CN114460789A - Lens driving device and camera module - Google Patents

Lens driving device and camera module Download PDF

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Publication number
CN114460789A
CN114460789A CN202011201191.XA CN202011201191A CN114460789A CN 114460789 A CN114460789 A CN 114460789A CN 202011201191 A CN202011201191 A CN 202011201191A CN 114460789 A CN114460789 A CN 114460789A
Authority
CN
China
Prior art keywords
fixed
base member
wiring board
movable
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011201191.XA
Other languages
Chinese (zh)
Inventor
长田宽志
王长兴
何瑛勇
李邓峰
王亚可
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Alps Alpine Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd, Alps Electric Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to CN202011201191.XA priority Critical patent/CN114460789A/en
Priority to JP2021178848A priority patent/JP2022074135A/en
Publication of CN114460789A publication Critical patent/CN114460789A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B5/00Adjustment of optical system relative to image or object surface other than for focusing
    • G03B5/02Lateral adjustment of lens
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/64Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
    • G02B27/646Imaging systems using optical elements for stabilisation of the lateral and angular position of the image compensating for small deviations, e.g. due to vibration or shake
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/09Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2205/00Adjustment of optical system relative to image or object surface other than for focusing
    • G03B2205/0053Driving means for the movement of one or more optical element
    • G03B2205/0076Driving means for the movement of one or more optical element using shape memory alloys

Abstract

The invention provides a lens driving device and a camera module, which can more reliably prevent the position deviation of a metal part when the metal part is installed on a base part. The lens driving device (101) is provided with a base member (18), a lens holding member (2) supported so as to be movable relative to the base member, a fixed-side metal member (5F) attached to the base member, and a shape memory alloy wire (SA) having one end fixedly adhered to the fixed-side metal member and configured to contract in response to a temperature increase to move the lens holding member. The base member has a projection (18V), and the fixing-side metal member has a through hole (RH). The fixed-side metal member is attached to the base member with the protrusion fitted in the through hole, and is fixed to the base member by a photocurable adhesive (EA) disposed from the surface around the through hole to the outer surface of the protrusion.

Description

Lens driving device and camera module
Technical Field
The present disclosure relates to a lens driving apparatus.
Background
Conventionally, a lens driving device using two shape memory alloy wires is known (see patent document 1). In the lens driving device, the respective end portions of the two shape memory alloy wires are fixed to a single metal member. That is, four metal members are used to attach two shape memory alloy wires to the base member. Two metal members are attached to a protrusion provided at one of the four corners of the rectangular frame-shaped base member, and the remaining two metal members are attached to another protrusion provided at the other of the four corners of the rectangular frame-shaped base member. Each metal member is attached to the base member by heat caulking a part of the base member.
Documents of the prior art
Patent document
Patent document 1: U.S. patent application publication No. 2010/0074607 specification
Disclosure of Invention
Problems to be solved by the invention
However, there is a fear that the shape memory alloy wire fixed to the metal member is contracted by heat at the time of the heat caulking. Further, the metal member may be displaced when the metal member is attached to the base member due to the contraction of the shape memory alloy wire.
Therefore, it is desirable to provide a lens driving device capable of more reliably preventing the positional displacement of the metal member when the metal member is attached to the base member.
Means for solving the problems
A lens driving device according to an embodiment of the present invention includes: a base member as a fixed-side member; a lens holding member as a movable-side member supported to be movable relative to the base member; a wiring board mounted to the base member; and a shape memory actuator having one end fixed to the terminal plate and configured to move the lens holding member by contracting in response to a temperature increase, wherein the base member has a protrusion, the terminal plate has a through hole, the terminal plate is attached to the base member in a state in which the protrusion is fitted into the through hole, and the terminal plate is fixed to the base member by a light-curable adhesive disposed from a peripheral surface of the through hole to an outer surface of the protrusion.
Effects of the invention
The lens driving device can more reliably prevent the position of the metal member from being shifted when the metal member is mounted on the base member.
Drawings
Fig. 1 is a perspective view of a lens driving device.
Fig. 2 is an exploded perspective view of the lens driving device.
Fig. 3 is a perspective view of a metal member connected to the lens holding member and the base member, respectively.
Fig. 4 is a view of a metal member with a shape memory alloy wire attached.
Fig. 5 is a perspective view of the base member.
Fig. 6 is a diagram showing the positional relationship of the plate spring, the shape memory alloy wire, the metal member, and the conductive member.
Fig. 7 is a diagram showing an example of a path of a current flowing through the shape memory alloy wire.
Fig. 8 is a view showing an example of a connection structure for connecting a fixed-side metal member and a conductive member.
Fig. 9 is a perspective view of another example of the base member.
Fig. 10 is a perspective view of another example of the lens holding member.
Fig. 11 is a diagram showing another example of the positional relationship of the plate spring, the shape memory alloy wire, the metal member, and the conductive member.
Fig. 12 is a diagram showing another example of a path of a current flowing through the shape memory alloy wire.
Fig. 13 is a view showing another example of a connection structure for connecting a fixed-side metal member and a conductive member.
Fig. 14 is a view showing another example of a connection structure for connecting a fixed-side metal member and a conductive member.
Fig. 15 is a view showing still another example of a connection structure for connecting a fixed-side metal member and a conductive member.
Fig. 16 is a diagram showing an example of a connection structure of a metal member.
Fig. 17 is a view showing an example of a connection structure for connecting the fixed-side metal member and the base member.
Fig. 18 is a view showing an example of a connection structure for connecting the fixed-side metal member and the base member.
Detailed Description
Hereinafter, a lens driving device 101 according to an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view of a lens driving device 101. Specifically, fig. 1(a) is an upper perspective view of the lens driving device 101, and fig. 1(B) is a lower perspective view of the lens driving device 101. Fig. 2 is an exploded perspective view of the lens driving device 101.
In fig. 1 and 2, X1 represents one direction of the X axis constituting the three-dimensional orthogonal coordinate system, and X2 represents the other direction of the X axis. Y1 represents one direction of the Y axis constituting the three-dimensional orthogonal coordinate system, and Y2 represents the other direction of the Y axis. Similarly, Z1 represents one direction of the Z axis constituting the three-dimensional orthogonal coordinate system, and Z2 represents the other direction of the Z axis. In fig. 1 and 2, the X1 side of the lens driving device 101 corresponds to the front side (front side) of the lens driving device 101, and the X2 side of the lens driving device 101 corresponds to the rear side (rear side) of the lens driving device 101. Further, Y1 of the lens driving device 101 corresponds to the right side of the side lens driving device 101, and the Y2 side of the lens driving device 101 corresponds to the left side of the lens driving device 101. The Z1 side of the lens driving device 101 corresponds to the upper side (object side) of the lens driving device 101, and the Z2 side of the lens driving device 101 corresponds to the lower side (image pickup device side) of the lens driving device 101. The same applies to other figures.
As shown in fig. 1 and 2, the lens driving device 101 includes a cover member 4 as a part of the fixed-side member RG. The cover member 4 includes an upper cover member 4U and a lower cover member 4L.
The cover member 4 is configured to function as a housing for covering the respective members. In the present embodiment, the cover member 4 is formed of a nonmagnetic metal. However, the cover member 4 may be formed of a magnetic metal. As shown in fig. 1, the cover member 4 has a box-like outer shape defining the housing portion 4 s.
The upper cover member 4U has a rectangular tubular first outer peripheral wall portion 4A and a rectangular annular flat plate-like top plate portion 4B continuous with the upper end (end on the Z1 side) of the first outer peripheral wall portion 4A. A circular opening 4k is formed in the center of the top plate 4B. The first outer peripheral wall portion 4A includes the first side plate portion 4A1 to the fourth side plate portion 4A 4. The first side panel portion 4a1 and the third side panel portion 4A3 face each other, and the second side panel portion 4a2 and the fourth side panel portion 4a4 face each other. The first side panel portion 4a1 and the third side panel portion 4A3 extend perpendicularly to the second side panel portion 4a2 and the fourth side panel portion 4a 4.
Similarly, the lower cover member 4L includes a second peripheral wall portion 4C having a rectangular tubular shape and a bottom plate portion 4D having a rectangular annular flat plate shape and provided continuously to a lower end (end on the Z2 side) of the second peripheral wall portion 4C. A circular opening 4m is formed in the center of the bottom plate 4D. The second peripheral wall portion 4C includes first to fourth side plate portions 4C1 to 4C 4. The first side panel portion 4C1 and the third side panel portion 4C3 face each other, and the second side panel portion 4C2 and the fourth side panel portion 4C4 face each other. The first side panel portion 4C1 and the third side panel portion 4C3 extend perpendicularly to the second side panel portion 4C2 and the fourth side panel portion 4C 4.
As shown in fig. 1, the upper cover member 4U is bonded to the lower cover member 4L with an adhesive. The second outer peripheral wall portion 4C is disposed so as to partially cover the first outer peripheral wall portion 4A.
As shown in fig. 2, the spacer member 1, the lens holding member 2, the metal member 5, the plate spring 6, the base member 18, the shape memory alloy wire SA, and the like are housed in the cover member 4.
The movable member MB includes a lens holding member 2 capable of holding a lens body (not shown), a shape memory alloy wire SA as a driving mechanism MK for moving the lens holding member 2 along an optical axis JD of the lens body, and a plate spring 6 for supporting the lens holding member 2 so as to be movable along the optical axis JD. The lens body is, for example, a cylindrical lens barrel including at least 1 lens, and the central axis thereof is configured to be along the optical axis JD.
The spacer member 1 is arranged to prevent the lens holding member 2 made of synthetic resin from colliding with the cover member 4 made of metal when the lens holding member 2 is moved in the Z1 direction. That is, the spacer member 1 is formed of synthetic resin and is disposed so as to form a space between the lens holding member 2 and the top plate portion 4B of the cover member 4. The spacer member 1 is fixed to the upper cover member 4U by an adhesive. Specifically, the spacer member 1 and the lens holding member 2 constitute a stopper mechanism that restricts excessive movement of the lens holding member 2 in the Z1 direction (upward). In the present embodiment, the lens holding member 2 is configured to contact the spacer member 1 when moved only a predetermined distance in the Z1 direction. With this configuration, the spacer member 1 can prevent the lens holding member 2 made of synthetic resin from coming into contact with the upper side cover member 4U made of metal, and can prevent the lens holding member 2 from being worn due to such contact. However, if a space can be formed between the lens holding member 2 and the top plate portion 4B of the upper cover member 4U by another structure or the like, the spacer member 1 may be omitted.
The lens holding member 2 is formed by injection molding a synthetic resin such as a Liquid Crystal Polymer (LCP). Specifically, as shown in fig. 2, the lens holding member 2 includes a cylindrical portion 12 formed to extend along the optical axis JD, a movable-side mount portion 2D formed to protrude radially outward from the cylindrical portion 12, and a protruding portion 2S. In the present embodiment, a screw groove is formed on the inner peripheral surface of the cylindrical portion 12 to screw the lens body. The lens body may be fixed to the inner peripheral surface of the cylindrical portion 12 with an adhesive. In this case, the thread groove may not be formed on the inner peripheral surface of the cylindrical portion 12.
The movable-side mount 2D includes a first movable-side mount 2D1 and a second movable- side mount 2D 2. The first movable-side mount 2D1 and the second movable-side mount 2D2 are arranged to extend in opposite directions with respect to the optical axis JD. Similarly, the projection portion 2S includes a first projection portion 2S1 and a second projection portion 2S 2. The first projection portions 2S1 and the second projection portions 2S2 are arranged to extend in opposite directions with respect to the optical axis JD. Specifically, the movable-side base 2D and the projecting portions 2S are arranged so as to correspond to the four corners of the lens holding member 2 and are alternately arranged, and the lens holding member 2 has a substantially rectangular outer shape in a plan view. Then, a part of the plate spring 6 is placed on each of the two movable-side bed portions 2D.
The drive mechanism MK includes a shape memory alloy wire SA as an example of a shape memory actuator. In the present embodiment, the shape memory alloy wires SA include first to eighth wires SA1 to SA 8. The shape memory alloy wire SA increases in temperature when a current flows therethrough, and contracts in accordance with the increase in temperature. The driving mechanism MK can move the lens holding member 2 up and down along the optical axis JD by contraction of the shape memory alloy wire SA. Further, the shape memory alloy wire SA is configured such that when one or more of the first wire SA1 to the eighth wire SA8 contracts, the lens holding member 2 moves, and by this movement, the other one or more of the first wire SA1 to the eighth wire SA8 is stretched.
The plate spring 6 is configured to support the lens holding member 2 movably in a direction parallel to the optical axis JD with respect to the fixed-side member RG (base member 18). In the present embodiment, the plate spring 6 is made of a metal plate mainly made of copper alloy, titanium copper alloy (titanium copper), copper nickel alloy (nickel tin copper), or the like, for example. Specifically, the leaf spring 6 includes a first leaf spring 6A and a second leaf spring 6B.
The base member 18 is formed by injection molding using a synthetic resin such as Liquid Crystal Polymer (LCP). In the present embodiment, the base member 18 has a substantially rectangular outline in plan view as shown in fig. 5(a), and has an opening 18K at the center. Specifically, the base member 18 includes four side portions 18E (a first side portion 18E1 to a fourth side portion 18E4) arranged so as to surround the opening 18K.
The plate spring 6 is configured to connect the movable-side mount 2D formed on the lens holding member 2 and the fixed-side mount 18D formed on the base member 18. The fixed-side mount 18D includes a first fixed-side mount 18D1 and a second fixed- side mount 18D 2.
