WO2022209627A1

WO2022209627A1 - Image sensor drive device and camera module

Info

Publication number: WO2022209627A1
Application number: PCT/JP2022/009991
Authority: WO
Inventors: 勝彦大友; 清行伊藤; 昌仁生井
Original assignee: アルプスアルパイン株式会社
Priority date: 2021-03-31
Filing date: 2022-03-08
Publication date: 2022-10-06
Also published as: CN117157570A; JPWO2022209627A1

Abstract

In the present invention, an image sensor drive device (101) comprises a fixed-side member (FB), an image sensor holder (2) to which an image sensor (IS) is integrally provided, and a drive unit (DM) that causes the image sensor holder (2) to move relative to the fixed-side member (FB). The drive unit (DM) is configured including a shape memory alloy wire (SA) provided between the fixed-side member (FB) and a moveable-side member (MB) that includes the image sensor holder (2). The shape memory alloy wire (SA) includes first through eighth wires (SA1–SA8), and one end of each of the first through eighth wires (SA1–SA8) is fixed to the fixed-side member (FB) and the other end is fixed to the moveable-side member (MB).

Description

Imaging device driving device and camera module

The present disclosure relates to an imaging device driving device and a camera module.

Conventionally, a voice coil motor configured to move an image sensor (imaging element) with a magnet and a coil is known (see Patent Document 1).

Japanese Patent Application Laid-Open No. 2020-170170

However, since this voice coil motor is driven by magnets and coils, there is a risk that the size will increase.

Therefore, it is desirable to provide a smaller-sized imaging device driving device.

An imaging device driving device according to an embodiment of the present invention includes a stationary member, an imaging device holder integrally provided with an imaging device, and a driving unit for moving the imaging device holder with respect to the fixed member. and wherein the drive unit includes a plurality of shape memory alloy wires provided between a movable member including the image pickup device holder and the fixed member. and the plurality of shape memory alloy wires are first wires spaced apart in a first direction with the imaging element interposed therebetween in a top view along a direction perpendicular to an imaging surface of the imaging element. and a fifth wire, and a third wire and a seventh wire spaced apart in a second direction perpendicular to the first direction across the imaging element, and viewed along the first direction A second wire arranged to intersect the first wire in a side view, and a fourth wire arranged to intersect the third wire in a side view along the second direction. a sixth wire arranged to cross the fifth wire in a side view along the first direction; and a sixth wire arranged to intersect the fifth wire in a side view along the first direction and an eighth wire arranged to intersect with the seven wires, wherein one end of each of the first to eighth wires is fixed to the fixed side member and the other end is fixed to the movable side member. It is

The image pickup device driving device described above can realize a smaller size than a device using a voice coil motor.

It is an upper perspective view of an imaging device drive. It is a downward perspective view of an image pick-up element drive. 1 is an exploded perspective view of an imaging device driving device; FIG. FIG. 3 is a perspective view of an imaging element holder, an elastic metal member, and a base member; FIG. 4 is a perspective view of a metal member connected to an imaging element holder; 4 is a perspective view of a metal member connected to the base member; FIG. 1 is a diagram of a metal member to which a shape memory alloy wire is attached; FIG. 1 is a diagram of a metal member to which a shape memory alloy wire is attached; FIG. It is a perspective view of a base member. 1 is a perspective view of an elastic metal member, a shape memory alloy wire, a metal member, and a conductive member; FIG. FIG. 4 is a top view of an elastic metal member, a metal member, and a conductive member; FIG. 4 is a diagram showing an example of a path of current flowing through a shape memory alloy wire; FIG. 10 is a diagram showing another example of a path of current flowing through a shape memory alloy wire; FIG. 10 is a table showing expansion and contraction states of shape memory alloy wires when each of six degrees of freedom of movement of an imaging element holder is realized; FIG. FIG. 4A is a top view, a front view, a rear view, a left side view, and a right side view of an imaging element holder and a base member which are connected by a shape memory alloy wire; FIG. 3 is a top view of an imaging element holder and a base member; FIG. 3 is a top view of an imaging element holder and a base member; FIG. 2 is a front view of an imaging device holder and a base member; FIG. 2 is a front view of an imaging device holder and a base member; 4 is a right side view of the imaging element holder and the base member; FIG. FIG. 3 is a top view of an imaging element holder and a base member;

An imaging device driving device 101 according to an embodiment of the present invention will be described below with reference to the drawings. 1A and 1B are perspective views of the imaging device driving device 101. FIG. Specifically, FIG. 1A is a top perspective view of the imaging device driving device 101, and FIG. 1B is a bottom perspective view of the imaging device driving device 101. FIG. FIG. 2 is an exploded perspective view of the imaging device driving device 101. As shown in FIG.

　In Figures 1A, 1B, and 2, X1 represents one direction of the X-axis that constitutes the three-dimensional orthogonal coordinate system, and X2 represents the other direction of the X-axis. Y1 represents one direction of the Y-axis forming the three-dimensional orthogonal coordinate system, and Y2 represents the other direction of the Y-axis. Similarly, Z1 represents one direction of the Z-axis forming the three-dimensional orthogonal coordinate system, and Z2 represents the other direction of the Z-axis. 1A, 1B, and 2, the X1 side of the image pickup device driving device 101 corresponds to the front side (front side) of the image pickup device driving device 101, and the X2 side of the image pickup device driving device 101 corresponds to the image pickup device driving device. It corresponds to the rear side (back side) of 101 . The Y1 side of the imaging device driving device 101 corresponds to the left side of the imaging device driving device 101 , and the Y2 side of the imaging device driving device 101 corresponds to the right side of the imaging device driving device 101 . The Z1 side of the image pickup device driving device 101 corresponds to the upper side (object side) of the image pickup device driving device 101, and the Z2 side of the image pickup device driving device 101 corresponds to the lower side of the image pickup device driving device 101 (image pickup device side). corresponds to The same applies to other drawings.

The imaging device driving device 101 includes a cover member 4 that is part of the fixed side member FB, as shown in FIGS. 1A, 1B, and 2 .

The cover member 4 is configured to function as part of the housing HS that covers each member. In this embodiment, the cover member 4 is made of non-magnetic metal. However, the cover member 4 may be made of a magnetic metal.

In the example shown in FIGS. 1A and 1B, the cover member 4 includes a rectangular tubular outer peripheral wall portion 4A and a rectangular annular flat plate shape provided so as to be continuous with the upper end (Z1 side end) of the outer peripheral wall portion 4A. and a top plate portion 4B. A circular opening 4k is formed in the center of the top plate portion 4B. The outer peripheral wall portion 4A includes a first side plate portion 4A1 to a fourth side plate portion 4A4. The first side plate portion 4A1 and the third side plate portion 4A3 face each other, and the second side plate portion 4A2 and the fourth side plate portion 4A4 face each other. The first side plate portion 4A1 and the third side plate portion 4A3 extend perpendicularly to the second side plate portion 4A2 and the fourth side plate portion 4A4.

The cover member 4 is joined to the base member 8 with an adhesive, as shown in FIGS. 1A and 1B. The base member 8 constitutes a housing HS together with the cover member 4 .

As shown in FIG. 2, the housing HS accommodates the drive section DM, the image sensor IS, the image sensor holder 2, the metal member 5, the elastic metal member 6, the circuit board 7, and the like. A flexible substrate 3 is attached to the lower surface (surface on the Z2 side) of the base member 8 that constitutes the housing HS. In FIG. 1A, for the sake of clarity, the imaging element IS is provided with a cross pattern, the flexible substrate 3 is provided with a coarse dot pattern, and the circuit board 7 is provided with a fine dot pattern.

The drive unit DM includes a shape memory alloy wire SA, which is an example of a shape memory actuator. In this embodiment, the shape memory alloy wires SA include first wires SA1 to eighth wires SA8 having substantially the same length and substantially the same diameter. The shape memory alloy wire SA increases in temperature when current flows, and contracts according to the increase in temperature. The drive unit DM can move the imaging element holder 2 using contraction of the shape memory alloy wires SA. As for the shape memory alloy wires SA, when one or more of the first wires SA1 to SA8 contract, the imaging device holder 2 moves, and the movement causes another one or more to be elongated. (decompressed).

In the present embodiment, the driving part DM is configured so that the movable side member MB can move with six degrees of freedom. The movements with six degrees of freedom are translation in a first direction (Z-axis direction) parallel to a first rotation axis RX1 perpendicular to the imaging surface of the image sensor IS, and movement in a second direction (X-axis direction) perpendicular to the first direction. translation, translation in a third direction (Y-axis direction) perpendicular to the first and second directions, rotation about the first direction (Z-axis direction), rotation about a second direction (X-axis direction), and , including rotation about a third direction (the Y-axis direction). The second direction (X-axis direction) is a direction parallel to the second rotation axis RX2, and the third direction (Y-axis direction) is a direction parallel to the third rotation axis RX3. The imaging surface of the imaging device IS is a plane parallel to the upper surface of the imaging device IS on the subject side.

The flexible substrate 3 is a flexible substrate on which a wiring pattern is formed for connecting the imaging device driving device 101 and a device outside the imaging device driving device 101 . In this embodiment, the flexible substrate 3 is a flexible printed circuit board configured to be repeatedly deformable.

The circuit board 7 is a board on which the imaging device IS is mounted. In this embodiment, the circuit board 7 is a rigid circuit board.

