CN220774307U - Wafer cleaning device of CMP board - Google Patents
Wafer cleaning device of CMP board Download PDFInfo
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- CN220774307U CN220774307U CN202322474398.XU CN202322474398U CN220774307U CN 220774307 U CN220774307 U CN 220774307U CN 202322474398 U CN202322474398 U CN 202322474398U CN 220774307 U CN220774307 U CN 220774307U
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- mechanical arm
- spray head
- wafer
- liquid
- central axis
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- 238000004140 cleaning Methods 0.000 title claims abstract description 36
- 239000007788 liquid Substances 0.000 claims abstract description 79
- 239000007921 spray Substances 0.000 claims abstract description 58
- 239000000126 substance Substances 0.000 claims abstract description 48
- 238000002156 mixing Methods 0.000 claims abstract description 38
- 239000000243 solution Substances 0.000 claims abstract description 38
- 239000008367 deionised water Substances 0.000 claims abstract description 35
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 35
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 17
- 230000008569 process Effects 0.000 claims abstract description 17
- 239000011259 mixed solution Substances 0.000 claims abstract description 9
- 238000005507 spraying Methods 0.000 claims abstract description 3
- 238000003756 stirring Methods 0.000 claims description 69
- 238000001802 infusion Methods 0.000 claims description 21
- 239000000203 mixture Substances 0.000 claims description 5
- 239000012895 dilution Substances 0.000 abstract description 12
- 238000010790 dilution Methods 0.000 abstract description 12
- 235000012431 wafers Nutrition 0.000 description 57
- 239000002245 particle Substances 0.000 description 9
- 230000009286 beneficial effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000005498 polishing Methods 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 4
- 238000011010 flushing procedure Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000013522 chelant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model provides a wafer cleaning device of a CMP machine, comprising: the spray head and the liquid mixing cavity; the liquid mixing cavity is provided with a first liquid inlet and a second liquid inlet, the first liquid inlet is used for introducing chemical solution, and the second liquid inlet is used for introducing deionized water; the mixed liquid cavity is used for mixing the chemical solution and the deionized water to form mixed liquid; the spray head is communicated with the mixed liquid cavity and is used for spraying the mixed liquid to the surface of the wafer. The mixed liquid cavity is added on the spray head, chemical solution introduced from the first liquid inlet and deionized water introduced from the second liquid inlet are mixed by the mixed liquid cavity, so that mixed solution with fixed dilution ratio is continuously obtained, the chemical solution and the deionized water are sprayed to the surface of a wafer by the spray head after being mixed for a short time in the mixed liquid cavity, and the stability of the cleaning process is improved.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a wafer cleaning device of a CMP (chemical mechanical polishing) machine.
Background
Chemical mechanical polishing (Chemical MechanicalPolishing, CMP) equipment is an important equipment in the production process of semiconductor wafers, and Chemical mechanical polishing is a processing technology combining Chemical corrosion action and mechanical removal action, and is the only technology capable of realizing global planarization of surfaces in the mechanical processing process. The cleaning (Clean) unit after the polishing (Polish) process is also important because the Wafer surface has particles (particles) or residues of complex and chelate compounds after chemical reaction after polishing (Polish), and therefore the Wafer surface must be cleaned by a Brush (Brush) cleaning and drying system to obtain a Clean Wafer surface. If particles (particles) remain on the surface of the Wafer (Wafer), bumps (bumps) are generated during the subsequent process Deposition (Deposition), which affects the yield. Therefore, a stable and efficient Clean (Clean) unit is important for improving the yield of the production line.