More specifically, the first plate spring 6A is configured to connect the first movable-side mount 2D1 formed on the lens holding member 2 to the first fixed-side mount 18D1 and the second fixed-side mount 18D2 formed on the base member 18, respectively. Similarly, the second plate spring 6B is configured to connect the second movable-side mount 2D2 formed on the lens holding member 2 to the first fixed-side mount 18D1 and the second fixed-side mount 18D2 formed on the base member 18, respectively.
The metal member 5 is configured to fix an end of the shape memory alloy wire SA. In the present embodiment, the metal member 5 includes a fixed-side metal member 5F and a movable-side metal member 5M. The fixed-side metal member 5F is configured to be fixed to a fixed-side seat portion 18D of the base member 18. The movable-side metal member 5M is fixed to the movable-side base 2D of the lens holding member 2.
More specifically, the fixed-side metal member 5F is also referred to as a fixed-side wiring board, and includes first to eighth fixed-side wiring boards 5F1 to 5F 8. The movable-side metal member 5M is also referred to as a movable-side terminal plate, and includes a first movable-side terminal plate 5M1 to a fourth movable-side terminal plate 5M 4.
Next, the positional relationship between the lens holding member 2 and the base member 18 and the metal member 5 will be described with reference to fig. 3. Fig. 3 a is a perspective view of the lens holding member 2 to which the movable-side metal member 5M (movable-side wiring board) and the plate spring 6 are attached. Fig. 3B is a perspective view of the base member 18 to which the fixed-side metal member 5F (fixed-side wiring board) is attached. For clarity, in fig. 3(a), the movable-side metal member 5M and the plate spring 6 are dotted, and in fig. 3(B), the fixed-side metal member 5F is dotted.
In the example shown in fig. 3 a, the first movable side wire connecting plate 5M1 is fixed to the side wall (right side attachment surface) of the first movable side mount section 2D1 on the Y1 side. Specifically, the first movable-side wire plate 5M1 is fixed to the first movable-side mount 2D1 with an adhesive in a state where a square protrusion 2V formed on the first movable-side mount 2D1 and protruding outward (Y1 side) is engaged with a rectangular hole AH (see fig. 4 a) formed in the first movable-side wire plate 5M 1. The adhesive is, for example, a photocurable adhesive. The photocurable adhesive is, for example, an ultraviolet curable adhesive or a visible light curable adhesive. Similarly, the second movable-side wiring board 5M2 is fixed to the side wall (rear attachment surface) on the X2 side of the first movable-side seating section 2D1, the third movable-side wiring board 5M3 is fixed to the side wall (front attachment surface) on the X1 side of the second movable-side seating section 2D2, and the fourth movable-side wiring board 5M4 is fixed to the side wall (left attachment surface) on the Y2 side of the second movable-side seating section 2D 2.
In the example shown in fig. 3B, the first fixing-side line plate 5F1 and the second fixing-side line plate 5F2 are fixed to the side wall (right attachment surface) on the Y1 side of the first fixing-side stand portion 18D1 arranged along the second side portion 18E2 of the base member 18. Specifically, the first fixing-side terminal plate 5F1 and the second fixing-side terminal plate 5F2 are fixed to the first fixing-side base 18D1 with an adhesive in a state where two circular protrusions 18V formed on the first fixing-side base 18D1 and protruding outward (Y1 side) are engaged with through holes RH (see fig. 4 a) formed in the first fixing-side terminal plate 5F1 and the second fixing-side terminal plate 5F2, respectively. The adhesive is, for example, a photocurable adhesive. The photocurable adhesive is, for example, an ultraviolet curable adhesive or a visible light curable adhesive. Similarly, the third fixing-side terminal plate 5F3 and the fourth fixing-side terminal plate 5F4 (not visible in fig. 3B) are fixed to the side wall (rear mounting surface) on the X2 side of the second fixing-side base portion 18D2 arranged along the third side portion 18E3 of the base member 18. The fifth fixing-side terminal plate 5F5 and the sixth fixing-side terminal plate 5F6 are fixed to the side wall (front mounting surface) on the X1 side of the first fixing-side base portion 18D1 arranged along the first side portion 18E1 of the base member 18. The seventh fixing-side terminal plate 5F7 and the eighth fixing-side terminal plate 5F8 (not visible in fig. 3B) are fixed to the side wall (left side attachment surface) on the Y2 side of the second fixing-side base portion 18D2 arranged along the fourth side portion 18E4 of the base member 18.
The shape memory alloy wire SA extends along the inner surface of the first outer peripheral wall portion 4A of the upper cover member 4U, and is configured to be capable of supporting the movable-side member MB so as to be movable relative to the fixed-side member RG. In the present embodiment, shape memory alloy wire SA includes first wire SA1 to eighth wire SA8, and is configured to be able to support lens holding member 2 as movable-side member MB so as to be movable relative to base member 18 as fixed-side member RG. As shown in fig. 2, the first to eighth wires SA1 to SA8 are each fixedly secured at one end to the fixed-side metal member 5F by crimping, welding, or the like, and at the other end to the movable-side metal member 5M by crimping, welding, or the like.
Next, the metal member 5 to which the shape memory alloy wire SA is attached will be described with reference to fig. 4. Fig. 4(a) is a view of the first cord SA1 attached to the first movable-side cord plate 5M1 and the first fixed-side cord plate 5F1, respectively, and the second cord SA2 attached to the first movable-side cord plate 5M1 and the second fixed-side cord plate 5F2, respectively, as viewed from the side Y1. Fig. 4(B) is a view of the first wire SA1 attached to the first movable-side wire strap 5M1 and the first fixed-side wire strap 5F1, respectively, and the second wire SA2 attached to the first movable-side wire strap 5M1 and the second fixed-side wire strap 5F2, respectively, as viewed from the X1 side. The positional relationship of the respective members shown in fig. 4(a) and 4(B) corresponds to the positional relationship when the lens driving device 101 is assembled. In fig. 4(a) and 4(B), the illustration of other components is omitted for clarity. The following description with reference to fig. 4(a) and 4(B) relates to the combination of the first line SA1 and the second line SA2, but the present invention is also applicable to the combination of the third line SA3 and the fourth line SA4, the combination of the fifth line SA5 and the sixth line SA6, and the combination of the seventh line SA7 and the eighth line SA 8.
Specifically, one end of the first wire SA1 is fixed to the first movable-side connector plate 5M1 at the position of the holding portion J3 on the lower side of the first movable-side connector plate 5M1, and the other end of the first wire SA1 is fixed to the first fixed-side connector plate 5F1 at the position of the holding portion J2 of the first fixed-side connector plate 5F 1. Similarly, one end of the second wire SA2 is fixed to the first movable-side wire plate 5M1 at the position of the holding portion J1 on the upper side of the first movable-side wire plate 5M1, and the other end of the second wire SA2 is fixed to the second fixed-side wire plate 5F2 at the position of the holding portion J4 of the second fixed-side wire plate 5F 2.
The holding portion J1 is formed by bending a part of the first movable side connection plate 5M 1. Specifically, a part of the first movable side connection plate 5M1 is bent in a state of sandwiching one end of the second wire SA2, and a holding portion J1 is formed. Further, one end of the second wire SA2 is fixed to the holding portion J1 by welding. The same applies to the holding portions J2 to J4.
As shown in fig. 4(a), the first wire SA1 and the second wire SA2 are arranged so as to be twisted with each other. That is, the first line SA1 and the second line SA2 are arranged so as not to contact each other (non-contact).
Next, with reference to fig. 5, base member 18 as a part of stationary-side member RG will be described in detail. Fig. 5 is a perspective view of the base member 18. Specifically, fig. 5(a) is a perspective view of the base member 18 with the conductive member CM removed, fig. 5(B) is a perspective view of the conductive member CM embedded in the base member 18, and fig. 5(C) is a perspective view of the base member 18 with the conductive member CM embedded. In fig. 5(B) and 5(C), the conductive member CM is indicated with a dot pattern for clarity.
The base member 18 is configured to function as a wire support member that supports one end of each of the first to eighth wires SA1 to SA 8. With this configuration, the movable member MB is supported by the first to eighth lines SA1 to SA8 so as to be movable in the Z-axis direction, which is a direction parallel to the optical axis JD.
A fixed-side pedestal portion 18D is formed on an upper surface of the base member 18 on the subject side (surface on the Z1 side). The fixed-side mount 18D includes a first fixed-side mount 18D1 and a second fixed- side mount 18D 2. The first fixed-side mount 18D1 and the second fixed-side mount 18D2 are disposed so as to face each other with the optical axis JD interposed therebetween.
The conductive member CM formed of a metal plate made of a material such as copper, iron, or an alloy containing these as a main component, as shown in fig. 5(B), is embedded in the base member 18 by insert molding. In the present embodiment, the conductive member CM is configured to have first to eleventh terminal portions TM1 to TM11 protruding from the lower surface (surface on the Z2 side) of the base member 18 and extending downward (in the Z2 direction), and a ninth engagement surface portion CP9 and a tenth engagement surface portion CP10 exposed on the upper surface (surface on the Z1 side) of the base member 18.
Specifically, the conductive members CM include first to eleventh conductive members CM1 to CM 11. Further, the first conductive member CM1 includes a first terminal portion TM1 and a first connection portion ED 1. The second conductive member CM2 includes a second terminal portion TM2 and a second connection portion ED 2. The third conductive member CM3 includes a third terminal portion TM3 and a third connection portion ED 3. The fourth conductive member CM4 includes a fourth terminal portion TM4 and a fourth connection portion ED 4. The fifth conductive member CM5 includes a fifth terminal portion TM5 and a fifth connection portion ED 5. The sixth conductive member CM6 includes a sixth terminal portion TM6 and a sixth connecting portion ED 6. The seventh conductive member CM7 includes a seventh terminal portion TM7 and a seventh connection portion ED 7. The eighth conductive member CM8 includes an eighth terminal portion TM8 and an eighth connecting portion ED 8. The ninth conductive member CM9 includes a ninth terminal portion TM9 and a ninth engaging face portion CP 9. The tenth conductive member CM10 includes a tenth terminal portion TM10 and a tenth engagement face portion CP 10. The eleventh conductive member CM11 includes an eleventh terminal portion TM11 and an eleventh connection portion ED 11.
The first to fourth terminal portions TM1 to TM4, the tenth terminal portion TM10, and the eleventh terminal portion TM11 are arranged along the third side portion 18E3 of the base member 18. The fifth terminal portion TM5 to the ninth terminal portion TM9 are arranged along the first side portion 18E1 of the base member 18.
That is, the first connection portion ED1 of the first conductive member CM1 is disposed along the second side portion 18E2 of the base member 18, and the first terminal portion TM1 of the first conductive member CM1 is disposed along the third side portion 18E3 of the base member 18 instead of the second side portion 18E 2. Similarly, the second connection portion ED2 of the second conductive member CM2 is disposed along the second side portion 18E2 of the base member 18, and the second terminal portion TM2 of the second conductive member CM2 is disposed along the third side portion 18E3 of the base member 18 instead of the second side portion 18E 2.
In addition, the seventh connecting portion ED7 of the seventh conductive member CM7 is disposed along the fourth side portion 18E4 of the base member 18, and the seventh terminal portion TM7 of the seventh conductive member CM7 is disposed along the first side portion 18E1 of the base member 18 instead of the fourth side portion 18E 4. Similarly, the eighth connecting portion ED8 of the eighth conductive member CM8 is disposed along the fourth side portion 18E4 of the base member 18, and the eighth terminal portion TM8 of the eighth conductive member CM8 is disposed along the first side portion 18E1 of the base member 18 instead of the fourth side portion 18E 4.
In this manner, the first to eleventh terminal portions TM1 to TM11 are disposed along the first side portion 18E1 or the third side portion 18E3 of the base member 18, and are not disposed along the second side portion 18E2 and the fourth side portion 18E4 of the base member 18.
Next, the positional relationship among the leaf spring 6, the shape memory alloy wire SA, the metal member 5, and the conductive member CM will be described with reference to fig. 6. Fig. 6 is a diagram showing a positional relationship among the plate spring 6, the shape memory alloy wire SA, the metal member 5, and the conductive member CM. Specifically, fig. 6(a) is a perspective view of the respective members (the plate spring 6, the shape memory alloy wire SA, the metal member 5, and the conductive member CM), and fig. 6(B) is a plan view of the respective members. In fig. 6(B), the shape memory alloy wire SA and the conductive member CM are not shown for clarity. In fig. 6(B), the leaf spring 6 is marked with a dot pattern.
As shown in fig. 6(B), the leaf spring 6 includes a first leaf spring 6A and a second leaf spring 6B. The first leaf spring 6A has a first portion 6A1 fixed to the first fixed-side mount 18D1 (see fig. 2) of the base member 18, a second portion 6A2 fixed to the second fixed-side mount 18D2 (see fig. 2) of the base member 18, a third portion 6A3 fixed to the first movable-side mount 2D1 (see fig. 2) of the lens holding member 2, a fourth portion 6A4 connecting the first portion 6A1 and the third portion 6A3, and a fifth portion 6A5 connecting the second portion 6A2 and the third portion 6A 3.
The first portion 6a1 is formed with a first through hole 6AH1 and a second through hole 6AH2 through which a circular projecting portion 18T (see fig. 3B) projecting upward is inserted, and the projecting portion 18T is formed in the first fixed-side pedestal portion 18D 1. In the present embodiment, the plate spring 6 and the protruding portion 18T are fixed by hot caulking or cold caulking the protruding portion 18T. However, the plate spring 6 and the projection 18T may be fixed by an adhesive.
The second portion 6a2 is formed with a third through hole 6AH3 through which a circular protruding portion 18T (see fig. 3B) protruding upward is inserted, and a fourth through hole 6AH4 for engagement with a tenth engagement surface CP10 (see fig. 5C) of the tenth conductive member CM10, and the protruding portion 18T is formed in the second fixed mount 18D 2. In the present embodiment, the plate spring 6 and the conductive member CM are joined by welding such as laser welding. However, the plate spring 6 and the conductive member CM may be joined by solder, a conductive adhesive, or the like.
