CN114438572A - Electroplating solution leakage-proof carrier and leakage-proof treatment process thereof - Google Patents
Electroplating solution leakage-proof carrier and leakage-proof treatment process thereof Download PDFInfo
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- CN114438572A CN114438572A CN202210008165.8A CN202210008165A CN114438572A CN 114438572 A CN114438572 A CN 114438572A CN 202210008165 A CN202210008165 A CN 202210008165A CN 114438572 A CN114438572 A CN 114438572A
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- 238000000034 method Methods 0.000 title claims description 26
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- 238000007747 plating Methods 0.000 claims description 82
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- 230000007246 mechanism Effects 0.000 claims description 21
- 239000004065 semiconductor Substances 0.000 claims description 19
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 230000002265 prevention Effects 0.000 claims description 14
- 239000011261 inert gas Substances 0.000 claims description 12
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- 239000012495 reaction gas Substances 0.000 claims description 6
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- 238000007599 discharging Methods 0.000 claims description 3
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/04—Removal of gases or vapours ; Gas or pressure control
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/08—Rinsing
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to an electroplating solution leakage-proof carrier which comprises an upper cavity cover and a lower cavity groove, wherein the upper cavity cover and the lower cavity groove are matched and closed with each other, an air bag is arranged at the gap between the upper cavity cover and the lower cavity groove, air holes and liquid guide holes are formed in the top and the bottom of the electroplating solution leakage-proof carrier, at least one liquid guide hole in the top of the electroplating solution leakage-proof carrier is externally connected with electroplating solution supply equipment, at least one air hole is externally connected with nitrogen supply equipment, at least one air hole is externally connected with a vacuum pump, at least one air hole is externally connected with an air pump in the bottom of the electroplating solution leakage-proof carrier to inflate and deflate the air bag, and at least one liquid guide hole is communicated with the interior of the lower cavity groove to enable the electroplating solution in the lower cavity groove to be emptied.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of electroplating, in particular to an electroplating solution leakage-proof carrier and a leakage-proof treatment process thereof.
[ background ] A method for producing a semiconductor device
In the electronic and metal industries, electroplating is often used, and no matter manufacturers of plating solutions or using companies of plating solutions, in terms of the existing electroplating process, a large amount of waste gas generated in the experimental process or the electroplating process is inevitable, and the waste gas mainly comprises organic waste gas, acid-base waste gas, chromic acid mist, metal dust and various waste gases emitted by heating various electroplating bath solutions, such as cyanogen-containing waste gas, ammonia-containing waste gas and the like. The waste gas has harm to respiratory tract, eyes and skin of human body, and the experimenter or electroplating operator contacts the waste gas for a long time to cause huge harm to human body, even some emitted sulfur dioxide and nitrogen oxide have harmful effect to growth of plants in the air, even kill the plants.
Therefore, waste gas treatment is a problem which cannot be solved at home and abroad, nowadays, waste gas treatment is usually carried out by arranging a suction fan at the top of a workshop or a waste gas generating facility, blowing the waste gas into a purification tower, and then carrying out treatment through a series of photocatalysis, plasma treatment, chimney overhead discharge and the like, but the method only focuses on the protection of the whole ecological system and neglects the human-oriented root problems, for example, reaction tanks in the existing method all adopt a fixed position and a fixed shape, electroplating solution needs to be frequently replaced and cleaned, gas deposited at the bottom of the reaction tanks can be accumulated to cause harm to human bodies, and many workshops only regularly detect whether the concentration of the workshop waste gas meets the standard, but the treatment is undoubtedly not permanent.
[ summary of the invention ]
In order to overcome the problems in the prior art, the invention provides an electroplating solution leakage-proof carrier and a leakage-proof treatment process thereof.
The invention provides a plating solution leakage-proof carrier for bearing plating solution and playing a role of leakage prevention, the electroplating liquid leakage-proof carrier comprises an upper cavity cover and a lower cavity groove, the upper cavity cover and the lower cavity groove are matched with each other to cover, an air bag is arranged at the gap between the upper cavity cover and the lower cavity groove, air vents and liquid vents are arranged at the top and the bottom of the electroplating liquid leakage-proof carrier, the top of the electroplating solution leakage-proof carrier is provided with at least one liquid guide hole which is externally connected with electroplating solution supply equipment, at least one air guide hole which is externally connected with nitrogen supply equipment, at least one air guide hole which is externally connected with a vacuum pump, the bottom of the electroplating solution anti-leakage carrier is at least provided with an air guide hole externally connected with an air pump to inflate and deflate the air bag, and the at least one liquid guide hole is communicated with the inside of the lower cavity groove so that the electroplating solution in the lower cavity groove can be emptied.
