CN211872138U - Electroplating device for uniformly stirring electroplating solution and electroplating bath with same - Google Patents
Electroplating device for uniformly stirring electroplating solution and electroplating bath with same Download PDFInfo
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- CN211872138U CN211872138U CN202020060062.2U CN202020060062U CN211872138U CN 211872138 U CN211872138 U CN 211872138U CN 202020060062 U CN202020060062 U CN 202020060062U CN 211872138 U CN211872138 U CN 211872138U
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- stirring
- electroplating
- plating
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- carousel
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Abstract
The utility model relates to an electroplate the field, in particular to electroplating device of even stirring of plating solution, including rotatory second rabbling mechanism of a vertical horizontal plane direction, the rotatory first rabbling mechanism of a horizontal plane direction and electroplate the mechanism, it includes positive pole and negative pole to electroplate the mechanism, second rabbling mechanism set up in the positive pole with between the negative pole, first rabbling mechanism including can center on the positive pole with the rotatory stirring piece in negative pole center, the stirring piece set up in the positive pole with the negative pole deviates from one side of rabbling mechanism.
Description
Technical Field
The utility model relates to an electroplate the field, in particular to electroplating device and have device's plating bath of even stirring of plating solution.
Background
The stirring of the electroplating solution is a key factor influencing the quality of the coating, and the thickness of the coating is the important factor in the quality of the coating; the existing stirring structure neglects the following two problems: firstly because metal ion's in the plating solution precipitation, the metal ion concentration of plating solution bottom is far greater than the concentration on upper strata, lead to being plated the cladding material thickness of work piece by the thickening from the top to the bottom, secondly the stirring often can only adopt single orderly mode among the prior art, for example adopt clockwise rotation, ordered clockwise movement is all done to ion in the plating solution so, the cladding material thickness of the one side of plating solution direction of motion is openly met to the work piece of plating this moment, will be greater than its cladding material thickness that deviates from the one side of plating solution direction of motion, synthesize the aforesaid, the equal urgent need of current stirring structure and mode is improved.
SUMMERY OF THE UTILITY MODEL
In order to overcome the problems, the utility model provides an electroplating device with evenly stirred electroplating solution and an electroplating bath with the same.
The utility model discloses a solve above-mentioned technical problem, provide as follows with technical scheme: the electroplating device comprises a second stirring mechanism rotating in the direction vertical to the horizontal plane, a first stirring mechanism rotating in the direction horizontal to the horizontal plane and an electroplating mechanism, wherein the electroplating mechanism comprises an anode and a cathode, the second stirring mechanism is arranged between the anode and the cathode, the first stirring mechanism comprises a stirring sheet capable of rotating around the center of the anode and the center of the cathode, and the stirring sheet is arranged on one side of the anode and one side of the cathode, which is deviated from the stirring mechanism.
Preferably, the second rabbling mechanism includes two mounting panels of erectting the setting, bottom between the mounting panel is provided with rotatable stirring gyro wheel, and the top in the outside of mounting panel is provided with second driving motor, second driving motor be connected with run through the mounting panel and with mounting panel rotatable coupling's axis of rotation, drive gear has been inlayed in the axis of rotation, and the drive gear meshing is in on the stirring gyro wheel.
Preferably, the stirring roller is of a hollow structure, and at least one opening is formed in the stirring roller.
Preferably, first rabbling mechanism includes a driving motor, and a driving motor is connected with the carousel that a level set up, and a driving motor connects in the center department of carousel and can drive the carousel rotation, and the carousel deviates from a driving motor's one side and stretches out there are two at least perpendicular to the vertical axis of carousel, the vertical axis centers on carousel central symmetry, the stirring piece sets up on the vertical axis.
Preferably, the number of the stirring sheets is at least two, the stirring sheets are arranged on the vertical shaft at intervals, the stirring sheets are arranged in a manner of inclining to the horizontal plane, and the inclination angle is 40-60 degrees.
Preferably, the spacing distances decrease in sequence in a direction away from the turntable.
Preferably, the areas increase in sequence in a direction away from the turntable.
Preferably, the center line of the turntable is located on the center line of the anode and the cathode.
In order to better solve the above problems, the present invention further provides a plating bath, which comprises the plating device for uniformly stirring the plating solution.
Compared with the prior art, the utility model provides an electroplating device of even stirring of plating solution has following advantage: the problem that the thickness of the electroplated layer of the workpiece is uneven because only a single ordered mode can be adopted in the previous stirring is solved.
Drawings
FIG. 1 is a schematic view showing the overall structure of an electroplating apparatus according to a first embodiment of the present invention, in which an electroplating solution is uniformly stirred.
FIG. 2 is a schematic view showing the structure of an electroplating mechanism in an electroplating apparatus according to a first embodiment of the present invention, in which the plating solution is uniformly stirred.
