CN114026492B

CN114026492B - Lens driving device, camera module, and method for manufacturing lens driving device

Info

Publication number: CN114026492B
Application number: CN202080046400.XA
Authority: CN
Inventors: 菊池功武; 长田宽志
Original assignee: Alps Electric Co Ltd
Current assignee: Alps Alpine Co Ltd
Priority date: 2019-06-25
Filing date: 2020-03-11
Publication date: 2023-11-21
Anticipated expiration: 2040-03-11
Also published as: JP7304946B2; WO2020261658A1; CN114026492A; JPWO2020261658A1

Abstract

The lens driving device (101) comprises: a detection magnet (8) held by the lens holding member (2); a magnetic detection member (11) for detecting the magnetic field of the detection magnet (8); a base member (18) in which the terminal member (7) is embedded; and a cover member (4) that forms a case together with the base member (18). The connection parts (7 ES-7 JS) of the terminal member (7) are exposed on the surface of the base member (18), and the magnetic detection member (11) is mounted on the wiring substrate (10). The wiring board (10) has a conductive joint (TM) formed on the lower surface side and facing the connection parts (7 ES-7 JS), a conductive part (TH) formed on the upper surface side, and a hole (VH) having a conductor at least on the inner peripheral surface for connecting the joint (TM) and the conductive part (TH). The connection parts (7 ES-7 JS) and the joint part (TM) are connected by Solder (SD).

Description

Lens driving device, camera module, and method for manufacturing lens driving device

Technical Field

The present disclosure relates to a lens driving device mounted on a portable device with a camera or the like, a camera module including the lens driving device, and a method of manufacturing the lens driving device, for example.

Background

Conventionally, there is known a lens holder driving device including a yoke, a lens holder, a coil disposed on an outer periphery of the lens holder, and a driving magnet attached to the yoke so as to face the coil (see patent document 1). In this device, the lens holder is held movable in the optical axis direction by a conductive leaf spring. The lens holder is provided with a sensor magnet for detecting the position of the lens holder. The position of the lens holder is derived from the output of a hall sensor mounted on the flexible printed board opposite to the sensor magnet. The derived position of the lens holder is used in feedback control of the drive current.

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open publication 2016-38444

Disclosure of Invention

Problems to be solved by the invention

However, in the lens holder driving device described above, the flexible printed board is mounted on the outer wall as the fixing side member perpendicularly to the leaf spring. This is to join the external connection terminal configured as a plate spring to a bowl-shaped recess formed in the flexible printed board by solder in a state of being inserted into the recess. This configuration complicates the mounting of the flexible printed board to the base member.

Accordingly, it is desirable to provide a lens driving device configured such that the mounting of a wiring board such as a flexible printed board to a base member is easy.

Means for solving the problems

The lens driving device according to an embodiment of the present invention includes: a fixed side member including a case; a lens holding member capable of holding a lens body; a support member that supports the lens holding member so as to be movable in an optical axis direction; a driving mechanism including at least a coil and a driving magnet, and configured to move the lens holding member in an optical axis direction; a detection magnet held by the lens holding member; a magnetic sensor for detecting a magnetic field of the detection magnet; a base member provided with a plurality of terminal members; and a cover member that forms a case together with the base member, wherein the connection portion of the terminal member is exposed on the surface of the base member, wherein the magnetic sensor is mounted on a wiring board, wherein the wiring board has a conductive joint portion formed on one surface side and facing the connection portion, a conductive portion formed on the other surface side, and a hole portion having a conductor at least on an inner peripheral surface that connects the joint portion and the conductive portion, and wherein the connection portion and the joint portion are connected by a joint material.

Effects of the invention

According to the above-described aspects, a lens driving device configured to facilitate attachment of a wiring board to a base member is provided.

Drawings

Fig. 1 is an exploded perspective view of a lens driving device.

Fig. 2A is an upper perspective view of the lens driving device.

Fig. 2B is a front view of the lens driving apparatus.

Fig. 3A is a top view of the lens driving device.

Fig. 3B is a bottom view of the lens driving device.

Fig. 4A is an upper perspective view of the lens driving device in a state where the cover member is removed.

Fig. 4B is an upper perspective view of the lens driving device in a state where the cover member and the yoke are removed.

Fig. 4C is an upper perspective view of the lens driving device in a state where the cover member, the yoke, and the spacer member are removed.

Fig. 5A is an upper perspective view of the lens holding member.

Fig. 5B is an upper perspective view of the lens holding member with the coil mounted thereon.

Fig. 6A is a lower perspective view of the lens holding member.

Fig. 6B is a lower perspective view of the lens holding member with the coil mounted thereon.

Fig. 7A is a top view of the lens holding member.

Fig. 7B is a top view of the lens holding member with the coil mounted thereon.

Fig. 8A is a bottom view of the lens holding member.

Fig. 8B is a bottom view of the lens holding member with the coil mounted thereon.

Fig. 9A is an enlarged view of a part of the lens holding member.

Fig. 9B is an enlarged view of another portion of the lens holding member.

Fig. 10A is a bottom view of the lens driving device with the cover member, the terminal member, and the base member removed.

Fig. 10B is a bottom view of the lens driving device with the cover member, the terminal member, the base member, the spacer member, the upper plate spring, the lower plate spring, and the yoke removed.

Fig. 11A is a top view of the upper leaf spring.

Fig. 11B is a top view of the lower leaf spring.

Fig. 12A is a bottom view of a connection structure of a plate spring and a coil in the lens driving device.

Fig. 12B is a side view of a connection structure of a plate spring and a coil in the lens driving device.

Fig. 13 is an exploded perspective view and a completed perspective view of a base member of the lens driving apparatus.

Fig. 14A is a plan view of the base member in which the terminal member is buried.

Fig. 14B is a plan view of the base member mounted with the wiring substrate.

Fig. 15A is a plan view of the wiring substrate.

Fig. 15B is a plan view of the upper pattern layer disposed on the upper surface of the wiring substrate.

Fig. 15C is a plan view of the lower pattern layer disposed on the lower surface of the wiring substrate.

Fig. 15D is a bottom view of the wiring substrate.

Fig. 16 is a cross-sectional view of the wiring substrate.

Fig. 17A is a perspective view of the terminal member.

Fig. 17B is a perspective view of the terminal member and the wiring board.

Fig. 17C is a perspective view of the terminal member, the wiring board, and the lower leaf spring.

Fig. 17D is a perspective view of the coil, the terminal member, the wiring board, and the lower leaf spring.

Fig. 18A is a bottom view of the drive mechanism.

Fig. 18B is a side view of the drive mechanism.

Fig. 18C is a front view of the drive mechanism.

Fig. 18D is a rear view of the drive mechanism.

Fig. 19 is a perspective view of the spacer member and the magnetic field generating member.

Detailed Description

Next, a lens driving device 101 according to an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is an exploded perspective view of the lens driving device 101. Fig. 2A is an upper perspective view of the lens driving device, and fig. 2B is a front view of the lens driving device 101 as viewed from the X1 side. Fig. 3A is a top view of the lens driving device 101, and fig. 3B is a bottom view of the lens driving device 101. Fig. 4A is an upper perspective view of the lens driving device 101 in a state where the cover member 4 is removed, fig. 4B is an upper perspective view of the lens driving device 101 in a state where the yoke 40 is further removed, and fig. 4C is an upper perspective view of the lens driving device 101 in a state where the spacer member 1 is further removed. Fig. 4A to 4C each correspond to fig. 2A.

As shown in fig. 1, the lens driving device 101 includes: a lens holding member 2 capable of holding a lens body (not shown); a drive mechanism MK for moving the lens holding member 2 along the optical axis direction (Z-axis direction) related to the lens body; a plate spring 6 as a supporting member that supports the lens holding member 2 so as to be movable in the optical axis direction; a fixed side member RG to which the leaf spring 6 is fixed; and a terminal member 7 electrically connected. The lens is, for example, a cylindrical lens barrel including at least one lens, and is configured such that its central axis is along the optical axis direction. The optical axis direction includes a direction of an optical axis JD associated with the lens body and a direction parallel to the optical axis JD.

The drive mechanism MK includes, as shown in fig. 1: a coil 3 having two oval winding portions 13 (see fig. 5B) held on two opposite sides out of four sides of the lens holding member 2, the lens holding member 2 having a substantially rectangular outer shape in a plan view; a yoke 40; the magnetic field generating member 5 is disposed so as to face the coil 3 in the radial direction (direction perpendicular to the optical axis direction); a detection magnet 8 (see fig. 6A) and a balance magnet 9 (see fig. 6A) mounted on the lens holding member 2; and a magnetic detection member 11 mounted on the wiring board 10.

The detection magnet 8 is a diode magnet attached to the lens holding member 2 for detecting the position of the lens holding member 2. The balance magnet 9 is a diode magnet attached to the lens holding member 2 so as to cancel the influence of the weight of the detection magnet 8 on the lens holding member 2, and has the same weight as the detection magnet 8. In the present embodiment, both the detecting magnet 8 and the balancing magnet 9 are fixed to the lens holding member 2 by an adhesive.

The magnetic detection means 11 includes a magnetic sensor for detecting the magnetic field generated by the detection magnet 8, and a driver IC having a current control circuit incorporated therein for controlling the current flowing through the coil 3. The magnetic sensor is, for example, a hall element. In the present embodiment, the magnetic detection member 11 is constituted by an electronic component in which at least the hall element and a chip constituting the driver IC are housed in one package.

The cover member 4 constitutes a rectangular box-like outer casing. In the present embodiment, the cover member 4 is formed of a nonmagnetic material such as austenitic stainless steel.

Specifically, as shown in fig. 1, the cover member 4 has a box-like outer shape defining the housing portion 4 s. The cover member 4 includes a rectangular tubular outer peripheral wall portion 4A and a flat annular upper plate portion 4B provided continuously with an upper end (end on the Z1 side) of the outer peripheral wall portion 4A. An opening is formed in the upper plate portion 4B.

The outer peripheral wall portion 4A includes first to fourth side plate portions 4A1 to 4A4. The first side plate portion 4A1 and the second side plate portion 4A2 are opposed to each other, and the third side plate portion 4A3 and the fourth side plate portion 4A4 are opposed to each other. In the present embodiment, the first side plate portion 4A1 and the second side plate portion 4A2 are perpendicular to the third side plate portion 4A3 and the fourth side plate portion 4A4, respectively.

The yoke 40 constitutes a part of the drive mechanism MK. In the present embodiment, the yoke 40 is manufactured by punching and drawing a plate material made of a soft magnetic material such as iron.

Specifically, as shown in fig. 1, the yoke 40 includes a side wall portion 40A and a flat annular upper wall portion 40B provided continuously with an upper end (Z1-side end) of the side wall portion 40A. An opening is formed in the upper wall portion 40B.

The side wall portion 40A includes a first side wall portion 40A1 disposed opposite to the first side plate portion 4A1 of the cover member 4, and a second side wall portion 40A2 disposed opposite to the second side plate portion 4A2 of the cover member 4. The first side wall 40A1 and the second side wall 40A2 are opposed to each other.