Currently, a cleaning (Clean) unit of a CMP apparatus cleans the surface of a Wafer (Wafer) by adopting a fixed nozzle and a rolling Brush (Brush), wherein one nozzle sprays deionized water (DIW), and the other nozzle sprays chemicals (Chemical), wherein the deionized water (DIW) has the effect of diluting the chemicals (Chemical) on one hand and has the effect of flushing on the other hand, and the cleaning unit is matched with the mechanical force of the rolling Brush (Brush) to remove particles (particles) remained on the surface of the Wafer (Wafer), so that the density of the particles (particles) after a Chemical mechanical polishing process is reduced, and the yield of the Wafer (Wafer) is improved. Because the dilution ratio of the Chemical (Chemical) is completely controlled by the flow rates of the Chemical (Chemical) and deionized water (DIW), the difficulty of continuously obtaining a solution with a fixed dilution ratio is high, so that the cleaning process is not stable enough, and the cleaning device cannot meet the process design.
Accordingly, there is a need for a wafer cleaning apparatus for a CMP tool that ameliorates the above-described problems.
Disclosure of Invention
The utility model aims to provide a wafer cleaning device of a CMP machine, which is used for continuously obtaining a solution with a fixed dilution ratio and improving the stability of a cleaning process.
The utility model provides a wafer cleaning device of a CMP machine, comprising: the spray head and the liquid mixing cavity;
the liquid mixing cavity is provided with a first liquid inlet and a second liquid inlet, the first liquid inlet is used for introducing chemical solution, and the second liquid inlet is used for introducing deionized water;
the mixed liquid cavity is used for mixing the chemical solution and the deionized water to form mixed liquid;
the spray head is communicated with the mixed liquid cavity and is used for spraying the mixed liquid to the surface of the wafer.
The beneficial effects of the utility model are as follows: through improving current shower nozzle, increase the mixed liquid cavity on original shower nozzle's basis, utilize the mixed liquid cavity to mix the chemical solution that first inlet lets in with the deionized water that the second inlet lets in to realize continuously obtaining the mixed solution that dilution ratio is fixed, chemical solution and deionized water spray the wafer surface by the shower nozzle after mixing briefly in the mixed liquid cavity again, improved the stability of cleaning process.
Optionally, a stirring sheet is arranged in the liquid mixing cavity;
the stirring blade comprises a stirring shaft and a plurality of stirring blades connected to the stirring shaft;
the stirring shaft is used for driving the stirring blade to rotate to stir and mix the chemical solution and the deionized water to form a mixed solution. The stirring device has the beneficial effects that the stirring shaft and the stirring blades connected to the stirring shaft are arranged in the liquid mixing cavity, the stirring shaft drives the stirring blades to rotate to stir and mix the chemical solution and the deionized water, so that the mixing time of the chemical solution and the deionized water can be shortened, and the stability of the dilution ratio of the chemical solution is improved.
Optionally, the infusion device further comprises a first mechanical arm, a rotating shaft, a second mechanical arm, a first infusion tube and a second infusion tube;
one end of the first mechanical arm is connected with the spray head, and the other end of the first mechanical arm is connected with the second mechanical arm through the rotating shaft;
the first mechanical arm drives the spray head to perform circular motion relative to the second mechanical arm through a rotating shaft, and the spray head sprays the mixed liquid to the surface of the wafer in the motion process;
one end of the first infusion tube is arranged in the second mechanical arm, sequentially passes through the second mechanical arm, the rotating shaft and the first mechanical arm and then is communicated with the first liquid inlet, and is used for conveying chemical solution to the first liquid inlet;
one end of the second infusion tube is arranged in the second mechanical arm, sequentially penetrates through the second mechanical arm, the rotating shaft and the first mechanical arm and then is communicated with the second liquid inlet, and is used for conveying deionized water to the second liquid inlet. Compared with the problem that in the prior art, the fixed spray head is used for cleaning the wafer, which is caused by poor cleaning effect because the fixed spray head cannot uniformly flush different positions of the wafer surface, the rotary shaft is arranged between the first mechanical arm and the second mechanical arm, the first mechanical arm drives the spray head to perform circular motion relative to the second mechanical arm through the rotary shaft, and the spray head sprays the mixed liquid to the wafer surface in the motion process, so that the mixed liquid can be used for uniformly flushing the wafer, particles on the wafer surface can be effectively removed, and the wafer yield is improved.