The movable side member MB is a member that is driven by the drive section DM. In this embodiment, the movable-side member MB is composed of the image sensor IS, the circuit board 7 on which the image sensor IS is mounted, and the image sensor holder 2 capable of holding the circuit board 7 .

The imaging element holder 2 is formed by injection molding synthetic resin such as liquid crystal polymer (LCP). Specifically, as shown in FIG. 2, the imaging element holder 2 includes a frame 2F that is substantially rectangular in top view, and movable side pedestals formed at two of the four corners of the frame 2F. It includes a portion 2D and projecting portions 2S formed at the remaining two of the four corners of the frame 2F. In this embodiment, the circuit board 7 is configured to be bonded to the lower surface of the frame 2F with an adhesive.

The movable-side pedestal portion 2D includes a first movable-side pedestal portion 2D1 and a second movable-side pedestal portion 2D2. The first movable-side pedestal portion 2D1 and the second movable-side pedestal portion 2D2 are arranged so as to face each other with the first rotation axis RX1 interposed therebetween. Similarly, the projecting portion 2S includes a first projecting portion 2S1 and a second projecting portion 2S2. The first projecting portion 2S1 and the second projecting portion 2S2 are arranged to face each other with the first rotation axis RX1 interposed therebetween. Specifically, the movable-side pedestal portion 2D and the protruding portion 2S are arranged so as to correspond to the four corners of the imaging element holding body 2 (frame body 2F) having a substantially rectangular outer shape when viewed from above. Moreover, they are arranged so as to be alternately arranged. A part of the elastic metal member 6 is placed on each of the two movable-side pedestals 2D, as shown in FIG.

FIG. 3 is a perspective view of the elastic metal member 6 connected to the image pickup device holder 2 and the base member 8. The positional relationship between the image pickup device holder 2 and the base member 8 and the elastic metal member 6 is shown in FIG. is shown. In FIG. 3, for clarity, the imaging device holder 2 has a fine dot pattern and the base member 8 has a coarse dot pattern. 3, illustration of members other than the imaging element holder 2, the elastic metal member 6, and the base member 8 is omitted for clarity.

The elastic metal member 6 is configured to movably support the imaging element holder 2 with respect to the fixed side member FB (base member 8). In this embodiment, the elastic metal member 6 is made of a conductive metal plate mainly made of, for example, a copper alloy, a titanium-copper alloy (titanium-copper), or a copper-nickel alloy (nickel-tin-copper). there is

The base member 8 is formed by injection molding using synthetic resin such as liquid crystal polymer (LCP). In this embodiment, as shown in FIG. 2, the base member 8 has a substantially rectangular outline in top view and has an opening 8K in the center. Specifically, the base member 8 has four side portions 8E (first side portion 8E1 to fourth side portion 8E4) arranged to surround the opening 8K.

Specifically, the base member 8 includes fixed side pedestals 8D formed at two of the four corners of the base member 8, as shown in FIG. The fixed-side pedestal portion 8D protrudes upward (in the Z1 direction) from the plate-like base portion of the base member 8 . The fixed side pedestal portion 8D includes a first fixed side pedestal portion 8D1 and a second fixed side pedestal portion 8D2. The first fixed side seat portion 8D1 and the second fixed side seat portion 8D2 are arranged so as to face each other with the first rotation axis RX1 interposed therebetween. Further, as shown in FIG. 3, the first fixed side pedestal portion 8D1 is arranged so as to face the first projecting portion 2S1 of the image pickup element holder 2, and the second fixed side pedestal portion 8D2 is arranged to face the image pickup element holding portion 8D2. It is arranged so as to face the second projecting portion 2S2 of the body 2. As shown in FIG.

The elastic metal member 6 is configured to connect the movable-side pedestal portion 2D formed on the imaging element holder 2 and the fixed-side pedestal portion 8D formed on the base member 8 . Specifically, as shown in FIG. 3, the elastic metal member 6 includes a first fixed portion 6e1 attached to a first fixed-side pedestal portion 8D1 formed on the base member 8, and an elastic metal member 6 formed on the imaging element holder 2. a second fixed portion 6e2 attached to the first movable side pedestal portion 2D1; a third fixed portion 6e3 attached to the second fixed side pedestal portion 8D2 formed on the base member 8; and a fourth fixing portion 6e4 attached to the second movable side pedestal portion 2D2. As shown in FIG. 3, the elastic metal member 6 includes an elastically deformable first arm portion 6g1 connecting the first fixing portion 6e1 and the second fixing portion 6e2, a second fixing portion 6e2 and a third fixing portion 6e3. an elastically deformable second arm portion 6g2 that connects the third fixing portion 6e3 and the fourth fixing portion 6e4, and an elastically deformable third arm portion 6g3 that connects the fourth fixing portion 6e4 and the first fixing portion 6e1 It has an elastically deformable fourth arm portion 6g4 that connects the .

The metal member 5 is configured so that the end of the shape memory alloy wire SA is fixed. In this embodiment, the metal member 5 includes a fixed side metal member 5F and a movable side metal member 5M, as shown in FIG. The stationary metal member 5</b>F is configured to be fixed to the stationary pedestal portion 8</b>D of the base member 8 . The movable-side metal member 5</b>M is configured to be fixed to the movable-side pedestal portion 2</b>D of the imaging element holder 2 .

More specifically, the fixed-side metal member 5F is also called a fixed-side terminal plate, and includes a first fixed-side terminal plate 5F1 to an eighth fixed-side terminal plate 5F8. The movable-side metal member 5M is also called a movable-side terminal plate, and includes a first movable-side terminal plate 5M1 and a second movable-side terminal plate 5M2.

Next, referring to FIGS. 4A and 4B, the positional relationship between each of the imaging element holder 2 and the base member 8 and the metal member 5 will be described. FIG. 4A is a perspective view of the imaging element holder 2 to which the movable-side metal member 5M (movable-side terminal plate) is attached. FIG. 4B is a perspective view of the base member 8 to which the fixed-side metal member 5F (fixed-side terminal plate) is attached. For clarity, in FIG. 4A, the movable metal member 5M has a dot pattern, and in FIG. 4B, the fixed metal member 5F has a dot pattern.

In the example shown in FIG. 4A, the first movable terminal plate 5M1 is fixed to the X1 side wall (front mounting surface) and the Y1 side wall (left mounting surface) of the first movable pedestal portion 2D1. Specifically, in a state in which the groove 2G (see FIG. 2) formed on the upper surface of the first movable-side pedestal portion 2D1 and the bent piece BP formed on the first movable-side terminal plate 5M1 are engaged with each other, the first The movable terminal plate 5M1 is fixed to the first movable pedestal 2D1 with an adhesive. The adhesive is, for example, a photocurable adhesive. The photocurable adhesive is, for example, an ultraviolet curable adhesive or a visible light curable adhesive. Similarly, the second movable terminal plate 5M2 is fixed to the X2 side wall (rear mounting surface) and the Y2 side wall (right mounting surface) of the second movable pedestal portion 2D2. Specifically, in a state in which the groove 2G (see FIG. 2) formed on the upper surface of the second movable-side pedestal portion 2D2 and the bent piece BP formed on the second movable-side terminal plate 5M2 are engaged with each other, the second The movable terminal plate 5M2 is fixed to the second movable pedestal 2D2 with an adhesive.

In the example shown in FIG. 4B, the first stationary terminal plate 5F1 and the second stationary terminal plate 5F2 are located on the X1 side of the first stationary seat 8D1 arranged along the first side 8E1 of the base member 8. It is fixed to the side wall (front mounting surface). Specifically, the first stationary terminal plate 5F1 and the second stationary terminal plate 5F2 are fixed to the first stationary pedestal portion 8D1 with an adhesive. The adhesive is, for example, a photocurable adhesive. The photocurable adhesive is, for example, an ultraviolet curable adhesive or a visible light curable adhesive. Similarly, the third stationary terminal plate 5F3 and the fourth stationary terminal plate 5F4 (not visible in FIG. 4B) are attached to the second stationary pedestal 8D2 arranged along the second side 8E2 of the base member 8 It is fixed to the side wall (left mounting surface) on the Y1 side. Also, the fifth fixed side terminal plate 5F5 and the sixth fixed side terminal plate 5F6 (not visible in FIG. 4B) are arranged along the third side 8E3 of the base member 8 on the X2 side of the second fixed side pedestal portion 8D2. side wall (rear mounting surface). The seventh stationary terminal plate 5F7 and the eighth stationary terminal plate 5F8 are arranged along the fourth side 8E4 of the base member 8 on the Y2 side wall (right mounting surface) of the first stationary pedestal 8D1. ).

The shape memory alloy wire SA extends along the inner surface of the outer peripheral wall portion 4A of the cover member 4, and is configured to movably support the movable side member MB with respect to the fixed side member FB. In the present embodiment, the shape memory alloy wires SA include first wires SA1 to eighth wires SA8 as shown in FIG. It is configured to movably support the imaging device holder 2 . Specifically, as shown in FIG. 2, each of the first wire SA1 to the eighth wire SA8 has one end fixed to the stationary metal member 5F by crimping or welding, and the other end is crimped or welded. is fixed to the movable-side metal member 5M.