The detection magnet 8 is disposed on a lower side (Z2 side) of one of the corners of the lens holding member 2, and the lens holding member 2 has a substantially rectangular outer shape in a plan view. Specifically, the detection magnet 8 is fitted into a recess formed at a position closer to the fourth side plate portion 4A4 than the first side plate portion 4A1, on a lower side of a corner portion between a side portion facing the first side plate portion 4A1 and a side portion facing the fourth side plate portion 4A4, among the four side portions of the lens holding member 2.

The balance magnet 9 is disposed on the lower side of the other corner of the lens holding member 2. Specifically, the balance magnet 9 is fitted into a recess formed at a position closer to the third side plate portion 4A3 than the second side plate portion 4A2, on the lower side of a corner portion between the side portion facing the second side plate portion 4A2 and the side portion facing the third side plate portion 4A3, among the four side portions of the lens holding member 2.

The cover member 4 configured as described above houses the coil 3, the magnetic field generating member 5, and the yoke 40 in the housing portion 4s, and is coupled to the base member 18 as shown in fig. 2A, and constitutes a case together with the base member 18.

The magnetic field generating member 5 constitutes a part of the drive mechanism MK. In the present embodiment, the magnetic field generating member 5 functions as a driving magnet. Specifically, the magnetic field generating member 5 includes a first magnetic field generating member 5A disposed opposite to the first side plate portion 4A1 (first side wall portion 40 A1), and a second magnetic field generating member 5B disposed opposite to the second side plate portion 4A2 (second side wall portion 40 A2).

The first magnetic field generating member 5A is constituted by a combination of two diode magnets. However, the first magnetic field generating member 5A may be constituted by one diode magnet or one quadrupole magnet. The same applies to the second magnetic field generating member 5B.

Specifically, the first magnetic field generating member 5A includes a first upper magnet 5AU and a first lower magnet 5AL as shown in fig. 1. The second magnetic field generating member 5B includes a second upper magnet 5BU and a second lower magnet 5BL.

The first upper magnet 5AU, the first lower magnet 5AL, the second upper magnet 5BU, and the second lower magnet 5BL are each substantially rectangular parallelepiped in shape. The magnetic field generating member 5 is disposed outside the coil 3 (winding portion 13) and along the first side wall portion 40A1 and the second side wall portion 40A2 of the yoke 40. The magnetic field generating member 5 is fixed to the inner surface of the side wall 40A by an adhesive. The inner surface is a surface facing the optical axis JD.

The leaf spring 6 includes an upper leaf spring 16 disposed between the lens holding member 2 and the yoke 40 (spacer member 1), and a lower leaf spring 26 disposed between the lens holding member 2 and the base member 18. The lower side plate spring 26 includes a lower side plate spring 26A and a lower side plate spring 26B.

The fixed-side member RG includes a spacer member 1, a cover member 4, a yoke 40, and a base member 18 in which the terminal member 7 is buried.

The spacer member 1 is disposed so that the elastic arm portion 16g of the upper leaf spring 16 can be elastically deformed when the lens holding member 2 moves in the Z1 direction.

The lens driving device 101 has a substantially rectangular parallelepiped shape, and is mounted on a substrate (not shown) on which a camera element (not shown) is mounted. The camera module is composed of a substrate, a lens driving device 101, a lens body mounted on the lens holding member 2, and imaging elements mounted on the substrate so as to face the lens body. The coil 3 is connected to the magnetic detection member 11 via the lower leaf spring 26, the terminal member 7, and the wiring board 10. When a current flows from a current control circuit (driver IC) provided in the magnetic detection unit 11 to the coil 3, the drive mechanism MK generates electromagnetic force along the optical axis direction.

The lens driving device 101 uses the electromagnetic force to move the lens holding member 2 in the optical axis direction on the Z1 side (object side) of the imaging element, thereby realizing an autofocus function. Specifically, the lens driving device 101 enables macro imaging by moving the lens holding member 2 in a direction away from the imaging element, and enables infinity imaging by moving the lens holding member 2 in a direction approaching the imaging element.

Next, the lens holder 2 and the driving mechanism MK will be described. Fig. 5A is an upper perspective view of the lens holding member 2, and fig. 5B shows a state of the lens holding member 2 when the lens holding member 2 of fig. 5A is wound with the coil 3. Fig. 6A is a lower perspective view of the lens holding member 2, and fig. 6B shows a state of the lens holding member 2 when the lens holding member 2 of fig. 6A is wound with the coil 3. Fig. 7A is a plan view of the lens holding member 2, and fig. 7B shows a state of the lens holding member 2 when the lens holding member 2 of fig. 7A is wound with the coil 3. Fig. 8A is a bottom view of the lens holding member 2, and fig. 8B shows a state of the lens holding member 2 when the lens holding member 2 shown in fig. 8A is wound with the coil 3. Fig. 9A is an enlarged view of the portion P shown in fig. 8B, and fig. 9B is an enlarged perspective view of the portion Q shown in fig. 8B. Fig. 10A is a bottom view of the lens driving device 101 in a state where the cover member 4, the terminal member 7, and the base member 18 are removed, and fig. 10B is a bottom view of the lens driving device 101 in a state where the spacer member 1, the upper plate spring 16, the lower plate spring 26, and the yoke 40 are further removed.

The lens holding member 2 is manufactured by injection molding a synthetic resin. In the present embodiment, the lens holding member 2 is manufactured by injection molding a Liquid Crystal Polymer (LCP). Specifically, as shown in fig. 5A, the lens holding member 2 includes a cylindrical portion 12 formed with a through hole extending in the optical axis direction.

The cylindrical portion 12 is provided with a screw groove on the inner circumferential surface of the cylindrical shape for attaching the lens body. A pedestal portion 12d having four recesses 12dh is provided on the end surface of the tubular portion 12 on the object side. As shown in fig. 4B, the inner portion 16i of the upper leaf spring 16 is placed on the mount portion 12d.

As shown in fig. 5A, a winding protrusion 12p for holding the coil 3 is provided on the outer peripheral surface of the cylindrical portion 12. In the present embodiment, the winding protrusion 12p has a substantially rectangular parallelepiped shape protruding from the outer peripheral surface of the cylindrical portion 12 in the radial direction (the X1 direction outer side and the X2 direction outer side) so as to wind the coil 3 around the axis perpendicular to the optical axis direction. Specifically, the winding protrusion 12p is disposed on two outer side surfaces (a surface on the X1 side and a surface on the X2 side) of the lens holding member 2 that face each other.

The coil 3 is formed by winding a conductive wire around the winding protrusion 12p as shown in fig. 5B. Specifically, as shown in fig. 6B, the coil 3 includes a first coil 3A disposed opposite to the first side plate portion 4A1, a second coil 3B disposed opposite to the second side plate portion 4A2, and a connecting portion 3C connecting the first coil 3A and the second coil 3B. The winding protrusion 12p includes a first winding protrusion 12pA around which the first coil 3A is wound, and a second winding protrusion 12pB around which the second coil 3B is wound. In the present embodiment, the coil 3 is fixed to the winding protrusion 12p without using an adhesive, but may be fixed to the winding protrusion 12p using an adhesive. The winding direction of the coil 3 is arbitrary and is determined according to the arrangement (magnetization direction) of the driving magnet 5A.

The first coil 3A includes a coil portion 13 as a coil body portion formed by winding around the first winding protrusion 12pA in a ring shape, and the second coil 3B includes a coil portion 13 as a coil body portion formed by winding around the second winding protrusion 12pB in a ring shape. Fig. 5B is a diagram showing a detailed winding state of the conductive wire material covered with the insulating member on the surface thereof, with respect to the winding portion 13, for clarity. The same applies to the other drawings illustrating the winding portion 13.

As shown in fig. 6A, the lens holding member 2 includes two holding portions 72 as protruding portions which protrude downward (Z2 direction) from the end face on the image pickup element side (Z2 side), and four protruding setting portions 2t which protrude in a circular shape.

As shown in fig. 6B, the holding portion 72 includes a first holding portion 72A corresponding to the winding start side of the coil 3 and a second holding portion 72B corresponding to the winding end side of the coil 3. Both ends of the coil 3 are wound around the holding portions 72 and held.

As shown in fig. 6A and 10A, the protruding portion 2t includes two protruding portions 2t corresponding to the lower plate spring 26A and two protruding portions 2t corresponding to the lower plate spring 26B. The inner portions 26i of the lower leaf springs 26A and 26B, which are movable side supporting portions, are attached to and fixed to the protruding portion 2t. The inner portions 26i of the lower leaf springs 26A and 26B are fixed by heat staking the protruding portions 2t inserted into the through holes formed in the inner portions 26 i. In the drawings relating to the present embodiment, the protruding portion 2t is illustrated in a state in which the tip is deformed after heat staking is performed. The protruding portion 2t may be cold-staked.

Next, a driving mechanism MK of the lens driving device 101 will be described. As shown in fig. 10A and 10B, the drive mechanism MK includes the coil 3, the yoke 40, and two magnetic field generating members 5 disposed opposite to the two side wall portions 40A (the first side wall portion 40A1 and the second side wall portion 40A 2) constituting the yoke 40. Specifically, the magnetic field generating member 5 includes a first magnetic field generating member 5A disposed opposite the first side wall portion 40A1, and a second magnetic field generating member 5B disposed opposite the second side wall portion 40 A2. The drive mechanism MK generates a drive force (thrust) by using the current flowing through the coil 3 and the magnetic field generated by the magnetic field generating member 5, and moves the lens holding member 2 up and down along the optical axis direction.

As shown in fig. 8B, 9A and 9B, the extension 33 of the coil 3 includes a first extension 33A connected to the first coil 3A on the winding start side of the coil 3 and a second extension 33B connected to the second coil 3B on the winding end side of the coil 3.

Specifically, as shown in fig. 9A, the first extension portion 33A includes a winding portion 33m wound around the first holding portion 72A, an opposing portion 33c extending so as to oppose the bottom surface (Z2-side surface) of the lens holding member 2, and a second opposing portion 33k extending so as to oppose the edge portion between the bottom surface and the front surface (X1-side surface) of the lens holding member 2. As shown in fig. 9B, the second extension portion 33B includes a winding portion 33m wound around the second holding portion 72B, an opposing portion 33c extending so as to oppose the bottom surface (Z2-side surface) of the lens holding member 2, and a second opposing portion 33k extending so as to oppose the edge portion between the bottom surface and the rear surface (X2-side surface) of the lens holding member 2.

In the present embodiment, the first extension portion 33A is wound around the first holding portion 72A of the lens holding member 2 before the wire of the coil 3 is wound around the outer periphery of the first winding protrusion 12 pA. In the example shown in fig. 9A, a part of the wire of the coil 3 is wound three times around the first holding portion 72A. Thereby, the winding portion 33m is formed in the first holding portion 72A, and a part of the first extending portion 33A is held in the first holding portion 72A. However, the wire of the coil 3 of the first extension portion 33A may be wound around the first holding portion 72A after being wound around the outer periphery of the first winding protrusion 12 pA.

