part from the mold.

In one embodiment, the step of providing a mold includes setting a profiling part on the mold with the same contour as the veneer; the part of the first mixed liquid covering the profiling part is cured to form a veneer meet face.

In one embodiment, the manufacturing of the piezoelectric sensing layer includes: preparing a second mixed solution, the second mixed solution including a second solute and a second solvent; coating the second mixed solution, and heating and curing it into a piezoelectric electrical material layer; polarize the piezoelectric material layer; respectively arrange a first electrode layer and a second electrode layer on both sides of the piezoelectric material layer, and the first electrode layer includes a plurality of first electrode layers arranged in parallel An electrode, the second electrode layer includes a plurality of second electrodes arranged in parallel, each of the first electrodes intersects with projections of the plurality of second electrodes on the piezoelectric material layer respectively.

In the manufacturing method of the film sticking device provided in the embodiment of the present application, the material of the sticking part includes the first solvent and the first solution, and the sticking surface is set on the sticking part by the mold, which is beneficial to sticking the product . By setting the material of the piezoelectric material layer including the second solute and the second solvent, it is beneficial to set the tensile stress and the piezoelectric coefficient of the piezoelectric material layer, thereby improving the accuracy of pressure measurement.

100:Film sticking device

10, 10a1, 10b: bonding part

11: Fitting surface

13: Adsorption structure

30: Piezoelectric sensing layer

31: The first electrode layer

310: first electrode

33: Piezoelectric material layer

35: Second electrode layer

350: second electrode

50: Pressure Control Department

51: Regulating cavity

511: first end

513: second end

53: Air pressure adjustment device

70: Control device

91: support frame

93: support table

B: laminating film

A, A': Items to be posted

A1: to be veneered

S21, S22, S23, S24, S25, S26, S31, S32, S33: steps

FIG. 1 is a schematic structural diagram of a film sticking device in Embodiment 1 of the present application.

FIG. 2 is a schematic structural diagram of the bonding part in Embodiment 1 of the present application.

FIG. 3 is a schematic structural diagram of a piezoelectric sensing layer in Embodiment 1 of the present application.

FIG. 4 is a IV-IV sectional view of the piezoelectric sensing layer in Embodiment 1 of the present application.

FIG. 5 is a schematic structural diagram of a pressure control unit in Embodiment 1 of the present application.

FIG. 6 is a flow chart of the film sticking method in Embodiment 2 of the present application.

FIG. 7 is a schematic diagram of the state of the film sticking device before step S25 in FIG. 6 .

Fig. 8 is a schematic diagram of film sticking of another object to be pasted in Example 2 of the present application.

Fig. 9 is a schematic diagram of film sticking of another object to be stuck in Embodiment 2 of the present application.

FIG. 10 is a flow chart of the manufacturing method of the film sticking device in the third embodiment of the present application.

The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them.

Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used in the description of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application.

In order to further explain the technical means and effects adopted by the present invention to achieve the intended purpose, the following detailed description of the present application will be given in conjunction with the accompanying drawings and preferred implementation modes.

Embodiment one

Embodiment 1 of the present application provides a film sticking device 100, please refer to FIG. Wherein, the laminating unit 10 is used for laminating a laminating film B to the surface A1 of an object A to be pasted. The piezoelectric sensing layer 30 is fixed on one side of the sticking part 10 for sensing the pressure that the sticking part 10 receives when sticking the sticking film B to the object A to be stuck. The pressure control part 50 is fixed on the side of the piezoelectric sensing layer 30 away from the bonding part 10. The pressure control part includes a plurality of pressure regulating chambers 51, and each pressure regulating chamber 51 is a closed cavity. independent of each other. The first end 511 of each pressure regulating chamber 51 is bonded to the piezoelectric sensing layer 30 , and the air pressure in each pressure regulating chamber 51 is adjustable, so that the pressure on the bonding portion 10 can be adjusted.

