CN203800023U - Cleaning and drying device used for improving cleanliness of wafer - Google Patents
Cleaning and drying device used for improving cleanliness of wafer Download PDFInfo
- Publication number
- CN203800023U CN203800023U CN201420195578.2U CN201420195578U CN203800023U CN 203800023 U CN203800023 U CN 203800023U CN 201420195578 U CN201420195578 U CN 201420195578U CN 203800023 U CN203800023 U CN 203800023U
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- China
- Prior art keywords
- cleaning
- mechanical arm
- wafer
- shower nozzle
- rinsing table
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- Expired - Lifetime
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 142
- 238000001035 drying Methods 0.000 title abstract description 14
- 230000003749 cleanliness Effects 0.000 title abstract description 5
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 239000012530 fluid Substances 0.000 claims description 41
- 238000000034 method Methods 0.000 abstract description 20
- 239000013078 crystal Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000009991 scouring Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a cleaning and drying device used for improving the cleanliness of a wafer. A first mechanical arm and a second mechanical arm which is rotatably connected with the first mechanical arm are arranged on a horizontal cleaning table on which a wafer is placed. The second mechanical arm is provided with a cleaning nozzle. The liquid outlet direction of the cleaning nozzle tilts to the vertical axial direction of the horizontal cleaning table. The first mechanical arm can drive the second mechanical arm to carry out horizontal linear movement on the cleaning table. The second mechanical arm can horizontally rotate around a rotating connection point with the first mechanical arm. According to the utility model, the nozzle rotates angles in the cleaning cavity to carry out cleaning. Compared with the method that the nozzle is fixed on the wafer or comes in or out of the cleaning cavity again to carry out cleaning in the prior art, the device has the advantages that the cleanliness of the wafer is improved; the process time is saved; and the cleaning efficiency is improved.
Description
Technical field
The utility model relates to the cleaning drying equipment that is applied to cleaning wafer in a kind of integrated circuit manufacture, more specifically, relates to a kind of cleaning that can improve wafer cleaner degree and dries equipment.
Background technology
In the manufacture process of integrated circuit, the cleanliness factor of crystal column surface and surface state are vital to high-quality silicon device technique.If surface quality does not reach requirement, no matter how outstandingly other processing steps are controlled, are also impossible obtain high-quality semiconductor device.
Up to the present, cleaning method has many kinds, mainly contains physical cleaning and chemical cleaning.Wherein chemical cleaning method is comparatively conventional, and its principle is by cleaning the cleaning shower nozzle of drying equipment to the wafer jet cleaning liquid of rotation, carrying out wafer cleaning.But in the drying after cleaning, sometimes have a little liquid residue, affect the cleanliness factor of crystal column surface.
Fig. 1 is the partial structurtes schematic diagram that a kind of wafer cleaning of prior art dries equipment, as shown in Figure 1, this is that a kind of wafer cleaning common in prior art dries equipment, and wafer 1 is positioned over (figure slightly) on rinsing table, cleans the top, the center of circle that shower nozzle 2 is vertically fixedly installed on wafer 1.In cleaning process, wafer 1 self rotates, and cleans shower nozzle 2 ejection cleaning fluids upper to wafer 1 surface, and wafer 1 is rotated liquid is brought to other positions of wafer by self.This cleaning method can guarantee that crystal column surface is all cleaned by soaked with liquid, still, owing to cleaning shower nozzle and be fixed on the top, the center of circle of wafer, causes at the cleaning performance of other position of wafer badly, and particle removal is not thorough.And, because shower nozzle is fixed on the center of circle top of wafer, also there is a problem, be that wafer circle centre position distribute is maximum, and minimum at the centrifugal force of the circle centre position of wafer, cause the crystal column surface problem that especially the liquid residue impurity of circle centre position cannot thoroughly be removed, and then affect cleannes, rate of finished products and the reliability of wafer.
Utility model content
The purpose of this utility model is to overcome the above-mentioned defect that prior art exists, provide a kind of cleaning that can improve wafer cleaner degree to dry equipment, by two sections of mechanical arms that the mechanical arm that cleans drying equipment is designed to be rotationally connected, make two sections of mechanical arms both can above the rinsing table that cleans drying equipment, link and move as horizontal linear, can make again wherein one section of mechanical arm around another section of rotation, thereby the fluid direction of installing on driving mechanical arm has, the cleaning shower nozzle of certain angle can move above the wafer being cleaned and rotation is cleaned, with in cleaning process, increase the cleaning dynamics of horizontal direction, make the distribution of cleaning fluid more even, avoid on wafer the residual cleaning fluid of same position residual too much, and wafer circle centre position has liquid residue while avoiding that centrifugal force due to circle centre position is minimum to be caused drying, thereby the cleannes of wafer have been improved.