Next, the metal member 5 to which the shape memory alloy wire SA is attached will be described with reference to FIGS. 5A and 5B. FIG. 5A shows a seventh wire SA7 attached to each of the second movable terminal plate 5M2 and the seventh fixed terminal plate 5F7, and a wire SA7 attached to each of the second movable terminal plate 5M2 and the eighth fixed terminal plate 5F8. It is a figure when the 8th wire SA8 attached is seen from the Y2 side (right side). FIG. 5B shows a seventh wire SA7 attached to each of the second movable side terminal plate 5M2 and the seventh fixed side terminal plate 5F7, and each of the second movable side terminal plate 5M2 and the eighth fixed side terminal plate 5F8. It is a figure when the 8th wire SA8 attached is seen from the X1 side (front side). Note that the positional relationship of each member shown in FIGS. 5A and 5B corresponds to the positional relationship when the imaging device driving device 101 is assembled. 5A and 5B, illustration of other members is omitted for clarity. Also, the following description with reference to FIGS. 5A and 5B relates to the combination of the seventh wire SA7 and the eighth wire SA8, the combination of the first wire SA1 and the second wire SA2, the third wire SA3 and the fourth wire SA4. and the combination of the fifth wire SA5 and the sixth wire SA6.

Specifically, one end of the seventh wire SA7 is fixed to the seventh fixed terminal plate 5F7 at the holding portion J2 of the seventh fixed terminal plate 5F7, and the other end of the seventh wire SA7 is fixed to the second movable terminal plate 5F7. It is fixed to the second movable side terminal plate 5M2 at the lower holding portion J1 of the terminal plate 5M2. Similarly, one end of the eighth wire SA8 is fixed to the eighth fixed terminal plate 5F8 at the holding portion J4 of the eighth fixed terminal plate 5F8, and the other end of the eighth wire SA8 is fixed to the second movable terminal plate. It is fixed to the second movable side terminal plate 5M2 at the upper holding portion J3 of 5M2.

The holding portion J1 is formed by bending a portion of the second movable terminal plate 5M2. Specifically, a portion of the second movable terminal plate 5M2 forms a holding portion J1 by being bent while sandwiching the end (the other end) of the seventh wire SA7. An end (the other end) of the seventh wire SA7 is fixed to the holding portion J1 by welding. The same applies to the holding portions J2 to J4.

As shown in FIG. 5A, the seventh wire SA7 and the eighth wire SA8 are arranged so as to be twisted relative to each other (three-dimensionally intersect when viewed from the Y2 side). That is, the seventh wire SA7 and the eighth wire SA8 are arranged so as not to contact each other (become non-contact).

Next, with reference to FIG. 6, the details of the base member 8, which is a part of the fixed side member FB, will be described. 6 is a perspective view of the base member 8. FIG. Specifically, the upper view of FIG. 6 is a perspective view of the base member 8 with the conductive member CM removed, and the central view of FIG. 6 is a perspective view of the base member 8 in which the conductive member CM is embedded. In addition, in the central view of FIG. 6 and the lower view of FIG. 6, the conductive member CM is given a dot pattern for clarity.

The base member 8 is configured to function as a fixed-side wire support section that supports one end of each of the first wire SA1 to the eighth wire SA8. Further, the imaging device holder 2 is configured to function as a movable side wire support section that supports the other ends of the first to eighth wires SA1 to SA8. With this configuration, the movable member MB is supported by the first wire SA1 to the eighth wire SA8 so as to be movable with respect to the fixed member FB with six degrees of freedom.

As described above, the fixed side pedestal portion 8D is formed on the upper surface of the base member 8 on the subject side (Z1 side surface). The fixed side pedestal portion 8D includes a first fixed side pedestal portion 8D1 and a second fixed side pedestal portion 8D2. The first fixed side seat portion 8D1 and the second fixed side seat portion 8D2 are arranged to face each other with the first rotation axis RX1 interposed therebetween.

In the base member 8, as shown in the central view of FIG. 6, a conductive member CM formed of a metal plate containing a material such as copper, iron, or an alloy containing them as a main component is embedded by insert molding. . In this embodiment, the conductive member CM includes a connecting portion ED exposed on the lower surface (Z2 side surface) of the base member 8 and extending outward, and an upper surface (Z1 side surface) of the fixed side pedestal portion 8D of the base member 8 (Z1 side surface). ).

Specifically, the conductive member CM includes a first conductive member CM1 and a second conductive member CM2. The first conductive member CM1 includes a first connection portion ED1 and a first joint surface portion CP1, and the second conductive member CM2 includes a second connection portion ED2 and a second joint surface portion CP2.

Next, the positional relationship among the metal member 5, the elastic metal member 6, the conductive member CM, and the shape memory alloy wire SA will be described with reference to FIGS. 7A and 7B. 7A and 7B are diagrams showing the positional relationship among the metal member 5, the elastic metal member 6, the conductive member CM, and the shape memory alloy wire SA. Specifically, FIG. 7A is a perspective view of each member (metal member 5, elastic metal member 6, conductive member CM, and shape memory alloy wire SA), and FIG. 7B is a top view of each member. In addition, in FIGS. 7A and 7B, dot patterns are given to the movable-side metal member 5M and the conductive member CM for clarity. Also, in FIG. 7B, illustration of the shape memory alloy wire SA is omitted for clarity.

As shown in FIG. 3, the elastic metal member 6 includes a first fixed portion 6e1 fixed to the first fixed-side pedestal portion 8D1 (see FIG. 2) of the base member 8, and a first movable portion 6e1 of the imaging element holder 2. A second fixing portion 6e2 fixed to the side pedestal portion 2D1 (see FIG. 2), a third fixing portion 6e3 fixed to the second fixed side pedestal portion 8D2 (see FIG. 2) of the base member 8, and an imaging A fourth fixing portion 6e4 fixed to the second movable side pedestal portion 2D2 (see FIG. 2) of the element holder 2, a first arm portion 6g1 connecting the first fixing portion 6e1 and the second fixing portion 6e2, A second arm portion 6g2 connecting the second fixing portion 6e2 and the third fixing portion 6e3, a third arm portion 6g3 connecting the third fixing portion 6e3 and the fourth fixing portion 6e4, a fourth fixing portion 6e4 and the first fixing portion 6e1. and a fourth arm portion 6g4 that connects the

The first fixing portion 6e1 has a first through hole 6H1 and a second through hole 6H2 through which the upwardly protruding columnar protrusion 8T (see FIG. 4B) formed on the first fixed side pedestal portion 8D1 is inserted. , and a third through hole 6H3 used for bonding with the first bonding surface portion CP1 (see the lower diagram of FIG. 6) of the first conductive member CM1. In this embodiment, the fixing between the elastic metal member 6 and the projecting portion 8T is achieved by subjecting the projecting portion 8T to hot crimping or cold crimping. However, the fixing between the elastic metal member 6 and the projecting portion 8T may be realized by an adhesive. In addition, in the present embodiment, the elastic metal member 6 and the first conductive member CM1 are joined together by welding such as laser welding. However, the joint between the elastic metal member 6 and the first conductive member CM1 may be realized by solder, a conductive adhesive, or the like.

The second fixing portion 6e2 has a fourth through hole 6H4 and a fifth through hole 6H5 through which the upwardly projecting columnar protrusion 2T (see FIG. 4A) formed on the first movable side pedestal portion 2D1 is inserted. and a sixth through-hole 6H6 used for joining with the tip of the bent piece BP (see FIG. 4A) of the first movable-side terminal plate 5M1. In this embodiment, the fixing of the elastic metal member 6 and the projecting portion 2T is achieved by subjecting the projecting portion 2T to hot crimping or cold crimping. However, the fixing between the elastic metal member 6 and the projecting portion 2T may be realized by an adhesive. In addition, in this embodiment, the elastic metal member 6 and the bent piece BP of the first movable terminal plate 5M1 are joined together by welding such as laser welding. However, the joint between the elastic metal member 6 and the bent piece BP may be realized by solder, a conductive adhesive, or the like.

Similarly, in the third fixing portion 6e3, a seventh through-hole 6H7 and an eighth through-hole 6H7 through which an upwardly protruding columnar projection 8T (see FIG. 4B) formed on the second fixed-side pedestal portion 8D2 is inserted. A through hole 6H8 and a ninth through hole 6H9 used for joining with the second joint surface portion CP2 (see the lower diagram of FIG. 6) of the second conductive member CM2 are formed.

Further, in the fourth fixing portion 6e4, a tenth through-hole 6H10 and an eleventh through-hole 6H10 through which a cylindrical protrusion 2T (see FIG. 4A) protruding upward formed on the second movable side pedestal portion 2D2 is inserted. A hole 6H11 and a twelfth through hole 6H12 used for joining with the tip of the bent piece BP (see FIG. 4A) of the second movable terminal plate 5M2 are formed.

Each of the first arm portion 6g1 to the fourth arm portion 6g4 of the elastic metal member 6 is an elastically deformable arm portion having four curved portions. Therefore, the imaging element holder 2 can move with respect to the base member 8 (fixed member FB) not only in the direction parallel to the first rotation axis RX1, but also in the direction intersecting the first rotation axis RX1. ing.

As shown in FIG. 7B, the elastic metal member 6 is configured to have two-fold rotational symmetry with respect to the first rotation axis RX1. Therefore, the elastic metal member 6 hardly affects the weight balance of the image pickup device holder 2 . In addition, the elastic metal member 6 has almost no adverse effect on the weight balance of the movable side member MB supported by the eight shape memory alloy wires SA (first wire SA1 to eighth wire SA8).

