CN114472332B - Soaking type photoresist removing, cleaning and drying integrated machine - Google Patents

Soaking type photoresist removing, cleaning and drying integrated machine Download PDF

Info

Publication number
CN114472332B
CN114472332B CN202210072573.XA CN202210072573A CN114472332B CN 114472332 B CN114472332 B CN 114472332B CN 202210072573 A CN202210072573 A CN 202210072573A CN 114472332 B CN114472332 B CN 114472332B
Authority
CN
China
Prior art keywords
drying
cleaning
liquid
hole
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202210072573.XA
Other languages
Chinese (zh)
Other versions
CN114472332A (en
Inventor
杨仕品
赵天翔
周训丙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Zhicheng Semiconductor Technology Co ltd
Original Assignee
Zhicheng Semiconductor Equipment Technology Kunshan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhicheng Semiconductor Equipment Technology Kunshan Co Ltd filed Critical Zhicheng Semiconductor Equipment Technology Kunshan Co Ltd
Priority to CN202210072573.XA priority Critical patent/CN114472332B/en
Publication of CN114472332A publication Critical patent/CN114472332A/en
Application granted granted Critical
Publication of CN114472332B publication Critical patent/CN114472332B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention relates to a soaking type photoresist removing, cleaning and drying integrated machine, which comprises: a body; the soaking and spin-drying component is arranged in the machine body and comprises a bearing tray and a rotating mechanism, wherein a placing groove is formed in the bearing tray, a hook-shaped bracket for clamping materials is arranged in the placing groove, and the materials are placed in the placing groove and fixed through the hook-shaped bracket, so that the soaking and cleaning of the materials are realized; the rotating mechanism is connected with the tray bottom of the bearing tray and drives the bearing tray to rotate so as to complete the spin-drying action; the nozzle assembly is arranged on the machine body and comprises a gas nozzle and a liquid nozzle, the liquid nozzle sequentially adds cleaning liquid and clear water into the bearing tray in the soaking and cleaning process, and the gas nozzle blows air to the bearing tray in the spin-drying process to assist in drying materials. The invention realizes the soaking cleaning, the spin-drying recovery of the cleaning solution and the drying treatment of the wafer in one device, reduces the transfer and the movement of the wafer, prevents the wafer from being damaged and simultaneously improves the cleaning efficiency of the wafer.