For achieving the above object, the technical solution of the utility model is as follows:
A kind of cleaning that improves wafer cleaner degree dries equipment, comprise place wafer horizontal rinsing table, be arranged on the mechanical arm of described rinsing table top, and being arranged on the cleaning shower nozzle on described mechanical arm, described cleaning shower nozzle is communicated with factory business feed flow end by liquid feeding pipeline; Described mechanical arm comprises the first mechanical arm and the second mechanical arm being rotationally connected with described the first mechanical arm, and described the second mechanical arm is equipped with cleaning shower nozzle, and the fluid direction of described cleaning shower nozzle favours the vertical axis direction of described horizontal rinsing table; Wherein, described the first mechanical arm can drive described the second mechanical arm as horizontal linear, to move above described rinsing table, and described the second mechanical arm can be around horizontally rotating with being rotationally connected a little of described the first mechanical arm.Cleaning of the present utility model dries equipment, by the fluid direction of cleaning shower nozzle being designed to favour the vertical axis direction of described horizontal rinsing table, favour the vertical axis direction of the wafer being cleaned, with in the cleaning process of wafer, increase the cleaning dynamics of horizontal direction, thereby improve the cleannes of wafer; Simultaneously, cleaning shower nozzle on mechanical arm both can move horizontally when ejection cleaning fluid, can horizontally rotate again, make the distribution of cleaning fluid more even, avoid on wafer the residual cleaning fluid of same position residual too much, and the defect of the centrifugal force due to circle centre position of having avoided prior art to exist is minimum while causing drying wafer circle centre position has liquid residue.Cleaning of the present utility model dries equipment, can and clean needs according to the wafer size being cleaned, and sets the multi-motion path of mechanical arm, to obtain best wafer cleaning effect.
Further, described the second mechanical arm is rotatably connected on the below of described the first mechanical arm.
Further, described the second mechanical arm is rotatably connected on the top of described the first mechanical arm.
Further, described the second mechanical arm can be around clockwise rotating with a level that is rotationally connected for described the first mechanical arm.
Further, described the second mechanical arm can be around rotating counterclockwise with a level that is rotationally connected for described the first mechanical arm.
Further, described the first mechanical arm can drive described the second mechanical arm above described rinsing table, to do to move through the horizontal linear at described horizontal rinsing table center, can guarantee like this to clean shower nozzle and can arrive the wafer home position being cleaned, guarantee certain sprinkling coverage rate of cleaning fluid.
Further, rotatable angle between described the second mechanical arm and described the first mechanical arm is 0 ~ 90 °, can guarantee that in the cleaning shower nozzle installed on the second mechanical arm rotation process when cleaning, the cleaning fluid energy uniform fold spraying is on the surface that is cleaned wafer of rotation.
Further, the rotatable front end of described the second mechanical arm is equipped with cleaning shower nozzle, and the fluid direction of described cleaning shower nozzle can be adjusted, and with compatibility test, looks for best fluid angle.
Further, the angle of the fluid direction of described cleaning shower nozzle and the vertical axis direction of described horizontal rinsing table is 3 ~ 10 °, with in cleaning process, increases the cleaning dynamics of horizontal direction, thereby improves the cleannes of wafer.
Further, the rotation direction setting of the fluid direction of described cleaning shower nozzle when described wafer cleaning, to form good scouring effect.
From technique scheme, can find out, the utility model favours the vertical axis direction of described horizontal rinsing table by the fluid direction of described cleaning shower nozzle is set, and with in cleaning process, increases the cleaning dynamics of horizontal direction, thereby improves the cleannes of wafer; Simultaneously, two mechanical arms can drive cleaning shower nozzle both can move horizontally cleaning when cleaning, the certain angle that can rotate again cleans, make the distribution of cleaning fluid more even, can avoid on wafer the residual cleaning fluid of same position residual too much, and the defect of the centrifugal force due to circle centre position of having avoided prior art to exist is minimum while causing drying wafer circle centre position has liquid residue.Experiment showed, that the utility model can obviously reduce the granule number that cleans rear crystal column surface residual impurity.The improvement of the utility model equipment is simple, with low cost; In the performance, rate of finished products and the reliability that improve product wafer, saved process costs; And for 300mm and more large-area wafer, use the shower nozzle of the present utility model mode that rotational angle cleans in cleaning chambers, compared to the shower nozzle of prior art, on wafer, maintain static or pass in and out again the mode that cleaning chambers cleans, save the process time, in a disguised form improved cleaning efficiency.
Accompanying drawing explanation
Fig. 1 is the partial structurtes schematic diagram that a kind of wafer cleaning of prior art dries equipment;
Fig. 2 is the structural representation that the utility model improves the cleaning drying equipment of wafer cleaner degree;
Fig. 3 is the side-looking structural representation of mechanical arm in Fig. 2;
Fig. 4 is that the operating state of mechanical arm in Fig. 2 changes schematic diagram.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in further detail.