Preferably, the upper chamber cover comprises a top plate, an upper shell and an air suction cover, the inner wall of the upper shell is embedded in the air suction cover and is matched with the upper shell, the top plate is arranged on one side, deviating from the lower chamber groove, of the upper chamber cover, and the top plate and the air suction cover are provided with corresponding air guide holes and corresponding liquid guide holes.
Preferably, the liquid guide hole is externally connected with a neutralizing liquid supply device, and when the electroplating reaction is completed, the neutralizing liquid can be applied to the electroplating solution for rinsing.
Preferably, hold the chamber groove down including casing and interior cell body down, interior cell body is placed and is used for bearing the plating solution in the lower internal portion of casing, the gasbag set up in on the outer wall of interior casing, in the arbitrary direction, the cross sectional dimension of lower casing will be greater than the cross sectional dimension of interior cell body, so that interior cell body place in when the casing is inside down, the casing can contain completely down interior cell body, just the gasbag with leave the clearance between the inner wall of casing down, go up and hold the chamber lid and close when holding the chamber groove down, through partly insert of last casing in the clearance.
Preferably, the bottom side of the interior of the lower shell is provided with a semiconductor refrigeration piece, the bottom surface of the semiconductor refrigeration piece is 10-12 mm away from the ground, and when the inner groove body is placed in the interior of the lower shell, the inner groove body is placed on the semiconductor refrigeration piece.
Preferably, the carrier is prevented revealing by plating solution further includes electroplating mechanism, electroplating mechanism detachable connect in inside the interior cell body, electroplating mechanism includes mounting panel, driving motor, stirring roller and electrode, wherein mounting panel, driving motor, stirring roller and electrode all adopt fixed connection.
Preferably, the stirring roller is provided in a hollow structure and has a water tank formed thereon, and when the stirring roller rotates, the plating solution is poured into the inside of the stirring roller from the water tank and then poured out, the electrode includes an anode and a cathode, and the stirring roller rotates clockwise in a direction from the anode to the cathode.
To better solve the above solution, the present invention further provides another solution as follows: namely, the leakage-proof treatment process of the electroplating solution leakage-proof carrier, which needs to be applied to the electroplating solution leakage-proof carrier, comprises the following operation steps: step S1, providing an upper cavity cover and a lower cavity groove, wherein the upper cavity cover and the lower cavity groove can be covered to form a space, and an air bag is provided and arranged at the gap between the upper cavity cover and the lower cavity groove; step S2, in the working state, the space is taken as an electroplating reaction tank, electroplating solution is injected into the electroplating reaction tank, the air bag is inflated to close the gap between the upper cavity cover and the lower cavity groove, and reaction gas in the space is simultaneously pumped out from the top; and step S3, after the electroplating is finished, discharging the plating solution from the bottom, inputting inert gas into the space from top to bottom, and after the internal space reaches a preset pressure threshold value, extracting the inert gas to change the space into a vacuum state for a preset time.
Preferably, further comprising step S4; step S4: the air bag is deflated, the upper cavity cover is moved out, and the lower cavity groove is moved to the next procedure.
Compared with the prior art, the electroplating solution leakage-proof carrier and the leakage-proof treatment process thereof have the following advantages:
1. the upper cavity cover and the lower cavity groove are matched with each other to cover, an air bag is arranged at the gap between the upper cavity cover and the lower cavity groove, the air bag can be inflated to extrude the inner wall of the upper shell, the position of the upper shell from the lower shell is fastened, a completely closed space is realized, and waste gas is prevented from leaking to avoid physical injury to experimenters; compared with the traditional electroplating bath, the electroplating solution leakage-proof carrier of the type has the advantages of being movable, controllable, strong in mobility and convenient to build a system, lays a foundation for unmanned factories and intelligent production of the electroplating industry, and reduces damage to human health.
2. On the basis of space sealing, a plurality of air guide holes and liquid guide holes are formed in the top plate and the air suction cover, so that a pipeline can be led out from the outside and penetrates through the air guide holes and the liquid guide holes in the top plate, and then correspondingly penetrates through the air guide holes and the liquid guide holes in the air suction cover, and after the upper cavity cover and the lower cavity groove cover are closed, the internal spaces of the upper cavity cover and the lower cavity groove can be interfered by an external pipeline; for example, the plating solution may be supplied through a drain hole, air discharged from the plating solution may be sucked by an external suction fan, or other neutralizing liquid supply device may be connected, and when the plating reaction is completed, the plating solution may be rinsed by applying a neutralizing liquid thereto, for example, a plating solution that generates cyanide off-gas may be rinsed by adding a sodium hydroxide solution.
The intelligent process operation can be realized through the mode, so that the parts participated by human processes are reduced, the contact chance between a human body and waste gas and electroplating solution is reduced, an unmanned factory is realized, and the side surface avoids the harm of the waste gas and the electroplating solution to the human body.