FIG. 3 is a schematic view showing the structure of a second stirring mechanism in the electroplating apparatus according to the first embodiment of the present invention for uniformly stirring the plating solution.
FIG. 4 is a schematic view showing a part of a structure of an electroplating apparatus according to a first embodiment of the present invention in which an electroplating solution is uniformly stirred.
FIG. 5 is a schematic view showing a simplified structure of an electroplating apparatus according to a first embodiment of the present invention for illustrating the principle of uniform stirring of a plating solution.
FIG. 6 is a schematic view showing the structure of a first stirring mechanism of an electroplating apparatus according to a first embodiment of the present invention for uniformly stirring an electroplating solution.
FIG. 7 is another schematic view showing the structure of a first stirring mechanism of an electroplating apparatus according to a first embodiment of the present invention for uniformly stirring an electroplating solution.
FIG. 8 is a schematic view of another perspective of the electroplating apparatus according to the first embodiment of the present invention for uniformly stirring the plating solution.
Description of reference numerals:
100. an electroplating device for uniformly stirring electroplating solution; 10. a first stirring mechanism; 101. a first drive motor; 102. a turntable; 103. a vertical axis; 104. a stirring sheet; 20. a second stirring mechanism; 201. mounting a plate; 202. a second drive motor; 203. a drive shaft; 204. a transmission gear; 205. stirring rollers; 2051. an opening; 30. an electroplating mechanism; 301. an anode; 302. and a cathode.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, the present invention provides an electroplating apparatus 100 for uniformly stirring electroplating solution, wherein the electroplating apparatus 100 is to be placed in the electroplating solution of an electroplating bath, and is mainly used for placing a workpiece in the electroplating solution and conducting current on the workpiece, so as to form a metal layer on the surface of the workpiece, thereby protecting the surface of the workpiece; meanwhile, the electroplating device 100 provided by the utility model mainly aims to solve the problem that the electroplating solution caused by uneven stirring has poor concentration, thereby resulting in uneven thickness of the electroplated layer.
The electroplating device 100 comprises a first stirring mechanism 10, a second stirring mechanism 20 and an electroplating mechanism 30, wherein the electroplating mechanism 30 is mainly used for electroplating workpieces, the first stirring mechanism 10 and the second stirring mechanism 20 are mainly used for stirring solutions, the connection relationship between the first stirring mechanism 10 and the second stirring mechanism 20 and the electroplating mechanism 30 is not limited, and the electroplating mechanism can be fixedly connected or integrally formed or detachably connected, and the position relationship is as follows: the first stirring mechanism 10 is disposed outside the plating mechanism 30, and the second stirring mechanism 20 is disposed inside the plating mechanism 30, when the plating apparatus 100 is disposed in the plating solution of the plating tank, the first stirring mechanism 10 can stir the plating solution outside the plating mechanism 30, and the second stirring mechanism 20 can stir the plating solution inside the plating mechanism 30, so that the plating mechanism 30 is in the plating solution with a balanced concentration, and the plating effect is optimized.
To further clarify the above positional relationship, referring to fig. 2, the electroplating mechanism 30 includes an anode 301 and a cathode 302, when electroplating, the metal product or plated part to be plated is used as the cathode 302, the anode 301 is the plated metal, wherein the anode 301 and the cathode 302 are disposed in parallel and separated by a predetermined distance to leave a space where the second stirring mechanism 20 can be disposed;
referring to fig. 3, the second stirring mechanism 20 includes two vertical mounting plates 201, wherein a rotatable stirring roller 205 is disposed at the bottom between the two mounting plates 201, wherein the height of the stirring roller 205 is matched with the height of the parallel anode 301 and cathode 302, and the rotation mode of the stirring roller 205 is as follows: the outside of mounting panel 201 is provided with second driving motor 202, specifically, second driving motor 202 sets up in the top outside of mounting panel 201, and second driving motor 202 is connected with and runs through mounting panel 201 and rather than rotatable coupling's axis of rotation 203, inlays on the axis of rotation 203 and has drive gear 204, and drive gear 204 meshes on stirring gyro wheel 205, therefore, through the cooperation of drive shaft 203 and drive gear 204, when second driving motor 202 drove axis of rotation 203 and rotates, thereby drive the stirring gyro wheel 205 roll of mounting panel 201 bottom.
It can be understood that rotation axis 203 includes driving shaft (not numbered) and driven shaft (not numbered), conducts and slows down through the meshing between drive gear 204, belongs to the common technical field of this trade, the utility model discloses do not specifically explain about this principle.