Description

Soaking type photoresist removing, cleaning and drying integrated machine
Technical Field
The invention relates to the technical field of wafer processing equipment, in particular to a soaking type photoresist removing, cleaning and drying integrated machine.
Background
The semiconductor industry is the core of modern electronic industry, and in the semiconductor field, the cleanliness of the wafer surface is one of the important factors influencing the reliability of a semiconductor device; the surface of the wafer is easily damaged by dust, metal particles, organic matters and the like, and the use effect of the wafer is affected, so that the removal of the pollutants on the surface of the wafer is an important link in the manufacturing process of the wafer.
In order to achieve the purpose of no pollutant on the surface of the wafer, in the manufacturing process of the wafer, the pollutant attached to the surface of the wafer needs to be removed through multiple times of surface cleaning; in the existing wafer cleaning process, a robot is required to pick a wafer and then convey the wafer to each cleaning process area for cleaning and spin-drying, for example, the patent numbers are as follows: CN212967650U, patent name: a Chinese patent of a wafer cleaning machine can clean wafers, and has a patent number of CN103811290A and a patent name of: the utility model provides a chinese patent of recovery unit is sprayed to liquid, can realize the washing liquid after the wafer washs and spin-dry and collect, and the patent number is: CN213657373U, patent name: the utility model provides a chinese patent of hot nitrogen desiccator can realize the drying process to the wafer after wasing, can know by above-mentioned prior art, and the washing of wafer, washing liquid are retrieved, the drying is accomplished through independent equipment, and the wafer need pass through transport and removal many times, causes the damage of wafer easily, and whole clean, dry process efficiency is lower simultaneously.
Disclosure of Invention
Therefore, the invention aims to solve the technical problems that in the prior art, the wafer is easily damaged due to the fact that the wafer needs to be transferred and moved for multiple times in the wafer cleaning process, and the efficiency of the whole cleaning process is low.
In order to solve the technical problem, the invention provides a soaking type photoresist removing, cleaning and drying integrated machine, which comprises: a body; the soaking and spin-drying component is arranged in the machine body and comprises a bearing tray and a rotating mechanism, wherein a placing groove is formed in the bearing tray, a hook-shaped bracket for clamping materials is arranged in the placing groove, and the materials are placed in the placing groove and fixed through the hook-shaped bracket, so that the materials are soaked and cleaned; the rotating mechanism is connected with the tray bottom of the bearing tray and drives the bearing tray to rotate so as to complete the spin-drying action;
and the nozzle assembly is arranged on the machine body and comprises a gas nozzle and a liquid nozzle, the liquid nozzle sequentially adds cleaning liquid and clear water into the bearing tray in the soaking and cleaning process, and the gas nozzle blows air to the bearing tray in the spin-drying process to assist in drying the materials.
In one embodiment of the invention, a plurality of evenly distributed hole-shaped flow channels are arranged from the inner side to the outer side of the placing groove, the horizontal inclination angles of the inner side and the outer side of the hole-shaped flow channels are 15-30 degrees, a liquid inlet is formed on the inner side, and a liquid outlet is formed on the outer side.
In one embodiment of the invention, a gravity switch is arranged on the hole-shaped flow channel, the gravity switch comprises a blocking block, a connecting rod, a balancing weight and a spring, an inclined cavity is arranged above the hole-shaped flow channel, the inclined direction of the cavity and the hole-shaped flow channel form an included angle of 45 degrees, a concave hole which is consistent with the inclined direction of the cavity is arranged on the outer side wall of the placing groove, the balancing weight is arranged in the concave hole, a connecting hole is arranged between the cavity and the concave hole and is used for matching the connecting rod in the concave hole, the connecting rod is connected with the center of the top surface of the blocking block and the center of the bottom surface of the balancing weight, the connected connecting rod is consistent with the inclined direction of the cavity, and the spring is arranged in the cavity and is positioned at the top of the blocking block; and a ball support is also arranged on the lower side edge of the concave hole.
In one embodiment of the invention, the machine body comprises a box body and a splash-proof cover, wherein a cavity for accommodating the soaking and spin-drying component is arranged in the box body, a feeding hole communicated with the cavity is formed in one side of the box body, and the splash-proof cover is used for blocking the feeding hole;
the splash-proof cover is rotatably arranged on the box body;
the box body is provided with a rotating arm, one end of the rotating arm is rotatably connected to the box body through a pivot, the other end of the rotating arm is connected with the splash-proof cover, and the rotating arm rotates along the pivot to drive the splash-proof cover to be buckled on the feeding opening;