3. The cross-sectional dimension of the lower shell is larger than that of the inner groove body in any direction, so that when the inner groove body is placed inside the lower shell, the lower shell can completely contain the inner groove body and leave a gap, namely the gap is left between the air bag and the inner wall of the lower shell, and the gap has the functions of providing a space for inflating and expanding the air bag and providing a space for the upper cavity cover to be inserted when the upper cavity cover is covered.
4. The semiconductor refrigerating piece is arranged at the bottom of the inner wall of the lower shell, the bottom surface of the semiconductor refrigerating piece is 10-12 mm away from the ground, so that severe corrosion is prevented, when the inner groove body is placed inside the lower shell, the inner groove body is placed on the semiconductor refrigerating piece, temperature control is carried out on electroplating liquid in the inner groove body, and overheating of the electroplating liquid is prevented.
5. The outer wall of whole interior cell body and the inner wall of last casing are blockked up completely by the gasbag between, go up again through the lid simultaneously between casing and the lower casing close completely sealed, and good leakproofness makes waste gas can only follow the cover of induced drafting and discharges, has improved the clean degree that waste gas was discharged away to the air guide hole on the cover of induced drafting again from the side, and simultaneously, the elasticity of gasbag can make interior cell body can not be because the too big destruction that causes the backing layer that warp, prevents the occurence of failure.
6. Wherein the mounting panel can joint in the top edge of interior casing to make whole electroplating mechanism detachable connect in the inside groove internal, thereby be convenient for experimenter or staff change the electroplating mechanism of different electrode types and work such as washing.
7. Set hollow structure to through the stirring gyro wheel, it has a basin to open on it, when the stirring gyro wheel was rotatory, the plating solution can be followed the basin and poured into the stirring gyro wheel and then poured out, the stirring gyro wheel is clockwise rotatory to the direction of negative pole along the positive pole, during the electroplating, the metal product or the piece of plating of treating to plate are done the negative pole, along with the stirring gyro wheel rolls clockwise, constantly topple over cladding material metal ion to the negative pole place, can accelerate the speed of electroplating, can guarantee the homogeneity of plating solution simultaneously again, prevent the ion from deposiing.
8. In step S2, the plating liquid may be injected first and then the completely sealed space may be formed by the bladder, or the plating liquid may be injected from the liquid guide hole after the completely sealed space is formed. The sequence can be not sequential, and simultaneously, in the electroplating process, the generated reaction gas is extracted to the outside through the air guide holes. The air-guiding hood is externally connected with an exhaust fan through an air guiding hole of the air-guiding hood, and then is blown into the purification tower to be treated through photocatalysis, plasma treatment, high-altitude discharge of a chimney and the like.
In step S3, the plating solution is discharged through the liquid guide hole at the bottom, and an inert gas, preferably dry nitrogen, is fed into the space from top to bottom, so as to extrude and evacuate the waste gas until the plating solution is completely discharged, and then the inert gas is pumped out to change the space into a vacuum state for a preset time, so as to further remove the gas residue and completely purify the space.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit of the present invention are intended to be included within the scope of the present invention.
[ description of the drawings ]
FIG. 1 is a schematic perspective view of a carrier for preventing plating solution from leaking according to a first embodiment of the present invention.
FIG. 2 is a schematic view showing the internal structure of the carrier for preventing plating solution from leaking according to the first and second embodiments of the present invention.
FIG. 3 is a schematic view showing a moving mechanism of a plating liquid leakage preventing carrier according to a third embodiment of the present invention.
FIG. 4 is a schematic view of a film supply mechanism in a plating solution leakage prevention carrier according to a third embodiment of the present invention.
FIG. 5 is a schematic view showing the structure of a protective film in a plating solution leakage prevention carrier according to a third embodiment of the present invention.
FIG. 6 is a schematic view showing the structure of a plating solution leakage preventing carrier according to the third embodiment of the present invention, in which a protective film is placed on a film supply mechanism.
FIG. 7 is a schematic structural view showing another mounting state of the plating solution leakage preventing carrier according to the third embodiment of the present invention, in which the protection film is mounted on the film supply mechanism.
FIG. 8 is a schematic structural view showing another mounting state of a protective film in the plating liquid leakage preventing carrier according to the third embodiment of the present invention.
FIG. 9 is a schematic view of a part of a plating solution leakage preventing carrier according to a third embodiment of the present invention.
FIG. 10 is a schematic view of a third embodiment of the present invention showing a mold pick-up member of a plating solution leakage prevention carrier being inserted into a film storage chamber.
FIG. 11 is a schematic view showing the separation of the passivation layer and the encapsulation layer in the plating liquid leakage prevention carrier according to the third embodiment of the present invention.
