Disclosure of Invention
In view of the above, an object of one or more embodiments of the present disclosure is to provide a device for applying butyl tape to a curved photovoltaic module, which solves one or all of the above problems.
The device that applies of curved surface photovoltaic module butyl sticky tape that one or more embodiments of this specification provided based on above-mentioned purpose, including the manipulator, install fixed baseplate on the manipulator, install the blowing subassembly on the fixed baseplate, cutting components is installed to the below of blowing subassembly, cutting components's below is installed and is applied the subassembly, the subassembly that applies is kept away from the recovery subassembly is installed to one side of blowing subassembly.
Optionally, the discharging assembly comprises a first driving motor, and the winding disc is installed at the output end of the first driving motor.
Optionally, the cutting assembly includes first cylinder, the briquetting is installed to the output of first cylinder, the locating wheel is installed to one side of briquetting, the second cylinder is installed to the below of locating wheel, the top movable block is installed to the output of second cylinder, it has the breach to set up one side of movable block to push up, it installs the third cylinder along the perpendicular thereto of horizontal direction in the below of first cylinder, the connecting block is installed to the output of third cylinder, install servo motor along vertical direction on the connecting block, the cutting break wheel is installed to servo motor's output, the cutting break wheel the position with the breach is corresponding.
Optionally, the application assembly comprises an application roller, the application roller is rotatably mounted at the lower part of the fixed substrate, and a hot air pipe is mounted at one side of the application roller.
Optionally, the recovery assembly includes a second driving motor, and the output end of the second driving motor is provided with the recovery disc.
From the above, it can be seen that the device for applying the butyl adhesive tape to the curved photovoltaic module provided by one or more embodiments of the present specification is implemented by using a manipulator instead of manual application, so that the production efficiency is improved, the requirement of rapid production can be met, meanwhile, the manipulator is controlled by a preset program, the positioning is accurate, the pressure control is uniform, the yield of adhesive tape application can be improved, and the production cost of products is further reduced.
Drawings
In order to more clearly illustrate one or more embodiments or prior art solutions of the present specification, the drawings that are needed in the description of the embodiments or prior art will be briefly described below, and it is obvious that the drawings in the following description are only one or more embodiments of the present specification, and that other drawings may be obtained by those skilled in the art without inventive effort from these drawings.
FIG. 1 is a schematic view of a curved photovoltaic module butyl tape application device according to one or more embodiments of the present disclosure;
FIG. 2 is a schematic view of a cutting assembly coupled to an application assembly in accordance with one or more embodiments of the present disclosure;
FIG. 3 is a schematic diagram illustrating the position of a third cylinder and a cutter wheel in accordance with one or more embodiments of the present disclosure;
the device comprises a mechanical arm 1, a fixed substrate 2, a discharging component 3, a cutting component 4, a first air cylinder 41, a pressing block 42, a positioning wheel 43, a second air cylinder 44, a jacking block 45, a notch 46, a third air cylinder 47, a connecting block 48, a servo motor 49, a cutting knife wheel 410, an attaching component 5, an attaching roller 51, a hot air pipe 52, a recycling component 6 and a recycling disc 61.
Detailed Description
To make the objects, technical solutions and advantages of the present disclosure more apparent, the present disclosure is further described in detail below with reference to specific embodiments.
It is to be noted that unless otherwise defined, technical or scientific terms used in one or more embodiments of the present specification should have the ordinary meaning as understood by those of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in one or more embodiments of the specification is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
One or more embodiments of this description have provided a device is applied in subsides of curved surface photovoltaic module butyl sticky tape, as shown in the figure, including manipulator 1, install fixed baseplate 2 on the manipulator 1, install blowing subassembly 3 on the fixed baseplate 2, cutting components 4 are installed to the below of blowing subassembly 3, cutting components 4's below is installed and is applied subassembly 5, it keeps away from to apply subassembly 5 recovery subassembly 6 is installed to one side of blowing subassembly 3.
The three-arch-surface toughened glass is characterized in that a butyl adhesive tape disc-shaped raw material is placed in a material placing assembly 3 and sequentially passes through a cutting assembly 4, a pasting assembly 5 and a recovery assembly 6, the material placing assembly 3 and the recovery assembly 6 work to provide tension for movement of the butyl adhesive tape and fix the three-arch-surface toughened glass, a manipulator 1 drives a fixed substrate 2 to move through a pre-programmed program, and the butyl adhesive tape is sequentially pasted on the toughened glass;
this device is applied by manipulator 1 and is replaced manual subsides and apply, has improved production efficiency, can satisfy the needs of quick production, and simultaneously, manipulator 1 has predetermined program control, and the location is accurate, and pressure control is even, can improve the yield that the sticky tape subsides were applied, and then has reduced the manufacturing cost of product.