The fixed-side metal member 5F has a connection portion CT (see FIGS. 5A and 5B) and is configured to be joined to the conductive pattern PT of the flexible substrate 3 via the connection portion CT. In this embodiment, the connecting portion CT includes a first connecting portion CT1 to an eighth connecting portion CT8.

The flexible board 3 includes, as shown in FIG. 2, a substantially rectangular inner portion 3i attached to the lower surface of the circuit board 7 and a substantially rectangular annular outer portion 3e attached to the lower surface of the base member 8. . A first conductive pattern PT1 to a tenth conductive pattern PT10 are formed in the outer portion 3e, and a large number of conductive patterns (not shown) used for connection with the imaging element IS are formed in the inner portion 3i. there is A substantially U-shaped slit (opening) is formed between the inner portion 3i and the outer portion 3e so that the movement of the inner portion 3i is not hindered.

Specifically, the first connecting portion CT1 of the first fixed-side terminal plate 5F1 is joined to the first conductive pattern PT1 (see FIG. 2) of the flexible substrate 3 by soldering. Similarly, the second connection portion CT2 of the second fixed terminal plate 5F2 is soldered to the second conductive pattern PT2 (see FIG. 2) of the flexible substrate 3, and the third fixed terminal plate 5F3 is The third connection portion CT3 is joined to the third conductive pattern PT3 (see FIG. 2) of the flexible substrate 3 by soldering, and the fourth connection portion CT4 of the fourth fixed terminal plate 5F4 is soldered. It is joined to the fourth conductive pattern PT4 (see FIG. 2) of the flexible substrate 3, and the fifth connecting portion CT5 of the fifth fixed-side terminal plate 5F5 is soldered to the fifth conductive pattern PT5 (see FIG. 2) of the flexible substrate 3. 2), and the sixth connecting portion CT6 of the sixth fixed terminal plate 5F6 is joined to the sixth conductive pattern PT6 (see FIG. 2) of the flexible substrate 3 by soldering, and the seventh The seventh connecting portion CT7 of the fixed terminal plate 5F7 is soldered to the seventh conductive pattern PT7 (see FIG. 2) of the flexible substrate 3, and the eighth connecting portion CT8 of the eighth fixed terminal plate 5F8 is connected. is joined to the eighth conductive pattern PT8 (see FIG. 2) of the flexible substrate 3 by soldering. Note that the connecting portion CT and the conductive pattern PT of the flexible substrate 3 may be joined by a conductive adhesive.

The first connection portion ED1 of the first conductive member CM1 is soldered to the ninth conductive pattern PT9 (see FIG. 2) of the flexible substrate 3, and the second connection portion ED2 of the second conductive member CM2 is It is joined to the tenth conductive pattern PT10 (see FIG. 2) of the flexible substrate 3 by soldering. In this embodiment, both the ninth conductive pattern PT9 and the tenth conductive pattern PT10 are connected to a ground terminal (not shown). Note that the connection portion ED and the conductive pattern PT of the flexible substrate 3 may be joined by a conductive adhesive.

The bent piece BP of the first movable terminal plate 5M1 is joined to the second fixed portion 6e2 of the elastic metal member 6 by welding such as laser welding, as shown in FIG. 7B. Similarly, the bent piece BP of the second movable side terminal plate 5M2 is joined to the fourth fixed portion 6e4 of the elastic metal member 6 by welding such as laser welding.

The first stationary terminal plate 5F1, the second stationary terminal plate 5F2, the seventh stationary terminal plate 5F7, and the eighth stationary terminal plate 5F8 are the first stationary portion of the elastic metal member 6, as shown in FIG. 7B. 6e1, and is not in contact with the first fixing portion 6e1 of the elastic metal member 6. As shown in FIG. On the other hand, as shown in FIG. 7B, the first fixed portion 6e1 of the elastic metal member 6 is joined to the first joint surface portion CP1 of the first conductive member CM1 by welding such as laser welding. Similarly, the third stationary terminal plate 5F3 to the sixth stationary terminal plate 5F6 are arranged apart from the third stationary portion 6e3 of the elastic metal member 6, as shown in FIG. 7B. is not in contact with the third fixing portion 6e3. On the other hand, as shown in FIG. 7B, the third fixing portion 6e3 of the elastic metal member 6 is joined to the second joint surface portion CP2 of the second conductive member CM2 by welding such as laser welding.

Next, with reference to FIGS. 8A and 8B, the path of current flowing through the shape memory alloy wire SA will be described. 8A and 8B are perspective views of a portion of the arrangement shown in FIG. 7A. In FIGS. 8A and 8B, for clarity, the first conductive member CM1 and the second movable terminal plate 5M2 are given rough dot patterns, and the seventh stationary terminal plate 5F7 and the eighth stationary terminal plate 5F8 has a fine dot pattern, and the elastic metal member 6 has an even finer dot pattern.

Specifically, FIG. 8A shows the state when the seventh connection portion CT7 of the seventh stationary terminal plate 5F7 is connected to a high potential and the first connection portion ED1 of the first conductive member CM1 is connected to a low potential. FIG. 8B shows that the eighth connection portion CT8 of the eighth fixed terminal plate 5F8 is connected to a high potential, and the first connection portion ED1 of the first conductive member CM1 is connected to a low potential. shows the path of the current when The following description relates to the path of the current flowing through the seventh wire SA7 or the eighth wire SA8, but the path of the current flowing through the first wire SA1 or the second wire SA2, the current flowing through the third wire SA3 or the fourth wire SA4. The same applies to the path and the path of the current flowing through the fifth wire SA5 or the sixth wire SA6.

When the seventh connecting portion CT7 of the seventh stationary terminal plate 5F7 is connected to a high potential and the first connecting portion ED1 of the first conductive member CM1 is connected to a low potential, the current flows as indicated by the arrow AR1 in FIG. 8A. flows through the seventh connecting portion CT7 to the seventh stationary terminal plate 5F7. After that, the current flows through the seventh fixed terminal plate 5F7 as indicated by arrow AR2, through the seventh wire SA7 as indicated by arrow AR3, and further through the second movable terminal plate 5M2 as indicated by arrow AR4. pass. Thereafter, the current flows through the fourth fixing portion 6e4, the fourth arm portion 6g4 and the first fixing portion 6e1 of the elastic metal member 6 as indicated by arrows AR5, AR6 and AR7, and then through the first fixing portion 6e1 as indicated by arrow AR8. flows through the first conductive member CM1 to the first connecting portion ED1.

In this embodiment, the current flows through the fourth fixing portion 6e4 of the elastic metal member 6, the third arm portion 6g3, the third fixing portion 6e3, the second conductive member CM2, and also the second connecting portion ED2. is configured to This is because both the first connection portion ED1 of the first conductive member CM1 and the second connection portion ED2 of the second conductive member CM2 are grounded.

When the eighth connecting portion CT8 of the eighth fixed-side terminal plate 5F8 is connected to a high potential and the first connecting portion ED1 of the first conductive member CM1 is connected to a low potential, the current flows as indicated by the arrow AR11 in FIG. 8B. , flows through the eighth connecting portion CT8 to the eighth stationary terminal plate 5F8. After that, the current flows through the eighth fixed terminal plate 5F8 as indicated by arrow AR12, the eighth wire SA8 as indicated by arrow AR13, and the second movable terminal plate 5M2 as indicated by arrow AR14. pass. After that, the current flows through the fourth fixing portion 6e4, the fourth arm portion 6g4 and the first fixing portion 6e1 of the elastic metal member 6 as indicated by arrows AR15, AR16 and AR17, and then through the first fixing portion 6e1 as indicated by arrow AR18. flows through the first conductive member CM1 to the first connecting portion ED1.

Also, when the seventh connecting portion CT7 of the seventh fixed terminal plate 5F7 is connected to a high potential, or when the eighth connecting portion CT8 of the eighth fixed side terminal plate 5F8 is connected to a high potential, , the path of the current after passing through the second movable-side terminal plate 5M2 is the same.

A control device external to the imaging device driving device 101 as described above controls the voltages applied to the respective connection portions CT of the first fixed-side terminal plate 5F1 to the eighth fixed-side terminal plate 5F8, thereby The expansion and contraction of each of the 1st wire SA1 to the 8th wire SA8 can be controlled. Alternatively, the control device controls the first terminal plate 5F1 through the eighth fixed terminal plate 5F8 via the connecting portions CT of the first to eighth stationary terminal plates 5F8 and the connecting portions ED of the first conductive member CM1 and the second conductive member CM2. By controlling the current supplied to each of the first wire SA1 to the eighth wire SA8, the expansion and contraction of each of the first wire SA1 to the eighth wire SA8 can be controlled. Note that the control device may be arranged in the imaging device driving device 101 . Also, the control device may be a component of the imaging device driving device 101 .

The image pickup device driving device 101 having a substantially rectangular parallelepiped shape is mounted on another substrate (not shown) such that an optical device (not shown) such as a lens body, a prism, or a mirror faces the image pickup device IS. ). The camera module includes, for example, an image sensor IS, an image sensor driving device 101, and a lens body facing the image sensor IS. A camera module may include a controller. Also, the lens body as an optical element may be attached to the imaging device driving device 101 . For example, the lens body may be fixed to the opening 4k of the cover member 4 forming the housing HS. In this case, the optical axis of the lens body coincides with the first rotation axis RX1 when the imaging element holder 2 is in the neutral position (initial state).