The third portion 6a3 is formed with a fifth through hole 6AH5 and a sixth through hole 6AH6 through which a circular projecting portion 2T (see fig. 3 a) projecting upward is inserted, and the projecting portion 2T is formed in the first movable- side mount 2D 1. In the present embodiment, the plate spring 6 and the protruding portion 2T are fixed by hot caulking or cold caulking the protruding portion 2T. However, the plate spring 6 may be fixed to the projection 2T by an adhesive.
Similarly, the second plate spring 6B has a first portion 6B1 fixed to the first fixed side mount 18D1 (see fig. 2) of the base member 18, a second portion 6B2 fixed to the second fixed side mount 18D2 (see fig. 2) of the base member 18, a third portion 6B3 fixed to the second movable side mount 2D2 (see fig. 2) of the lens holding member 2, a fourth portion 6B4 connecting the first portion 6B1 and the third portion 6B3, and a fifth portion 6B5 connecting the second portion 6B2 and the third portion 6B 3.
The first portion 6B1 is formed with a first through hole 6BH1 through which a circular protruding portion 18T (see fig. 3B) protruding upward is inserted, and a second through hole 6BH2 for engagement with a ninth engagement surface portion CP9 (see fig. 5C) of the ninth conductive member CM9, and the protruding portion 18T is formed in the first fixed-side pedestal portion 18D 1.
The second portion 6B2 is formed with a third through hole 6BH3 and a fourth through hole 6BH4 through which a circular protruding portion 18T (see fig. 3B) protruding upward is inserted, and the protruding portion 18T is formed in the second fixed-side pedestal portion 18D 2.
The third portion 6B3 is formed with a fifth through hole 6BH5 and a sixth through hole 6BH6 through which a circular protruding portion 2T (see fig. 3 a) protruding upward is inserted, and the protruding portion 2T is formed in the second movable-side pedestal portion 2D 2.
The fourth and fifth portions 6A4 and 6A5 of the first plate spring 6A and the fourth and fifth portions 6B4 and 6B5 of the second plate spring 6B are elastically deformable arm portions having a plurality of bent portions. Therefore, the lens holding member 2 is movable with respect to the base member 18 (fixed-side member RG) not only in a direction parallel to the optical axis JD but also in a direction intersecting the optical axis JD.
As shown in fig. 6(B), the first leaf spring 6A and the second leaf spring 6B have substantially the same shape. Specifically, the first plate spring 6A and the second plate spring 6B are configured to be rotationally symmetric twice about the optical axis JD (rotational symmetry with a minimum rotation angle of 180 °). Therefore, this configuration can reduce the number of components of the lens driving device 101. Further, the first plate spring 6A and the second plate spring 6B can support the lens holding member 2 in the air with good balance. Further, the plate spring 6 does not adversely affect the weight balance of the movable-side member MB supported by the 8-bar-shaped memory alloy wire SA (the first wire SA1 to the eighth wire SA 8).
The first connection portion ED1 of the first conductive member CM1 is vertically joined to the connection portion CT1 of the first fixed-side wiring board 5F1 by solder as shown in fig. 6 (a). That is, the first connection portion ED1 and the connection portion CT1 are joined in a state in which their surfaces are substantially perpendicular to each other. Also, the second connection portion ED2 of the second conductive member CM2 is vertically joined to the connection portion CT2 of the second fixing-side wiring board 5F2 by solder, the third connection portion ED3 of the third conductive member CM3 is vertically joined to the connection portion CT3 of the third fixing-side wiring board 5F3 by solder, and the fourth connection portion ED4 of the fourth conductive member CM4 is vertically joined to the connection portion CT4 of the fourth fixing-side wiring board 5F4 by solder. In addition, the fifth connection portion ED5 of the fifth conductive member CM5 is vertically joined to the connection portion CT5 of the fifth fixed side wiring board 5F5 by solder, the sixth connection portion ED6 of the sixth conductive member CM6 is vertically joined to the connection portion CT6 of the sixth fixed side wiring board 5F6 by solder, the seventh connection portion ED7 of the seventh conductive member CM7 is vertically joined to the connection portion CT7 of the seventh fixed side wiring board 5F7 by solder, and the eighth connection portion ED8 of the eighth conductive member CM8 is vertically joined to the connection portion CT8 of the eighth fixed side wiring board 5F8 by solder.
The connection portion CT9 of the first movable-side terminal plate 5M1 is perpendicularly joined to the third portion 6A3 of the first leaf spring 6A by solder as shown in fig. 6 (B). That is, the connection CT9 and the third portion 6A3 are joined in a state in which their surfaces are substantially perpendicular to each other. Similarly, the connection portion CT10 of the second movable-side wiring board 5M2 is vertically joined to the third portion 6A3 of the first leaf spring 6A by solder, the connection portion CT11 of the third movable-side wiring board 5M3 is vertically joined to the third portion 6B3 of the second leaf spring 6B by solder, and the connection portion CT12 of the fourth movable-side wiring board 5M4 is vertically joined to the third portion 6B3 of the second leaf spring 6B by solder.
On the other hand, as shown in fig. 6(B), the first fixed side connection plate 5F1 is disposed apart from the first portion 6A1 of the first leaf spring 6A and does not contact the first portion 6A1 of the first leaf spring 6A. Similarly, the third fixing-side terminal plate 5F3 does not contact the second portion 6A2 of the first leaf spring 6A, the fifth fixing-side terminal plate 5F5 does not contact the first portion 6B1 of the second leaf spring 6B, and the seventh fixing-side terminal plate 5F7 does not contact the second portion 6B2 of the second leaf spring 6B.
The ninth bonding surface portion CP9 (see fig. 5B) of the ninth conductive member CM9 is bonded in parallel to the first portion 6B1 of the second plate spring 6B by welding such as laser welding at the portion of the second through hole 6BH2 formed in the first portion 6B1 of the second plate spring 6B. That is, the ninth engaging face portion CP9 and the first portion 6B1 are engaged in a state in which surfaces thereof are substantially parallel to each other. Similarly, the tenth joining surface portion CP10 (see fig. 5B) of the tenth conductive member CM10 is joined in parallel to the second part 6A2 of the first plate spring 6A by welding such as laser welding at the portion of the fourth through hole 6AH4 formed in the second part 6A2 of the first plate spring 6A.
Next, referring to fig. 7, a path of the current flowing through the shape memory alloy wire SA will be described. Fig. 7 is a perspective view of a part of the configuration shown in fig. 6. In fig. 7(a), for the sake of clarity, the first conductive member CM1 and the tenth conductive member CM10 are marked with a relatively thin dot pattern, the first leaf spring 6A is marked with a relatively dense dot pattern, and the first movable-side wiring board 5M1 and the first fixed-side wiring board 5F1 are marked with a relatively thin dot pattern. Similarly, in fig. 7(B), for the sake of clarity, the second conductive member CM2 and the tenth conductive member CM10 are marked with a relatively sparse dot pattern, the first leaf spring 6A is marked with a relatively dense dot pattern, and the first movable-side wiring board 5M1 and the second fixed-side wiring board 5F2 are marked with a relatively dense dot pattern.
Specifically, fig. 7(a) shows a path of a current when the first terminal portion TM1 of the first conductive member CM1 is connected to a high potential and the tenth terminal portion TM10 of the tenth conductive member CM10 is connected to a low potential, and fig. 7(B) shows a path of a current when the second terminal portion TM2 of the second conductive member CM2 is connected to a high potential and the tenth terminal portion TM10 of the tenth conductive member CM10 is connected to a low potential. The following description relates to the path of the current flowing through the first line SA1 or the second line SA2, but the same can be applied to the path of the current flowing through the third line SA3 or the fourth line SA4, the path of the current flowing through the fifth line SA5 or the sixth line SA6, and the path of the current flowing through the seventh line SA7 or the eighth line SA 8.
When the first terminal portion TM1 of the first conductive member CM1 is connected to a high potential and the tenth terminal portion TM10 of the tenth conductive member CM10 is connected to a low potential, a current flows from the first terminal portion TM1 to the first fixed-side wiring board 5F1 through the first conductive member CM1 as indicated by an arrow AR1 in fig. 7 (a). Then, the current passes through the first fixed-side terminal plate 5F1 as indicated by an arrow AR2, passes through the first wire SA1 as indicated by an arrow AR3, and further passes through the first movable-side terminal plate 5M1 as indicated by an arrow AR 4. Then, the current flows to the tenth terminal portion TM10 through the third portion 6A3, the fifth portion 6A5, and the second portion 6A2 of the first plate spring 6A as indicated by arrows AR5 and AR6, and then through the tenth conductive member CM10 as indicated by arrows AR 7.
When the second terminal portion TM2 of the second conductive member CM2 is connected to a high potential and the tenth terminal portion TM10 of the tenth conductive member CM10 is connected to a low potential, a current flows from the second terminal portion TM2 to the second fixed-side wiring board 5F2 through the second conductive member CM2 as indicated by an arrow AR11 in fig. 7 (B). Then, the current passes through the second fixed-side terminal plate 5F2 as indicated by an arrow AR12, passes through the second wire SA2 as indicated by an arrow AR13, and further passes through the first movable-side terminal plate 5M1 as indicated by an arrow AR 14. Then, the current flows to the tenth terminal portion TM10 through the third portion 6A3, the fifth portion 6A5, and the second portion 6A2 of the first plate spring 6A as indicated by arrows AR15 and AR16, and then through the tenth conductive member CM10 as indicated by arrows AR 17.
The path of the current flowing from the first movable-side wiring board 5M1 to the tenth terminal portion TM10 is the same regardless of whether the first terminal portion TM1 of the first conductive member CM1 is connected to a high potential or the second terminal portion TM2 of the second conductive member CM2 is connected to a high potential.
The controller located outside the lens driving device 101 as described above can control the contraction of the first to eighth lines SA1 to SA8 by controlling the voltages applied to the terminal portions of the first to tenth conductive members CM1 to CM 10. The control device may be disposed in the lens driving device 101. The control device may be a component of the lens driving device 101.
The lens driving device 101 having a substantially rectangular parallelepiped shape is mounted on an external substrate (not shown) on which an imaging element (not shown) is mounted, for example. The camera module is composed of, for example, an external substrate, a lens driving device 101, a lens body attached to the lens holding member 2, and an imaging element attached to the external substrate so as to face the lens body. The camera module may also contain control means.
The control device may move the lens holding member 2 in the direction parallel to the optical axis JD on the Z1 side (the object side) of the imaging element by using a driving force in the direction parallel to the optical axis JD due to contraction of the shape memory alloy wire SA as the driving mechanism MK, for example. Further, the control device may realize an auto focus adjustment function as one of the lens adjustment functions by moving the lens holding member 2 in such a manner. Specifically, the control device may move the lens holding member 2 in a direction away from the image pickup device to enable macro image pickup, and move the lens holding member 2 in a direction toward the image pickup device to enable infinity image pickup.
Further, the control device may move the lens holding member 2 in a direction intersecting the optical axis JD by controlling the currents flowing through the plurality of shape memory alloy wires SA. Thereby, the control device can also realize the shake correction function.
Next, an example of a connection structure for connecting the fixed-side metal member 5F (fixed-side wiring board) and the conductive member CM will be described with reference to fig. 8. Fig. 8 is a diagram showing an example of a connection structure for connecting the fixed-side metal member 5F (fixed-side wiring board) and the conductive member CM. Specifically, fig. 8a is a perspective view of the entire base member 18 to which the fixed-side metal member 5F (fixed-side connection board) is attached. Fig. 8(B) is an enlarged side view of the range R1 surrounded by the broken line shown in fig. 8(a) as viewed from the Y1 side. Fig. 8(C) is an enlarged bottom view of a range R2 surrounded by the broken line shown in fig. 8(B) when viewed from the Z2 side. In fig. 8a to 8C, for the sake of clarity, the fixed-side metal member 5F (fixed-side wiring board) is given a relatively sparse dot pattern, and the conductive member CM is given a relatively dense dot pattern.
As shown in fig. 8B and 8C, the first fixing-side connection plate 5F1 is attached to the side wall (right attachment surface) of the base member 18 on the Y1 side of the first fixing-side base 18D1 by a photo-curing adhesive. Further, the connection portion CT1 of the first fixing-side wiring board 5F1 is joined to the first connection portion ED1 of the first conductive member CM1 via the joining material SD. The bonding material SD is, for example, solder or a conductive adhesive.
Similarly, the second fixing-side connection plate 5F2 is attached to the side wall (right attachment surface) on the Y1 side of the first fixing-side pedestal portion 18D1 in the base member 18 by a photo-curing adhesive. Further, the connection portion CT2 of the second fixed-side wiring board 5F2 is joined to the second connection portion ED2 of the second conductive member CM2 via the joining material SD. In fig. 8(B) and 8(C), the bonding material SD is marked with a cross pattern for clarity.
As shown in fig. 8C, the first connection portion ED1 is disposed so as to protrude from the Y1-side (right-side) surface of the connection portion CT1 toward the Y1 side. Similarly, the second connector ED2 is disposed so as to protrude from the Y1-side (right-side) surface of the connector CT2 toward the Y1 side.
This arrangement enables adhesion of the bonding material SD to at least the upper surface (surface on the Z1 side) of the first connection portion ED1 and the outer surface (surface on the Y1 side) of the connection portion CT1, and therefore the connection strength by the bonding material SD between the connection portion CT1 and the first connection portion ED1 can be improved. Typically, this arrangement allows the bonding material SD to adhere to the plurality of surfaces constituting the first connection portion ED1 and the plurality of surfaces constituting the connection portion CT1, and therefore can improve the connection strength by the bonding material SD between the connection portion CT1 and the first connection portion ED 1. The same applies to the bonding strength of the bonding material SD between the connection portion CT2 and the second connection portion ED 2.