The mounting panel 201 is erect and is placed and can be inserted it in the plating bath of adaptation, and the mountable makes its fixed connection on the inner wall of plating bath, thereby the position of fixed mounting panel 201, and stirring roller 205 installs the bottom between mounting panel 201, this mode of setting includes two advantages, firstly because metal ion's natural precipitation in the plating solution, the metal ion concentration that leads to the plating solution lower floor is greater than upper concentration, consequently stirring roller 205 sets up in the bottom, can make the metal ion in its lower floor plating solution be difficult to deposit under stirring when stirring roller 205 rolls, secondly when stirring roller 205 rolls, drive the plating solution and splash away.
The second driving motor 202 is arranged on the outer side of the top of the mounting plate 201, the stirring roller 205 is driven to rotate through the rotating shaft 203 and the transmission gear 204, the stirring roller 205 is not directly driven to rotate through the motor, the arrangement is to provide a more reasonable mounting space for the mounting plate 201 and the stirring roller 205, and when the stirring roller 205 is arranged in the electroplating bath, the second driving motor 202 can be exposed outside the electroplating bath, so that debugging and maintenance are facilitated.
Further, the stirring roller 205 has a hollow structure, and at least one opening 2051 is formed thereon, so that the plating solution can enter the inside of the stirring roller 205 through the opening 2051.
Referring to fig. 4, the rotation direction of the stirring roller 23 is defined as: rotate clockwise along the direction of positive pole 301 to negative pole 302, can understand, along with stirring gyro wheel 23 clockwise rolls, constantly topples over the upper portion of cladding material metal ion from negative pole 302 to the lower part, can accelerate the speed of electroplating, can guarantee the homogeneity of plating solution again simultaneously, prevents that the ion from deposiing.
To further illustrate the above principle, referring to fig. 5 (which is simplified for clarity), the anode 301, the cathode 302, and the stirring roller 205 are all located in the electroplating bath, and in an operating state, since the anode 301 generates metal ions, the cathode 302 is a workpiece to be plated, the metal ion concentration in the electroplating solution in a region below the anode 301 is the highest, the metal ion concentration in a region below the cathode 302 is lower than that in a region below the anode 301, the metal ion concentration in the entire electroplating bath decreases from bottom to top, the stirring roller 23 rotates clockwise along the direction from the anode 301 to the cathode 302, so that during the rotation of the stirring roller 23, the electroplating solution is injected into the stirring roller 23 when the opening 2051 rotates toward the lower side to the upper side of the anode 301, and then the stirring roller tilts from the upper side to the lower side of the cathode 302, so that the metal ion concentrations above and below the cathode 302 are in a state of complete, the phenomenon of uneven upper and lower coatings of the workpiece to be plated is prevented.
Further, half a circle when opening 2051 is towards anode 301 one side, its stirring roller 23's rotation speed will be greater than opening 2051 towards the half circle of negative pole 302, pours into the plating solution slowly promptly into to further increase the degree of consistency of cladding material, the operation procedure of above-mentioned mode accessible external controller control second driving motor 202 can be realized, the utility model discloses not too much the explanation.
Referring to fig. 6, the first stirring mechanism 10 includes a first driving motor 101, the first driving motor 101 is connected to a horizontally disposed turntable 102, the first driving motor 101 is connected to a center of the turntable 102 and can drive the turntable 102 to rotate, at least two vertical shafts 103 perpendicular to the turntable 102 extend from a surface of the turntable 102 away from the first driving motor 101, the vertical shafts 103 are symmetrical around the center of the turntable, at least two stirring blades 104 are disposed on each vertical shaft 103, and at least two stirring blades 104 are disposed in an inclined manner, optionally, the inclination angle is 40 ° to 60 °, and the first driving motor 101 can drive the turntable 102 to rotate and then drive the stirring blades 104 to rotate around the center of the turntable 102, so as to stir the plating solution uniformly.
Further, stirring piece 104 is from last to down, along keeping away from in the direction of carousel 102, the area of stirring piece 104 increases in proper order, or from last to down, along keeping away from the direction of carousel 102 in proper order, the interval distance reduces in proper order, gets one of them mode or both modes and combines to make the stirring dynamics of plating solution bottom be greater than the dynamics of upside, prevent the concentration difference that metal ion deposit arouses, consequently avoided the inhomogeneous condition of cladding material.
Referring to fig. 5 and 8, the center line of the turntable 102 is located on the center line of the anode 301 and the cathode 302, that is, the stirring sheet 104 can rotate around the center line of the anode 301 and the cathode 302, the second stirring mechanism 20 can maintain the cathode 302, that is, the upper side and the lower side of the workpiece to be coated, to be uniform, and due to the rotation unicity of the second stirring mechanism 20, in the gradual stirring process, the metal ion concentration of the area a of one side of the cathode 302 facing the second stirring mechanism 20 is greater than that of one side facing away from the stirring mechanism 20, so that the coating of the area a is greater than that of the area b, the stirring sheet 104 is disposed outside the electroplating mechanism 30, that is, the anode 301 and the cathode 302 of the electroplating mechanism 30 are away from the stirring mechanism 20, and, when the first stirring mechanism 10 rotates, the metal ions of the anode 301 can be continuously moved to the cathode 302 under the stirring of the stirring sheet 104, so that the concentration of one side of the cathode 302 facing away from the second stirring mechanism 20 and the side The uniformity of the coating thickness of the workpiece to be coated is completely ensured.