FIG. 12 is a schematic view showing the structure of a cleaning pack frame and a slide groove in a plating liquid leakage preventing carrier according to a fourth embodiment of the present invention.
FIG. 13 is a schematic view showing a part of the structure of a cleaning bag holder in a plating solution leakage preventing carrier according to a fourth embodiment of the present invention.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 and fig. 2, a plating solution leakage prevention carrier 100 according to the present invention is mainly suitable for providing a closed reaction space for a plating solution, i.e. preventing waste gas generated by plating from leaking to harm users, and examples thereof include: acid waste gas produced by acid washing, chromium fog produced in a chromium plating process, chemical degreasing, strong alkaline electroplating and cyaniding electroplating produce alkaline waste gas, so that the problems that whether the concentration of the waste gas reaches the standard or not in the existing workshop is monitored in real time, time and labor are wasted, harm to a human body is reduced to a great extent, and therefore intelligent production of power-assisted industry and good environmental quality control during casting electroplating are achieved.
The first embodiment is as follows:
the first embodiment of the present invention mainly provides the carrier for preventing the electroplating solution from leaking, the mechanism included therein, and the position relationship and functions thereof:
the electroplating solution leakage-proof carrier 100 comprises an upper cavity cover 1 and a lower cavity groove 3, wherein the upper cavity cover 1 and the lower cavity groove 3 can be covered to form a space, an electroplating mechanism 2 is arranged in the space, a controller (not shown) is further arranged on the electroplating solution leakage-proof carrier, the controller can be an industrial personal computer or a PLC (programmable logic controller), the controller can be debugged through an external upper computer, all mechanical actions explained below the electroplating solution leakage-proof carrier are executed through the controller, and the controller belongs to common technical characteristics of people in the field.
Specifically, the lower chamber 3 is mainly used for carrying electroplating solution, and the upper chamber cover 1 is used for closing the lower chamber 3, so that it can be understood that the electroplating mechanism 2 is placed in the lower chamber 3 to realize the function of plating the workpiece.
Please refer to fig. 2 and fig. 3, wherein the upper chamber cover 1 includes a top plate 11, an upper housing 12 and an air suction cover 12, the air suction cover 12 is embedded in the inner wall of the upper housing 12 and is adapted to the upper housing 12, that is, the size of the air suction cover 12 can just seal the inside of the upper housing 12, the top plate 11 is disposed on the top of the upper chamber cover 1, that is, the side of the upper chamber cover 1 departing from the lower chamber groove 3, a plurality of air vents 40 and liquid vents 50 are disposed on the top plate 11 and the air suction cover 12, so that a pipeline can be led out from the outside, pass through the air vents 40 and the liquid vents 50 on the top plate 11, and then pass through the air vents 40 and the liquid vents 50 of the air suction cover 12, and when the upper chamber cover 1 and the lower chamber groove 3 are covered, the internal spaces of the upper chamber cover 1 and the lower chamber groove 3 can be interfered by an external pipeline; for example, the plating solution may be supplied through the drain hole 50, air discharged from the plating solution may be drawn by an external suction fan, or other supply means for neutralizing liquid may be externally connected, and when the plating reaction is completed, the plating solution may be rinsed by applying the neutralizing liquid thereto, and for example, the plating solution generating cyanide off-gas may be rinsed by adding sodium hydroxide solution.
As can be understood from the above description, when a pipe passes through the air guide hole 40 or the liquid guide hole 50 on the top plate 11 or the suction hood 12, the pipe should not leave a gap with the air guide hole 40 to ensure the sealing performance of the internal space, and a sealing ring needs to be arranged between the pipe and the air guide hole 40 of the top plate 11 to further ensure the sealing performance; the leakage amount of the gas is reduced.
Further, a handle 121 is arranged on the outer wall of the upper shell 12, so that the upper cavity cover 1 can be manually lifted in emergency or special situations;
referring to fig. 2 and 4, the lower chamber 3 includes a lower housing 32 and an inner housing 31, the inner housing 31 is disposed inside the lower housing 32 and is mainly used for carrying electroplating solution or providing a reaction tank for electroplating reaction, the lower housing 32 is used for supporting and protecting the inner housing 31, the inner housing 31 includes an inner housing 311, i.e. the structure for placing electroplating solution, the material of the inner housing is ti-electroplated layer, PP material, PVC material, PVDF material, glass fiber reinforced plastic tank material, stainless steel tank material, granite material, polytetrafluoroethylene material, and other tank materials, the outer wall of the inner housing 311 is provided with an air bag 312, the bottoms of the air bag 312 and the lower housing 32 are also provided with corresponding air vents 40, wherein the air vents 40 on the air bag 312 can inflate or deflate the air bag 312, the bottoms of the inner housing 311 and the lower housing 32 are also provided with liquid vents 50, the drain hole 50 completely conducts the inner casing 311 to drain the plating liquid from the inside of the inner casing 311, thereby functioning to drain the plating liquid.