the splash-proof cover is characterized in that a rotary pressing arm is arranged on the box body, one end of the rotary pressing arm is connected to the box body through a pivot, and the other end of the rotary pressing arm can be pressed on the splash-proof cover in a supporting mode.
In one embodiment of the invention, the splash cover is provided with a through hole, and the gas nozzle and the liquid nozzle inject or blow liquid into the bearing tray through the through hole.
In one embodiment of the invention, the nozzle assembly further comprises an air blowing swing arm and a liquid spraying swing arm which are arranged on the box body, the air nozzle is arranged at the end part of the air blowing swing arm, and the liquid nozzle is arranged at the end part of the liquid spraying swing arm;
the splash guard is provided with an arc opening communicated with the through hole, and the extending direction of the arc opening is matched with the swinging direction of the gas nozzle and the liquid nozzle driven by the blowing swing arm and the liquid spraying swing arm.
In an embodiment of the invention, the body is further provided with a homing seat for placing the gas nozzle and the liquid nozzle, and the gas blowing swing arm and the liquid spraying swing arm respectively drive the gas nozzle and the liquid nozzle to be inserted into the homing seat.
In one embodiment of the invention, the bottom of the box body is further provided with a recovery tank, and the bottom of the recovery tank is provided with a recovery port communicated with the cavity.
In an embodiment of the invention, the hook-shaped brackets include an elastic supporting portion and a clamping portion, a plurality of the hook-shaped brackets are arranged in the placing groove, the plurality of the hook-shaped brackets are circumferentially and uniformly distributed on the circumference of a concentric circle, and the plurality of the hook-shaped brackets clamp and fix the material together.
In one embodiment of the invention, a waterproof cover is sleeved outside the rotating mechanism.
In one embodiment of the invention, a lifting mechanism is further arranged below the rotating mechanism.
Compared with the prior art, the technical scheme of the invention has the following advantages:
the soaking type photoresist removing, cleaning and drying integrated machine can realize soaking and cleaning, cleaning fluid spin-drying recovery and wafer drying treatment of wafers in one device, reduces transfer and movement of the wafers, prevents the wafers from being damaged, and improves wafer cleaning efficiency;
the soaking type degumming, cleaning and drying integrated machine is characterized in that a soaking and spin-drying component is arranged in the machine body, a placing groove is formed in a bearing tray, so that a wafer can be soaked in the placing groove, the soaking and cleaning of the wafer are realized, the cleaning time and the cleaning effect of the wafer are improved, a rotating mechanism is arranged to drive the bearing tray to rotate, after the soaking and cleaning are completed, a cleaning solution on the wafer is spin-dried by rotating under the action of centrifugal force, a hook-shaped bracket used for clamping materials is arranged in the placing groove, the wafer is placed in the placing groove and is fixed through the hook-shaped bracket, and the wafer is prevented from rotating in the placing groove or flying out of the placing groove in the spin-drying process;
and a nozzle assembly is arranged outside the machine body, cleaning liquid and clean water are sequentially added into the bearing tray through a liquid nozzle in the soaking and cleaning process, the cleaning liquid and the clean water are respectively added to clean the wafer in multiple steps, auxiliary materials are blown into the bearing tray through a gas nozzle in the spin-drying process to be dried, and the wafer drying efficiency and the wafer drying effect are further improved through the cooperation of rotary spin-drying and gas drying.
Drawings
In order that the present disclosure may be more readily understood, a more particular description of the disclosure will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings
FIG. 1 is a schematic view of the external structure of the soaking type integrated machine for removing photoresist, cleaning and drying of the present invention;
FIG. 2 is a schematic view of the internal structure of embodiment 1 of the present invention;
FIG. 3 is a side view of the load tray of the present invention;
FIG. 4 is a schematic top view of the load-bearing tray of the present invention;
FIG. 5 is a schematic top view of example 2 of the present invention;
FIG. 6 is a schematic top view of example 3 of the present invention;
FIG. 7 is a schematic view of the internal structure of embodiment 4 of the present invention;
FIG. 8 is a schematic view of the internal structure of embodiment 5 of the present invention;
FIG. 9 is a schematic view of the internal structure of embodiment 6 of the present invention;
FIG. 10 is an enlarged view of the structure of FIG. 9 at A;
FIG. 11 is a top exploded view of the ball support;
fig. 12 is a side view structural view of the ball holder.
The specification reference numbers indicate: 1. a body; 11. a box body; 111. a feeding port; 112. a recovery tank; 113. a recovery port; 12. a splash cover; 121. a through hole; 122. an arc-shaped opening; 13. a rotating arm; 14. rotating the press arm; 15. a splash cover limiting block; 2. a carrying tray; 21. a placement groove; 22. a hook-shaped bracket; 23. a circular groove; 241. a liquid inlet; 242. a liquid outlet; 251. a cavity; 252. a balancing weight; 261. a blocking block; 262. a spring; 263. a connecting rod; 264. concave holes; 27. a ball support; 271. a skeleton arrangement frame; 272. a ball bearing; 273. a ball hole; 3. a rotation mechanism; 4. a nozzle assembly; 41. a gas nozzle; 42. a liquid nozzle; 43. a blowing swing arm; 44. a liquid spraying swing arm; 45. a homing seat; 5. a waterproof cover; 6. a lifting mechanism.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
