CN108122813A - Wafer rear clearing and drying device, wafer rear are cleaned and dried system and method - Google Patents
Wafer rear clearing and drying device, wafer rear are cleaned and dried system and method Download PDFInfo
- Publication number
- CN108122813A CN108122813A CN201711347994.4A CN201711347994A CN108122813A CN 108122813 A CN108122813 A CN 108122813A CN 201711347994 A CN201711347994 A CN 201711347994A CN 108122813 A CN108122813 A CN 108122813A
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- wafer
- back side
- nozzle
- drying device
- movable block
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention relates to wafer rear cleaning equipment technical fields, and system and method is cleaned and dried more particularly, to a kind of wafer rear clearing and drying device, wafer rear.The wafer rear clearing and drying device, including wafer clamping device, first driving means and injection equipment, wafer clamping device is used to carry wafer；First driving means are used to that wafer clamping device to be driven to rotate；Injection equipment is used to be cleaned and dried the back side of wafer；Injection equipment includes nozzle, and nozzle is gradually moved into the jet path at the back side of wafer by the center at the back side of wafer at the edge at the back side of wafer.The wafer rear is cleaned and dried system, including the wafer rear clearing and drying device.The present invention, which can realize, is cleaned and dried the back side of whole wafer, and apparatus structure is simple, and can realize the overlapping in the region of cleaning-drying as needed, so as to reach effective cleaning-drying of wafer rear, improves the cleaning-drying effect of wafer rear.
Description
Technical field
The present invention relates to wafer rear cleaning equipment technical fields, are cleaned and dried and fill more particularly, to a kind of wafer rear
It puts, wafer rear is cleaned and dried system and method.
Background technology
With the continuous diminution of the critical size of semiconductor device technology, the requirement to wafer process is stringenter, to crystalline substance
The cleaning-drying effect requirements at the circle back side are also higher and higher.At present, during wafer-process, technique is carried out to the back side of wafer
During processing, by the way of multiple fixed nozzle fixed point injections, that is to say, that nozzle is to the fixed position at the back side of wafer
It is sprayed, to achieve the purpose that cleaning-drying, the apparatus structure by the way of this cleaning-drying is complicated, and cannot cover
Lid is entire or is overlapped the back side of covering wafer, so as to cause cleaning-drying effect undesirable.
The content of the invention
It is an object of the invention to provide a kind of wafer rear clearing and drying device, wafer rears to be cleaned and dried system and side
Method cannot cover entire or overlapping covering wafer the back side in a manner of solving cleaning-drying in the prior art, so as to
It causes to be cleaned and dried the technical issues of effect is undesirable.
The present invention provides a kind of wafer rear clearing and drying device, including wafer clamping device, first driving means and
Injection equipment, the wafer clamping device are used to carry wafer；The first driving means fill for the wafer to be driven to clamp
Put rotation；Injection equipment is used to be cleaned and dried the back side of the wafer；The injection equipment includes nozzle, and the spray
Mouth is gradually moved into the jet path at the back side of the wafer by the center at the back side of the wafer at the back side of the wafer
Edge.
Further, the injection equipment further includes connecting rod and movable block；The nozzle is fixed on the movable block, institute
Connecting rod is stated to be hinged with the movable block, for the connecting rod along the connecting rod itself axial direction move back and forth when, it is described
Connecting rod can drive the movable block to move, to change the injection direction of the nozzle.
Further, process cavity is further included, the wafer clamping device is located in the process cavity, the movable block
It is installed on the in vivo articulated shaft of the process cavity, and the movable block can be rotated around the articulated shaft.
Further, the movable block includes the first rotation section and the second rotation section, first rotation section and described the
Two rotation sections are connected.
Further, the second driving device is further included, the axial direction of itself is done along the connecting rod for making the connecting rod
It moves back and forth.
Further, second driving device is electric pushrod.
Further, the first driving means are motor.
Further, the nozzle is communicated with pipeline, for enabling flow through the pipeline into the nozzle.
The present invention also provides a kind of wafer rears to be cleaned and dried system, and dress is cleaned and dried including the wafer rear
It puts.
