CN103028566A - Cleaning machine swinging spraying device and method - Google Patents
Cleaning machine swinging spraying device and method Download PDFInfo
- Publication number
- CN103028566A CN103028566A CN2012105462296A CN201210546229A CN103028566A CN 103028566 A CN103028566 A CN 103028566A CN 2012105462296 A CN2012105462296 A CN 2012105462296A CN 201210546229 A CN201210546229 A CN 201210546229A CN 103028566 A CN103028566 A CN 103028566A
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- Prior art keywords
- shower nozzle
- cleaning machine
- machine swinging
- spray device
- wafer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to the field of semiconductor industry, in particular to a cleaning machine swinging spraying device and a method for wafer cleaning. The cleaning machine swinging spraying device provided by the invention comprises a spraying arm, a spraying head and a driving device, wherein the spraying head is hinged with the spraying arm for forming a first hinging part, and the spraying head swings through being controlled by the driving device. The driving device is an air cylinder, and a piston rod of the air cylinder is hinged with the spraying head for forming a second hinging part. When the cleaning machine swinging spraying device is adopted, good cleaning effects can be realized in both the center position and the edge position of wafers.
Description
Technical field
The present invention relates to the semi-conductor industry field, relate in particular to a kind of cleaning machine swinging spray device and method for wafer cleaning.
Background technology
At present, cleaning machine all is vertically to be ejected into wafer surface with the chemical liquid of chemical liquid shower nozzle ejection.Semiconductor has 300mm with the copper-connection wafer diameter now, and wafer continues rotation in cleaning process, and the linear differential of its center and marginal position is apart from obvious.When liquid impacted wafer surface with same vertical direction, center wafer position and marginal position be because the difference of angular speed is huge, touches vertical and lower chemical liquid collision and can produce different backwashes and react.The marginal position angular speed of wafer is large, and is larger to the backwash of vertical liquid stream, even if under the movement velocity of less spray arm, dissolving photoresist and particle in the groove of outward flange position are difficult to be pulled away.Now need to provide technology to solve that fierce backwash effect occurs for marginal position that liquid vertically is ejected into wafer and the problem that affects cleaning performance.
Summary of the invention
The technical problem that (one) will solve
The technical problem to be solved in the present invention provides a kind of cleaning machine swinging spray device and the method that can well clean center wafer position and marginal position.
(2) technical scheme
For reaching above-mentioned purpose, cleaning machine swinging spray device of the present invention comprises spray arm 1, shower nozzle 2 and drive unit, and described shower nozzle 2 is connected with described spray arm 1, and described shower nozzle 2 is at drive unit control lower swing.
Preferably, described shower nozzle 2 and described spray arm 1 hinged formation the first hinged place 5.
Preferably, described drive unit is cylinder 3, and the piston rod 4 of described cylinder 3 is connected with described shower nozzle 2.
Preferably, described piston rod 4 and described shower nozzle 2 hinged formation the second hinged place 6.
Preferably, described cleaning machine swinging spray device also comprises protective sleeve 7, and described the first hinged place 5, the second hinged place 6 and piston rod 4 place in the protective sleeve.
Swing the method for spray according to described cleaning machine swinging spray device, may further comprise the steps:
S1. make board rotation to be cleaned, after moving into described board center under spray arm 1 effect, shower nozzle 2 beginning ejecting fluid are cleaned described board with shower nozzle 2, and this moment, shower nozzle 2 was vertical with described board;
S2. the piston rod 4 of cylinder 3 stretches out 2 swings of cylinder 3 drive shower nozzles under the compressed air effect, makes shower nozzle 2 tilt to ejecting fluid and arrives described board edge, thereby finish the cleaning to whole board.
Preferably, described board is wafer 8.
(3) beneficial effect
The device and method that the present invention adopts technique scheme to provide, shower nozzle vertically is ejected into wafer surface in the center wafer position, tilts to inject wafer surface at Waffer edge position chemical liquid.Larger impulsive force can compensate for wafer center linear velocity granule be difficult for the problem taken away by liquid in the groove.There has been very large linear velocity the Waffer edge position, and the liquid inclination is ejected into wafer surface and large impact can occur on the surface, and chemical liquid can enter into groove depths particle along with liquid stream is pulled away.Adopt cleaning machine swinging spray device of the present invention to make center wafer position and marginal position that good cleaning performance be arranged.
Description of drawings
Fig. 1 is the structural representation of cleaning machine swinging spray device of the present invention;
Fig. 2 is center wafer position liquid stream backwash schematic diagram;
Fig. 3 is Waffer edge position liquid stream backwash schematic diagram.
