TWI699502B - Gluing method and device for wave-shaped substrate - Google Patents

Abstract

The present invention provides a method for applying glue to a wave-shaped substrate, which includes placing a wave-shaped substrate on a table for positioning. The wave-shaped substrate is formed by a plurality of arc-convex surfaces and a plurality of arc-concave surfaces in a staggered manner. At least two wavy glue application paths and two linear glue application paths are surrounded to form a glue application track; a glue application wheel is provided to roll along the glue application track and touch the wavy substrate while simultaneously applying glue. The present invention also includes a glue application device implementing the above method, so as to improve the problem that the traditional glue application wheel is difficult to stick the tape tightly on the wave-shaped substrate.

Description

Gluing method and device for wave-shaped substrate

The invention relates to a glue application technology of a substrate, in particular to a glue application method and a device for a wave-shaped substrate.

As we all know, in the era of high environmental awareness, solar power generation is a power generation method that meets environmental requirements. Generally, in addition to building solar power plants to generate power, solar panels can also be installed on the roof of buildings to generate power.

At present, the shapes of solar panels installed on the roof of buildings include the traditional flat-shaped and the emerging wave-shaped. Among them, the wave-shaped solar panel has the advantages of improving the building’s efficiency compared with the flat-shaped solar panel. The advantages of integrity and aesthetics, therefore, the use of wave-shaped solar panels on the roof of buildings gradually replaces the traditional use of flat-shaped solar panels.

It is also known that in the production process of solar panels, a number of solar cells are sandwiched between two glass substrates, and the two glass substrates can be adhered to each other with tape to form a solar panel. However, when the traditional automatic gluing device sticks the tape on the substrate of the solar panel, it uses the optical sensor to adjust the position of the gluing wheel of the gluing device so that the gluing wheel can contact the substrate and then stick the tape on On the substrate.

However, the substrate facing the wave-shaped solar panel has a wave-shaped structure. If the traditional optical detector is used to detect the wave-shaped adhesive path around the substrate, and then the adhesive wheel is ordered to walk on the adhesive path for adhesive application, this The detection accuracy of the process and the precision of the glue application are very high; at this time, if the starting point of the wave-shaped substrate placed on the horizontal platform is slightly deviated, it will easily cause the accuracy of the optical sensing of the wave-shaped glue path Deviation, forcing the rubber wheel to stick the tape tightly on the waves On the shaped substrate, or even the bonding between the two wave-shaped glass substrates, defects are prone to occur. Therefore, it is not conducive to the yield rate of the solar panel in the automated glue application, and it needs to be improved.

In view of this, the purpose of the present invention is to solve the problem that the traditional rubber sticking wheel is difficult to stick the tape tightly on the wave-shaped substrate.

To this end, the present invention provides a method for applying glue to a wave-shaped substrate, including the following steps: (1) Place a wave-shaped substrate on a table for positioning, and the wave-shaped substrate is composed of a plurality of arc convex surfaces and a plurality of arc concave surfaces. Staggered and continuously formed, the periphery of the wave-shaped substrate is surrounded by at least two wave-shaped adhesive paths and two linear adhesive paths to form an adhesive track, wherein the at least two wave-shaped adhesive paths have a wave-shaped cross-section Height difference; (2) Provide a glue sticking wheel to roll and contact the wave-shaped substrate along the glue sticking track, and apply glue at the same time; wherein, the rolling contact includes applying an elastic thrust by the glue sticking wheel to roll and press contact The wave-shaped substrate and the glue application wheel absorb the height difference in the wave-shaped glue path through the elastic thrust.

In a further implementation, there is an included angle between the direction of the elastic thrust applied by the glue wheel to the wave-shaped substrate and the horizontal direction when the glue wheel moves along the glue track, and the included angle is greater than 90 degrees and Less than 180 degrees.

The above method can be realized by a device technology. For this reason, a specific embodiment of the present invention is to provide a wavy substrate glue test device, the technical means include: a table with a wavy substrate; The glue head is arranged on a multi-axis transmission mechanism so that the glue head can movably sit on the top of the table for displacement. The glue head is pivoted with a feeding tray and a receiving tray; a glue wheel is pivoted. At the bottom of the glue head, and the interval is located between the feeding tray and the receiving tray, so that the feeding tray, the rubber sticking wheel and the receiving tray are in a triangular distribution shape, and the winding is arranged by the feeding tray An adhesive tape provided by the disc and held by the rubber applicator and collected by the receiving tray; wherein an elastic element capable of applying elastic thrust to the rubber applicator is arranged between the rubber applicator and the glue head.

