CN212962714U

CN212962714U - Nitrogen heating wafer drying tank

Info

Publication number: CN212962714U
Application number: CN202021624929.9U
Authority: CN
Inventors: 杨仕品
Original assignee: Zhicheng Semiconductor Equipment Technology Kunshan Co Ltd
Current assignee: Suzhou Zhicheng Semiconductor Technology Co ltd
Priority date: 2020-08-07
Filing date: 2020-08-07
Publication date: 2021-04-13
Anticipated expiration: 2030-08-07

Abstract

The utility model provides a nitrogen heating wafer drying tank, which comprises a box body, wherein a drying barrel is arranged in the box body, the lower part of the drying barrel is communicated with a nitrogen heating device, the bottom of the drying barrel is provided with a rotating device, the output end of the rotating device passes through the drying barrel and is connected with a wafer boat support assembly, and the drying barrel is provided with a sealing cover; the wafer boat support assembly comprises a support panel, wherein a hollow groove is formed in the support panel, a fixing portion is arranged at the center of the hollow groove, a first limit edge and a second limit edge are arranged on two sides of the hollow groove in a stepped mode, drain holes are formed in the end portions of the first limit edge and the second limit edge respectively, the nitrogen heating device is arranged in a machine case, the integrated structure of drying equipment is guaranteed, the wafer boat support assembly is convenient to carry, and a rotating device is arranged to drive a wafer to rotate continuously in the drying process, so that water on the surface of the wafer boat support assembly is dried, and the drying efficiency is improved.

Description

Nitrogen heating wafer drying tank

Technical Field

The utility model relates to a wafer cleaning equipment field especially relates to nitrogen gas heating wafer drying bath.

Background

Wafer cleaning and drying are indispensable process requirements in semiconductor device production. The drying method commonly adopted in the industry at present is to heat nitrogen and then use the heated nitrogen to dry wafers. The technical scheme adopted for heating the nitrogen gas is as follows: introducing nitrogen into a hollow tube with one end provided with a heating device and the other end blocked by a blank cap; the nitrogen input port is arranged at one end of the hollow pipe close to the fixed heating device; one end close to the blank cap is provided with a mounting hole for mounting a nozzle; for example, the patent publication number is: CN 208091183U's utility model discloses a nitrogen gas stoving module for after wafer wet process washs is through the nitrogen gas heating device at equipment external connection barrel-shaped to equipment is inside sprays high temperature nitrogen gas in order to realize the drying, and only is slower to the drying effect of wafer lower surface through spraying nitrogen gas, makes whole drying time extension, and is inefficient.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a nitrogen heating wafer drying tank, which comprises a box body, wherein a drying barrel is arranged in the box body, the lower part of the drying barrel is communicated with a nitrogen heating device, the bottom of the drying barrel is provided with a rotating device, the output end of the rotating device passes through the drying barrel and is connected with a wafer boat support assembly, and the drying barrel is provided with a sealing cover; the wafer boat support component comprises a support panel, wherein a hollow groove is formed in the support panel, a fixing part is arranged in the center of the hollow groove, a first limit edge and a second limit edge are arranged on two sides of the hollow groove in a stepped mode, and drain holes are formed in the end portions of the first limit edge and the second limit edge respectively.

Preferably, the rotating device comprises a motor, the output end of the motor is connected with a rotating shaft, and the rotating shaft is connected with the fixing part.

Preferably, the drying barrel comprises an outer barrel and an inner barrel, positioning rings are arranged at the top and the bottom of the outer barrel, the inner barrel is positioned between the positioning rings, a support is arranged on the side wall of the outer barrel, and the support is connected with the box body; the bottom of the inner barrel is provided with an air inlet end and an air outlet end.

Preferably, nitrogen gas heating device is including being fixed in the mount of "concave" font on the box base, be equipped with nitrogen gas heating device on the mount, nitrogen gas heating device includes protective housing, be equipped with the location plate body in the protective housing, be equipped with continuous S-shaped air guide groove between the location plate body, be equipped with air inlet and gas outlet on the location plate body that air guide groove both ends correspond, the gas outlet is connected with the air duct, the air duct with the inlet end is connected.

