CN217426669U

CN217426669U - Chip module plasma cleaning device with high excellent rate

Info

Publication number: CN217426669U
Application number: CN202220568024.7U
Authority: CN
Inventors: 任飞
Original assignee: Zhejiang Jiachen Semiconductor Co ltd
Current assignee: Zhejiang Jiachen Semiconductor Co ltd
Priority date: 2022-03-15
Filing date: 2022-03-15
Publication date: 2022-09-13
Anticipated expiration: 2032-03-15

Abstract

The utility model discloses a chip module plasma cleaning device with high excellent rate, which comprises a box body, a cleaning chamber is arranged in the box body, a placing rack is arranged in the cleaning chamber, a module frame is arranged on the placing rack, a plurality of through holes are arranged on the side wall and the bottom of the module frame, a closed box is arranged at the upper end of the box body, a plasma generator is arranged in the closed box, an air source tank is arranged outside the box body, the air source tank is connected with the plasma generator through an air supply pipe, a first air pump is arranged on the air supply pipe, a plurality of plasma emission ports are arranged at the upper end of the cleaning chamber, the plasma emission ports are all communicated with the closed box, an air vent communicated with the cleaning chamber is arranged at one side of the box body, a second air pump is arranged at the air vent, a substrate is inserted into the module frame and placed in the cleaning chamber, plasma generated by the plasma generator is sprayed into the cleaning chamber from the plasma emission ports to clean the chip module on the substrate, because the plasma is dry, secondary pollution can not be caused, and the excellent rate of the chip module can be improved.

Description

Chip module plasma cleaning device with high excellent rate

Technical Field

The utility model relates to a semiconductor equipment technical field, concretely relates to chip module plasma cleaning device of high excellent rate.

Background

In SIP system level packaging, constitute a complete system chip module that can accomplish a function on the base plate with the chip level of different functions or overlap welding usually, the welding has a plurality of chip modules on a base plate usually, need wash the chip module of welding on the base plate in process of production, usually through ultrasonic cleaning in traditional technology, but ultrasonic cleaning has some drawbacks, because some solvents need to be added to ultrasonic cleaning, consequently cause secondary pollution to the chip module easily, the yields of chip module has been reduced.

Disclosure of Invention

In order to solve the shortcomings in the prior art, the utility model provides a chip module plasma cleaning device with high excellent rate.

In order to realize the technical effect, the utility model discloses a following scheme:

a chip module plasma cleaning device with high excellent rate comprises a box body, wherein a cleaning chamber is arranged in the box body, the front side of the box body is provided with an inlet and an outlet corresponding to the cleaning chamber, a box door is correspondingly arranged at the inlet and the outlet, a placing frame is arranged in the cleaning chamber, a module frame can be detachably placed on the placing frame, the upper end of the module frame is opened and extends downwards to form a placing groove, a plurality of vertically arranged clamping grooves are respectively arranged on the inner walls of two sides corresponding to the placing groove, the clamping grooves on the inner walls of the two sides are in one-to-one correspondence, a plurality of through holes are respectively formed in the side wall and the bottom of the module frame, a closed box is installed at the upper end of the box body, a plasma generator is arranged in the closed box, a gas source tank is arranged outside the box body and is connected with the plasma generator through a gas supply pipe, a first gas pump is arranged on the gas supply pipe, a plurality of plasma emission ports are arranged at the upper end of the cleaning chamber, the plurality of plasma emission ports are communicated with the closed box, an air outlet communicated with the cleaning chamber is formed in one side of the box body, and a second air pump is arranged at the air outlet.

According to the preferable technical scheme, the fan-heating plate is installed on the side wall of the closed box body, the heat dissipation plate is connected with a plurality of heat conduction rods extending into the closed box body, and the heat dissipation plate is provided with heat dissipation fins.

According to the technical scheme, the heat dissipation box is arranged on the side wall of the closed box body, the heat dissipation plate is located in the heat dissipation box, through holes are formed in the upper end and the lower end of the heat dissipation box, and the heat dissipation fan is installed in the through holes in the upper end of the heat dissipation box.