The present invention also provides a kind of wafer rear cleaning-drying sides using the wafer rear clearing and drying device
Method, this method include：
Wafer is placed on the wafer clamping device, by the first driving means wafer is driven to clamp dress
Put rotation；
The back side of the wafer is cleaned and dried using the injection equipment, wherein, the nozzle is to the wafer
The back side jet path be gradually moved by the center at the back side of the wafer wafer the back side edge.
Compared with prior art, beneficial effects of the present invention are：
Wafer rear clearing and drying device provided by the invention, wafer rear are cleaned and dried system and method, and wafer is pacified
It is placed on wafer clamping device, by first driving means wafer clamping device is driven to rotate；Using injection equipment to wafer
The back side is cleaned and dried, wherein, nozzle is gradually moved into the jet path at the back side of wafer by the center at the back side of wafer
The edge at the back side of wafer.So by the compound of the jet path of the rotation and nozzle of wafer, just can realize to entire brilliant
The round back side is cleaned, and apparatus structure is simple, and can realize the overlapping in the region of cleaning-drying as needed, so as to reach
To effective cleaning-drying at the back side of wafer, improve the cleaning-drying effect at the back side of wafer.
Description of the drawings
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution of the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, in describing below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is the structure diagram for the wafer rear clearing and drying device that the embodiment of the present invention one provides；
Fig. 2 is the structure diagram of wafer rear clearing and drying device provided by Embodiment 2 of the present invention；
Fig. 3 is the structure diagram for the wafer rear clearing and drying device that the embodiment of the present invention three provides；
Fig. 4 is the structure diagram for the wafer rear clearing and drying device that the embodiment of the present invention four provides.
In figure：
100- process cavities；101- wafer clamping devices；102- wafers；103- nozzles；104- drive shafts；105- connects
Bar；106- movable blocks；The first rotation sections of 107-；The second rotation sections of 108-；The second shafts of 109-；110- motors；111- barrels of circles；
112- geometrical clamps；The 3rd driving devices of 113-；114- various way solenoid valves；115- articulated shafts.
Specific embodiment
Technical scheme is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is part of the embodiment of the present invention, instead of all the embodiments.
Component usually here described in attached drawing with the embodiment of the present invention shown can be with a variety of configurations
To arrange and design.Therefore, below the detailed description of the embodiment of the present invention to providing in the accompanying drawings be not intended to limit will
The scope of the present invention of protection is sought, but is merely representative of the selected embodiment of the present invention.
Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without making creative work
The every other embodiment obtained, belongs to the scope of protection of the invention.
In the description of the present invention, it is necessary to explanation, term " " center ", " on ", " under ", "left", "right", " vertical ",
The orientation or position relationship of the instructions such as " level ", " interior ", " outer " be based on orientation shown in the drawings or position relationship, merely to
Convenient for the description present invention and simplify description rather than instruction or imply signified device or element must have specific orientation,
With specific azimuth configuration and operation, therefore it is not considered as limiting the invention.In addition, term " first ", " second ",
" the 3rd " is only used for description purpose, and it is not intended that instruction or hint relative importance.
In the description of the present invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or be integrally connected；It can
To be mechanical connection or be electrically connected；It can be directly connected, can also be indirectly connected by intermediary, Ke Yishi
Connection inside two elements.For the ordinary skill in the art, with concrete condition above-mentioned term can be understood at this
Concrete meaning in invention.
Embodiment one
Shown in Figure 1, the embodiment of the present invention one provides a kind of wafer rear clearing and drying device and is clamped including wafer
Device 101, first driving means and injection equipment, wafer clamping device 101 are used to carry wafer 102；First driving means are used
It is rotated in driving wafer clamping device 101；Injection equipment is used to be cleaned and dried the back side of wafer；Injection equipment includes spray
Mouth 103, and nozzle 103 is gradually moved into the jet path at the back side of wafer by the center at the back side of wafer at the back side of wafer
Edge.Wafer clamping device 101 is not improved in the embodiment, is the prior art, therefore, institute in examples below
The description for the wafer clamping device 101 being related to is only for the technical solution that the present invention is more fully described and clearer
It embodies the features of the present invention rather than is defined for the present invention.