Preferably, the locating plate body is internally embedded with a heating rod, and the heating rod extends to the end part of the protective shell.

Preferably, the positioning plate body is not in contact with the side wall of the protective shell.

The utility model provides a nitrogen gas heating wafer drying bath has following beneficial effect: this device is through establishing in the quick-witted incasement with nitrogen gas heating device, has guaranteed drying equipment's integral structure, the transport of being convenient for to set up rotating device and can drive the wafer and constantly rotate in drying process, spin-dry the water on surface, improve drying efficiency.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below.

Fig. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of the internal three-dimensional structure of the present invention;

fig. 3 is a schematic view of the drying tub of the present invention;

fig. 4 is a schematic view of a rotating device of the present invention;

FIG. 5 is an internal schematic view of the nitrogen gas heating apparatus of the present invention;

wherein, 1, a box body; 2. drying the barrel; 3. a nitrogen heating device; 4. a rotating device; 5. a sealing cover; 6. A support panel; 7. hollowing out the grooves; 8. a fixed part; 9. a first limit edge; 10. a second limit edge; 11. a drain hole; 12. an outer tub; 13. an inner barrel; 14. a positioning ring; 15. a support; 16. an air inlet end; 17. an air outlet end; 18. a fixed mount; 19. a protective housing; 20. positioning the plate body; 21. an S-shaped air guide groove; 22. an air outlet; 23. An air inlet; 24. a heating rod; 25. an air duct.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

As shown in fig. 1, the utility model provides a nitrogen heating wafer drying tank, which comprises a tank body 1, wherein a drying barrel 2 is arranged in the tank body 1, as shown in fig. 3, the drying barrel 2 comprises an outer barrel 12 and an inner barrel 13, positioning rings 14 are arranged at the top and the bottom of the outer barrel 12, the inner barrel 13 is positioned between the positioning rings 14, a support 15 is arranged on the side wall of the outer barrel 12, and the support 15 is connected with the tank body 1; the bottom of the inner barrel 13 is provided with an air inlet end 16 and an air outlet end 17, the support 15 is fixed on the outer barrel 12 through screws, and the structure of the inner barrel 12 is arranged, so that the sealing performance of the inner barrel 13 is ensured, and the inner wall of the support 15 is prevented from being damaged during installation.

The lower part of the drying barrel 2 is communicated with a nitrogen heating device 3, the bottom of the drying barrel 2 is provided with a rotating device 4, as shown in fig. 4, the output end of the rotating device 4 penetrates through the drying barrel 2 and is connected with a boat support component, the rotating device 4 comprises a motor, the output end of the motor is connected with a rotating shaft, the rotating shaft is connected with the fixed part 8, the boat support component comprises a supporting panel 6, the supporting panel 6 is provided with a hollow groove 7, the center of the hollow groove 7 is provided with the fixed part 8, the two sides of the hollow groove 7 are arranged with a first limit edge 9 and a second limit edge 10 in a stepped manner, the end parts of the first limit edge 9 and the second limit edge 10 are respectively provided with a drain hole 11, the first limit edge 9 and the second limit edge 10 which are arranged in a stepped manner can be used for placing boats with different sizes, a plurality of wafers are placed on the boat, the water of the wafer can be thrown out, meanwhile, in order to prevent the thrown water from being gathered in the corners of the end parts of the first limit edge 9 and the second limit edge 10 to cause secondary pollution to the wafer, the water discharging hole 11 is arranged at the position, and the water can fall into the drying barrel 2 at the lower part and is slowly evaporated by high temperature.

