CN114425527A - Wafer cleaning device and wafer cleaning method - Google Patents
Wafer cleaning device and wafer cleaning method Download PDFInfo
- Publication number
- CN114425527A CN114425527A CN202011184980.7A CN202011184980A CN114425527A CN 114425527 A CN114425527 A CN 114425527A CN 202011184980 A CN202011184980 A CN 202011184980A CN 114425527 A CN114425527 A CN 114425527A
- Authority
- CN
- China
- Prior art keywords
- wafer
- spray head
- wafer cleaning
- cleaning apparatus
- servo motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 10
- 239000007921 spray Substances 0.000 claims abstract description 43
- 241000405070 Percophidae Species 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 239000012535 impurity Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a wafer cleaning device and a wafer cleaning method, wherein the wafer cleaning device comprises: the spray head, the bracket and the driving piece; the nozzle is pivoted with the support, the driving piece is connected with the nozzle, and the driving piece is used for driving the nozzle to swing. The invention can drive the spray head to swing, thereby improving the cleaning effect of the spray head on the wafer.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a wafer cleaning device and a wafer cleaning method.
Background
After the surface of the wafer is processed, the semiconductor special equipment needs to clean the surface of the wafer to remove impurities on the surface of the wafer. The common cleaning device directly sprays deionized water to the surface of a wafer by using a fixed spray head, and the cleaning effect is not ideal because the spray area is large, the spray force is not strong, and the spray water flow is not uniform.
Disclosure of Invention
In order to solve the problems, the wafer cleaning device and the wafer cleaning method provided by the invention can drive the spray head to swing relative to the bracket by arranging the driving part, so that the spray head can clean the wafer from a plurality of angles, and the wafer cleaning effect is improved.
In a first aspect, the present invention provides a wafer cleaning apparatus, comprising: the spray head, the bracket and the driving piece;
the nozzle is pivoted with the support, the driving piece is connected with the nozzle, and the driving piece is used for driving the nozzle to swing.
Optionally, the driver comprises: an AC servo motor.
Optionally, the ac servo motor includes a casing and an output shaft, the casing is fixedly connected to the bracket, and the output shaft is fixedly connected to the nozzle.
Optionally, the driver further comprises: an outer gear and an inner gear;
the output shaft of the alternating current servo motor is fixedly connected with the outer gear, the outer gear is sleeved in the inner gear and meshed with the inner gear, and the outer gear is fixedly connected with the spray head.
Optionally, the wafer driving apparatus further includes: a driver;
the driver is in communication connection with the alternating current personal service motor;
the driver is used for sending pulse signals to the alternating current servo motor so as to control the rotating speed, the rotating direction and the rotating angle of an output shaft of the alternating current servo motor.
Optionally, the rotation angle ranges from 0 degree to 90 degrees.
Optionally, the wafer driving apparatus further includes: a service module;
the service module is in communication connection with the driver and is used for adjusting the pulse signals sent by the driver.
Optionally, the spray head comprises: a round-mouth type spray head or a duckbill type spray head.
In a second aspect, the present invention provides a wafer cleaning method, including:
providing a wafer, a driving member, a spray head and a bracket for supporting the spray head;
moving the wafer to the lower part of the spray head;
the driving piece drives the spray head to swing relative to the bracket so as to clean the wafer.
According to the wafer cleaning device and the wafer cleaning method provided by the embodiment of the invention, the driving part can drive the spray head to swing relative to the support, so that the spray head can clean the wafer from multiple angles, and the wafer cleaning effect is improved.
Drawings
FIG. 1 is a schematic block diagram of a wafer cleaning apparatus according to an embodiment of the present application;
FIG. 2 is a schematic block diagram of a wafer cleaning apparatus according to an embodiment of the present application;
fig. 3 is an internal structural view of a stent according to an embodiment of the present application.