In a further implementation, a swing arm is pivotally connected to the bottom of the glue head, The glue sticking wheel is pivoted on the swing arm to sit on the bottom of the glue sticking head. The elastic element is arranged between the swing arm and the glue head. The elastic element is a spiral compression spring.

In a further implementation, the multi-axis transmission mechanism is a robotic arm.

According to the above technical means, the advantage of the present invention is that the rubber application wheel rolls and presses against the wave-shaped substrate through the elastic thrust, and the rubber application wheel absorbs the height difference in the wave-shaped adhesive path on the wave-shaped substrate through the elastic thrust. The rubber sticking wheel can stick the tape tightly on the wavy substrate.

Please refer to the following embodiments and drawings for specific implementation details of the technical means of the above-mentioned methods and devices and their performance.

10: Wavy substrate

101: Arc convex surface

102: arc concave

11: Pasting track

111: Wavy glue path

112: Straight glue path

21: Adhesive head

22: feeding tray

221: Feeding drive

23: Receiving tray

231: Receiving Drive

24‧‧‧Glue wheel

25‧‧‧Guide wheel

26‧‧‧Swing arm

27‧‧‧Elastic element

28‧‧‧Glue cutting unit

281‧‧‧Knife Block

282‧‧‧Disc cutter

283‧‧‧th knife drive

284‧‧‧Second Cutter Drive

285‧‧‧Anvil

286‧‧‧stopper

29‧‧‧Heater

30‧‧‧Tape

301‧‧‧Bottom

302‧‧‧cladding

40‧‧‧Countertop

50‧‧‧Multi-axis transmission mechanism

F‧‧‧Elastic thrust

θ‧‧‧Included angle

S1 to S2‧‧‧Example step description

Fig. 1 is a flow chart of the steps of the adhesive application method of the present invention; Figs. 2a to 2f are schematic diagrams of actions for executing the method of Fig. 1 respectively.

Figure 3 is a three-dimensional schematic diagram of the glue applicator of the present invention.

Fig. 4 is a front view of Fig. 3.

Fig. 5 is a rear view of Fig. 3.

Fig. 6 is a top view of Fig. 3.

Fig. 7 is a perspective schematic view of the glue applicator of the present invention being assembled on a multi-axis transmission mechanism.

Please refer to FIG. 1 to illustrate the method for applying glue to a wave-shaped substrate provided by the present invention, including the following steps S1 to S2 in sequence:

Step S1: Place the wavy substrate for positioning.

Please refer to Figures 2a and 2b together to illustrate the positioning of a wave-shaped substrate 10 on a table 40 so that the wave-shaped substrate 10 is in a horizontal state (as shown in Figure 2a). The wave-shaped substrate 10 is composed of a plurality of The arc convex surface 101 and a plurality of arc concave surfaces 102 are formed staggeredly and continuously. The peripheral edge of the wave-shaped substrate 10 is planned to be surrounded by at least two wave-shaped adhesive paths 111 and two linear adhesive paths 112 to form an adhesive track 11 (as shown in FIG. 2b). Furthermore, the at least two wave-shaped glue application paths 111 have a height difference of a wave-shaped section. The so-called wavy section means wavy The wave-shaped glue path 111 on both sides of the substrate 10 is a cut-off surface formed between wave crests and wave troughs.

Step S2: The glue sticking wheel rolls and presses against the substrate to stick glue.