In this embodiment, please refer to FIG. 1 and FIG. 2 together. The bonding portion 10 includes a bonding surface 11 , and the shape of the bonding surface 11 matches the contour of the surface A1 to be bonded. Specifically, when the bonding part 10 touches the object A to be pasted, the bonding surface 11 can coincide with the surface A1 of the object A to be pasted. By arranging the bonding part 10 to include the bonding surface 11 , it is beneficial that the bonding can also be performed when the surface A1 to be bonded is a non-developable curved surface.

In this embodiment, the surface A1 of the object A to be pasted is a non-developable curved surface. Specifically, the curved surface of the surface A1 to be pasted cannot be developed into a plane, that is, the Gaussian curvature of any point on the surface A1 to be pasted is not zero . In other embodiments, the surface A1 of the object A to be pasted can also be a developable curved surface or a plane. In this application, by setting the bonding part 10 to include a bonding surface 11 that conforms to the contour of the surface A1 to be bonded, the application can be realized. Films for non-developable surfaces.

In this embodiment, the bonding part 10 further includes at least one adsorption structure 13 for adsorbing the bonding film B. As shown in FIG. Specifically, the adsorption structure 13 is a suction cup, which is arranged on the same side as the bonding surface 11, and can adsorb the bonding film B on the bonding part 10, and then bond it to the object A to be bonded. The bonding film B can include a bonding area to be bonded to the object A and an adsorption area for being grasped by the adsorption structure 13. After the bonding is completed, it can be cut Apply film B so that the attached area is separated from the adsorption area. In other embodiments, the adsorption structure 13 can also be a plurality of air holes opened on the surface of the laminating part 10, and the air in the air holes can be eliminated by pressing on the laminating film B, so as to achieve an adsorption effect similar to that of a suction cup.

In this embodiment, the bonding part 10 is a flexible material, specifically, a polymer material with a relatively low Young's modulus, such as thermoplastic elastomer (Thermoplastic Elastomer, TPE), thermoplastic polyurethane elastomer (Thermoplastic polyurethanes, TPU ) or thermoplastic acrylic resin (Thermoplastic Polyamide, TPA), etc. This kind of material has high density, good flexibility and a certain bonding tension, so it can achieve a high degree of bonding, which is beneficial to avoid air bubbles between the bonding film B and the object A to be bonded during the bonding process. In other embodiments, other materials may also be used for the bonding portion 10 , which is not limited in this application.

In this embodiment, the tensile strain of the piezoelectric sensing layer 30 is greater than 150%. Specifically, when the piezoelectric sensing layer 30 is under pressure, it will convert mechanical energy into electrical energy. Since the bonding part 10 has a relatively low Young's modulus, it will undergo a relatively large deformation under the action of pressure, thereby The piezoelectric sensing layer 30 is driven to be deformed. Therefore, setting the tensile strain of the piezoelectric sensing layer 30 to be greater than 150% is beneficial to prevent the structural damage of the piezoelectric sensing layer 30 due to stretching caused by deformation.

In this embodiment, please refer to FIG. 3 and FIG. 4 together. The piezoelectric sensing layer 30 includes a first electrode layer 31 , a piezoelectric material layer 33 and a second electrode layer 35 which are sequentially stacked. The first electrode layer 31 includes a plurality of first electrodes 310 arranged in parallel and at intervals, and the second electrode layer 35 includes a plurality of second electrodes 350 arranged in parallel and at intervals, and each first electrode 310 is in contact with the plurality of second electrodes 350. The projections on the piezoelectric material layer 33 respectively intersect. Specifically, the direction in which the first electrodes 310 are arranged in parallel is perpendicular to the direction in which the second electrodes 350 are arranged in parallel, so that the projections of the plurality of first electrodes 310 and the plurality of second electrodes 350 on the piezoelectric material layer 33 form an array arrangement A plurality of intersecting areas, each overlapping first electrode 310, second electrode 350 and part of the piezoelectric material layer 33 corresponding to the intersecting area constitutes a capacitive structure, and the capacitive structure is set as a piezoelectric sensing unit, Then the piezoelectric sensing layer 30 includes a plurality of piezoelectric sensing units arranged in an array.