In conclusion, the second stirring mechanism 20 rotates in the vertical horizontal plane direction, and the first stirring mechanism 10 rotates in the horizontal plane direction, so that the uniformity of the cathode 302, namely the coating of the workpiece to be coated, can be increased, and the coating quality is greatly improved.
To better illustrate the above solution, the present invention further provides an electroplating bath (not shown), which needs to utilize the electroplating device for uniformly stirring the electroplating solution when electroplating the metal to be plated.
Compared with the prior art, the utility model provides an electroplating device of even stirring of plating solution has following advantage:
1. the above is only a preferred embodiment of the present invention, and should not be limited to the present invention, and any modifications, equivalent replacements, and improvements made within the principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The utility model provides an electroplating device of even stirring of plating solution which characterized in that: including rotatory first rabbling mechanism of a horizontal plane direction, the rotatory second rabbling mechanism of a perpendicular horizontal plane direction and electroplate the mechanism, it includes positive pole and negative pole to electroplate the mechanism, second rabbling mechanism set up in the positive pole with between the negative pole, first rabbling mechanism is including can center on the positive pole with the rotatory stirring piece in negative pole center, the stirring piece set up in the positive pole with the negative pole deviates from one side of rabbling mechanism.
2. A plating apparatus with uniform stirring of a plating liquid as set forth in claim 1, wherein: the second rabbling mechanism includes that two are erect the mounting panel that sets up, bottom between the mounting panel is provided with rotatable stirring gyro wheel, and the top in the outside of mounting panel is provided with second driving motor, second driving motor be connected with run through the mounting panel and with mounting panel rotatable coupling's axis of rotation, drive gear has been inlayed in the axis of rotation, and the drive gear meshing is in on the stirring gyro wheel.
3. A plating apparatus with uniform stirring of a plating liquid as set forth in claim 2, wherein: the stirring roller is of a hollow structure, and at least one opening is formed in the stirring roller.
4. A plating apparatus with uniform stirring of a plating liquid as set forth in claim 1, wherein: first rabbling mechanism includes a driving motor, and a driving motor is connected with the carousel that a level set up, and a driving motor connects in the center department of carousel and can drive the carousel rotation, and the carousel deviates from a driving motor's one side and stretches out there are two at least perpendicular to the vertical axis of carousel, the vertical axis centers on carousel central symmetry, the stirring piece sets up on the vertical axis.
5. A plating apparatus with uniform stirring of a plating solution as set forth in claim 4, wherein: the stirring plates are at least two and are arranged on the vertical shaft at intervals, the stirring plates are arranged in an inclined manner to the horizontal plane, and the inclination angle is 40-60 degrees.
6. A plating apparatus with uniform stirring of a plating solution as set forth in claim 5, wherein: the spacing distances decrease in sequence in a direction away from the turntable.
7. A plating apparatus with uniform stirring of a plating solution as set forth in claim 5, wherein: along keeping away from the carousel direction, the area increases in proper order.
8. A plating apparatus with uniform stirring of a plating solution as set forth in claim 4, wherein: the center line of the rotating disc is positioned on the center lines of the anode and the cathode.
9. An electroplating bath, which is characterized in that: the electroplating bath according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020060062.2U CN211872138U (en) | 2020-01-11 | 2020-01-11 | Electroplating device for uniformly stirring electroplating solution and electroplating bath with same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020060062.2U CN211872138U (en) | 2020-01-11 | 2020-01-11 | Electroplating device for uniformly stirring electroplating solution and electroplating bath with same |
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| CN211872138U true CN211872138U (en) | 2020-11-06 |
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| CN202020060062.2U Expired - Fee Related CN211872138U (en) | 2020-01-11 | 2020-01-11 | Electroplating device for uniformly stirring electroplating solution and electroplating bath with same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114438572A (en) * | 2022-04-08 | 2022-05-06 | 深圳市虹喜科技发展有限公司 | Electroplating solution leakage-proof carrier and leakage-proof treatment process thereof |
-
2020
- 2020-01-11 CN CN202020060062.2U patent/CN211872138U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114438572A (en) * | 2022-04-08 | 2022-05-06 | 深圳市虹喜科技发展有限公司 | Electroplating solution leakage-proof carrier and leakage-proof treatment process thereof |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201106 Termination date: 20220111 |
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| CF01 | Termination of patent right due to non-payment of annual fee |