In addition, this arrangement can prevent only the end face (the face on the Y1 side) of the first connection portion ED1 that is not plated from being bonded to the connection portion CT1 with the bonding material SD. The same is true for the engagement between the second connection portion ED2 and the connection portion CT 2. The end face (the face on the Y1 side) of the first connection portion ED1 is a cut face formed when a non-illustrated waste connection portion is cut, and therefore is not plated. The sacrificial connecting portion is a portion for connecting the plurality of conductive members, and is used when the plurality of conductive members are embedded in the base member 18 by insert molding, but is ultimately sacrificial.
Another combination of the lens holding member 2, the metal member 5, and the base member 18 constituting the lens driving device 101 will be described with reference to fig. 9 to 11.
Fig. 9 is a perspective view of a base member 18A as another example of the base member 18. Specifically, fig. 9(a) is a perspective view of the base member 18A with the conductive member CM removed, fig. 9(B) is a perspective view of the conductive member CM embedded in the base member 18A, and fig. 9(C) is a perspective view of the base member 18A with the conductive member CM embedded. In fig. 9(B) and 9(C), the conductive member CM is indicated with a dot pattern for clarity.
Fig. 10 is a perspective view of a lens holding member 2A as another example of the lens holding member 2. The lens holding member 2A is different from the lens holding member 2 in that the conductive member 20 is embedded by insert molding. Specifically, fig. 10(a) is a perspective view of the lens holding member 2A with the conductive member 20 removed, fig. 10(B) is a perspective view of the conductive member 20 embedded in the lens holding member 2A, and fig. 10(C) is a perspective view of the lens holding member 2A with the conductive member 20 embedded. In fig. 10(B) and 10(C), the conductive member 20 is marked with a dot pattern for clarity.
Fig. 11 is a diagram showing a positional relationship among the metal member 5, the plate spring 6, the conductive member CM, the conductive member 20, and the shape memory alloy wire SA. Specifically, fig. 11(a) is a diagram showing a positional relationship among the metal member 5, the base member 18A, and the conductive member 20. Fig. 11(B) is a diagram showing a positional relationship among the metal member 5, the plate spring 6, the conductive member CM, the conductive member 20, and the shape memory alloy wire SA. In fig. 11(B), the conductive member 20 is marked with a dot pattern for the sake of clarity.
The base member 18A is formed by injection molding using synthetic resin such as Liquid Crystal Polymer (LCP) similarly to the base member 18 shown in fig. 5. As shown in fig. 9(a), the base member 18A has a substantially rectangular outline in plan view, and has an opening 18K at the center. A fixed-side pedestal portion 18D is formed on an upper surface of the base member 18A on the subject side (surface on the Z1 side). The fixed-side mount 18D includes a first fixed-side mount 18D1 and a second fixed- side mount 18D 2. The first fixed-side mount 18D1 and the second fixed-side mount 18D2 are disposed so as to face each other with the optical axis JD interposed therebetween.
A conductive member CM formed of a metal plate as shown in fig. 9(B) is embedded in the base member 18A by insert molding. In this example, the conductive member CM is configured to have: first to tenth terminal portions TM1 to TM10 protruding from the lower surface (surface on the Z2 side) of the base member 18A and extending downward (in the Z2 direction); a first joint surface portion CP1, a second joint surface portion CP2, a fifth joint surface portion CP5, and a sixth joint surface portion CP6 exposed at side surfaces (a surface on the X1 side and a surface on the Y1 side) of the first fixed-side pedestal portion 18D 1; a third joint surface portion CP3, a fourth joint surface portion CP4, a seventh joint surface portion CP7, and an eighth joint surface portion CP8 exposed at side surfaces (a surface on the X2 side and a surface on the Y2 side) of the second fixed-side pedestal portion 18D 2; a ninth engagement surface portion CP9, a tenth engagement surface portion CP10, an eleventh engagement surface portion CP11, and a twelfth engagement surface portion CP12 exposed on the upper surface (surface on the Z1 side) of the base member 18A.
Specifically, the conductive members CM include first to twelfth conductive members CM1 to CM 12. Also, the first conductive member CM1 includes a first terminal portion TM1 and a first engagement face portion CP 1. The second conductive member CM2 includes a second terminal portion TM2 and a second engagement face portion CP 2. The third conductive member CM3 includes a third terminal portion TM3 and a third engagement face portion CP 3. The fourth conductive member CM4 includes a fourth terminal portion TM4 and a fourth engagement surface portion CP 4. The fifth conductive member CM5 includes a fifth terminal portion TM5 and a fifth engaging face portion CP 5. The sixth conductive member CM6 includes a sixth terminal portion TM6 and a sixth engagement surface portion CP 6. The seventh conductive member CM7 includes a seventh terminal portion TM7 and a seventh engaging face portion CP 7. The eighth conductive member CM8 includes an eighth terminal portion TM8 and an eighth junction surface portion CP 8. The ninth conductive member CM9 includes a ninth terminal portion TM9 and a ninth engaging face portion CP 9. The tenth conductive member CM10 includes a tenth terminal portion TM10 and a tenth engagement face portion CP 10. The eleventh conductive member CM11 includes an eleventh engagement face portion CP 11. The twelfth conductive member CM12 includes a twelfth engagement face CP 12.
The lens holding member 2A is formed by injection molding a synthetic resin such as a Liquid Crystal Polymer (LCP) similarly to the lens holding member 2 shown in fig. 2. Specifically, the lens holding member 2A includes a cylindrical portion 12 formed to extend along the optical axis JD, a movable-side mount portion 2D formed to protrude radially outward from the cylindrical portion 12, and a protruding portion 2S. The movable-side mount 2D includes a first movable-side mount 2D1 and a second movable- side mount 2D 2. The first movable-side mount 2D1 and the second movable-side mount 2D2 are disposed so as to extend in opposite directions with respect to the optical axis JD. Similarly, the projection portion 2S includes a first projection portion 2S1 and a second projection portion 2S 2. The first protruding portion 2S1 and the second protruding portion 2S2 are disposed so as to extend in opposite directions with respect to the optical axis JD. Specifically, the movable-side base 2D and the protruding portions 2S are arranged so as to correspond to four corners of the lens holding member 2A having a substantially rectangular outer shape in plan view, and are alternately arranged. Further, a part of the plate spring 6 is mounted on each of the two movable-side bed portions 2D.
The lens holding member 2A is different from the lens holding member 2 in that the conductive member 20 is embedded therein, but is the same as the lens holding member 2 in other points. Therefore, the conductive member 20, which is a different part, will be described in detail below, and the description of the other parts will be omitted.
The conductive member 20 is formed of a metal plate, similar to the conductive member CM embedded in the base member 18, and is embedded in the lens holding member 2A by insert molding. In this example, the conductive member 20 includes a first conductive member 20A embedded in the first movable-side mount 2D1 and a second conductive member 20B embedded in the second movable- side mount 2D 2.
The first conductive member 20A includes a first conductive portion 20A1 configured to be exposed to a side wall (right side mounting surface) of the first movable-side mount portion 2D1, a second conductive portion 20A2 configured to be exposed to a side wall (rear side mounting surface) of the first movable-side mount portion 2D1, and a third conductive portion 20A3 configured to connect the first conductive portion 20A1 and the second conductive portion 20A2 to each other on an upper surface of the first movable-side mount portion 2D 1.
The second conductive member 20B includes a first conductive portion 20B1 configured to be exposed at a side wall (front side mounting surface) of the second movable-side mount portion 2D2, a second conductive portion 20B2 configured to be exposed at a side wall (left side mounting surface) of the second movable-side mount portion 2D2, and a third conductive portion 20B3 configured to connect the first conductive portion 20B1 and the second conductive portion 20B2 on the upper surface of the second movable-side mount portion 2D 2.
The metal member 5 shown in fig. 11(a) is similar to the metal member 5 shown in fig. 3, and is configured to fix an end portion of the shape memory alloy wire SA. In this example, the metal member 5 includes a fixed-side metal member 5F and a movable-side metal member 5M. The fixed-side metal member 5F is configured to be fixed to a fixed-side pedestal portion 18D of the base member 18. The movable-side metal member 5M is configured to be fixed to the movable-side base portion 2D of the lens holding member 2 (see fig. 10 a).
More specifically, the fixed-side metal member 5F (fixed-side wiring board) includes first to eighth fixed-side wiring boards 5F1 to 5F 8. The movable-side metal member 5M (movable-side terminal plate) includes first to fourth movable-side terminal plates 5M1 to 5M 4.
The first movable-side terminal plate 5M1 is welded to the first conductive portion 20a1 exposed at the side wall (right attachment surface) on the Y1 side of the first movable-side pedestal portion 2D 1. Specifically, as shown in fig. 11 a, the first movable-side terminal plate 5M1 is fixed to the first movable-side base 2D1 with a light-curing adhesive in a state where a square protrusion 2V (see fig. 10C) formed on the first movable-side base 2D1 and protruding outward (Y1 side) is engaged with the first rectangular hole AH1 formed on the first movable-side terminal plate 5M 1. The photocurable adhesive is, for example, an ultraviolet curable adhesive or a visible light curable adhesive. In addition, the first movable-side terminal plate 5M1 is joined in parallel to the first conductive portion 20A1 by soldering or a joining material SD in a state where the first conductive portion 20A1 of the first conductive member 20A is exposed from the second rectangular hole AH2 formed in the first movable-side terminal plate 5M 1. That is, the first conductive portion 20a1 and the first movable-side wiring board 5M1 are joined in a state in which their surfaces are substantially parallel to each other. The same applies to the second movable side connection plate 5M2 to the fourth movable side connection plate 5M 4.
The first fixing-side terminal plate 5F1 and the second fixing-side terminal plate 5F2 are fixed to the side wall (right side attachment surface) of the first fixing-side pedestal portion 18D1 on the Y1 side. Specifically, as shown in fig. 11 a, the first fixed-side connector plate 5F1 and the second fixed-side connector plate 5F2 are fixed to the first fixed-side connector plate 18D1 with a light-curable adhesive in a state where two circular protrusions 18V formed on the first fixed-side connector plate 18D1 and protruding outward (Y1 side) engage with through holes RH formed in the first fixed-side connector plate 5F1 and the second fixed-side connector plate 5F2, respectively. The photocurable adhesive is, for example, an ultraviolet curable adhesive or a visible light curable adhesive. In addition, the first fixed-side wiring board 5F1 is joined in parallel to the first conductive member CM1 by welding or a joining material SD in a state where the first joining surface portion CP1 of the first conductive member CM1 is exposed from the rectangular hole FH1 (see fig. 9B) formed in the first fixed-side wiring board 5F 1. That is, the first engagement surface portion CP1 and the first fixing-side wiring board 5F1 are engaged in a state in which the surfaces thereof are substantially parallel to each other. Similarly, the second fixed-side wiring board 5F2 is joined in parallel to the second joint surface portion CP2 by welding or a joining material SD in a state where the second joint surface portion CP2 of the second conductive member CM2 is exposed from the rectangular hole FH2 (see fig. 9B) formed in the second fixed-side wiring board 5F 2. That is, the second engagement surface portion CP2 and the second fixing side wiring board 5F2 are engaged in a state in which the surfaces thereof are substantially parallel to each other. The same applies to the third fixed side connector plates 5F3 to eighth fixed side connector plates 5F 8.
This configuration can improve the conductive bonding property as compared with a case where the conductive member CM and the fixed-side metal member 5F are vertically bonded via the bonding material SD.
On the other hand, the first fixed side attachment plate 5F1 is disposed apart from the first portion 6A1 of the first leaf spring 6A and does not contact the first portion 6A1 of the first leaf spring 6A, as in the configuration shown in fig. 6 (B). In addition, the third fixing-side terminal plate 5F3 does not contact the second portion 6A2 of the first leaf spring 6A, the fifth fixing-side terminal plate 5F5 does not contact the first portion 6B1 of the second leaf spring 6B, and the seventh fixing-side terminal plate 5F7 does not contact the second portion 6B2 of the second leaf spring 6B.
The ninth bonding surface portion CP9 (see fig. 9B) of the ninth conductive member CM9 is bonded in parallel to the first portion 6B1 of the second plate spring 6B by welding such as laser welding or a bonding material SD at the portion of the second through hole 6BH2 formed in the first portion 6B1 of the second plate spring 6B. That is, the ninth engaging face portion CP9 and the first portion 6B1 are engaged in a state in which surfaces thereof are substantially parallel to each other. Similarly, the tenth bonding surface portion CP10 (see fig. 9B) of the tenth conductive member CM10 is bonded in parallel to the second portion 6A2 of the first plate spring 6A by welding such as laser welding or by the bonding material SD at the portion of the fourth through hole 6AH4 formed in the second portion 6A2 of the first plate spring 6A. That is, the tenth engagement face portion CP10 and the second portion 6a2 are engaged in a state in which surfaces thereof are substantially parallel to each other.
The shape memory alloy wire SA shown in fig. 11(B) extends along the inner surface of the first outer peripheral wall portion 4A of the upper cover member 4U, and is configured to movably support the movable-side member MB with respect to the fixed-side member RG, similarly to the shape memory alloy wire SA shown in fig. 6 (a). In this example, shape memory alloy wire SA includes first wire SA1 to eighth wire SA8, and is configured to support lens holding member 2 as movable-side member MB so as to be movable relative to base member 18 as fixed-side member RG. As shown in fig. 11(B), the first to eighth wires SA1 to SA8 have one end fixed to the fixed-side metal member 5F by pressure welding, or the like, and the other end fixed to the movable-side metal member 5M by pressure welding, or the like.