Reference numerals
1. A spray head; 2. a support; 21. a mounting cavity; 22. a rotating shaft; 3. a drive member; 31. an AC servo motor; 32. a driver; 33. a service module; 34. an outer gear; 35. an internal gear; 4. a wafer; 5. and a support member.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In a first aspect, the present invention provides a wafer cleaning apparatus, comprising: a spray head 1, a bracket 2 and a driving piece 3.
In this embodiment, the driving member 3 is an ac servo motor 31, a housing of the ac servo motor 31 is fixedly connected to the bracket 2, and an output shaft of the ac servo motor 31 is fixedly connected to the spray head 1;
in an alternative embodiment, the driver 3 comprises: an ac servo motor 31, a driver 32, a service module 33, an external gear 34 and an internal gear 35. Wherein, the spray head 1 is pivoted with the bracket 2; the driving piece 3 is used for driving the spray head 1 to swing; the shell of the alternating current servo motor 31 is fixedly connected with the bracket 2, and the output shaft of the alternating current servo motor 31 is fixedly connected with the outer gear 34; an output shaft of the alternating current servo motor 31 is fixedly linked with an outer gear 34, the outer gear 34 is sleeved in an inner gear 35 and meshed with the inner gear 35, and the outer gear 34 is fixedly linked with the nozzle 1; the driver 32 is in communication connection with the AC personal service motor; the driver 32 is configured to send a pulse signal to the ac servo motor to control the rotation speed, the rotation direction, and the rotation angle of the output shaft of the ac servo motor 31, and the range of the rotation angle with respect to the vertical plane is plus or minus 45 degrees, but the application is not limited thereto; the service module 33 is communicatively connected to the driver 32 through an ethernet network, the service module 33 provides a graphical interactive interface, and the service module 33 adjusts the pulse signal sent by the driver 32 through the graphical interactive interface.
Specifically, the output shaft of the ac servo motor 31 is perpendicular to the side surface of the external gear 34, and penetrates through the center of the external gear 34 to be fixedly connected to the external gear 34. The internal gear 35 is vertically fixed in the housing of the shower head 1. The bracket 2 is provided with a mounting cavity 21, a rotating shaft 22 is fixedly arranged in the mounting cavity 21, the rotating shaft 22 vertically penetrates through the axis of the internal gear 35, and the spray head 1 is rotatably connected with the rotating shaft 22. Wherein, shower nozzle 1 includes: a round mouth type spray head 1 or a duckbill type spray head 1. In the present embodiment, the spray head 1 is a duckbill spray head 1, and the nozzle of the duckbill spray head 1 faces downward.
In this embodiment, the wafer cleaning apparatus further includes: a support 5. The support 5 is used to support the wafer 4. The support member 5 is a chuck, and the chuck is used for driving the wafer 4 to rotate after adsorbing the wafer 4. When the wafer 4 is mounted on the support 5, the shower head 1 is positioned directly above the center of the wafer 4.
When the wafer 4 needs to be cleaned, a pulse signal is sent to the ac servo motor 31 through the driver 32 to control the ac servo motor 31 to oscillate back and forth, so that the shower head 1 can clean the wafer 4 all over. This wafer cleaning device simple structure, the cleaning performance is good, especially when wasing the marginal portion of wafer 4, washs the marginal portion of wafer 4 through the angle from the slope and can further improve the cleaning performance to wafer 4, prevents because of the dynamics that shower nozzle 1 washed is not enough, can't clear away the impurity granule on the wafer 4 totally, influences the processingquality of wafer 4.