Optionally, the stirring shaft is disposed along an axial direction of the liquid mixing cavity.
Optionally, the stirring shaft is disposed along a radial direction of the liquid mixing cavity.
Optionally, the plurality of stirring vanes are uniformly arranged on the stirring shaft. The stirring shaft has the beneficial effects that the stability of the dilution ratio of the chemical solution can be improved by uniformly arranging the stirring blades on the stirring shaft.
Optionally, the rotation direction of the spray head is opposite to the rotation direction of the wafer. The wafer cleaning device has the beneficial effects that by arranging the rotation direction of the spray head opposite to the rotation direction of the wafer, the mixed liquid and the wafer can generate a certain relative speed, and the effect of flushing the surface of the wafer by the mixed liquid is further improved.
Optionally, the central axis of the spray head is parallel to the central axis of the second mechanical arm but not on the same straight line;
the diameter of the spray head is equal to half of the diameter of the wafer, and the distance between the central axis of the spray head and the central axis of the second mechanical arm is equal to one fourth of the diameter of the wafer. The device has the beneficial effects that the central axis of the spray head is parallel to the central axis of the second mechanical arm but not on the same straight line, the diameter of the spray head is equal to half of the diameter of the wafer, and the distance between the central axis of the spray head and the central axis of the second mechanical arm is equal to one fourth of the diameter of the wafer, so that the spray head can be ensured to rotate around the rotating shaft for one circle to completely flush the surface of the covered wafer, and the cleaning efficiency is improved.
Optionally, the first mechanical arm includes a transverse mechanical arm and a longitudinal mechanical arm which are connected;
the central axis of the transverse mechanical arm is parallel to the central axis of the second mechanical arm;
the central axis of the longitudinal mechanical arm is intersected with the central axis of the second mechanical arm;
the spray head is connected with the rotating shaft sequentially through the transverse mechanical arm and the longitudinal mechanical arm. The mechanical arm has the beneficial effects that the first mechanical arm comprises a transverse mechanical arm and a longitudinal mechanical arm which are connected, and the central axis of the transverse mechanical arm is parallel to the central axis of the second mechanical arm; the axis of the longitudinal mechanical arm is intersected with the axis of the second mechanical arm, and the spray head is connected with the rotating shaft sequentially through the transverse mechanical arm and the longitudinal mechanical arm, so that the stability of the movement of the spray head can be improved.
Optionally, the spray head is connected with the rotating shaft through the first mechanical arm which is obliquely arranged. The spray head has the beneficial effects that the spray head is connected with the rotating shaft through the first mechanical arm which is obliquely arranged, and compared with the transverse mechanical arm, the longitudinal mechanical arm and the first mechanical arm, the length of the required mechanical arm is smaller, so that the cost can be reduced.
Drawings
FIG. 1 is a schematic view of a wafer cleaning apparatus of a CMP tool according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a structure of a liquid mixing cavity and a stirring plate according to an embodiment of the present utility model;
FIG. 3 is a schematic view of another structure of the liquid mixing cavity and the stirring plate according to the embodiment of the present utility model;
fig. 4 is a schematic structural diagram of a first mechanical arm, a rotating shaft, and a second mechanical arm according to an embodiment of the present utility model.
Reference numerals in the drawings:
1. a spray head; 2. a liquid mixing cavity; 3. a wafer; 4. a rolling brush; 5. a first mechanical arm; 6. a rotating shaft; 7. a second mechanical arm; 8. a first infusion tube; 9. a second infusion tube; 10. stirring sheets;
51. a transverse mechanical arm; 52. a longitudinal mechanical arm;
101. a stirring shaft; 102. stirring the leaves.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model. Unless otherwise defined, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this utility model belongs. As used herein, the word "comprising" and the like means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof without precluding other elements or items.