Referring to fig. 5 and 6 (which are simplified for clarity), in any direction, the cross-sectional dimension of the lower housing 32 is greater than the cross-sectional dimension of the inner slot 31, so that when the inner slot 31 is placed inside the lower housing 32, the lower housing 32 can completely contain the inner slot 31 with a gap of distance d, that is, a gap of distance d is left between the airbag 312 and the inner wall of the lower housing 32, and the gap has the functions of firstly inflating and expanding the airbag 312 and secondly providing a space for the upper cavity cover 1 to be inserted when being covered; the bottom of the inner wall of the lower shell 32 is provided with the semiconductor refrigerating sheet 321, the bottom surface of the semiconductor refrigerating sheet 321 is 10-12 mm away from the ground, so as to prevent serious corrosion, when the inner groove body 31 is placed inside the lower shell 32, the inner groove body 31 is placed on the semiconductor refrigerating sheet 321, so that the temperature of electroplating liquid in the inner groove body 31 is controlled, the phenomenon of overheating of the electroplating liquid is prevented, compared with the prior art that the temperature is reduced by adding a coolant, the thermal inertia of the semiconductor refrigerating sheet is very small, the refrigerating and heating time is very short, under the condition that a cold end is in no load due to good heat dissipation of a hot end, the power is not electrified for one minute, the refrigerating sheet can reach the maximum temperature difference, the semiconductor refrigerating sheet is a current transduction type sheet, the high-precision temperature control can be realized through the control of input current, and the remote control, program control and computer control are easily realized.
The connection mode of the inner groove 31 and the lower groove 32 is not limited, and may be integrally disposed, fixedly connected, or detachably connected, depending on the desired applicable environment, as exemplified by: in some experiments, the plating solution needs to be transferred frequently, the inner tank 31 and the lower tank 32 can be detachably disposed, so that an experimenter can conveniently and directly detach the inner tank 31 integrally for analysis.
Referring to fig. 7, when the upper chamber cover 1 is closed to the lower chamber tank 3, a portion of the upper casing 12 is inserted from the gap between the lower casing 32 and the inner tank 31, i.e., between the airbag 312 and the inner wall of the lower casing 32, thereby completely closing the entire inner tank 31, i.e., forming a closed plating solution carrying space.
Further, after the upper housing 12 is inserted into the gap between the lower housing 32 and the inner housing 31, the upper housing 12 and the lower housing 32 may be configured to form some structure of clamping, such as clamping similar to a latch type, which is input to a common means of those skilled in the art, and the present invention is not described too much.
After the upper case 12 is inserted from the gap between the lower case 32 and the inner case 31, the airbag 312 may be inflated to press the inner wall of the upper case 12, fasten the position of the upper case 12 from the lower case 32, and achieve a completely closed space, prevent the leakage of exhaust gas, so as to prevent the physical injury to the experimenter.
Referring to fig. 8, the plating solution is injected from the solution guide hole 50 on the top plate 11, and the plating solution falls into the inner tank 31 after passing through the air suction hood 12, because the outer wall of the whole inner tank 31 and the inner wall of the upper shell 12 are completely blocked by the air bag 312, and meanwhile, the upper shell 12 and the lower shell 32 are completely sealed by covering, the excellent sealing performance enables the waste gas to be discharged from the air suction hood 12 only, and the cleanness of the waste gas discharged from the air guide hole on the air suction hood 12 is improved from the side, and meanwhile, the elasticity of the air bag 312 enables the inner tank 31 not to be damaged by the lining layer due to too large deformation, thereby preventing accidents.
Referring to fig. 8 and 9, the electroplating mechanism 2 includes an installation plate 21, a driving motor 22, a stirring roller 23 and an electrode 24, the installation plate 21, the driving motor 22, the stirring roller 23 and the electrode 24 are all fixedly connected, wherein the installation plate 21 can be clamped at the top edge of the inner housing 311 (see fig. 4), so that the whole electroplating mechanism 2 can be detachably connected to the inner tank 31, thereby facilitating the experimenter or the worker to replace the electroplating mechanisms with different electrode types and to perform the cleaning operation, and in some embodiments, the electroplating mechanism 2 and the inner tank 31 are fixedly connected, which also belongs to the protection scope covered by the present invention.
After the electroplating solution is input into the inner tank 31, the electroplating mechanism 2 can be soaked, the stirring roller 23 is arranged in the middle of the two electrodes 24, and the driving motor 22 can drive the stirring roller 23 to roll through the shaft and gear combination structure, so that the electroplating solution is uniform, and the uniformity of the plating layer is increased.