In this embodiment, a plurality of first electrodes 310 are respectively electrically connected to the control device 70, and are used to transmit electrical signals to the control device 70, and a plurality of second electrodes 350 are respectively electrically connected to the control device 70, and are used to transmit electrical signals to the control device 70 transmit electrical signals. The control device 70 respectively detects the electric signal on each first electrode 310 and each second electrode 350 to obtain the piezoelectric signal generated by each piezoelectric sensing unit.

In this embodiment, the distance between two adjacent first electrodes 310 is 10 μm, and the distance between two adjacent second electrodes 250 is 10 μm. By setting the distance between adjacent electrodes, it is possible to further adjust The density of piezoelectric sensing units on the piezoelectric sensing layer 30 can be adjusted to further adjust the measurement accuracy, so as to accurately obtain the pressure generated at different positions on the piezoelectric sensing layer 30 . In other embodiments, the distance between adjacent electrodes can also be adjusted according to the requirement of measurement accuracy, which is not limited in this application.

In this embodiment, the piezoelectric material layer 33 is made of polyvinylidene fluoride (polyvinylidene fluoride, PVDF), and the piezoelectric film made of PVDF material will deform under the action of pressure and generate an electric field. When the piezoelectric material layer 33 in the overlapping portion of a first electrode 310 and a second electrode 350 is deformed, the voltage difference between the first electrode 310 and the second electrode 350 will change, and by detecting the degree of voltage change, that is Can determine the size of the pressure. For example, the voltage difference between a first electrode 310 and a second electrode 350 can be transmitted to the control device 70 in the form of a current signal, and the control device 70 receives the signals transmitted by the first electrode 310 and the second electrode 350 respectively. After receiving the current signal, the voltage difference at the corresponding position can be obtained according to the two current signals, so as to obtain the pressure. By analyzing the multiple current signals transmitted by each first electrode 310 and each second electrode 350, the voltage difference generated on each piezoelectric sensing unit can be obtained, thereby obtaining different positions on the piezoelectric sensing layer 30 under pressure. Wherein, the sensitivity of the voltage change is related to the piezoelectric coefficient of the piezoelectric material layer 33 , the higher the piezoelectric coefficient of the piezoelectric material layer 33 , the larger the voltage change value when deformation occurs.

In this embodiment, please refer to FIG. 1 and FIG. 5 together. The pressure control part includes a plurality of pressure regulating chambers 51 densely arranged, and each pressure regulating chamber 51 is specifically a hexagonal cavity. A plurality of pressure regulating chambers 51 are adjacent to each other to form a honeycomb structure, so that the pressure regulating chambers 51 cover the piezoelectric sensing layer 30 to the greatest extent. The first end 511 of the pressure regulating cavity 51 is bonded to the piezoelectric sensing layer 30 to realize sealing; the second end 513 is connected to the air pressure regulating device 53 to realize a sealed structure. When a pressure regulating chamber 51 is pressurized, under the action of air pressure, the pressure regulating chamber 51 will generate a pressure on the piezoelectric sensing layer 30, and the piezoelectric sensing layer 30 will be deformed under the action of the pressure. When the bonding part 10 is not bonded to the object A to be pasted, the part of the bonding part 10 corresponding to the pressure regulating cavity 51 will be deformed; The pressure of the sticking part 10 corresponding to the position of the cavity 51 on the object A to be stuck will increase. By adjusting the air pressure in different pressure regulating chambers 51, it is beneficial to adjust the pressure at each position of the bonding part 10, so that the pressure at each position between the bonding part 10 and the object A to be bonded can be adjusted during the bonding process. pressure. In other embodiments, the pressure regulating chamber 51 may also be a cylindrical cavity or a cavity of other shapes, which is not limited in the present application.

In this embodiment, the wall of the pressure regulating chamber 51 can be made of a material with a higher Young's modulus, so that the pressure regulating chamber 51 is not easily deformed under the action of air pressure, thereby avoiding the pressure on the piezoelectric sensing layer 30. error occurs. In addition, the cavity wall can also be used to support the piezoelectric sensing layer 30 and the bonding part 10 , thereby improving the structural stability of the film sticking device 100 .