According to the preferred technical scheme, the placing frame is fixedly arranged on the rotary table, the bottom of the box body is provided with the rotating motor, an output shaft of the rotating motor extends into the cleaning chamber upwards, and the upper end of the output shaft is fixedly connected with the rotating center of the rotary table.

According to the technical scheme, the lower end of the rotary table is provided with the supporting structure, the supporting structure comprises a circular ring, the circular ring is fixedly arranged at the lower end of the rotary table, the center of the circular ring is overlapped with the rotating center of the rotary table, and a plurality of universal wheels are arranged at the lower end of the circular ring along the circular ring.

Compared with the prior art, beneficial effect does:

the utility model discloses simple structure, convenient to use inserts the base plate and places in the purge chamber in the module frame, and it washs to the chip module on the base plate in the purge chamber to spout from the plasma transmission mouth through plasma generator production plasma, because plasma is dry, can not cause secondary pollution, can improve the goodness rate of chip module, need not pass through drying process again moreover, has saved technology, has improved production efficiency.

Drawings

FIG. 1 is a schematic cross-sectional view of the present invention;

fig. 2 is a schematic diagram of the structure of the middle placement frame of the present invention.

Reference numerals are as follows: 1. a box body; 2. a cleaning chamber; 3. placing a rack; 4. a module frame; 5. a placement groove; 6. a card slot; 7. a through hole; 8. a closed box; 9. a plasma generator; 10. a gas source tank; 11. a first air pump; 12. a plasma emission port; 13. an exhaust port; 14. a second air pump; 15. a heat dissipation plate; 16. a heat conducting rod; 17. a heat dissipating fin; 18. a heat dissipation box; 19. a heat radiation fan; 20. a rotating electric machine; 21. a circular ring; 22. a universal wheel.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

A chip module plasma cleaning device with high excellent rate comprises a box body 1, wherein a cleaning chamber 2 is arranged in the box body 1, the front side of the box body 1 is provided with an entrance and an exit corresponding to the cleaning chamber 2, the entrance and the exit are correspondingly provided with a box door, a placing frame 3 is arranged in the cleaning chamber 2, a module frame 4 can be detachably placed on the placing frame 3, the placing frame 3 is provided with a plurality of grooves, the bottom of the module frame 4 is inserted into the grooves for placing, the upper end of the module frame 4 is opened and extends downwards to form a placing groove 5, a plurality of vertically arranged clamping grooves 6 are respectively arranged on the inner walls at two sides corresponding to the placing groove 5, the clamping grooves 6 on the inner walls at two sides are in one-to-one correspondence, a substrate is inserted into the vertically arranged placing groove 5, two side edges of the substrate are respectively inserted into the corresponding clamping grooves 6, a plurality of through holes 7 are respectively arranged on the side wall and the bottom of the module frame 4, a closed box 8 is arranged at the upper end of the box body 1, be equipped with plasma generator 9 in the seal box 8, box 1 is equipped with air supply tank 10 outward, air supply tank 10 passes through the air feed pipe with plasma generator 9 and is connected, be equipped with first air pump 11 on the air feed pipe, carry the air supply to plasma generator 9 through first air pump 11, the upper end of purge chamber 2 is equipped with a plurality of plasma emission mouth 12, and a plurality of plasma emission mouth 12 all communicate with seal box 8, one side of box 1 is equipped with the gas vent 13 with purge chamber 2 intercommunication, gas vent 13 is equipped with second air pump 14.

The substrate is inserted into the module frame 4 and placed in the cleaning chamber 2, the air in the cleaning chamber 2 is exhausted by the second air pump 14 to form vacuum, the first air pump 11 pumps an air source to the plasma generator 9 to generate plasma, and then the plasma is ejected into the cleaning chamber 2 through the plasma emitting port 12 to be cleaned.

According to the preferable technical scheme, the fan-heating plate is installed on the side wall of the closed box 8 body 1, the heat dissipation plate 15 is connected with a plurality of heat conduction rods 16 extending into the closed box 8 body 1, the heat dissipation plate 15 is provided with heat dissipation fins 17, the plasma generator 9 can generate a large amount of heat during working, the heat is conducted to the heat dissipation plate 15 through the heat conduction rod, and the heat is dissipated through the heat dissipation fins 17.