Example 1
Referring to fig. 1 to 4, an immersion type integrated machine for removing photoresist, cleaning and drying of the present embodiment includes: a machine body 1;
the soaking and spin-drying component is arranged in the machine body 1 and comprises a bearing tray 2 and a rotating mechanism 3, wherein a placing groove 21 is formed in the bearing tray 2, a hook-shaped bracket 22 for clamping materials is arranged in the placing groove 21, the materials are placed in the placing groove 21 and fixed through the hook-shaped bracket 22, and soaking and cleaning of the materials are achieved; the rotating mechanism 3 is connected with the bottom of the bearing tray 2, and the rotating mechanism 3 drives the bearing tray 2 to rotate so as to complete the spin-drying action;
the nozzle assembly 4 is arranged on the machine body 1 and comprises a gas nozzle 41 and a liquid nozzle 42, the liquid nozzle 42 sequentially adds cleaning liquid and clear water into the bearing tray 2 in the soaking and cleaning process, and the gas nozzle 41 blows air to the bearing tray 2 in the spin-drying process to assist in drying materials.
In this embodiment, the hook-shaped brackets 22 include an elastic supporting portion and a clamping portion, the placing groove 21 is provided with a plurality of hook-shaped brackets 22, the plurality of hook-shaped brackets 22 are circumferentially and uniformly distributed on the circumference of a concentric circle, the plurality of hook-shaped brackets 22 clamp and fix a material together, a wafer is placed above the plurality of hook-shaped brackets 22 from above the carrying tray 2, the wafer presses the elastic supporting portion to deform the elastic supporting portion outward, and the wafer is clamped and fixed from the periphery of the wafer through the plurality of elastic supporting portions;
specifically, a plurality of concentric circular grooves 23 with the bearing tray 2 as the centre of a circle and different in radius are opened in the placing groove 21, the hook-shaped bracket 22 is arranged in the same circular groove 23, and the hook-shaped bracket 22 is adjusted according to the size of the wafer and is placed in the circular grooves 23 with different radii, so that the clamping of wafers with different sizes is fixed, and the application range of the embodiment is further widened.
The soaking type photoresist removing, cleaning and drying integrated machine can achieve soaking cleaning, cleaning fluid drying and recycling and wafer drying treatment of wafers in one device, transfer and movement of the wafers are reduced, damage to the wafers is prevented, and meanwhile wafer cleaning efficiency is improved;
the soaking type degumming, cleaning and drying integrated machine is characterized in that a soaking and spin-drying component is arranged in a machine body 1, a placing groove 21 is formed in a bearing tray 2, so that a wafer can be soaked in the placing groove 21, soaking and cleaning of the wafer are realized, the cleaning time and the cleaning effect of the wafer are improved, a rotating mechanism 3 is arranged to drive the bearing tray 2 to rotate, after soaking and cleaning are completed, cleaning liquid on the wafer is spin-dried by rotating under the action of centrifugal force, a hook-shaped bracket 22 used for clamping materials is arranged in the placing groove 21, the wafer is placed in the placing groove 21 and is fixed through the hook-shaped bracket 22, and the wafer is prevented from rotating in the placing groove 21 or flying out of the placing groove 21 in the spin-drying process;
and, set up the spray nozzle assembly 4 outside the body 1, add washing liquid and clear water to the bearing tray 2 in proper order through the liquid nozzle 42 in the course of soaking and washing, add washing liquid and clear water respectively and realize the multistep washing to the wafer, blow auxiliary material to the bearing tray 2 in the course of spin-drying through the gas nozzle 41 and dry, rotate and spin-dry and cooperate with the gas to dry, further promote wafer drying efficiency and drying effect.
Example 2
Referring to fig. 5, on the basis of embodiment 1, in order to prevent splashing of the cleaning solution during the cleaning process, the machine body 1 of this embodiment includes a box body 11 and a splash cover 12, a cavity for accommodating the soaking and spin-drying assembly is disposed in the box body 11, a material inlet 111 communicated with the cavity is disposed at one side of the box body 11, a wafer is placed in the box body 11 through the material inlet 111, and the splash cover 12 is used for blocking the material inlet 111 to prevent the cleaning solution from flying out of the material inlet 111 during the spin-drying process;
specifically, splash guard 12 covers establishes bear the periphery of tray 2, at the in-process that the washing liquid was spin-dried, rotary mechanism 3 drives bear the high-speed rotation of tray 2, and the washing liquid on the wafer slides to the wafer edge along the wafer, and the washing liquid splashes from the edge that bears tray 2 and throws away, the edge that bears tray 2 has an ascending inclination in the slant, makes the washing liquid throws away in the slant under the effect of centrifugal force, splashes on splash guard 12 drip through the action of gravity in box 11 on splash guard 12.