In this embodiment, referring to FIG. 1 , an air pressure regulating device 53 is respectively connected to each pressure regulating chamber 51 for adjusting the air pressure in each pressure regulating chamber 51 . In other embodiments, the film pasting device 100 may also include a plurality of air pressure adjustment devices 53, each air pressure adjustment device 53 is connected to one or several pressure regulating chambers 51, and is used to adjust the air pressure in each pressure regulating chamber 51 respectively. , this application does not limit it.

In this embodiment, the control device 70 is electrically connected to the piezoelectric sensing layer 30 and the air pressure adjustment device 53 respectively, and is used to record the pressure between the bonding part 10 and the object A to be pasted, and to adjust each pressure regulating chamber 51 The air pressure inside can adjust the pressure on the bonding part 10 . Specifically, the control device 70 can record the capacitance value of each capacitor on the piezoelectric sensing layer 30, so as to calculate the pressure on the piezoelectric sensing layer 30 according to the capacitance value, and then obtain the relationship between the bonding part 10 and the object A to be pasted. and control the air pressure in each pressure regulating chamber 51 to adjust the pressure at each position between the bonding part 10 and the object A to be pasted.

In this embodiment, the support table 93 is disposed on the side of the bonding portion 10 away from the piezoelectric sensing layer 30 , and is used for transporting and supporting the object A to be bonded. Specifically, the support table 93 can be used to support the object A to be pasted, so as to facilitate the realization of the film sticking of the object A to be pasted. In addition, the support table 93 can also be used as a conveyor belt to sequentially transmit a plurality of objects A to be pasted to the bottom of the bonding part 10. Thereby realizing pipeline operation.

In this embodiment, the supporting frame 91 is disposed between the laminating part 10 and the supporting platform 93 for conveying and carrying the laminating film B. As shown in FIG. Specifically, the supporting frame 91 can be two rollers, which can transmit the laminating film B by rotation and play a supporting role at the same time. The bonding film B can include a plurality of bonding areas for bonding with the object A to be pasted. After the film pasting is finished, the support frame 91 can move the bonding film B, thereby combining the new bonding area with the non-filmed object to be pasted. Object A is aligned to realize assembly line operation. In other embodiments, the support frame 91 may also include a rotating shaft, on which the laminating film B is wound in the form of a reel, and the laminating area is aligned with the object A to be pasted without the film by the rotation of the rotating shaft. .

In this embodiment, the film sticking device 100 also includes a moving device (not shown in the figure), and the moving device is fixed to one or a combination of the bonding part 10, the piezoelectric sensing layer 30, and the pressure control part 50 for controlling the bonding The part 10 moves toward the direction of the support table 93, so that the bonding film B is bonded to the surface A1 to be bonded. Specifically, the moving device can be a guide rail perpendicular to the supporting platform 93 , and controls the movement of the bonding part 10 by fitting with the bonding part 10 , the piezoelectric sensing layer 30 or the pressure control part 50 . In other embodiments, the mobile device can also be a robot arm, and by grabbing the bonding part 10, the piezoelectric sensing layer 30 or the pressure control part 50, the Control of the bonding unit 10. The moving device can also be any mechanical device that can control the fitting part 10 to approach and move away from the supporting platform 93, which is not limited in the present application.

The film sticking device 100 provided in the embodiment of the present application facilitates the sticking of non-developable curved surface structures by setting the sticking part 10 to include the sticking surface 11 conforming to the contour of the object to be sticking A1. By setting the piezoelectric sensing layer 30, the pressure at various positions between the bonding part 10 and the object A to be bonded can be measured during the bonding process, so as to know the bonding state. By setting the pressure control part 50, the pressure control of each position of the piezoelectric sensing layer 30 can be realized by adjusting the air pressure of each pressure regulating chamber 51, and then the pressure of each position between the bonding part 10 and the object A to be pasted can be adjusted. The pressure makes the pressure on the bonding film B uniform during the film bonding process, which is conducive to improving the optical performance after film bonding and avoiding the generation of air bubbles between the bonding film B and the object A to be bonded.