In a second aspect, the present invention provides a wafer cleaning method applied to the above wafer cleaning apparatus, the wafer cleaning method comprising: providing a wafer 4, a driving member 3, a spray head 1 and a bracket 2 for supporting the spray head 1; mounting the wafer 4 on the support 5 so that the shower head 1 is positioned right above the center of the circle of the wafer 4; the driving piece 3 is controlled by the driving piece 3 to drive the spray head 1 to reciprocate relative to the bracket 2 so as to clean the wafer 4. So wash through swing shower nozzle 1 to wafer 4, can improve the effect of wafer 4 washing, especially when wasing the marginal portion of wafer 4, can further improve the cleaning performance to wafer 4 through wasing the edge of wafer 4 from the angle of slope, prevent because of the dynamics that shower nozzle 1 washed is not enough, can't clear away the impurity granule on the wafer 4 clean, influence the processingquality of wafer 4.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. A wafer cleaning apparatus, comprising: the spray head, the bracket and the driving piece;
the nozzle is pivoted with the support, the driving piece is connected with the nozzle, and the driving piece is used for driving the nozzle to swing.
2. The wafer cleaning apparatus as set forth in claim 1 wherein the drive member comprises: an AC servo motor.
3. The wafer cleaning apparatus as claimed in claim 2, wherein the ac servo motor comprises a housing and an output shaft, the housing is fixedly connected to the support, and the output shaft is fixedly connected to the shower head.
4. The wafer cleaning apparatus as set forth in claim 2 wherein the drive member further comprises: an outer gear and an inner gear;
the output shaft of the alternating current servo motor is fixedly connected with the outer gear, the outer gear is sleeved in the inner gear and meshed with the inner gear, and the outer gear is fixedly connected with the spray head.
5. The wafer cleaning apparatus according to claim 2, wherein the wafer driving apparatus further comprises: a driver;
the driver is in communication connection with the alternating current personal service motor;
the driver is used for sending pulse signals to the alternating current servo motor so as to control the rotating speed, the rotating direction and the rotating angle of an output shaft of the alternating current servo motor.
6. The wafer cleaning apparatus according to claim 5, wherein the rotation angle is in a range of 0 to 90 degrees.
7. The wafer cleaning apparatus according to claim 5, wherein the wafer driving apparatus further comprises: a service module;
the service module is in communication connection with the driver and is used for adjusting the pulse signals sent by the driver.
8. The wafer cleaning apparatus as set forth in claim 1 wherein the showerhead comprises: a round-mouth type spray head or a duckbill type spray head.
9. A method for cleaning a wafer, comprising:
providing a wafer, a driving member, a spray head and a bracket for supporting the spray head;
moving the wafer to the lower part of the spray head;
the driving piece drives the spray head to swing relative to the bracket so as to clean the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011184980.7A CN114425527A (en) | 2020-10-29 | 2020-10-29 | Wafer cleaning device and wafer cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011184980.7A CN114425527A (en) | 2020-10-29 | 2020-10-29 | Wafer cleaning device and wafer cleaning method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114425527A true CN114425527A (en) | 2022-05-03 |
Family
ID=81309210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011184980.7A Pending CN114425527A (en) | 2020-10-29 | 2020-10-29 | Wafer cleaning device and wafer cleaning method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114425527A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103028566A (en) * | 2012-12-14 | 2013-04-10 | 北京七星华创电子股份有限公司 | Cleaning machine swinging spraying device and method |
| CN104527586A (en) * | 2015-01-15 | 2015-04-22 | 陈学琴 | Windshield wiper drive mechanism based on hydraulic swing |
| CN206416936U (en) * | 2016-12-22 | 2017-08-18 | 绍兴市水邦针纺有限公司 | A kind of pilotless automobile rear view mirror adjustment device |
-
2020
- 2020-10-29 CN CN202011184980.7A patent/CN114425527A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103028566A (en) * | 2012-12-14 | 2013-04-10 | 北京七星华创电子股份有限公司 | Cleaning machine swinging spraying device and method |
| CN104527586A (en) * | 2015-01-15 | 2015-04-22 | 陈学琴 | Windshield wiper drive mechanism based on hydraulic swing |
| CN206416936U (en) * | 2016-12-22 | 2017-08-18 | 绍兴市水邦针纺有限公司 | A kind of pilotless automobile rear view mirror adjustment device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20220503 |