In the present embodiment, refer to Fig. 2, Fig. 2 is the structural representation that the utility model improves the cleaning drying equipment of wafer cleaner degree.As shown in the figure, cleaning of the present utility model dries equipment, comprises the horizontal rinsing table of placing wafer 1, and rinsing table is provided with wafer mounting apparatus (figure slightly), for fixing wafer 1 and drive wafer rotation.The wafer 1 being cleaned is placed on rinsing table, can make centrifugal rotary-cleaning.Mechanical arm is housed above rinsing table, comprises the first mechanical arm 2 and the second mechanical arm 5.The second mechanical arm is rotationally connected by rotating shaft 3 and the first mechanical arm 2, and the second mechanical arm 5 can be made level clockwise or rotate counterclockwise around rotating shaft 3.Front end at the second mechanical arm 5 is equipped with cleaning shower nozzle 4.The first mechanical arm 2 can drive the second mechanical arm 5 above rinsing table, to do to move (as arrow indication in figure) through the horizontal linear in wafer 1 center of circle, can guarantee like this to clean shower nozzle and can arrive the wafer home position being cleaned, guarantee certain sprinkling coverage rate of cleaning fluid.Cleaning shower nozzle is communicated with by liquid feeding pipeline and the factory feed flow end of being engaged in.
Refer to Fig. 3, Fig. 3 is the side-looking structural representation of mechanical arm in Fig. 2.As shown in the figure, the second mechanical arm 5 installs by rotating shaft 3 below that is connected to the first mechanical arm 2, and the front end of the second mechanical arm 5 is equipped with and cleans shower nozzle 4.The angle that cleans the fluid direction of shower nozzle 4 and the vertical axis direction of rinsing table is 3 ~ 10 °, with in cleaning process, increases the cleaning dynamics of horizontal direction, thereby improves the cleannes of wafer.For this reason, in the angular range of 3 ~ 10 °, can by adjustment, clean the setting angle of shower nozzle, control the best angle of fluid direction, to reach best cleaning performance.The rotation direction setting of the fluid direction of cleaning shower nozzle when wafer cleaning, to form good scouring effect.
Refer to Fig. 4, Fig. 4 is that the operating state of mechanical arm in Fig. 2 changes schematic diagram.As shown in the figure, the cleaning of raising wafer cleaner degree of the present utility model dries equipment in use, wafer 1 is placed horizontally on described rinsing table, and the first mechanical arm 2 drives the second mechanical arm 5 to move to wafer 1 center, cleaning shower nozzle 4 is arranged to the top, the center of circle of described wafer 1.Wafer 1 starts horizontal rotation, starts cleaning process.Cleaning shower nozzle 4 ejection cleaning fluids on mechanical arm are to wafer 1 surface, cleaning shower nozzle 4 moves horizontally along wafer 1 diametric(al), and under the drive of the second mechanical arm 5, rotate (in the present embodiment for clockwise rotating), wafer 1 is constantly converted to the mobile cleaning that cleaning fluid sprays position.The rotatable angle of the second mechanical arm 5 is 0 ~ 90 °, can guarantee on the second mechanical arm 5 that in the cleaning shower nozzle 4 the installed rotation process when cleaning, the cleaning fluid energy uniform fold spraying is on the surface that is cleaned wafer 1 of rotation.Clean the fluid direction of shower nozzle 4 and the axis of wafer 1 and there is the angle of 3 ~ 10 °, can make cleaning fluid there is the impulse force of a horizontal direction, thereby be reduced in the residual of crystal column surface, and improve the cleansing power to crystal column surface.And the rotation direction setting of the fluid direction of cleaning shower nozzle 4 when wafer 1 cleans, to form good scouring effect.While finishing to cleaning, the second mechanical arm 5 homings are put, and to rinsing table outside, exit under the first mechanical arm 2 drives.Now, clean shower nozzle 4 stop supplies cleaning fluids, described wafer 1 continues horizontal rotation, to dry the cleaning fluid of crystal column surface.
Cleaning of the present utility model dries equipment, by the fluid direction of cleaning shower nozzle being designed to favour the vertical axis direction of described horizontal rinsing table, favour the vertical axis direction of the wafer being cleaned, with in the cleaning process of wafer, increase the cleaning dynamics of horizontal direction, thereby improve the cleannes of wafer; Simultaneously, cleaning shower nozzle on mechanical arm both can move horizontally when ejection cleaning fluid, can horizontally rotate again, make the distribution of cleaning fluid more even, avoid on wafer the residual cleaning fluid of same position residual too much, and the defect of the centrifugal force due to circle centre position of having avoided prior art to exist is minimum while causing drying wafer circle centre position has liquid residue.