Embodiment two

Embodiment 2 of the present application provides a film sticking method, please refer to FIG. 6, which includes: Step S21: providing the above film sticking device; side; step S23: disposing the bonding film between the bonding part and the object to be bonded; step S24: moving the bonding part so that the bonding part absorbs the bonding film; step S25 : Continue to move the fitting part so that the fitting part covers the surface to be pasted; Step S26: Sensing the pressure received by the fitting part, and adjusting the air pressure in the plurality of pressure regulating chambers, until the bonding film is bonded to the surface to be bonded.

In this embodiment, step S21 includes: providing a bonding part 10 including a bonding surface 11 , and the bonding surface 11 coincides with the contour of the surface A1 to be bonded. Specifically, when providing the film sticking device 100 , it is necessary to select the corresponding sticking part 10 according to the shape of the object A to be sticked, so as to achieve a better sticking effect.

In this embodiment, step S22 is specifically: setting the object A to be pasted on the support table 93 , and aligning the surface A1 to be pasted to the pasting surface 11 . Step S23 is specifically: transferring the bonding film B between the bonding part 10 and the object A to be bonded via the support frame 91 .

In this embodiment, step S24 is specifically: attach the bonding part 10 to the bonding film B, and continue to press down, so that the adsorption structure 13 on the bonding part 10 will adsorb the bonding film B. Specifically, after the bonding portion 10 and the bonding film B are bonded, continue to press the bonding portion 10, a certain pressure can be generated between the bonding film B and the bonding portion 10, so that the bonding portion 10 The adsorption structure 13 on the top will adsorb the bonding film B, that is, under the action of pressure, the air holes on the bonding part 10 or the gas in the suction cup will be discharged, thereby realizing the adsorption of the bonding film B.

In this embodiment, please refer to FIG. 7, before step S25, it also includes: raising the air pressure in part of the pressure regulating chamber 51, so that in the process of bonding the bonding film B to the surface A1 to be bonded, the bonding film B corresponds to Part of the pressure regulating cavity 51 is in contact with the surface A1 to be veneered first. Specifically, before moving the bonding part 10 and making the bonding film B contact the surface A1 to be bonded, the air pressure in part of the pressure regulating chamber 51 can be increased first, so that the corresponding part of the bonding part 10 and the bonding film B Deformation occurs under the action of pressure, so as to be in contact with the surface A1 to be veneered first. By setting part of the laminating film B to be in contact with the surface A1 to be laminated first, it can be extended to the periphery with the first laminated part as the center in the subsequent process, thereby realizing the complete lamination of the laminating film B and the surface A1 to be laminated. It is beneficial to avoid air bubbles during the bonding process.

In this embodiment, step S26 is specifically: using the piezoelectric sensing layer 30 to sense the pressure at different positions between the bonding part 10 and the object A to be bonded, and adjust multiple pressures according to the sensed pressure. The air pressure in the pressure regulating chamber 51 makes the pressure on each position of the bonding part 10 equal everywhere until the bonding is completed. By setting the pressure between the bonding part 10 and the object A to be pasted everywhere to be equal, it is beneficial to evenly bond the bonding film B to the object A to be pasted, and at the same time avoid damage due to uneven force during the bonding process. bubbles produced.

Specifically, the piezoelectric sensing layer 30 includes a plurality of piezoelectric sensing units, and each piezoelectric sensing unit is used to sense the piezoelectric signal generated when its corresponding part of the bonding portion 10 is under pressure, for To facilitate subsequent adjustments, the pressure sensed by the piezoelectric sensing unit at any position can also be used as a reference to determine the magnitude of the pressure generated at different positions on the bonding portion 10 . In other embodiments, the position where the bonding portion 10 first contacts the object A to be pasted can also be used as a reference point to measure the pressure at other positions.