Specifically, in order to enable the splash guard 12 to be capable of avoiding the material inlet 111, the splash guard 12 is rotatably disposed on the box body 11, a rotating arm 13 is disposed on the box body 11, one end of the rotating arm 13 is rotatably connected to the box body 11 through a pivot, the other end of the rotating arm 13 is connected to the splash guard 12, and the rotating arm 13 rotates along the pivot to drive the splash guard 12 to be buckled on the material inlet 111;
specifically, the side of swinging boom 13 still be provided with two splashproof lid stopper 15 on the rotation path of swinging boom 13, restrict the swing position of swinging boom 13 through splashproof lid stopper 15, swinging boom 13 swings between two splashproof lid stoppers 15, drives splashproof lid 12 and realizes the action of opening and shutting on pan feeding mouth 111.
Still be provided with rotatory pressure arm 14 on the box 11, the one end of rotatory pressure arm 14 is passed through pivot and is connected on the box 11, the other end of rotatory pressure arm 14 can support and press on the splashproof lid 12, works as when swinging boom 13 drives splashproof lid 12 lock on pan feeding mouth 111, rotates rotatory pressure arm 14, makes rotatory pressure arm 14 support and presses on splashproof lid 12, rotatory pressure arm 14 compresses tightly splashproof lid 12 and fixes on pan feeding mouth 111.
Still seted up through-hole 121 on the splashproof lid 12, gas nozzle 41 and liquid nozzle 42 pass through-hole 121 annotates liquid or blows to bearing tray 2 in, through-hole 121 corresponds sets up in bearing tray 2 top, the diameter of through-hole 121 is greater than gas nozzle 41 and liquid nozzle 42's diameter.
Example 3
Referring to fig. 6, on the basis of embodiment 1, in order to uniformly add the cleaning solution to each position of the wafer and dry each position of the wafer during the cleaning and spin-drying processes, in this embodiment, the nozzle assembly 4 further includes an air blowing swing arm 43 and a liquid spraying swing arm 44 disposed on the box 11, the air nozzle 41 is disposed at an end of the air blowing swing arm 43, the liquid nozzle 42 is disposed at an end of the liquid spraying swing arm 44, and the air nozzle 41 and the liquid nozzle 42 are driven by the air blowing swing arm 43 and the liquid spraying swing arm 44 to move above the carrier tray 2, so as to achieve the effects of adding the cleaning solution to each position of the wafer and drying each position of the wafer.
In order to match the air blowing swing arm 43 and the liquid spraying swing arm 44, an arc opening 122 communicated with the through hole 121 is formed in the splash guard 12, and the extending direction of the arc opening 122 is matched with the swinging direction of the air blowing swing arm 43 and the liquid spraying swing arm 44 which drive the gas nozzle 41 and the liquid nozzle 42, so that the gas nozzle 41 and the liquid nozzle 42 can also penetrate through the splash guard 12 to act on a wafer in the swinging process.
Specifically, the machine body 1 is further provided with a return seat 45 for placing the gas nozzles 41 and the liquid nozzles 42, the return seat includes a gas nozzle return seat and a liquid nozzle return seat, the blowing swing arm 43 and the liquid spraying swing arm 44 respectively drive the gas nozzles 41 and the liquid nozzles 42 to be inserted into the gas nozzle return seat and the liquid nozzle return seat, and the gas nozzles 41 and the liquid nozzles 42 are positioned by the return seat 45, so that the gas nozzles 41 and the liquid nozzles 42 are prevented from influencing the taking and placing actions of the wafers in the box 11.
Example 4
Referring to fig. 7, on the basis of embodiment 1, in order to collect the cleaning liquid and prevent the cleaning liquid from entering the rotating mechanism 3 and affecting the normal operation of the rotating mechanism 3, in this embodiment, a recovery tank 112 is further disposed at the bottom of the tank 11, a recovery port 113 communicated with the cavity is disposed at the bottom of the recovery tank 112, and a recovery tank is connected to the recovery port 113 to recycle the cleaning liquid;
moreover, the waterproof cover 5 is sleeved outside the rotating mechanism 3, the spin-dried cleaning liquid cannot flow into the waterproof cover 5, and the liquid can flow into the recovery tank 112 along the side surface of the waterproof cover 5, so that the rotating mechanism 3 in the waterproof cover 5 is well protected from water.
Example 5
Referring to fig. 8, on the basis of embodiment 1, in order to facilitate the taking and placing of the wafer in the box 11, in this embodiment, a lifting mechanism 6 is further disposed below the rotating mechanism 3, and the lifting mechanism 6 drives the soaking and spin-drying assembly to enter and exit the box 11 from the material inlet 111.
Example 6
Referring to fig. 9 to 12, on the basis of embodiment 1, the edge of the placement groove 21 is improved and adjusted, a plurality of hole-shaped flow channels are uniformly distributed from the inner side to the outer side of the placement groove 21, for example, the number of the hole-shaped flow channels is 4, 6, or 8, and the like, the high horizontal inclination angle and the low horizontal inclination angle in the hole-shaped flow channels are 15 ° to 30 ° to facilitate the outflow of the waste liquid, wherein a liquid inlet 241 is formed on the inner side, and a liquid outlet 242 is formed on the outer side;