Specifically, wafer clamping device 101 rotates, so as to which the wafer that it is driven to carry rotates, the axis which rotates
The intersection point at the perpendicular of line and wafer, the pivot center of the center, that is, wafer at the back side of wafer and the back side of wafer.Wafer
In rotation process, since the jet path of nozzle 103 is the side at the back side that wafer is gradually moved by the center at the back side of wafer
Edge, so as to realize that the entire back side to wafer carries out the cleaning without dead angle.The nozzle 103 of injection equipment can spray
Go out solution to clean with the back side to wafer, nozzle 103 can also eject gas and carry out with the back side of the wafer after cleaning
It is dry.It can also be cleaned it should be noted that being not only limited to solution to the cleaning at the back side of wafer using gas.Separately
Outside, the solution that nozzle 103 ejects can be chemical liquids or pure water, chemical liquids can according to the needs realized in cleaning process come
It chooses, is no longer specifically described in the embodiment.
The wafer rear clearing and drying device that the embodiment provides, so passes through the rotation of wafer and the nozzle of injection equipment
103 jet path it is compound, just can realize and the back side of whole wafer is cleaned, the structure of device is simple, and
The overlapping in the region of cleaning-drying can be realized as needed, so as to reach effective cleaning at the back side of wafer, improve wafer
The cleaning performance at the back side.
In the optional scheme of the embodiment, wafer clamping device 101 is installed in drive shaft 104, and driving device drives
Drive shaft 104 rotates, and drive shaft 104 drives wafer clamping device 101 to rotate.
In the optional scheme of the embodiment, first driving means are motor.
Specifically, the output shaft of motor can directly be connected with drive shaft 104, and the output shaft of motor can also lead to
Gear or synchronous belt are crossed drive shaft 104 to be driven to rotate.The motor can be servomotor.
In the optional scheme of the embodiment, injection equipment further includes connecting rod 105 and movable block 106；Nozzle 103 is fixed on work
On motion block 106, connecting rod 105 is hinged with movable block 106, for being moved back and forth in connecting rod 105 along the axial direction of connecting rod 105 itself
When, connecting rod 105 can drive movable block 106 to move, to change the injection direction of nozzle 103.Wafer rear clearing and drying device
Process cavity 100 is further included, wafer clamping device 101 is located in process cavity, and it is in vivo that movable block 106 is installed on process cavity
On articulated shaft 115, and movable block 106 can be rotated around articulated shaft.Articulated shaft is installed on the in vivo bottom of process cavity by fixed link
Portion.
Specifically, the injection direction of nozzle 103 is towards the back side of wafer；Movable block 106 is in fold-line-shaped；105 edge of connecting rod
During the axial movement of itself, movable block 106 links with connecting rod 105.Movable block 106 is rotated around articulated shaft；The axis of articulated shaft
It is parallel with the back side of wafer to direction.And the rotation of movable block 106, just make nozzle 103 that can also rotate, so that spray
The injection direction of mouth 103 changes.
In the optional scheme of the embodiment, movable block 106 include the first rotation section 107 and the second rotation section 108, first turn
Dynamic portion 107 is connected with the second rotation section 108.105 and first rotation section 107 of connecting rod is hinged, and the second rotation section 108 is installed on hinge
In spindle.The length extending direction of first rotation section 107 and the length extending direction of the second rotation section 108 are set in angle.
In the optional scheme of the embodiment, wafer rear clearing and drying device further includes the second driving device, for making company
Along connecting rod 105, the axial direction of itself reciprocatingly moves bar 105, even if connecting rod 105 moves up and down, to realize the spray of nozzle 103
Penetrate the change in direction.Nozzle is installed on the second rotation section.
Specifically, the second driving device is electric pushrod, can be conducive to the injection to nozzle 103 by electric pushrod
Direction is accurately controlled.
It should be noted that in the embodiment, multiple injection equipments can also be set, multiple injection equipments are uniformly distributed together
On one circle, that is to say, that multiple injection equipments are uniformly distributed along the circumferential direction of wafer, can so improve cleaning efficiency.In addition,
Multiple injection equipments can also can so be easy to implement better cleaning along the radial arrangement of setting circle, realize different clear
Wash function.