After the wire of the coil 3 is wound around the first holding portion 72A, the wire is wound around the outer periphery of the first winding protrusion 12 pA. At this time, as shown in fig. 9A, the wire extending from the winding portion 33m extends so as to face the bottom surface of the lens holding member 2, and further extends so as to face the edge portion between the bottom surface and the front surface of the lens holding member 2. At this time, the portion facing the bottom surface of the lens holding member 2 constitutes a first facing portion 33c of the first extension portion 33A, and the portion facing the edge of the lens holding member 2 constitutes a second facing portion 33k of the first extension portion 33A.

The second opposing portion 33k of the first extending portion 33A is configured to contact the edge portion of the lens holding member 2 as shown in fig. 9A when extending to oppose the edge portion of the lens holding member 2. Therefore, when a strong impact is applied to the lens driving device 101 due to a drop or the like, the first extension portion 33A of the coil 3 is pressed against the edge portion of the lens holding member 2. In the present embodiment, the edge of the lens holding member 2 is curved. Therefore, the first extension 33A is difficult to be cut at the edge of the lens holding member 2. The same applies to the edge portion of the lens holder 2 that contacts the second extension 33B.

Then, the connecting portion 3C is formed by the wire drawn from the winding portion 13 of the first coil 3A. After the connecting portion 3C is formed, the wire is wound around the outer periphery of the second winding protrusion 12pB in the same manner. When the winding of the wire material around the outer periphery of the first winding protrusion 12pA and the winding of the wire material around the outer periphery of the second winding protrusion 12pB are completed, the second extension 33B connected to the end of the winding portion 13 of the second coil 3B on the winding completion side is led out from the rear surface side to the bottom surface side of the lens holding member 2 as shown in fig. 9B. Specifically, the second opposing portion 33k extends so as to face an edge portion located between the bottom surface and the rear surface of the lens holding member 2, the first opposing portion 33c extends so as to face the bottom surface of the lens holding member 2, and the winding portion 33m is wound around the second holding portion 72B of the lens holding member 2. In the example shown in fig. 9B, the second extension portion 33B is wound three times around the second holding portion 72B.

Next, the leaf spring 6 and the fixed-side member RG will be described in detail. Fig. 11A is a plan view of the upper plate spring 16, and fig. 11B is a plan view of the lower plate spring 26. Fig. 12A and 12B are diagrams illustrating an example of a connection structure between the lower plate spring 26B and the coil 3. Specifically, fig. 12A is an enlarged view of the portion T shown in fig. 10A, and fig. 12B is an enlarged view of the lower leaf spring 26B, the coil 3, and the lens holding member 2 when the portion T shown in fig. 10A is viewed from the X2 side. In fig. 12A and 12B, the conductive adhesive CA as a bonding material is shown by cross hatching for the sake of easy understanding of the description. Fig. 13 is a diagram illustrating the base member 18 as the fixed-side member RG. Specifically, fig. 13 is an exploded perspective view and a completed perspective view of the base member 18 in which the terminal member 7 is buried.

In the present embodiment, the plate spring 6 is made of a metal plate mainly made of a copper alloy. The leaf spring 6 includes an upper leaf spring 16 disposed between the lens holding member 2 and the yoke 40 (spacer member 1), and a lower leaf spring 26 disposed between the lens holding member 2 and the base member 18. In a state where the lens holding member 2 and the leaf springs 6 (the upper leaf spring 16, the lower leaf spring 26A, and the lower leaf spring 26B) are engaged, the leaf springs 6 support the lens holding member 2 in a suspended state so that the lens holding member 2 can move in the optical axis direction (Z-axis direction). The lower leaf spring 26A and the lower leaf spring 26B function as power feeding means for supplying current to the coil 3. Therefore, the lower plate spring 26A is electrically connected to one end portion of the coil 3, and the lower plate spring 26B is electrically connected to the other end portion of the coil 3. The spacer member 1 is arranged between the upper leaf spring 16 and the yoke 40.

As shown in fig. 11A, the upper leaf spring 16 has a substantially rectangular shape in plan view, and includes an inner portion 16i as a movable side support portion fixed to the lens holding member 2, an outer portion 16e as a fixed side support portion fixed to the spacer member 1 as a fixed side member RG, and four elastic arm portions 16g located between the inner portion 16i and the outer portion 16 e. Specifically, the inner portion 16i is provided so as to face the pedestal portion 12d of the lens holding member 2. The outer side portion 16e has four corner portions 16b, and four stacks 16r connecting adjacent two corner portions 16 b. As shown in fig. 4B and 4C, the stack portion 16r is sandwiched between the spacer member 1 and the magnetic field generating member 5 and fixed by an adhesive. The corner portions 16b are fixed to the corners of the spacer member 1 with an adhesive. The spacer member 1, the yoke 40, and the magnetic field generating member 5 function as a fixed-side member RG.

Specifically, when the upper leaf spring 16 is mounted on the lens driving device 101, as shown in fig. 4B, the inner portion 16i is placed on the pedestal portion 12d of the lens holding member 2 (see fig. 5A). Further, the inner portion 16i and the pedestal portion 12d are fixed with an adhesive applied in the recess 12dh (refer to fig. 5A), whereby the inner portion 16i is fixed to the lens holding member 2. As shown in fig. 4C, the outer portion 16e contacts the upper surface (Z1-side surface) of the magnetic field generating member 5, and is sandwiched between the spacer member 1 (see fig. 4B) and the magnetic field generating member 5 to be fixed.

The upper leaf spring 16 is formed to be rotationally symmetrical approximately four times as shown in fig. 11A. The inner portion 16i is fixed to the lens holder 2, and the outer portion 16e is fixed to the yoke 40 and the cover member 4 via the spacer member 1. Therefore, the upper plate spring 16 can support the lens holding member 2 in a well-balanced manner.

As shown in fig. 11B, the lower leaf springs 26A and 26B are each configured to have a substantially semicircular inner shape. Further, the lens holder includes an inner portion 26i as a movable side support portion fixed to the lens holder 2, an outer portion 26e as a fixed side support portion fixed to the base member 18 as a fixed side member RG, and an elastic arm portion 26g located between the inner portion 26i and the outer portion 26 e.

As shown in fig. 11B, the inner portions 26i of the lower leaf springs 26A and 26B each include two inner engaging portions 26c engaged with the lens holding member 2, a first connecting portion 26p connecting the two inner engaging portions 26c, and a connecting plate portion 26h facing the extending portion 33 of the coil 3.

When the lower leaf spring 26A and the lower leaf spring 26B are assembled to the lens driving device 101, the four protruding portions 2t of the lens holding member 2 shown in fig. 6A are inserted into circular through holes provided in the inner joint portions 26c of the lower leaf spring 26A and the lower leaf spring 26B shown in fig. 11B, respectively, and are fitted. Thereby, the inner portions 26i of the lower leaf springs 26A and 26B are positioned and fixed to the lens holding member 2. The lower leaf springs 26A and 26B are fixed to the lens holding member 2 by, for example, heat staking or cold staking the protruding portion 2t of the lens holding member 2.

The relationship between the lower plate spring 26B, the lens holder 2, and the coil 3 will be mainly described below. However, the description of the lower leaf spring 26B applies equally to the lower leaf spring 26A.

As shown in fig. 12A and 12B, the connection plate portion 26h of the inner portion 26i of the lower plate spring 26B faces the bank 82 of the lens holding member 2 when the lens driving device 101 is assembled. That is, as shown in fig. 12A, the surface of the connecting plate portion 26h on the object side (Z1 side) is opposed to the concave receiving portion 82s surrounded by the dam portion 82. As shown in fig. 12A, the first opposing portion 33c of the second extending portion 33B of the coil 3 extends between the object-side surface of the inner portion 26i (the connecting plate portion 26 h) of the lower leaf spring 26B and the image pickup element-side surface (Z2-side) of the lens holding member 2. The dam 82 is formed by a step formed on the bottom surface of the lens holder 2.

The housing 82s is configured to be able to house the conductive adhesive CA that connects the second extension 33B of the coil 3 and the lower leaf spring 26B. In the present embodiment, the bank 82 is formed at a position adjacent to the second holding portion 72B, so the side wall of the second holding portion 72B is suitably used as a part of the bank 82. Therefore, the receiving portion 82s is provided at a position adjacent to the second holding portion 72B.

When the lower leaf spring 26B is attached to the lens holding member 2, as shown in fig. 12B, the second holding portion 72B protrudes downward (in the Z2 direction) from the inner portion 26i of the lower leaf spring 26B so that the tip end thereof is positioned on the image pickup element side (Z2 side) of the inner portion 26 i. Further, the second holding portion 72B may be wound so that a part of the winding portion 33m is also located on the image pickup element side (Z2 side) of the inner portion 26 i.

The lower plate spring 26B and the second extension 33B of the coil 3 are electrically and physically connected to each other by a conductive adhesive CA in which a conductive filler such as silver particles is dispersed in a synthetic resin. Specifically, before the lower leaf spring 26B is attached to the lens holder 2, the accommodating portion 82s of the lens holder 2 surrounded by the dam 82 is filled with the conductive adhesive CA, and then the lower leaf spring 26B is attached to the lens holder 2. The protruding portion 2t of the lens holding member 2 is heat-staked, and the conductive adhesive CA attached to each of the lens holding member 2 (the housing portion 82 s), the lower plate spring 26B (the connecting plate portion 26 h), and the second extension portion 33B (the first opposing portion 33 c) is heat-set. The heat curing from the filling of the conductive adhesive CA into the accommodating portion 82s to the filling of the conductive adhesive CA is performed in a state where the lens holding member 2 is inverted so that the second holding portion 72B protrudes vertically upward. Therefore, even when the conductive adhesive CA has fluidity, it can be held at a desired position (position in the housing 82 s) appropriately. Further, since a part of the first opposing portion 33c is disposed in the housing portion 82s, it is buried in the conductive adhesive CA. The conductive adhesive CA is not limited to the thermosetting type, and may be an ultraviolet curable type.

As shown in fig. 11B, the outer portion 26e of the lower leaf spring 26B includes two outer engaging portions 26d engaged with the base member 18, and a second connecting portion 26q connecting the two outer engaging portions 26 d. The through hole provided in the outer engaging portion 26d of the lower leaf spring 26B is fitted into a projection 18t (see fig. 13) provided on the upper surface of the base member 18. Thereby, the outer portion 26e of the lower plate spring 26B is positioned and fixed to the base member 18.

The lower leaf spring 26A and the lower leaf spring 26B are formed to be substantially rotationally symmetrical twice as shown in fig. 11B. The lower leaf spring 26B is connected to the lens holder 2 at two inner engaging portions 26c and connected to the base member 18 at two outer engaging portions 26 d. The same applies to the lower plate spring 26A. With this configuration, the lower leaf spring 26A and the lower leaf spring 26B can support the lens holding member 2 in a state of being movable in the optical axis direction in a well-balanced manner.