As shown in fig. 1, the present utility model provides a wafer cleaning apparatus for a CMP apparatus, comprising: the device comprises a spray head 1, a liquid mixing cavity 2, a first mechanical arm 5, a rotating shaft 6, a second mechanical arm 7, a first infusion tube 8 and a second infusion tube 9; the spray head 1 is communicated with the liquid mixing cavity 2 and is connected with one end of the first mechanical arm 5 through the liquid mixing cavity 2, and the other end of the first mechanical arm 5 is connected with the second mechanical arm 7 through the rotating shaft 6; the first mechanical arm 5 drives the spray head 1 to perform circular motion relative to the second mechanical arm 7 through the rotating shaft 6, and the spray head 1 sprays the mixed liquid to the surface of the wafer 3 in the motion process. The liquid mixing cavity 2 is provided with a chemical solution inlet and a deionized water inlet, one end of the first infusion tube 8 is arranged in the second mechanical arm 7, sequentially passes through the second mechanical arm 7, the rotating shaft 6 and the first mechanical arm 5 and then is communicated with the chemical solution inlet, and is used for conveying chemical solution to the chemical solution inlet; one end of the second infusion tube 9 is arranged in the second mechanical arm 7, sequentially passes through the second mechanical arm 7, the rotating shaft 6 and the first mechanical arm 5, and then is communicated with the deionized water inlet, so as to convey deionized water to the deionized water inlet.
As shown in fig. 1, the cleaning device provided by the utility model can be arranged on the side surface of the wafer 3 according to the requirement in the actual use process, and is matched with the rolling brush 4 to clean the surface of the wafer 3, and the specific process is as follows:
the round brush 4 arranged at both sides of the wafer 3 cleans the surface of the wafer 3, in the process, the first infusion tube 8 and the second infusion tube 9 respectively introduce chemical solution and deionized water into the mixed liquid cavity 2, the chemical solution and the deionized water are mixed through the mixed liquid cavity 2, so as to realize that the mixed solution with fixed dilution ratio is continuously obtained, and the chemical solution and the deionized water are sprayed to the surface of the wafer 3 for cleaning by the spray head 1 after being mixed for a short time in the mixed liquid cavity 2, thereby improving the stability of the cleaning process.
In some embodiments, as shown in fig. 1, in order to further improve the effect of the mixed solution in rinsing the surface of the wafer 3, so that a certain relative speed is generated between the mixed solution and the wafer 3, the wafer 3 is set to rotate along the self-plane, and the rotation direction of the spray head 1 is set to be opposite to the rotation direction of the wafer 3 (for example, when the wafer 3 rotates anticlockwise along the self-plane, the rotation direction of the spray head 1 is clockwise, and specifically, the effect of adjusting the rotation direction of the spray head 1 can be achieved by changing the current direction of the driving motor that drives the rotation shaft 6 to rotate).
In some embodiments, as shown in fig. 1, in order to improve the cleaning efficiency, to ensure that the shower head 1 can completely flush the surface of the cover wafer 3 after rotating around the rotating shaft 6 for one turn, the central axis of the shower head 1 and the central axis of the second mechanical arm 7 are parallel but not on the same straight line; the diameter of the spray head 1 is equal to half of the diameter of the wafer 3, and the distance between the central axis of the spray head 1 and the central axis of the second mechanical arm 7 is equal to one fourth of the diameter of the wafer 3.
In some embodiments, as shown in fig. 1, in order to improve the stability of the movement of the spray head 1, the first mechanical arm 5 includes a transverse mechanical arm 51 and a longitudinal mechanical arm 52 that are connected; the central axis of the transverse mechanical arm 51 is parallel to the central axis of the second mechanical arm 7; the central axis of the longitudinal arm 52 intersects the central axis of the second arm 7. It should be noted that, when the first mechanical arm 5 includes the connected transverse mechanical arm 51 and the longitudinal mechanical arm 52, to ensure that the distance between the central axis of the showerhead 1 and the central axis of the second mechanical arm 7 is equal to one fourth of the diameter of the wafer 3, the length of the longitudinal mechanical arm 52 may be directly set to be equal to one fourth of the diameter of the wafer 3.