Please refer to FIG. 2c, which illustrates that a glue-applying wheel 24 rolls along the glue-applying track 11 to contact the wave-shaped substrate 10. The glue-applying wheel 24 is wound with an adhesive tape 30, which is a flexible multi-layer adhesive film An object, which includes a bottom layer 301 commonly known as release paper and an adhesive coating 302 attached to the release paper. The tape 30 can roll on the wavy substrate 10 by the adhesive wheel 24 to make the coating 302 Sticking on the wavy substrate 10 is glue. Furthermore, when the glue application wheel 24 rolls and contacts the wave-shaped substrate 10 along the glue application track 11, the glue application wheel 24 exerts an elastic thrust F on the wave-shaped substrate 10, which in addition to driving the glue wheel 24 to roll and press In addition to touching the wave-shaped substrate 10, the adhesive wheel 24 can absorb the height difference in the wave-shaped adhesive path 111 through the elastic thrust F, so that the adhesive wheel 24 can tightly adhere the coating 302 of the tape 30 to the wave-shaped substrate 10 on (as shown in Figure 2d to Figure 2f). Furthermore, there is an angle between the direction of the elastic thrust F exerted by the glue wheel 24 on the wave-shaped substrate 10 and the horizontal direction when the glue wheel 24 moves on the wave-shaped substrate 10 along the glue track 11 θ, the included angle θ is greater than 90 degrees and less than 180 degrees. When the glue application wheel 24 moves along the glue application track 12 on the wave-shaped substrate 10, the wave-shaped substrate 10 will not be displaced by the elastic thrust F.

On the other hand, please refer to FIG. 3, FIG. 4, FIG. 5, and FIG. 6 together to illustrate that the present invention also provides a device for applying a wave-shaped substrate, so that the above-mentioned method of applying a wave-shaped substrate can be easily implemented. From the above, it can be seen that the glue application device for the wave-shaped substrate includes a glue head 21 and a glue wheel 24. among them:

The glue head 21 is movably arranged above a table 40 on which a wave-shaped substrate 10 is placed. The glue head 21 is pivotally provided with a feeding tray 22 and a receiving tray 23. The adhesive tape 30 is arranged around the feeding Between tray 22 and receiving tray 23. Furthermore, the feeding tray 22 is rotated by a feeding drive 221, and the receiving tray 23 is rotated by a receiving drive 231, so that the tape 30 can be driven by the feeding tray 22 and the receiving tray 23. Move from the feeding tray 22 to the receiving tray 23.

The applicator wheel 24 is movably arranged at the bottom of the applicator head 21, and is spaced between the feeding tray 22 and the receiving tray 23, so that the feeding tray 22, the applicating wheel 24 and the receiving tray 23 are distributed in a triangle. In terms of implementation, the tape 30 is wound between the feeding tray 22, the applicator wheel 24, and the receiving tray 23. The adhesive tape 30 is provided by the feeding tray 22 and stretched by the applicator wheel 24 and then received The disc 23 collects and sticks the tape 30 on the wave-shaped substrate 10 via the glue wheel 24. In addition, the glue head 21 is pivotally provided with a plurality of guide wheels 25, the plurality of guide wheels 25 are respectively located between the feeding tray 22, the glue wheel 24 and the receiving tray 23, by guiding The wheel 25 changes the movement path of the tape 30.

A swing arm 26 is arranged at the bottom of the glue head 21. One end of the swing arm 26 is pivoted on the glue head 21. The glue wheel 24 is pivoted on the other end of the swing arm 26 so that the glue wheel 24 can move along Arc path movement. Between the swing arm 26 and the glue head 21 is an elastic element 27 that can apply an elastic thrust F to the glue wheel 24. When the glue wheel 24 moves along an arc path, it can be driven by the elastic element 27 to return to the original position. . The elastic element 27 is implemented as a spiral compression spring.

The glue head 21 is equipped with a glue cutting unit 28 for cutting the coating 302 of the tape 30. The glue cutting unit 28 includes a knife holder 281, a disc-shaped knife 282, a first knife driver 283 and a The second cutter driver 284, wherein the cutter seat 281 is slidably disposed on the glue head 21, and the disc-shaped cutter 282 is pivoted on the cutter seat 281 and is driven to rotate by the first cutter driver 283. The disc-shaped cutter 282 is also driven by the second cutter driver 284 via the knife holder 281 to be displaced. The tape 30 is located on the moving path of the disc-shaped cutter 282, thereby passing through the disc-shaped cutter 282 Move to cut the coating 302 of the tape 30.

The glue cutting unit 28 also includes a knife anvil 285 and a stopper 286. The knife anvils 285 are arranged at intervals on the glue head 21 on one side of the disc-shaped cutter 282. The tape 30 passes through the disc-shaped cutter 282. Between the tape 30 and the anvil 285, the bottom layer 301 of the tape 30 faces the anvil 285, and the coating 302 of the tape 30 faces the disc-shaped cutter 282, so that the tape 30 is supported by the bottom layer 301 of the anvil 285 The coating 302 accepts the cutting of the disc-shaped cutter 282; the stopper 286 is arranged on the feeding tray 22 and the knife anvil 285 on the glue head 21, the tape 30 can be tightly attached to the knife anvil 285 via the stopper 286 and the pulling force exerted by the take-up tray 23 to facilitate disc-shaped cutting The knife 282 cuts the coating 302 of the tape 30.