Next, the fixed-side member RG will be described in detail. The fixing-side member RG includes a spacer member 1 for fixing the upper leaf spring 16, a cover member 4, a magnetic field generating member 5, and a yoke 40, and a base member 18 for fixing the respective lower leaf springs 26A and 26B.

The base member 18 is manufactured by injection molding synthetic resin. The base member 18 is disposed below the lens holder 2 (on the Z2 side), and constitutes a case together with the cover member 4. In the present embodiment, the base member 18 is manufactured by injection molding a Liquid Crystal Polymer (LCP) which is the same synthetic resin material as the lens holding member 2. Specifically, as shown in fig. 13, the base member 18 has a substantially rectangular outer shape in a plan view, and a circular opening 18k is formed in the center. Six protruding portions 18t protruding upward are provided on a surface (upper surface) of the base member 18 on the object side (Z1 side). The protruding portion 18t is inserted into and fitted into a through hole provided in the outer engaging portions 26d of the lower leaf springs 26A and 26B, respectively. At this time, the protruding portion 18t is fixed to the outer joint part 26d by heat staking. In the drawings related to the present embodiment, the protruding portion 18t is illustrated in a state in which the tip is deformed after heat staking. The protruding portion 18t may be fixed to the outer joint part 26d by cold staking.

As shown in fig. 13, the base member 18 is embedded with a terminal member 7 formed of a metal plate containing copper, iron, or an alloy containing these as a main component. In the present embodiment, the terminal member 7 includes first to tenth terminal members 7A to 7J.

The first terminal member 7A has an end portion 7AR protruding outward from a corner of the base member 18 in a direction perpendicular to the optical axis direction, and a terminal portion 7AT protruding downward (Z2 direction) from the base member 18 on the front side (X1 side) of the base member 18. The second terminal member 7B has an end portion 7BR protruding outward from a corner of the base member 18 in a direction perpendicular to the optical axis direction. The third terminal member 7C has an end portion 7CR protruding outward in a direction perpendicular to the optical axis direction from a corner portion of the base member 18. The fourth terminal member 7D has an end portion 7DR protruding outward from a corner of the base member 18 in a direction perpendicular to the optical axis direction.

The end portions 7AR, 7BR, 7CR, and 7DR are configured to contact the lower end portions of the four corners of the cover member 4 as shown in fig. 2A and 2B, respectively. According to this configuration, the first to fourth terminal members 7A to 7D are electrically connected to each other via the cover member 4, and are grounded via the terminal portion 7AT of the first terminal member 7A.

The base member 18 is positioned by combining the inner surface of the outer peripheral wall portion 4A of the cover member 4 and the outer peripheral side surface of the base member 18, and then the end portions 7AR, 7BR, 7CR, and 7DR are welded to the lower end portions of the four corners of the cover member 4, respectively, and are fixed to the cover member 4. The cover part 4 and the base part 18 may also be at least partially fixed with an adhesive.

The fifth terminal member 7E has a connection portion 7EP exposed from the upper surface (surface on the Z1 side) of the base member 18, a connection portion 7EQ (see fig. 3B) exposed from the lower surface (surface on the Z2 side) of the base member 18, and a connection portion 7ES in contact with the first joint portion TM1, which is one joint portion TM among six joint portions TM (see fig. 15C) formed on the wiring substrate 10.

The sixth terminal member 7F has a connection portion 7FP exposed from the upper surface (surface on the Z1 side) of the base member 18, a connection portion 7FQ (see fig. 3B) exposed from the lower surface (surface on the Z2 side) of the base member 18, and a connection portion 7FS in contact with a sixth joint portion TM6 that is one joint portion TM among six joint portions TM (see fig. 15C) formed on the wiring substrate 10.

The base member 18 is configured such that the surface of the connection portion 7EP and the surface of the connection portion 7FP are located on the same plane. The base member 18 is configured such that the surface of the connection portion 7EQ and the surface of the connection portion 7FQ are on the same plane.

The seventh terminal member 7G has a terminal portion 7GT protruding downward (Z2 direction) from the base member 18 on the front side (X1 side) of the base member 18, and a connection portion 7GS that contacts a second joint portion TM2 that is one joint portion TM of six joint portions TM (see fig. 15C) formed on the wiring substrate 10.

The eighth terminal member 7H has a terminal portion 7HT protruding downward (Z2 direction) from the base member 18 on the front side (X1 side) of the base member 18, and a connection portion 7HS that contacts a third joint portion TM3 that is one joint portion TM of six joint portions TM (see fig. 15C) formed on the wiring substrate 10.

The ninth terminal member 7I has a terminal portion 7IT protruding downward (Z2 direction) from the base member 18 on the front side (X1 side) of the base member 18, and a connection portion 7IS that contacts a fourth joint portion TM4 that IS one joint portion TM of six joint portions TM (see fig. 15C) formed on the wiring substrate 10.

The tenth terminal member 7J has a terminal portion 7JT protruding downward (Z2 direction) from the base member 18 on the front side (X1 side) of the base member 18, and a connection portion 7JS that contacts a fifth joint portion TM5 that is one joint portion TM of six joint portions TM (see fig. 15C) formed on the wiring substrate 10.

Next, the wiring board 10 will be described in detail with reference to fig. 14A, 14B, 15A to 15D, and 16. Fig. 14A and 14B are diagrams showing positional relationships between the wiring board 10 and the base member 18. Specifically, fig. 14A shows a top view of the base member 18 in which the terminal member 7is embedded, and fig. 14B shows a top view of the base member 18 to which the wiring board 10 is mounted. Fig. 14A corresponds to fig. 14B in which illustration of the wiring board 10 is omitted. Fig. 15A to 15D are diagrams showing a pattern layer formed on the wiring board 10. Specifically, fig. 15A shows a plan view of the wiring board 10. Fig. 15B visually illustrates the practically invisible upper pattern layer 10L1 disposed on the upper surface (surface on the Z1 side) of the wiring substrate 10, and fig. 15C visually illustrates the practically invisible lower pattern layer 10L2 disposed on the lower surface (surface on the Z2 side) of the wiring substrate 10. Fig. 15D shows a bottom view of the wiring board 10. Fig. 16 is a cross-sectional view of a portion of the wiring board 10 where the through hole VH is formed. In fig. 15C, for easy understanding, the lower pattern layer 10L2 disposed on the lower surface of the wiring board 10 is shown in perspective from the upper surface side (Z1 side).

The wiring board 10 is a double-sided printed board having conductive wiring patterns formed on both sides, and includes a base portion 10B formed of a polyimide film having heat resistance, an upper pattern layer 10L1 disposed on the upper surface of the base portion 10B, an insulating upper resist layer 10R1 covering a part of the upper pattern layer 10L1, a lower pattern layer 10L2 disposed on the lower surface of the base portion 10B, and an insulating lower resist layer 10R2 covering a part of the lower pattern layer 10L 2. The wiring board 10 is configured as a flexible wiring board, but may be a rigid wiring board or a rigid-flexible wiring board. In fig. 15A, the upper resist layer 10R1 is indicated by dot hatching, and in fig. 15D, the lower resist layer 10R2 is indicated by dot hatching.

The wiring patterns of the upper pattern layer 10L1 and the lower pattern layer 10L2 are formed of copper, for example. In the present embodiment, as shown in fig. 16, the upper pattern layer 10L1 is composed of a copper foil layer CF1 and a copper plating layer CP1 covering the copper foil layer CF 1. Similarly, the lower pattern layer 10L2 is composed of a copper foil layer CF2 and a copper plating layer CP2 covering the copper foil layer CF 2.

As shown in fig. 14A and 14B, the wiring board 10 is mounted on the upper surface of the base member 18 so that the six connection portions 7ES to 7JS of the terminal member 7 are electrically connected to the magnetic detection member 11, respectively. In the present embodiment, the wiring patterns (first to sixth bonding portions TM1 to TM6 (see fig. 15C)) in the wiring substrate 10 and the connection portions 7ES to 7JS in the terminal member 7 are bonded by solder SD as a bonding material. However, the wiring patterns (first to sixth bonding portions TM1 to TM 6) and the connection portions 7ES to 7JS may be bonded by a conductive adhesive as a bonding material.

Fig. 14A shows the magnetic detection member 11 and the capacitor 14 disposed in the recess 18R formed in the upper surface of the base member 18, and the magnetic detection member 11 and the capacitor 14 are actually mounted on the lower surface (surface on the Z2 side) of the wiring board 10 by soldering or the like, and then mounted on the base member 18 together with the wiring board 10 in a state of being mounted on the wiring board 10. Specifically, the magnetic detection member 11 and the capacitor 14 are accommodated in the recess 18R as shown in fig. 14A.

As shown in fig. 15A and 15B, the upper pattern layer 10L1 includes six conductive portions TH (first to sixth conductive portions TH1 to TH 6) and eight auxiliary conductive portions NT (first to eighth auxiliary conductive portions NT1 to NT 8). The six conductive portions TH and the eight auxiliary conductive portions NT are alternately arranged.

As shown in fig. 15C and 15D, the lower pattern layer 10L2 includes first to sixth land portions LD1 to LD6 connected to six connection portions (not shown) in the magnetic detection member 11, and seventh and eighth land portions LD7 and LD8 connected to two electrodes (not shown) in the capacitor 14.

The lower pattern layer 10L2 includes six bonding portions TM (first to sixth bonding portions TM1 to TM 6) and seven conductive pattern portions PT (first to seventh pattern portions PT1 to PT 7). The six bonding portions TM and the seven pattern portions PT are alternately arranged. As shown in fig. 15D, the lower pattern layer 10L2 is configured such that the first to sixth bonding portions TM1 to TM6 are exposed from the lower resist layer 10R 2.

The conductive portion TH in the upper pattern layer 10L1 is connected to the joint portion TM in the lower pattern layer 10L2 via the via hole VH as shown in fig. 16. The through hole VH is an example of a hole portion having a conductor on the inner peripheral surface. The conductor of the inner peripheral surface connects the joint portion TM in the lower pattern layer 10L2 and the conductive portion TH in the upper pattern layer 10L 1. In the present embodiment, the through hole VH is formed by copper plating holes (holes penetrating the copper foil layer CF1 and the base 10B but not penetrating the copper foil layer CF 2) formed by laser at the stage where the copper foil layer CF1 is formed on the upper surface of the base 10B and the copper foil layer CF2 is formed on the lower surface of the base 10B. According to this configuration, heat applied to the conductive portion TH in the upper pattern layer 10L1 is transferred to the bonding portion TM in the lower pattern layer 10L2 through the copper plating layer CP1 constituting the through hole VH.

In the present embodiment, the bonding between the connection portions 7ES to 7JS and the first to sixth bonding portions TM1 to TM6 (see fig. 15C) based on the wiring pattern of the solder SD (see fig. 14A) is achieved by using the heat conduction through the copper plating layer CP1 as described above.