Among the figure, 1: spray arm; 2: shower nozzle; 3: cylinder; 4: piston rod; 5: the first hinged places; 6: the second hinged places; 7: protective sleeve; 8: wafer; 9: vertical liquid stream; 10: inclination liquid stream.
The specific embodiment
Below in conjunction with drawings and Examples cleaning machine swinging spray device of the present invention is described in further detail.Following examples are used for explanation the present invention, but are not used for limiting the scope of the invention.
In description of the invention, need to prove, term " " center "; " vertically "; " laterally "; " on "; D score; " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", orientation or the position relationship of indications such as " outward " are based on orientation shown in the drawings or position relationship, only be for convenience of description the present invention and simplified characterization, rather than device or the element of indication or hint indication must have specific orientation, with specific orientation structure and operation, therefore can not be interpreted as limitation of the present invention.In addition, term " first ", " second ", " the 3rd " only are used for describing purpose, and can not be interpreted as indication or hint relative importance.
In description of the invention, need to prove that unless clear and definite regulation and restriction are arranged in addition, term " installation ", " linking to each other ", " connection " should be done broad understanding, for example, can be to be fixedly connected with, also can be to removably connect, or connect integratedly; Can be mechanical connection, also can be to be electrically connected; Can be directly to link to each other, also can indirectly link to each other by intermediary, can be the connection of two element internals.For the ordinary skill in the art, can concrete condition understand above-mentioned term concrete meaning in the present invention.
In addition, in description of the invention, except as otherwise noted, the implication of " a plurality of " is two or more.
As shown in Figure 1, cleaning machine swinging spray device of the present invention comprises spray arm 1, shower nozzle 2 and drive unit, described shower nozzle 2 and described spray arm 1 hinged formation the first hinged place 5, and described shower nozzle 2 is at drive unit control lower swing.Described drive unit can be the device that cylinder, hydraulic cylinder, screw mandrel and gear etc. can be realized oscillating motion.
Wherein, described drive unit is cylinder 3, piston rod 4 and described shower nozzle 2 hinged formation second hinged place 6 of described cylinder 3, and described cylinder 3 is connected with compressed air.
Wherein, described cleaning machine swinging spray device also comprises protective sleeve 7, and described the first hinged place 5, the second hinged place 6 and piston rod 4 place in the protective sleeve.Shower nozzle the first hinged place, the second hinged place and piston rod in moving process can rub and easily produce particle, and the first hinged place, the second hinged place and piston rod are placed in the protective sleeve, and friction produces particle and is difficult for calling in wafer surface.
Swing the method for spray according to described cleaning machine swinging spray device, may further comprise the steps:
S1. make wafer to be cleaned 8 rotations, after moving into wafer 8 centers under spray arm 1 effect, shower nozzle 2 beginning ejecting fluid are cleaned wafer 8 with shower nozzle 2, and this moment, shower nozzle 2 was vertical with wafer 8;
S2. the piston rod 4 of cylinder 3 stretches out 2 swings of cylinder 3 drive shower nozzles under the compressed air effect, makes shower nozzle 2 tilt to ejecting fluid and arrives wafer 8 edges, thereby finish the cleaning to whole wafer 8.
At the marginal position of wafer 8, liquid is ejected into wafer 8 surfaces with certain angle of inclination, not only can not produce obvious backwash effect but also can infiltrate the groove deep layer of wafer 8, and photoresist and particle will leave wafer surface along with the liquid stream that tilts.Less owing to linear velocity in the center near wafer 8, rely on the one hand the larger jet velocity of shower nozzle to improve the flow stream velocity of the center of wafer 8, on the other hand, vertical liquid stream is ejected into the deep layer raceway groove that the almost nil wafer of linear velocity 8 surfaces more are conducive to increase wafer 8 and cleans.Drive in default of outside liquid stream, more be conducive to the cleaning of particle and photoresist lysate near the larger vertical impact power in center of wafer 8.Cleaning machine swinging spray device of the present invention can change the direction that liquid flows, and more is conducive to the particle of the marginal position of clean wafer 8.