Referring to fig. 10, the stirring roller 23 is configured as a hollow structure, a water tank 231 is opened on the stirring roller 23, when the stirring roller 23 rotates, the electroplating solution is poured into the stirring roller 23 from the water tank 231 and then poured out, specifically, the electrode 24 includes an anode and a cathode, and the stirring roller 23 rotates clockwise along the direction from the anode to the cathode, so that it can be understood that, when electroplating, the metal product or the plated part to be plated is used as the cathode, and as the stirring roller 23 rolls clockwise, the metal ions of the plating layer are continuously poured towards the position of the cathode, thereby accelerating the electroplating speed, and simultaneously ensuring the uniformity of the electroplating solution and preventing the ion deposition.
Referring to fig. 10 and 11, at least one liquid guiding hole 50 on the top plate 11 and the air suction hood 13 is externally connected with a plating solution supply device, at least one air guiding hole 40 is externally connected with a nitrogen gas supply device, at least one air guiding hole 40 is externally connected with a vacuum pump, wherein at least one air guiding hole 40 at the bottom of the inner tank body 31 is externally connected with an air pump to inflate and deflate the air bag, and at least one liquid guiding hole 50 is communicated with the inside of the inner tank body 31. And is externally connected with a water suction pump so that the electroplating solution in the inner tank body 31 can be emptied.
Example two:
in order to better solve the above problems, a second embodiment of the present invention provides a leakage-preventing treatment process for the plating solution leakage-preventing carrier; based on the structural characteristics and connection relationship of the electroplating solution leakage-proof carrier described in the first embodiment, the leakage-proof treatment process of the electroplating solution leakage-proof carrier comprises the following steps:
step S1, providing an upper cavity cover and a lower cavity groove, wherein the upper cavity cover and the lower cavity groove can be covered to form a space, and an air bag is provided and arranged at the gap between the upper cavity cover and the lower cavity groove;
step S2, in the working state, the space is taken as an electroplating reaction tank, electroplating solution is input, the air bag is inflated to close the gap between the upper cavity cover and the lower cavity groove, and reaction gas in the space is simultaneously pumped out from the top;
step S3, after the electroplating is finished, discharging the plating solution from the bottom, inputting inert gas into the space from top to bottom, and after the internal space reaches a preset pressure threshold value, extracting the inert gas to change the space into a vacuum state for a preset time; and
and step S4, deflating the air bag, moving the upper cavity cover out, and moving the lower cavity groove to the next procedure.
In step S1, which is a structural feature of the first embodiment, in step S2, the plating solution may be injected first and then the completely sealed space may be formed by the bladder, or the plating solution may be injected from the solution guide hole after the completely sealed space is formed. The sequence can be not sequential, and simultaneously, in the electroplating process, the generated reaction gas is extracted to the outside through the air guide holes. The air is blown into the purification tower through an air guide hole of the air suction cover and is treated through photocatalysis, plasma treatment, high-altitude discharge of a chimney and the like, and the treatment modes belong to common means of the personnel in the industry and are not described too much herein.
In step S3, the plating solution is discharged through the liquid guide hole at the bottom, and an inert gas, preferably dry nitrogen, is fed into the space from top to bottom, so as to extrude and evacuate the waste gas until the plating solution is completely discharged, and then the inert gas is pumped out to change the space into a vacuum state for a preset time, so as to further remove the gas residue and completely purify the space.
Step S4 is a subsequent step, in which after all the gas in the upper chamber cover and the lower chamber tank is completely treated, the gas in the gas bag is released, so that the upper chamber cover and the lower chamber tank are not fastened, the upper chamber cover is removed, and the lower chamber tank originally used for carrying the plating solution is moved to the next process, such as cleaning the lower chamber tank or replacing the lower chamber tank.
It can be understood that, the steps S1-S4 all adopt an industrial personal computer to control operation, so that the intelligent operation of a factory is realized, the intelligent operation system has the advantages of mobility, controllability, strong mobility and convenience in system building, a foundation is laid for unmanned factories and intelligent production in the electroplating industry, and damage to human health is reduced.
In conclusion, the electroplating solution leakage-proof carrier 1 provided by the invention has strong universality, ensures that waste gas is not leaked, and simultaneously has lower production, manufacturing and maintenance costs.
It should also be understood by those skilled in the art that if all or some of the units related to the plating solution leakage prevention carrier of the present invention are combined and replaced by fusing, simple changing, and mutual conversion between serial and parallel connection, such as placement and moving positions of each component, line and unit; or the products formed by the components are integrally arranged; or a detachable design; it is within the scope of the present invention to replace the corresponding components of the present invention with such a circuit arrangement/device/apparatus/system, where the combined components may constitute a circuit arrangement/device/apparatus/system having specific functions.