Specifically, the above-mentioned bonding is achieved by melting the solder paste applied on the lower surface (surface on the Z2 side) of the bonding portion TM in the lower pattern layer 10L2 by the heat of a heating member such as a heating die pressed against the upper surface (surface on the Z1 side) of the conductive portion TH in the upper pattern layer 10L 1. Solder paste may be applied to the connection portions 7ES to 7JS of the terminal member 7 (see fig. 14A). The solder SD shown in fig. 14A is a solidified solder paste that is melted. However, the solder SD may be, for example, a solder paste melted in a reflow step for bonding the magnetic detection member 11 and the capacitor 14 to the wiring board 10, and solidified. That is, the solder paste may be applied to the lower surface of the joint portion TM together with the solder paste for joining the magnetic detection member 11 and the capacitor 14 to the wiring substrate 10 before the reflow process. In this case, the solder SD adheres in a cured state to the bonding portions TM (first to sixth bonding portions TM1 to TM 6) of the wiring substrate 10 before being placed on the base member 18.

The range HA shown by a broken line in fig. 15A indicates the size of the heating surface of the heating die as an example of the heating member. The heating die is pressed from the upper side (Z1 side) against the range HA in the upper surface (Z1 side surface) of the wiring substrate 10 in the state shown in fig. 14B. The area HA in the upper surface of the wiring substrate 10 is not covered with the upper resist layer 10R 1. Accordingly, the through hole VH formed in the conductive portion TH is exposed on the surface of the conductive portion TH. This is to enable the heated surface of the heated die to be in direct contact with the conductive portion TH.

In the present embodiment, the wiring board 10 is configured such that the heating surface of the heating die is in contact with not only the upper surface of the conductive portion TH but also the upper surface of the auxiliary conductive portion NT. The heat applied to the auxiliary conductive portion NT can heat the base portion 10B, but is not transferred to the wiring pattern in the lower pattern layer 10L2 by heat conduction. This is because the auxiliary conductive parts NT in the upper pattern layer 10L1 are not formed with through holes, that is, because the auxiliary conductive parts NT are not connected to the wiring patterns in the lower pattern layer 10L 2.

As shown in fig. 15C and 15D, the pattern portion PT in the lower pattern layer 10L2 is covered with extension portions EX (first to fifth extension portions EX1 to EX 5) that form a part of the lower resist layer 10R 2. That is, a laminated structure composed of pattern portions PT (first pattern portions PT1 to fifth pattern portions PT 5) and extension portions EX (first extension portions EX1 to fifth extension portions EX 5) is arranged between each of the six bonding portions TM in the lower pattern layer 10L 2. With the rigidity of these laminated structures, the wiring substrate 10 can suppress deformation of the base portion 10B when the heating die is pressed against the upper surface of the conductive portion TH in the upper pattern layer 10L 1. Further, these laminated structures can prevent the molten solder paste applied to the lower surface of the joint portion TM in the lower pattern layer 10L2 from diffusing between the two joint portions TM when the molten solder paste is melted. Because these laminated structures are formed in a state of bulging from the base 10B above the joint TM. As a result, these laminated structures can prevent the thickness of the solder SD for joining the wiring patterns (first to sixth joining portions TM1 to TM 6) in the wiring substrate 10 and the connection portions 7ES to 7JS (see fig. 14A) in the terminal member 7 from becoming excessively thin. In the present embodiment, the solder SD is configured to have a thickness substantially equal to the thickness of the extension portion EX in the laminated structure.

In the present embodiment, six connection portions in the magnetic detection member 11 and the first to sixth boss portions LD1 to LD6 are joined by soldering. Similarly, the two electrodes in the capacitor 14 are joined to the seventh land LD7 and the eighth land LD8 by soldering. The capacitor 14 is a bypass capacitor connected between a power supply Voltage (VDD) and a ground Voltage (VSS).

The first land LD1 is a land connected to a ground Voltage (VSS). The second boss LD2 is a boss connected to a power supply Voltage (VDD). The third boss portion LD3 is a boss portion connected to the data signal line (SDA). The fourth land LD4 is a land connected to the clock signal line (SCL). The fifth land LD5 and the sixth land LD6 are land portions used for outputting a current controlled by a driver IC (current control circuit) in the magnetic detection member 11. Specifically, the fifth boss portion LD5 is a boss portion connected to the first current output line (OUT 1), and the sixth boss portion LD6 is a boss portion connected to the second current output line (OUT 2).

The first joint TM1 is a joint connected to the first current output line (OUT 1), and is configured to be joined to the connection portion 7ES (see fig. 14A) of the terminal member 7. In the present embodiment, the first bonding portion TM1 is connected to the fifth land portion LD5 through the through holes VH9 and VH10, the first conductive portion TH1, and the through hole VH1, as shown in fig. 15B and 15C. The first bonding portion TM1 and the first conductive portion TH1 are connected via two through holes VH (through hole VH9 and through hole VH 10).

The second joint TM2 is a joint connected to the ground Voltage (VSS), and is configured to be joined to the connection portion 7GS (see fig. 14A) of the terminal member 7. In the present embodiment, as shown in fig. 15C, the second bonding portion TM2 is connected to the first land portion LD1 and the seventh land portion LD7 by the wiring pattern in the lower pattern layer 10L 2.

The third joint TM3 is a joint connected to the power supply Voltage (VDD), and is configured to be joined to the connection portion 7HS (see fig. 14A) of the terminal member 7. In the present embodiment, the third joint portion TM3 is connected to the second boss portion LD2 and the eighth boss portion LD8 via the through holes VH7 and VH4 as shown in fig. 15B and 15C.

The fourth joint TM4 IS a joint part connected to the data signal line (SDA), and IS configured to be joined to the connection part 7IS (see fig. 14A) of the terminal member 7. In the present embodiment, as shown in fig. 15B and 15C, the fourth joint portion TM4 is connected to the third boss portion LD3 via the through holes VH5 and VH 3.

The fifth joint TM5 is a joint connected to the clock signal line (SCL), and is configured to be joined to the connection portion 7JS (see fig. 14A) of the terminal member 7. In the present embodiment, as shown in fig. 15B and 15C, the fifth joint portion TM5 is connected to the fourth land portion LD4 via the through hole VH14, the fifth conductive portion TH5, and the through hole VH 8.

The sixth joint TM6 is a joint connected to the second current output line (OUT 2), and is configured to be joined to the connection portion 7FS (see fig. 14A) of the terminal member 7. In the present embodiment, as shown in fig. 15B and 15C, the sixth bonding portion TM6 is connected to the sixth land portion LD6 through the through holes VH15 and VH16, the sixth conductive portion TH6, and the through hole VH 2. The sixth bonding portion TM6 and the sixth conductive portion TH6 are connected via two through holes VH (through hole VH15 and through hole VH 16).

In the present embodiment, as described above, the wiring board 10 is configured such that two through holes VH are formed in the conductive portion TH having a relatively large surface area such as the first conductive portion TH1 and the sixth conductive portion TH6, and one through hole VH is formed in the conductive portion having a relatively small surface area such as the second conductive portion TH2 to the fifth conductive portion TH 5. This is to raise the temperatures of the first to sixth bonding portions TM1 to TM6 at substantially the same rate by the heat of the heating die pressed against the first to sixth conductive portions TH1 to TH 6.

However, in order to raise the temperatures of the plurality of bonding portions TM at substantially the same rate of rise, at least one combination of the conductive portions TH and the bonding portions TM may be connected via three or more through holes VH.

In the present embodiment, the through holes VH9 to VH16 for transmitting heat of the heating die are formed to have the same shape. However, at least one of the through holes VH may have a different shape from the other through holes VH in order to raise the temperatures of the first to sixth bonding portions TM1 to TM6 at substantially the same rate of rise. For example, the through hole VH9 may have an inner diameter different from that of the through hole VH 10.

In the present embodiment, the corresponding conductive portion TH and the bonding portion TM are formed to have substantially the same size. For example, the first conductive portion TH1 is configured to have substantially the same size as the first bonding portion TM 1. However, in order to raise the temperatures of the first to sixth bonding portions TM1 to TM6 at substantially the same rate of rise, the corresponding conductive portions TH and the bonding portions TM may have different sizes from each other.

In this way, as long as the temperatures of the first to sixth bonding portions TM1 to TM6 can be raised at substantially the same rate of rise, the arrangement and the size of the through holes VH are arbitrary, and the sizes of the conductive portions TH and the bonding portions TM can be determined arbitrarily.

According to this configuration, the driver IC in the magnetic detection member 11 can receive a command concerning the target position of the lens holding member 2 in the optical axis direction from an external control device or the like through the fourth joint TM4, for example. The driver IC can determine the current position of the lens holding member 2 based on the magnitude of the magnetic field detected by the hall element, and increase or decrease the magnitude of the current flowing through the coil 3 so that the difference between the current position of the lens holding member 2 and the target position becomes zero. That is, the driver IC can realize feedback control of the position of the lens holding member 2 in the optical axis direction.

Next, the electrical and physical connection relationship among the coil 3, the terminal member 7, the wiring board 10, and the lower leaf spring 26 will be described with reference to fig. 17A to 17D. Fig. 17A to 17D are diagrams showing an electrical and physical connection relationship between the coil 3, the terminal member 7, the wiring board 10, and the lower leaf spring 26. Specifically, fig. 17A is a perspective view of the terminal member 7, fig. 17B is a perspective view of the terminal member 7 and the wiring board 10, fig. 17C is a perspective view of the terminal member 7, the wiring board 10, and the lower plate spring 26, and fig. 17D is a perspective view of the coil 3, the terminal member 7, the wiring board 10, and the lower plate spring 26. Fig. 17A to 17D are hatched to indicate members through which current flows.

The joint TM (see fig. 15D) of the wiring board 10 is connected to the terminal member 7. Specifically, the second joint portion TM2 is connected to the connection portion 7GS (see fig. 17A) of the seventh terminal member 7G by the solder SD, and the third joint portion TM3 is connected to the connection portion 7HS (see fig. 17A) of the eighth terminal member 7H by the solder SD.

As shown in fig. 13 and 17B, the fifth terminal member 7E has a connection portion 7EP exposed from the upper surface of the base member 18. Similarly, the sixth terminal member 7F has a connection portion 7FP exposed from the upper surface of the base member 18. The connection portion 7EP (see fig. 17B) is connected to the outer joint portion 26d (see fig. 17C) of the lower leaf spring 26A by welding or conductive adhesive. Similarly, the connection portion 7FP (see fig. 17B) is connected to the outer joint portion 26d (see fig. 17C) of the lower leaf spring 26B by welding or conductive adhesive.

The connection portion 7EP is located above the wiring board 10 (on the Z1 side). That is, the base member 18 is configured such that, when the wiring board 10 and the lower plate spring 26A are assembled to the base member 18, the lower plate spring 26A can be held in a state where the lower plate spring 26A is not in contact with the wiring board 10 and is spaced apart from the wiring board 10 above the wiring board 10. The wiring board 10 is accommodated in a space between the lower plate spring 26A and the base member 18. Therefore, this configuration can improve the space efficiency in the case of the lens driving device 101.

The connection plate portion 26h (see fig. 17C) of the lower leaf spring 26A is connected to a first opposing portion 33C (not visible in fig. 17D) of the first extension portion 33A connected to the first coil 3A by a conductive adhesive. Similarly, the connection plate portion 26h (see fig. 17C) of the lower leaf spring 26B is connected to the first opposing portion 33C (see fig. 17D) of the second extension portion 33B connected to the second coil 3B by a conductive adhesive.