The control device utilizes, for example, a driving force along a first direction (Z-axis direction) parallel to the first rotation axis RX1 due to contraction of the shape memory alloy wire SA as the drive unit DM, and on the Z2 side of the lens body , the imaging element holder 2 may be moved along the first direction. By moving the image sensor holder 2 in this manner, the control device may realize an automatic focus adjustment function, which is one of the lens adjustment functions. Specifically, the control device moves the image sensor holder 2 in a direction away from the lens body to enable macro photography, and moves the image sensor holder 2 in a direction to approach the lens body to enable infinity photography. can be

The control device may also move the imaging element holder 2 in a direction intersecting with the first direction by controlling the currents flowing through the plurality of shape memory alloy wires SA. The direction intersecting the first direction is, for example, the second direction (X-axis direction) perpendicular to the first direction, or the third direction (Y-axis direction) perpendicular to the first direction and the second direction. good. In addition, the control device rotates the imaging element holder 2 around the first direction (Z-axis direction), around the second direction (X-axis direction), or around the third direction (Y-axis direction). good too. By such movement of the image pickup device holder 2, the control device may implement a camera shake correction function.

Next, the details of the drive unit DM will be described with reference to FIGS. 9 to 16. FIG. FIG. 9 is a table showing expansion and contraction states of the shape memory alloy wire SA when realizing each of the six degrees of freedom of movement of the imaging element holder 2 . 10A and 10B are a top view, a front view, a rear view, a left side view, and a right side view of the imaging element holder 2 and the base member 8 which are connected by the shape memory alloy wire SA. FIG. 11 is a top view of the imaging element holder 2 and the base member 8 that translate in the X-axis direction with respect to the base member 8. FIG. FIG. 12 is a top view of the imaging element holder 2 and the base member 8 that translate in the Y-axis direction with respect to the base member 8. FIG. FIG. 13 is a front view of the imaging element holder 2 and the base member 8 that translate in the Z-axis direction with respect to the base member 8. FIG. FIG. 14 is a front view of the imaging element holder 2 and the base member 8 rotating around the X-axis (second rotation axis RX2). FIG. 15 is a right side view of the imaging element holder 2 and the base member 8 rotating around the Y-axis (third rotation axis RX3). FIG. 16 is a top view of the imaging element holder 2 and the base member 8 rotating around the Z-axis (first rotation axis RX1). 10 to 16, for clarity, the imaging element holder 2 has a fine dot pattern and the base member 8 has a coarse dot pattern.

FIG. 10 shows the state of the imaging element holder 2, the base member 8, and the shape memory alloy wire SA when the imaging element driving device 101 is in a neutral state (neutral position). Note that the neutral state of the image pickup device driving device 101 means that the image pickup device holder 2, which is translatable along each of the X-axis, Y-axis, and Z-axis directions with respect to the fixed-side member FB, moves in the X-axis direction. It means a state of being positioned in the middle of the possible range, in the middle of the movable range in the Y-axis direction, and in the middle of the movable range in the Z-axis direction. Typically, in the neutral state of the image pickup device driving device 101, the image pickup device holder 2 is positioned at the center of each movable range in the X-axis direction, the Y-axis direction, and the Z-axis direction. . Further, the neutral state of the imaging device driving device 101 is around the X axis (second rotation axis RX2), around the Y axis (third rotation axis RX3), and around the Z axis (first rotation axis RX1). It means a state in which each rotatable (swingable) imaging element holder 2 is positioned in the middle of the rotatable range (rotatable angle) around each rotation axis. Typically, in the neutral state of the image pickup device driving device 101, the image pickup surface of the image pickup device IS is perpendicular to the optical axis of the lens body arranged to face the image pickup device IS. In this case, the first rotation axis RX1, which is the central axis of the imaging element IS (imaging surface), coincides with the optical axis of the lens body. Note that the initial state of the imaging device driving device 101 when no current is supplied to the shape memory alloy wires SA may be the neutral state.

Specifically, when the image pickup device driving device 101 is in the neutral state, one end (fixed end) of the second wire SA2 is positioned further by a predetermined distance D1 than the other end (movable end) in a top view from the Z1 side. It is arranged so as to be located on the outer side (front side (X1 side)). One end (fixed end) of the second wire SA2 is the end fixed to the second fixed terminal plate 5F2, and the other end (movable end) of the second wire SA2 is the first movable terminal plate 5M1. is the end that is fixed to the

In addition, the fourth wire SA4 is arranged such that one end (fixed end) thereof is positioned outside (to the left (Y1 side)) the other end (movable end) of the fourth wire SA4 by a predetermined distance D2 when viewed from the top. One end (fixed end) of SA6 is positioned outside (rear side (X2 side)) a predetermined distance D3 from the other end (movable end). ) is positioned outside (to the right (Y2 side)) of the other end (movable end) by a predetermined distance D4. The same applies to the first wire SA1, the third wire SA3, the fifth wire SA5, and the seventh wire SA7.

That is, when viewed from above, the first wire SA1, the second wire SA2, the fifth wire SA5, and the sixth wire SA6 are arranged so as to be non-parallel to the Y-axis, and the third wire SA3 and the fourth wire SA3 are arranged to be non-parallel to the Y axis. SA4, seventh wire SA7, and eighth wire SA8 are arranged so as to be non-parallel to the X-axis.

With such an arrangement, the control device can move the image sensor holder 2 along the X-axis or the Y-axis, for example, by contracting a part of the first wire SA1 to the eighth wire SA8 and extending the rest. can be translated by

In addition, when the imaging device driving device 101 is in a neutral state, the first wire SA1 is arranged such that one end (fixed end) thereof is positioned higher than the other end (movable end) in a front view viewed from the X1 side. The second wire SA2 is arranged so that one end (fixed end) is lower than the other end (movable end), and the first wire SA1 and the second wire SA2 are arranged so as to cross each other. are placed.

Further, in a left side view from the Y1 side, the third wire SA3 is arranged so that one end (fixed end) thereof is higher than the other end (movable end), and the fourth wire SA4 The (fixed end) is positioned lower than the other end (movable end), and the third wire SA3 and the fourth wire SA4 are arranged to cross each other.

In addition, in rear view from the X2 side, the fifth wire SA5 is arranged so that one end (fixed end) is higher than the other end (movable end), and the sixth wire SA6 is arranged such that one end ( The fixed end) is positioned lower than the other end (movable end), and the fifth wire SA5 and the sixth wire SA6 are arranged to cross each other.

Similarly, in a right side view from the Y2 side, the seventh wire SA7 is arranged so that one end (fixed end) is higher than the other end (movable end), and the eighth wire SA8 One end (fixed end) is positioned lower than the other end (movable end), and the seventh wire SA7 and the eighth wire SA8 are arranged to cross each other.

That is, in a side view, the first wire SA1 to the eighth wire SA8 are all arranged so as to extend obliquely (non-parallel) to the X-axis and the Y-axis.

With such an arrangement, the control device causes, for example, the first wire SA1 to the eighth wire SA8 to contract partly and extend the rest, thereby translating the imaging element holder 2 along the Z axis. be able to. However, the first wire SA1 and the second wire SA2 need only be arranged so as to extend obliquely when viewed from the front, and need not cross each other when viewed from the front. The same applies to the relationship between the third wire SA3 and the fourth wire SA4, the relationship between the fifth wire SA5 and the sixth wire SA6, and the relationship between the seventh wire SA7 and the eighth wire SA8.

Specifically, the upper diagram of FIG. 11 is a top view of the imaging element holder 2 and the base member 8 that translate in the X1 direction (forward) with respect to the base member 8, and the middle diagram of FIG. 11 is a neutral state. 11 is a top view of the image pickup element holder 2 and the base member 8 in FIG. 11, and the lower diagram of FIG. .

When the image sensor holder 2 is translated in the X1 direction (forward) with respect to the base member 8, the control device contracts the first wire SA1 and the second wire SA2 relatively small as shown in the table of FIG. , the third wire SA3 and the fourth wire SA4 are stretched relatively greatly, the fifth wire SA5 and the sixth wire SA6 are stretched relatively little, and the seventh wire SA7 and the eighth wire SA8 are relatively greatly contracted. . Shrinking the first wire SA1 and the second wire SA2 to a relatively small amount and shrinking the seventh wire SA7 and the eighth wire SA8 to a relatively large amount means that the amount of shrinkage of each of the first wire SA1 and the second wire SA2 is is smaller than the contraction amount of each of the seventh wire SA7 and the eighth wire SA8. In addition, stretching the third wire SA3 and the fourth wire SA4 relatively large and stretching the fifth wire SA5 and the sixth wire SA6 relatively small will cause the third wire SA3 and the fourth wire SA4 to stretch. It means that the amount of extension is greater than the amount of extension of each of the fifth wire SA5 and the sixth wire SA6. In addition, in the present embodiment, the control device causes the first wire SA1 and the second wire SA2 to shrink by substantially the same amount and relatively small, and the third wire SA3 and the fourth wire SA4 to stretch by approximately the same amount and relatively large. The fifth wire SA5 and the sixth wire SA6 are stretched to a relatively small extent by approximately the same amount of stretching, and the seventh wire SA7 and the eighth wire SA8 are shrunk by approximately the same amount to a relatively large extent. The same applies to the following description. The control device expands and contracts each of the first wire SA1 through eighth wire SA8 as described above by individually adjusting the magnitude of the current supplied to each of first wire SA1 through eighth wire SA8. Under the control of this control device, the drive unit DM can translate the imaging element holder 2 in the X1 direction (forward) with respect to the base member 8, as indicated by an arrow AR21 in the upper diagram of FIG.