specifically, a gravity switch is further disposed on the hole-shaped flow channel, and the gravity switch includes a blocking block 261, a connecting rod 263, a weight 252, and a spring 262, an inclined cavity 251 is disposed above the hole-shaped flow channel, so as to provide a moving space for the blocking block 261, an included angle between the inclined direction of the cavity 251 and the hole-shaped flow channel is 45 °, the outer side wall of the placement groove 21 is provided with a concave hole 264 consistent with the inclined direction of the cavity 251, the weight 252 is disposed in the concave hole 264, a connecting hole is disposed between the cavity 251 and the concave hole 264 and fits the connecting rod 263, the connecting rod 263 connects the top surface center of the blocking block 261 and the bottom surface center of the weight 252, and after connection, the connecting rod 263 is consistent with the inclined direction of the cavity 251, the spring 262 is disposed in the cavity 251 and is disposed at the top of the blocking block 261, and the spring provides a downward extrusion force for the blocking block 261 in the process of moving upward under the action of centrifugal force.
The lower side of shrinkage pool 264 still is provided with ball support 27, ball support 27 is used in linear slide rail, linear bearing mechanical design structure field usually, has the good effect that reduces side frictional force, consequently sets up ball support 27 can be convenient the removal of balancing weight 252.
Because the ball support 27 has various structural possibilities, in order to facilitate understanding of the structure of the ball support 27, the ball support 27 includes a pair of skeletons 271 and a plurality of balls 272, the skeletons 271 are provided with ball holes 273 matched with the balls 272, the balls 272 have protruding portions higher than the skeletons 271 after being installed, and the protruding portions form support and contact with the counterweight 252 in a rolling manner, so as to reduce friction between the counterweight 252 and the concave hole 264, and facilitate sliding of the counterweight 252.
The working actions of the soaking type photoresist removing, cleaning and drying integrated machine are as follows:
1. the rotary pressing arm 14 rotates to move away from the upper part of the splash guard 12, the rotary arm 13 rotates to drive the splash guard 12 to open, the lifting mechanism 6 drives the soaking and spin-drying component to integrally lift, so that the bearing tray 2 extends out of the feeding port 111, a clamping finger manipulator is used for clamping a wafer and placing the wafer on the hook-shaped bracket 22 of the bearing tray 2, and the wafer is clamped and fixed through the hook-shaped bracket 22;
2. the lifting mechanism 6 drives the soaking and spin-drying component to integrally descend, so that the bearing tray 2 drives the wafer to enter the box body 11, the rotating arm 13 rotates to drive the splash cover 12 to be buckled on the feeding opening 111, and the rotating pressing arm 14 rotates to abut against the splash cover 12;
3. the rotating mechanism 3 is started to drive the bearing tray 2 to rotate slowly, the liquid spraying swing arm 44 drives the liquid nozzle 42 to work to spray the wafer, and the wafer is soaked in the bearing tray 2 after the spraying is finished;
4. after soaking, the liquid spraying swing arm 44 drives the liquid nozzle 42 to the homing seat 45, the gear of the rotating mechanism 3 is adjusted to drive the bearing tray 2 to rotate at high speed, the centrifugal force of the liquid is utilized for drying, the air blowing swing arm 43 drives the gas nozzle 41 to work during drying, the wafer is dried, and the dried liquid falls into the recovery tank 112 and is discharged from the recovery port 113; meanwhile, in order to spin-dry the waste liquid better, in the rotating process of the bearing tray 2, the counterweight block 252 helps the blocking block 261 to slide outwards under the action of centrifugal force, the hole-shaped channel is through, unclean waste liquid thrown at the edge of the placing groove 21 can flow away from the hole-shaped channel, and meanwhile, in the wafer soaking process, the closing of the hole-shaped channel does not affect the wafer soaking effect; and then discover because standing groove 21's edge structure reason, originally not notice the influence in little flow field, under the condition that does not set up the hole shape passageway, gas nozzle 41's the process of drying, can not be close unanimous effect of drying with other positions to standing groove 21's corner formation, discover after setting up the hole shape passageway, get rid of most liquid back, further process wafer that weathers also continues rotatoryly, hole shape passageway then is equivalent to a local air current microchannel so, form fluid action cooperation to top-down's air current, the hole shape passageway has also been dried simultaneously, make the effect of drying better, ensure the good state of wafer cleaning drying microenvironment, further promoted the processing technology of washing and drying.
5. After drying, the rotary pressing arm 14 rotates to move away from the upper part of the splash guard 12, the rotary arm 13 rotates to drive the splash guard 12 to open, the lifting mechanism 6 drives the soaking and spin-drying component to integrally lift, so that the bearing tray 2 extends out of the material inlet 111, and the wafer is taken out of the bearing tray 2 by adopting a clamping finger manipulator to finish the cleaning action of the wafer.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. This need not be, nor should it be exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.