In accordance with the connection relationship described above, an electric voltage is applied to the magnetic detection member 11 from a power source, not shown, via the seventh terminal member 7G and the eighth terminal member 7H. At this time, the eighth terminal member 7H is connected to the power supply Voltage (VDD), and therefore the magnetic detection member 11 composed of electronic components is driven by the power supply Voltage (VDD). The current flows from the terminal portion 7HT of the eighth terminal member 7H to the connection portion 7HS as indicated by arrow AR1 in fig. 17A, for example. Under the control of the driver IC, the current output from the magnetic detection member 11 flows through the connection portion 7EP from the connection portion 7ES (see fig. 17A) of the fifth terminal member 7E as indicated by an arrow AR2 in fig. 17B, flows through the connection plate portion 26h from the outer joint portion 26D of the lower leaf spring 26A as indicated by an arrow AR3 in fig. 17C, and flows through the first opposing portion 33C of the first extension portion 33A (not visible in fig. 17D) via the first coil 3A, the connection portion 3C, and the second coil 3B as indicated by an arrow AR4 to an arrow AR8 in fig. 17D. Then, the current flows from the connection plate portion 26h of the lower leaf spring 26B to the outer joint portion 26d as indicated by arrow AR9 in fig. 17C, flows from the connection portion 7FP of the sixth terminal member 7F to the connection portion 7FS (see fig. 17A) as indicated by arrow AR10 in fig. 17B, and flows to the magnetic detection member 11 through the wiring pattern in the wiring substrate 10.

In the example shown in fig. 17A to 17D, the current flows from the connection portion 7ES of the fifth terminal member 7E toward the connection portion 7FS of the sixth terminal member 7F, but when the current flows from the connection portion 7FS of the sixth terminal member 7F toward the connection portion 7ES of the fifth terminal member 7E, the current flows in the opposite direction in the same path.

The driver IC in the magnetic detection member 11 can change the direction and magnitude of the electromagnetic force generated by the drive mechanism MK by changing the direction and magnitude of the current flowing between the connection portion 7ES of the fifth terminal member 7E and the connection portion 7FS of the sixth terminal member 7F, and as a result, the position of the lens holding member 2 in the optical axis direction can be controlled. In the present embodiment, the hall element in the magnetic detection means 11 detects the magnetic field generated by the detection magnet 8. Further, the driver IC can determine the current position of the lens holding member 2 in the optical axis direction based on the magnitude of the magnetic field detected by the hall element. The driver IC can change the direction and magnitude of the current flowing between the connection portion 7ES of the fifth terminal member 7E and the connection portion 7FS of the sixth terminal member 7F so that the difference between the current position and the target position of the lens holding member 2 in the optical axis direction becomes zero. In this way, the driver IC can feedback-control the position of the lens holding member 2 in the optical axis direction.

An example of the arrangement of the coil 3, the magnetic field generating member 5, the detecting magnet 8, the balancing magnet 9, and the magnetic detecting member 11 in an initial state in which current does not flow through the coil 3 will be described below with reference to fig. 18A to 18D. The initial state in the present embodiment is an initial state when the lens driving device 101 is oriented so that the optical axis JD is orthogonal to the virtual vertical plane. Fig. 18A to 18D show an example of the arrangement of the coil 3, the magnetic field generating member 5, the detecting magnet 8, the balancing magnet 9, and the magnetic detecting member 11. Specifically, fig. 18A is a bottom view of the drive mechanism MK. Fig. 18B is a side view of drive mechanism MK when the drive mechanism MK is viewed from the Y1 side. Fig. 18C is a front view of the drive mechanism MK when viewed from the X1 side. Fig. 18D is a rear view of the drive mechanism MK when viewed from the X2 side. The drive mechanism MK includes a coil 3, a magnetic field generating member 5, a magnet for detection 8, a magnet for balance 9, a magnetic detecting member 11, and a yoke 40. For clarity, the lens holding member 2 is illustrated in fig. 18A, and the illustration of the magnetic detection member 11 and the yoke 40 is omitted. Fig. 18B to 18D illustrate the magnetic detection member 11, and the lens holding member 2 and the yoke 40 are omitted. In fig. 18A to 18D, the N pole of the magnet is shown by cross hatching, the S pole of the magnet is shown by diagonal hatching, and the coil 3 is shown by dot hatching.

As shown in fig. 18A, the first coil 3A is disposed so as to face the first magnetic field generating member 5A, and the second coil 3B is disposed so as to face the second magnetic field generating member 5B.

The detection magnet 8 is a diode magnet polarized and magnetized in the Z-axis direction, which is the optical axis direction, and is disposed so as to face the magnetic detection member 11 mounted on the lower side (Z2 side) of the wiring board 10 in the Z-axis direction as shown in fig. 8B to 8D.

The balance magnet 9 is a diode magnet polarized and magnetized in the Z-axis direction, and is preferably arranged at the same height as the detection magnet 8 in the Z-axis direction as shown in fig. 18B.

The detection magnet 8 is disposed closer to the first magnetic field generating member 5A than the second magnetic field generating member 5B when compared based on the linear distance, and the balance magnet 9 is disposed closer to the second magnetic field generating member 5B than the first magnetic field generating member 5A when compared based on the linear distance. Therefore, in the present embodiment, the distance DS1 between the detection magnet 8 and the first magnetic field generating member 5A in the X-axis direction is smaller than the distance DS2 between the detection magnet 8 and the second magnetic field generating member 5B. The distance DS3 between the balancing magnet 9 and the second magnetic field generating member 5B in the X-axis direction is smaller than the distance DS4 between the balancing magnet 9 and the first magnetic field generating member 5A.

The detection magnet 8 and the balance magnet 9 are attached to the lens holder 2 such that the distance DS5 between the optical axis JD and the detection magnet 8 is equal to the distance DS6 between the optical axis JD and the balance magnet 9. This is to cancel the influence of the weight of the detection magnet 8 on the lens holding member 2 by the balance magnet 9.

In the present embodiment, as shown in fig. 18B, the detection magnet 8 and the balance magnet 9 are both arranged such that the upper portion (Z1 side portion) is S-pole and the lower portion (Z2 side portion) is N-pole.

The first upper magnet 5AU is disposed such that an inner portion (portion on the X2 side) facing the upper portion of the first coil 3A is an N pole and an outer portion (portion on the X1 side) is an S pole. The first lower magnet 5AL is disposed so that an inner portion (portion on the X2 side) facing the lower portion of the first coil 3A is S-pole and an outer portion (portion on the X1 side) is N-pole. This is to make the directions of the current flow opposite in the upper and lower portions of the first coil 3A.

The second upper magnet 5BU is disposed so that an inner portion (portion on the X1 side) facing the upper portion of the second coil 3B is an N pole and an outer portion (portion on the X2 side) is an S pole. The second lower magnet 5BL is disposed so that an inner portion (portion on the X1 side) facing the lower portion of the second coil 3B is S-pole and an outer portion (portion on the X2 side) is N-pole. This is to make the directions of the current flow opposite in the upper and lower portions of the second coil 3B.

In the present embodiment, as shown in fig. 18C, the first magnetic field generating member 5A is disposed at a position higher than the detecting magnet 8 at a boundary between the S-pole portion of the first upper magnet 5AU and the N-pole portion of the first lower magnet 5AL (i.e., at a boundary between the first upper magnet 5AU and the first lower magnet 5 AL). Similarly, as shown in fig. 18D, the second magnetic field generating member 5B is disposed at a position higher than the balance magnet 9 at a boundary between the S-pole portion of the second upper magnet 5BU and the N-pole portion of the second lower magnet 5BL (i.e., at a boundary between the second upper magnet 5BU and the second lower magnet 5 BL).

In the present embodiment, as shown in fig. 18B, the detection magnet 8 is arranged such that the vertical width H1 of the upper portion (S-pole portion) thereof is within the vertical width H2 of the first coil 3A and within the vertical width H3 of the first magnetic field generating member 5A. The same applies to the magnet for balance 9.

According to the above-described configuration, in the initial state, attractive force is generated between the upper side portion (S-pole portion) of the detection magnet 8 and the inner side portion (N-pole portion) of the first upper side magnet 5 AU. Therefore, the lens holding member 2 as a movable portion that supports the detection magnet 8 is biased in the direction indicated by the arrow AR12 in fig. 18B. That is, a force that brings the lens holding member 2 close to the first magnetic field generating member 5A acts on the lens holding member 2.

Then, attractive force is generated between the upper portion (S-pole portion) of the balancing magnet 9 and the inner portion (N-pole portion) of the second upper magnet 5 BU. Therefore, the lens holding member 2 is biased in the direction indicated by the arrow AR13 in fig. 18B, that is, in the direction opposite to the direction indicated by the arrow AR 12. That is, a force that brings the lens holding member 2 close to the second magnetic field generating member 5B acts on the lens holding member 2.

As a result, as shown in fig. 18A, the lens holding member 2 is biased in both the direction indicated by the arrow AR14 and the direction indicated by the arrow AR 15. That is, since the lens holding member 2 receives a force that is pulled from both sides, the optical axis JD of the lens body can be prevented from being deviated and tilted with respect to the Z axis.

As shown in fig. 18A, the detection magnet 8 is disposed near one end of the first magnetic field generating member 5A. Therefore, the force acting on the detection magnet 8 strictly has not only the component in the X-axis direction indicated by the arrow AR14 but also the component in the Y-axis direction. That is, the force acting on the detection magnet 8 brings the force acting in the tangential direction of a circle centered on the optical axis JD to the lens holding member 2. Similarly, the balance magnet 9 is disposed near the other end of the second magnetic field generating member 5B. Therefore, the force acting on the balance magnet 9 strictly has not only the component in the X-axis direction indicated by the arrow AR15 but also the component in the Y-axis direction. That is, the force acting on the balance magnet 9 brings the force acting in the tangential direction of the circle centered on the optical axis JD to the lens holding member 2. However, since the two forces acting in the tangential direction tend to rotate only the lens holder 2 around the optical axis JD, the optical axis JD of the lens body is not shifted. Further, the rotation of the lens holder 2 around the optical axis JD is suppressed by the rigidity of the plate spring 6, and in this regard, two forces acting in the tangential direction do not shift the optical axis JD of the lens body.

Next, the arrangement of the spacer member 1 and the magnetic field generating member 5 will be described with reference to fig. 19. Fig. 19 is a perspective view of the spacer member 1 and the magnetic field generating member 5. In fig. 19, for the sake of clarity, the upper leaf spring 16 actually disposed between the spacer member 1 and the magnetic field generating member 5 is omitted from illustration.

The spacer member 1 is a member disposed below the yoke 40 so as to be in contact with the lower surface of the upper wall portion 40B of the yoke 40, and has a frame-like portion FR.