In other embodiments, as shown in fig. 4, the first mechanical arm 5 may also be formed by an obliquely arranged mechanical arm, where one end of the obliquely arranged mechanical arm is connected to the liquid mixing cavity 2, and the other end of the obliquely arranged mechanical arm is connected to the rotating shaft 6, and the central axis of the liquid mixing cavity 2 is the same as the central axis of the nozzle 1, and when the first mechanical arm 5 is an obliquely arranged mechanical arm, in order to ensure that the distance between the central axis of the nozzle 1 and the central axis of the second mechanical arm 7 is equal to one quarter of the diameter of the wafer 3, the obliquely arranged mechanical arm may be projected transversely and longitudinally, and only the length projected longitudinally of the obliquely arranged mechanical arm is required to be equal to one quarter of the diameter of the wafer 3, and compared with the first mechanical arm 5 formed by using one transverse mechanical arm 51 and one longitudinal mechanical arm 52, the required mechanical arm is smaller and lower in cost.
In some embodiments, in order to further ensure that the mixed solution with stable dilution ratio is continuously obtained, the device further comprises a factory end, and the other end of the first infusion tube 8 and the other end of the second infusion tube 9 are respectively communicated with the factory end, wherein the factory end is used for supplying chemical solution into the first infusion tube 8, supplying deionized water into the second infusion tube 9 and adjusting the flow of the chemical solution and the deionized water.
In some embodiments, as shown in fig. 2 and 3, in order to shorten the mixing time of the chemical solution and the deionized water and improve the stability of the dilution ratio of the chemical solution, a stirring blade 10 is disposed in the mixing chamber 2; the stirring blade 10 comprises a stirring shaft 101 and 3 stirring blades 102 connected to the stirring shaft 101; the stirring shaft 101 is used for driving the stirring blade 102 to rotate to stir and mix the chemical solution and the deionized water to form a mixed solution. It should be noted that, in a practical use scenario, a power mechanism, such as a driving motor, may be further provided, by setting an output end of the driving motor to be fixedly connected with the stirring shaft 101, driving the stirring shaft 101 to rotate clockwise/anticlockwise by the driving motor, and driving 3 stirring blades 102 fixed on the stirring shaft 101 to rotate synchronously by the stirring shaft 101, where the stirring blades 102 stir and mix the chemical solution and deionized water in the liquid mixing cavity 2 in a rotation process. The rotation direction of the driving motor can be adjusted, and the mixing time of the chemical solution and the deionized water can be further shortened and the stability of the dilution ratio of the chemical solution can be improved by changing the rotation direction of the stirring blade 102 in the liquid mixing cavity 2.
In some specific embodiments, as shown in fig. 2, the stirring shaft 101 is disposed along the axial direction of the liquid mixing cavity 2. It should be noted that, the central axis of the stirring shaft 101 may be coincident with or parallel to the central axis of the liquid mixing cavity 2, or an included angle between the central axis of the stirring shaft 101 and the central axis of the liquid mixing cavity 2 may be an acute angle.
In other specific embodiments, as shown in fig. 3, the stirring shaft 101 is disposed along a radial direction of the liquid mixing cavity 2. It should be noted that, the central axis of the stirring shaft 101 may be perpendicular to the central axis of the liquid mixing cavity 2, or an included angle between the central axis of the stirring shaft 101 and the central axis of the liquid mixing cavity 2 may be an acute angle.
In still other specific embodiments, the plurality of stirring blades 102 are uniformly disposed on the stirring shaft 101 in order to improve the stability of the dilution ratio of the chemical solution. For example, as shown in fig. 2 and fig. 3, the length direction of the stirring blade 102 is the same as the central axis direction of the stirring shaft 101, and the included angle between two adjacent stirring blades 102 is the same, for example, when three stirring blades 102 are provided, the included angle between two adjacent stirring blades 102 is 120 degrees, and of course, the stirring blades 102 may also be spirally and circumferentially provided on the stirring shaft 101.