Similarly, when the control device translates the image pickup element holder 2 in the X2 direction (rearward) with respect to the base member 8, the first wire SA1 and the second wire SA2 are relatively set as shown in the table of FIG. The third wire SA3 and the fourth wire SA4 are contracted relatively large, the fifth wire SA5 and the sixth wire SA6 are contracted relatively small, and the seventh wire SA7 and the eighth wire SA8 are contracted relatively. stretch greatly. The control device expands and contracts each of the first wire SA1 through eighth wire SA8 as described above by individually adjusting the magnitude of the current supplied to each of first wire SA1 through eighth wire SA8. Under the control of this control device, the driving section DM can translate the imaging element holder 2 in the X2 direction (backward) with respect to the base member 8, as indicated by an arrow AR22 in the lower diagram of FIG.

The upper diagram in FIG. 12 is a top view of the imaging element holder 2 and the base member 8 that translate in the Y1 direction (leftward) with respect to the base member 8, and the middle diagram in FIG. 12 is a top view of the body 2 and the base member 8, and the bottom view of FIG.

When the control device translates the imaging element holder 2 in the Y1 direction (leftward) with respect to the base member 8, the first wire SA1 and the second wire SA2 are stretched relatively large as shown in the table of FIG. , the third wire SA3 and the fourth wire SA4 are shrunk relatively small, the fifth wire SA5 and the sixth wire SA6 are shrunk relatively large, and the seventh wire SA7 and the eighth wire SA8 are stretched relatively small. Let The control device expands and contracts each of the first wire SA1 through eighth wire SA8 as described above by individually adjusting the magnitude of the current supplied to each of first wire SA1 through eighth wire SA8. Under the control of this control device, the drive unit DM can translate the imaging element holder 2 in the Y1 direction (leftward) with respect to the base member 8, as indicated by an arrow AR23 in the upper diagram of FIG.

Similarly, when the control device translates the imaging element holder 2 in the Y2 direction (rightward) with respect to the base member 8, the first wire SA1 and the second wire SA2 are compared as shown in the table of FIG. The third wire SA3 and the fourth wire SA4 are stretched relatively little, the fifth wire SA5 and the sixth wire SA6 are stretched relatively greatly, and the seventh wire SA7 and the eighth wire SA8 are compared. contract small. The control device expands and contracts each of the first wire SA1 through eighth wire SA8 as described above by individually adjusting the magnitude of the current supplied to each of first wire SA1 through eighth wire SA8. Under the control of this control device, the driving section DM can translate the imaging element holder 2 in the Y2 direction (rightward) with respect to the base member 8, as indicated by the arrow AR24 in the lower diagram of FIG.

The upper diagram in FIG. 13 is a front view of the imaging element holder 2 and the base member 8 that translate in the Z1 direction (upward) with respect to the base member 8, and the middle diagram in FIG. 13 is the imaging element holder in a neutral state. 13 is a front view of the image sensor holder 2 and the base member 8, and the lower view of FIG.

When the control device translates the imaging element holder 2 in the Z1 direction (upward) with respect to the base member 8, as shown in the table of FIG. and the seventh wire SA7 are contracted, and the second wire SA2, the fourth wire SA4, the sixth wire SA6 and the eighth wire SA8 are stretched. The control device expands and contracts each of the first wire SA1 through eighth wire SA8 as described above by individually adjusting the magnitude of the current supplied to each of first wire SA1 through eighth wire SA8. Under the control of this control device, the driving section DM can translate the imaging element holder 2 in the Z1 direction (upward) with respect to the base member 8, as indicated by an arrow AR25 in the upper diagram of FIG.

Similarly, when the control device translates the imaging element holder 2 in the Z2 direction (downward) with respect to the base member 8, the first wire SA1, the third wire SA3, the fifth The wire SA5 and the seventh wire SA7 are stretched by approximately the same amount of stretching, and the second wire SA2, the fourth wire SA4, the sixth wire SA6 and the eighth wire SA8 are contracted by approximately the same amount of contraction. The control device expands and contracts each of the first wire SA1 through eighth wire SA8 as described above by individually adjusting the magnitude of the current supplied to each of first wire SA1 through eighth wire SA8. Under the control of this control device, the drive unit DM can translate the imaging element holder 2 in the Z2 direction (downward) with respect to the base member 8, as indicated by an arrow AR26 in the lower diagram of FIG.

14 is a front view of the imaging element holder 2 and the base member 8 rotating clockwise about the X-axis (second rotation axis RX2) with respect to the base member 8, and the center view of FIG. 14 is a front view of the imaging element holder 2 and the base member 8 in a neutral state, and the lower view of FIG. 2 is a front view of an imaging device holder 2 and a base member 8; FIG.

When the control device rotates the imaging element holder 2 clockwise around the X-axis (second rotation axis RX2) with respect to the base member 8 in a front view, the first wire The wires SA1 to the third wire SA3 and the eighth wire SA8 are contracted by approximately the same amount of contraction, and the fourth wire SA4 to the seventh wire SA7 are stretched by approximately the same extension amount. The control device expands and contracts each of the first wire SA1 through eighth wire SA8 as described above by individually adjusting the magnitude of the current supplied to each of first wire SA1 through eighth wire SA8. Under the control of this control device, the drive unit DM rotates the imaging element holder clockwise around the X axis (second rotation axis RX2) with respect to the base member 8, as indicated by an arrow AR27 in the upper diagram of FIG. 2 can be rotated.

Similarly, when the control device rotates the imaging element holder 2 counterclockwise around the X axis (second rotation axis RX2) with respect to the base member 8 in a front view, as shown in the table of FIG. , the first wire SA1 to the third wire SA3 and the eighth wire SA8 are stretched by approximately the same stretching amount, and the fourth wire SA4 to the seventh wire SA7 are contracted by approximately the same shrinking amount. The control device expands and contracts each of the first wire SA1 through eighth wire SA8 as described above by individually adjusting the magnitude of the current supplied to each of first wire SA1 through eighth wire SA8. Under the control of this control device, the drive unit DM rotates the imaging element holder counterclockwise around the X axis (second rotation axis RX2) with respect to the base member 8, as indicated by an arrow AR28 in the lower diagram of FIG. 2 can be rotated.

The upper diagram in FIG. 15 is a right side view of the imaging element holder 2 rotating clockwise around the Y-axis (third rotation axis RX3) with respect to the base member 8 and the base member 8. The figure is a right side view of the imaging element holder 2 and the base member 8 in a neutral state, and the lower figure in FIG. 3 is a right side view of the rotating imaging element holder 2 and the base member 8. FIG.

When the control device rotates the imaging element holder 2 clockwise around the Y-axis (third rotation axis RX3) with respect to the base member 8 in the right side view, the first The wire SA1, the third wire SA3, the fourth wire SA4, and the sixth wire SA6 are contracted by approximately the same amount, and the second wire SA2, the fifth wire SA5, the seventh wire SA7, and the eighth wire SA8 are contracted. It is extended by approximately the same amount of extension. The control device expands and contracts each of the first wire SA1 through eighth wire SA8 as described above by individually adjusting the magnitude of the current supplied to each of first wire SA1 through eighth wire SA8. Under the control of this control device, the drive unit DM rotates the imaging element holder clockwise around the Y-axis (third rotation axis RX3) with respect to the base member 8, as indicated by an arrow AR29 in the upper diagram of FIG. 2 can be rotated.

Similarly, when the control device rotates the imaging element holder 2 counterclockwise around the Y-axis (third rotation axis RX3) with respect to the base member 8 in the right side view, as shown in the table of FIG. , the first wire SA1, the third wire SA3, the fourth wire SA4, and the sixth wire SA6 are stretched by substantially the same amount of stretching, and the second wire SA2, the fifth wire SA5, the seventh wire SA7, and the The 8-wire SA8 is shrunk by approximately the same amount of shrinkage. The control device expands and contracts each of the first wire SA1 through eighth wire SA8 as described above by individually adjusting the magnitude of the current supplied to each of first wire SA1 through eighth wire SA8. Under the control of this control device, the drive unit DM rotates the imaging element holder counterclockwise around the Y-axis (third rotation axis RX3) with respect to the base member 8, as indicated by an arrow AR30 in the lower diagram of FIG. 2 can be rotated.

The upper diagram in FIG. 16 is a top view of the imaging element holder 2 rotating clockwise around the Z-axis (first rotation axis RX1) with respect to the base member 8 and the base member 8, and the middle diagram of FIG. 16 is a top view of the imaging element holder 2 and the base member 8 in a neutral state, and the lower view of FIG. 2 is a top view of an imaging device holder 2 and a base member 8; FIG.

When the control device rotates the imaging element holder 2 clockwise around the Z-axis (first rotation axis RX1) with respect to the base member 8 in top view, the first wire The SA1, the second wire SA2, the fifth wire SA5, and the sixth wire SA6 are stretched by substantially the same amount of stretching, and the third wire SA3, the fourth wire SA4, the seventh wire SA7, and the eighth wire SA8 are stretched by approximately the same amount. Shrink with the same amount of shrinkage. The control device expands and contracts each of the first wire SA1 through eighth wire SA8 as described above by individually adjusting the magnitude of the current supplied to each of first wire SA1 through eighth wire SA8. Under the control of this control device, the drive unit DM rotates the imaging element holder clockwise around the Z axis (first rotation axis RX1) with respect to the base member 8, as indicated by an arrow AR31 in the upper diagram of FIG. 2 can be rotated.