The leaf spring 6 shown in fig. 11(B) includes a first leaf spring 6A and a second leaf spring 6B, similar to the leaf spring 6 shown in fig. 6 (a). The first leaf spring 6A includes a first section 6A1 fixed to the first fixed-side seat 18D1 (see fig. 11 a) of the base member 18, a second section 6A2 fixed to the second fixed-side seat 18D2 (see fig. 11 a) of the base member 18, a third section 6A3 fixed to the first movable-side seat 2D1 (see fig. 10 a) of the lens holding member 2, a fourth section 6A4 connecting the first section 6A1 and the third section 6A3, and a fifth section 6A5 connecting the second section 6A2 and the third section 6A 3.
The first portion 6a1 has a first through hole 6AH1 through which a circular protruding portion 18T (see fig. 11 a) protruding upward is inserted, and the protruding portion 18T is formed in the first fixed-side pedestal portion 18D 1. In this example, the plate spring 6 is fixed to the projection 18T by hot caulking or cold caulking the projection 18T. However, the plate spring 6 and the projection 18T may be fixed by an adhesive.
The second portion 6a2 is formed with a third through hole 6AH3 through which a circular protruding portion 18T (see fig. 11 a) protruding upward is inserted, and a fourth through hole 6AH4 for engagement with a tenth engagement surface CP10 (see fig. 9C) of the tenth conductive member CM10, and the protruding portion 18T is formed in the second fixed mount 18D 2. In this example, the plate spring 6 and the conductive member CM are joined by welding such as laser welding. However, the plate spring 6 and the conductive member CM may be joined by solder, a conductive adhesive, or the like.
The third portion 6A3 is formed with a fifth through hole 6AH5 and a sixth through hole 6AH6 through which a circular protruding portion 2T (see fig. 10C) protruding upward is inserted, and a seventh through hole 6AH7 for joining to the third conductive portion 20A3 (see fig. 10C) of the first conductive member 20A, and the protruding portion 2T is formed in the first movable mount 2D 1. In this example, the plate spring 6 is fixed to the projection 2T by hot caulking or cold caulking the projection 2T. However, the plate spring 6 and the projection 2T may be fixed by an adhesive. Further, the third portion 6A3 of the first plate spring 6A is fixed to the third conductive portion 20A3 of the first conductive member 20A by welding.
The same applies to the fixation of the second plate spring 6B to the lens holding member 2, the base member 18, the conductive member 20, and the conductive member CM.
Next, referring to fig. 12, a path of the current flowing through the shape memory alloy wire SA will be described. Fig. 12 is a perspective view of a part of the configuration shown in fig. 11. In fig. 12(a), for the sake of clarity, the first conductive member CM1 and the tenth conductive member CM10 are marked with a relatively sparse dot pattern, the first leaf spring 6A is marked with a relatively dense dot pattern, the first movable-side wiring board 5M1 and the first fixed-side wiring board 5F1 are marked with a relatively dense dot pattern, and the first conductive member 20A is marked with a cross pattern. Similarly, in fig. 12(B), for the sake of clarity, the second conductive member CM2 and the tenth conductive member CM10 are marked with a relatively sparse dot pattern, the first leaf spring 6A is marked with a relatively dense dot pattern, the first movable-side wiring board 5M1 and the second fixed-side wiring board 5F2 are marked with a relatively dense dot pattern, and the first conductive member 20A is marked with a cross pattern.
Specifically, fig. 12(a) shows a path of a current when the first terminal portion TM1 of the first conductive member CM1 is connected to a high potential and the tenth terminal portion TM10 of the tenth conductive member CM10 is connected to a low potential, and fig. 7(B) shows a path of a current when the second terminal portion TM2 of the second conductive member CM2 is connected to a high potential and the tenth terminal portion TM10 of the tenth conductive member CM10 is connected to a low potential. The following description relates to the path of the current flowing through the first line SA1 or the second line SA2, but the same can be applied to the path of the current flowing through the third line SA3 or the fourth line SA4, the path of the current flowing through the fifth line SA5 or the sixth line SA6, and the path of the current flowing through the seventh line SA7 or the eighth line SA 8.
When the first terminal portion TM1 of the first conductive member CM1 is connected to a high potential and the tenth terminal portion TM10 of the tenth conductive member CM10 is connected to a low potential, a current flows from the first terminal portion TM1 to the first fixed-side wiring board 5F1 through the first conductive member CM1 as indicated by an arrow AR1 in fig. 12 (a). Then, the current passes through the first fixed-side terminal plate 5F1 as indicated by an arrow AR2, passes through the first wire SA1 as indicated by an arrow AR3, and further passes through the first movable-side terminal plate 5M1 as indicated by an arrow AR 4. Then, the current flows through the first conductive member 20A and the third portion 6A3 of the first plate spring 6A as indicated by arrow AR5, through the fifth portion 6A5 and the second portion 6A2 of the first plate spring 6A as indicated by arrow AR6 and arrow AR7, and then through the tenth conductive member CM10 to the tenth terminal portion TM10 as indicated by arrow AR 8.
When the second terminal portion TM2 of the second conductive member CM2 is connected to a high potential and the tenth terminal portion TM10 of the tenth conductive member CM10 is connected to a low potential, a current flows from the second terminal portion TM2 to the second fixed-side wiring board 5F2 through the second conductive member CM2 as indicated by an arrow AR11 in fig. 12 (B). Then, the current passes through the second fixed-side terminal plate 5F2 as indicated by an arrow AR12, passes through the second wire SA2 as indicated by an arrow AR13, and further passes through the first movable-side terminal plate 5M1 as indicated by an arrow AR 14. Then, the current flows through the first conductive member 20A and the third portion 6A3 of the first plate spring 6A as indicated by arrow AR15, through the fifth portion 6A5 and the second portion 6A2 of the first plate spring 6A as indicated by arrow AR16 and arrow AR17, and then through the tenth conductive member CM10 to the tenth terminal portion TM10 as indicated by arrow AR 18.
The path of the current flowing from the first movable-side wiring board 5M1 to the tenth terminal portion TM10 is the same regardless of whether the first terminal portion TM1 of the first conductive member CM1 is connected to a high potential or the second terminal portion TM2 of the second conductive member CM2 is connected to a high potential.
The controller located outside the lens driving device 101 as described above can control the contraction of the first to eighth lines SA1 to SA8 by controlling the voltages applied to the terminal portions of the first to tenth conductive members CM1 to CM 10. The control device may be disposed in the lens driving device 101. The control device may be a component of the lens driving device 101.
Next, another example of a connection structure for connecting the fixed-side metal member 5F (fixed-side connection board) and the conductive member CM will be described with reference to fig. 13 and 14. Fig. 13 and 14 are views showing another example of a connection structure for connecting the fixed-side metal member 5F (fixed-side connection board) and the conductive member CM. Specifically, fig. 13 a is a perspective view of the entire base member 18 to which the fixed-side metal member 5F (fixed-side connection board) is attached, and corresponds to fig. 8 a. Fig. 13(B) is an enlarged side view of a range R3 surrounded by the broken line shown in fig. 13(a) as viewed from the Y1 side, and corresponds to fig. 8 (B). Fig. 14(a) is an enlarged bottom view of a range R4 surrounded by the broken line shown in fig. 13(B) when viewed from the Z2 side, and corresponds to fig. 8 (C). Fig. 14B is a view of the connection portion CT1 and the first connection portion ED1 of the connection portion CT1 of the first fixed-side wiring board 5F1 and the first connection portion ED1 of the first conductive member CM1, as viewed from the front side (X1 side). In fig. 13 and 14, for the sake of clarity, a relatively sparse dot pattern is given to the fixed-side metal member 5F (fixed-side wiring board), and a relatively dense dot pattern is given to the conductive member CM. In fig. 13(B), 14(a) and 14(B), the bonding material SD is marked with a cross pattern for clarity.
As shown in fig. 13B and 14 a, the first fixing-side connection plate 5F1 is attached to the side wall (right attachment surface) of the base member 18 on the Y1 side of the first fixing-side base 18D1 by a photo-curing adhesive. Further, the connection portion CT1 of the first fixing-side wiring board 5F1 is joined to the first connection portion ED1 of the first conductive member CM1 via the joining material SD. The bonding material SD is, for example, solder or a conductive adhesive.
Similarly, the second fixing-side connection plate 5F2 is attached to the side wall (right attachment surface) on the Y1 side of the first fixing-side pedestal portion 18D1 in the base member 18 by a photo-curing adhesive. Further, the connection portion CT2 of the second fixed-side wiring board 5F2 is joined to the second connection portion ED2 of the second conductive member CM2 via the joining material SD.
As shown in fig. 14 a and 14B, the connector CT1 is disposed so as to cover at least a part of the end face EP of the first connector ED1 on the Y1 side (right side). Specifically, as shown in fig. 14B, the first fixing-side connection plate 5F1 is bent outward (Y1 side) at the root RT of the connection CT1 so that the connection CT1 is located outward (Y1 side) of the first connection ED 1. The same applies to the connection CT 2.
This arrangement enables the bonding material SD to adhere to at least the lower surface (surface on the Z2 side) of the connection portion CT1 and the surface on the outer side (Y1 side) of the first connection portion ED1, and therefore can improve the connection strength by the bonding material SD between the connection portion CT1 and the first connection portion ED 1. Typically, this arrangement allows the bonding material SD to adhere to the plurality of surfaces constituting the first connection portion ED1 and the plurality of surfaces constituting the connection portion CT1, and therefore can improve the connection strength by the bonding material SD between the connection portion CT1 and the first connection portion ED 1. The same applies to the bonding strength of the bonding material SD between the connection portion CT2 and the second connection portion ED 2.
As shown in fig. 14(a), a recess RS1 is formed at the tip of the first connection portion ED 1. This configuration allows the bonding material SD to easily enter between the connection portion CT1 and the first connection portion ED1, and therefore, the connection strength of the bonding material SD between the connection portion CT1 and the first connection portion ED1 can be improved. The same applies to the connection strength of the bonding material SD between the second connection portion ED2 having the recessed portion RS2 formed at the tip end thereof and the connection portion CT 2.
In addition, this arrangement can prevent only the end face EP (surface on the Y1 side) of the first connection portion ED1 that is not plated from being bonded to the connection portion CT1 with the bonding material SD. The same is true for the engagement between the second connection portion ED2 and the connection portion CT 2.
Next, with reference to fig. 15, a description will be given of another example of a connection structure for connecting the fixed-side metal member 5F (fixed-side wiring board) and the conductive member CM. Fig. 15 is a diagram showing another example of a connection structure for connecting the fixed-side metal member 5F (fixed-side wiring board) and the conductive member CM. Specifically, fig. 15 a is a lower perspective view of the base member 18 before the fixing-side metal member 5F (fixing-side wire plate) is attached. Fig. 15(B) is a lower perspective view of the base member 18 after the fixing-side metal member 5F (fixing-side wiring board) is attached, and corresponds to fig. 15 (a). In fig. 15 a and 15B, for the sake of clarity, the fixed-side metal member 5F (fixed-side wiring board) is given a relatively sparse dot pattern, and the conductive member CM is given a relatively dense dot pattern.
In the example shown in fig. 15, the connection portion CT1 has an elastic contact portion EC 1. The elastic contact portion EC1 is a portion formed at the front end of the connection portion CT1, and is configured to engage with a recessed portion RS1 formed at the front end of the first connection portion ED 1. Specifically, as shown in fig. 15(B), the elastic contact portion EC1 is configured to generate a force that presses the first connection portion ED1 in the Y2 direction in a state of being engaged with the recessed portion RS 1. That is, the elastic contact portion EC1 is configured to elastically contact the recess RS 1. The connection portion CT1 is joined to the first connection portion ED1 by welding such as laser welding or a joining material SD in a state where the elastic contact portion EC1 is pressed against the recessed portion RS 1.
Also, the connection portion CT2 has an elastic contact portion EC 2. The elastic contact portion EC2 is a portion formed at the front end of the connection portion CT2, and is configured to engage with a concave portion RS2 formed at the front end of the second connection portion ED 2. Specifically, as shown in fig. 15(B), the elastic contact portion EC2 is configured to generate a force that presses the second connection portion ED2 in the Y2 direction while being engaged with the recessed portion RS 2. That is, the elastic contact portion EC2 is configured to elastically contact the recess RS 2. The connection portion CT2 is joined to the second connection portion ED2 by welding such as laser welding or a joining material SD in a state where the elastic contact portion EC2 is pressed against the recessed portion RS 2.
This configuration allows the connection portion CT1 (elastic contact portion EC1) and the first connection portion ED1 (recessed portion RS1) to be joined in an elastically contacted state, and therefore, the connection strength by the welding or joining material SD between the connection portion CT1 and the first connection portion ED1 can be improved.
Next, an example of a connection structure of the metal member 5 will be described with reference to fig. 16 to 18. Fig. 16 is a diagram showing an example of a connection structure of the metal member 5. Specifically, fig. 16(a) is a front view of the base member 18 assembled with the lens holding member 2, the metal member 5, the conductive member CM, and the shape memory alloy wire SA. Fig. 16(B) is an enlarged view of a range R5 surrounded by the broken line shown in fig. 16 (a). Fig. 16(C) is an enlarged view of a range R6 surrounded by the broken line shown in fig. 16 (a). In fig. 16(a), for the sake of clarity, the lens holding member 2 is marked with a relatively sparse dot pattern, and the base member 18 is marked with a relatively dense dot pattern. In fig. 16(B) and 16(C), the photocurable adhesive EA is shown in a dot pattern for clarity.