The frame-shaped portion FR is a rectangular annular member, and has first to fourth side portions FR1 to FR4. The first side FR1 is disposed opposite to the first side plate 4A1 and the first side wall 40A1, the second side FR2 is disposed opposite to the second side plate 4A2 and the second side wall 40A2, the third side FR3 is disposed opposite to the third side plate 4A3, and the fourth side FR4 is disposed opposite to the fourth side plate 4 A4.

The frame-shaped portion FR has a protruding portion PR for positioning the magnetic field generating member 5. In the present embodiment, the protrusion PR has a pair of first protrusions PR1 used for positioning the first magnetic field generating member 5A and a pair of second protrusions PR2 used for positioning the second magnetic field generating member 5B.

The pair of first protruding portions PR1 are formed to protrude in the Z2 direction from the end face of the first side portion FR1 on the Z2 side. The pair of first protruding portions PR1 are arranged at intervals having substantially the same size as the width of the first magnetic field generating member 5A so that the first magnetic field generating member 5A is arranged therebetween.

The pair of second protruding portions PR2 are formed to protrude in the Z2 direction from the end face of the Z2 side of the second side portion FR 2. The pair of second protruding portions PR2 are arranged at intervals of substantially the same size as the width of the second magnetic field generating member 5B so that the second magnetic field generating member 5B is arranged therebetween.

Further, the pair of first protruding portions PR1 is configured to have a protruding length H11 larger than the height H10 of the first upper magnet 5AU so that the first upper magnet 5AU and the first lower magnet 5AL can be positioned at the same time. In the present embodiment, the pair of first protruding portions PR1 is configured such that the protruding length H11 is smaller than the height of the first magnetic field generating member 5A, but may be configured to be larger than the height of the first magnetic field generating member 5A. The same applies to the pair of second protruding portions PR 2.

As described above, the lens driving apparatus 101 according to the present embodiment includes: a fixed side part RG comprising a case; a lens holding member 2 capable of holding a lens body; a plate spring 6 as a supporting member that supports the lens holding member 2 so as to be movable in the optical axis direction; a drive mechanism MK configured to have at least a coil 3 and a drive magnet (magnetic field generating member 5) and to move the lens holding member 2 in the optical axis direction; a detection magnet 8 held by the lens holding member 2; a magnetic detection member 11 as a magnetic sensor for detecting the magnetic field of the detection magnet 8 and detecting the position in the optical axis direction of the lens holding member 2; a base member 18 provided with a plurality of terminal members 7; and a cover member 4 constituting a case together with the base member 18. The connection portions 7ES to 7JS of the terminal member 7 are exposed on the surface (upper surface) of the base member 18 as shown in fig. 14A, for example. The magnetic detection member 11 is mounted on the wiring board 10. As shown in fig. 15A to 15D, the wiring board 10 includes conductive bonding portions TM (first to sixth bonding portions TM1 to TM 6) formed on one surface side (Z2 side) and opposed to the connection portions 7ES to 7JS, conductive portions (first to sixth conductive portions TH1 to TH 6) formed on the other surface side (Z1 side), and through holes VH (through holes VH9 to VH 16) as holes connecting the bonding portions TM and the conductive portions TH and having conductors at least on the inner peripheral surface thereof. The connection portions 7ES to 7JS and the joint portions TM (first joint portion TM1 to sixth joint portion TM 6) are connected by a joint material such as solder SD as shown in fig. 14A, for example.

With this configuration, in the lens driving device 101, the wiring board 10 is easily attached to the base member 18. Therefore, this configuration can improve the production efficiency of the lens driving device 101. This is because, for example, in a state where the wiring board 10 is laminated on the base member 18, only heat needs to be applied to the conductive portion TH, and the connection portions 7ES to 7JS and the bonding portions TM (first bonding portion TM1 to sixth bonding portion TM 6) are bonded by the solder SD. Further, the reason is that a part of the terminal member 7 does not need to be inserted into a hole formed in the wiring board 10.

In this configuration, the joint portions of the connection portions 7ES to 7JS and the joint portions TM (first joint portion TM1 to sixth joint portion TM 6) are sandwiched between the wiring substrate 10 and the base member 18, and are thereby shielded from the outside. That is, the joining of the connection portions 7ES to 7JS and the joining portions TM (first joining portion TM1 to sixth joining portion TM 6) is completed inside the product of the lens driving device 101. Therefore, even when the lens driving device 101 receives an impact due to a drop or the like, the configuration can suppress the influence from being applied to the joint portion thereof, and further can suppress or prevent the occurrence of a positional shift or the like of the magnetic detection member 11. In this configuration, a part of the terminal member 7 does not penetrate the wiring board 10 and protrude from the wiring board 10, and does not cause other members to contact such protruding portions. That is, this structure does not bring about a complicated and easily damaged structure for joining the terminal member 7 and the wiring board 10. Therefore, this configuration can suppress or prevent the occurrence of positional displacement of the magnetic detection member 11 due to contact between the connecting portions 7ES to 7JS and the joint portions TM (the first joint portion TM1 to the sixth joint portion TM 6) and other members, or the like. As a result, this configuration enables the magnetic detection member 11 to appropriately detect the magnetic field generated by the detection magnet 8, and can improve the accuracy of position detection by the lens holding member 2 of the magnetic detection member 11.

The magnetic detection member 11, which is a magnetic sensor, is typically mounted on one surface side (Z2 side) of the wiring board 10. For example, in the example shown in fig. 15D, the magnetic detection member 11 is mounted on the lower surface (Z2-side surface) of the wiring substrate 10. That is, the magnetic detection member 11 is mounted on the surface opposite to the upper surface (surface on the Z1 side) of the wiring board 10 pressed by the heating die. With this configuration, contact between the heating die and the magnetic detection member 11 can be reliably avoided. Therefore, this configuration can facilitate heating of the conductive portion TH by the heating die.

The base member 18 may be formed with a recess 18R as a receiving portion in which the magnetic detection member 11 as a magnetic sensor can be received. With this configuration, the base member 18 can suppress an increase in the height dimension of the lens driving device 101.

The auxiliary conductive portion NT may be disposed between two adjacent conductive portions TH. That is, the conductive portions TH may be arranged in a state of three or more spaced apart intervals, and the auxiliary conductive portion NT may be arranged in at least one of the portions located between the adjacent two conductive portions TH. The conductive portions TH and the auxiliary conductive portions NT may be alternately arranged. For example, as shown in fig. 15A, the third auxiliary conductive portion NT3 may be disposed between the first conductive portion TH1 and the first conductive portion TH2, and the fourth auxiliary conductive portion NT4 may be disposed between the second conductive portion TH2 and the third conductive portion TH 3. Further, the fifth auxiliary conductive portion NT5 may be disposed between the third conductive portion TH3 and the fourth conductive portion TH4, the sixth auxiliary conductive portion NT6 may be disposed between the fourth conductive portion TH4 and the fifth conductive portion TH5, and the seventh auxiliary conductive portion NT7 may be disposed between the fifth conductive portion TH5 and the sixth conductive portion TH 6. With this configuration, the wiring board 10 can prevent the area of the portion of the heating surface of the heating die, which is in direct contact with the base 10B, from excessively increasing.

On the other surface side (Z1 side) of the wiring board 10, for example, as shown in fig. 15A, an upper resist layer 10R1 as a first resist layer covering the wiring pattern formed on the other surface side (Z1 side) may be provided so as to expose a region where the plurality of conductive portions TH are formed.

Further, as shown in fig. 15D, for example, a lower resist layer 10R2 as a second resist layer covering the wiring pattern formed on one surface side (Z2 side) may be provided on one surface side (Z2 side) of the wiring substrate 10, and an extension portion EX as a part of the lower resist layer 10R2 may be arranged between two adjacent bonding portions TM. Specifically, a first extension EX1 is arranged between the first joint TM1 and the second joint TM2, a second extension EX2 is arranged between the second joint TM2 and the third joint TM3, a third extension EX3 is arranged between the third joint TM3 and the 4 th joint TM 4, a fourth extension EX 4 is arranged between the fourth joint TM 4 and the 5 th joint TM5, and a fifth extension EX5 is arranged between the fifth joint TM5 and the sixth joint TM 6.

A pattern portion PT as a conductive layer may be formed between two adjacent bonding portions TM as shown in fig. 15C, and the pattern portion PT may be covered with a portion of the lower resist layer 10R2 as a second resist layer as shown in fig. 15D. According to this configuration, when the solder paste or the solidified solder SD provided on the lower surface of the joint portion TM is melted, the melted solder SD can be prevented from diffusing between the two joint portions TM by the laminated structure of the pattern portion PT and the extension portion EX of the lower resist layer 10R 2. As a result, these laminated structures can more reliably prevent the solder SD for bonding the wiring patterns (first to sixth bonding portions TM1 to TM 6) and the terminal members 7 (connection portions 7ES to 7 JS) from being excessively thin.

The through hole VH as the hole portion is preferably closed by a conductor. For example, the through hole VH is formed so as not to penetrate the joint portion TM and to open only on the upper side (Z1 side) as shown in fig. 16. This structure can prevent the molten solder SD from reaching the upper surface of the joint TM through the through hole VH when the solder SD provided on the lower surface (Z2-side surface) of the joint TM melts. Therefore, this structure can prevent the solder SD from adhering to the heating surface of the heating die.

The method for manufacturing the lens driving device 101 according to the present embodiment includes: a mounting step of superposing the base member 18 and the wiring board 10 so that the connection portions 7ES to 7JS of the terminal member 7 and the joint portions TM (first joint portion TM1 to sixth joint portion TM 6) of the wiring board 10 face each other; and a heating step of heating the conductive portions TH (the first to sixth conductive portions TH1 to TH 6) from the other surface side (Z1 side) of the wiring board 10 to melt the solder SD between the connection portions 7ES to 7JS and the bonding portions TM (the first to sixth bonding portions TM1 to TM 6), and soldering the connection portions 7ES to 7JS and the bonding portions TM (the first to sixth bonding portions TM1 to TM 6). This manufacturing method can improve the production efficiency of the lens driving device 101. This is because, in this manufacturing method, the connection portions 7ES to 7JS and the bonding portions TM (first bonding portion TM1 to sixth bonding portion TM 6) can be bonded by the solder SD by applying heat to the conductive portion TH only in a state where the wiring substrate 10 is laminated on the base member 18. In addition, this manufacturing method is because a part of the terminal member 7 does not need to be inserted into a hole formed in the wiring board 10.

The solder SD between the connection portions 7ES to 7JS and the joint portions TM (first joint portions TM1 to sixth joint portions TM 6) may be, for example, solder that adheres to the connection portions 7ES to 7JS or the joint portions TM (first joint portions TM1 to sixth joint portions TM 6) by solder plating, or solder that is contained in solder paste that is applied to the connection portions 7ES to 7JS or the joint portions TM (first joint portions TM1 to sixth joint portions TM 6).