Similarly, when the control device rotates the imaging element holder 2 counterclockwise around the Z-axis (first rotation axis RX1) with respect to the base member 8 in top view, as shown in the table of FIG. , the first wire SA1, the second wire SA2, the fifth wire SA5, and the sixth wire SA6 are contracted by substantially the same contraction amount, and the third wire SA3, the fourth wire SA4, the seventh wire SA7, and the eighth wire SA7 are contracted by substantially the same contraction amount. The wire SA8 is stretched by approximately the same stretch amount. The control device expands and contracts each of the first wire SA1 through eighth wire SA8 as described above by individually adjusting the magnitude of the current supplied to each of first wire SA1 through eighth wire SA8. Under the control of this control device, the drive unit DM rotates the imaging element holder counterclockwise around the Z axis (first rotation axis RX1) with respect to the base member 8, as indicated by an arrow AR32 in the lower diagram of FIG. 2 can be rotated.

As described above, the imaging device holder 2 can move with 6 degrees of freedom. Each of these six degrees of freedom of movement is realized by individually adjusting the current supplied to each of the first wire SA1 to the eighth wire SA8. The movement of the imaging device holder 2 may be realized by combining a plurality of movements of the six degrees of freedom. In the present embodiment, the imaging element holder 2 moves when the corresponding shape memory alloy wire SA contracts by applying current to one or more of the first wire SA1 to the eighth wire SA8. By this movement, another one or a plurality of the first wire SA1 to the eighth wire SA8 are stretched, thereby realizing the stretching of the shape memory alloy wire SA.

The six-degree-of-freedom movement of the movable-side member MB as described above is detected by a motion detector (not shown). The motion detection unit includes, for example, at least three magnets attached to the movable side member MB such as the imaging element holder 2, and at least three magnetic sensors attached to the fixed side member FB such as the base member 8 or the flexible substrate 3. and

The magnetic sensor is configured to detect the position of the movable side member MB by detecting the position of the magnet. In this embodiment, the magnetic sensor is configured to detect the position of the movable member MB using a Hall element. However, the magnetic sensor is a Giant Magneto Resistive effect (GMR) element that can detect the magnetic field generated by a magnet, a Semiconductor Magneto Resistive (SMR) element, an Anisotropic Magneto Resistive The position of the movable side member MB may be detected using a magnetic resistance element such as an AMR (Tunnel Magneto Resistive: TMR) element or a Tunnel Magneto Resistive (TMR) element.

As described above, the image pickup device driving device 101 according to the embodiment of the present invention includes, as shown in FIG. and a driving section DM for moving the imaging element holder 2 with respect to the member FB. The drive unit DM includes a plurality of shape memory alloy wires SA provided between a movable member MB including the image pickup device holder 2 and a fixed member FB. The plurality of shape memory alloy wires SA extend in a first direction (X A first wire SA1 and a fifth wire SA5 arranged apart in the axial direction) and separated in a second direction (Y-axis direction) perpendicular to the first direction (X-axis direction) with the imaging element IS interposed therebetween. and a third wire SA3 and a seventh wire SA7 arranged in parallel. Further, the plurality of shape memory alloy wires SA include second wires SA2 arranged to intersect the first wires SA1 in a side view (front view) along the first direction (X-axis direction); A fourth wire SA4 arranged to cross the third wire SA3 in a side view (left side view) along the second direction (Y-axis direction); A sixth wire SA6 arranged to intersect with the fifth wire SA5 in a side view (rear view) along the and an eighth wire SA8 arranged to intersect with the seventh wire SA7 at. One end of each of the first wire SA1 to the eighth wire SA8 is fixed to the fixed side member FB (base member 8), and the other end is fixed to the movable side member MB (image pickup element holder 2).

In this configuration, the movement of the imaging element holder 2 is performed by the shape memory alloy wire SA. Therefore, this configuration can suppress an increase in the size of the imaging device driving device 101, and can achieve a size smaller than that of a device using a voice coil motor for moving the imaging device holder 2, for example. In addition, this configuration can reduce the weight of the imaging device driving device 101 . In addition, since this configuration does not use a voice coil motor for moving the image pickup device holder 2, even if a device using a voice coil motor is arranged next to the device, the device and the image pickup device driving device 101 can be connected. can suppress magnetic interference between

In addition, in this configuration, two shape memory alloy wires SA are arranged so as to intersect in each of the four areas surrounding the imaging element IS in top view. That is, in this configuration, not all shape memory alloy wires SA are arranged parallel to the imaging plane. Therefore, this configuration can move the image pickup device holder 2 in a direction intersecting the image pickup surface.

The driving unit DM may be configured to rotate the imaging element holder 2 around the axis of the first rotation axis RX1, which is the axis perpendicular to the imaging surface. This configuration can suppress the influence of camera shake caused by rotation about the first rotation axis RX1 on an image when a device such as a smartphone on which the image pickup device driving device 101 is mounted is used.

The drive unit DM may be configured to move the imaging element holder 2 in a direction intersecting the imaging surface. This configuration brings about an effect that the imaging device driving device 101 can realize an automatic focus adjustment function.

The fixed-side member FB may have eight first metal members (first fixed-side terminal plate 5F1 to eighth fixed-side terminal plate 5F8). In this case, one end of each of the eight shape memory alloy wires SA (first wire SA1 to eighth wire SA8) may be individually connected to the corresponding first metal member. In the above embodiment, as shown in FIG. 2, one end of the first wire SA1 is connected to the first fixed terminal plate 5F1, one end of the second wire SA2 is connected to the second fixed terminal plate 5F2, and the second wire SA1 is connected to the first fixed terminal plate 5F1. One end of the 3-wire SA3 is connected to the third fixed terminal plate 5F3, one end of the fourth wire SA4 is connected to the fourth fixed-side terminal plate 5F4, and one end of the fifth wire SA5 is connected to the fifth fixed-side terminal plate 5F5. One end of the sixth wire SA6 is connected to the sixth fixed side terminal plate 5F6, one end of the seventh wire SA7 is connected to the seventh fixed side terminal plate 5F7, and one end of the eighth wire SA8 is connected to the eighth fixed side terminal plate 5F7. It is connected to the terminal plate 5F8. This configuration has the effect of facilitating the securing of conductive paths for supplying currents individually to the eight shape memory alloy wires SA.

The other ends of at least four shape memory alloy wires SA out of the eight shape memory alloy wires SA may be electrically connected to each other via conductors provided on the movable side member MB. In this configuration, the other ends of at least four shape memory alloy wires SA out of eight shape memory alloy wires SA are connected to a common potential. Therefore, this configuration brings about the effect of further facilitating the securing of conductive paths for allowing current to be individually supplied to each of the eight shape memory alloy wires SA.

The conductor is an elastic deformation that connects the second metal member (movable side metal member 5M) to which the other end of each of the at least four shape memory alloy wires SA is connected, and the movable side member MB and the fixed side member FB. A possible elastic metal member 6 may also be included. In this case, the fixed-side member FB may have a columnar portion (fixed-side pedestal portion 8D) in which the third metal member (conductive member CM) is embedded. Then, as shown in FIG. 7A, the fixing portions (the second fixing portion 6e2 and the fourth fixing portion 6e4) of the elastic metal member 6 are connected to the second metal member (the movable side metal member 5M), and the third metal member ( Another fixing portion (the first fixing portion 6e1 and the third fixing portion 6e3) of the elastic metal member 6 may be connected to the conductive member CM). Note that the elastic metal member 6 may be a leaf spring. This configuration brings about an effect that it becomes easier to secure a conductive path for supplying an electric current to each of the eight shape memory alloy wires SA.

In the above-described embodiment, the other ends of the eight shape memory alloy wires SA are configured to conduct with each other via the movable metal member 5M, the elastic metal member 6, and the conductive member CM. Specifically, as shown in FIG. 7A, the other ends of the first to fourth wires SA1 to SA4 are connected to the first movable terminal plate 5M1, the elastic metal member 6, the first conductive member CM1 or the second conductive member CM1. It is connected to the ground terminal via the member CM2. The other end of each of the fifth wire SA5 to the eighth wire SA8 is connected to the ground terminal through the second movable terminal plate 5M2, the elastic metal member 6, and the first conductive member CM1 or the second conductive member CM2. It is The first fixing portion 6e1 of the elastic metal member 6 is welded to the first joint surface portion CP1 (see the central view of FIG. 6) of the first conductive member CM1, and the third fixing portion 6e3 of the elastic metal member 6 are welded to the second joint surface portion CP2 (see the central view of FIG. 6) of the second conductive member CM2. Also, the first connection part ED1 (see the central view of FIG. 6) of the first conductive member CM1 is soldered to the ninth conductive pattern PT9 (see FIG. 2) of the flexible substrate 3, and the second conductive member The second connection part ED2 of CM2 (see the central view of FIG. 6) is soldered to the tenth conductive pattern PT10 of the flexible substrate 3 (see FIG. 2). Both the ninth conductive pattern PT9 and the tenth conductive pattern PT10 are connected to a ground terminal (not shown).