A heater 29 is arranged on the glue head 21 on one side of the glue wheel 24. The tape 30 passes through the heater 29 and then moves to the glue wheel 24. The heater 29 heats the tape 30 to improve the quality of the tape 30. The adhesiveness of the coating layer 302 enables the coating layer 302 of the tape 30 to be closely adhered to the wave-shaped substrate 10. The heater 29 is implemented as a hot air duct.

Please refer to FIG. 7, which illustrates that the applicator head 21 is configured on a multi-axis transmission mechanism 50 in implementation, so that the applicator head 21 can be movably seated on the table 40 through the drive of the multi-axis transmission mechanism 50 Displacement, so that the adhesive roller 24 sticks the tape 30 on the wave-shaped substrate 10. The multi-axis transmission mechanism 50 is a robotic arm in implementation.

The above examples only express the preferred embodiments of the present invention, but should not be understood as a limitation to the scope of the present invention. Therefore, the present invention should be subject to the claims defined in the scope of the patent application.

S1 to S2‧‧‧Example step description

Claims (7)

A method for applying glue to a wave-shaped substrate includes the following steps: (1) Place a wave-shaped substrate to be positioned on a table. The wave-shaped substrate is formed by a plurality of arc-convex surfaces and a plurality of arc-concave surfaces. The periphery of the at least two wavy glue paths and two linear glue paths are surrounded to form a glue track, and the at least two wavy glue paths have a height difference of a wave-shaped section; (2) A rubber sticking wheel is provided to roll along the sticking track to contact the wave-shaped substrate, and glue sticking at the same time; wherein the sticking wheel is suspended to accept the restraint and drive of a multi-axis transmission mechanism, and is suspended from above to downward The wavy substrate is applied by rolling along the glue application track, and the rolling contact includes applying an elastic thrust by the glue application wheel to roll and press the wavy substrate, and the glue application wheel passes through the elastic The thrust absorbs the height difference in the wave-shaped glue path. According to claim 1, the glue application method of the wave-shaped substrate, wherein the glue application wheel is applied between the direction of elastic thrust applied to the wave-shaped substrate and the horizontal direction when the glue application wheel moves along the glue application track There is an included angle that is greater than 90 degrees and less than 180 degrees. A gluing device for a wave-shaped substrate, comprising: a table placed and positioned with a wave-shaped substrate, the wave-shaped substrate is formed by a plurality of arc-convex surfaces and a plurality of arc-concave surfaces in a staggered and continuous manner; A wavy glue application path and two straight glue application paths are surrounded to form a glue application track. The at least two wavy glue application paths have a height difference of a wave-shaped section; one glue application head is arranged in one glue application track. On the multi-axis transmission mechanism, the glue head can movably sit on the top of the table for displacement. The glue head is pivotally provided with a feeding tray and a receiving tray; a glue wheel, suspended pivotally Stick the bottom of the glue head and sit at intervals Falling between the feeding tray and the receiving tray, so that the feeding tray, the rubber application wheel and the receiving tray are in a triangular distribution form, and the winding is provided by the feeding tray and held by the rubber application wheel An adhesive tape collected by the receiving tray; wherein an elastic element capable of exerting an elastic thrust on the adhesive application wheel is arranged between the adhesive application wheel and the adhesive application head. The glue application track rolls in contact with the wave-shaped substrate for glue application. As described in claim 3, the glue application device for a wave-shaped substrate, wherein the glue application head has a swing arm pivotally connected to the bottom thereof, and the glue application wheel is pivoted on the swing arm to sit on the bottom of the glue application head. According to claim 4, the wavy substrate glue application device, wherein the elastic element is disposed between the swing arm and the glue application head. According to claim 3 or 5, the wavy substrate gluing device, wherein the elastic element is a spiral compression spring. According to claim 3, the wave-shaped substrate glue application device, wherein the multi-axis transmission mechanism is a mechanical arm.

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