Technique begins rear spray arm 1 and drives the center that shower nozzle 2 enters wafer 8 fast, and shower nozzle 2 makes liquid vertically be injected into the surface of wafer 8 perpendicular to the surface of wafer 8.Shower nozzle 2 is outward-dipping under the piston rod 4 of cylinder 3 drives, and liquid begins to tilt to inject the surface of wafer 8 and outwards flow, and reaches the maximum inclination angle at the marginal position shower nozzle 2 of wafer 8.After the shower nozzle 2 of wafer 8 tops was covered a wafer radius, shower nozzle 2 moved toward the center, and shower nozzle 2 fades to vertical direction by incline direction under cylinder 3 drives.Difference along with wafer 8 linear velocities, the liquid incident angle is different, the marginal position of the wafer 8 that the liquid on-line velocity is larger is during with the incident of maximum inclination angle, the backwash on wafer 8 surfaces is little, and produce easily bubble, the liquid flow path direction is outside, easier photoresist and the various solid particle of taking away dissolving.Cleaning machine swinging spray device of the present invention makes the center of wafer 8 and marginal position that good cleaning performance be arranged.
Above embodiment only is used for explanation the present invention, and be not limitation of the present invention, the those of ordinary skill in relevant technologies field is in the situation that does not break away from the spirit and scope of the present invention, can also make a variety of changes and modification, so all technical schemes that are equal to also belong to category of the present invention.
Claims (7)
1. cleaning machine swinging spray device, it is characterized in that, described cleaning machine swinging spray device comprises spray arm (1), shower nozzle (2) and drive unit, and described shower nozzle (2) is connected with described spray arm (1), and described shower nozzle (2) is at drive unit control lower swing.
2. cleaning machine swinging spray device according to claim 1 is characterized in that, described shower nozzle (2) and described spray arm (1) hinged formation the first hinged place (5).
3. cleaning machine swinging spray device according to claim 1 and 2 is characterized in that, described drive unit is cylinder (3), and the piston rod (4) of described cylinder (3) is connected with described shower nozzle (2).
4. cleaning machine swinging spray device according to claim 3 is characterized in that, described piston rod (4) and described shower nozzle (2) hinged formation the second hinged place (6).
5. cleaning machine swinging spray device according to claim 4 is characterized in that, described cleaning machine swinging spray device also comprises protective sleeve (7), and described the first hinged place (5), the second hinged place (6) and piston rod (4) place in the protective sleeve.
6. each described cleaning machine swinging spray device swings the method for spray according to claim 1-5, it is characterized in that, may further comprise the steps:
S1. make board rotation to be cleaned, with shower nozzle (2) behind the described board of the lower immigration of spray arm (1) effect center, shower nozzle (2) beginning ejecting fluid is cleaned described board, and shower nozzle this moment (2) is vertical with described board;
S2. the piston rod (4) of cylinder (3) stretches out cylinder (3) drive shower nozzle (2) swing under the compressed air effect, makes shower nozzle (2) tilt to ejecting fluid and arrives described board edge, thereby finish the cleaning to whole board.
7. cleaning machine swinging spray device according to claim 6 swings the method for spray, it is characterized in that, described board is wafer (8).
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105462296A CN103028566A (en) | 2012-12-14 | 2012-12-14 | Cleaning machine swinging spraying device and method |
| PCT/CN2013/073580 WO2014089942A1 (en) | 2012-12-14 | 2013-04-01 | Rinsing machine swinging spraying device and method |
| US14/127,975 US9744565B2 (en) | 2012-12-14 | 2013-04-01 | Swing spray device of cleaning apparatus and cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105462296A CN103028566A (en) | 2012-12-14 | 2012-12-14 | Cleaning machine swinging spraying device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103028566A true CN103028566A (en) | 2013-04-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012105462296A Pending CN103028566A (en) | 2012-12-14 | 2012-12-14 | Cleaning machine swinging spraying device and method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103028566A (en) |