Be equipped with sealed lid 5 on drying barrel 2, sealed lid 5's effect can seal drying barrel 2, prevents that nitrogen gas from leaking, and during operation, in nitrogen gas from the air duct 25 letting in interior bucket 13 of nitrogen gas through the heating of nitrogen gas heating device 3, the dryness fraction on wafer surface can be controlled to the nitrogen gas of high temperature. In addition, as shown in fig. 5, the nitrogen heating device 3 of the device is arranged in a plate-shaped structure and a cabinet, so that the whole device structure is more compact, the nitrogen heating device 3 includes a concave-shaped fixing frame 18 fixed on a base of the box body 1, the fixing frame 18 can ensure that the nitrogen heating device 3 is vertically arranged, the nitrogen heating device 3 is arranged on the fixing frame 18, the nitrogen heating device 3 includes a protective shell 19, a positioning plate body 20 is arranged in the protective shell 19, a continuous S-shaped air guide groove 21 is arranged between the positioning plate bodies 20, half of the S-shaped air guide groove 21 is arranged between the two positioning plate bodies 20, the two positioning plate bodies 20 are combined and locked by screws, so that the whole S-shaped air guide groove 21 is realized, the positioning plate bodies 20 corresponding to two ends of the air guide groove are provided with an air inlet 23 and an air outlet 22, the gas outlet 22 is connected with the air duct 25, the air duct 25 with the inlet end 16 is connected, and the positioning plate body is embedded to have a heating rod 24, heating rod 24 stretch in 19 tip of protecting sheathing, after 24 ohmic heating of heating rod, heat positioning plate body 20 through the heat transfer to with nitrogen gas temperature rising, and directly set up the mode of S-shaped air guide groove 21 on the plate body, improved heat conduction efficiency greatly, it is effectual to heat, and on too much transmission to protecting sheathing 19 of heat in order to prevent positioning plate body 20, positioning plate body 20 with 19 lateral walls of protecting sheathing contactless stretch out on protecting sheathing 19 through heating rod 24, realize setting up positioning plate body 20 in protecting sheathing 19' S central point, and originally dry efficiently, and compact structure.

Various modifications to the embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A nitrogen heating wafer drying groove is characterized by comprising a box body, wherein a drying barrel is arranged in the box body, the lower part of the drying barrel is communicated with a nitrogen heating device, the bottom of the drying barrel is provided with a rotating device, the output end of the rotating device penetrates through the drying barrel and is connected with a wafer boat support assembly, and a sealing cover is arranged on the drying barrel; the wafer boat support component comprises a support panel, wherein a hollow groove is formed in the support panel, a fixing part is arranged in the center of the hollow groove, a first limit edge and a second limit edge are arranged on two sides of the hollow groove in a stepped mode, and drain holes are formed in the end portions of the first limit edge and the second limit edge respectively.

2. The nitrogen-heated wafer drying tank of claim 1, wherein the rotating device comprises a motor, an output end of the motor is connected with a rotating shaft, and the rotating shaft is connected with the fixing part.

3. The nitrogen-heated wafer drying tank as claimed in claim 1, wherein the drying tank comprises an outer tank and an inner tank, positioning rings are arranged at the top and the bottom of the outer tank, the inner tank is located between the positioning rings, a support is arranged on the side wall of the outer tank, and the support is connected with the box body; the bottom of the inner barrel is provided with an air inlet end and an air outlet end.

4. The nitrogen-heated wafer drying tank of claim 3, wherein the nitrogen heating device comprises a concave-shaped fixing frame fixed on the base of the tank body, the fixing frame is provided with the nitrogen heating device, the nitrogen heating device comprises a protective shell, positioning plate bodies are arranged in the protective shell, a continuous S-shaped air guide groove is arranged between the positioning plate bodies, the positioning plate bodies corresponding to two ends of the air guide groove are provided with an air inlet and an air outlet, the air outlet is connected with an air guide tube, and the air guide tube is connected with the air inlet.

5. The nitrogen-heated wafer drying tank of claim 4, wherein a heating rod is embedded in the positioning plate body and extends to the end of the protective shell.

6. The nitrogen-heated wafer drying tank of claim 4, wherein the positioning plate body is not in contact with the protective enclosure sidewall.