Claims (8)

1. The utility model provides a soak formula and remove to glue washing, dry all-in-one which characterized in that includes:
a body;
the soaking and spin-drying component is arranged in the machine body and comprises a bearing tray and a rotating mechanism, wherein a placing groove is formed in the bearing tray, a hook-shaped bracket for clamping materials is arranged in the placing groove, and the materials are placed in the placing groove and fixed through the hook-shaped bracket, so that the materials are soaked and cleaned; the rotating mechanism is connected with the tray bottom of the bearing tray and drives the bearing tray to rotate so as to complete the spin-drying action;
a plurality of hole-shaped flow channels which are uniformly distributed are arranged on the inner side of the placing groove and the outer side of the placing groove, the horizontal inclination angles of the hole-shaped flow channels are 15-30 degrees, a liquid inlet is formed on the inner side, and a liquid outlet is formed on the outer side; the hole-shaped flow channel is provided with a gravity switch, the gravity switch comprises a blocking block, a connecting rod, a balancing weight and a spring, an inclined cavity is arranged above the hole-shaped flow channel, the inclined direction of the cavity and the hole-shaped flow channel form an included angle of 45 degrees, the outer side wall of the placing groove is provided with a concave hole consistent with the inclined direction of the cavity, the balancing weight is arranged in the concave hole, a connecting hole is arranged between the cavity and the concave hole, the connecting rod is matched in the concave hole, the connecting rod is connected with the center of the top surface of the blocking block and the center of the bottom surface of the balancing weight, the connecting rod after connection is consistent with the inclined direction of the cavity, and the spring is arranged in the cavity and positioned at the top of the blocking block; a ball support is arranged on the lower side edge of the concave hole;
and the nozzle assembly is arranged on the machine body and comprises a gas nozzle and a liquid nozzle, the liquid nozzle sequentially adds cleaning liquid and clear water into the bearing tray in the soaking and cleaning process, and the gas nozzle blows air to the bearing tray in the spin-drying process to assist in drying the materials.
2. The immersion type integrated machine for removing photoresist, cleaning and drying as claimed in claim 1, wherein: the machine body comprises a box body and a splash-proof cover, a cavity for accommodating the soaking and spin-drying component is arranged in the box body, a feeding opening communicated with the cavity is formed in one side of the box body, and the splash-proof cover is used for plugging the feeding opening;
the box body is provided with a rotating arm, one end of the rotating arm is rotatably connected to the box body through a pivot, the other end of the rotating arm is connected with the splash-proof cover, and the rotating arm rotates along the pivot to drive the splash-proof cover to be buckled on the feeding opening;
the splash-proof cover is characterized in that a rotary pressing arm is arranged on the box body, one end of the rotary pressing arm is connected to the box body through a pivot, and the other end of the rotary pressing arm can be pressed on the splash-proof cover in a supporting mode.
3. The immersion type integrated machine for removing photoresist, cleaning and drying as claimed in claim 2, characterized in that: the splash-proof cover is provided with a through hole, and the gas nozzle and the liquid nozzle inject or blow liquid into the bearing tray through the through hole.
4. The immersion type integrated machine for removing photoresist, cleaning and drying as claimed in claim 3, characterized in that: the nozzle assembly further comprises an air blowing swing arm and a liquid spraying swing arm which are arranged on the box body, the air nozzle is arranged at the end part of the air blowing swing arm, and the liquid nozzle is arranged at the end part of the liquid spraying swing arm;
the splash guard is provided with an arc opening communicated with the through hole, and the extending direction of the arc opening is matched with the swinging direction of the gas nozzle and the liquid nozzle driven by the blowing swing arm and the liquid spraying swing arm.
5. The immersion type integrated machine for removing photoresist, cleaning and drying as claimed in claim 4, wherein: the machine body is also provided with a homing seat for placing the gas nozzle and the liquid nozzle, and the blowing swing arm and the liquid spraying swing arm respectively drive the gas nozzle and the liquid nozzle to be inserted into the homing seat.
6. The immersion type integrated machine for removing photoresist, cleaning and drying as claimed in claim 2, characterized in that: the bottom of the box body is also provided with a recovery tank, and the bottom of the recovery tank is provided with a recovery port communicated with the cavity.
7. The immersion type integrated machine for removing photoresist, cleaning and drying as claimed in claim 1, wherein: collude the shape bracket and include elastic support portion and joint portion, be provided with a plurality ofly in the standing groove collude the shape bracket, it is a plurality of collude shape bracket circumference evenly distributed on the circumference of concentric circles, it is a plurality of collude the common centre gripping of shape bracket and fix the material.
8. The immersion type integrated machine for removing photoresist, cleaning and drying as claimed in claim 1, wherein: the rotating mechanism is also sleeved with a waterproof cover.
CN202210072573.XA 2022-01-21 2022-01-21 Soaking type photoresist removing, cleaning and drying integrated machine Active CN114472332B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210072573.XA CN114472332B (en) 2022-01-21 2022-01-21 Soaking type photoresist removing, cleaning and drying integrated machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210072573.XA CN114472332B (en) 2022-01-21 2022-01-21 Soaking type photoresist removing, cleaning and drying integrated machine