| WO (1) | WO2014089942A1 (en) |
Cited By (13)
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|---|---|---|---|---|
| CN105597981A (en) * | 2016-03-08 | 2016-05-25 | 佳马机械涂覆科技（苏州）有限公司 | Movable spray coating device with five degrees of freedom |
| CN105926907A (en) * | 2016-06-17 | 2016-09-07 | 佛山市联智新创科技有限公司 | Low-rise building outer wall paint spraying device |
| CN106733950A (en) * | 2016-12-23 | 2017-05-31 | 中车贵阳车辆有限公司 | A kind of rolling stock 120 valve external wall cleaning machines and its cleaning method |
| CN107297367A (en) * | 2017-08-25 | 2017-10-27 | 刘玉馨 | A kind of natural gas line cleaning plant |
| CN108122813A (en) * | 2017-12-14 | 2018-06-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer rear clearing and drying device, wafer rear are cleaned and dried system and method |
| CN108311446A (en) * | 2018-01-31 | 2018-07-24 | 重庆婉婷科技发展有限公司 | Method for machine components slagging-off |
| CN108405435A (en) * | 2018-03-30 | 2018-08-17 | 长兴宏力机械科技有限公司 | A kind of spare parts processing machinery cleaning device |
| CN108748743A (en) * | 2018-06-12 | 2018-11-06 | 山东大海新能源发展有限公司 | A kind of crystal holder heat sink and polysilicon chip preparation process |
| CN111014169A (en) * | 2019-12-17 | 2020-04-17 | 西安奕斯伟硅片技术有限公司 | Cleaning device |
| CN111341690A (en) * | 2018-12-19 | 2020-06-26 | 北京北方华创微电子装备有限公司 | Spraying structure and reaction chamber |
| CN112223909A (en) * | 2020-09-02 | 2021-01-15 | 湖北金禄科技有限公司 | Method for cleaning printing screen for circuit board |
| CN113684515A (en) * | 2021-08-03 | 2021-11-23 | 山东铂克新材料有限公司 | Aluminum product anodic oxidation dyeing apparatus |
| CN114425527A (en) * | 2020-10-29 | 2022-05-03 | 中国科学院微电子研究所 | Wafer cleaning device and wafer cleaning method |
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| CN113229764B (en) * | 2021-04-22 | 2023-04-07 | 苏州科洁泰电器有限公司 | Spraying mechanism of traction swinging type dish washing machine |
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| CN201632351U (en) * | 2010-04-12 | 2010-11-17 | 劲辉实业有限公司 | High-pressure swaying spray head device |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105597981A (en) * | 2016-03-08 | 2016-05-25 | 佳马机械涂覆科技（苏州）有限公司 | Movable spray coating device with five degrees of freedom |
| CN105597981B (en) * | 2016-03-08 | 2018-05-11 | 佳马机械涂覆科技（苏州）有限公司 | A kind of moveable five degree of freedom spray equipment |
| CN105926907A (en) * | 2016-06-17 | 2016-09-07 | 佛山市联智新创科技有限公司 | Low-rise building outer wall paint spraying device |
| CN105926907B (en) * | 2016-06-17 | 2017-12-26 | 深圳广田集团股份有限公司 | A kind of outer wall of low-rise building spray-painting plant |
| CN106733950A (en) * | 2016-12-23 | 2017-05-31 | 中车贵阳车辆有限公司 | A kind of rolling stock 120 valve external wall cleaning machines and its cleaning method |
| CN107297367A (en) * | 2017-08-25 | 2017-10-27 | 刘玉馨 | A kind of natural gas line cleaning plant |
| CN108122813A (en) * | 2017-12-14 | 2018-06-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer rear clearing and drying device, wafer rear are cleaned and dried system and method |
| CN108311446A (en) * | 2018-01-31 | 2018-07-24 | 重庆婉婷科技发展有限公司 | Method for machine components slagging-off |
| CN108405435A (en) * | 2018-03-30 | 2018-08-17 | 长兴宏力机械科技有限公司 | A kind of spare parts processing machinery cleaning device |
| CN108748743A (en) * | 2018-06-12 | 2018-11-06 | 山东大海新能源发展有限公司 | A kind of crystal holder heat sink and polysilicon chip preparation process |
| CN111341690A (en) * | 2018-12-19 | 2020-06-26 | 北京北方华创微电子装备有限公司 | Spraying structure and reaction chamber |
| CN111341690B (en) * | 2018-12-19 | 2023-12-22 | 北京北方华创微电子装备有限公司 | Spraying structure and reaction chamber |
| CN111014169A (en) * | 2019-12-17 | 2020-04-17 | 西安奕斯伟硅片技术有限公司 | Cleaning device |
| CN111014169B (en) * | 2019-12-17 | 2022-05-20 | 西安奕斯伟材料科技有限公司 | Cleaning device |
| CN112223909A (en) * | 2020-09-02 | 2021-01-15 | 湖北金禄科技有限公司 | Method for cleaning printing screen for circuit board |
| CN112223909B (en) * | 2020-09-02 | 2022-05-24 | 湖北金禄科技有限公司 | Method for cleaning printing screen for circuit board |
| CN114425527A (en) * | 2020-10-29 | 2022-05-03 | 中国科学院微电子研究所 | Wafer cleaning device and wafer cleaning method |
| CN113684515A (en) * | 2021-08-03 | 2021-11-23 | 山东铂克新材料有限公司 | Aluminum product anodic oxidation dyeing apparatus |
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| Publication number | Publication date |
|---|---|
| WO2014089942A1 (en) | 2014-06-19 |
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Application publication date: 20130410 |