In this example, the photocurable adhesive EA is a hybrid adhesive that is cured once by irradiation of ultraviolet rays and cured twice by heating. However, the photocurable adhesive EA may be an adhesive that is cured only by irradiation of visible light or ultraviolet light.
Fig. 17 and 18 are views showing an example of a connection structure for connecting the fixed-side metal member 5F and the base member 18. Specifically, fig. 17(a) is a perspective view of the base member 18 before the fifth fixing side connection plate 5F5 and the sixth fixing side connection plate 5F6 are attached. Fig. 17(B) is a perspective view of the base member 18 after the fifth fixing side connection plate 5F5 and the sixth fixing side connection plate 5F6 are attached, and corresponds to fig. 17 (a). Fig. 18 is a front view of the base member 18 before the light curing type adhesive EA is applied after the fifth fixing side connection plate 5F5 and the sixth fixing side connection plate 5F6 are mounted, and corresponds to fig. 17 (B).
The following description relates to a connection structure for connecting the fifth fixing-side connector plate 5F5 and the sixth fixing-side connector plate 5F6 to the base member 18, but the same applies to a connection structure for connecting the first to fourth fixing-side connector plates 5F1 to 5F4, the seventh fixing-side connector plate 5F7, and the eighth fixing-side connector plate 5F8 to the base member 18.
Specifically, the base member 18 has a protrusion 18V as shown in fig. 16 (B). The projection 18V includes an upper projection 18VU and a lower projection 18 VL. The upper protrusion 18VU is inserted through the through hole RH (fifth through hole RH5) formed in the fifth fixed contact pad 5F5, and the lower protrusion 18VL is inserted through the through hole RH (sixth through hole RH6) formed in the sixth fixed contact pad 5F 6. The term "fifth" in the "fifth through hole RH 5" is related to the fifth fixed contact plate 5F5, and the term "sixth" in the "sixth through hole RH 6" is related to the sixth fixed contact plate 5F 6. Although not shown by reference numerals, there are through holes corresponding to the first to fourth fixed-side terminal plates 5F1 to 5F4, the seventh fixed-side terminal plate 5F7, and the eighth fixed-side terminal plate 5F8, respectively. The same applies to "fifth axis AX 5", "sixth axis AX 6", "fifth contact surface CF 5", "sixth contact surface CF 6", "fifth extended portion EL 5", and "sixth extended portion EL 6", which will be described later.
The fifth fixing-side connection plate 5F5 is attached to the base member 18 with the upper protrusion 18VU fitted in the fifth through hole RH5, and is fixed to the base member 18 by a photocurable adhesive EA (first photocurable adhesive EA1) disposed from the peripheral surface of the fifth through hole RH5 over the outer surface of the upper protrusion 18 VU. The outer side surfaces of the upper protrusions 18VU typically include the end surfaces and the outer peripheral surfaces of the upper protrusions 18 VU. However, the outer surface of the upper projection 18VU may be the outer peripheral surface of the upper projection 18 VU. That is, the outer surface of the upper projection 18VU may not include the end surface of the upper projection 18 VU.
Similarly, the sixth fixed connection board 5F6 is attached to the base member 18 in a state where the lower protrusion 18VL is fitted into the sixth through hole RH6, and is fixed to the base member 18 by the first photocurable adhesive EA1 disposed from the peripheral surface of the sixth through hole RH6 over the outer surface of the lower protrusion 18 VL. The outer surface of the lower projection 18VL includes the end surface and the outer peripheral surface of the lower projection 18 VL. However, the outer surface of the lower projection 18VL may be the outer peripheral surface of the lower projection 18 VL. That is, the outer surface of the lower projection 18VL may not include the end surface of the lower projection 18 VL.
In this example, the upper protrusions 18VU and the lower protrusions 18VL are arranged in a vertical direction (Z-axis direction) and are arranged in proximity to each other. The first photocurable adhesive EA1 is disposed from the surface around the fifth through hole RH5 to the outer surface of the upper protrusion 18VU, and from the surface around the sixth through hole RH6 to the outer surface of the lower protrusion 18 VL. That is, the first light-curing adhesive EA1 is disposed so as to integrally cover the upper side protrusions 18VU and the lower side protrusions 18 VL. However, the upper and lower protrusions 18VU and 18VL may be arranged to be inclined with respect to the vertical direction. The light-curable adhesive EA attached to the upper protrusions 18VU and the light-curable adhesive EA attached to the lower protrusions 18VL may be disposed separately from each other.
The fifth fixing-side terminal plate 5F5 includes an extension portion EL (fifth extension portion EL5) extending in a direction away from the fifth through hole RH 5. In this example, the fifth fixing-side connection plate 5F5 has a fifth extension portion EL5 extending in the Z2 direction after extending in the Y2 direction and connected to the connection portion CT 5. In this example, the fifth extension EL5 is formed to be located on the opposite side of the holding portion J2 with the upper side protrusion 18VU in between.
Similarly, the sixth fixing-side terminal plate 5F6 includes an extension portion EL (sixth extension portion EL6) extending in a direction away from the sixth through hole RH 6. In this example, the sixth fixing-side connection plate 5F6 includes a sixth extension portion EL6 extending in the Z2 direction after extending in the Y2 direction and connected to the connection portion CT 6. In this example, the sixth extended portion EL6 is formed so as to be located on the opposite side of the holding portion J4 with the lower protrusion 18VL interposed therebetween, similarly to the fifth extended portion EL 5.
The fifth fixing-side connection plate 5F5 and the sixth fixing-side connection plate 5F6 are fixed and adhered not only by the first light-curing adhesive EA1 but also by the second light-curing adhesive EA2 and the third light-curing adhesive EA 3. Specifically, the second light-curable adhesive EA2 is disposed so as to straddle the fifth fixing-side connector plate 5F5 and the sixth fixing-side connector plate 5F6, similarly to the first light-curable adhesive EA 1. More specifically, as shown in fig. 16B, the second photocurable adhesive EA2 is disposed so as to span the lower peripheral edge (Z2 side) of the fifth extension portion EL5 and the upper peripheral edge (Z1 side) of the sixth extension portion EL 6. On the other hand, the third photocurable adhesive EA3 is configured to be attached only to the fifth fixing-side connection plate 5F 5. Specifically, the third photocurable adhesive EA3 is disposed so as to adhere to the left side (Y2 side) peripheral edge of the fifth extension portion EL5, as shown in fig. 16B.
As shown in fig. 16(B), 17, and 18, the regulating wall RB is disposed between the fifth fixing-side terminal plate 5F5 and the sixth fixing-side terminal plate 5F6, and the recess GR is disposed inside (on the X2 side) the fixing-side metal member 5F. In fig. 17 and 18, for the sake of clarity, the restricting wall portion RB is indicated by a dense dot pattern, and the recessed portion GR is indicated by a sparse dot pattern. In fig. 17(B), a more sparse dot pattern is given to the photocurable adhesive EA.
The restricting wall portion RB is a portion that bulges outward (in the X1 direction) from the outer surface (the surface on the X1 side) of the base member 18, and is configured to define a fifth contact surface CF5 and a sixth contact surface CF6, as shown in fig. 17 a. The fifth contact surface CF5 is configured to contact the right side (Y1 side) peripheral edge of the fifth extension portion EL5 of the fifth fixed-side wiring board 5F 5. The sixth contact surface CF6 is configured to contact the left side (Y2 side) peripheral edge of the sixth extension portion EL6 of the sixth fixed-side wiring board 5F 6.
Specifically, the fifth contact surface CF5 is disposed so as to be able to prevent the arc movement of the fifth extension portion EL5, which is intended to perform the arc movement with the fifth axis AX5 (see fig. 17 a), which is the central axis of the upper protrusion portion 18VU extending in the front-rear direction (X-axis direction), as the rotation center. The sixth contact surface CF6 is disposed to prevent circular motion of the sixth extended portion EL6, which is intended to perform circular motion about a sixth axis AX6 (see fig. 17 a), which is the central axis of the lower protrusion 18VL extending in the front-rear direction (X-axis direction), as the rotation center.
The recess GR is configured to dispose the light-curable adhesive EA between the fixed-side metal member 5F and the base member 18. In this example, the recess GR includes a first recess GR1, a second recess GR2, a third recess GR3, and a fourth recess GR 4.
The first recessed portions GR1 are formed to connect the upper side projection portions 18VU with the lower side projection portions 18 VL. Specifically, the first recess GR1 extends in the vertical direction and is formed to pass through the inner side (X2 side) of the fifth fixed side connector board 5F5 and the inner side (X2 side) of the sixth fixed side connector board 5F 6.
The second recess GR2 is formed between the first recess GR1 and the third recess GR 3. Specifically, the second recess GR2 extends in the vertical direction and is formed to pass through the inside (X2 side) of the fifth fixed side wiring board 5F5 and the inside (X2 side) of the sixth fixed side wiring board 5F 6. The second recessed portion GR2 is formed to pass through the inner side (X2 side) of the peripheral edge of the right side (Y2 side) of the connection portion CT6 constituting the sixth fixed side wiring board 5F 6.
The third recessed portion GR3 is formed to pass through the inner side (X2 side) of the peripheral edge of the left side (Y2 side) of each of the fifth extension portion EL5 and the connection portion CT5 constituting the fifth fixed-side wiring board 5F 5. Specifically, the third recess GR3 extends in the vertical direction and passes through the inside (X2 side) of the fifth fixed side wiring board 5F5, but is formed not to pass through the inside (X2 side) of the sixth fixed side wiring board 5F 6.
The fourth recess GR4 extends vertically on the right side (Y1 side) of the first recess GR1 and is formed to pass through the inside (X2 side) of the fifth fixed side wiring board 5F5 and the inside (X2 side) of the sixth fixed side wiring board 5F 6.
The recessed portion GR is configured to be accessible from the outside. That is, the recess GR is configured such that the light-curable adhesive EA can flow into the recess GR from the outside (X1 side) of the fixed-side metal member 5F and adhere to the inner (X2 side) surface of the fixed-side metal member 5F.
Specifically, the first recess GR1 is configured to allow the first light-curable adhesive EA1 to flow from the outer side (X1 side) of each of the fifth fixed-side wiring board 5F5 and the sixth fixed-side wiring board 5F6 and adhere to the inner side (X2 side) surface of each of the fifth fixed-side wiring board 5F5 and the sixth fixed-side wiring board 5F 6. That is, the first recess GR1 is configured to receive the first photocurable adhesive EA1 on the inner side (X2 side) of the fifth fixed-side wiring board 5F5 and the sixth fixed-side wiring board 5F6 in a state where the fifth fixed-side wiring board 5F5 and the sixth fixed-side wiring board 5F6 are attached to the base member 18.
The second recess GR2 is configured such that the second light-curable adhesive EA2 can flow from the outer side (X1 side) of each of the fifth fixed-side wiring board 5F5 and the sixth fixed-side wiring board 5F6 and adhere to the inner side (X2 side) surface of each of the fifth fixed-side wiring board 5F5 and the sixth fixed-side wiring board 5F 6. That is, the second recess GR2 is configured to receive the second light-curing adhesive EA2 on the inner side (X2 side) of the fifth fixed-side wiring board 5F5 and the sixth fixed-side wiring board 5F6 in a state where the fifth fixed-side wiring board 5F5 and the sixth fixed-side wiring board 5F6 are attached to the base member 18.
The third recessed portion GR3 is configured to allow the third light-curable adhesive EA3 to flow from the outside (X1 side) of the fifth fixed-side wiring board 5F5 and adhere to the inner surface (X2 side) of the fifth fixed-side wiring board 5F 5. That is, the third recess GR3 is configured to receive the third light-curing adhesive EA3 on the inner side (X2 side) of the fifth extension portion EL5 in a state where the fifth fixing side wiring board 5F5 is attached to the base member 18.
Further, a notch CUa is formed in the peripheral edge of the left side (Y2 side) of the fifth extension portion EL5 located on the opposite side of the peripheral edge of the right side (Y1 side) of the fifth extension portion EL5 facing the limiting wall portion RB so as to be able to enter the third recess GR3 from the outside (X1 direction). The third light-curable adhesive EA3 can flow into the third recessed portion GR3 through the cut portion CUa and adhere to the inner surface (X2 side) of the fifth extension portion EL 5.
The fourth recessed portion GR4 is configured to allow the first light-curable adhesive EA1 to flow from the outer side (X1 side) of each of the fifth fixed-side wiring board 5F5 and the sixth fixed-side wiring board 5F6 and adhere to the inner side (X2 side) surface of each of the fifth fixed-side wiring board 5F5 and the sixth fixed-side wiring board 5F 6. That is, the fourth recess GR4 is configured to receive the first photocurable adhesive EA1 on the inner side (X2 side) of the fifth fixed-side wiring board 5F5 and the sixth fixed-side wiring board 5F6 in a state where the fifth fixed-side wiring board 5F5 and the sixth fixed-side wiring board 5F6 are attached to the base member 18. That is, the first light curable adhesive EA1 is applied so as to enter the first recess GR1 and the fourth recess GR4, respectively.
As shown in fig. 16(C), the lens holding member 2 has a rectangular protrusion 2V. In this example, the protrusion 2V is inserted through a rectangular hole AH formed in the third movable-side terminal plate 5M 3.
The third movable-side attachment plate 5M3 is attached to the lens holding member 2 in a state where the protrusion 2V is fitted into the rectangular hole AH, and is fixed to the lens holding member 2 by a light-curable adhesive EA (fourth light-curable adhesive EA4) disposed from the peripheral surface of the rectangular hole AH over the outer surface of the protrusion 2V. The outer side surface of the protrusion 2V typically includes the end surface and the outer peripheral surface of the protrusion 2V. However, the outer side surface of the protrusion 2V may be the outer peripheral surface of the protrusion 2V. That is, the outer side surface of the projection 2V may not include the end surface of the projection 2V.