While embodiments of the present utility model have been described in detail hereinabove, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. It is to be understood that such modifications and variations are within the scope and spirit of the present utility model as set forth in the following claims. Moreover, the utility model described herein is capable of other embodiments and of being practiced or of being carried out in various ways.
Claims (10)
1. A wafer cleaning apparatus for a CMP tool, comprising: the spray head and the liquid mixing cavity;
the liquid mixing cavity is provided with a first liquid inlet and a second liquid inlet, the first liquid inlet is used for introducing chemical solution, and the second liquid inlet is used for introducing deionized water;
the mixed liquid cavity is used for mixing the chemical solution and the deionized water to form mixed liquid;
the spray head is communicated with the mixed liquid cavity and is used for spraying the mixed liquid to the surface of the wafer.
2. The cleaning device according to claim 1, wherein a stirring plate is arranged in the liquid mixing cavity;
the stirring blade comprises a stirring shaft and a plurality of stirring blades connected to the stirring shaft;
the stirring shaft is used for driving the stirring blade to rotate to stir and mix the chemical solution and the deionized water to form a mixed solution.
3. The cleaning device of claim 1, further comprising a first mechanical arm, a spindle, a second mechanical arm, a first infusion tube, and a second infusion tube;
one end of the first mechanical arm is connected with the spray head, and the other end of the first mechanical arm is connected with the second mechanical arm through the rotating shaft;
the first mechanical arm drives the spray head to perform circular motion relative to the second mechanical arm through a rotating shaft, and the spray head sprays the mixed liquid to the surface of the wafer in the motion process;
one end of the first infusion tube is arranged in the second mechanical arm, sequentially passes through the second mechanical arm, the rotating shaft and the first mechanical arm and then is communicated with the first liquid inlet, and is used for conveying chemical solution to the first liquid inlet;
one end of the second infusion tube is arranged in the second mechanical arm, sequentially penetrates through the second mechanical arm, the rotating shaft and the first mechanical arm and then is communicated with the second liquid inlet, and is used for conveying deionized water to the second liquid inlet.
4. The cleaning device of claim 2, wherein the stirring shaft is disposed along an axial direction of the liquid mixing cavity.
5. The cleaning device of claim 2, wherein the agitator shaft is disposed radially of the mixing chamber.
6. The cleaning apparatus of claim 2, wherein the plurality of stirring vanes are uniformly disposed on the stirring shaft.
7. A cleaning device according to claim 3, wherein the direction of rotation of the spray head is opposite to the direction of rotation of the wafer.
8. A cleaning device according to claim 3, wherein the central axis of the spray head and the central axis of the second mechanical arm are parallel but not collinear;
the diameter of the spray head is equal to half of the diameter of the wafer, and the distance between the central axis of the spray head and the central axis of the second mechanical arm is equal to one fourth of the diameter of the wafer.
9. The cleaning apparatus of claim 3, wherein the first robotic arm comprises a transverse robotic arm and a longitudinal robotic arm connected;
the central axis of the transverse mechanical arm is parallel to the central axis of the second mechanical arm;
the central axis of the longitudinal mechanical arm is intersected with the central axis of the second mechanical arm;
the spray head is connected with the rotating shaft sequentially through the transverse mechanical arm and the longitudinal mechanical arm.
10. A cleaning device according to claim 3, wherein the spray head is connected to the spindle by the first arm being arranged obliquely.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322474398.XU CN220774307U (en) | 2023-09-12 | 2023-09-12 | Wafer cleaning device of CMP board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322474398.XU CN220774307U (en) | 2023-09-12 | 2023-09-12 | Wafer cleaning device of CMP board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220774307U true CN220774307U (en) | 2024-04-12 |
Family
ID=90605669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322474398.XU Active CN220774307U (en) | 2023-09-12 | 2023-09-12 | Wafer cleaning device of CMP board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220774307U (en) |
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2023
- 2023-09-12 CN CN202322474398.XU patent/CN220774307U/en active Active
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