The embodiment is additionally provided realizes wafer rear cleaning and drying method, the party using wafer rear clearing and drying device
Method comprises the following steps：
Wafer is placed on wafer clamping device 101,101 turns of wafer clamping device is driven by first driving means
It is dynamic.By the second driving device connecting rod 105 is driven to move, make the solution that nozzle 103 sprays first clear to the center at the back side of wafer
It washes.Second driving device gradually moves up connecting rod 105, to change the injection direction of nozzle 103, makes the injection of nozzle 103
Path is gradually moved into the edge at the back side of wafer by the center at the back side of wafer, to complete cleaning.When to the back of the body of wafer
After the completion of the cleaning of face, then nozzle 103 is made to eject gas；Second driving device gradually moves down connecting rod 105 again, so that spray
The jet path of mouth 103 is gradually moved into the center at the back side of wafer by the edge at the back side of wafer, to complete the back of the body to wafer
The drying work in face.
Embodiment two
The present embodiment two also provides a kind of wafer rear clearing and drying device, and the wafer rear of the embodiment is cleaned and dried
Device describes another implementation of the injection equipment, and the technical solution of embodiment one in addition falls within the reality
Example two is applied, is not repeated to describe.
Shown in Figure 2, in the embodiment, injection equipment includes movable block 106 and nozzle 103；Nozzle 103 is installed on
On movable block 106, movable block 106 is installed in the second shaft 109, and the second shaft 109 passes through gear or synchronous belt and 4 wheel driven
Dynamic device transmission, four-drive device can be motor 110；Motor rotates, so that the change of angle occurs for the second shaft 109,
So that movable block 106 deflects, the movement of movable block 106 drives the spray angle of nozzle 103 to change, so as to fulfill
The change of the jet path of nozzle 103.
Embodiment three
The present embodiment three also provides a kind of wafer rear clearing and drying device, and the wafer rear of the embodiment is cleaned and dried
Device describes another implementation of the wafer clamping device 101, embodiment one in addition or embodiment two
Technical solution falls within the embodiment three, is not repeated to describe.
Shown in Figure 3, in the embodiment, wafer clamping device 101 includes bucket circle 111 and multiple geometrical clamps 112, more
A geometrical clamp 112 is uniformly distributed along the circumferential direction of bucket circle 111；Threeth driving of the bucket circle 111 by being arranged at the outside of bucket circle 111 fills
113 drivings are put, and the 3rd driving device 113 drives bucket circle 111 to rotate by gear-driven mode.3rd driving device 113
For motor 110.Injection equipment is located in the circle of bucket circle 111.The bottom of bucket circle is limited in limiting slot, and bucket circle and limiting slot it
Between have ball, can so reduce friction.
It is the prior art it should be noted that not improved geometrical clamp 112 in the embodiment, therefore, following reality
The description of geometrical clamp 112 involved in example is applied, is only for the technical solution and become apparent from that the present invention is more fully described
The embodiment features of the present invention rather than be defined for the present invention.
By motor bucket circle 111 is driven to rotate, so when the nozzle 103 of injection equipment sprays wafer, can realized
The unobstructed effect for spraying to wafer, improving cleaning or drying of solution or gas ejected.
Example IV
Wafer rear clearing and drying device in the present embodiment four be in embodiment one into embodiment three any embodiment
On the basis of improvement, embodiment one technology contents not repeated description, embodiment disclosed in any embodiment into embodiment three
One into embodiment three any embodiment disclosure fall within four disclosure of the present embodiment.
Shown in Figure 4, in the embodiment, nozzle 103 is connected by pipeline with more logical pneumatic operated valves 114.By mostly logical
Pneumatic operated valve 114 can realize the switching for the different fluid that nozzle 103 sprays, and such as realize the switching of solution and gas, when switching to
When ejecting solution, to be cleaned to wafer；When switch to eject gas when, wafer to be dried.It needs to illustrate
, in the embodiment, mostly logical pneumatic operated valves can also be replaced with more moving electromagnetic valves.
Embodiment five
The embodiment of the present invention five provides a kind of wafer rear and is cleaned and dried system, including embodiment one into example IV
The wafer rear clearing and drying device that any embodiment provides.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe is described in detail the present invention with reference to foregoing embodiments, it will be understood by those of ordinary skill in the art that：Its according to
Can so modify to the technical solution recorded in foregoing embodiments either to which part or all technical characteristic into
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is not made to depart from various embodiments of the present invention technology
The scope of scheme.In addition, it will be appreciated by those of skill in the art that although some embodiments described herein include other implementations
Included some features rather than other feature in example, but the combination of the feature of different embodiments means in the present invention
Within the scope of and form different embodiments.For example, in the following claims, embodiment claimed
It is one of arbitrary mode to use in any combination.