The fixed-side member FB may have a housing HS (cover member 4) having a shape (for example, a substantially rectangular shape) having at least four corners 4C when viewed from above. In this case, as shown in FIG. 2, the housing HS (cover member 4) has a first corner 4C1 and a third corner 4C3 located on one diagonal line and a second corner located on the other diagonal line. It may have a portion 4C2 and a fourth corner portion 4C4. One end of each of the eight shape-memory alloy wires SA is a base member that functions as a fixed-side wire support portion for the fixed-side member FB arranged to face the first corner portion 4C1 or the third corner portion 4C3. 8 fixed side pedestal portion 8D, and the other end of each of the eight shape memory alloy wires SA is arranged to face the second corner portion 4C2 or the fourth corner portion 4C4 of the movable side member MB. It may be supported by the movable-side pedestal portion 2D of the imaging element holder 2 that functions as a movable-side wire support portion. This configuration brings about the effect of further suppressing the enlargement of the imaging device driving device 101 . In addition, this configuration brings about an effect that further weight reduction of the imaging device driving device 101 can be realized. Note that the housing HS may be configured to have another shape such as a substantially hexagonal shape or a substantially octagonal shape when viewed from above.

The imaging element IS may be mounted on the circuit board 7 as the first printed wiring board. In this case, the circuit board 7 may be fixed to the imaging element holder 2 and connected to the flexible board 3 as a flexible second printed wiring board. Also, the circuit board 7 may be configured to be thicker than the flexible board 3 . This configuration brings about an effect that the imaging element IS can be easily integrated with the imaging element holder 2 . Note that the image pickup device IS may be provided with an IR cut filter.

Further, the camera module according to the embodiment of the present invention is configured to have the above-described imaging device driving device 101, the imaging device IS, and a lens body (not shown) facing the imaging device IS. may have been

The preferred embodiment of the present invention has been described in detail above. However, the invention is not limited to the embodiments described above. Various modifications and replacements may be applied to the above-described embodiments without departing from the scope of the present invention. Also, each of the features described with reference to the above-described embodiments may be combined as appropriate as long as they are not technically inconsistent.

For example, in the above-described embodiment, the elastic metal member 6 is composed of one part, but it may be composed of two parts. For example, the elastic metal member 6 may be divided into a first elastic metal member and a second elastic metal member at each of the central portion of the first fixing portion 6e1 and the central portion of the third fixing portion 6e3. good. In this case, the first elastic metal member may be configured to be connected to the first conductive member CM1 and not connected to the second conductive member CM2. Also, the second elastic metal member may be configured to be connected to the second conductive member CM2 and not to be connected to the first conductive member CM1.

Further, in the above-described embodiment, the position of the movable-side member MB is detected based on the output of the magnetic sensor, but it may be detected based on the output of a sensor that detects the resistance value of the shape memory alloy wire SA. .

Further, in the above-described embodiment, the fixed-side metal member 5F is fixed to the base member 8 with an adhesive, but it may be embedded in the base member 8, and the conductive pattern formed on the surface of the base member 8 may be fixed. may be Similarly, the movable-side metal member 5M is fixed to the image pickup element holder 2 with an adhesive, but it may be embedded in the image pickup element holder 2, and the conductive metal member 5M formed on the surface of the image pickup element holder 2 may be used. It can be a pattern.

This application claims priority based on Japanese Patent Application No. 2021-060170 filed on March 31, 2021, and the entire contents of this Japanese Patent Application are incorporated herein by reference.

2... Imaging element holder 2D... Movable side pedestal 2D1... First movable side pedestal 2D2... Second movable side pedestal 2F... Frame 2G... Groove 2S... · Protruding portion 2S1... First protruding portion 2S2... Second protruding portion 2T... Protruding portion 3... Flexible substrate 3e... Outer portion 3i... Inner portion 4- ... Cover member 4A... Peripheral wall part 4A1... First side plate part 4A2... Second side plate part 4A3... Third side plate part 4A4... Fourth side plate part 4B... Top plate part 4C... corner 4C1...first corner 4C2...second corner 4C3...third corner 4C4...fourth corner 4k...opening 5...metal member 5F・・・Fixed-side metal member 5F1・・・First fixed-side terminal plate 5F2・・・Second fixed-side terminal plate 5F3・・・Third fixed-side terminal plate 5F4・・・Fourth fixed-side terminal plate 5F5・・・· 5th fixed side terminal plate 5F6... 6th fixed side terminal plate 5F7... 7th fixed side terminal plate 5F8... 8th fixed side terminal plate 5M... Movable side metal member 5M1... No. 1 movable side terminal plate 5M2... second movable side terminal plate 6... elastic metal member 6e1... first fixed part 6e2... second fixed part 6e3... third fixed part 6e4... Fourth fixing part 6g1... First arm part 6g2... Second arm part 6g3... Third arm part 6g4... Fourth arm part 6H1... First through hole 6H2... Second Through hole 6H3... Third through hole 6H4... Fourth through hole 6H5... Fifth through hole 6H6... Sixth through hole 6H7... Seventh through hole 6H8... Eighth through hole 6H9... 9th through hole 6H10... 10th through hole 6H11... 11th through hole 6H12... 12th through hole 7... circuit board 8... base member 8D... fixed side Pedestal 8D1... First fixed side pedestal 8D2... Second fixed side pedestal 8E... Side 8E1... First side 8E2... Second side 8E3... Third Side portion 8E4... Fourth side portion 8K... Opening 8T... Protruding portion 101... Imaging device driving device BP... Bent piece CM... Conductive member CM1... First conductive member CM2 ... second conductive member CP ... joint surface portion CP1 ... first joint surface portion CP2 ... second 2 Joint surface part CT... Connection part CT1... First connection part CT2... Second connection part CT3... Third connection part CT4... Fourth connection part CT5... Fifth connection part CT6 ... 6th connection part CT7... 7th connection part CT8... 8th connection part DM... Drive part ED... Connection part ED1... 1st connection part ED2... 2nd connection Part FB... Fixed side member HS... Housing IS... Imaging element J1 to J4... Holding part MB... Movable side member PT1... First conductive pattern PT2... Second conductive Pattern PT3... 3rd conductive pattern PT4... 4th conductive pattern PT5... 5th conductive pattern PT6... 6th conductive pattern PT7... 7th conductive pattern PT8... 8th conductive pattern PT9 ... Ninth conductive pattern PT10... Tenth conductive pattern RX1... First rotation axis RX2... Second rotation axis RX3... Third rotation axis SA... Shape memory alloy wire SA1... · 1st wire SA2... 2nd wire SA3... 3rd wire SA4... 4th wire SA5... 5th wire SA6... 6th wire SA7... 7th wire SA8... 8th wire

Claims

a fixed side member;
an imaging element holder integrally provided with an imaging element;
An image pickup device driving device comprising: a driving unit that moves the image pickup device holder with respect to the fixed member,
The driving section includes a plurality of shape memory alloy wires provided between a movable side member including the imaging element holder and the fixed side member,
The plurality of shape memory alloy wires are
A first wire and a fifth wire spaced apart in a first direction with the image pickup device interposed therebetween in a top view along a direction perpendicular to an image pickup surface of the image pickup device, and the image pickup device. a third wire and a seventh wire sandwiched between and spaced apart in a second direction perpendicular to the first direction;
a second wire arranged to cross the first wire in a side view along the first direction;
a fourth wire arranged to cross the third wire in a side view along the second direction;
a sixth wire arranged to cross the fifth wire in a side view along the first direction;
an eighth wire arranged to cross the seventh wire in a side view along the second direction;
Each of the first wire to the eighth wire has one end fixed to the fixed side member and the other end fixed to the movable side member,
An imaging device driving device characterized by:
The drive unit rotates the imaging device holder around an axis perpendicular to the imaging surface,
The imaging device driving device according to claim 1 .
The drive unit moves the imaging element holder in a direction intersecting the imaging plane,
3. The imaging device driving device according to claim 1.
The fixed side member has eight first metal members, and one end of each of the eight shape memory alloy wires is individually connected to the corresponding first metal member,
4. The imaging device driving device according to any one of claims 1 to 3.
The other ends of at least four of the eight shape memory alloy wires are electrically connected to each other via conductors provided on the movable member,
5. The imaging device driving device according to claim 4.
The conductor includes a second metal member to which the other end of each of the at least four shape memory alloy wires is connected, and an elastically deformable elastic metal member that connects the movable side member and the fixed side member. including
the fixed-side member has a columnar portion in which a third metal member is embedded;
A fixing portion of the elastic metal member is connected to the third metal member,
Another fixed portion of the elastic metal member is connected to the second metal member,
The imaging device driving device according to claim 5 .
The stationary member has a housing that has at least four corners when viewed from above,
The housing has a first corner and a third corner located on one diagonal line, and a second corner and a fourth corner located on another diagonal line,
One end of each of the eight shape memory alloy wires is supported by a stationary wire support portion of the stationary member arranged to face the first corner or the third corner,
The other end of each of the eight shape memory alloy wires is supported by a movable-side wire support portion of the movable-side member arranged to face the second corner or the fourth corner,
7. The imaging device driving device according to any one of claims 1 to 6.
The imaging element is mounted on a first printed wiring board,
The first printed wiring board,
fixed to the imaging element holder,
connected to a flexible second printed wiring board, and
thicker than the second printed wiring board;
8. The imaging device driving device according to any one of claims 1 to 7.
An imaging device driving device according to any one of claims 1 to 8;
the imaging element;
and a lens body facing the imaging device,
The camera module.