In one embodiment, the discharge assembly 3 includes a first drive motor (not shown) having an output end mounted with a take-up tray 31.
In an embodiment, cutting assembly 4 includes first cylinder 41, briquetting 42 is installed to the output of first cylinder 41, locating wheel 43 is installed to one side of briquetting 42, second cylinder 44 is installed to the below of locating wheel 43, top movable block 45 is installed to the output of second cylinder 44, breach 46 has been seted up to one side of top movable block 45, it installs third cylinder 47 along the perpendicular it of horizontal direction in the below of first cylinder 41, connecting block 48 is installed to the output of third cylinder 47, servo motor 49 is installed along vertical direction on the connecting block 48, cutting wheel 410 is installed to servo motor 49's output, cutting wheel 410's position with breach 46 is corresponding.
In one embodiment, the application assembly 5 comprises an application roller 51, the application roller 51 is rotatably mounted at the lower part of the fixed substrate 2, and a hot air pipe 52 is mounted at one side of the application roller 51. Wherein, the hot-blast pipe 52 blows hot air to the butyl tape to heat the butyl tape, so that the butyl tape is easier to be bonded on the toughened glass.
In one embodiment, the recovery assembly 6 includes a second drive motor (not shown) having an output mounted with a recovery tray 61.
The device is also provided with a plurality of rollers for fixing the position of the butyl adhesive tape;
the application method of the application device comprises the following specific steps:
the butyl adhesive tape disc-shaped raw material is placed in the winding disc 31, sequentially passes through the cutting assembly 4 and the applying assembly 5, and is finally wound on the recovery disc 61, and the first driving motor and the second driving motor drive the winding disc 31 and the recovery disc 61 to rotate so as to move the butyl adhesive tape;
when the butyl adhesive tape moves to the application roller 51, the hot air pipe 52 blows hot air to the butyl adhesive tape to heat the butyl adhesive tape, the manipulator 1 executes a preset program to drive the butyl adhesive tape to be applied to the toughened glass, and the release film for peeling the butyl adhesive tape continuously moves and is rolled into the recovery disc 61;
when the butyl adhesive tape passes through the corresponding length and needs to be cut, the first air cylinder 41 drives the pressing block 42 to tightly press the butyl adhesive tape on the positioning wheel 43 to fix the butyl adhesive tape, the coil plate 31 and the recovery plate 61 stop rotating, the second air cylinder 44 drives the jacking block 45 to jack the butyl adhesive tape and tension the butyl adhesive tape, the third air cylinder 47 drives the connecting block 48 to horizontally move perpendicular to the jacking block 45, meanwhile, the cutting knife wheel 410 is driven by the servo motor 49 to rotate at a high speed, the cutting knife wheel 410 cuts off the butyl adhesive tape part without cutting off a release film, after cutting is finished, the first air cylinder 41, the second air cylinder 44 and the third air cylinder 47 return to the original position, and the coil plate 31 and the recovery plate 61 continue to rotate;
according to the application device provided by one or more embodiments of the specification, the manipulator 1 is used for applying instead of manual application, the production efficiency is improved, the requirement for rapid production can be met, meanwhile, the manipulator 1 is controlled by a preset program, the positioning is accurate, the pressure is controlled uniformly, the yield of adhesive tape application can be improved, and the production cost of products is further reduced.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the spirit of the present disclosure, features from the above embodiments or from different embodiments may also be combined, steps may be implemented in any order, and there are many other variations of different aspects of one or more embodiments of the present description as described above, which are not provided in detail for the sake of brevity.
In addition, well-known power/ground connections to Integrated Circuit (IC) chips and other components may or may not be shown in the provided figures, for simplicity of illustration and discussion, and so as not to obscure one or more embodiments of the disclosure. Furthermore, devices may be shown in block diagram form in order to avoid obscuring the understanding of one or more embodiments of the present description, and this also takes into account the fact that specifics with respect to implementation of such block diagram devices are highly dependent upon the platform within which the one or more embodiments of the present description are to be implemented (i.e., specifics should be well within purview of one skilled in the art). Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the disclosure, it should be apparent to one skilled in the art that one or more embodiments of the disclosure can be practiced without, or with variation of, these specific details. Accordingly, the description is to be regarded as illustrative instead of restrictive.
While the present disclosure has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of these embodiments will be apparent to those of ordinary skill in the art in light of the foregoing description. For example, other memory architectures (e.g., dynamic ram (dram)) may use the discussed embodiments.
It is intended that the one or more embodiments of the present specification embrace all such alternatives, modifications and variations as fall within the broad scope of the appended claims. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of one or more embodiments of the present disclosure are intended to be included within the scope of the present disclosure.