The third movable contact plate 5M3 is configured not to rotate around the rectangular protrusion 2V by fitting the rectangular hole AH disposed in the center of the third movable contact plate 5M3 to the rectangular protrusion 2V. Specifically, the rectangular hole AH is formed to be located substantially in the middle between the holding portion J1 and the holding portion J3.
The third movable-side connection plate 5M3 includes an extension portion EM (third extension portion EM3) extending in a direction away from the rectangular hole AH. In this example, the third movable-side connection plate 5M3 includes a third extension portion EM3 extending in the Y1 direction. In this example, third extension portion EM3 is formed to be located on the opposite side of the side where connection portion CT11 is located with protrusion 2V in between.
As shown in fig. 16C, a restricting wall portion ST is disposed on the right side (Y1 side) of the third extension portion EM 3.
The restricting wall portion ST is a portion that protrudes outward (in the X1 direction) from the outer surface (the surface on the X1 side) of the lens holding member 2, and is configured to define the contact surface CFb. The contact surface CFb is configured to contact the right side (Y1 side) peripheral edge of the extension EM3 of the third movable-side connection plate 5M 3. Specifically, the contact surface CFb is arranged to be able to prevent the movement of the third movable-side terminal plate 5M3 that is intended to move rightward (in the Y1 direction).
Further, a notched portion CUb is formed in the right side (Y1 side) peripheral edge of third extension portion EM3 so as to face abutment surface CFb of restriction wall portion ST. The fifth light-curable adhesive EA5 can reach the inner side (X2 side) of the third extension portion EM3 through the notch portion CUb and adhere to the inner side (X2 side) surface of the third extension portion EM 3.
Next, a force acting on the fixing-side metal member 5F when the shape memory alloy wire SA contracts when the fixing-side metal member 5F is attached to the base member 18 will be described with reference to fig. 18.
The shape memory alloy wire SA contracts when heated. In the example shown in fig. 18, the contracted fifth wire SA5 generates a force that pulls the holding portion J2 in the direction indicated by the arrow AR 20. In this case, the contracted fifth line SA5 generates a force to rotate the fifth fixed-side wire plate 5F5 about the fifth axis AX5 which is the central axis of the upper protrusion 18VU, as indicated by an arrow AR 21. Further, the contracted fifth wire SA5 generates a force to rotate fifth extension portion EL5 of fifth fixed-side wire plate 5F5 about fifth axis AX5 as indicated by arrow AR 22.
Therefore, although the fifth extension portion EL5 attempts to rotate in the direction indicated by the arrow AR22, the periphery of the right side (Y1 side) of the fifth extension portion EL5 comes into contact with the fifth contact surface CF5 of the limiting wall RB, and therefore the rotation thereof is prevented by the fifth contact surface CF 5.
In this way, even when the fifth wire SA5 contracts due to heating, the fifth fixed-side wire plate 5F5 does not rotate about the fifth axis AX 5.
Likewise, the contracted sixth wire SA6 generates a force that pulls the holding portion J4 in the direction indicated by the arrow AR 23. In this case, the contracted sixth wire SA6 generates a force to rotate the sixth fixed-side wire plate 5F6 about the sixth axis AX6 which is the central axis of the lower protrusion 18VL, as indicated by an arrow AR 24. Further, the contracted sixth wire SA6 generates a force to rotate the sixth extension portion EL6 of the sixth fixed-side wire plate 5F6 about the sixth axis AX6 as indicated by an arrow AR 25.
Therefore, the sixth extended portion EL6 attempts to rotate in the direction indicated by the arrow AR25, but the peripheral edge of the left side (Y2 side) of the sixth extended portion EL6 comes into contact with the sixth contact surface CF6 of the limiting wall RB, and therefore the rotation thereof is prevented by the sixth contact surface CF 6.
In this way, even when the sixth wire SA6 contracts due to heating, the sixth fixed-side wire plate 5F6 does not rotate about the sixth axis AX 6.
As described above, lens drive device 101 includes base member 18 as fixed-side member RG made of resin, lens holding member 2 as movable-side member MB supported to be movable relative to base member 18, metal member 5 as a terminal block attached to base member 18, and shape memory alloy wire SA as a shape memory actuator having one end fixedly adhered to metal member 5 and configured to move lens holding member 2 by contracting in accordance with a temperature increase. The lens driving device 101 includes a conductive member CM embedded in the base member 18, a part of which is exposed from the base member 18 and electrically connected to the metal member 5, and another part of which is exposed from the base member 18 at a position separated from the metal member 5 and serves as an external terminal.
Specifically, the lens driving device 101 includes a first conductive member CM1 embedded in the base member 18. The first conductive member CM1 is configured such that a part (for example, the first connection portion ED1 shown in fig. 5 or the engagement surface portion CP1 shown in fig. 9) is exposed from the base member 18 and electrically connected to the first fixed-side wiring board 5F1, and another part (for example, the first terminal portion TM1 shown in fig. 5 and 9) is exposed from the base member 18 at a position separated from the first fixed-side wiring board 5F1 and becomes an external terminal. The first fixing-side terminal plate 5F1 is located along the second side portion 18E2 (see fig. 5 and 9) of the base member 18, and the first terminal portion TM1 is located along the third side portion 18E3 (see fig. 5 and 9) of the base member 18.
In this configuration, since the external terminal is not formed by a part of the metal member 5 as the wiring board, but by a part of the conductive member CM connected to the metal member 5, the degree of freedom of the position where the external terminal is provided can be increased. Therefore, this configuration can improve the degree of freedom of wiring in an external substrate having a structure for receiving an external terminal, for example. In addition, even if an external force is applied to the external terminal, the configuration can suppress or prevent the influence from being exerted on the metal member 5 as the wiring board. Therefore, even if an external force is applied to the external terminal, the configuration can suppress or prevent the influence from being exerted on the shape memory alloy wire SA attached to the metal member 5.
The conductive member CM may have a joint surface portion parallel to the surface of the metal member 5 as the wiring board at one end, and the joint surface portion may be overlapped with the metal member 5 and joined to the wiring board by welding. However, the joint surface portion and the wiring board may be joined by solder or a conductive adhesive.
Specifically, as shown in fig. 9(B), the first conductive member CM1, which is one of the conductive members CM, may have an engagement surface portion CP1 at one end thereof, which is parallel to the surface of the first fixed-side wiring board 5F 1. As shown in fig. 11(a), the first conductive member CM1 may be joined to the first fixed-side wiring board 5F1 by welding with the joint surface portion CP1 overlapping the first fixed-side wiring board 5F 1.
This configuration can facilitate the joining of the first conductive member CM1 and the first fixed-side wiring board 5F1, and further, can ensure the joining of the first conductive member CM1 and the first fixed-side wiring board 5F 1. This is because, compared to the case where the first conductive member CM1 is vertically joined to the first fixed-side wiring board 5F1, this configuration enables the first conductive member CM1 and the first fixed-side wiring board 5F1 to be joined in a state where the contact area between the first conductive member CM1 and the first fixed-side wiring board 5F1 is increased.
The base member 18 is desirably a polygonal ring-shaped member having one side and the other sides. In this case, the metal member 5 as a wiring board is attached to the base member 18 along one side portion. The external terminal, which is a part of the conductive member CM electrically connected to the metal member 5, is provided along the other side portion.
For example, as shown in fig. 3(B), the base member 18 may be a quadrangular ring-shaped member having a second side 18E2 as one side and a third side 18E3 as the other side. In this case, the first fixing-side connection plate 5F1 is attached to the base member 18 along the second side portion 18E2 as one side portion, as shown in fig. 3 (B). Further, the first terminal portion TM1 which is an external terminal which is a part of the first conductive member CM1 electrically connected to the first fixed-side wiring board 5F1 is arranged along the third side portion 18E3 which is the other side portion.
In this configuration, since the external terminal is arranged along the third side 18E3 which is the other side so as not to be arranged along the second side 18E2 which is one side, the degree of freedom of wiring in the external substrate having a structure for receiving the external terminal can be increased. This is because, in this configuration, it is not necessary to dispose the above-described structure in the region on the external board corresponding to the second side portion 18E 2. Thus, this configuration can easily realize, for example, a wiring design that can prevent the wiring related to the imaging element arranged on the external substrate from interfering with the wiring related to the lens driving device 101. Alternatively, for example, even when two lens driving devices 101 are arranged adjacent to each other, this configuration can prevent a situation in which the external terminals of the two lens driving devices 101 interfere with each other and wiring is difficult.
As shown in fig. 3(B), the base member 18 may be a four-sided ring-shaped member having a first side portion 18E1, a second side portion 18E2, a third side portion 18E3, and a fourth side portion 18E 4. The metal member 5 as a terminal block may include a first terminal block (first fixed-side terminal block 5F1 and second fixed-side terminal block 5F2), a second terminal block (third fixed-side terminal block 5F3 and fourth fixed-side terminal block 5F4), a third terminal block (fifth fixed-side terminal block 5F5 and sixth fixed-side terminal block 5F6), and a fourth terminal block (seventh fixed-side terminal block 5F7 and eighth fixed-side terminal block 5F 8). As shown in fig. 5B, the external terminals may include a first external terminal (a first terminal portion TM1 and a second terminal portion TM2), a second external terminal (a third terminal portion TM3 and a fourth terminal portion TM4), a third external terminal (a fifth terminal portion TM5 and a sixth terminal portion TM6), and a fourth external terminal (a seventh terminal portion TM7 and an eighth terminal portion TM 8).
In this case, the first external terminals (the first terminal portion TM1 and the second terminal portion TM2) are electrically connected to the first terminal board (the first fixed-side terminal board 5F1 and the second fixed-side terminal board 5F2) mounted to the base member 18 along the second side portion 18E 2.
The second external terminals (the third terminal portion TM3 and the fourth terminal portion TM4) are electrically connected to the second terminal board (the third fixed-side terminal board 5F3 and the fourth fixed-side terminal board 5F4) attached to the base member 18 along the third side portion 18E 3.
Further, the third external terminals (the fifth terminal portion TM5 and the sixth terminal portion TM6) are electrically connected to the third terminal board (the fifth fixing-side terminal board 5F5 and the sixth fixing-side terminal board 5F6) mounted to the base member 18 along the first side portion 18E 1.
In addition, the fourth external terminal (seventh terminal portion TM7 and eighth terminal portion TM8) is electrically connected to a fourth terminal board (seventh fixed-side terminal board 5F7 and eighth fixed-side terminal board 5F8) mounted to the base member 18 along the fourth side portion 18E 4.
As shown in fig. 5, the first external terminal (the first terminal portion TM1 and the second terminal portion TM2) and the second external terminal (the third terminal portion TM3 and the fourth terminal portion TM4) are provided along the third side portion 18E3, and the third external terminal (the fifth terminal portion TM5 and the sixth terminal portion TM6) and the fourth external terminal (the seventh terminal portion TM7 and the eighth terminal portion TM8) are provided along the first side portion 18E 1.
In this configuration, since the external terminals are arranged along the first side portion 18E1 and the third side portion 18E3 so as not to be arranged along the second side portion 18E2 and the fourth side portion 18E4, the degree of freedom of wiring in the external substrate having a structure for receiving the external terminals can be increased. This is because, in this configuration, it is not necessary to arrange the above-described structure in the region on the external substrate corresponding to the second side portion 18E2 and the fourth side portion 18E 4.
As shown in fig. 8, the first conductive member CM1 may have a first connection portion ED1 extending substantially perpendicularly to the surface of the first fixed-side wiring board 5F1 at one end. In this case, the first connection portion ED1 is joined to the first fixing-side wiring board 5F1 via the joining material SD. The same applies to the second to eighth conductive members CM2 to CM 8. As shown in fig. 14 a and 14B, the first fixing-side wiring board 5F1 may be joined to the first connection portion ED1 via the joining material SD in a state where the end face EP of the first connection portion ED1 is located on the inner side (the side closer to the optical axis JD) than the first fixing-side wiring board 5F 1. Alternatively, as shown in fig. 15, the first fixing-side terminal plate 5F1 may be joined to the first connection portion ED1 by welding while being pressed against the first connection portion.
These configurations can improve the connection strength between the conductive member CM (the first connection portion ED1 of the first conductive member CM 1) and the metal member 5 (the connection portion CT1 of the first fixing-side wiring board 5F 1).
The lens driving device 101 may include the base member 18 as a fixed-side member RG and the lens holding member 2 as a movable-side member MB supported to be movable relative to the base member 18, a fixed-side metal member 5F as a terminal block attached to the base member 18, and a shape memory alloy wire SA as a shape memory actuator having one end fixedly adhered to the fixed-side metal member 5F and configured to contract in accordance with a temperature increase to move the lens holding member 2. In this case, for example, as shown in fig. 16B, the base member 18 has a protrusion 18V, and the fixed-side metal member 5F (fifth fixed-side connection plate 5F5) has a through hole RH. The fixed-side metal member 5F is attached to the base member 18 in a state where the protrusion 18V is fitted into the through hole RH, and is fixed to the base member 18 by a photocurable adhesive EA disposed from the peripheral surface of the through hole RH over the outer surface of the protrusion 18V.
This configuration can prevent the shape memory alloy wire SA from contracting when the fixing-side metal member 5F is fixed to the base member 18. This is because, in this configuration, since the photocurable adhesive EA is used, it is not necessary to heat the adhesive for fixing the fixing-side metal member 5F to the base member 18. Therefore, this configuration can prevent the fixed-side metal member 5F from being positionally displaced when the fixed-side metal member 5F is fixed to the base member 18. As a result, this configuration can prevent deterioration of the operating characteristics of the shape memory alloy wire SA as the drive mechanism MK in the lens drive device 101, for example.