Publications (2)

Publication Number Publication Date
CN114472332A CN114472332A (en) 2022-05-13
CN114472332B true CN114472332B (en) 2023-03-21

Family

ID=81471777

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210072573.XA Active CN114472332B (en) 2022-01-21 2022-01-21 Soaking type photoresist removing, cleaning and drying integrated machine

Country Status (1)

Country Link
CN (1) CN114472332B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115312436B (en) * 2022-08-12 2023-09-05 苏州智程半导体科技股份有限公司 Automatic wafer belt cleaning device of material loading
CN115360126B (en) * 2022-10-17 2023-03-21 谷微半导体科技(江苏)有限公司 Wafer photoresist removing machine and use method thereof
CN116581068B (en) * 2023-07-13 2023-12-19 北京紫光华天热能动力技术有限公司 Device and method for efficiently removing nano particles from silicon-based material
CN116984292A (en) * 2023-09-28 2023-11-03 哈尔滨岛田大鹏工业股份有限公司 Energy-saving cleaning and drying device
CN117476508B (en) * 2023-12-21 2024-03-15 苏州智程半导体科技股份有限公司 Swing arm device for wafer cleaning

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007036152A (en) * 2005-07-29 2007-02-08 Tokyo Seimitsu Co Ltd Wafer cleaning/drying method and wafer cleaning/drying equipment
CN103506339B (en) * 2012-06-28 2017-04-19 盛美半导体设备（上海）有限公司 Device and method for cleaning reverse side of wafer
CN105289923A (en) * 2014-05-30 2016-02-03 盛美半导体设备（上海）有限公司 Wafer gumming machine and gumming method
JP6728009B2 (en) * 2016-09-26 2020-07-22 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus
CN109107970A (en) * 2018-11-07 2019-01-01 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Wafer cleaner equipment and wafer production line
CN109962028A (en) * 2019-04-18 2019-07-02 上海允哲机电科技有限公司 A kind of Full-automatic and its cleaning process for chip
CN209747469U (en) * 2019-04-25 2019-12-06 东京毅力科创株式会社 Substrate cleaning device
CN113020078A (en) * 2021-03-25 2021-06-25 长江存储科技有限责任公司 Wafer cleaning device and wafer cleaning method

Also Published As

Publication number Publication date
CN114472332A (en) 2022-05-13

Similar Documents

Publication Publication Date Title
CN114472332B (en) Soaking type photoresist removing, cleaning and drying integrated machine
US5829156A (en) Spin dryer apparatus
US4651440A (en) Spin drying apparatus
TWI520795B (en) Substrate cleaning apparatus
US7275553B2 (en) Liquid processing apparatus and liquid processing method
US5778554A (en) Wafer spin dryer and method of drying a wafer
JPH04363022A (en) Cleaning device for wafer mounter
KR20130120410A (en) Substrate processing apparatus
US6494220B1 (en) Apparatus for cleaning a substrate such as a semiconductor wafer
JPH0929189A (en) Cleaner
CN216213290U (en) Wafer cleaning device
CN218639240U (en) Wafer polishing device
JPH09298181A (en) Substrate rear surface washer
JP3774951B2 (en) Wafer cleaning equipment
JP2003017452A (en) Method and apparatus for treating substrate
US20070256632A1 (en) Systems and methods for clamping semiconductor wafers
TW202205415A (en) Substrate liquid processing device andsubstrate liquid processing method
JP4579354B2 (en) Spin processing equipment
CN218191398U (en) Wafer belt cleaning device that cleaning efficiency is high
JP3822996B2 (en) Substrate holding structure for semiconductor manufacturing equipment
JPH07211685A (en) Spinner cleaning equipment
CN218414487U (en) Silicon chip monolithic washs mechanism that spin-dries
JP2564661Y2 (en) Adhesive plate cleaning device
CN216880798U (en) Hardenability thin slice belt cleaning device
JP2006302974A (en) Apparatus for cleaning semiconductor wafer sheet

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Room 3, no.299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd.

Address before: Room 3, no.299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province

Patentee before: Zhicheng semiconductor equipment technology (Kunshan) Co.,Ltd.

CP01 Change in the name or title of a patent holder