In this embodiment, please refer to FIG. 8 and FIG. 9 together. The outline of the object A to be pasted can be depressed in a direction away from the bonding portion 10a, and the bonding portion 10a is also set to be similar to the contour of the object A to be pasted. match. When it is necessary to bond an object A' attached with a bonding film B to the object A, the object A' can be adsorbed to the bonding part 10b by the adsorption structure 13 first, and then moved and pasted part 10b, so that the bonding film B is bonded to the object A to be bonded. In the above process, the piezoelectric sensing layer 30 can sense the pressure between the bonding part and the object A to be bonded, and the effect of bonding can be improved by controlling the air pressure in the pressure regulating chamber 51 . In other embodiments, the contour of the object A to be pasted can also be other curved surfaces, by setting the bonding part 10 that matches the contour of the object A to be pasted, and during the bonding process, the piezoelectric sensing layer 30 and the pressure control part 50, so that the pressure between the bonding part 10 and the object A to be pasted is equal everywhere, so as to improve the effect of film pasting and avoid the generation of air bubbles.

The film sticking method provided in the embodiment of the present application senses the pressure at various positions between the sticking part 10 and the object A to be stuck during the film sticking process, and utilizes the pressure of the pressure control part 50 on different positions of the sticking part 10 Adjusting the force can better bond the bonding film B to the object A to be pasted, improve the optical effect, and avoid air bubbles between the bonding film B and the object A to be pasted.

Embodiment Three

Embodiment 3 of the present application provides a method for manufacturing a film sticking device, which is used to manufacture the film sticking device 100 in Embodiment 1. Please refer to FIG. The bonding film is bonded to the surface of an object to be bonded; step S32: manufacturing a piezoelectric sensing layer, and bonding the piezoelectric sensing layer to one side of the bonding part; step S33: Manufacturing the pressure control part includes manufacturing a plurality of pressure regulating chambers, and bonding one end of each of the pressure regulating chambers to the side of the piezoelectric sensing layer away from the bonding part, so that each of the pressure regulating chambers The air pressure in the pressure chamber is adjustable.

In this embodiment, step S31 includes: step S311: preparing a first mixed solution, the first mixed solution at least including a first solute and a first solvent; step S312: providing a mold, and making the first mixed solution Putting it into the mold; step S313: after the first mixed liquid solidifies to form the bonding part, take out the bonding part from the mold.

Wherein, step S312 specifically includes: setting a profiling part on the mould, which has the same profile as the surface A1 to be veneered; That is, when preparing the bonding part 10 , the bonding part 10 formed after the solidification of the first mixed liquid can include the bonding surface 11 by setting the mold to include a profiling part having the same contour as the surface A1 to be bonded.

In this embodiment, the first solute of the first mixed solution prepared in step S311 can be a thermoplastic elastic material, such as hydrogenated styrene-butadiene block copolymer (Styrene Ethylene Butylene Styrene, SEBS), the first solvent It is a material that can be miscible with the first solute, such as white mineral oil. In addition, the first mixed liquid may also include other components, such as polypropylene (polypropylene, PP), ultraviolet (ultraviolet, UV) curing materials, and antioxidants. A feasible mass ratio of the first mixed solution is: SEBS: 10±10%, PP: 6.5±10%, white mineral oil: 105±10%, UV curing material: 0.15±10%, antioxidant: 0.15 ±10%. By setting the material of the first mixed liquid, the bonding part 10 after curing can have a lower Young's modulus, and the bonding part 10 has high density, good flexibility and certain Bonding tension, so a higher degree of bonding can be achieved, which is beneficial to avoid air bubbles between the bonding film B and the object A to be bonded during the bonding process.

In this embodiment, step S32 includes: step S321: preparing a second mixed solution, the second mixed solution including a second solute and a second solvent; step S322: coating the second mixed solution, and heating and curing it into a pressed Electric material layer; Step S323: Polarize the piezoelectric material layer; Step S324: Set a first electrode layer and a second electrode layer on both sides of the piezoelectric material layer, the first electrode layer includes A plurality of first electrodes arranged in parallel, the second electrode layer includes a plurality of second electrodes arranged in parallel, each of the first electrodes and the projection of the plurality of second electrodes on the piezoelectric material layer respectively cross.