According to the technical scheme, the heat dissipation box 18 is arranged on the side wall of the 8 closed box body 1, the heat dissipation plate 15 is located in the heat dissipation box 18, through holes are formed in the upper end and the lower end of the heat dissipation box 18, the heat dissipation fan 19 is installed in the through holes in the upper end of the heat dissipation box 18, air circulation is accelerated through the heat dissipation fan 19, and heat dissipation efficiency is improved.

The preferred technical scheme, rack 3 is fixed to be set up on the carousel, the bottom of box 1 is equipped with rotating electrical machines 20, rotating electrical machines 20's output shaft stretches into in purge chamber 2 up, the upper end of output shaft and the center of rotation fixed connection of carousel, the carousel rotates to make the washing more even.

The preferred technical scheme, the lower extreme of carousel is equipped with bearing structure, bearing structure includes ring 21, the fixed lower extreme of locating the carousel of ring 21, the center of ring 21 overlaps with the rotation center of carousel, a plurality of universal wheels 22 are installed along ring 21 to the lower extreme of ring 21, and universal wheel 22 supports the bottom at purge chamber 2.

In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. indicate the directions or positional relationships based on the directions or positional relationships shown in the drawings, or the directions or positional relationships that the products of the present invention are usually placed when in use, or the directions or positional relationships that those skilled in the art usually understand, and are only for the convenience of describing the present invention and simplifying the description, but not for indicating or implying that the device or element that is referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.

Claims

1. A chip module plasma cleaning device with high excellent rate is characterized by comprising a box body, wherein a cleaning chamber is arranged in the box body, the front side of the box body is provided with an inlet and an outlet corresponding to the cleaning chamber, a box door is correspondingly arranged at the inlet and the outlet, a placing frame is arranged in the cleaning chamber, a module frame is detachably placed on the placing frame, the upper end of the module frame is opened and extends downwards to form a placing groove, a plurality of vertically arranged clamping grooves are respectively arranged on the inner walls at two sides corresponding to the placing groove, the clamping grooves on the inner walls at the two sides are in one-to-one correspondence, a plurality of through holes are respectively formed in the side wall and the bottom of the module frame, a closed box is installed at the upper end of the box body, a plasma generator is arranged in the closed box, an air source tank is arranged outside the box body, the air source tank is connected with the plasma generator through an air supply pipe, a first air pump is arranged on the air supply pipe, a plurality of plasma emission ports are arranged at the upper end of the cleaning chamber, the plurality of plasma emission ports are communicated with the closed box, an air outlet communicated with the cleaning chamber is formed in one side of the box body, and a second air pump is arranged at the air outlet.

2. The high yield plasma cleaning apparatus for chip modules according to claim 1, wherein the side wall of the closed box is provided with a heat dissipating plate, the heat dissipating plate is connected with a plurality of heat conducting rods extending into the closed box, and the heat dissipating plate is provided with heat dissipating fins.

3. The plasma cleaning apparatus for chip modules according to claim 2, wherein a heat dissipation box is disposed on the sidewall of the chamber body, the heat dissipation plate is disposed in the heat dissipation box, the heat dissipation box has through holes at the upper and lower ends, and a heat dissipation fan is disposed in the through hole at the upper end of the heat dissipation box.

4. The high yield rate chip module plasma cleaning apparatus according to claim 1, wherein the placing frame is fixedly disposed on the turntable, a rotating motor is disposed at the bottom of the box, an output shaft of the rotating motor extends upward into the cleaning chamber, and an upper end of the output shaft is fixedly connected to a rotation center of the turntable.

5. The high yield rate chip module plasma cleaning apparatus according to claim 4, wherein the lower end of the turntable is provided with a support structure, the support structure comprises a ring, the ring is fixedly arranged at the lower end of the turntable, the center of the ring is overlapped with the rotation center of the turntable, and the lower end of the ring is provided with a plurality of universal wheels along the ring.