It should be noted that, cleaning of the present utility model dries equipment, can and clean needs according to the wafer size being cleaned, and sets the multi-motion path of mechanical arm, to obtain best wafer cleaning effect.For example, the mechanical arm that the utility model cleans drying equipment can drive and clean at the uniform velocity curvilinear motion of shower nozzle, the motion mode such as broken line motion or speed change curvilinear motion, change speed linear motion at the uniform velocity, and the motion mode of other the cleaning shower nozzles that can realize moves cleaning, all within thought range of the present invention.In addition, the cleaning shower nozzle that described cleaning dries equipment can be fixedly connected with described liquid feeding pipeline, and the fluid direction of described cleaning shower nozzle can be controlled by liquid feeding pipeline; Or described cleaning shower nozzle is flexibly connected with described liquid feeding pipeline, the fluid direction of described cleaning shower nozzle can be cleaned shower nozzle by adjusting and be controlled.The regulative mode of the fluid direction of the connected mode of described cleaning shower nozzle and described liquid feeding pipeline and cleaning shower nozzle is not limited by above-described embodiment.
Above-described is only preferred embodiment of the present utility model; described embodiment is not in order to limit scope of patent protection of the present utility model; therefore the equivalent structure that every utilization specification of the present utility model and accompanying drawing content are done changes, and in like manner all should be included in protection range of the present utility model.
Claims (10)
1. a cleaning that improves wafer cleaner degree dries equipment, comprise place wafer horizontal rinsing table, be arranged on the mechanical arm of described rinsing table top, and be arranged on the cleaning shower nozzle on described mechanical arm, described cleaning shower nozzle is communicated with by liquid feeding pipeline and factory business feed flow end, it is characterized in that, described mechanical arm comprises the first mechanical arm and the second mechanical arm being rotationally connected with described the first mechanical arm, described the second mechanical arm is equipped with cleaning shower nozzle, and the fluid direction of described cleaning shower nozzle favours the vertical axis direction of described horizontal rinsing table; Wherein, described the first mechanical arm can drive described the second mechanical arm as horizontal linear, to move above described rinsing table, and described the second mechanical arm can be around horizontally rotating with being rotationally connected a little of described the first mechanical arm.
2. cleaning as claimed in claim 1 dries equipment, it is characterized in that, described the second mechanical arm is rotatably connected on the below of described the first mechanical arm.
3. cleaning as claimed in claim 1 dries equipment, it is characterized in that, described the second mechanical arm is rotatably connected on the top of described the first mechanical arm.
4. the cleaning as described in claim 1,2 or 3 dries equipment, it is characterized in that, described the second mechanical arm can be around clockwise rotating with a level that is rotationally connected for described the first mechanical arm.
5. the cleaning as described in claim 1,2 or 3 dries equipment, it is characterized in that, described the second mechanical arm can be around rotating counterclockwise with a level that is rotationally connected for described the first mechanical arm.
6. the cleaning as described in claim 1,2 or 3 dries equipment, it is characterized in that, described the first mechanical arm can drive described the second mechanical arm above described rinsing table, to do to move through the horizontal linear at described horizontal rinsing table center.
7. the cleaning as described in claim 1,2 or 3 dries equipment, it is characterized in that, the rotatable angle between described the second mechanical arm and described the first mechanical arm is 0 ~ 90 °.
8. cleaning as claimed in claim 1 dries equipment, it is characterized in that, the rotatable front end of described the second mechanical arm is equipped with cleaning shower nozzle, and the fluid direction of described cleaning shower nozzle can be adjusted.
9. the cleaning as described in claim 1 or 8 dries equipment, it is characterized in that, the angle of the fluid direction of described cleaning shower nozzle and the vertical axis direction of described horizontal rinsing table is 3 ~ 10 °.
10. the cleaning as described in claim 1 or 8 dries equipment, it is characterized in that the rotation direction setting of the fluid direction of described cleaning shower nozzle when described wafer cleaning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420195578.2U CN203800023U (en) | 2014-04-22 | 2014-04-22 | Cleaning and drying device used for improving cleanliness of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420195578.2U CN203800023U (en) | 2014-04-22 | 2014-04-22 | Cleaning and drying device used for improving cleanliness of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203800023U true CN203800023U (en) | 2014-08-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420195578.2U Expired - Lifetime CN203800023U (en) | 2014-04-22 | 2014-04-22 | Cleaning and drying device used for improving cleanliness of wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203800023U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110508537A (en) * | 2019-08-29 | 2019-11-29 | 南通大学 | Hydrojet efficient appliances and method in a kind of corrosion cleaning of improvement large-sized wafer |
-
2014
- 2014-04-22 CN CN201420195578.2U patent/CN203800023U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110508537A (en) * | 2019-08-29 | 2019-11-29 | 南通大学 | Hydrojet efficient appliances and method in a kind of corrosion cleaning of improvement large-sized wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140827 |