The above-described manufacturing method may include a mounting step of soldering the magnetic detection member 11 as a magnetic sensor to one surface side (Z2 side) of the wiring board 10. The mounting step may include, for example, a reflow step. In this case, the solder SD disposed between the connection portions 7ES to 7JS and the joint portions TM (first joint portion TM1 to sixth joint portion TM 6) may be formed by melting and solidifying solder paste applied to the joint portions TM (first joint portion TM1 to sixth joint portion TM 6) in the mounting process. For example, the solder SD may be a solder obtained by melting and solidifying solder paste applied to the joint portions TM (first to sixth joint portions TM1 to TM 6) in the reflow step, and then melting and solidifying the solder again by heat of a heating die. That is, the solder paste may be a solder paste applied to the joint TM simultaneously with a solder paste applied to the magnetic sensor member 11 or the wiring board 10 for joining the magnetic sensor member 11 to the wiring board 10. In this manufacturing method, for example, the bonding between the connection portions 7ES to 7JS and the bonding portions TM (first to sixth bonding portions TM1 to TM 6) by the solder SD provided at the bonding portions TM (first to sixth bonding portions TM1 to TM 6) before the wiring substrate 10 is placed on the base member 18 is achieved. Therefore, the manufacturing method can further improve the production efficiency of the lens driving device 101. Since it is not necessary to apply solder plating to the connection portions 7ES to 7JS or the joint portions TM (first joint portion TM1 to sixth joint portion TM 6).

The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above-described embodiments. Various modifications, substitutions, and the like can be applied to the above-described embodiment without departing from the scope of the present invention. The features described with reference to the above embodiments may be appropriately combined as long as the features are not technically contradictory.

For example, in the above embodiment for realizing the auto focusing function, the lower leaf spring 26A and the first extension 33A are electrically connected, and the lower leaf spring 26B and the second extension 33B are electrically connected, but the present invention is not limited to this configuration. In the lens driving device with the shake correction function, for example, the present invention may include a configuration in which the upper plate spring 16 is divided into two, one of which is electrically connected to the first extension portion 33A and the other of which is electrically connected to the second extension portion 33B. In this configuration, the upper plate spring 16 is configured to connect the magnet holder and the lens holding member 2, and is configured to support the lens holding member 2 so as to be movable in the optical axis direction. The magnet holder is a member for holding the magnetic field generating member 5 facing the coil 3 held by the lens holding member 2, and is typically connected to the base member 18 via a suspension wire, and is supported by the suspension wire so as to be movable in a direction perpendicular to the optical axis direction. Specifically, the magnet frame is movable in a direction perpendicular to the optical axis direction by a driving mechanism including a magnetic field generating member 5 and a coil different from the coil 3 provided on the base member 18 so as to face the magnetic field generating member 5. In this case, the holding portion 72 as a protruding portion may be provided at the upper end portion of the lens holding member 2 on the side where the upper plate spring 16 is disposed. The magnetic detection member 11 is preferably held by a magnet holder.

In the above embodiment, the coil 3 is constituted by two elliptical (oval) coils each having a coil axis perpendicular to the optical axis direction, which are held on two of the four side surfaces of the lens holding member 2. However, the present invention is not limited to this configuration. The coil 3 may be a ring-shaped coil wound around the lens holding member 2 so as to have a coil axis extending in the optical axis direction.

In the above embodiment, the first magnetic field generating member 5A is constituted by a combination of the first upper magnet 5AU and the first lower magnet 5AL magnetized in the direction perpendicular to the optical axis JD, but may be constituted by one diode magnet magnetized in the optical axis direction. In this case, the upper side portion of the diode magnet corresponds to the inner side portion of the first upper side magnet 5AU, and the lower side portion thereof corresponds to the inner side portion of the first lower side magnet 5 AL. The same applies to the second magnetic field generating member 5B.

In the above embodiment, the detection magnet 8 and the balance magnet 9 are mounted so that the arrangement of the magnetic poles (magnetization direction) is the same as each other in the up-down direction as the optical axis direction, but may be mounted so that the arrangement is opposite to each other in the up-down direction as the optical axis direction. In this case, for example, the winding direction of the winding portion 13 of the second coil 3B is set to be the opposite direction to the winding direction in the above-described embodiment, and the arrangement (magnetization direction) of the magnetic poles of the second magnetic field generating member 5B is set to be the opposite arrangement (magnetization direction) to the arrangement (magnetization direction) of the magnetic poles in the above-described embodiment.

In the above embodiment, the magnetic detection means 11 is constituted by an electronic component having a hall element and a driver IC incorporated therein, but may be constituted by a magnetic detection element such as a hall element or a magnetoresistance effect element without including the driver IC. In this case, the magnetic detection element outputs a detection signal toward a control section located outside the lens driving device 101. The control unit controls the current supplied to the coil 3 by the control unit based on the detection signal.

The present application claims priority based on japanese patent application No. 2019-117626 filed on 25 th month 6 of 2019, and the entire contents of the japanese patent application are incorporated herein by reference.

Description of the reference numerals

The spacer member 2t is protruded from the setting portion 3A, the first coil 3B, the second coil 3C, the connecting portion 4A, the cover member 4A, the outer peripheral wall portion 4A1, the first side plate portion 4A2, the second side plate portion 4A3, the third side plate portion 4A4, the fourth side plate portion 4B, the upper plate portion 4A, the magnetic field generating member 5A, the first magnetic field generating member 5AU, the first upper magnet 5AL side magnet 5B second magnetic field generating member 5BU second upper magnet 5BL second lower magnet plate spring 7A first terminal member 7B second terminal member 7C third terminal member 7D fourth terminal member 7E fifth terminal member 7F sixth terminal member 7G seventh terminal member 7H eighth terminal member 7I ninth terminal member 7J tenth terminal member 7AR to 7DR terminal 7AT 7GT to 7JT terminal portions 7EP, 7EQ, 7FP, 7FQ, the magnetic body for detecting 7S-7 JS is provided with a magnet 9, a winding protrusion 12d, a first winding protrusion 12pB, a second winding protrusion 12P, a winding portion 14, a capacitor 16, an upper plate spring 16B, a corner 16e, an outer side 16g, an elastic arm 16i, an inner side 16R, a base 18k, and a base 18A, and a magnetic body for detecting 7S-7 JS is provided with a magnetic body 9, a base 10B, a base 10L1, an upper pattern layer 10L2, and an upper pattern layer 10R1, an upper resist layer 10R2, a lower resist layer 11, a magnetic body 12d, a base 12d, a winding protrusion 12p, a first winding protrusion 12pB, a second winding protrusion 14, a first plate spring 16B, an upper plate spring 16B, a corner 16e, an inner side 16, and a base 18A, respectively; 26B & lower leaf spring 26c & inner bonding portion 26d & outer bonding portion 26e & outer bonding portion 26g & elastic arm portion 26h & connecting plate portion 26i & inner portion 26p & first connecting portion 26q & second connecting portion 33A & extension portion 33B & second extension portion 33c & first opposing portion 33k & second opposing portion 33m & winding portion 40A & side wall portion 40A & first side wall portion 40A & second side wall portion 40B & upper wall portion 72A & first holding portion 72B & second holding portion 33A & second holding portion 82 & second holding portion 1 & CF & holder & CP & 1 & electric-conductive copper foil storage means, CP2 · copper plating EX · extension portion FR1 · first side portion FR2 · second side portion FR3 · third side portion FR4 · fourth side portion JD 1 · optical axis LD1 · first boss portion LD2 · second boss portion LD3 · third boss portion LD4 · fourth boss portion LD5 · fifth boss portion LD6 · sixth boss portion LD7 · seventh boss portion LD8 · eighth boss portion MK drive mechanism NT · auxiliary conductive portion PR · protruding portion PR1 · first protruding portion PR2 · second protruding portion LD2 · pattern portion LD · fixing side member SD · VH · through hole VH.

Claims

1. A lens driving device, comprising:

a fixed side member including a case;

a lens holding member capable of holding a lens body;

a support member that supports the lens holding member so as to be movable in an optical axis direction;

a driving mechanism including at least a coil and a driving magnet, and configured to move the lens holding member in an optical axis direction;

a detection magnet held by the lens holding member;

a magnetic sensor for detecting a magnetic field of the detection magnet;

a base member provided with a plurality of terminal members; and

a cover member constituting the case together with the base member,

the terminal member has a connection portion exposed on an upper surface of the base member, a terminal portion protruding downward from the base member, and a portion buried in the base member between the connection portion and the terminal portion,

the magnetic sensor is mounted on a wiring substrate,

the wiring board has a conductive joint part formed on one surface side and opposite to the connection part, a conductive part formed on the other surface side, and a hole part having a conductor at least on the inner peripheral surface for connecting the joint part and the conductive part,

The connection portion and the joint portion are connected by solder,

the hole portion is blocked by the conductor.

2. The lens driving apparatus according to claim 1,

the magnetic sensor is mounted on the one surface side of the wiring board.

3. The lens driving apparatus according to claim 2,

the base member is formed with a housing portion capable of housing the magnetic sensor.

4. The lens driving apparatus according to any one of claim 1 to 3,

an auxiliary conductive portion is disposed between two adjacent conductive portions.

5. The lens driving apparatus according to claim 4,

the conductive portions and the auxiliary conductive portions are alternately arranged.

6. The lens driving apparatus according to any one of claim 1 to 3,

a first resist layer covering the wiring pattern formed on the other surface side of the wiring substrate is provided so as to expose a region where the plurality of conductive portions are formed.

7. The lens driving apparatus according to any one of claim 1 to 3,

a second resist layer is provided on the one surface side of the wiring board to cover the wiring pattern formed on the one surface side, and a part of the second resist layer is disposed between two adjacent bonding portions.

8. The lens driving apparatus according to claim 7,

an electroconductive pattern portion is formed between two adjacent bonding portions, the pattern portion being covered with a part of the second resist layer.

9. A camera module, comprising:

the lens driving apparatus according to any one of claims 1 to 8;

the lens body; and

an imaging element facing the lens body.

10. A method of manufacturing a lens driving apparatus, the lens driving apparatus comprising:

a fixed side member including a case;

a lens holding member capable of holding a lens body;

a detection magnet held by the lens holding member;

a magnetic sensor for detecting a magnetic field of the detection magnet;

a wiring board on which the magnetic sensor is mounted;

a base member provided with a plurality of terminal members; and

a cover member constituting the case together with the base member,

the method of manufacturing the lens driving apparatus is characterized in that,

the wiring board has a conductive joint part formed on one surface side, a conductive part formed on the other surface side, and a hole part having a conductor at least on the inner peripheral surface for connecting the joint part and the conductive part,

the hole portion is blocked by the conductor,

the manufacturing method of the lens driving device comprises the following steps:

a mounting step of superposing the base member and the wiring board so that the connection portion and the joint portion of the terminal member face each other;

and a heating step of heating the conductive portion from the other surface side of the wiring board, thereby melting solder between the connection portion and the joint portion, and soldering the connection portion and the joint portion.

11. The method for manufacturing a lens driving apparatus according to claim 10,

the method comprises a mounting step of soldering the magnetic sensor to the one surface side of the wiring board,

The solder disposed between the connection portion and the joint portion is formed by melting and solidifying a solder paste applied to the joint portion at the time of the mounting process.