As shown in fig. 18, for example, the shape memory alloy wire SA as the shape memory actuator may be arranged to have one end fixed and bonded to a position separated from the through hole RH of the fixed-side metal member 5F in the vertical direction (Z-axis direction) and to extend in the horizontal direction (Y-axis direction). In the example shown in fig. 18, the fifth wire SA5 is arranged to have one end fixed to the holding portion J2 at a position separated from the fifth through hole RH5 of the fifth fixed-side wire plate 5F5 in the upward direction (Z1 direction) and to extend in the left direction (Y2 direction). The sixth wire SA6 is fixed at one end to the holding portion J4 at a position separated from the sixth through hole RH6 of the sixth fixed wire strap 5F6 in the downward direction (Z2 direction) and extends in the left direction (Y2 direction).
In this case, the fixed-side metal member 5F may have an extension portion EL extending in a direction away from the through hole RH. In the example shown in fig. 18, the fifth fixed-side contact plate 5F5 includes a fifth extension portion EL5 (extending in the Y2 direction and then in the Z2 direction) extending in a direction away from the fifth through hole RH 5. The sixth fixed-side contact plate 5F6 includes a sixth extension portion EL6 (extending in the Y2 direction and then in the Z2 direction) extending in a direction away from the sixth through hole RH 6.
The extension portion EL may be disposed so as to receive a rotational force about an axis AX extending in the front-rear direction (X-axis direction) as a rotational center when the shape memory alloy wire SA contracts. In the example shown in fig. 18, the fifth fixed-side terminal plate 5F5 is disposed so as to receive a rotational force in the direction shown by the arrow AR21 with the fifth shaft AX5 (see fig. 17 a) extending in the front-rear direction (X-axis direction) as the center of rotation when the fifth wire SA5 contracts in the direction shown by the arrow AR 20. That is, the fifth extension portion EL5 is disposed so as to receive a rotational force in the direction indicated by the arrow AR22 with the fifth axis AX5 as the rotational center. Similarly, the sixth fixed side connector plate 5F6 is disposed so as to receive a rotational force in the direction indicated by the arrow AR24 about the sixth axis AX6 (see fig. 17 a) extending in the front-rear direction (X-axis direction) as the rotational center when the sixth wire SA6 contracts in the direction indicated by the arrow AR 23. That is, the sixth extension portion EL6 is disposed so as to receive a rotational force in the direction indicated by the arrow AR25 with the sixth axis AX6 as the center of rotation.
As shown in fig. 17, the base member 18 may have a restricting wall portion RB that defines an abutment surface CF against which an extension portion EL that is intended to move in an arc about an axis AX extending in the front-rear direction (X-axis direction) abuts. In the example shown in fig. 17, the base member 18 has a fifth contact surface CF5 that defines a contact area against which the fifth extension portion EL5 contacts, and a sixth contact surface CF6 against which the sixth extension portion EL6 contacts, the fifth extension portion EL5 is moved in an arc about the fifth axis AX5 as a rotation center, and the sixth extension portion EL6 is moved in an arc about the sixth axis AX6 as a rotation center. The base member 18 may have a third recessed portion GR3 that forms a space inside (in the X2 direction) the peripheral edge of the fifth extension portion EL5 and is accessible from the outside (in the X1 direction). The inner surface (surface on the X2 side) of the fifth extension portion EL5 may be fixed and adhered to the base member 18 by a third photocurable adhesive EA3 filled in the third recessed portion GR 3.
This structure enables the fixing-side metal member 5F to be positioned by the projection 18V and the restricting wall RB. In addition, this configuration can prevent the fixed-side metal member 5F from rotating around the axis AX, and can prevent the fixed-side metal member 5F from peeling off from the base member 18.
As shown in fig. 17(B), a notch CUa may be provided in the fifth extended portion EL5 at a position overlapping the third recessed portion GR 3. The cut portion CUa may be used when the third recess GR3 is filled with the third photocurable adhesive EA 3. This configuration can facilitate filling of the third light-curable adhesive EA3 into the third recessed portion GR 3. In addition, this configuration enables the third photocurable adhesive EA3 to be continuously (integrally) adhered to the inner surface (surface on the X2 side) and the outer surface (surface on the X1 side) of the fifth extension portion EL5 and the end surface of the cut portion CUa.
The photocurable adhesive EA may be an adhesive having both the properties of the photocurable adhesive EA and the properties of a thermosetting adhesive. For example, the photocurable adhesive EA may be a hybrid adhesive that is cured at a time by irradiation of ultraviolet rays and cured at a second time by heating, as in the above-described example.
This configuration can suppress the positional displacement of the fixed-side metal member 5F with respect to the base member 18 when the photocurable adhesive EA is cured. Further, this configuration enables more firm adhesion between the fixed-side metal member 5F and the base member 18. This is because the shape memory alloy wire SA is not heated when the photocurable adhesive EA is cured once by ultraviolet rays. Further, the photocurable adhesive EA is cured once to such an extent that the positional deviation of the fixing-side metal member 5F does not occur, and is cured twice by heating in this state, so that the adhesive strength between the fixing-side metal member 5F and the base member 18 is improved.
The fixed-side metal member 5F may include a first terminal plate (fifth fixed-side terminal plate 5F5) and a second terminal plate (sixth fixed-side terminal plate 5F6), and a first protrusion (upper protrusion 18VU) of the first terminal plate (fifth fixed-side terminal plate 5F5) and a second protrusion (lower protrusion 18VL) of the second terminal plate (sixth fixed-side terminal plate 5F6) may be disposed in proximity to each other so as to be integrally covered with a light-curable adhesive EA (first light-curable adhesive EA 1). In the example shown in fig. 17B, the upper side protrusion 18VU of the fifth fixing-side wiring board 5F5 and the lower side protrusion 18VL of the sixth fixing-side wiring board 5F6 are arranged in proximity to each other in the vertical direction (Z-axis direction) so as to be integrally covered with the first photocurable adhesive EA 1. The term "close" means that, for example, the distance between the upper projection 18VU and the lower projection 18VL is not more than half the height of the first fixed-side pedestal portion 18D 1.
This configuration can improve the manufacturing efficiency of the lens driving device 101. This is because the adhesive fixation of the two fixing-side metal members 5F (the fifth fixing-side wiring board 5F5 and the sixth fixing-side wiring board 5F6) is achieved by one application of the photo-curable adhesive EA (the first photo-curable adhesive EA 1).
The preferred embodiments of the present invention have been described above in detail. However, the present invention is not limited by the above embodiments. The above-described embodiments can be applied to various modifications, replacements, and the like without departing from the scope of the present invention. In addition, the features described with reference to the above embodiments may be combined as appropriate as long as they are not technically contradictory.
Description of the reference numerals
1. spacer member 2. lens holding member 2D. Movable side seat 2D 1. first movable side seat 2D 2. second movable side seat 2S. projection 2S 1. second projection 2T. projection 2V. projection 4. first outer peripheral wall section 4A 1. first side plate section 4A 2. second side plate section 4A 3. fourth side plate section 4A 5. second side plate section 4C 4. second outer peripheral wall section 4C 4834. second side plate section 4C 4. second side plate section 4A 3874. second side wall section 4C 4. second side plate section 4A 3. second side plate section 4C 4. second side wall section 2D 3. movable side seat 2S. projection 4. second projection 4S. second projection 4A. second side plate section 4C Part 5F 1. first fixed side connection pad 5F 2. second fixed side connection pad 5F 3. fourth fixed side connection pad 5F 5. fifth fixed side connection pad 5F 6. sixth fixed side connection pad 5F 7. seventh fixed side connection pad 5F 8. eighth fixed side connection pad 5M 20. fourth movable side connection pad 5M 2. second movable side connection pad 5M 3. fourth movable side connection pad 5M 4. fourth movable side connection pad 6A 6. fourth fixed side connection pad 5F 3. fourth fixed side connection pad 5F 7. fourth movable side connection pad 42. fourth movable side connection pad 6A 8. fifth movable side connection pad portion AH 866. fourth movable side connection pad portion AH 26A 38. fourth movable side connection pad 6A 8. fourth movable side connection pad portion AH 6A 38. fifth through-fourth fixed side connection pad 5F 3. fifth through-fourth through-second movable side connection pad 5F 38A 6A 866A 48 Through-hole 6AH 7. seventh through- hole 6B 1. second portion 6B 3. third portion 6B 4. fourth portion 6B 5. fifth portion 6BH 1. first through-hole 6BH 2. second through-hole 6BH 3. third through-hole 6BH 4. fourth through-hole 6BH 638. fifth through-hole 6BH 638. fourth conductive part 18E 73718. fifth conductive part 18E 2. second through- hole 18E 18. fifth through-hole 6BH 8. cylindrical part 18, 18A. 18E 9. fourth conductive part 18E 9. fifth conductive part 18E 20. fourth through-hole 6B 3884. fifth through-hole 6BH 18. fourth through-hole 18B 9. fifth conductive part 18E 18 The second conductive part 20B 2. the second conductive part 20B 3. the third conductive part 101. the lens drive device AH 1. the second rectangular hole AH 2. the second rectangular hole AX. the fifth axis AX 5. the fifth axis AX 6. the sixth axis CF, the CFb. the contact surface CF 5. the fifth contact surface CF 6. the sixth contact surface CF 2. the fourth conductive part 1. the second conductive part 3. the fourth conductive part 8. the fifth conductive part 8. the second conductive part 4958. the second conductive part 4948. the fifth contact surface CM 6. the second conductive part 4948. the second conductive part 4958. the second conductive part 4948. the second conductive part can be joined to the fifth conductive part 8. the second conductive part 20B 2. the second conductive part 20B 3. the third conductive part 101. the lens drive device AH 6868. the second rectangular hole AH 2. the second conductive part can be joined to the fifth conductive part 8. the second conductive part can be joined to the second conductive part 8. the second conductive part No. the third conductive part 8. the second conductive part No. the second conductive part 3. the second conductive The bonded surface CP6 · sixth bonding surface CP7 · seventh bonding surface CP8 · eighth bonding surface CP9 · ninth bonding surface CP10 · tenth bonding surface CP12 · twelfth bonding surface CT1 · CT12 · connecting portion CUa, the cut-away portion EA · light-curable adhesive EA1 · fifth light-curable adhesive EA2 · second light-curable adhesive EA3 · third light-curable adhesive EA4 · fourth light-curable adhesive EA5 · fifth light-curable adhesive connecting portion EC2 · elastic contact portion ED 5474 · ED3 · fifth light-curable adhesive connecting portion ED3 · second light-curable adhesive connecting portion ED3 · fifth light-curable adhesive connecting portion ED The second terminal portion of the first terminal portion of the second terminal portion of Ninth terminal part TM10 DEG tenth terminal part TM1 DEG first terminal part

Claims (7)

1. A lens driving device is characterized by comprising:
a base member as a fixed-side member;
a lens holding member as a movable-side member supported to be movable relative to the base member;
a wiring board mounted to the base member; and
a shape memory actuator having one end fixed to the wiring board and configured to move the lens holding member by contracting in response to a temperature rise,
the base member has a protrusion portion that is formed on the base member,
the wiring board has a through-hole,
the wiring board is attached to the base member with the projection portion fitted in the through hole, and is fixed to the base member with a photocurable adhesive disposed from the peripheral surface of the through hole to the outer surface of the projection portion.
2. The lens driving device according to claim 1,
the shape memory actuator is configured to have one end fixed and adhered to a position separated from the through hole of the wiring board along the vertical direction and extend along the horizontal direction,
an extension portion extending in a direction away from the through hole,
the extension portion receives a rotational force about an axis extending in the front-rear direction as a rotational center when the shape memory actuator contracts,
the base member has a restriction wall portion that defines an abutment surface against which the extended portion subjected to the rotational force abuts, and a recess portion that forms a space inside a peripheral edge of the extended portion and is accessible from outside,
the recess is filled with the photo-curable adhesive, and the inner surface of the extension portion is fixed to the base member.
3. The lens driving device according to claim 2,
a notch portion is provided at a position of the extension portion overlapping the recess portion.
4. The lens driving device according to any one of claims 1 to 3,
the photocurable adhesive is an adhesive having the properties of the photocurable adhesive and the properties of a thermosetting adhesive.
5. The lens driving device according to any one of claims 1 to 3,
the patch panel includes a first patch panel and a second patch panel,
the first protruding portion of the first wiring board and the second protruding portion of the second wiring board are disposed in proximity to each other so as to be integrally covered with the photocurable adhesive.
6. The lens driving device according to claim 4,
the patch panel includes a first patch panel and a second patch panel,
the first protruding portion of the first wiring board and the second protruding portion of the second wiring board are disposed in proximity to each other so as to be integrally covered with the photocurable adhesive.
7. A camera module, comprising:
the lens driving device according to any one of claims 1 to 6;
the lens body; and
and an imaging element facing the lens body.
CN202011201191.XA 2020-11-02 2020-11-02 Lens driving device and camera module Pending CN114460789A (en)

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JP2021178848A JP2022074135A (en) 2020-11-02 2021-11-01 Lens drive device and camera module

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JP2007108598A (en) * 2005-10-17 2007-04-26 Sony Corp Lens unit and imaging apparatus
US20070097527A1 (en) * 2005-10-17 2007-05-03 Sony Corporation Lens unit and imaging device
US20090244728A1 (en) * 2008-04-01 2009-10-01 Kabushiki Kaisha Toshiba Camera module and method for manufacturing the same
CN102089695A (en) * 2008-07-11 2011-06-08 精工电子有限公司 Drive module, method of assembling the same, and electronic apparatus
CN102227664A (en) * 2008-12-01 2011-10-26 精工电子有限公司 Driving module and electronic device
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