Compared with the prior art, the electroplating solution leakage-proof carrier and the leakage-proof treatment process thereof have the following advantages:
1. the upper cavity cover and the lower cavity groove are matched with each other to cover, an air bag is arranged at the gap between the upper cavity cover and the lower cavity groove, the air bag can be inflated to extrude the inner wall of the upper shell, the position of the upper shell from the lower shell is fastened, a completely closed space is realized, and waste gas is prevented from leaking to avoid physical injury to experimenters; compared with the traditional electroplating bath, the electroplating solution leakage-proof carrier of the type has the advantages of being movable, controllable, strong in mobility and convenient to build a system, lays a foundation for unmanned factories and intelligent production of the electroplating industry, and reduces damage to human health.
2. On the basis of space sealing, a plurality of air guide holes and liquid guide holes are formed in the top plate and the air suction cover, so that a pipeline can be led out from the outside and penetrates through the air guide holes and the liquid guide holes in the top plate, and then correspondingly penetrates through the air guide holes and the liquid guide holes in the air suction cover, and after the upper cavity cover and the lower cavity groove cover are closed, the internal spaces of the upper cavity cover and the lower cavity groove can be interfered by an external pipeline; for example, the plating solution may be supplied through a drain hole, air discharged from the plating solution may be sucked by an external suction fan, or other neutralizing liquid supply device may be connected, and when the plating reaction is completed, the plating solution may be rinsed by applying a neutralizing liquid thereto, for example, a plating solution that generates cyanide off-gas may be rinsed by adding a sodium hydroxide solution.
The intelligent process operation can be realized through the mode, so that the parts participated by human processes are reduced, the contact chance between a human body and waste gas and electroplating solution is reduced, an unmanned factory is realized, and the side surface avoids the harm of the waste gas and the electroplating solution to the human body.
3. The cross-sectional dimension of the lower shell is larger than that of the inner groove body in any direction, so that when the inner groove body is placed inside the lower shell, the lower shell can completely contain the inner groove body and leave a gap, namely the gap is left between the air bag and the inner wall of the lower shell, and the gap has the functions of providing a space for inflating and expanding the air bag and providing a space for the upper cavity cover to be inserted when the upper cavity cover is covered.
4. The semiconductor refrigerating piece is arranged at the bottom of the inner wall of the lower shell, the bottom surface of the semiconductor refrigerating piece is 10-12 mm away from the ground, so that severe corrosion is prevented, when the inner groove body is placed inside the lower shell, the inner groove body is placed on the semiconductor refrigerating piece, temperature control is carried out on electroplating liquid in the inner groove body, and overheating of the electroplating liquid is prevented.
5. The outer wall of whole interior cell body and the inner wall of last casing are blockked up completely by the gasbag between, go up again through the lid simultaneously between casing and the lower casing close completely sealed, and good leakproofness makes waste gas can only follow the cover of induced drafting and discharges, has improved the clean degree that waste gas was discharged away to the air guide hole on the cover of induced drafting again from the side, and simultaneously, the elasticity of gasbag can make interior cell body can not be because the too big destruction that causes the backing layer that warp, prevents the occurence of failure.
6. Wherein the mounting panel can joint in the top edge of interior casing to make whole electroplating mechanism detachable connect in the inside groove internal, thereby be convenient for experimenter or staff change the electroplating mechanism of different electrode types and work such as washing.
7. Set hollow structure to through the stirring gyro wheel, it has a basin to open on it, when the stirring gyro wheel was rotatory, the plating solution can be followed the basin and poured into the stirring gyro wheel and then poured out, the stirring gyro wheel is clockwise rotatory to the direction of negative pole along the positive pole, during the electroplating, the metal product or the piece of plating of treating to plate are done the negative pole, along with the stirring gyro wheel rolls clockwise, constantly topple over cladding material metal ion to the negative pole place, can accelerate the speed of electroplating, can guarantee the homogeneity of plating solution simultaneously again, prevent the ion from deposiing.
8. In step S2, the plating liquid may be injected first and then the completely sealed space may be formed by the bladder, or the plating liquid may be injected from the liquid guide hole after the completely sealed space is formed. The sequence can be not sequential, and simultaneously, in the electroplating process, the generated reaction gas is extracted to the outside through the air guide holes. The air-guiding hood is externally connected with an exhaust fan through an air guiding hole of the air-guiding hood, so that the air-guiding hood is blown into a purification tower and then is treated through photocatalysis, plasma treatment, high-altitude exhaust of a chimney and the like.