Claims (10)
1. a kind of wafer rear clearing and drying device, which is characterized in that including wafer clamping device, first driving means and injection
Mechanism, the wafer clamping device are used to carry wafer；The first driving means are used to that the wafer clamping device to be driven to turn
It is dynamic；Injection equipment is used to be cleaned and dried the back side of the wafer；The injection equipment includes nozzle, and the nozzle pair
The jet path at the back side of the wafer is gradually moved into the edge at the back side of the wafer by the center at the back side of the wafer.
2. wafer rear clearing and drying device according to claim 1, which is characterized in that the injection equipment further includes company
Bar and movable block；The nozzle is fixed on the movable block, and the connecting rod is hinged with the movable block, in the connecting rod
When being moved back and forth along the axial direction of the connecting rod itself, the connecting rod can drive the movable block to move, with described in change
The injection direction of nozzle.
3. wafer rear clearing and drying device according to claim 2, which is characterized in that process cavity is further included, it is described
Wafer clamping device is located in the process cavity, and the movable block is installed on the in vivo articulated shaft of the process cavity, and institute
Stating movable block can rotate around the articulated shaft.
4. wafer rear clearing and drying device according to claim 3, which is characterized in that the movable block includes first turn
Dynamic portion and the second rotation section, first rotation section are connected with second rotation section.
5. the wafer rear clearing and drying device according to any one of claim 2-4, which is characterized in that further include second
Driving device, for making the connecting rod, along the connecting rod, the axial direction of itself reciprocatingly moves.
6. wafer rear clearing and drying device according to claim 5, which is characterized in that second driving device is electricity
Dynamic push rod.
7. the wafer rear clearing and drying device according to any one of claim 1-4, which is characterized in that described first drives
Dynamic device is motor.
8. the wafer rear clearing and drying device according to any one of claim 1-4, which is characterized in that the nozzle connects
Pipeline is connected with, for enabling flow through the pipeline into the nozzle.
9. a kind of wafer rear is cleaned and dried system, which is characterized in that including the wafer as any one of claim 1-8
Wafer Backside Cleaning drying device.
10. a kind of wafer rear cleaning of wafer rear clearing and drying device using any one of claim 1-8 is dry
Drying method, which is characterized in that this method includes：
Wafer is placed on the wafer clamping device, by the first driving means wafer clamping device is driven to turn
It is dynamic；
The back side of the wafer is cleaned and dried using the injection equipment, wherein, the nozzle is to the back of the body of the wafer
The jet path in face is gradually moved into the edge at the back side of the wafer by the center at the back side of the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711347994.4A CN108122813A (en) | 2017-12-14 | 2017-12-14 | Wafer rear clearing and drying device, wafer rear are cleaned and dried system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711347994.4A CN108122813A (en) | 2017-12-14 | 2017-12-14 | Wafer rear clearing and drying device, wafer rear are cleaned and dried system and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108122813A true CN108122813A (en) | 2018-06-05 |
Family
ID=62230079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711347994.4A Pending CN108122813A (en) | 2017-12-14 | 2017-12-14 | Wafer rear clearing and drying device, wafer rear are cleaned and dried system and method |
Country Status (1)
| Country | Link |
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| CN (1) | CN108122813A (en) |
Cited By (4)
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| CN110034055A (en) * | 2018-11-29 | 2019-07-19 | 杭州众硅电子科技有限公司 | A kind of system for rinsing with dry wafer |
| CN111644414A (en) * | 2020-06-01 | 2020-09-11 | 中国科学院微电子研究所 | Cleaning and drying device and method for semiconductor mechanical chuck |
| CN113945072A (en) * | 2021-10-18 | 2022-01-18 | 北京烁科精微电子装备有限公司 | Drying system and drying method |
| CN114551303A (en) * | 2022-02-24 | 2022-05-27 | 江苏京创先进电子科技有限公司 | Wafer cleaning device, wafer cleaning method and Taizhou ring cutting equipment |
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| CN114551303A (en) * | 2022-02-24 | 2022-05-27 | 江苏京创先进电子科技有限公司 | Wafer cleaning device, wafer cleaning method and Taizhou ring cutting equipment |
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Application publication date: 20180605 |