Specifically, the second solute of the second mixed solution in step S321 may be a piezoelectric polymer material, the second solvent is used for miscibility with the second solute, and the mass ratio of the second solute may be 10%-30%, The mass proportion of the second solvent may be 70%-90%. By setting the second mixed solution to include the second solute and the second solvent, the piezoelectric material layer 33 can have a tensile stress greater than 150% and a higher piezoelectric coefficient.

In this embodiment, step S322 may include baking at a low temperature to solidify the second mixed liquid, and then baking at a high temperature to crystallize the second mixed liquid, thereby forming the piezoelectric material layer 33 . Step S323 is to polarize the piezoelectric material layer 33 so as to have piezoelectric properties. Specifically, the piezoelectric material layer 33 may be polarized by mechanical stretching or by a high electric field. Step S324 may specifically be: printing the first electrode layer 31 and the second electrode layer 35 on both sides of the piezoelectric material layer 33 by screen printing.

In the manufacturing method of the film sticking device provided in the embodiment of the present application, by setting the material of the sticking part 10 as the first mixed liquid, and curing the first mixed liquid by the mold, the sticking can be set according to the contour of the object A to be stuck The profile of the surface 11; by setting the components of the first mixed liquid, the bonding part 10 can have a lower Young's modulus, and have a higher density and bonding tension, thereby improving the effect of the film. By setting the material of the piezoelectric sensing layer 30 to include the second mixed solution, and setting the components of the second mixed solution, it is beneficial to increase the tensile stress of the piezoelectric material layer 33 and improve the stretching of the piezoelectric material layer 33 coefficient, thereby improving the effect of piezoelectric sensing.

Those skilled in the art should recognize that the above embodiments are only used to illustrate the present invention, rather than to limit the present invention, as long as within the scope of the spirit of the present invention, appropriate changes made to the above embodiments and changes all fall within the scope of protection of the present invention.

100:Film sticking device

10:Fitting part

30: Piezoelectric sensing layer

50:Pressure control department

51: Regulating cavity

511: first end

513: second end

53: Air pressure adjustment device

70: Control device

91: support frame

93: support platform

B: laminating film

A: Items to be posted

A1: to be veneered

Claims (16)