In step S3, the plating solution is discharged through the liquid guide hole at the bottom, and an inert gas, preferably dry nitrogen, is fed into the space from top to bottom, so as to extrude and evacuate the waste gas until the plating solution is completely discharged, and then the inert gas is pumped out to change the space into a vacuum state for a preset time, so as to further remove the gas residue and completely purify the space.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. A carrier for preventing electroplating solution from leaking is used for bearing electroplating solution and playing a role of preventing leakage and is characterized in that, the electroplating liquid leakage-proof carrier comprises an upper cavity cover and a lower cavity groove, the upper cavity cover and the lower cavity groove are matched with each other to cover, an air bag is arranged at the gap between the upper cavity cover and the lower cavity groove, air vents and liquid vents are arranged at the top and the bottom of the electroplating liquid leakage-proof carrier, the top of the electroplating solution leakage-proof carrier is provided with at least one liquid guide hole which is externally connected with electroplating solution supply equipment, at least one air guide hole which is externally connected with nitrogen supply equipment, at least one air guide hole which is externally connected with a vacuum pump, the bottom of the electroplating solution anti-leakage carrier is at least provided with an air guide hole externally connected with an air pump to inflate and deflate the air bag, and the at least one liquid guide hole is communicated with the inside of the lower cavity groove so that the electroplating solution in the lower cavity groove can be emptied.
2. The plating solution leakage prevention carrier as claimed in claim 1, wherein the upper chamber cover comprises a top plate, an upper housing and an air suction cover, the air suction cover is embedded in the inner wall of the upper housing and is matched with the upper housing, the top plate is disposed on a side of the upper chamber cover away from the lower chamber groove, and the top plate and the air suction cover are respectively provided with a corresponding air guide hole and a corresponding liquid guide hole.
3. The plating solution leak-proof carrier as defined in claim 1, wherein the drain hole is externally connected to a neutralizing liquid supply device, and the plating solution is rinsed by applying a neutralizing liquid thereto after the plating reaction is completed.
4. The plating solution leakage prevention carrier as claimed in claim 2, wherein the lower chamber comprises a lower housing and an inner chamber, the inner chamber is disposed inside the lower housing for carrying the plating solution, the airbag is disposed on the outer wall of the inner housing, and the cross-sectional dimension of the lower housing is larger than that of the inner chamber in any direction, so that when the inner chamber is disposed inside the lower housing, the lower housing can completely contain the inner chamber, and a gap is left between the airbag and the inner wall of the lower housing, and when the upper chamber cover covers the lower chamber, the upper chamber cover is inserted into the gap through a part of the upper housing.
5. The plating solution leakage prevention carrier as claimed in claim 4, wherein a semiconductor refrigeration piece is disposed on a bottom side of an inside of the lower housing, a bottom surface of the semiconductor refrigeration piece is 10mm to 12mm from a ground surface, and the inner tank is disposed on the semiconductor refrigeration piece when the inner tank is disposed inside the lower housing.
6. The electroplating solution leakage prevention carrier as claimed in claim 4, further comprising an electroplating mechanism detachably connected inside the inner tank body, wherein the electroplating mechanism comprises a mounting plate, a driving motor, a stirring roller and an electrode, and the mounting plate, the driving motor, the stirring roller and the electrode are all fixedly connected.
7. The plating solution leakage prevention carrier as claimed in claim 6, wherein the stirring roller is formed in a hollow structure and has a water tank formed thereon, the plating solution is poured into the inside of the stirring roller from the water tank and then poured out when the stirring roller rotates, the electrode includes an anode and a cathode, and the stirring roller rotates clockwise in an anode-to-cathode direction.
8. An anti-leakage treatment process of an electroplating solution anti-leakage carrier is characterized by comprising the following steps:
step S1, providing an upper cavity cover and a lower cavity groove, wherein the upper cavity cover and the lower cavity groove can be covered to form a space, and an air bag is provided and arranged at the gap between the upper cavity cover and the lower cavity groove;
step S2, in the working state, the space is taken as an electroplating reaction tank, electroplating solution is injected into the electroplating reaction tank, the air bag is inflated to close the gap between the upper cavity cover and the lower cavity groove, and reaction gas in the space is simultaneously pumped out from the top; and
and step S3, after the electroplating is finished, discharging the plating solution from the bottom, inputting inert gas into the space from top to bottom, and after the internal space reaches a preset pressure threshold value, extracting the inert gas to change the space into a vacuum state for a preset time.
9. A leak prevention process for an electroplating solution leak prevention carrier as recited in claim 8, further comprising step S4;
step S4: the air bag is deflated, the upper cavity cover is moved out, and the lower cavity groove is moved to the next procedure.
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| CN117568907A (en) * | 2023-11-10 | 2024-02-20 | 天水华洋电子科技股份有限公司 | Novel electroplating process of nickel-palladium-gold lead frame |
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| CN210736942U (en) * | 2019-10-30 | 2020-06-12 | 苏州吉岛电极科技有限公司 | Electroplating device for titanium anode |
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