A film sticking device, comprising: a sticking part, used for sticking a sticking film to a surface to be sticked of an object to be sticked; a piezoelectric sensing layer, fixed on one side of the sticking part, used for sensing Measuring the pressure received by the bonding part when the bonding film is bonded to the object to be pasted; and the pressure control part is fixed on the side of the piezoelectric sensing layer away from the bonding part, so The pressure control part includes a plurality of pressure regulating chambers, the first end of each of the pressure regulating chambers is attached to the piezoelectric sensing layer, and the air pressure in each of the pressure regulating chambers is adjustable, so that the The pressure on the bonding part can be adjusted; wherein, the pressure control part also includes an air pressure adjustment device, and the air pressure adjustment device is connected to the second end of each of the pressure adjustment chambers away from the piezoelectric sensing layer. To adjust the air pressure in each of the pressure regulating chambers. The film sticking device according to claim 1, wherein the sticking part includes a sticking surface, and the sticking surface matches the contour of the face to be sticked. The film sticking device according to claim 1, wherein the sticking part includes at least one adsorption structure for absorbing the sticking film. The film sticking device according to claim 1, wherein the tensile strain of the piezoelectric sensing layer is greater than 150%. The film sticking device according to claim 1, wherein the piezoelectric sensing layer includes a first electrode layer, a piezoelectric material layer, and a second electrode layer stacked in sequence, and the first electrode layer includes parallel and spaced electrodes. A plurality of first electrodes, the second electrode layer includes a plurality of second electrodes arranged in parallel and at intervals, each of the first electrodes and the projection of the plurality of second electrodes on the piezoelectric material layer cross respectively, so that the piezoelectric sensing layer includes a plurality of piezoelectric sensing units arranged in an array. The film sticking device according to claim 5, wherein each of the piezoelectric sensing units is used to sense the pressure on its corresponding part of the sticking part. The film sticking device according to claim 1, further comprising: a control device electrically connected to the piezoelectric sensing layer for recording the pressure; the control device is also connected to the air pressure adjustment device The device is connected, and is used to control the air pressure regulating device to adjust the air pressure in each of the pressure regulating chambers, so as to adjust the pressure on the bonding part. The film sticking device according to any one of claims 1 to 7, further comprising: a support table, located on the side of the bonding part away from the piezoelectric sensing layer, for conveying and carrying the The object to be pasted; the support frame, which is arranged between the bonding part and the support table, and is used to transmit and carry the bonding film; and the mobile device, which is connected with the bonding part and the piezoelectric sensor One or any combination of the layer and the pressure control part is fixed, and is used to control the moving of the bonding part to the direction of the support table, so as to bond the bonding film to the surface to be bonded. A film sticking method, comprising: providing a film sticking device as described in any one of Claims 1 to 8; placing the object to be pasted on the side of the sticking part away from the piezoelectric sensing layer; placing the sticking film Set between the bonding part and the object to be pasted; move the bonding part so that the bonding part absorbs the bonding film; continue to move the bonding part so that the bonding part Covering the surface to be pasted; sensing the pressure received by the bonding part, and adjusting the air pressure in the plurality of pressure regulating chambers until the bonding film is bonded to the surface to be bonded. The film sticking method according to claim 9, wherein the step of providing the film sticking device includes: providing the sticking part including a sticking surface, and the sticking surface matches the contour of the face to be sticked . The film sticking method according to claim 9, wherein, before continuing to move the sticking part, it also includes: increasing the air pressure in the pressure regulating chamber, so that the sticking film is sticking to the surface to be sticking During the process, the position on the laminating film corresponding to the part of the pressure regulating chamber is in contact with the surface to be laminated first. The film sticking method as described in claim 9, wherein the sensing the pressure received by the bonding part is specifically: sensing the piezoelectric signals generated at different positions of the piezoelectric sensing layer, wherein The piezoelectric signal at any position is used as a reference to determine the pressure on each position on the piezoelectric sensing layer. A method for manufacturing a film sticking device, comprising: manufacturing a bonding portion, the bonding portion is used to bond a bonding film to a surface to be bonded of an object to be bonded; manufacturing a piezoelectric sensing layer, and placing the The piezoelectric sensing layer is attached to one side of the bonding part; manufacturing the pressure control part includes manufacturing a plurality of pressure regulating chambers, and bonding one end of each of the pressure regulating chambers to the piezoelectric sensing layer. The side of the layer away from the bonding part makes the air pressure in each of the pressure regulating chambers adjustable. The method for manufacturing a film sticking device according to claim 13, wherein the manufacturing the bonding part includes: preparing a first mixed solution, the first mixed solution including a first solute and a first solvent; providing a mold, and The first mixed liquid is put into the mold; after the first mixed liquid solidifies to form the bonding part, the bonding part is taken out from the mold. The manufacturing method of a film sticking device according to claim 14, wherein the step of providing a mold includes setting a profiling part on the mold that is the same as the contour of the surface to be pasted; the first mixed solution covers the Partial curing of the contoured portion forms the bonding surface. The method for manufacturing a film sticking device according to claim 13, wherein the manufacturing of the piezoelectric sensing layer includes: preparing a second mixed liquid, the second mixed liquid includes a second solute and a second solvent; coating the first Two mixed liquids are heated and solidified to form a piezoelectric material layer; the piezoelectric material layer is polarized; a first electrode layer and a second electrode layer are respectively arranged on both sides of the piezoelectric material layer, and the first The electrode layer includes a plurality of first electrodes arranged in parallel, and the second electrode layer includes a plurality of second electrodes arranged in parallel, and each of the first electrodes and the plurality of second electrodes are in the piezoelectric material layer The projections on are respectively intersected.

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